PC chip carrier tape packaging material and preparation method thereof

Abstract

The invention relates to the technical field of packaging materials, and discloses a PC chip carrier tape packaging material and a preparation method thereof. The PC chip carrier tape packaging material is prepared from the following raw materials in parts by weight: 80 to 100 parts of polycarbonate, 15 to 30 parts of ABS (Acrylonitrile Butadiene Styrene) resin, 4 to 8 parts of ACR (Acrylonitrile Butadiene Styrene) resin, 2 to 6 parts of modified antistatic agent, 3 to 6 parts of modified scratch-resistant agent, 0.1 to 0.5 part of antioxidant 1010 and 6 to 10 parts of nano zinc oxide. The modified antistatic agent provided by the invention can realize lasting and stable antistatic performance of the PC material, and effectively avoid electrostatic adsorption of dust and impurities; the modified scratch-resistant agent provided by the invention can effectively reduce the friction coefficient of the material and reduce the friction loss of the carrier tape in high-speed transmission, winding and use processes, and forms synergistic protection with the modified antistatic agent.

Description

Technical Field

[0001] This invention relates to the field of packaging materials technology, specifically to a PC chip carrier tape packaging material and its preparation method. Background Technology

[0002] With the mass production of advanced process chips in smartphones, autonomous driving domain controllers, and other applications, chips are iterating towards higher integration, miniaturized pins, and modular functionality. This has led to an exponential increase in the requirements for precision protection and environmental tolerance of packaging materials during production, warehousing, and transportation. Polycarbonate (PC), due to its high transparency, dimensional stability, and high-temperature resistance, has become a core substrate for chip carrier tapes. Antistatic performance is one of the core technological bottlenecks for PC carrier tapes. PC carrier tape materials easily accumulate static electricity during transport. Friction with packaging liners and turnover boxes during transportation, and with guide rollers during production line transmission, all continuously accumulate static electricity, causing the material to adsorb dust and fine debris from the environment, clogging the carrier tape pores or contaminating the component-bearing area. Existing conductive fillers, such as carbon black, can reduce the material's mechanical properties if added in large quantities. Quaternary ammonium salt-based external coating antistatic agents have weak adhesion to the PC substrate and are prone to detachment under high-frequency friction and stacking pressure. Furthermore, long-term exposure to air can lead to evaporation, moisture absorption, and decomposition, resulting in a decrease in antistatic effectiveness. In addition, insufficient scratch resistance also restricts the stable application of PC carrier tapes. During production line transmission, scratches are easily generated on the surface of the carrier tape, and continuous friction will exacerbate the accumulation of static electricity. Deeper scratches may weaken the mechanical structural integrity of the carrier tape. At the same time, the scratched areas are easy to become attachment points for dust and impurities, which in turn contaminate the electronic components they carry.

[0003] Patent application number 201410847942.3 discloses an antistatic PC modified material and its preparation method. The antistatic agent is a mixture of carbon black and carbon fiber, which can reduce the surface resistance of the PC material. However, excessive carbon black addition can affect the material's mechanical properties and cause it to turn black, limiting its application scenarios. Patent application number 201410603433.6 discloses an antistatic PC / ABS alloy material and its preparation method. It uses alkylbenzene sulfonate and siloxane to obtain a compounded antistatic agent. However, this agent is physically dispersed in the substrate without forming chemical bonds, making it prone to migration and loss during long-term use, leading to a decrease in antistatic effect. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a PC chip carrier packaging material and its preparation method.

[0005] The objective of this invention can be achieved through the following technical solutions:

[0006] A PC chip carrier tape packaging material comprises the following raw materials in parts by weight: 80-100 parts of polycarbonate, 15-30 parts of ABS resin, 4-8 parts of ACR resin, 2-6 parts of modified antistatic agent, 3-6 parts of modified scratch-resistant agent, 0.1-0.5 parts of antioxidant 1010, and 6-10 parts of nano zinc oxide.

[0007] The modified antistatic agent is prepared by the following steps:

[0008] Step A1: Stir and heat lauryl alcohol polyoxyethylene ether-23 to 80°C, add boron trifluoride diethyl ether solution, and then add epichlorohydrin dropwise. After the addition is complete, continue to reflux for 3 hours, and then distill under reduced pressure to obtain intermediate product 1.

[0009] Furthermore, the ratio of lauryl alcohol polyoxyethylene ether-23, boron trifluoride diethyl ether solution, and epichlorohydrin is 0.8-1 mol: 0.8-1 g: 0.92-1.15 mol;

[0010] In step A1, lauryl alcohol polyoxyethylene ether-23 and epibromopropane undergo a ring-opening reaction, introducing bromine atoms into the system and providing reaction conditions for the subsequent quaternization reaction. The polyether segments in the introduced lauryl alcohol polyoxyethylene ether molecule have strong hygroscopicity and can adsorb moisture from the air through hydrogen bonds, forming a thin water film on the material surface. This water film provides ion conduction channels, allowing electrostatic charges to leak or neutralize rapidly, thereby reducing surface resistivity and exhibiting good conductivity.

[0011] Step A2: Mix 1-vinylimidazolium, 2,6-di-tert-butyl-4-methylphenol (BHT) and n-hexane, purge with nitrogen, add intermediate product 1 solution dropwise, heat to 40℃ and react for 24 h, cool to room temperature after the reaction is complete, wash, filter, and vacuum dry to obtain intermediate product 2.

[0012] Furthermore, the ratio of 1-vinylimidazole, BHT, n-hexane, and intermediate 1 solution is 0.3-0.4 mol : 0.14-0.18 mmol : 40-60 mL : 40-60 mL;

[0013] Furthermore, the intermediate product 1 solution is prepared by mixing intermediate product 1 and n-hexane in a volume ratio of 0.6-0.8 mol: 40-60 mL;

[0014] In step A2, 1-vinylimidazole and intermediate 1 undergo a quaternization reaction, introducing a double bond into the system and providing reaction conditions for the subsequent thiol-ene click reaction. The cationic groups in the introduced imidazole salt structure can adsorb moisture in the environment and form a thin ion-conductive film on the material surface. This film rapidly leaks accumulated static charge through ion conduction, thereby preventing electrostatic hazards.

[0015] Step A3: Mix intermediate product 2, cysteamine, triethylamine and tetrahydrofuran, purge with nitrogen, heat to 60°C, reflux for 12 h, cool to room temperature, rotary evaporate, wash, purify and vacuum dry to obtain intermediate product 3;

[0016] Furthermore, the ratio of intermediate 2, cysteine, triethylamine, and tetrahydrofuran is 0.1-0.3 mol: 0.1-0.3 mol: 0.02-0.06 mol: 300-400 mL;

[0017] In step A3, intermediate 2 and cysteine ​​undergo a thiol-ene click reaction, introducing an amino group into the system and providing reaction conditions for the subsequent amide grafting reaction.

[0018] Step A4: Mix carboxylated multi-walled carbon nanotubes and dicyclohexylcarbodiimide, add toluene, sonicate for 15 min, add 4-dimethylaminopyridine, heat in an oil bath at 100°C for 10 min, then add intermediate product 3, continue the reaction for 24 h, wash with anhydrous ethanol after the reaction is completed, filter, and vacuum dry to obtain the modified antistatic agent.

[0019] Furthermore, the ratio of carboxylated multi-walled carbon nanotubes, dicyclohexylcarbodiimide, toluene, 4-dimethylaminopyridine, intermediate 3, and anhydrous ethanol is 0.1 g : 0.5-1 g : 15-20 mL : 0.1-0.2 g : 0.1-0.2 mol : 100 mL;

[0020] In step A4, carboxylated multi-walled carbon nanotubes and intermediate product 3 undergo an amide grafting reaction. Carbon nanotubes have excellent electrical and mechanical properties. By grafting lauryl alcohol polyoxyethylene ether and imidazole salt structures, a conductive network is constructed on the surface of carbon nanotubes, enhancing the conductivity of the system, thereby reducing the contact resistance of the system and improving the antistatic properties.

[0021] The modified scratch-resistant agent is prepared by the following steps:

[0022] Step B1: Mix isosorbide and methyl methacrylate, add sodium carbonate while stirring, heat to 130°C under vacuum of 450 mmHg, react for 2 h, cool, filter and distill under reduced pressure to obtain isosorbide derivative.

[0023] Furthermore, the ratio of isosorbide, methyl methacrylate, and sodium carbonate is 0.4-1.2 mol: 0.1-0.3 mol: 0.01-0.03 mol;

[0024] In step B1, isosorbide and methyl methacrylate undergo a transesterification reaction, introducing a double bond into the system and providing reaction conditions for the subsequent hydrosilylation reaction. The difuran ring in isosorbide imparts strong rigidity, and its introduction into the polymer system can enhance scratch resistance.

[0025] Step B2: Mix 0.9wt% isopropanol chloroplatinic acid solution with toluene, add 1-tetradecene, maleic anhydride and isosorbide derivative, stir and heat to 80℃, add hydrogen-containing polysiloxane dropwise over 1 hour, react for 6 hours, and after the reaction is completed, rotary evaporate to obtain modified scratch-resistant agent.

[0026] Furthermore, the molar amount of double bonds in 1-tetradecene accounts for 10%-20% of the molar amount of hydrogen groups in the hydrogen-containing polysiloxane, the molar amount of double bonds in maleic anhydride accounts for 5%-10% of the molar amount of hydrogen groups in the hydrogen-containing polysiloxane, and the molar amount of double bonds in isosorbide derivatives accounts for 50%-60% of the molar amount of hydrogen groups in the hydrogen-containing polysiloxane;

[0027] Furthermore, the volume of the isopropanol chloroplatinic acid solution used is 0.1-0.2 mL;

[0028] In step B2, the hydrogen-containing polysiloxane undergoes a hydrosilylation reaction with 1-tetradecene, maleic anhydride, and isosorbide derivatives. The introduced long-chain alkyl groups can entangle with the polycarbonate backbone, preventing the low molecular weight polysiloxane from seeping out in a short time, which would cause the material surface to become dusty and lose its scratch resistance. Under the action of high temperature and shear force, the anhydride groups in maleic anhydride can undergo transesterification with the hydroxyl groups at the end of the PC molecular chain, improving compatibility. Introducing long-chain alkyl groups, anhydride groups, and isosorbide into the polysiloxane can improve the lubricity and wear resistance of the system.

[0029] A method for preparing a PC chip carrier packaging material includes the following steps:

[0030] Step S1: Dry the polycarbonate at 80°C for 4 hours for later use;

[0031] Step S2: Mix the dried polycarbonate with ABS resin, ACR resin, modified antistatic agent, modified scratch-resistant agent, antioxidant 1010 and nano zinc oxide at a speed of 400-600 r / min for 10-30 min to obtain a mixture.

[0032] Step S3: Place the mixture in a twin-screw extruder and set the temperatures of each zone of the twin-screw extruder as follows: Zone 1 200-210℃, Zone 2 220-230℃, Zone 3 240-250℃, Zone 4 250-260℃, Zone 5 250-260℃, Zone 6 245-255℃, and Zone 7 240-250℃. The screw speed is 200-300 r / min. After melt extrusion and granulation, PC chip carrier packaging material is obtained.

[0033] The beneficial effects of this invention are:

[0034] The modified PC chip carrier packaging material of this invention can be widely used in high-end electronic fields such as chip transportation and storage, and precision electronic component packaging. Adding the modified antistatic agent of this invention to the PC substrate achieves durable and stable antistatic performance, effectively preventing static electricity from attracting dust and impurities or damaging sensitive chip components, ensuring chip safety during packaging and transportation. Simultaneously, the modified scratch-resistant agent further enhances the scratch resistance of the PC material, effectively reducing the material's coefficient of friction and minimizing frictional loss during high-speed transmission, winding, and use of the carrier tape. It also suppresses triboelectric effects, forming a synergistic protection with the antistatic agent. This composite system improves wear resistance without compromising the original mechanical strength of the PC material, ensuring the structural stability of the carrier tape under long-term dynamic use conditions. Compared with existing technologies, the PC material prepared by this invention maintains its original excellent mechanical properties while ensuring durable antistatic properties and scratch resistance, showing broad application prospects in the field of high-end electronic packaging.

[0035] The modified antistatic agent of this invention first utilizes a ring-opening reaction between lauryl polyoxyethylene ether-23 and epichlorohydrin to introduce a polyether segment in the lauryl polyoxyethylene ether molecule. This segment possesses strong hygroscopicity and can adsorb moisture from the air through hydrogen bonds, forming a thin water film on the material surface. This water film provides ion-conducting channels, allowing electrostatic charges to leak or neutralize rapidly, thereby reducing surface resistivity and exhibiting good conductivity. Next, a quaternization reaction is used to introduce a cationic group in the imidazole salt structure, which can adsorb moisture from the environment, forming a thin ion-conducting film on the material surface. This film rapidly leaks accumulated electrostatic charges through ion conduction, thus preventing electrostatic hazards. Then, an amino group is introduced into the system through a thiol-ene click reaction. Finally, an amide grafting reaction occurs with carboxylated multi-walled carbon nanotubes. Carbon nanotubes possess excellent conductivity and mechanical properties. By grafting lauryl polyoxyethylene ether and imidazole salt structures, a conductive network is constructed on the surface of the carbon nanotubes, enhancing the system's conductivity, thereby reducing the system's contact resistance and improving antistatic performance.

[0036] The modified scratch-resistant agent of this invention first utilizes isosorbide and methyl methacrylate for transesterification. The difuran ring in isosorbide imparts strong rigidity, and its introduction into the polymer system enhances scratch resistance. Then, a hydrosilylation reaction is used to introduce long-chain alkyl groups that can entangle with the polycarbonate backbone, preventing the short-term leakage of low-molecular-weight polysiloxanes that would cause surface dust accumulation and loss of scratch resistance. Under high temperature and shear force, the anhydride groups in maleic anhydride can undergo transesterification with the hydroxyl groups at the ends of the PC molecular chain, improving compatibility. Introducing long-chain alkyl groups, anhydride groups, and isosorbide into the polysiloxane improves the system's lubricity and wear resistance. Detailed Implementation

[0037] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0038] The following are the sources of some of the raw materials used in the examples:

[0039] Carboxylated multi-walled carbon nanotubes, 8-15nm, purchased from Jiangsu Xianfeng Nanomaterials Technology Co., Ltd.

[0040] Hydrogen-containing polysiloxane, purchased from Guangzhou Tinci Organosilicon Technology Co., Ltd., with a hydrogen content of 0.25wt%.

[0041] Example 1: The modified antistatic agent was prepared by the following steps:

[0042] Step A1: Stir and heat lauryl polyoxyethylene ether-23 to 80°C, add boron trifluoride diethyl ether solution, and then add epichlorohydrin dropwise. After the addition is complete, continue to reflux for 3 hours, and then distill under reduced pressure to obtain intermediate product 1. The ratio of lauryl polyoxyethylene ether-23, boron trifluoride diethyl ether solution and epichlorohydrin is 0.8 mol: 0.8 g: 0.92 mol.

[0043] Step A2: Mix 1-vinylimidazolium, BHT and n-hexane, purge with nitrogen, add intermediate product 1 solution dropwise, heat to 40℃ and react for 24 h. After the reaction is complete, cool to room temperature, wash, filter, and vacuum dry to obtain intermediate product 2. The molar ratio of 1-vinylimidazolium, BHT, n-hexane and intermediate product 1 solution is 0.3 mol: 0.14 mmol: 40 mL: 40 mL. Intermediate product 1 solution is prepared by mixing intermediate product 1 and n-hexane in a molar ratio of 0.6 mol: 40 mL.

[0044] Step A3: Mix intermediate product 2, cysteamine, triethylamine and tetrahydrofuran, purge with nitrogen, heat to 60°C, reflux for 12 h, cool to room temperature, rotary evaporate, wash, purify and vacuum dry to obtain intermediate product 3. The molar ratio of intermediate product 2, cysteamine, triethylamine and tetrahydrofuran is 0.1 mol: 0.1 mol: 0.02 mol: 300 mL.

[0045] Step A4: Mix carboxylated multi-walled carbon nanotubes and dicyclohexylcarbodiimide, add toluene, sonicate for 15 min, add 4-dimethylaminopyridine, heat in an oil bath at 100℃ for 10 min, then add intermediate product 3, continue the reaction for 24 h, wash with anhydrous ethanol after the reaction is complete, filter, and vacuum dry to obtain the modified antistatic agent. The ratio of carboxylated multi-walled carbon nanotubes, dicyclohexylcarbodiimide, toluene, 4-dimethylaminopyridine, intermediate product 3 and anhydrous ethanol is 0.1 g: 0.5 g: 15 mL: 0.1 g: 0.1 mol: 100 mL.

[0046] The modified scratch-resistant agent is prepared by the following steps:

[0047] Step B1: Mix isosorbide and methyl methacrylate, add sodium carbonate while stirring, heat to 130°C under vacuum of 450 mmHg, react for 2 h, cool, filter and distill under reduced pressure to obtain isosorbide derivative. The ratio of isosorbide, methyl methacrylate and sodium carbonate is 0.4 mol: 0.1 mol: 0.01 mol.

[0048] Step B2: Mix 0.9wt% isopropanol chloroplatinic acid solution with 30mL toluene, add 1-tetradecene, maleic anhydride and isosorbide derivative, stir and heat to 80℃, add hydrogen-containing polysiloxane dropwise over 1h, react for 6h, and after the reaction is complete, rotary evaporate to obtain modified scratch-resistant agent. The molar amount of double bond in 1-tetradecene accounts for 10% of the molar amount of hydrogen group in hydrogen-containing polysiloxane, the molar amount of double bond in maleic anhydride accounts for 5% of the molar amount of hydrogen group in hydrogen-containing polysiloxane, the molar amount of double bond in isosorbide derivative accounts for 50% of the molar amount of hydrogen group in hydrogen-containing polysiloxane, and the volume of isopropanol chloroplatinic acid solution is 0.1mL.

[0049] Example 2: The modified antistatic agent was prepared by the following steps:

[0050] Step A1: Stir and heat lauryl polyoxyethylene ether-23 to 80°C, add boron trifluoride diethyl ether solution, and then add epichlorohydrin dropwise. After the addition is complete, continue to reflux for 3 hours, and then distill under reduced pressure to obtain intermediate product 1. The ratio of lauryl polyoxyethylene ether-23, boron trifluoride diethyl ether solution and epichlorohydrin is 0.9 mol: 0.9 g: 1.035 mol.

[0051] Step A2: Mix 1-vinylimidazolium, BHT and n-hexane, purge with nitrogen, add intermediate product 1 solution dropwise, heat to 40℃ and react for 24 h. After the reaction is complete, cool to room temperature, wash, filter, and vacuum dry to obtain intermediate product 2. The molar ratio of 1-vinylimidazolium, BHT, n-hexane and intermediate product 1 solution is 0.35 mol: 0.16 mmol: 50 mL: 50 mL. Intermediate product 1 solution is prepared by mixing intermediate product 1 and n-hexane in a molar ratio of 0.7 mol: 50 mL.

[0052] Step A3: Mix intermediate product 2, cysteamine, triethylamine and tetrahydrofuran, purge with nitrogen, heat to 60°C, reflux for 12 h, cool to room temperature, rotary evaporate, wash, purify and vacuum dry to obtain intermediate product 3. The molar ratio of intermediate product 2, cysteamine, triethylamine and tetrahydrofuran is 0.2 mol: 0.2 mol: 0.04 mol: 350 mL.

[0053] Step A4: Mix carboxylated multi-walled carbon nanotubes and dicyclohexylcarbodiimide, add toluene, sonicate for 15 min, add 4-dimethylaminopyridine, heat in an oil bath at 100℃ for 10 min, then add intermediate product 3, continue the reaction for 24 h, wash with anhydrous ethanol after the reaction is completed, filter, and vacuum dry to obtain the modified antistatic agent. The ratio of carboxylated multi-walled carbon nanotubes, dicyclohexylcarbodiimide, toluene, 4-dimethylaminopyridine, intermediate product 3 and anhydrous ethanol is 0.1 g: 0.75 g: 17.5 mL: 0.15 g: 0.15 mol: 100 mL.

[0054] The modified scratch-resistant agent is prepared by the following steps:

[0055] Step B1: Mix isosorbide and methyl methacrylate, add sodium carbonate while stirring, heat to 130°C under vacuum of 450 mmHg, react for 2 h, cool, filter, and distill under reduced pressure to obtain isosorbide derivative. The ratio of isosorbide, methyl methacrylate and sodium carbonate is 0.8 mol: 0.2 mol: 0.02 mol.

[0056] Step B2: Mix 0.9wt% isopropanol chloroplatinic acid solution with 35mL toluene, add 1-tetradecene, maleic anhydride and isosorbide derivative, stir and heat to 80℃, add hydrogen-containing polysiloxane dropwise over 1h, react for 6h, and after the reaction is complete, rotary evaporate to obtain the modified scratch-resistant agent. The molar amount of double bond in 1-tetradecene accounts for 15% of the molar amount of hydrogen in the hydrogen-containing polysiloxane, the molar amount of double bond in maleic anhydride accounts for 5% of the molar amount of hydrogen in the hydrogen-containing polysiloxane, the molar amount of double bond in isosorbide derivative accounts for 55% of the molar amount of hydrogen in the hydrogen-containing polysiloxane, and the volume of isopropanol chloroplatinic acid solution is 0.15mL.

[0057] Example 3: The modified antistatic agent was prepared by the following steps:

[0058] Step A1: Stir and heat lauryl polyoxyethylene ether-23 to 80°C, add boron trifluoride diethyl ether solution, and then add epichlorohydrin dropwise. After the addition is complete, continue to reflux for 3 hours, and then distill under reduced pressure to obtain intermediate product 1. The ratio of lauryl polyoxyethylene ether-23, boron trifluoride diethyl ether solution and epichlorohydrin is 1 mol: 1 g: 1.15 mol.

[0059] Step A2: Mix 1-vinylimidazolium, BHT and n-hexane, purge with nitrogen, add intermediate product 1 solution dropwise, heat to 40℃ and react for 24 h. After the reaction is complete, cool to room temperature, wash, filter, and vacuum dry to obtain intermediate product 2. The molar ratio of 1-vinylimidazolium, BHT, n-hexane and intermediate product 1 solution is 0.4 mol: 0.18 mmol: 60 mL: 60 mL. Intermediate product 1 solution is prepared by mixing intermediate product 1 and n-hexane in a molar ratio of 0.8 mol: 60 mL.

[0060] Step A3: Mix intermediate product 2, cysteamine, triethylamine and tetrahydrofuran, purge with nitrogen, heat to 60°C, reflux for 12 h, cool to room temperature, rotary evaporate, wash, purify and vacuum dry to obtain intermediate product 3. The molar ratio of intermediate product 2, cysteamine, triethylamine and tetrahydrofuran is 0.3 mol: 0.3 mol: 0.06 mol: 400 mL.

[0061] Step A4: Mix carboxylated multi-walled carbon nanotubes and dicyclohexylcarbodiimide, add toluene, sonicate for 15 min, add 4-dimethylaminopyridine, heat in an oil bath at 100℃ for 10 min, then add intermediate product 3, continue the reaction for 24 h, wash with anhydrous ethanol after the reaction is completed, filter, and vacuum dry to obtain the modified antistatic agent. The ratio of carboxylated multi-walled carbon nanotubes, dicyclohexylcarbodiimide, toluene, 4-dimethylaminopyridine, intermediate product 3 and anhydrous ethanol is 0.1 g: 1 g: 20 mL: 0.2 g: 0.2 mol: 100 mL.

[0062] The modified scratch-resistant agent is prepared by the following steps:

[0063] Step B1: Mix isosorbide and methyl methacrylate, add sodium carbonate while stirring, heat to 130°C under vacuum of 450 mmHg, react for 2 h, cool, filter and distill under reduced pressure to obtain isosorbide derivative. The ratio of isosorbide, methyl methacrylate and sodium carbonate is 1.2 mol: 0.3 mol: 0.03 mol.

[0064] Step B2: Mix 0.9wt% isopropanol chloroplatinic acid solution with 40mL of toluene, add 1-tetradecene, maleic anhydride and isosorbide derivative, stir and heat to 80℃, add hydrogen-containing polysiloxane dropwise over 1h, react for 6h, and after the reaction is complete, rotary evaporate to obtain the modified scratch-resistant agent. The molar amount of double bonds in 1-tetradecene accounts for 20% of the molar amount of hydrogen groups in the hydrogen-containing polysiloxane, the molar amount of double bonds in maleic anhydride accounts for 10% of the molar amount of hydrogen groups in the hydrogen-containing polysiloxane, the molar amount of double bonds in isosorbide derivative accounts for 60% of the molar amount of hydrogen groups in the hydrogen-containing polysiloxane, and the volume of isopropanol chloroplatinic acid solution is 0.2mL.

[0065] Example 4: A method for preparing a PC chip carrier packaging material, comprising the following steps:

[0066] 80 parts polycarbonate, 15 parts ABS resin, 4 parts ACR resin, 2 parts modified antistatic agent prepared in Example 1, 3 parts modified scratch-resistant agent prepared in Example 1, 0.1 parts antioxidant 1010, and 6 parts nano zinc oxide.

[0067] Step S1: Dry the polycarbonate at 80°C for 4 hours for later use;

[0068] Step S2: The dried polycarbonate is mixed with ABS resin, ACR resin, the modified antistatic agent prepared in Example 1, the modified scratch-resistant agent prepared in Example 1, antioxidant 1010 and nano zinc oxide at a speed of 400 r / min for 10 min to obtain a mixture.

[0069] Step S3: Place the mixture in a twin-screw extruder and set the temperatures of each zone of the twin-screw extruder to be 200℃ for zone 1, 220℃ for zone 2, 240℃ for zone 3, 250℃ for zone 4, 250℃ for zone 5, 245℃ for zone 6, and 240℃ for zone 7. The screw speed is 200r / min. After melt extrusion and granulation, PC chip carrier packaging material is obtained.

[0070] Example 5: A method for preparing a PC chip carrier packaging material, comprising the following steps:

[0071] 90 parts polycarbonate, 25 parts ABS resin, 6 parts ACR resin, 4 parts modified antistatic agent prepared in Example 2, 5 parts modified scratch-resistant agent prepared in Example 2, 0.3 parts antioxidant 1010, and 8 parts nano zinc oxide.

[0072] Step S1: Dry the polycarbonate at 80°C for 4 hours for later use;

[0073] Step S2: The dried polycarbonate is mixed with ABS resin, ACR resin, the modified antistatic agent prepared in Example 2, the modified scratch-resistant agent prepared in Example 2, antioxidant 1010 and nano zinc oxide at a speed of 500 r / min for 20 min to obtain a mixture.

[0074] Step S3: Place the mixture in a twin-screw extruder and set the temperatures of each zone of the twin-screw extruder to be 210℃ for zone 1, 230℃ for zone 2, 250℃ for zone 3, 260℃ for zone 4, 260℃ for zone 5, 255℃ for zone 6, and 250℃ for zone 7. The screw speed is 300 r / min. After melt extrusion and granulation, PC chip carrier packaging material is obtained.

[0075] Example 6: A method for preparing a PC chip carrier packaging material, comprising the following steps:

[0076] 100 parts polycarbonate, 30 parts ABS resin, 8 parts ACR resin, 6 parts modified antistatic agent prepared in Example 3, 6 parts modified scratch-resistant agent prepared in Example 3, 0.5 parts antioxidant 1010, and 10 parts nano zinc oxide.

[0077] Step S1: Dry the polycarbonate at 80°C for 4 hours for later use;

[0078] Step S2: The dried polycarbonate is mixed with ABS resin, ACR resin, the modified antistatic agent prepared in Example 3, the modified scratch-resistant agent prepared in Example 3, antioxidant 1010 and nano zinc oxide at a speed of 600 r / min for 30 min to obtain a mixture.

[0079] Step S3: Place the mixture in a twin-screw extruder and set the temperatures of each zone of the twin-screw extruder to be 210℃ for zone 1, 230℃ for zone 2, 250℃ for zone 3, 260℃ for zone 4, 260℃ for zone 5, 255℃ for zone 6, and 250℃ for zone 7. The screw speed is 300 r / min. After melt extrusion and granulation, PC chip carrier packaging material is obtained.

[0080] Comparative Example 1: This comparative example is a carrier packaging material. The difference between this example and Example 6 is that the modified antistatic agent prepared in Example 3 is replaced with tributylmethylammonium bis(trifluoromethanesulfonyl)imide salt. All other aspects are the same.

[0081] Comparative Example 2: This comparative example is a carrier packaging material. The difference between this example and Example 6 is that commercially available silicone oil is used instead of the modified scratch-resistant agent prepared in Example 3. All other aspects are the same.

[0082] Comparative Example 3: This comparative example is a carrier packaging material. The difference between this example and Example 6 is that the modified antistatic agent prepared in Example 3 is replaced with tributylmethylammonium bis(trifluoromethanesulfonyl)imide salt, and the modified scratch-resistant agent prepared in Example 3 is replaced with commercially available silicone oil. All other aspects are the same.

[0083] The performance of the carrier packaging materials prepared in Examples 4-6 and Comparative Examples 1-3 was tested:

[0084] Tensile strength: Tested according to GB / T 1040.3-2022 "Determination of tensile properties of plastics - Part 3: Test conditions for thin plastics and sheets";

[0085] Impact strength: Tested according to GB / T 1843-2008 "Determination of impact strength of plastic cantilever beams";

[0086] Bending strength: Tested according to GB / T 9341-2008 "Determination of bending properties of plastics";

[0087] Surface resistivity: Surface resistivity was measured according to ASTM D257;

[0088] Scratch resistance: determined by testing on K31 leather using GMW14688;

[0089] Static friction coefficient: tested according to ASTM D1894.

[0090] The test results are shown in Table 1:

[0091] Table 1: Performance Test Results

[0092]

[0093] As can be seen from Table 1, the PC chip carrier packaging material prepared by this invention possesses good mechanical properties. The tensile strength of the material prepared in the examples is above 82.6 MPa, and the notched impact strength is 47.7 KJ / m. 2 The bending strength is above 83.2 MPa. As can be seen from Example 6 and Comparative Example 1, the modified antistatic agent prepared by this invention reduces the surface resistivity of the material and improves the mechanical properties of the system. As can be seen from Example 6 and Comparative Example 2, the modified scratch-resistant agent reduces the static friction coefficient of the material and improves its scratch resistance; the static friction coefficient of the material in Example 6 reaches 0.15. This demonstrates that the packaging material prepared by this invention possesses good mechanical properties, scratch resistance, and antistatic properties.

[0094] The above content is merely an example and illustration of the concept of the present invention. Those skilled in the art can make various modifications or additions to the specific embodiments described or use similar methods to replace them, as long as they do not deviate from the scope defined by the inventive concept, they should all fall within the protection scope of the present invention.

Claims

1. A PC chip carrier packaging material, characterized in that, The raw materials include the following parts by weight: 80-100 parts polycarbonate, 15-30 parts ABS resin, 4-8 parts ACR resin, 2-6 parts modified antistatic agent, 3-6 parts modified scratch resistant agent, 0.1-0.5 parts antioxidant, and 6-10 parts nano zinc oxide. The modified antistatic agent is prepared by the following steps: Step A1: Stir and heat lauryl alcohol polyoxyethylene ether-23 to 80°C, add boron trifluoride diethyl ether solution, and then add epichlorohydrin dropwise. After the addition is complete, continue to reflux for 3 hours, and then distill under reduced pressure to obtain intermediate product 1. Step A2: Mix 1-vinylimidazolium, BHT and n-hexane, purge with nitrogen, add intermediate product 1 solution dropwise, heat to 40℃ and react for 24 h, cool to room temperature after reaction, wash, filter and vacuum dry to obtain intermediate product 2. Step A3: Mix intermediate product 2, cysteamine, triethylamine and tetrahydrofuran, purge with nitrogen, heat to 60°C, reflux for 12 h, cool to room temperature, rotary evaporate, wash, purify and vacuum dry to obtain intermediate product 3; Step A4: Mix carboxylated multi-walled carbon nanotubes and dicyclohexylcarbodiimide, add toluene, sonicate for 15 min, add 4-dimethylaminopyridine, heat in an oil bath at 100°C for 10 min, then add intermediate product 3, continue the reaction for 24 h, wash with anhydrous ethanol after the reaction is completed, filter, and vacuum dry to obtain the modified antistatic agent.

2. The PC chip carrier packaging material according to claim 1, characterized in that, In step A1, the ratio of lauryl polyoxyethylene ether-23, boron trifluoride ethyl ether solution, and epichlorohydrin is 0.8-1 mol: 0.8-1 g: 0.92-1.15 mol.

3. The PC chip carrier packaging material according to claim 1, characterized in that, In step A2, the ratio of 1-vinylimidazole, BHT, n-hexane, and intermediate product 1 solution is 0.3-0.4 mol: 0.14-0.18 mmol: 40-60 mL: 40-60 mL.

4. The PC chip carrier packaging material according to claim 1, characterized in that, In step A2, the intermediate product 1 solution is prepared by mixing intermediate product 1 and n-hexane in a ratio of 0.6-0.8 mol: 40-60 mL.

5. The PC chip carrier packaging material according to claim 1, characterized in that, In step A3, the ratio of intermediate product 2, cysteine, triethylamine and tetrahydrofuran is 0.1-0.3 mol: 0.1-0.3 mol: 0.02-0.06 mol: 300-400 mL.

6. The PC chip carrier packaging material according to claim 1, characterized in that, In step A4, the ratio of carboxylated multi-walled carbon nanotubes, dicyclohexylcarbodiimide, toluene, 4-dimethylaminopyridine, intermediate product 3, and anhydrous ethanol is 0.1g:0.5-1g:15-20mL:0.1-0.2g:0.1-0.2mol:100mL.

7. The PC chip carrier packaging material according to claim 1, characterized in that, The modified scratch-resistant agent is prepared by the following steps: Step B1: Mix isosorbide and methyl methacrylate, add sodium carbonate while stirring, heat to 130°C under vacuum of 450 mmHg, react for 2 h, cool, filter and distill under reduced pressure to obtain isosorbide derivative. Step B2: Mix 0.9wt% isopropanol chloroplatinic acid solution with toluene, add 1-tetradecene, maleic anhydride and isosorbide derivative, stir and heat to 80℃, add hydrogen-containing polysiloxane dropwise over 1 hour, react for 6 hours, and then evaporate by rotary evaporation to obtain the modified scratch-resistant agent.

8. The PC chip carrier packaging material according to claim 7, characterized in that, In step B1, the ratio of isosorbide, methyl methacrylate, and sodium carbonate is 0.4-1.2 mol: 0.1-0.3 mol: 0.01-0.03 mol.

9. A PC chip carrier packaging material according to claim 7, characterized in that, In step B2, the molar amount of the double bond in 1-tetradecene accounts for 10%-20% of the molar amount of hydrogen groups in the hydrogen-containing polysiloxane, the molar amount of the double bond in maleic anhydride accounts for 5%-10% of the molar amount of hydrogen groups in the hydrogen-containing polysiloxane, the molar amount of the double bond in the isosorbide derivative accounts for 50%-60% of the molar amount of hydrogen groups in the hydrogen-containing polysiloxane, and the amount of isopropanol chloroplatinate solution is 0.1-0.2 mL.

10. A method for preparing the PC chip carrier packaging material according to any one of claims 1-9, characterized in that, The PC chip carrier packaging material is prepared by the following steps: Step S1: Dry the polycarbonate at 80°C for 4 hours for later use; Step S2: Mix the dried polycarbonate with ABS resin, ACR resin, modified antistatic agent, modified scratch-resistant agent, antioxidant 1010 and nano zinc oxide at a speed of 400-600 r / min for 10-30 min to obtain a mixture. Step S3: Place the mixture in a twin-screw extruder and set the temperatures of each zone of the twin-screw extruder as follows: Zone 1 200-210℃, Zone 2 220-230℃, Zone 3 240-250℃, Zone 4 250-260℃, Zone 5 250-260℃, Zone 6 245-255℃, and Zone 7 240-250℃. The screw speed is 200-300 r / min. After melt extrusion and granulation, PC chip carrier packaging material is obtained.

Images