UV-crosslinkable SIS-based adhesive, UV viscosity-reducing film and preparation method of UV-crosslinkable SIS-based adhesive

Abstract

The invention relates to an SIS (styrene isoprene styrene)-based adhesive capable of being cross-linked by UV (ultraviolet), the adhesive comprises SIS-based photosensitive resin obtained by acrylic acid graft modification and a photolysis type cross-linking agent, and a styrene-isoprene-styrene block copolymer at least contains 15 parts of a styrene hard segment block copolymer, the photolysis type cross-linking agent comprises at least one polymerizable olefinic bond and at least one photosensitive bond which can be broken by UV light. According to the invention, the SIS block copolymer is used for grafting modification, and the grafting type adhesive is used for'grafting 'different monomers or polymer chains to a main chain through chemical bonds to form a stable copolymerization structure, so that the problem of phase separation or poor compatibility caused by physical mixing in a mixed type is avoided.

Description

Technical Field

[0001] This invention belongs to the field of UV-resistant adhesive tape technology, and particularly relates to a UV-crosslinkable SIS-based adhesive and its preparation method. Background Technology

[0002] With the development of precision manufacturing fields such as microelectronic packaging and flexible displays, traditional thermally release tapes can no longer meet the demands due to the risk of damaging sensitive components (such as OLED light-emitting layers and brittle wafers) at high temperatures. UV-resistant tapes, which reduce adhesion by triggering adhesion decay under light, achieve precise peeling at room temperature and have become a key material for industrial upgrading.

[0003] In the front-end processes of semiconductor manufacturing, there are numerous steps. Wafers need sufficient thickness to meet mechanical strength and warpage requirements for handling and transfer within and between equipment. However, from a structural perspective, most integrated circuits are manufactured on a shallow surface layer of silicon substrate material. Excess thickness can generally be removed by grinding. Furthermore, wafer thinning through grinding offers several benefits, including: improved electrical performance; enhanced heat dissipation; miniaturization and thinning; reduced costs and increased production efficiency; and improved packaging quality. UV-resistant grinding tape is typically used for temporary protection during the wafer grinding process and is peeled off after processing. Ensuring effective grinding quality while preventing contamination on the wafer surface after peeling is paramount.

[0004] However, existing UV-cured adhesive tape technology suffers from a core contradiction: "curing leads to embrittlement," which manifests itself in the following ways:

[0005] The dramatic increase in modulus during UV curing induces interfacial stress concentration, and the abrupt change in modulus leads to microcracks at the tape / substrate interface, thus limiting its application and easily causing residue and other contamination. Patent CN 119081595 A introduces unsaturated quaternary ammonium salt monomers to maintain antistatic properties, but its effect on improving material flexibility and reducing the risk of embrittlement is limited. Patent CN 222156638 U, a water-based UV anti-adhesion protective film, uses a multilayer film structure design to improve the adhesion between the adhesive layer and the substrate. Although this method may greatly alleviate the risk of adhesive layer delamination, the embrittlement problem of the adhesive layer itself still exists, limiting its application scenarios. Patent TW1885082 B describes a method for thinning semiconductor wafers with uneven structures through grinding, suppressing post-grinding cracks and residue formation. The structure includes a substrate, an intermediate layer, and an adhesive layer, wherein the intermediate layer uses A (non-UV-active acrylic polymer) + B (UV-active acrylic polymer).

[0006] In summary, the technical problems mentioned above are as follows: 1. Traditional UV-cured adhesives experience a sharp increase in modulus after UV curing, which can easily lead to "embrittlement" and residue. 2. Traditional UV-cured adhesives often experience volume shrinkage during UV curing. If the temporary fixing parts have structures such as step differences, stress can easily occur at the interface during peeling, leading to defects. 3. Poor material compatibility; they have poor adaptability to different wafer materials (Si, SiC, GaN, glass, ceramics, etc.) or surface treatments (polishing, coating). For example, in BG grinding applications, there are special structures and materials such as dicing channels and passivation layers (metal oxides, PI curing layers, etc.). Traditional UV-cured adhesives are prone to residue and other contamination, affecting product yield. Special tapes need to be developed for different materials, which is costly. To solve the problems existing in the prior art, this application provides a new UV-crosslinkable SIS-based adhesive and a UV-cured adhesive tape. Summary of the Invention

[0007] The present invention aims to provide a UV crosslinkable SIS-based adhesive, a UV anti-tack film and its preparation method. The UV anti-tack film has a simple single-layer structure coating process, low cost, excellent residual adhesive performance and low surface stress, and will not cause damage to the substrate or cohesive failure of the adhesive layer during application.

[0008] To achieve the above objectives, the technical solution adopted by the present invention is: a UV-crosslinkable SIS-based adhesive, wherein the adhesive comprises an acrylic-grafted modified SIS-based photosensitive resin and a photolytic crosslinking agent, wherein the styrene-isoprene-styrene block copolymer contains at least 15 parts of styrene hard segments, and the photolytic crosslinking agent contains at least one polymerizable olefin bond and at least one photosensitive bond that can be broken by UV light. The photolytic crosslinking agent is a photoinitiator.

[0009] Core mechanism: Organically combining block elastomer (SIS rubber, maintaining high initial tack, high cohesion, and high energy absorption before curing) with UV photosensitive material (acrylate-AOI double bond, forming a restricted cross-linked network after triggering).

[0010] The following is a further improvement to the above technical solution:

[0011] 1. In the above solution, the adhesive comprises the following components by weight:

[0012] 100 parts of styrene-isoprene-styrene block copolymer (SIS)

[0013] 25-70 parts of n-butyl acrylate (BA),

[0014] 1-10 parts of 4-hydroxybenzoic acid acrylate (4HBA)

[0015] Acrylic acid (AA) 0.5-3 parts,

[0016] Dicumyl peroxide (DCP) 0.5–1.5 parts,

[0017] 0.5 parts of 6-di-tert-butyl-p-cresol (BHT)

[0018] 0.01-0.1 parts of dioctyl zinc tin dilaurate,

[0019] 1-3 parts of photoinitiator

[0020] 0.5 to 3 parts of thermosetting agent,

[0021] 1 to 10 parts of ethyl isocyanate acrylate.

[0022] Among them, styrene-isoprene-styrene block copolymer (SIS): the main soft segments can deform and adhere, avoiding "suspension" or local "over-abrasion" when the bonding and protective surface has uneven structures. The PI middle segment provides high elasticity, allowing the adhesive layer to quickly recover its deformation after being stressed, with good creep resistance, and can cope with high-frequency vibrations and local impacts generated during grinding. In addition, it has good thermal stability and creep resistance, and can maintain adhesion and structural integrity even under local temperature rise caused by grinding.

[0023] 2. In the above scheme, n-butyl acrylate (BA) provides initial tack and segment flexibility.

[0024] 3. In the above scheme, 4-hydroxybenzoic acid acrylate (4HBA) provides cohesive strength and adhesion to the substrate. 4HBA imparts good elasticity and scratch resistance to the main adhesive, and its high activity improves the grafting rate of the second-step grafting reaction. Furthermore, 4HBA contains phenolic hydroxyl groups (–OH) and carboxyl groups (–COOH), which can form hydrogen bonds, coordination bonds, or dipole interactions with metal oxides (such as Al2O3, Fe2O3), silanol groups on glass surfaces, and ester groups in PET, thereby improving adhesion.

[0025] A method for preparing a UV crosslinkable SIS-based adhesive, wherein the SIS-based photosensitive resin is obtained by two-step graft modification. The first step is to use an internal mixer to perform acrylic acid graft modification on SIS to obtain PS-1 adhesive; the second step is to dissolve PS-1 and then further graft modify the polymer through the action of a catalyst to obtain PS-2 adhesive solution.

[0026] A two-step chemical modification reaction was used to prepare SIS-based adhesives, forming photocontrolled crosslinked side chains. Compared with traditional physical blending methods, the system does not contain a large number of small molecules with active functional groups, and it avoids problems such as microphase separation. This reduces the risk of severe local embrittlement after UV curing and the risk of adhesive residue due to external stress during peeling.

[0027] The following is a further improvement to the above technical solution:

[0028] 1. The above solution includes the following steps:

[0029] Preparation of S1 and PS-1 adhesive solutions: Using an internal mixer, add the following components in sequence: styrene-isoprene-styrene block copolymer (SIS), soft monomer, functional monomer, diisopropylbenzene peroxide (DCP), and 6-di-tert-butyl-p-cresol (BHT); use toluene to prepare a 15% solid content PS-1 adhesive solution.

[0030] Preparation of S2 and PS-2 adhesive solutions: In a glass reactor, the following components are added in sequence: PS-1 adhesive solution: 300 parts by weight, ethyl isocyanate, dioctyl zinc tin dilaurate, and part of ethyl acetate. Stir until homogeneous to obtain PS-2 adhesive solution.

[0031] Preparation of S3 and SIS-based adhesives: SIS-based adhesives are prepared by mixing and stirring PS-2 solution, photoinitiator, thermosetting agent, and remaining ethyl acetate.

[0032] 2. In the above scheme, the internal mixer in step S1 is a Banbury internal mixer, and the feeding sequence is: SIS → monomer → antioxidant → initiator. Before adding the initiator diisopropylbenzene peroxide (DCP), the other materials are premixed for 5 minutes at a temperature of 50°C. After the initiator is added, the speed is set to 40-60 rpm, the temperature to 150°C, the time to 10 minutes, and the pressure to 0.2-1.0 MPa under N2 protection.

[0033] After the reaction is complete, cool the product, discharge it, and vacuum dry it at 80℃ for 2 hours.

[0034] The granules were dissolved in toluene with a solid content of 20%. After complete dissolution, the insoluble components were filtered out using a filter screen. The solid content was then remeasured and solvent was added to obtain a PS-1 solution with a solid content of 15%.

[0035] 3. In the above scheme, step S2 specifically involves adding 300 parts by weight of PS-1 adhesive solution and heating to 50°C, adding dioctyl zinc tin dilaurate and a small amount of ethyl acetate, and adding ethyl isocyanate acrylate dropwise under stirring conditions for 0.5 hours, keeping warm for 8 hours, and then cooling to obtain PS-2 adhesive solution.

[0036] 4. In the above scheme, the thermosetting agent in step S3 includes isocyanate-type curing agent and epoxy curing agent.

[0037] A UV anti-adhesion film, wherein the UV anti-adhesion film comprises, from top to bottom, a release film, a UV anti-adhesion adhesive layer and a substrate, wherein the UV anti-adhesion adhesive layer is formed by coating and curing the UV crosslinkable SIS-based adhesive as described in claim 1.

[0038] The following is a further improvement to the above technical solution:

[0039] 1. In the above scheme, the release film layer can be a PET (polyethylene terephthalate) based release film with a thickness of 25-75 μm;

[0040] The substrate layer can be a PO substrate with a thickness of 100-150 μm;

[0041] The thickness of the UV anti-adhesion layer is 15-50 μm.

[0042] A method for preparing a UV anti-adhesion film, the method comprising the following steps:

[0043] The above-prepared adhesive solution is applied to a corona-treated substrate and dried in an oven at 110°C for 3 minutes to allow the solvent to evaporate and complete curing, forming a UV-resistant adhesive layer.

[0044] Rewinding: Apply release film to the UV adhesive layer and rewind to obtain the finished product.

[0045] An application of a UV anti-adhesion film for attaching a wafer with a surface having a micro-uneven structure, and leaving no adhesive residue in the micro-uneven structure after peeling.

[0046] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0047] 1. This invention uses SIS block copolymer graft modification. The grafted adhesive "grafts" different monomers or polymer chains onto the main chain through chemical bonds to form a stable copolymer structure, avoiding the phase separation or poor compatibility problems caused by physical mixing in the mixed type.

[0048] 2. This invention can prevent residue by utilizing the interaction forces between molecular chains (such as hydrogen bonds, van der Waals forces, or chemical crosslinking); because the grafting structure enhances the interaction forces between molecular chains (such as hydrogen bonds, van der Waals forces, or chemical crosslinking), the system has higher cohesive strength, is less prone to cohesive failure and residue, and is more suitable for high-stress application scenarios.

[0049] 3. The grafted structure of this invention is denser and has a higher degree of cross-linking, resulting in better solvent and water resistance. Grafted structures are generally denser and have a higher degree of cross-linking, effectively resisting solvent penetration and moisture erosion, reducing the risk of adhesive swelling or failure, and making them suitable for humid or chemical environments. 4. Flexible formulation design and strong performance controllability: flexible monomer selection.

[0050] 4. By selecting different monomers for grafting, this invention can precisely control the properties of adhesives such as Tg (glass transition temperature), flexibility, viscosity, and curing speed, thereby meeting diverse application needs, making the formulation design flexible and the performance highly controllable. Detailed Implementation

[0051] The present invention will be further described below with reference to embodiments:

[0052] Example 1

[0053] A PO-based UV anti-adhesion film, comprising, from top to bottom: a PO substrate layer, a UV anti-adhesion adhesive layer, and a PET release film;

[0054] The UV-reducing adhesive layer is formed by coating and curing a UV-crosslinkable SIS-based adhesive. The UV-crosslinkable SIS-based adhesive is grafted using a one-step internal mixer method, combined with optimized ratios of peroxide initiators and functional monomers, to achieve a high grafting rate, low gelation, and high adhesion SIS grafted adhesive. Specific steps:

[0055] 1. PS-1 adhesive solution preparation: Using an internal mixer, add the following components in sequence:

[0056] Styrene-isoprene-styrene block copolymer (SIS): 100 parts by weight

[0057] n-Butyl acrylate (BA): 46.7 parts by weight

[0058] Acrylic acid (AA): 2.85 parts by weight

[0059] 4-Hydroxybenzoic acid acrylate (4HBA): 5.4 parts by weight

[0060] Diisopropylbenzene peroxide (DCP): 1 part by weight

[0061] 6-Di-tert-butyl-p-cresol (BHT): 0.5 parts,

[0062] The internal mixer is a Banbury internal mixer. The feeding sequence is: SIS → monomer → antioxidant → initiator. Before adding the initiator diisopropylbenzene peroxide (DCP), the other materials are premixed for 5 minutes at a temperature of 50°C. After the initiator is added, the speed is set to 40-60 rpm, the temperature to 150°C, the time to 10 minutes, and the pressure to 0.2-1.0 MPa under N2 protection.

[0063] After the reaction is complete, cool the product, discharge it, and vacuum dry it at 80℃ for 2 hours.

[0064] The granules were dissolved in toluene with a solid content of 20%. After complete dissolution, the insoluble components were filtered out using a filter screen. The solid content was then remeasured and solvent was added to obtain a PS-1 solution with a solid content of 15%.

[0065] 2. Preparation of PS-2 adhesive solution: In a glass reactor, add the following components in sequence:

[0066] PS-1 solution: 300 parts by weight

[0067] Ethyl isocyanate acrylate: 1.37 parts by weight

[0068] Dioctyl zinc tin dilaurate: 0.03 parts by weight

[0069] 5 parts by weight of ethyl acetate;

[0070] 300 parts by weight of PS-1 adhesive solution were heated to 50°C, and 0.02 parts of dioctyl zinc tin dilaurate and a small amount of ethyl acetate were added. Ethyl isocyanate acrylate was added dropwise under stirring for 0.5 hours, and the mixture was kept at this temperature for 8 hours. After cooling, PS-2 adhesive solution was obtained.

[0071] 3. Preparation of coating adhesive:

[0072] 300g of PS-2 solution

[0073] 2 parts by weight of photoinitiator

[0074] 1 part isocyanate-based curing agent

[0075] 0.02 parts epoxy curing agent,

[0076] 5 parts of ethyl acetate;

[0077] The above components are mixed evenly to prepare a UV crosslinkable SIS-based adhesive.

[0078] Coating and curing: The above adhesive solution is applied to a corona-treated PO substrate (100μm thick) and dried in an oven at 110°C for 3 minutes to allow the solvent to evaporate and complete curing, forming a UV-resistant adhesive layer with a thickness of 20μm.

[0079] Rewinding: Apply release film to the adhesive layer and rewind to obtain the finished product.

[0080] Examples 2 and 3 used the same preparation method as Example 1, and the specific components are as follows:

[0081]

[0082]

[0083] Comparative Example 1

[0084] Instead of using 4-HBA monomer, conventional hydroxyethyl acrylate was used, and the other components were the same as in Example 1.

[0085] Comparative Example 2

[0086] PS-1 adhesive liquid, without the second step of chemical modification, compared to Example 1, PS-2 adhesive liquid is replaced with PS-1 adhesive liquid, 300 parts PS-1 adhesive liquid + 7.94 parts pentaerythritol triacrylate (PETA), other components are the same as in Example 1.

[0087] Comparative Example 3

[0088] Compared to Example 1, the amount of ethyl isocyanate acrylate in the preparation of PS-2 was reduced from 1.37 parts to 0.75 parts, while other components remained the same as in Example 1.

[0089] Comparative Example 4

[0090] Compared to Example 1, in the preparation of PS-1, the amount of BA was reduced from 46.7 parts to 25 parts, AA from 2.85 parts to 1 part, 4-HBA from 5.4 parts to 1.5 parts, and DCP from 1 part to 0.4 parts. In the preparation of PS-2, the amount of ethyl isocyanate acrylate was reduced from 1.37 parts to 0.75 parts. Other components were the same as in Example 1.

[0091] Test methods and results

[0092] The above cases were compared and tested, including initial adhesion, UV adhesion, and residual adhesive evaluation.

[0093] The specific testing method is as follows:

[0094] Initial adhesion: The sample is 25mm thick. A 2kg roller is used to adhere the sample to the substrate at a speed of 300mm / min. The sample is rolled back and forth three times. The sample is left to stand at room temperature for 20 minutes. Tensile testing machine parameters: tensile speed is 300mm / min, and the distance is 150mm.

[0095] Post-UV adhesion: The sample width was 25mm. A 2kg roller was used to adhere the sample to the substrate at a speed of 300mm / min, rolling back and forth three times. The adhesion was tested after debonding. The test conditions were the same as above. Debonding parameters: LED equipment debonding, power 20%, time 10s, debonding energy 1000mJ / cm2.

[0096] Residual Adhesive Assessment: After long-term aging of the laminated wafer, UV de-adhesive is applied to the wafer surface. The wafer is left to stand for 48 hours at 85°C. After returning to room temperature, UV de-adhesive is applied at an energy of 1000mJ / cm2. The tape is then removed, and an electron microscope is used to check for residual adhesive, color differences, or other contamination.

[0097] The test data is as follows:

[0098] Test Result 1

[0099]

[0100] Note: In the table, O: Excellent; ▲: Average; X: Poor.

[0101] Test results analysis: As shown in the table, Examples 1 to 3 of the present invention perfectly achieved the comprehensive performance of high initial tack, easy debonding and no residue. However, Comparative Example 1 had a lower peel force before UV due to the different monomers selected. Comparative Example 2, due to the lack of a second step of chemical grafting modification and the use of physical blending, had high adhesion after debonding but also had the risk of residue, which could not meet the needs of high-end grinding.

[0102] Comparative Example 3 reduced the amount of ethyl isocyanate acrylate added, resulting in higher adhesion after UV treatment and difficulty in peeling off. Comparative Example 4 reduced the amount of initiator and various acrylic monomers added, resulting in lower peel strength before UV treatment and higher adhesion after UV treatment, also exhibiting difficulty in peeling off. Neither method meets the usage requirements.

[0103] The key points of this invention are as follows:

[0104] Core mechanism: Organically combining block elastomer (SIS rubber, maintaining high initial tack, high cohesion, and high energy absorption before curing) with UV photosensitive material (acrylate-AOI double bond, forming a restricted cross-linked network after triggering).

[0105] 1. Core component: SIS block copolymer graft modification

[0106] Key point: Grafted adhesives use chemical bonds to "graft" different monomers or polymer chains onto the main chain, forming a stable copolymer structure, thus avoiding the phase separation or poor compatibility problems caused by physical mixing in hybrid adhesives.

[0107] 2. Residue prevention mechanism: Intermolecular forces (such as hydrogen bonds, van der Waals forces, or chemical cross-linking)

[0108] Key points: Because the grafting structure enhances the interaction forces between molecular chains (such as hydrogen bonds, van der Waals forces or chemical crosslinking), the system has higher cohesive strength, is less prone to cohesive failure and residue, and is more suitable for high-stress applications.

[0109] 3. Mechanism of better solvent and water resistance: Grafted structures are usually more compact and have a higher degree of cross-linking.

[0110] Key points: Grafted structures are typically denser and have a higher degree of cross-linking, effectively resisting solvent penetration and moisture erosion, reducing the risk of adhesive layer swelling or failure, and are suitable for humid or chemical environments. For example: after wafer grinding, acid washing to relieve stress, water washing, etc.

[0111] 4. Flexible formulation design and strong performance controllability: flexible monomer selection

[0112] Key point: By selecting different monomers for grafting, the properties of adhesives such as Tg (glass transition temperature), flexibility, viscosity, and curing speed can be precisely controlled to meet diverse application needs.

[0113] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A UV-crosslinkable SIS-based adhesive, characterized in that, The adhesive comprises an SIS-based photosensitive resin obtained by acrylic acid grafting modification and a photolytic crosslinking agent. The styrene-isoprene-styrene block copolymer contains at least 15 parts of block copolymer with styrene hard segments. The photolytic crosslinking agent contains at least one polymerizable olefin bond and at least one photosensitive bond that can be broken by UV light.

2. The UV-crosslinkable SIS-based adhesive according to claim 1, characterized in that, The adhesive comprises the following components by weight: 100 parts of styrene-isoprene-styrene block copolymer (SIS) 25-70 parts of n-butyl acrylate (BA), 1-10 parts of 4-hydroxybenzoic acid acrylate (4HBA) Acrylic acid (AA) 0.5-3 parts, Dicumyl peroxide (DCP) 0.5–1.5 parts, 0.5 parts of 6-di-tert-butyl-p-cresol (BHT) 0.01-0.1 parts of dioctyl zinc tin dilaurate, 1-3 parts of photoinitiator 0.5 to 3 parts of thermosetting agent, 1 to 10 parts of ethyl isocyanate acrylate.

3. A method for preparing a UV-crosslinkable SIS-based adhesive according to any one of claims 1 to 2, characterized in that, The SIS-based photosensitive resin was prepared by two-step grafting modification. The first step was to use an internal mixer to graft SIS with acrylic acid to obtain PS-1 adhesive. The second step was to dissolve PS-1 and then further graft modify the polymer with a catalyst to obtain PS-2 adhesive solution.

4. The method for preparing the UV-crosslinkable SIS-based adhesive according to claim 3, characterized in that, Includes the following steps: Preparation of S1 and PS-1 adhesive solutions: Using an internal mixer, add the following components in sequence: styrene-isoprene-styrene block copolymer (SIS), soft monomer, functional monomer, diisopropylbenzene peroxide (DCP), and 6-di-tert-butyl-p-cresol (BHT); use toluene to prepare a 15% solid content PS-1 adhesive solution. Preparation of S2 and PS-2 adhesive solutions: In a glass reactor, the following components are added in sequence: PS-1 adhesive solution: 300 parts by weight, ethyl isocyanate, dioctyl zinc tin dilaurate, and part of ethyl acetate to obtain PS-2 adhesive solution; Preparation of S3 and SIS-based adhesives: SIS-based adhesives are prepared by mixing and stirring PS-2 solution, photoinitiator, thermosetting agent, and remaining ethyl acetate.

5. The method for preparing the UV-crosslinkable SIS-based adhesive according to claim 4, characterized in that, In step S1, the internal mixer is a Banbury internal mixer, and the feeding sequence is: SIS → monomer → antioxidant → initiator. Before adding the initiator diisopropylbenzene peroxide (DCP), the other materials are premixed for 5 minutes at a temperature of 50°C. After the initiator is added, the speed is set to 40-60 rpm, the temperature to 150°C, the time to 10 minutes, and the pressure to 0.2-1.0 MPa under N2 protection. After the reaction is complete, cool the product, discharge it, and vacuum dry it at 80℃ for 2 hours. The granules were dissolved in toluene with a solid content of 20%. After complete dissolution, the insoluble components were filtered out using a filter screen. The solid content was then remeasured and solvent was added to obtain a PS-1 solution with a solid content of 15%.

6. The method for preparing the UV-crosslinkable SIS-based adhesive according to claim 4, characterized in that, Specifically, step S2 involves adding 300 parts by weight of PS-1 adhesive solution and heating it to 50°C. Then, dioctyl zinc tin dilaurate and a small amount of ethyl acetate are added. Under stirring conditions, ethyl isocyanate acrylate is added dropwise over a period of 0.5 hours. The mixture is kept at this temperature for 8 hours and then cooled to obtain PS-2 adhesive solution.

7. A UV anti-adhesion film, characterized in that, The UV anti-tack film consists of a release film, a UV anti-tack adhesive layer, and a substrate from top to bottom. The UV anti-tack adhesive layer is formed by coating and curing the UV crosslinkable SIS-based adhesive as described in claim 1.

8. The UV anti-adhesion film according to claim 7, characterized in that, The release film layer can be a PET release film with a thickness of 25–75 μm; The substrate layer can be a PO substrate with a thickness of 100-150 μm; The thickness of the UV anti-adhesion layer is 15-50 μm.

9. A method for preparing a UV anti-adhesion film, characterized in that: The preparation method includes the following steps: The adhesive solution prepared according to claim 5 is applied to a substrate that has been corona-treated and dried in an oven at 110°C for 3 minutes to allow the solvent to evaporate and complete the curing process, thereby forming a UV-resistant adhesive layer. Rewinding: Apply release film to the UV adhesive layer and rewind to obtain the finished product.

10. An application of a UV anti-adhesion film, characterized in that: The UV anti-adhesion film is used to attach wafers with micro-uneven surfaces.

Images