Half-piece type silicon wafer inserting device and process

Abstract

The invention provides a half-piece type silicon wafer inserting device and process, and the device comprises a mounting and inserting line, and also comprises a double-equipment rack on the mounting and inserting line, the double-equipment rack is internally provided with an immersion cleaning device and a silicon wafer feeding mechanism, and the double-equipment rack is also internally provided with a wafer taking mechanism, a wafer inserting execution mechanism, and a washing and suction integrated mechanism. According to the invention, the washing and absorbing integrated mechanism combines the washing and absorbing structure of the silicon wafer, the silicon wafer is absorbed and inserted through the water film tension formed after the residual deionized water for washing the silicon wafer is in contact with the silicon wafer, and the silicon wafer is fixed and protected in emergency through the absorbing assembly and the anti-skid assembly. A water film can be removed while a silicon wafer is rapidly dried after the silicon wafer is inserted through the suction plate driving assembly, so that the whole device is simplified, the cost is saved, the whole wafer insertion operation steps are simplified, and the contact of deionized water can effectively reduce the friction of the silicon wafer in the wafer insertion process; scratches on the surface of the silicon wafer and indentations of a traditional suction cup are avoided.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer manufacturing technology, and in particular to a half-wafer wafer insertion device and process. Background Technology

[0002] Silicon is one of the most abundant elements in the Earth's crust and is the main material for making solar cells and chips. Monocrystalline silicon is produced by purifying polycrystalline silicon from abundant silicon raw materials in nature, and then producing zone-melted monocrystalline silicon or Czochralski monocrystalline silicon through zone melting or Czochralski method, which is further formed into silicon wafers. After the silicon wafers are produced, they need to be inserted one by one into special wafer cassettes for collection and storage. In order to improve the collection efficiency, silicon wafer insertion machines have been designed.

[0003] Chinese patent CN202411025866.8 discloses a wafer insertion device for solar cells, including a support base, a feeding mechanism on one side of the support base, a conveying mechanism on the top of the support base, a triggering mechanism on the top of the support base, a lifting mechanism on one side of the support base, and a wafer insertion basket on one side of the lifting mechanism. The triggering mechanism includes a trigger base on the top of the support base, a lifting plate movably connected to the top of the trigger base, and a trigger slide fixedly connected to the top of the base plate of the trigger base. The device uses the weight of the silicon wafer to drive the conductive movable block in the triggering mechanism to contact the power electrode plate and the output electrode plate, thereby triggering the lifting of the basket and driving the basket to rise. It can also reset and cut off the power when the silicon wafer is detached, thus ensuring that the insertion slot matches the silicon wafer and avoiding the situation where the rising speed of the basket and the transportation speed of the silicon wafer are not matched, resulting in inaccurate insertion.

[0004] However, this technical solution has certain shortcomings in use. The method of adsorbing and gripping silicon wafers by the device through the rubber suction cup structure is relatively traditional. The production efficiency is low because of the one-wafer-one-grab method. During the contact with the silicon wafer, scratches and indentations are easily formed on the surface of the silicon wafer. Moreover, it is difficult to balance the adsorption pressure. If the pressure is too high, the silicon wafer is easily damaged, while if the pressure is too low, the silicon wafer is easily detached. Summary of the Invention

[0005] The purpose of this invention is to address the shortcomings of existing technologies by providing a half-wafer silicon wafer insertion device and process. This device achieves the insertion function through a dual-line multi-insertion production line combined with an integrated washing and suction mechanism, thereby solving the problems of poor production efficiency and easy scratches and damage to silicon wafers.

[0006] To achieve the above objectives, the present invention provides the following technical solution: A half-wafer insertion device includes an insertion line, characterized in that it further includes a dual-rack on the insertion line. The dual-rack is equipped with a washing device and a wafer feeding mechanism. The dual-rack also includes a wafer picking mechanism. One end of the wafer picking mechanism is equipped with an insertion execution mechanism, and a washing and suction integrated mechanism is located below the insertion execution mechanism. The wafer picking mechanism includes a transport section located within the dual-rack, a clamping mechanism on the transport section, a robotic arm on the inner side of the wafer picking mechanism, a basket mechanism on one side of the robotic arm, and a discharge section below the basket mechanism.

[0007] The washing and suction integrated mechanism includes two sets of input bottom cylinders located below the insert actuator. Each set of input bottom cylinders has a base plate below it, and multiple evenly distributed liquid outlet grooves are embedded under the base plate. Two sets of structural side plates are also fixedly connected to the base plate. The washing and suction integrated mechanism also includes a liquid return assembly located on the two sets of input bottom cylinders. An adsorption assembly is located below the input bottom cylinder, and a suction plate drive assembly is located below the adsorption assembly. An anti-slip assembly is also provided on the adsorption assembly. The clamping mechanism includes a gantry frame located on the transport section. An adjustment assembly is located on one side of the gantry frame, and a double air knife assembly is installed on the adjustment assembly.

[0008] The insert actuator includes: a robot frame mounted on the robotic arm; a docking end mounted on the robot frame; a connecting plate fixedly connected to the robot frame; a motor a mounted on the robot frame; two sets of adjusting plates located within the robot frame; a synchronous belt mounted on the motor a, with its other end passing through one set of adjusting plates and connecting to the other set of adjusting plates; and a motor b mounted on the adjusting plates.

[0009] The liquid return assembly includes: a telescopic arm a, which is disposed on the side plate of the structure; a rotating seat, which is disposed at the bottom end of the telescopic arm a; a liquid receiving hopper, which is installed on the rotating seat; two sets of guide plates, which are disposed inside the liquid receiving hopper; a liquid return trough, which is disposed at the bottom end of one side of the liquid receiving hopper; a metal plate, which is installed on the liquid receiving hopper; a collection hopper, which is disposed on the liquid receiving hopper; a telescopic arm b, which is disposed on another set of the side plates of the structure; and an electromagnet, which is disposed at the output end of the telescopic arm b.

[0010] The adsorption assembly includes: an E-shaped suction plate, with multiple sets of E-shaped suction plates disposed under the base plate, the multiple sets of E-shaped suction plates being evenly distributed, and the gap between adjacent E-shaped suction plates being movably inserted into the silicon wafer; a contact outer plate, the contact outer plate being disposed on one side of the E-shaped suction plate; sealing holes, multiple sets of sealing holes being opened on the contact outer plate; interlocking strips, multiple sets of interlocking strips being fixedly connected to the contact outer plate; liquid outlet micropores, multiple sets of liquid outlet micropores being opened on the interlocking strips; outward expansion ends, three sets of outward expansion ends being disposed on the E-shaped suction plate; and an inner cavity, the inner cavity being opened inside the E-shaped suction plate.

[0011] The adsorption assembly further includes: an inner movable plate, which is movably connected to the E-shaped suction plate; a set of fitting seats, multiple sets of fitting seats fixedly connected to the inner movable plate, the height of the multiple sets of fitting seats being consistent with the fitting strip; two sets of air guide pipes, which are disposed on the inner movable plate; multiple sets of flow guide valves, which are disposed on the inner movable plate, the center height of the multiple sets of flow guide valves being consistent with the sealing hole; an exhaust hood, multiple sets of exhaust hoods installed on the contact outer plate, the multiple sets of exhaust hoods being sealed and inserted into the multiple sets of sealing holes; an inner plate block, which is movably connected to one side of the exhaust hood; and exhaust micro-holes, multiple sets of exhaust micro-holes being formed on the exhaust hood.

[0012] The suction plate driving assembly includes: an outer cover, two sets of which are fixedly connected to the bottom ends of both sides of the E-shaped suction plate; inner plate guide blocks, two sets of which are fixedly connected to the bottom ends of both sides of the inner movable plate, and the two sets of inner plate guide blocks are movably connected to the two sets of outer covers; an extension block, which is disposed on the inner plate guide block; a nut, which is installed on the extension block; a cover plate, which is disposed on one side of the outer cover; a sealing ring, which is disposed on the cover plate; and a slide rail, which is disposed outside the sealing ring. Side; spring, the spring being disposed within the slide rail; sealing plate, the sealing plate being movably connected to the sealing ring; slider, multiple sets of sliders being disposed outside the sealing plate; air inlet pipe, the air inlet pipe being connected through to the bottom end of one side of the outer cover; air outlet pipe, the air outlet pipe being connected through to the top end of the other side of the outer cover; liquid injection pipe, the liquid injection pipe being connected through to the bottom end of the other side of the outer cover; sealing seat, the sealing seat being disposed in the pipe through groove of the outer cover; lead screw, two sets of lead screws being disposed on both sides of the E-shaped suction plate.

[0013] The anti-slip component includes: an outer expansion seat, which is fitted onto the outer expansion end; an elastic membrane, which is disposed within the outer expansion seat; a photoelectric sensor, which is disposed on the outer expansion seat; a one-way tube, with two sets of one-way tubes connected through the outer expansion seat; a piston strip, which is movably connected within the outer expansion seat; an electric telescopic rod, which is installed within the outer expansion seat; and a telescopic rod head, which is disposed at the top end of the output end of the electric telescopic rod.

[0014] An insertion process for a half-wafer silicon wafer insertion device includes the following steps: Step 1: Loading process. After the silicon wafer raw material is cut by the cutting device, the cut silicon wafers are transported to the immersion washing device by the conveyor belt. They are immersed and cleaned by the standard cleaning solution in the immersion washing device to remove particles, organic matter and some metal contaminants. After the silicon wafers are immersed and drained, they are loaded and transported to the clamping mechanism by the silicon wafer feeding mechanism and the transportation department. They are then positioned and separated by the double air knife group in the clamping mechanism of the two production lines, so that the silicon wafers are stacked into two groups of silicon wafers and are evenly distributed with a certain distance between them. Step 2: Wafer separation process. The robotic arm moves the wafer insertion actuator to the top of a silicon wafer group on a production line. The positions of the two sets of adjustment plates and the washing and suction integrated mechanism below are adjusted by motors a and b on the wafer insertion actuator so that their positions correspond to the two sets of silicon wafer groups respectively. Furthermore, the positions of the multiple sets of E-shaped suction plates below the input bottom cylinder correspond to the gap positions between the silicon wafers. The robotic arm drives multiple E-shaped suction plates to be inserted into two sets of silicon wafers simultaneously. The liquid receiving hopper is extended beyond the bottom of the corresponding silicon wafer set by the telescopic arm a, and the liquid receiving hopper is rotated to a horizontal position by the rotating seat so that it is below the silicon wafer set. On the other side, the electromagnet is driven by the telescopic arm b to contact the metal plate on the liquid receiving hopper. The other end of the liquid receiving hopper is fixed by magnetic force to complete the preparation for receiving and recycling the rinsing liquid. Step 3: Rinsing process. By connecting the bottom tank to the external water source, deionized water is sprayed from the outlet tank to rinse both sides of the silicon wafer below the outlet tank, in order to remove the immersion solution and impurities on the silicon wafer. At the same time as the bottom tank is connected, deionized water is injected into the E-shaped suction plate through the injection pipe through the outer cover, and sprayed out through the micro-holes on the multiple sets of interlocking strips on the contact outer plate to further rinse the adsorption surface of the silicon wafer and ensure the cleanliness of the contact surface. The flushed deionized water is collected by the receiving hopper and flows into the collection hopper. The deionized water is then extracted through the external pipeline, filtered, and recycled. Step 4: Suction and insertion process. After rinsing, recycle telescopic arm a, telescopic arm b and liquid receiving hopper. Through the return tank set in the rotating end of the liquid receiving hopper, the residual deionized water in the liquid receiving hopper and collection hopper will not overflow during the recycling process. The robotic arm micro-drives multiple sets of E-shaped suction plates to contact the outer plate of the silicon wafer and attach it to one side. After rinsing, the outer plate surface is left with deionized water. After it comes into full contact with the silicon wafer, a water film is formed. The surface tension of the water film adsorbs and fixes the silicon wafer, so that two silicon wafer sets can be picked up at the same time. The robotic arm then transports the two silicon wafer sets at the same time and inserts them into the basket of the flower basket mechanism to complete the wafer insertion. Step 5: Anti-slip process. During the silicon wafer assembly movement and insertion, the water film between the silicon wafer and the contact outer plate blocks the liquid outlet micropores on multiple sets of interlocking strips, thus preventing the deionized water in the E-shaped suction plate from flowing out. Due to gravity, when the water film at the bottom between the contact outer plate and the silicon wafer flows out, a gap appears between the silicon wafer and the bottom of the contact outer plate. This opens the liquid outlet micropores at that point, and the deionized water stored at the bottom of the E-shaped suction plate overflows from the open liquid outlet micropores, repairing the lost water film and preventing the water film from being missing, which would reduce the tension adsorption effect and thus prevent the silicon wafer from falling off. When the silicon wafer slides down, it no longer blocks the light from the photoelectric sensor. The photoelectric sensor receives the light signal and triggers the electric telescopic rod. The electric telescopic rod pushes the piston bar to extend rapidly and squeezes the liquid in the expansion seat out of the one-way tube, creating a negative pressure inside the expansion seat and causing the outer elastic membrane to collapse. The rapid collapse of the elastic membrane creates a negative pressure at the contact point with the silicon wafer, which can adsorb and fix the silicon wafer as it slides down, preventing it from slipping and being damaged. Step Six: Unloading Process. After wafer insertion, the lead screw is driven by an external motor to rotate slightly by a certain angle. The rotation of the lead screw, through the nut and the inner plate guide block, drives the inner movable plate to move towards the silicon wafer side in the E-shaped suction plate. During the movement, the inner plate guide block moves from the air inlet pipe to the liquid injection pipe, thus connecting the air inlet pipe with the outer cover and the air outlet pipe. The inner plate guide block seals the liquid injection pipe to prevent the backflow of deionized water from above. During the movement, the fitting seat on the inner movable plate contacts the fitting strip, and the elastic structure at the front end of the fitting seat seals the liquid outlet micropores, reducing the loss of deionized water in the E-shaped suction plate. Simultaneously, the inner movable plate... Multiple sets of inner plate blocking blocks are pushed out slightly, thus slightly pushing the silicon wafer away. This prevents the water film from contacting the silicon wafer and allows air to flow freely between the silicon wafer and the outer contact plate. The deionized water will fall due to gravity. After the multiple sets of inner plate blocking blocks are removed from the vent hood, multiple sets of vent micro-holes on the vent hood open. Hot air is injected into multiple sets of guide valves through the air guide pipe. The hot air is sprayed out from the multiple sets of vent micro-holes to blow and dry the gap between the silicon wafer and the outer contact plate. This achieves silicon wafer separation and unloading while drying the silicon wafer, which is convenient for subsequent processing and avoids secondary contamination of the silicon wafer.

[0015] The beneficial effects of this invention are as follows: (1) The present invention, through the setting of dual production lines and robotic arms, as well as dual clamping and dual adsorption structures, and controlled by the same system, can simultaneously insert multiple silicon wafer components, effectively improving the insertion efficiency while reducing the time required for slicing and immersion, increasing production capacity while reducing costs.

[0016] (2) The present invention combines the washing and suction structure of silicon wafers through the washing and suction integrated mechanism. The silicon wafers are adsorbed and inserted by the water film tension formed by the deionized water remaining after washing the silicon wafers. This simplifies the overall device and saves costs while simplifying the overall insertion process. The contact of deionized water can effectively reduce the friction of silicon wafers during the insertion process, avoiding scratches on the silicon wafer surface and the indentation of traditional suction cups.

[0017] (3) The present invention provides emergency fixation protection for silicon wafers by using the adsorption component and anti-slip component in the washing and adsorption integrated mechanism to prevent silicon wafers from falling off and being damaged during the wafer insertion process.

[0018] (4) In this invention, the suction plate driving component in the washing and suction integrated mechanism separates the silicon wafer after the silicon wafer is inserted and opens the air outlet at the same time. The silicon wafer is dried quickly through the gas pipeline and the water film can be removed at the same time, so as to achieve rapid separation of the silicon wafer and further improve the overall insertion efficiency. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the wafer-taking mechanism of the present invention; Figure 3 This is a schematic diagram of the clamping mechanism of the present invention; Figure 4 This is a schematic diagram of the overall structure of the insert actuator of the present invention; Figure 5 This is a schematic cross-sectional view of the insert actuator of the present invention; Figure 6 This is a schematic diagram of the integrated washing and suction mechanism of the present invention; Figure 7 This is a schematic diagram of the liquid return assembly structure of the present invention; Figure 8 This is a schematic diagram of the cross-sectional structure of the liquid receiving hopper of the present invention; Figure 9 This is a schematic diagram of the bottom cylinder structure of the present invention; Figure 10 This is a schematic diagram of the overall structure of the adsorption component of the present invention; Figure 11 This is a schematic diagram of the disassembled structure of the adsorption component of the present invention; Figure 12 This is a schematic diagram of the internal movable plate structure of the present invention; Figure 13 This is a schematic diagram of the air duct structure of the present invention; Figure 14 This is a schematic diagram of the overall structure of the suction plate driving assembly of the present invention; Figure 15 This is a schematic diagram of the disassembled structure of the suction plate driving assembly of the present invention; Figure 16 This is a schematic diagram of the overall structure of the anti-slip component of the present invention; Figure 17 This is a schematic diagram of the internal structure of the anti-slip component of the present invention.

[0020] The reference numerals in the accompanying drawings of this application are as follows: 1. Insertion line; 101. Dual equipment rack; 102. Immersion washing device; 103. Silicon wafer feeding mechanism; 2. Wafer picking mechanism; 201. Transport section; 202. Clamping mechanism; 2021. Gantry frame; 2022. Adjustment component; 2023. Dual air knife assembly; 203. Robotic arm; 204. Basket mechanism; 205. Unloading section; 3. Insertion execution mechanism; 301. Robot frame; 302. Docking end; 303. Connecting plate; 304. Motor a; 305, Adjusting plate; 306, Synchronous belt; 307, Motor b; 4. Washing and suction integrated mechanism; 401, Input bottom cylinder; 402, Base plate; 403, Discharge tank; 404, Structural side plate; 41, Return liquid assembly; 411, Telescopic arm a; 412, Rotating seat; 413, Receiving hopper; 4131, Guide plate; 4132, Return liquid tank; 4133, Metal plate; 414, Collection hopper; 415, Telescopic arm b; 416, Electromagnet; 42, Adsorption assembly; 421. E-shaped suction plate; 422. Contact outer plate; 4221. Sealing hole; 4222. Fitting strip; 4223. Liquid outlet micro-hole; 423. Outward expansion end; 424. Inner cavity; 425. Inner movable plate; 4251. Fitting seat; 4252. Air guide tube; 4253. Flow guide valve; 4254. Air outlet hood; 4255. Inner plate block; 4256. Air outlet micro-hole; 43. Suction plate drive assembly; 431. Outer cover; 432. Inner plate guide block; 4321. Extension block; 43 22. Nut; 433. Cover plate; 4331. Sealing ring; 4332. Slide rail; 4333. Spring; 4334. Sealing plate; 4335. Slider; 434. Air inlet pipe; 435. Air outlet pipe; 436. Liquid injection pipe; 437. Sealing seat; 438. Lead screw; 44. Anti-slip component; 441. Outer expansion seat; 442. Elastic diaphragm; 443. Photoelectric sensor; 444. One-way tube; 445. Piston bar; 446. Electric telescopic rod; 447. Telescopic rod head. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0024] Example 1: As Figures 1-17 As shown, this embodiment provides a half-wafer insertion device, including an insertion line 1 and a double rack 101 on the insertion line 1. The double rack 101 is equipped with a washing device 102 and a silicon wafer feeding mechanism 103. The double rack 101 is also equipped with a wafer picking mechanism 2. One end of the wafer picking mechanism 2 is equipped with an insertion execution mechanism 3, and a washing and suction integrated mechanism 4 is provided below the insertion execution mechanism 3. The wafer picking mechanism 2 includes a transport section 201 located in the double rack 101. The transport section 201 is equipped with a clamping mechanism 202. A robotic arm 203 is provided on the inner side of the wafer picking mechanism 2. A basket mechanism 204 is provided on one side of the robotic arm 203. A discharge section 205 is provided below the basket mechanism 204.

[0025] The washing and suction integrated mechanism 4 includes two sets of input bottom cylinders 401 located below the insert actuator 3. Each set of input bottom cylinders 401 is provided with a bottom plate 402 below it. Multiple sets of evenly distributed liquid outlet grooves 403 are embedded under the bottom plate 402. Two sets of structural side plates 404 are also fixedly connected to the bottom plate 402. The washing and suction integrated mechanism 4 also includes a return liquid assembly 41 located on the two sets of input bottom cylinders 401. An adsorption assembly 42 is located below the input bottom cylinders 401. A suction plate drive assembly 43 is located below the adsorption assembly 42. An anti-slip assembly 44 is also provided on the adsorption assembly 42. The clamping mechanism 202 includes a gantry frame 2021 located on the transport section 201. An adjustment assembly 2022 is located on one side of the gantry frame 2021. A double air knife assembly 2023 is installed on the adjustment assembly 2022.

[0026] The insert actuator 3 includes: a robot frame 301, which is mounted on the robotic arm 203; a docking end 302, which is mounted on the robot frame 301; a connecting plate 303, which is fixedly connected to the robot frame 301; a motor a 304, which is mounted on the robot frame 301; two sets of adjusting plates 305, which are located inside the robot frame 301; a synchronous belt 306, which is mounted on the motor a 304, and the other end of the synchronous belt 306 passes through one set of adjusting plates 305 and connects to the other set of adjusting plates 305; and a motor b 307, which is mounted on the adjusting plate 305.

[0027] In this embodiment, the insertion line 1 cuts the silicon wafers using a cutting device and then transports them via a conveyor belt to the immersion washing device 102. The wafers are immersed in a standard cleaning solution within the immersion washing device 102 to remove particles, organic matter, and some metallic contaminants. After immersion washing and draining, the silicon wafers are fed by the silicon wafer feeding mechanism 103 and the transport unit 201 to the clamping mechanism 202. The wafers are further cleaned and dried by the dual air knife groups 2023 in the two sets of clamping mechanisms 202 on the production line. The wafers are then diced and stacked into two sets using clamps. During stacking, laser sensors precisely position the wafers, ensuring a uniform distribution with a certain gap between them. The wafers are then rotated... The rotating robotic arm 203 moves the wafer insertion actuator 3 above a set of silicon wafers on a production line. The synchronous belt 306 and gear move through the rotation of motors a304 and b307 on the wafer insertion actuator 3. The synchronous belt 306 and gear drive the two sets of adjusting plates 305 to move, so that the two sets of adjusting plates 305 move towards each other and adjust the positions of the two sets of adjusting plates 305 and the washing and suction integrated mechanism 4. The positions of the washing and suction integrated mechanism 4 are respectively aligned with the two sets of silicon wafers. Furthermore, the positions of the multiple sets of E-shaped suction plates 421 below the input bottom cylinder 401 are aligned with the gap positions between the silicon wafers. After subsequent wafer insertion, continuous feeding can be carried out, reducing the cutting and washing time and improving the overall wafer insertion efficiency.

[0028] The liquid return assembly 41 includes: a telescopic arm a411, which is mounted on the structural side plate 404; a rotating seat 412, which is located at the bottom end of the telescopic arm a411; a liquid receiving hopper 413, which is mounted on the rotating seat 412; two sets of guide plates 4131, which are located inside the liquid receiving hopper 413; a liquid return trough 4132, which is located at the bottom end of one side of the liquid receiving hopper 413; a metal plate 4133, which is mounted on the liquid receiving hopper 413; a collection hopper 414, which is located on the liquid receiving hopper 413; a telescopic arm b415, which is mounted on another set of structural side plates 404; and an electromagnet 416, which is located at the output end of the telescopic arm b415.

[0029] In this embodiment, the robotic arm 203 drives multiple sets of E-shaped suction plates 421 to be simultaneously inserted into two sets of silicon wafers. The telescopic arm a411 extends the liquid receiving hopper 413 beyond the bottom of the corresponding silicon wafer set, and the rotating seat 412 rotates the liquid receiving hopper 413 to a horizontal position, placing it below the silicon wafer set. On the other side, the telescopic arm b415 drives the electromagnet 416 to contact the metal plate 4133 on the liquid receiving hopper 413, and fixes the other end of the liquid receiving hopper 413 by magnetic force. The liquid receiving hopper 413 collects the deionized water sprayed out during subsequent cleaning and flows into the collection hopper 414. The deionized water is then extracted through the external pipeline, filtered, and recycled.

[0030] The adsorption assembly 42 includes an E-shaped suction plate 421, with multiple sets of E-shaped suction plates 421 disposed under the base plate 402. The multiple sets of E-shaped suction plates 421 are evenly distributed, and the gap between adjacent E-shaped suction plates 421 is movably inserted into the silicon wafer; a contact outer plate 422, which is disposed on one side of the E-shaped suction plate 421; sealing holes 4221, with multiple sets of sealing holes 4221 opened on the contact outer plate 422; interlocking strips 4222, with multiple sets of interlocking strips 4222 fixedly connected to the contact outer plate 422; liquid outlet micropores 4223, with multiple sets of liquid outlet micropores 4223 opened on the interlocking strips 4222; outward expansion ends 423, with three sets of outward expansion ends 423 disposed on the E-shaped suction plate 421; and an inner cavity 424, which is opened inside the E-shaped suction plate 421.

[0031] The adsorption assembly 42 further includes: an inner movable plate 425, which is movably connected to the E-shaped suction plate 421; a fitting seat 4251, with multiple sets of fitting seats 4251 fixedly connected to the inner movable plate 425, the height of the multiple sets of fitting seats 4251 being consistent with the fitting strip 4222, and a rubber block provided at the front end of the fitting seat 4251; two sets of air guide pipes 4252, which are provided on the inner movable plate 425; and multiple sets of flow guide valves 4253. 3. On the inner movable plate 425, the center height of multiple sets of flow guide valves 4253 is consistent with the sealing hole 4221; vent hood 4254, multiple sets of vent hood 4254 are installed on the contact outer plate 422, and multiple sets of vent hood 4254 are sealed and inserted into multiple sets of sealing holes 4221; inner plate block 4255, inner plate block 4255 is movably connected to one side of vent hood 4254; vent micro-hole 4256, multiple sets of vent micro-hole 4256 are opened on vent hood 4254.

[0032] In this embodiment, by connecting the input bottom cylinder 401 to an external water source, deionized water is sprayed from the outlet tank 403 to rinse both sides of the silicon wafer located below the outlet tank 403, so as to remove the immersion solution and impurities on the silicon wafer. At the same time as the input bottom cylinder 401 is turned on, the external water source injects water through the injection pipe 436. The deionized water enters the outer cover 431 through the injection pipe 436 and is injected into the E-shaped suction plate 421 through the inner opening of the outer cover 431. It is then sprayed out through the liquid outlet microholes 4223 on the multiple sets of interlocking strips 4222 on the contact outer plate 422 to further rinse the adsorption surface of the silicon wafer and ensure the cleanliness of the contact surface. The robotic arm 203 drives multiple sets of E-shaped suction plates 421 to contact the outer plates 422 with one side of the silicon wafer. After rinsing, deionized water remains on the surface of the outer plates 422. After complete contact with the silicon wafer, a water film is formed. The surface tension of the water film adsorbs and fixes the silicon wafer, so that two silicon wafer groups can be picked up at the same time. The robotic arm 203 transports the two silicon wafer groups at the same time and inserts them into the basket in the basket mechanism 204 to complete the wafer insertion. During the movement of the silicon wafer assembly, the water film between the silicon wafer and the contact outer plate 422 blocks the liquid outlet micropores 4223 on the multiple sets of interlocking strips 4222, so that the deionized water in the E-shaped suction plate 421 will not be lost. Due to gravity, when the water film at the bottom between the contact outer plate 422 and the silicon wafer is lost, a gap will appear at the bottom of the silicon wafer and the contact outer plate 422. The liquid outlet micropores 4223 at this point will open, and the deionized water stored at the bottom of the E-shaped suction plate 421 will overflow from the open liquid outlet micropores 4223 to repair the lost water film, avoid the loss of water film and reduce the tension adsorption effect, thereby preventing the silicon wafer from falling off.

[0033] The suction plate drive assembly 43 includes: an outer cover 431, two sets of outer covers 431 fixedly connected to the bottom ends of both sides of the E-shaped suction plate 421; inner plate guide blocks 432, two sets of inner plate guide blocks 432 fixedly connected to the bottom ends of both sides of the inner movable plate 425, and the two sets of inner plate guide blocks 432 are respectively movably connected to the two sets of outer covers 431; an extension block 4321, the extension block 4321 is disposed on the inner plate guide block 432; a nut 4322, the nut 4322 is installed on the extension block 4321; a cover plate 433, the cover plate 433 is disposed on one side of the outer cover 431; a sealing ring 4331, the sealing ring 4331 is disposed on the cover plate 433; and a slide rail 4332, the slide rail 4332 is disposed outside the sealing ring 4331. Side; Spring 4333, spring 4333 is located inside slide rail 4332; Sealing plate 4334, sealing plate 4334 is movably connected to sealing ring 4331; Slider 4335, multiple sliders 4335 are located outside sealing plate 4334; Air inlet pipe 434, air inlet pipe 434 is connected through to the bottom end of one side of outer cover 431; Air outlet pipe 435, air outlet pipe 435 is connected through to the top end of the other side of outer cover 431; Liquid injection pipe 436, liquid injection pipe 436 is connected through to the bottom end of the other side of outer cover 431; Sealing seat 437, sealing seat 437 is located in the pipe through groove of outer cover 431; Lead screw 438, two sets of lead screws 438 are located on both sides of E-shaped suction plate 421.

[0034] In this embodiment, an external motor drives the lead screw 438 to rotate slightly by a certain angle. The rotation of the lead screw 438, via the nut 4322 and the inner plate guide block 432, causes the inner movable plate 425 to move towards the silicon wafer side of the E-shaped suction plate 421. During this movement, the fitting seat 4251 on the inner movable plate 425 contacts the fitting strip 4222. The rubber block at the front end of the fitting seat 4251 seals the liquid outlet micropore 4223, reducing the loss of deionized water in the E-shaped suction plate 421. Simultaneously, the inner movable plate 425 slightly pushes out the inner plate blocking blocks 4255 on multiple sets of air outlet hoods 4254, thus slightly pushing the silicon wafer away, thereby... The water film no longer contacts the silicon wafer, allowing air to flow freely between the silicon wafer and the contact outer plate 422. The deionized water on both will fall due to gravity. After the multiple sets of inner plate blockages 4255 are pushed out from the vent 4254, the multiple sets of vent micro-holes 4256 on the vent 4254 open, the external hot air blower runs, and hot air is injected into the multiple sets of guide valves 4253 through the air guide pipe 4252. After being guided by the multiple sets of guide valves 4253, the hot air is sprayed out from the multiple sets of vent micro-holes 4256 to blow and dry the gap between the silicon wafer and the contact outer plate 422. This achieves the separation and unloading of the silicon wafer while drying it, which is convenient for subsequent processing and avoids secondary contamination of the silicon wafer.

[0035] The anti-slip component 44 includes: an outer expansion seat 441, which is fitted onto the outer expansion end 423; an elastic membrane 442, which is disposed within the outer expansion seat 441; a photoelectric sensor 443, which is disposed on the outer expansion seat 441; a one-way tube 444, with two sets of one-way tubes 444 passing through and connected to the outer expansion seat 441; a piston strip 445, which is movably connected within the outer expansion seat 441; an electric telescopic rod 446, which is installed within the outer expansion seat 441; and a telescopic rod head 447, which is located at the top of the output end of the electric telescopic rod 446.

[0036] In this embodiment, when the silicon wafer slides down, it no longer blocks the light from the photoelectric sensor 443. The photoelectric sensor 443 receives the light signal and triggers the electric telescopic rod 446. The electric telescopic rod 446 pushes the piston bar 445 to extend rapidly and squeezes the liquid in the outer expansion seat 441 out of the one-way tube 444 above the outer expansion seat 441. This creates a negative pressure inside the outer expansion seat 441 and causes the outer elastic membrane 442 to dent. The rapid denting of the elastic membrane 442 creates a negative pressure at the contact point with the silicon wafer, thereby adsorbing and fixing the silicon wafer as it slides down, preventing it from slipping and being damaged.

[0037] Example 2: Figures 1-17 As shown, components that are the same as or corresponding to those in Embodiment 1 are referred to using the same reference numerals as in Embodiment 1. For simplicity, only the differences from Embodiment 1 are described below. The difference between Embodiment 2 and Embodiment 1 is as follows: An insertion process for a half-wafer silicon wafer insertion device includes the following steps: Step 1: Feeding process. After the silicon wafer raw material is cut by the cutting device, the sliced ​​silicon wafers are transported to the immersion washing device 102 by the conveyor belt. The wafers are immersed and cleaned by the standard cleaning solution in the immersion washing device 102 to remove particles, organic matter and metal contaminants. After the silicon wafers are immersed and drained, they are fed and transported to the clamping mechanism 202 by the silicon wafer feeding mechanism 103 and the transportation department 201. The wafers are positioned and separated by the double air knife group 2023 in the clamping mechanism 202 of the two production lines, so that the silicon wafers are stacked into two groups of silicon wafers and the silicon wafers are evenly distributed with a certain distance between them. Step 2: Wafer separation process. The inserting actuator 3 is moved above the silicon wafer group of a production line by the robotic arm 203. The positions of the two sets of adjusting plates 305 and the washing and suction integrated mechanism 4 below are adjusted by the motors a304 and b307 on the inserting actuator 3 so that their positions correspond to the two sets of silicon wafer groups respectively. Furthermore, the positions of the multiple sets of E-shaped suction plates 421 below the input bottom cylinder 401 correspond to the gap positions between the silicon wafers. The robotic arm 203 drives multiple E-shaped suction plates 421 to be inserted into two sets of silicon wafers simultaneously. The telescopic arm a411 extends the liquid receiving hopper 413 beyond the bottom of the corresponding silicon wafer set, and the rotating seat 412 rotates the liquid receiving hopper 413 to a horizontal position, placing it below the silicon wafer set. On the other side, the telescopic arm b415 drives the electromagnet 416 to contact the metal plate 4133 on the liquid receiving hopper 413. The other end of the liquid receiving hopper 413 is fixed by magnetic force to complete the preparation for receiving and recycling the rinsing liquid. Step 3: Rinsing process. By connecting the input bottom cylinder 401 to an external water source, deionized water is sprayed from the liquid outlet tank 403 to rinse both sides of the silicon wafer located below the liquid outlet tank 403, in order to remove standard cleaning solution and impurities from the silicon wafer. At the same time as the input bottom cylinder 401 is connected, the external water source injects water through the liquid injection pipe 436. The deionized water enters the outer cover 431 through the liquid injection pipe 436 and is injected into the E-shaped suction plate 421 through the inner opening of the outer cover 431. It is then sprayed out through the liquid outlet microholes 4223 on the multiple sets of interlocking strips 4222 on the contact outer plate 422 to further rinse the adsorption surface of the silicon wafer and ensure the cleanliness of the contact surface. The flushed deionized water is collected by the receiving hopper 413 and flows into the collection hopper 414. The deionized water is then extracted through the external pipeline, filtered, and recycled. Step 4: After the suction and rinsing process is completed, the telescopic arm a411, telescopic arm b415 and liquid receiving hopper 413 are recovered. Through the return tank 4132 set in the rotating end of the liquid receiving hopper 413, the residual deionized water in the liquid receiving hopper 413 and the collection hopper 414 will not overflow during the recovery process due to the influence of centrifugal force and liquid flow rate. The robotic arm 203 drives multiple sets of E-shaped suction plates 421 to contact the outer plates 422 with one side of the silicon wafer. After rinsing, deionized water remains on the surface of the outer plates 422. After complete contact with the silicon wafer, a water film is formed. The surface tension of the water film adsorbs and fixes the silicon wafer, so that two silicon wafer groups can be picked up at the same time. The robotic arm 203 transports the two silicon wafer groups at the same time and inserts them into the basket in the basket mechanism 204 to complete the wafer insertion. Step 5: Anti-slip process. During the silicon wafer assembly movement and insertion process, the water film between the silicon wafer and the contact outer plate 422 blocks the liquid outlet micropores 4223 on the multiple sets of interlocking strips 4222, so that the deionized water in the E-shaped suction plate 421 will not be lost. Due to gravity, when the water film at the bottom between the contact outer plate 422 and the silicon wafer is lost, a gap will appear between the silicon wafer and the bottom of the contact outer plate 422. Furthermore, the liquid outlet micropores 4223 at this point will open, and the deionized water stored at the bottom of the E-shaped suction plate 421 will overflow from the open liquid outlet micropores 4223 to repair the lost water film, avoid the water film loss reducing the tension adsorption effect, and thus prevent the silicon wafer from falling off. When the silicon wafer slides down, it no longer blocks the light from the photoelectric sensor 443. The photoelectric sensor 443 receives the light signal and triggers the electric telescopic rod 446. The electric telescopic rod 446 pushes the piston bar 445 to extend rapidly and squeezes the liquid in the outer expansion seat 441 out of the one-way tube 444. This creates a negative pressure inside the outer expansion seat 441 and causes the outer elastic membrane 442 to collapse. The rapid collapse of the elastic membrane 442 creates a negative pressure at the contact point with the silicon wafer, which can adsorb and fix the silicon wafer as it slides down, preventing it from slipping and being damaged. Step Six: Unloading Process. After wafer insertion, the lead screw 438 is driven by an external motor to rotate slightly. The rotation of the lead screw 438 is transmitted through the threaded drive of the nut 4322 and the inner plate guide block 432, causing the inner movable plate 425 to move towards the silicon wafer side in the E-shaped suction plate 421. During the movement, the inner plate guide block 432 moves from the air inlet pipe 434 to the liquid injection pipe 436, thereby connecting the air inlet pipe 434 with the outer cover 431 and the air outlet pipe 435. The inner plate guide block 432 blocks the liquid injection pipe 436. During the movement, the fitting seat 4251 on the inner movable plate 425 contacts the fitting strip 4222. The elastic structure at the front end of the fitting seat 4251 blocks the liquid outlet micropore 4223, reducing the loss of deionized water in the E-shaped suction plate 421. Simultaneously, the inner movable plate 425 slightly pushes out multiple sets of inner plate blocking blocks 4255, and pushes the silicon wafer slightly away through the multiple sets of inner plate blocking blocks 4255, so that the water film no longer contacts the silicon wafer, and allows air to flow freely between the silicon wafer and the contact outer plate 422. The deionized water will fall by gravity. After the multiple sets of inner plate blocking blocks 4255 are pushed away from the air outlet hood 4254, the multiple sets of air outlet micro-holes 4256 on the air outlet hood 4254 open, and hot air is injected into the multiple sets of guide valves 4253 through the air guide pipe 4252. The hot air is sprayed out from the multiple sets of air outlet micro-holes 4256 to blow and dry the gap between the silicon wafer and the contact outer plate 422, thereby realizing the separation and unloading of silicon wafers while drying them, which facilitates subsequent processing and avoids secondary contamination of silicon wafers.

[0038] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A half-wafer silicon wafer insertion device, comprising insertion wires (1), characterized in that, It also includes a dual equipment rack (101) on the insertion line (1). The dual equipment rack (101) is equipped with an immersion washing device (102) and a silicon wafer feeding mechanism (103). The dual equipment rack (101) is also equipped with a wafer picking mechanism (2). One end of the wafer picking mechanism (2) is equipped with a wafer insertion execution mechanism (3). Below the wafer insertion execution mechanism (3) is a washing and suction integrated mechanism (4). The film taking mechanism (2) includes a transport section (201) located in the double equipment rack (101), a clamping mechanism (202) is provided on the transport section (201), a robotic arm (203) is provided on the inner side of the film taking mechanism (2), a basket mechanism (204) is provided on one side of the robotic arm (203), and a discharge section (205) is provided below the basket mechanism (204).

2. The half-wafer insertion device according to claim 1, characterized in that, The washing and suction integrated mechanism (4) includes two sets of input bottom cylinders (401) located under the insert actuator (3). Each set of input bottom cylinders (401) is provided with a bottom plate (402). Multiple sets of evenly distributed liquid outlet grooves (403) are embedded under the bottom plate (402). Two sets of structural side plates (404) are also fixedly connected to the bottom plate (402). The washing and suction integrated mechanism (4) also includes a return liquid assembly (41) located on the two sets of input bottom cylinders (401). An adsorption assembly (42) is located below the input bottom cylinder (401). A suction plate drive assembly (43) is located below the adsorption assembly (42). An anti-slip assembly (44) is also located on the adsorption assembly (42). The clamping mechanism (202) includes a gantry (2021) mounted on the transport section (201), an adjustment assembly (2022) is provided on one side of the gantry (2021), and a double air knife assembly (2023) is mounted on the adjustment assembly (2022).

3. The half-wafer insertion device according to claim 1, characterized in that, The insert actuator (3) includes: a robot frame (301) mounted on the robotic arm (203); a docking end (302) mounted on the robot frame (301); a connecting plate (303) fixedly connected to the robot frame (301); a motor a (304) mounted on the robot frame (301); an adjusting plate (305) with two sets of adjusting plates (305) located inside the robot frame (301); a synchronous belt (306) mounted on the motor a (304), with the other end of the synchronous belt (306) passing through one set of adjusting plates (305) and connected to the other set of adjusting plates (305); and a motor b (307) mounted on the adjusting plate (305).

4. The half-wafer insertion device according to claim 2, characterized in that, The liquid return assembly (41) includes: a telescopic arm a (411), which is mounted on the structural side plate (404); a rotating seat (412), which is located at the bottom end of the telescopic arm a (411); a liquid receiving hopper (413), which is mounted on the rotating seat (412); a guide plate (4131), two sets of the guide plates (4131) are located inside the liquid receiving hopper (413); and a liquid return tank (4132). A liquid tank (4132) is located at the bottom of one side of the receiving hopper (413); a metal plate (4133) is installed on the receiving hopper (413); a collection hopper (414) is located on the receiving hopper (413); a telescopic arm b (415) is located on another set of the structural side plates (404); and an electromagnet (416) is located at the output end of the telescopic arm b (415).

5. A half-wafer insertion device according to claim 2, characterized in that, The adsorption assembly (42) includes: an E-shaped suction plate (421), with multiple sets of the E-shaped suction plates (421) disposed under the base plate (402), the multiple sets of the E-shaped suction plates (421) being evenly distributed, and the gap between adjacent E-shaped suction plates (421) being movably inserted into the silicon wafer; a contact outer plate (422), the contact outer plate (422) being disposed on one side of the E-shaped suction plate (421); and sealing holes (4221), multiple sets of the sealing holes (4221) being opened in the contact outer plate (4221). On the outer plate (422); interlocking strip (4222), multiple sets of the interlocking strip (4222) are fixedly connected to the contact outer plate (422); liquid outlet micropore (4223), multiple sets of liquid outlet micropore (4223) are opened on the interlocking strip (4222); outward expansion end (423), three sets of outward expansion end (423) are provided on the E-shaped suction plate (421); inner cavity (424), the inner cavity (424) is opened inside the E-shaped suction plate (421).

6. A half-wafer intercalation device according to claim 5, characterized in that, The multiple sets of E-shaped suction plates (421) and the contact outer plate (422) are all made of polyvinyl chloride. The contact outer plate (422) is provided with a hydrophilic coating, which is cured on the surface of the contact outer plate (422) by ultraviolet light.

7. A half-wafer insertion device according to claim 5, characterized in that, The adsorption assembly (42) further includes: an inner movable plate (425), which is movably connected to the E-shaped suction plate (421); a fitting seat (4251), multiple sets of fitting seats (4251) are fixedly connected to the inner movable plate (425), and the height of the multiple sets of fitting seats (4251) is consistent with the fitting strip (4222); an air guide pipe (4252), two sets of air guide pipes (4252) are provided on the inner movable plate (425); and a flow guide valve (4253), multiple sets of flow guide valves (4253) are provided on the inner movable plate. On (425), the center height of multiple sets of the flow guide valves (4253) is consistent with the sealing hole (4221); the vent hood (4254), multiple sets of the vent hood (4254) are installed on the contact outer plate (422), and the multiple sets of the vent hood (4254) are sealed and inserted into the multiple sets of the sealing hole (4221); the inner plate block (4255) is movably connected to one side of the vent hood (4254); the vent microhole (4256), multiple sets of the vent microhole (4256) are opened on the vent hood (4254).

8. A half-wafer intercalation device according to claim 7, characterized in that, The suction plate driving assembly (43) includes: an outer cover (431), two sets of the outer covers (431) being fixedly connected to the bottom ends of both sides of the E-shaped suction plate (421); inner plate guide blocks (432), two sets of the inner plate guide blocks (432) being fixedly connected to the bottom ends of both sides of the inner movable plate (425), and the two sets of the inner plate guide blocks (432) being movably connected to the two sets of the outer covers (431); and an extension block (4321). The inner plate guide block (432) is provided on the inner plate guide block (432); the nut (4322) is installed on the extension block (4321); the cover plate (433) is provided on one side of the outer cover (431); the sealing ring (4331) is provided on the cover plate (433); the slide rail (4332) is provided outside the sealing ring (4331). Side; Spring (4333), the spring (4333) is disposed inside the slide rail (4332); Sealing plate (4334), the sealing plate (4334) is movably connected to the sealing ring (4331); Slider (4335), multiple sets of sliders (4335) are disposed outside the sealing plate (4334); Air inlet pipe (434), the air inlet pipe (434) is connected through to the bottom end of one side of the outer cover (431); An air outlet pipe (435) is connected to the top of the other side of the outer cover (431); an injection pipe (436) is connected to the bottom of the other side of the outer cover (431); a sealing seat (437) is provided in the pipe through groove of the outer cover (431); and two sets of lead screws (438) are provided on both sides of the E-shaped suction plate (421).

9. A half-wafer intercalation device according to claim 5, characterized in that, The anti-slip component (44) includes: an expansion seat (441) fitted onto the expansion end (423); an elastic membrane (442) disposed within the expansion seat (441); a photoelectric sensor (443) disposed on the expansion seat (441); a one-way tube (444) with two sets of one-way tubes (444) connected through the expansion seat (441); a piston strip (445) movably connected within the expansion seat (441); an electric telescopic rod (446) installed within the expansion seat (441); and a telescopic rod head (447) located at the top of the output end of the electric telescopic rod (446).

10. The wafer insertion process of a half-wafer wafer insertion device according to claim 1, wherein the wafer insertion device is the half-wafer wafer insertion device according to claim 1, characterized in that, Includes the following steps: Step 1: Loading process, the silicon wafers are loaded to the designated position through the insertion line (1) and the wafer picking mechanism (2); Step 2: Wafer separation process. The robotic arm (203) and the wafer insertion actuator (3) drive the washing and suction integrated mechanism (4) to simultaneously insert into the two sets of silicon wafers, and the liquid return assembly (41) is used to collect and recover the cleaning liquid during the cleaning process. Step 3: Rinsing process, the silicon wafer is rinsed by inputting the bottom cylinder (401); Step 4: Wafer insertion process. The silicon wafer is adsorbed and fixed by the surface tension of the water film formed by the contact outer plate (422) after rinsing and the deionized water on the surface of the silicon wafer, and the silicon wafer assembly is transported and inserted. Step 5: Anti-slip process, the adsorption component (42) adaptively repairs the lost water film; and the anti-slip component (44) triggers the elastic membrane (442) to retract and generate negative pressure to further adsorb and fix the silicon wafer when receiving light signals; Step 6: Unloading process, the silicon wafer is dried and separated by the suction plate drive assembly (43) and the air outlet hood (4254) inside the adsorption assembly (42).

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