LED lamp bead packaging device and method

Abstract

The invention discloses an LED lamp bead packaging device and method, and relates to the technical field of LED lamp bead packaging, the LED lamp bead packaging device comprises a defoaming assembly, the defoaming assembly comprises a negative pressure barrel, a side tooth gear is rotatably mounted at the bottom of the negative pressure barrel, an impeller disc is rotatably mounted in the negative pressure barrel, and an exhaust pipe is fixedly mounted on the impeller disc; and a shielding ventilation cap is fixedly mounted at the top of the exhaust pipe. According to the invention, the small steam pocket in the packaging adhesive can be separated from the packaging adhesive, so that the lighting effect of the packaged LED lamp bead is improved; the LED lamp bead support can move in the packaging process, so that the packaging process can be completed without stopping the LED lamp bead support in the packaging process, and the LED lamp bead packaging efficiency is improved; and the packaging glue buffer storage box is arranged, so that continuous bubble-free packaging glue supply in the packaging process of the LED lamp beads can be ensured.

Description

Technical Field

[0001] This invention relates to the field of LED chip packaging technology, specifically to an LED chip packaging device and method. Background Technology

[0002] The LED packaging process requires two parts: a mounting bracket and the LED chip. The chip is fixed into the LED mounting bracket, positive and negative electrodes are soldered on, and then it is encapsulated in one step with encapsulating adhesive. The LED mounting bracket is generally made of copper (but iron, aluminum, and ceramic are also used), because copper has excellent conductivity. It contains leads to connect to the electrodes inside the LED chip. After the LED chip is encapsulated, it can be removed from the bracket. The copper leads at both ends of the chip become the positive and negative electrodes, used for soldering to LED lamps or other finished LED products. Therefore, in the LED packaging process, to ensure the purity of the light source, it is necessary to ensure that there are no air bubbles in the encapsulating adhesive.

[0003] To address this, existing technology, specifically invention patent CN116564857A, utilizes an LED chip packaging structure. This solution involves injecting encapsulating adhesive through an inlet hole. Once the channel is filled with adhesive, it overflows from the outlet hole, ensuring uniform adhesive filling of the channel and resolving the issue of air bubbles during encapsulation affecting product packaging quality. However, its packaging efficiency is low, making it unsuitable for high-speed production lines. Summary of the Invention

[0004] To overcome the shortcomings of the prior art, the present invention provides the following technical solution: an LED bead packaging device, comprising a debubbling assembly, the debubbling assembly including a negative pressure tank, a side gear rotatably mounted at the bottom of the negative pressure tank, a pulsator rotatably mounted inside the negative pressure tank, an exhaust pipe fixedly mounted on the pulsator, a vent cap fixedly mounted at the top of the exhaust pipe, at least thirty-two glue discharge ports opened on the bottom surface of the negative pressure tank, a sealing valve sliding groove provided on the negative pressure tank, a sealing valve plate slidably mounted in the sealing valve sliding groove, at least three communicating constant pressure sliding grooves provided on the negative pressure tank, and an iron ring slidably mounted on the outer surface of the negative pressure tank, the iron ring and the sealing valve plate being fixedly engaged through the communicating constant pressure sliding grooves; further comprising a dispensing part, the dispensing part including a transmission The system comprises a conveyor belt assembly bracket, an encapsulating adhesive buffer storage box, and a permanent magnet support frame. The conveyor belt assembly bracket is rotatably mounted on the conveyor belt assembly bracket for conveying LED bead brackets. The permanent magnet support frame is fixedly mounted with an adhesive injection box bracket. Two symmetrically arranged circulating pulleys, rotatably engaging with the adhesive injection box bracket, are mounted on the adhesive injection box bracket. A circulating belt is fitted onto the surface of each of the two circulating pulleys. An adhesive injection box is movably mounted between the two circulating belts via a rotating pin. The adhesive injection box and the encapsulating adhesive buffer storage box are connected via an adhesive injection tube. A piston sealing plate is provided on the inner wall of the encapsulating adhesive buffer storage box. At least one row of adhesive injection needles is provided at the bottom of the adhesive injection box for injecting encapsulating adhesive into the LED bead brackets. A permanent magnet is fixedly mounted on the permanent magnet support frame, magnetically engaging with the bottom of the adhesive injection box.

[0005] Preferably, the exhaust pipe is fixedly connected to the side gear, and a stirring rod is fixedly installed on the outer surface of the exhaust pipe.

[0006] Preferably, an electromagnet ring is provided above the iron ring and is fixedly connected to the negative pressure tank. The electromagnet ring and the iron ring are magnetically attracted to each other. A drainage chamber is fixedly installed on the outside of the discharge port of the negative pressure tank. A sealing cover is provided on the top of the negative pressure tank. A sealing strip is provided between the sealing cover and the contact surface of the negative pressure tank. A pressure relief valve is provided on the sealing cover.

[0007] Preferably, at least three sliding rods are fixedly installed between the drainage and discharging chamber and the electromagnet ring. Each sliding rod is surrounded by a spring, and the two ends of the spring are fixedly connected to the electromagnet ring and the iron ring or the sealing valve plate, respectively. The iron ring or the sealing valve plate slides in cooperation with the spring.

[0008] Preferably, the degassing assembly further includes a vacuum pump and a degassing motor for driving the vacuum pump. A linkage gear that drives the side gear is fixedly installed on the output shaft of the degassing motor. The vacuum pump and the bottom end of the exhaust pipe are rotatably sealed together through a sealed rotary joint.

[0009] Preferably, the interior of the encapsulating adhesive buffer storage box is connected to the interior of the dispensing and draining chamber, a conveyor belt assembly drive motor for driving the conveyor belt assembly is fixedly installed on the conveyor belt assembly bracket, and a gear pump for pumping encapsulating adhesive from the encapsulating adhesive buffer storage box into the dispensing pipe is provided at the connection position between the dispensing pipe and the encapsulating adhesive buffer storage box.

[0010] Preferably, the bottom of the glue injection box is provided with an iron block that magnetically engages with the permanent magnet, and a drive shaft is rotatably mounted on the glue injection box bracket. The two ends of the drive shaft are connected to two circulating pulleys via two third drive belts. A first gearbox for driving the circulating pulleys to rotate is fixedly mounted on one side of the glue injection box bracket. The input end of the first gearbox is connected to one of the pulleys of the conveyor belt assembly via a first drive belt.

[0011] Preferably, a toothed gear is fixedly installed at the input end of the first gearbox, and a second gearbox is fixedly installed on the permanent magnet support frame via a second gearbox bracket. A passive injection gear that meshes with the toothed gear is fixedly installed at the input end of the second gearbox, and the output end of the second gearbox is connected to the input shaft of the gear pump via a second transmission belt.

[0012] An LED chip packaging method includes the following steps: S1. Pour the sealing adhesive into the negative pressure tank and put the sealing cover on the negative pressure tank; S2. Adjust the pressure inside the negative pressure tank to a vacuum negative pressure state by starting the degassing motor; S3. Allow the air bubbles in the encapsulating adhesive to separate from the encapsulating adhesive under the action of pressure difference; S4. Discharge the degassed encapsulant from the negative pressure tank into the encapsulant buffer storage box; S5. The encapsulating adhesive is injected into the LED bead bracket in an orderly manner through the dispensing section.

[0013] Compared with the prior art, the present invention has the following advantages: (1) The present invention can separate the small air bubbles in the encapsulating glue from the encapsulating glue, so as to improve the lighting effect of the LED beads after encapsulation; (2) The present invention can allow the LED bead support to move during the encapsulation process, so that the LED bead support does not need to stop during the encapsulation process to complete the encapsulation process, thereby improving the efficiency of LED bead encapsulation; (3) The encapsulating glue buffer storage box set in the present invention can ensure a continuous supply of bubble-free encapsulating glue during the LED bead encapsulation process. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0015] Figure 2 For the present invention Figure 1Schematic diagram of the structure at point A in the middle.

[0016] Figure 3 This is a schematic diagram of the structure at the first transmission belt of the present invention.

[0017] Figure 4 For the present invention Figure 3 Schematic diagram of the structure at point B.

[0018] Figure 5 For the present invention Figure 4 Schematic diagram of the structure at point C.

[0019] Figure 6 This is a schematic diagram of the bottom structure of the negative pressure tank of the present invention.

[0020] Figure 7 This is a schematic diagram of the internal structure of the negative pressure tank of the present invention.

[0021] Figure 8 For the present invention Figure 7 Schematic diagram of the structure at point D.

[0022] Figure 9 This is a schematic diagram of the structure of the sealing rotary joint of the present invention.

[0023] Figure 10 This is a schematic diagram of the structure of the sealing valve plate of the present invention.

[0024] Figure 11 For the present invention Figure 10 Schematic diagram of the structure at point E in the middle.

[0025] Figure 12 This is a schematic diagram of the glue discharge port structure of the present invention.

[0026] In the diagram: 101-Conveyor belt assembly bracket; 102-Conveyor belt assembly drive motor; 103-Conveyor belt assembly; 104-First transmission belt; 105-Encapsulating glue buffer storage box; 106-Injection tube; 107-Second transmission belt; 108-Injection box; 109-Injection box bracket; 110-Circulating belt; 111-Circulating pulley; 112-Third transmission belt; 113-Permanent magnet support frame; 114-Permanent magnet; 115-Injection needle; 116-First gearbox; 117-Gear with missing tooth; 118-Passive injection gear; 119-Second gearbox; 120-Second gearbox bracket; 121-Gear pump; 122-Rotating pin; 123-Drive shaft; 201-Negative pressure tank; 2011-Connecting constant pressure chute; 2012-Sealing valve sliding groove; 2013-Discharge port; 202-Side gear; 203-Vacuum pump; 204-Linkage gear; 205-Degassing motor; 206-Exhaust pipe; 207-Shielding vent cap; 208-Stirring rod; 209-Impeller disc; 210-Sealing rotary joint; 211-Drainage and discharge chamber; 212-Sealing cover plate; 213-Sealing valve plate; 214-Iron ring; 215-Electromagnetic ring; 216-Sliding rod; 217-Spring. Implementation

[0027] The following is in conjunction with the appendix Figures 1-12 As shown, the technical solution of the present invention will be further illustrated through specific embodiments.

[0028] This invention provides an LED lamp bead packaging device. The debubbling assembly includes a negative pressure tank 201. A side gear 202 is rotatably mounted on the bottom of the negative pressure tank 201. A pulsator 209 is rotatably mounted inside the negative pressure tank 201. An exhaust pipe 206 is fixedly mounted on the pulsator 209. A vent cap 207 is fixedly mounted on the top of the exhaust pipe 206. At least thirty-two glue discharge ports 2013 are opened on the bottom surface of the negative pressure tank 201. A sealing valve sliding groove 2012 is also provided on the negative pressure tank 201. A sealing valve plate 213 is slidably mounted in the sealing valve sliding groove 2012. At least three communicating constant pressure sliding grooves 2011 are also provided on the negative pressure tank 201. An iron ring 214 is slidably mounted on the outer surface of the negative pressure tank 201. The iron ring 214 and the sealing valve plate 213 are fixedly engaged through the communicating constant pressure sliding grooves 2011. The exhaust pipe 206 is fixedly connected to the side gear 202, and a stirring rod 208 is fixedly installed on the outer surface of the exhaust pipe 206. An electromagnet ring 215 is fixedly connected to the negative pressure tank 201 above the iron ring 214. The electromagnet ring 215 and the iron ring 214 are magnetically attracted to each other. A drainage chamber 211 is fixedly installed on the outside of the discharge port 2013 of the negative pressure tank 201. A sealing cover plate 212 is provided on the top of the negative pressure tank 201. A sealing strip is provided between the sealing cover plate 212 and the contact surface of the negative pressure tank 201, and a pressure relief valve is provided on the sealing cover plate 212. At least three sliding rods 216 are fixedly installed between the drainage and discharge chamber 211 and the electromagnet ring 215. Each sliding rod 216 is surrounded by a spring 217. The two ends of the spring 217 are fixedly connected to the electromagnet ring 215 and the iron ring 214 or the sealing valve plate 213, respectively. The iron ring 214 or the sealing valve plate 213 slides in cooperation with the spring 217.

[0029] The degassing assembly also includes a vacuum pump 203 and a degassing motor 205 for driving the vacuum pump 203. A linkage gear 204 that drives the side gear 202 is fixedly installed on the output shaft of the degassing motor 205. The vacuum pump 203 and the bottom end of the exhaust pipe 206 are rotatably sealed together through a sealing rotary joint 210.

[0030] The dispensing section includes a conveyor belt assembly bracket 101, an encapsulant buffer storage box 105, and a permanent magnet support frame 113. A conveyor belt assembly 103 is rotatably mounted on the conveyor belt assembly bracket 101 for conveying LED bead brackets. A dispensing box bracket 109 is fixedly mounted on the permanent magnet support frame 113. Two symmetrically arranged circulating pulleys 111, which rotatably engage with the dispensing box bracket 109, are mounted on the dispensing box bracket 109. A circulating belt 110 is fitted onto the surface of each of the two circulating pulleys 111. A dispensing box 108 is movably mounted between the circulating belts 110 via a rotating pin 122. The dispensing box 108 is connected to the encapsulating glue buffer storage box 105 via a dispensing tube 106. A piston sealing plate is provided on the inner wall of the encapsulating glue buffer storage box 105. At least one row of dispensing needles 115 is provided at the bottom of the dispensing box 108 for injecting encapsulating glue into the LED lamp bead bracket. A permanent magnet 114 is fixedly mounted on the permanent magnet support frame 113, which magnetically engages with the bottom of the dispensing box 108. The interior of the encapsulating glue buffer storage box 105 is connected to the interior of the drainage and discharging chamber 211. A conveyor belt assembly drive motor 102 for driving the conveyor belt assembly 103 is fixedly mounted on the conveyor belt assembly bracket 101. A gear pump 121 is provided at the connection position between the dispensing tube 106 and the encapsulating glue buffer storage box 105 for pumping encapsulating glue from the encapsulating glue buffer storage box 105 into the dispensing tube 106. The bottom of the glue injection box 108 is provided with an iron block that magnetically engages with the permanent magnet 114. A drive shaft 123 is rotatably mounted on the glue injection box bracket 109. The two ends of the drive shaft 123 are connected to two circulating pulleys 111 via two third drive belts 112. A first gearbox 116 for driving the circulating pulleys 111 is fixedly mounted on one side of the glue injection box bracket 109. The input end of the first gearbox 116 is connected to one of the pulleys of the conveyor belt assembly 103 via a first drive belt 104. A toothed gear 117 is also fixedly mounted on the input end of the first gearbox 116. A second gearbox 119 is fixedly mounted on the permanent magnet support frame 113 via a second gearbox bracket 120. A passive glue injection gear 118 that meshes with the toothed gear 117 is fixedly mounted on the input end of the second gearbox 119. The output end of the second gearbox 119 is connected to the input shaft of the gear pump 121 via a second drive belt 107.

[0031] The working principle of the LED bead encapsulation device disclosed in this invention is as follows: Encapsulating adhesive is poured into a negative pressure tank 201, and then a sealing cover 212 is placed on the negative pressure tank 201. At this time, the degassing motor 205 is started. The output shaft of the degassing motor 205 drives the vacuum pump 203 (a gearbox is provided between the vacuum pump 203 and the degassing motor 205 to reduce the speed of the output shaft of the degassing motor 205). The vacuum pump 203, upon starting, draws air from the exhaust pipe 206 through the sealed rotary joint 210, and also draws air from inside the negative pressure tank 201 through the vent cap 207, thus reducing the internal pressure of the negative pressure tank 201 to a vacuum state. In this state, if there are air bubbles inside the encapsulating adhesive, the pressure inside the air bubbles is much greater than the vacuum negative pressure inside the negative pressure tank 201. Therefore, the air bubbles will move in the direction of lower pressure inside the encapsulating adhesive (that is, upward due to gravity), so that the pressure inside the air bubbles is released into the internal space of the negative pressure tank 201. The output shaft of the degassing motor 205 will also drive the side gear 202 to rotate through the linkage gear 204. The rotation of the side gear 202 will drive the exhaust pipe 206 to rotate. The rotation of the exhaust pipe 206 will drive the stirring rod 208 and the impeller 209 to rotate. The rotating stirring rod 208 will rotate the encapsulating adhesive at a low speed, so that the larger air bubbles inside are broken into smaller air bubbles. When the degassing process is complete, open the pressure relief valve on the sealing cover 212 and turn off the degassing motor 205. Remove the sealing cover 212 and then restart the degassing motor 205 at high speed. The output shaft of the degassing motor 205 will drive the side gear 202 to rotate through the linkage gear 204. The rotation of the side gear 202 will drive the impeller 209 to rotate through the exhaust pipe 206. The rotation of the impeller 209 will drive the bottom encapsulating adhesive to rotate rapidly. Due to the viscosity between fluids, the top encapsulating adhesive will also rotate (depending on the characteristics of different encapsulating adhesives, the stirring rod 208 can be removed to suppress the generation of air bubbles). At the same time, the electromagnet ring 215 is energized. The electromagnet ring 215 generates magnetic force to attract the iron ring 214 and compress the spring 217, while simultaneously... The moving iron ring 214 moves upward, which in turn moves the sealing valve plate 213. The movement of the sealing valve plate 213 opens the blocked discharge port 2013. At this time, the encapsulating adhesive inside the negative pressure tank 201 enters the drainage discharge chamber 211 through the discharge port 2013, and then enters the encapsulating adhesive buffer storage box 105. Since the encapsulating adhesive buffer storage box 105 is equipped with a piston sealing plate, the encapsulating adhesive will slide upward along the inner wall of the encapsulating adhesive buffer storage box 105 against the piston sealing plate until most of the encapsulating adhesive inside the negative pressure tank 201 is discharged into the drainage discharge chamber 211 (and then into the encapsulating adhesive buffer storage box 105. Some encapsulating adhesive needs to be left in the negative pressure tank 201, and the liquid level of the left encapsulating adhesive is higher than the height of the discharge port 2013).

[0032] The conveyor belt assembly drive motor 102 is started, and the LED lamp bead brackets are placed orderly and equidistantly on the conveyor belt assembly 103. The conveyor belt assembly drive motor 102 will drive the conveyor belt assembly 103 to rotate. The rotation of the conveyor belt assembly 103 will cause the LED lamp bead brackets to move horizontally. The rotation of the conveyor belt assembly 103 will drive the input shaft of the first gearbox 116 to rotate through the first transmission belt 104. The output shaft of the first gearbox 116 will drive the circulating pulley 111 to rotate. The rotation of the circulating pulley 111 will drive the circulating belt 110 to rotate. The rotation of the circulating belt 110 will drive the glue injection box 108 to rotate through the rotating pin 122. Due to the attraction of the bottom permanent magnet 114, the glue injection needle tube 115 on the glue injection box 108 will always rotate downward (divided into horizontal movement and vertical movement, so that it forms a cycle). While the circulating pulley 111 is rotating, it will also drive the circulating pulley 111 on the other side to rotate through the transmission shaft 123 and the two third transmission belts 112. The rotation of the input shaft of the first gearbox 116 also drives the toothed gear 117 to rotate. The rotation of the toothed gear 117 intermittently drives the passive glue-injecting gear 118 to rotate. The rotation of the passive glue-injecting gear 118 drives the input shaft of the second gearbox 119 to rotate. The output shaft of the second gearbox 119 drives the gear pump 121 through the second transmission belt 107. The gear pump 121 discharges the encapsulating glue in the encapsulating glue buffer storage box 105 into the glue-injecting box 108 through the glue-injecting tube 106. Therefore, every time the LED lamp bead bracket moves a certain distance (the rotation of the conveyor belt assembly 103), the conveyor belt assembly 103 drives the toothed gear 117 to rotate through the first transmission belt 104. Through the intermittent transmission between the toothed gear 117 and the passive glue-injecting gear 118, the gear pump 121 is intermittently driven, thereby intermittently discharging the encapsulating glue from the encapsulating glue buffer storage box 105 into the glue-injecting box 108, and then intermittently... The encapsulating glue is injected into the LED bead holder through the dispensing needle 115. (Because the LED bead holder moves with the conveyor belt assembly 103, the encapsulating glue needs to be injected into the LED bead holder intermittently. When the dispensing needle 115 is not injecting encapsulating glue, it is moving towards the next row of LED beads in the LED bead holder. Therefore, the direction of movement of the dispensing needle 115 during the dispensing process is the same as the direction of movement of the LED bead holder. The accuracy of dispensing can be improved by setting a horizontal moving section at the bottom of the circulating belt 110, that is, the circulating belt 110 needs to be connected to four circulating pulleys 111.) Depending on the size of the LED beads, the distance between two adjacent rows of LED beads on the LED bead holder is different. When the diameter of the LED beads is small, multiple rows of dispensing needles 115 can be set so that the distance between two adjacent rows of dispensing needles 115 is the same as the distance between the LED beads.

Claims

1. An LED chip packaging device, characterized in that: The device includes a degassing assembly, which includes a negative pressure tank (201). A side gear (202) is rotatably mounted on the bottom of the negative pressure tank (201). A pulsator (209) is rotatably mounted inside the negative pressure tank (201). An exhaust pipe (206) is fixedly mounted on the pulsator (209). A vent cap (207) is fixedly mounted on the top of the exhaust pipe (206). At least thirty-two glue discharge ports (2013) are provided on the bottom surface of the negative pressure tank (201). The negative pressure tank (201) is also provided with a sealing valve sliding groove (2012), and a sealing valve plate (213) is slidably installed in the sealing valve sliding groove (2012). The negative pressure tank (201) is also provided with at least three communicating constant pressure sliding grooves (2011), and an iron ring (214) is slidably installed on the outer surface of the negative pressure tank (201). The iron ring (214) and the sealing valve plate (213) are fixedly engaged through the communicating constant pressure sliding grooves (2011). It also includes a dispensing section, which includes a conveyor belt assembly bracket (101), an encapsulant buffer storage box (105), and a permanent magnet support frame (113). The conveyor belt assembly (103) is rotatably mounted on the conveyor belt assembly bracket (101) for conveying LED lamp bead brackets. The permanent magnet support frame (113) is fixedly mounted with a glue injection box bracket (109). Two circulating pulleys (111) are symmetrically arranged on the glue injection box bracket (109) and rotate with the glue injection box bracket (109). The surfaces of the two circulating pulleys (111) are fitted with circulating belts (110). A glue injection box (108) is movably installed between the two circulation belts (110) via a rotating pin (122). The glue injection box (108) is connected to the encapsulating glue buffer storage box (105) via a glue injection tube (106). A piston sealing plate is provided on the inner wall of the encapsulating glue buffer storage box (105). At least one row of glue injection needle tubes (115) is provided at the bottom of the glue injection box (108) for injecting encapsulating glue into the LED lamp bead bracket. A permanent magnet (114) is fixedly installed on the permanent magnet support frame (113) and magnetically engages with the bottom of the glue injection box (108).

2. The LED bead packaging device according to claim 1, characterized in that: The exhaust pipe (206) is fixedly connected to the side gear (202), and a stirring rod (208) is fixedly installed on the outer surface of the exhaust pipe (206).

3. The LED bead packaging device according to claim 2, characterized in that: An electromagnet ring (215) is fixedly connected to the negative pressure tank (201) above the iron ring (214). The electromagnet ring (215) and the iron ring (214) are magnetically attracted to each other. A drainage chamber (211) is fixedly installed on the outside of the discharge port (2013) of the negative pressure tank (201). A sealing cover plate (212) is provided on the top of the negative pressure tank (201). A sealing strip is provided between the sealing cover plate (212) and the contact surface of the negative pressure tank (201). A pressure relief valve is provided on the sealing cover plate (212).

4. The LED bead packaging device according to claim 3, characterized in that: At least three sliding rods (216) are fixedly installed between the drainage and discharge chamber (211) and the electromagnet ring (215). Each sliding rod (216) is surrounded by a spring (217). The two ends of the spring (217) are fixedly connected to the electromagnet ring (215) and the iron ring (214) or the sealing valve plate (213), respectively. The iron ring (214) or the sealing valve plate (213) slides in cooperation with the spring (217).

5. The LED bead packaging device according to claim 4, characterized in that: The degassing assembly also includes a vacuum pump (203) and a degassing motor (205) for driving the vacuum pump (203). A linkage gear (204) that drives the side gear (202) is fixedly installed on the output shaft of the degassing motor (205). The vacuum pump (203) and the bottom end of the exhaust pipe (206) are rotatably sealed together through a sealing rotary joint (210).

6. The LED bead packaging device according to claim 5, characterized in that: The interior of the encapsulant buffer storage box (105) is connected to the interior of the drainage and discharging chamber (211). A conveyor belt assembly drive motor (102) for driving the conveyor belt assembly (103) is fixedly installed on the conveyor belt assembly bracket (101). A gear pump (121) for pumping encapsulant from the encapsulant buffer storage box (105) into the encapsulant injection tube (106) is provided at the connection position between the injection tube (106) and the encapsulant buffer storage box (105).

7. The LED bead packaging device according to claim 6, characterized in that: The bottom of the glue injection box (108) is provided with an iron block that magnetically engages with the permanent magnet (114). A drive shaft (123) is rotatably mounted on the glue injection box bracket (109). The two ends of the drive shaft (123) are connected to two circulating pulleys (111) via two third drive belts (112). A first gearbox (116) for driving the circulating pulleys (111) to rotate is fixedly mounted on one side of the glue injection box bracket (109). The input end of the first gearbox (116) is connected to one of the pulleys of the conveyor belt assembly (103) via a first drive belt (104).

8. The LED bead packaging device according to claim 7, characterized in that: The input end of the first gearbox (116) is also fixedly mounted with a toothed gear (117). The permanent magnet support frame (113) is fixedly mounted with a second gearbox (119) via a second gearbox bracket (120). The input end of the second gearbox (119) is fixedly mounted with a passive glue-injected gear (118) that meshes with the toothed gear (117). The output end of the second gearbox (119) is connected to the input shaft of the gear pump (121) via a second transmission belt (107).

9. A packaging method using the LED lamp bead packaging device according to claim 8, characterized in that, Includes the following steps: S1. Pour the sealing adhesive into the negative pressure tank (201) and put the sealing cover (212) on the negative pressure tank (201); S2. Adjust the pressure inside the negative pressure tank (201) to a vacuum negative pressure state by starting the degassing motor (205); S3. Allow the air bubbles in the encapsulating adhesive to separate from the encapsulating adhesive under the action of pressure difference; S4. Discharge the degassed encapsulant from the negative pressure tank (201) into the encapsulant buffer storage box (105); S5. The encapsulating adhesive is injected into the LED bead bracket in an orderly manner through the dispensing section.

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