Micro-channel and metal filling template

Abstract

The invention provides a micro-channel and a metal filling template, the micro-channel comprises a diversion trench and a liquid gold pool, the diversion trench is communicated with the liquid gold pool; the liquid gold pool corresponds to a plurality of containing structures used for being filled with metal on the adapter plate. And the liquid gold pool is communicated with the outside through the flow guide groove. The matching adapter plate comprises a micro-channel and a substrate, a dielectric layer is arranged on the substrate, and the micro-channel is arranged on the dielectric layer. According to the micro-channel and the metal filling template provided by the embodiment of the invention, the preparation cost of the adapter plate is reduced.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically to a microchannel and a metal-filled template. Background Technology

[0002] Quantum computing has received widespread attention due to its potential computing power advantage, among which superconducting quantum computing shows great application potential due to its compatibility with semiconductor processes.

[0003] Further scaling up of superconducting quantum computing currently requires advanced packaging technologies to achieve vertical stacking of multi-layer chips. Vertical stacking of superconducting quantum chips involves two key interconnect technologies: superconducting flip-chip bonding and superconducting interposer technology. For superconducting interposer technology, current research mainly focuses on hollow or copper-filled through-silicon via (TSV) structures, with only the sidewalls covered by continuous superconducting material. Therefore, as a core element in constructing three-dimensional integrated architectures, superconducting interposers still lack effective processes for full superconducting material filling, and related technologies for superconducting filling of interposers urgently need development. Summary of the Invention

[0004] To address the problems in the prior art, embodiments of the present invention provide a microchannel and a metal-filled template, which can at least partially solve the problems existing in the prior art.

[0005] In a first aspect, the present invention proposes a microchannel, comprising a flow guide channel and a liquid gold pool, wherein: The flow channel is connected to the liquid gold pool; the liquid gold pool corresponds to multiple receiving structures on the adapter plate for filling metal; the flow channel connects the liquid gold pool to the outside.

[0006] Furthermore, there are multiple flow channels.

[0007] Furthermore, the plurality of guide channels are arranged in a rotating array about the center of the liquid gold pool.

[0008] Furthermore, the shape of the guide channel is a straight line or a curve.

[0009] Furthermore, the curve consists of at least one smooth curve segment.

[0010] Furthermore, the liquid gold pool is polygonal, circular, or elliptical.

[0011] Secondly, the present invention proposes a metal-filled template, comprising microchannels and a substrate as described in any of the above embodiments, wherein a dielectric layer is disposed on the substrate and the microchannels are disposed on the dielectric layer.

[0012] Furthermore, the microchannels are multiple.

[0013] Furthermore, multiple microchannel arrays are arranged.

[0014] Furthermore, there are various types of microchannels.

[0015] Furthermore, each type of microchannel array is arranged.

[0016] Furthermore, the metal filling template provided in this embodiment of the invention also includes a fully interconnected channel, which is disposed on the medium layer. The guide groove of each microchannel is connected to the fully interconnected channel, and the fully interconnected channel is used to connect the microchannel with the outside.

[0017] The microchannel and metal-filled template provided in this embodiment of the invention include a flow guide groove and a liquid gold pool, wherein the flow guide groove is connected to the liquid gold pool; the liquid gold pool corresponds to multiple receiving structures on the adapter plate for filling metal; the flow guide groove connects the liquid gold pool to the outside, and can be used for the preparation of the adapter plate, thereby reducing the preparation cost of the adapter plate. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings: Figure 1 This is a schematic diagram of the microchannel structure provided in the first embodiment of the present invention.

[0019] Figure 2 This is a schematic diagram showing the correspondence between the liquid gold pool and the containment structure provided in the second embodiment of the present invention.

[0020] Figure 3 This is a schematic diagram of the microchannel structure provided in the third embodiment of the present invention.

[0021] Figure 4 This is a schematic diagram of the microchannel structure provided in the fourth embodiment of the present invention.

[0022] Figure 5 This is a schematic diagram of the microchannel structure provided in the fifth embodiment of the present invention.

[0023] Figure 6 This is a schematic diagram of the microchannel structure provided in the sixth embodiment of the present invention.

[0024] Figure 7A This is a top view of the metal filling template provided in the seventh embodiment of the present invention.

[0025] Figure 7BThis is a cross-sectional structural diagram of the metal filling template provided in the seventh embodiment of the present invention.

[0026] Figure 8A This is a top view of the metal filling template provided in the eighth embodiment of the present invention.

[0027] Figure 8B This is a cross-sectional structural diagram of the metal filling template provided in the eighth embodiment of the present invention.

[0028] Figure 9 This is a top view of the metal filling template provided in the ninth embodiment of the present invention. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. Here, the illustrative embodiments and their descriptions are used to explain the present invention, but are not intended to limit the present invention. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be arbitrarily combined with each other. The acquisition, storage, use, and processing of data in the technical solutions of this application all comply with relevant laws and regulations. The user information in the embodiments of this application is obtained through legal and compliant means, and the acquisition, storage, use, and processing of user information have been agreed upon by the customer.

[0030] To facilitate understanding of the technical solution provided in this application, the relevant content of the technical solution in this application will be explained below.

[0031] The main technologies for the transition plate for superconducting quantum devices include the following two technical routes: (1) Through-Silicon Via (TSV) with superconducting material on the sidewall: After deep silicon etching, superconducting materials such as TiN, Ti, Ta, and TaN are deposited on the sidewall of the TSV using technologies such as atomic layer deposition (ALD) and physical vapor deposition (PVD) to achieve superconducting interconnection between the top and bottom surfaces within the layer; however, the main limitation of this method is that the hollow TSV transition plate cannot meet the requirements of the machine for vacuuming without the addition of an auxiliary layer, which increases the complexity of the process; in addition, a large number of chemical reagents and contaminants will remain in the TSV hole or on the sidewall of the hole, affecting the physical properties of the superconducting material layer on the sidewall; and some organic substances may cause gas release or denaturation problems in the ultra-low temperature test, affecting the stability of the TSV transition plate test environment. (2) Fully filled TSV with superconducting material covering the sidewalls and copper plating inside the holes: The superconducting material on the sidewalls can form a parallel path with the internal copper plating. Electroplated copper TSV, through glass via (TGV) and other technologies are mature processes in the semiconductor industry. However, in the high-frequency measurement and control process of TSV adapters, the electromagnetic field distribution in non-superconducting copper may still cause the risk of Joule heating, which in turn affects the accuracy of temperature control and the stability of the superconducting state.

[0032] Therefore, this application proposes that a metal-filling template be used in the fabrication process of the adapter plate, where superconducting metal is filled using a pressure difference method. This template can be obtained by growing a dielectric layer on a substrate and then fabricating microchannels on the dielectric layer. Superconducting metal can be filled into the microchannels. After melting in a vacuum environment, the filled superconducting metal can be filled into the blind holes of the components used to fabricate the adapter plate under negative pressure, thus realizing the fabrication of the superconducting structure in the adapter plate. This template can be reused, thereby reducing the fabrication cost of the adapter plate.

[0033] Figure 1 This is a schematic diagram of the microchannel provided in the first embodiment of the present invention, as shown below. Figure 1 As shown, the microchannel provided in this embodiment of the invention includes a flow guide 1 and a liquid gold pool 2, wherein: The flow channel 1 is connected to the liquid gold pool 2; the liquid gold pool 2 corresponds to multiple receiving structures on the adapter plate for filling metal; the flow channel 1 connects the liquid gold pool 2 to the outside.

[0034] Specifically, the microchannels provided in this embodiment of the invention can be fabricated on a substrate. The flow channel 1 is connected to the liquid gold pool 2, and the depth of the liquid gold pool 2 can be greater than the depth of the flow channel 1. The liquid gold pool 2 is used to fill metal, such as superconducting metal. The flow channel 1 connects the liquid gold pool 2 to the outside, so that negative pressure filling can be achieved by loading an inert gas into the external cavity when filling the containing structure with metal. The shape and size of the liquid gold pool 2 are set according to actual needs, and this embodiment of the invention does not limit them. The shape and size of the flow channel 1 are set according to actual needs, and this embodiment of the invention does not limit them. The containing structure includes, but is not limited to, blind holes, deep grooves, etc.

[0035] like Figure 2 As shown, the liquid gold pool 2 corresponds to multiple containment structures. Figure 2 Each circle in the diagram represents a containment structure.

[0036] For example, the liquid gold pool 2 can be shaped like a triangle, rectangle, or other polygons; it can also be shaped like a circle or an ellipse; or it can be shaped like a curve composed of various common functions or combinations thereof. The preferred shape of the liquid gold pool is a smooth curve, i.e., one with continuous first or higher-order derivatives within its domain, to minimize flow resistance.

[0037] The microchannel provided in this embodiment of the invention includes a flow guide groove and a liquid gold pool, wherein the flow guide groove is connected to the liquid gold pool; the liquid gold pool corresponds to multiple receiving structures on the adapter plate for filling metal; the flow guide groove connects the liquid gold pool to the outside, and can be used for the preparation of the adapter plate, thereby reducing the preparation cost of the adapter plate.

[0038] Based on the above embodiments, the corner of the guide channel 1 is further provided with a rounded transition structure to reduce the flow resistance of liquid metal in the guide channel 1.

[0039] Based on the above embodiments, there are multiple flow channels 1.

[0040] Specifically, the microchannel provided in this embodiment of the invention may include multiple guide channels 1, each guide channel 1 being connected to a liquid gold pool 2. The specific number of guide channels 1 is set according to actual needs, and this embodiment of the invention does not impose a limitation.

[0041] For example, such as Figure 3 As shown, the microchannel includes three guide channels 1, which are connected to the liquid gold pool 2.

[0042] For example, such as Figure 4 As shown, the microchannel includes two guide channels 1, which are respectively connected to the liquid gold pool 2.

[0043] Based on the above embodiments, further, a plurality of guide channels 1 are arranged in a rotating array about the center of the liquid gold pool 2.

[0044] Specifically, the microchannel provided in this embodiment of the invention may include multiple guide channels 1, which are arranged in a rotating array about the center of the liquid metal pool 2. When liquid metal is filled into the liquid metal pool 2 through the multiple guide channels 1, the rotating array arrangement of the multiple guide channels 1 can avoid the cancellation of kinetic energy and turbulence during the injection process of the liquid metal in the same straight line, which is beneficial for the kinetic energy of the liquid metal to be fully used for filling the liquid metal pool 2. In addition, it can also ensure the uniformity of the metal flow direction and path.

[0045] For example, such as Figure 5 As shown, the microchannel may include four guide channels 1, which are arranged in a rotating array about the center of the liquid gold pool 2, and are also rotationally symmetrical about the center of the liquid gold pool 2. The four inlets of the liquid gold pool 2 connected to the four guide channels are not collinear with any two inlets, i.e., they are staggered in the vertical or horizontal direction. This is to suppress the cancellation of kinetic energy and turbulence generated during the injection of high-speed liquid metal in the same straight line, thus ensuring that the kinetic energy of the liquid metal is fully utilized for filling the liquid gold pool 2.

[0046] For example, such as Figure 6 As shown, the microchannel may include four guide channels 1, which are arranged in a rotating array about the center of the liquid gold pool 2 and are also rotationally symmetrical about the center of the liquid gold pool 2. Figure 6 The four guide channels 1 shown are relative to Figure 5 The four guide channels 1 shown have longer flow channels.

[0047] Based on the above embodiments, the shape of the guide groove 1 is a straight line or a curve.

[0048] Based on the above embodiments, further, the curve is composed of at least one smooth curve segment, that is, the shape of the flow guide trough 1 is a curve, which is composed of one or more smooth curve segments. The shape of the flow guide trough 1 adopts a smooth curve to reduce the flow resistance of liquid metal at the corners.

[0049] Based on the above embodiments, the liquid gold pool 2 can be polygonal, circular, or elliptical. Among them, polygons include, but are not limited to, triangles, quadrilaterals, rectangles, squares, rhombuses, regular pentagons, etc.

[0050] Figure 7A This is a top view of the metal filling template provided in the seventh embodiment of the present invention. Figure 7B This is a cross-sectional structural diagram of the metal filling template provided in the seventh embodiment of the present invention. Figure 7B yes Figure 7A AA cross-section diagram, as shown Figure 7Aand Figure 7B As shown, the metal filling template provided in this embodiment of the invention includes the microchannel 701 and substrate 702 described in any of the above embodiments. A dielectric layer 703 is disposed on the substrate 702, and the microchannel 701 is disposed on the dielectric layer 703.

[0051] Specifically, a dielectric layer 703 can be grown on the substrate 702, and then microchannels 701 can be fabricated on the dielectric layer 703. The microchannels 701 include a flow channel 701-1 and a liquid gold pool 701-2, with the flow channel 701-1 serving as a channel connecting the liquid gold pool 701-2 to the outside. The dielectric layer 703 can be made of materials such as silicon dioxide or silicon nitride, selected according to actual needs; this embodiment of the invention does not limit its application. The substrate can be made of silicon wafers, glass wafers, molded wafers, etc., selected according to actual needs; this embodiment of the invention does not limit its application.

[0052] To fabricate a transition plate with a fully filled superconducting structure, superconducting metal is filled into the microchannels 701 of a metal-filled template. Components for fabricating the transition plate are prepared, each component having blind holes corresponding to the microchannels 701. Under vacuum conditions, based on the correspondence between the microchannels and blind holes, the metal-filled template and the components for fabricating the transition plate are bonded. The superconducting metal is melted, and negative pressure is used to fill the corresponding blind holes in the microchannels 701 with the superconducting metal. After filling the blind holes, the metal-filled template can be reused after appropriate cleaning, eliminating the need to fabricate a separate metal-filled template each time a transition plate is fabricated. This reduces the manufacturing cost and improves the production efficiency of the transition plate.

[0053] The metal-filled template provided in this embodiment of the invention includes microchannels and a substrate. A dielectric layer is disposed on the substrate, and the microchannels are disposed on the dielectric layer. Since the microchannels can be repeatedly filled with metal for the fabrication of the adapter plate, the fabrication cost of the adapter plate can be reduced and the production efficiency of the adapter plate can be improved.

[0054] Based on the above embodiments, there are multiple microchannels 701. The specific number of microchannels 701 is set according to actual needs, and is not limited in this embodiment of the invention.

[0055] For example, multiple identical or different microchannels 701 can be used to cover the entire surface of the template filled with metal and mating adapter plate. The specific structure of the microchannels 701 is set according to actual needs, and is not limited in this embodiment of the invention. The specific dimensions of the microchannels 701 are set according to actual needs, and are not limited in this embodiment of the invention.

[0056] For example, multiple microchannels 701 with the same structure can be used to cover the entire surface of the metal filling template. The specific structure of the microchannel 701 is set according to actual needs, and this embodiment of the invention does not limit it. For example, the liquid gold pool 701-2 of the microchannel 701 can be shaped as an equilateral triangle, a regular square, or a regular hexagon. The specific size of the microchannel 701 is set according to actual needs, and this embodiment of the invention does not limit it.

[0057] For example, multiple microchannels 701 with different structures can be used to cover the entire surface of the metal filling template. The specific structure of the microchannels 701 is set according to actual needs, and this embodiment of the invention does not limit it. For example, the shape of the liquid gold pool 701-2 of the microchannels 701 with different structures includes equilateral triangles and squares; the shape of the liquid gold pool 701-2 of the microchannels 701 with different structures includes equilateral triangles + regular hexagons; the shape of the liquid gold pool 701-2 of the microchannels 701 with different structures includes squares + regular octagons; the shape of the liquid gold pool 701-2 of the microchannels 701 with different structures includes regular pentagons + regular decagons, etc. The specific size of the microchannels 701 is set according to actual needs, and this embodiment of the invention does not limit it.

[0058] Based on the above embodiments, a further arrangement of multiple microchannels 701 is provided.

[0059] For example, such as Figure 8A and Figure 8B As shown, Figure 8B yes Figure 8A The cross-sectional schematic diagram of the middle section shows that the metal filling template provided in this embodiment of the invention includes multiple microchannels 701 arranged in an array. Each microchannel 701 can be connected to a fully interconnected channel 704, which is disposed on the dielectric layer 703 and is used to connect each microchannel 701 to the outside.

[0060] Based on the above embodiments, there are further various types of microchannels 701. Different types of microchannels 701 refer to different liquid gold pools 701-2 and / or flow guides 701-1 within the microchannel 701. The specific type of microchannel 701 is set according to actual needs, and this embodiment of the invention does not limit it.

[0061] For example, microchannels 701 of various structures can be used to cover the entire surface of the metal filler template. The specific type of microchannel 701 is set according to actual needs, and this embodiment of the invention does not limit it. The specific size of the microchannel 701 is set according to actual needs, and this embodiment of the invention does not limit it.

[0062] Based on the above embodiments, each microchannel array arrangement is further described.

[0063] For example, such as Figure 9 As shown, the metal filling template provided in this embodiment of the invention includes four types of microchannels 701, which are arranged in an array.

[0064] like Figure 8A and 8B As shown, based on the above embodiments, the metal filling template provided in this embodiment of the invention further includes a fully connected channel 704. The fully connected channel 704 is disposed on the medium layer 703. The guide groove 701-1 of each microchannel 701 is connected to the fully connected channel 704. The fully connected channel 704 is used to connect the microchannel 701 to the outside.

[0065] By setting up a fully connected channel 704, each microchannel 701 can share the fully connected channel 704 to connect with the outside, without the need for the flow guide groove 701-1 of each microchannel 701 to be connected to the outside separately, thus reducing the design complexity of the microchannel.

[0066] During the fabrication of the adapter plate, when filling multiple blind holes with superconducting metal, after the fully connected channel 704 is filled with inert gas (such as nitrogen), the inert gas enters the input port of the guide groove 701-1 of each microchannel 701 through the fully connected channel 704. Under the action of negative pressure, the inert gas compresses the liquid superconducting metal in the liquid gold pool 701-2 from the outside to the inside of the fully connected channel 704, generating forced flow. Since the blind hole corresponding to the liquid gold pool 701-2 is a vacuum environment, the liquid superconducting metal is flush with the height of the liquid gold pool 701-2, and the liquid superconducting metal is difficult to compress, all the liquid gold pools 701-2 distributed on the entire substrate 702 will synchronously inject superconducting metal into the corresponding blind hole, ensuring the consistency of superconducting metal injection on the entire substrate 702.

[0067] Based on the above embodiments, the substrate 702 is further adopted as a wafer-level substrate. In this application, wafer-level refers to, but is not limited to, circular wafers, square panels, etc.

[0068] Microchannels can be arranged as densely as possible on the entire wafer-level substrate, which helps to realize the fabrication of superconducting structures with high density of superconducting metal filling in the transition plate.

[0069] The process of preparing a transition plate based on pressure difference filling with superconducting metal is described below. In the preparation of the transition plate, the metal filling template provided in the embodiments of the present invention is required.

[0070] The method for preparing the adapter plate provided in this embodiment of the invention includes: A first component is obtained by filling a microchannel of a metal-filled template with a superconducting metal; wherein the metal-filled template is pre-obtained. Specifically, a superconducting metal is filled into the microchannels of a metal-filled template to form a first component. The metal-filled template is pre-obtained, and the specific shape and number of the microchannels within it are set according to actual needs; this embodiment of the invention does not impose any limitations. The superconducting metal can be indium or similar materials.

[0071] For example, superconducting metal can be filled into the flow channel by evaporation or electroplating, making the surface of the superconducting metal flush with the surface of the dielectric layer of the metal-filled template to ensure sufficient hermeticity and that enough superconducting metal can be used to fill the corresponding blind vias. It should be noted that if electroplating is used, necessary underlay materials, such as an adhesion layer and an electroplating seed layer, need to be deposited before filling the superconducting metal.

[0072] Because the superconducting metal in the microchannel and the dielectric layers on both sides of the microchannel are at the same height, a good sealing structure will be formed after the first and second components are bonded, maintaining the vacuum environment inside the blind hole.

[0073] A second component is fabricated based on a second substrate, the second component including blind vias; Specifically, blind vias are fabricated on the second substrate to obtain the second component. The positions of the blind vias correspond to the positions of the superconducting metal, facilitating subsequent filling of the corresponding blind vias by the superconducting metal. The second substrate can be a silicon wafer, glass wafer, molded wafer, etc., selected according to actual needs; this embodiment of the invention does not limit the choice. The number of blind vias is set according to actual needs; this embodiment of the invention does not limit the choice. The second component is used to fabricate the adapter plate.

[0074] The second substrate needs to be cleaned before use. If the second substrate is a silicon wafer, the silicon wafer surface can be cleaned using the standard RCA process. For silicon wafers, silicon blind vias can be fabricated, which will form TSVs after the adapter board is fabricated. If the second substrate is a glass wafer, the HF component in the RCA solution will corrode the glass, so the standard RCA process cannot be used for cleaning. Instead, suitable organic solvents and DI can be used for cleaning. For glass wafers, glass blind vias can be fabricated, which will form TGVs after the adapter board is fabricated. If the second substrate is a molded wafer, it can be cleaned using suitable organic solvents and DI. For molded wafers, molded blind vias can be fabricated, which will form through-molding vias (TMVs) after the adapter board is fabricated.

[0075] Based on the above embodiments, an adhesion layer is further deposited on the inner wall of the blind hole. The adhesion layer may be made of a superconducting metal such as Ti. The melting point of the adhesion layer material is higher than that of the superconducting metal used in the superconducting metal pillar.

[0076] An adhesion layer can be deposited on the insulating layer of the through-hole using a thin-film growth technique capable of filling deep-hole structures, thereby achieving good fixation between the superconducting metal and the hole structure. Atomic layer deposition, bias sputtering, chemical vapor deposition, and other processes can be used to deposit the adhesion layer. Further, based on the above embodiments, when the second substrate is a conductor or semiconductor material, a dielectric layer needs to be deposited inside the blind hole and on the second substrate as an insulating layer.

[0077] In a vacuum environment, based on the correspondence between the microchannels and the blind holes, the first component and the second component are bonded, and the superconducting metal is melted and the superconducting metal in the microchannels is filled with the corresponding blind holes by negative pressure to obtain the assembly. Specifically, the first component and the second component are bonded in a vacuum environment. During bonding, the microchannels and blind holes are aligned, allowing the superconducting metal in the microchannels to fill the corresponding blind holes after melting. After the first and second components are bonded, the superconducting metal is melted, and negative pressure is used to force the superconducting metal in the microchannels to fill the corresponding blind holes. After the superconducting metal cools, the assembly is obtained. The correspondence between the microchannels and the blind holes is predetermined.

[0078] During bonding, the first component and the second component can be heated and pressurized to facilitate bonding. It is understood that the heating temperature during bonding should be lower than the melting point of the superconducting metal to prevent the superconducting metal from melting during the bonding process.

[0079] The assembly is debonded to obtain a third component; wherein the third component includes blind holes filled with superconducting metal; Specifically, after obtaining the assembly, the superconducting metal has been filled, molded, and cooled. The assembly can then be debonded to separate the first and second components. The second component, filled with superconducting metal within the blind hole, constitutes the third component. The debonding can be performed using mechanical methods such as stretching or rotation, or chemical methods such as immersion in a specific chemical solvent, selected according to actual needs. This embodiment of the invention does not impose any limitations on the method.

[0080] The third component is thinned so that the blind hole becomes a through hole and exposes the superconducting metal, forming an adapter plate.

[0081] Specifically, the blind hole of the third component is thinned, the bottom of the blind hole is removed, and the blind hole becomes a through hole, exposing the superconducting metal. That is, the superconducting metal will be exposed at both ends of the through hole to form an adapter plate.

[0082] Specifically, if the second substrate is a silicon wafer, a TSV will be formed on the adapter board. If the second substrate is a glass wafer, a TGV will be formed on the adapter board. If the second substrate is a molded wafer, a TMV will be formed on the adapter board.

[0083] After thinning the third component, the adapter board can be processed using Chemical Mechanical Polishing (CMP) to obtain a smooth surface. After debonding the assembly, the debonded surface will have an undesirable geometry, and there is a risk of superconducting metal contamination on the dielectric layer in the non-blind via regions; therefore, CMP is necessary. After CMP, the original dielectric layer of the third component will be removed, so the dielectric layer needs to be deposited and patterned again to ensure the insulation of the planar wiring pattern and the second substrate.

[0084] The two surfaces of the exposed superconducting metal in the third component can be used to deposit wiring layers and pattern them for the fabrication of related electrical structures.

[0085] The method for preparing the adapter plate provided in this invention reduces the complexity of adapter plate preparation and improves the preparation efficiency. Furthermore, it avoids chemical reagent contamination of the through-holes, thus improving the stability of the adapter plate during testing.

[0086] Based on the above embodiments, further, while debonding the assembly to obtain the third component, a debonded metal filling template is also obtained; the debonded metal filling template is cleaned to obtain a reusable clean metal filling template.

[0087] Specifically, the assembly is debonded, separating the first and second components. The second component, filled with superconducting metal within the blind hole, constitutes the third component. The first component, after transferring the superconducting metal, becomes the debonded metal-filled template. Then, the debonded metal-filled template is cleaned. The cleaned metal-filled template can be reused in the fabrication of the adapter plate, achieving the reuse of the metal-filled template.

[0088] The cleaning process used for the debonded metal filler template is selected according to actual needs, and the embodiments of the present invention do not limit it.

[0089] Based on the above embodiments, obtaining the metal-filled template further includes: A dielectric layer is grown on the first substrate; Specifically, a dielectric layer is grown on the first substrate. The dielectric layer can be made of materials such as silicon dioxide and silicon nitride, and the selection is made according to actual needs. This embodiment of the invention does not limit the choice.

[0090] Microchannels are formed on the dielectric layer; Specifically, microchannels can be fabricated on the dielectric layer. These microchannels are used to fill the superconducting metal and can accommodate it during subsequent melting. The microchannels can be connected to the outside environment through guide grooves, so that when the superconducting metal is filled into the blind hole, pressure can be applied to the molten superconducting metal by loading an inert gas, thus pushing the superconducting metal towards the blind hole.

[0091] For example, microchannel patterns can be photolithographically formed on the dielectric layer, and then the microchannels can be etched using dry or wet etching methods.

[0092] Based on the above embodiments, further, forming microchannels on the dielectric layer includes: Photolithography is performed on the dielectric layer to form a microchannel pattern; Specifically, microchannel patterns are photolithographically etched onto the dielectric layer, and these microchannel patterns are used to fabricate microchannels. The microchannel patterns are configured according to actual needs, and this embodiment of the invention does not impose any limitations.

[0093] The microchannels are obtained by etching the dielectric layer based on the microchannel pattern.

[0094] Specifically, the microchannels can be obtained by etching the dielectric layer based on the microchannel pattern. The etching can be performed using either dry or wet etching methods.

[0095] Based on the above embodiments, the further step of fabricating the second component based on the second substrate includes: A mask layer is grown on the second substrate; Specifically, a mask layer is grown on the second substrate. The mask layer can be made of materials such as silicon dioxide and silicon nitride, and the selection is made according to actual needs. This embodiment of the invention does not limit the choice.

[0096] Blind hole patterns are photolithographically etched onto the mask layer; Specifically, blind hole patterns are photolithographically formed on the mask layer, and these blind hole patterns are used to fabricate blind holes. The blind hole patterns are configured according to actual needs, and this embodiment of the invention does not impose any limitations.

[0097] The second substrate is etched based on the blind via pattern to form blind vias within the second substrate.

[0098] Specifically, by etching the second substrate based on the blind via pattern, blind vias can be formed within the second substrate. After obtaining the blind vias, the mask layer can be removed. The etching can be performed using either dry or wet etching methods.

[0099] For example, the second substrate is a silicon wafer, which can be etched using the DRIE dry etching method or the KOH solution wet etching method to form blind holes in the second substrate.

[0100] For example, if the second substrate is a glass wafer, laser-induced etching can be used to form blind holes within the second substrate.

[0101] For example, if the second substrate is a molded wafer, blind vias can be formed in the second substrate using methods such as laser drilling or mechanical drilling.

[0102] Based on the above embodiments, an adhesion layer is further deposited on the inner wall of the blind hole. The adhesion layer may be made of a superconducting metal such as Ti. The melting point of the adhesion layer material is higher than that of the superconducting metal used in the superconducting metal pillar.

[0103] An adhesion layer can be deposited on the insulating layer of a through-hole using a thin-film growth technique capable of filling deep-hole structures, thereby achieving good fixation between the superconducting metal and the hole structure. Atomic layer deposition, bias sputtering, chemical vapor deposition, and other processes can be used to deposit the adhesion layer.

[0104] Based on the above embodiments, when the second substrate is a conductor or semiconductor material, a dielectric layer is deposited in the blind hole and on the second substrate as an insulating layer.

[0105] Based on the above embodiments, further, the step of bonding the first component and the second component in a vacuum environment based on the correspondence between the microchannels and the blind holes, melting the superconducting metal, and filling the corresponding blind holes with the superconducting metal in the microchannels through negative pressure to obtain the assembly includes: The first component and the second component are bonded in a vacuum environment so that the surfaces of the first component and the second component overlap, and the superconducting metal seals the corresponding blind holes; Specifically, the first component and the second component are placed in a vacuum environment and bonded together, i.e., bonded by van der Waals forces between the surfaces of the first and second components. During bonding, the surface of the first component with microchannels and superconducting metal faces the surface of the second component with blind holes, and the superconducting metal filling the microchannels corresponds to the blind holes so that the corresponding blind holes can be sealed after bonding. To facilitate bonding, the bonding surfaces of the first and second components can be heated, and pressure can be applied during the bonding process.

[0106] The vacuum environment can be achieved using a bonding device. The first and second components are clamped in the bonding device and brought into the main cavity of the device. A vacuum operation is performed on the main cavity to remove the air and achieve a vacuum state, thus creating a vacuum environment inside the blind hole.

[0107] The superconducting metal is melted and an inert gas is introduced into the vacuum environment of the main cavity, so that the inert gas pushes the molten superconducting metal through the microchannel to fill the corresponding blind holes; Specifically, the superconducting metal is heated above its melting point, causing it to melt. An inert gas is then introduced into the vacuum environment. Since the blind holes remain under vacuum, the inert gas enters the microchannels under negative pressure, propelling the molten superconducting metal into the corresponding blind holes until the entire blind hole is filled. The inert gas can be nitrogen, argon, etc., selected according to actual needs; this embodiment of the invention does not impose a limitation.

[0108] Understandably, when a superconducting metal is heated above its melting point, the liquid superconducting metal can extend inward at the entrance of the blind hole due to surface tension, thereby achieving a good liquid seal for the blind hole and preventing pressure leakage.

[0109] To ensure complete filling of the blind hole, the total amount of superconducting metal in the guide channel is greater than the total amount of superconducting metal required to fill the blind hole.

[0110] The assembly is formed after the superconducting metal cools and solidifies.

[0111] Specifically, after the superconducting metal fills the blind holes, it is cooled to below the melting point of the superconducting metal, allowing it to solidify within the blind holes, thus obtaining the assembly. To ensure the superconducting metal solidifies within the blind holes, an inert gas pressure is maintained on the superconducting metal throughout the cooling process; after the superconducting metal has solidified, the gas pressure is removed.

[0112] In the description of this specification, the references to terms such as "an embodiment," "a specific embodiment," "some embodiments," "for example," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0113] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above descriptions are merely specific embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A microchannel, characterized in that, Includes a flow channel and a liquid gold pool, wherein: The flow channel is connected to the liquid gold pool; the liquid gold pool corresponds to multiple receiving structures on the adapter plate for filling metal; the flow channel connects the liquid gold pool to the outside.

2. The microchannel according to claim 1, characterized in that, There are multiple flow channels.

3. The microchannel according to claim 2, characterized in that, Multiple flow channels are arranged in a rotating array about the center of the liquid gold pool.

4. The microchannel according to claim 1, characterized in that, The shape of the guide channel can be a straight line or a curve.

5. The microchannel according to claim 4, characterized in that, The curve consists of at least one smooth curve segment.

6. The microchannel according to any one of claims 1 to 5, characterized in that, The liquid gold pool can be polygonal, circular, or elliptical.

7. A metal filling template, characterized in that, The invention includes the microchannels and substrate as described in any one of claims 1 to 6, wherein a dielectric layer is disposed on the substrate and the microchannels are disposed on the dielectric layer.

8. The metal filling template according to claim 7, characterized in that, There are multiple microchannels.

9. The metal filling template according to claim 8, characterized in that, Multiple microchannel arrays are arranged.

10. The metal filling template according to claim 7, characterized in that, There are various types of microchannels.

11. The metal filling template according to claim 10, characterized in that, Each type of microchannel array arrangement.

12. The metal filling template according to claim 8 or 10, characterized in that, It also includes a fully connected channel, which is disposed on the medium layer. The guide groove of each microchannel is connected to the fully connected channel, which is used to connect the microchannel to the outside.

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