Heat dissipation device

Abstract

The heat dissipation device according to the present invention comprises: a one-side heat conduction panel; a heat transfer panel on the other side that is joined to the heat transfer panel on the one side and forms a refrigerant flow space between the heat transfer panel on the other side and the heat transfer panel on the one side, the refrigerant flow space being filled with a refrigerant and phase-changing the refrigerant; and a sintered body column assembly disposed in the refrigerant flow space, in which the sintered body column assembly includes: a plurality of condensation part sintered body columns disposed at positions in the refrigerant flow space corresponding to condensation end parts that participate in condensation of the refrigerant by heat exchange with outside air; and an evaporation unit sintered body base which is disposed at an evaporation end portion close to a heat generating body, the evaporation end portion being a portion other than the condensation end portion in the refrigerant flow space, the evaporation unit sintered body base being connected to at least one of the plurality of condensation unit sintered body columns, thereby maximizing heat dissipation performance and improving heat efficiency. And the advantage of improving the bonding force is provided.

Description

Technical Field

[0001] This invention relates to a heat dissipation apparatus, and more specifically, to a heat dissipation apparatus that maximizes heat dissipation performance while improving product productivity. Background Technology

[0002] In various industries such as communications, electronics, and electrical engineering, related technologies continue to evolve in order to be applied to more advanced industries. To achieve higher levels of technological development, high-power energy is required. Equipment using high-power energy inevitably faces the problem of high heat generation, thus necessitating the development of corresponding cooling systems.

[0003] Cooling systems are used in various industries, including air conditioning, mobile communications, data centers, air mobility, electric vehicles, energy storage devices, and displays. These cooling systems are a major contributor to electricity consumption, which is gradually increasing with industrial development.

[0004] Generally, heat dissipation devices are broadly classified into active cooling devices and passive cooling devices. Active cooling devices mainly use fans to force convection, while passive cooling devices can be classified as those that utilize natural convection without using fans.

[0005] However, existing heat dissipation systems have limitations in effectively dissipating the high heat generated by continuously evolving high-tech applications. Therefore, innovative technologies are needed in related industries to address this problem, and heat dissipation devices are being developed as part of this solution.

[0006] A phase transition refers to a change in the inherent state of a liquid, gas, or solid when it accumulates a large amount of energy or releases stored heat.

[0007] A phase transition refers to a change in the physical arrangement of molecules, rather than a chemical reaction such as chemical combination or formation. When energy is applied to a substance, the heat that does not occur during a phase transition is called sensible heat, while the heat used during a phase transition is called latent heat.

[0008] However, since heat dissipation devices are directly proportional to temperature and pressure, there is a problem that the pressure also increases as the temperature rises. Within a sealed heat dissipation device, the high temperature conducted from the heat source causes pressure to rise, potentially leading to the device's own rupture. To solve this problem, the pressure needs to be prevented from rising, and the heat dissipation device must have sufficient internal volume to achieve pressure equilibrium during the phase transition cycle of matter. Summary of the Invention

[0009] Technical issues The present invention aims to solve the above-mentioned technical problems and its purpose is to provide a heat dissipation device that can maximize heat dissipation performance.

[0010] Furthermore, another object of the present invention is to provide a heat dissipation device that improves the work safety of workers (assembly personnel, etc.) by removing the sharp parts of the edge end that constitutes the condensation end.

[0011] The technical problems of the present invention are not limited to those described above, and other technical problems not mentioned can be clearly understood by those skilled in the art from the following description.

[0012] Technical solution A heat dissipation device according to an embodiment of the present invention includes: a side heat-conducting panel; a other side heat-conducting panel, joined to the side heat-conducting panel and forming a refrigerant flow space between the other side heat-conducting panel, the refrigerant flow space being a space where the refrigerant is filled and undergoes a phase change; and a sintered body column assembly disposed in the refrigerant flow space, wherein the sintered body column assembly includes: a plurality of condensing section sintered body columns disposed in the refrigerant flow space at locations corresponding to condensing ends, the condensing ends being locations that participate in the condensation of the refrigerant through heat exchange with external air; and an evaporating section sintered body base disposed near the evaporating end of the heating element, the evaporating end being a location in the refrigerant flow space other than the condensing ends, the evaporating section sintered body base being connected to at least one of the plurality of condensing section sintered body columns.

[0013] Here, the aforementioned heat-conducting panel on one side and the heat-conducting panel on the other side can be made of the same metallic material with a thermal conductivity of more than a predetermined value.

[0014] In addition, the aforementioned heat-conducting panel on one side and the heat-conducting panel on the other side can be configured as metal sheet components made of stainless steel (SUS).

[0015] In addition, the aforementioned heat-conducting panel on one side and the heat-conducting panel on the other side can be processed by sheet metal through stamping die technology.

[0016] In addition, the above sintered body column assembly further includes a sintered body additional base, which is connected to the evaporation part sintered body base and is located on the lower side of the condensation end part with respect to the gravity direction. Among them, the lower ends of the plurality of condensation part sintered body columns can be connected to the sintered body additional base.

[0017] In addition, when the sintered body additional base is arranged obliquely in the up-down direction along the condensation end part, the lower end of the sintered body additional base can avoid the upper end of the evaporation part sintered body base and be connected to one side of the upper end part of the evaporation part sintered body base in a grounded manner.

[0018] In addition, the upper end of the evaporation part sintered body base can be located at a position at least higher than the inclined lower end of the sintered body additional base with respect to the gravity direction.

[0019] In addition, the lower end of the condensation part sintered body column in the plurality of condensation part sintered body columns that is arranged close to the evaporation part sintered body base is connected to the evaporation part sintered body base.

[0020] In addition, the lower end of the condensation part sintered body column can be arranged to avoid the upper end of the evaporation sintered body strip and be connected to one side of the evaporation part sintered body strip.

[0021] In addition, it further includes a condensation part sintered body base, which is arranged obliquely in the condensation end part except the evaporation end part in a manner of connecting the lower ends of the plurality of condensation part sintered body columns. The inclined lower end of the condensation part sintered body base can be arranged to be connected to one side of the upper end part of the evaporation sintered body strip.

[0022] In addition, the upper end of the evaporation sintered body strip can be located at a position at least higher than the inclined lower end of the condensation part sintered body base with respect to the gravity direction.

[0023] In addition, the evaporation sintered body strip can be joined by brazing to make surface thermal contact with the evaporation end part.

[0024] In addition, the evaporation sintered body strip can include: a joining panel, which is formed by bending a panel made of copper (Cu) material into a "匚" - shaped cross - section with one side open; and a sintered body filling part, which is formed by sintering copper - material powder (powder) inside the joining panel.

[0025] In addition, the plurality of condensation part sintered body columns and the condensation part sintered body base in the sintered body column can be formed by sintering metal powder of the same material as the metal material constituting the one - side heat - conducting panel and the other - side heat - conducting panel.

[0026] Furthermore, the aforementioned evaporation sintered strips in the sintered column can be formed by sintering copper metal powder.

[0027] Beneficial effects According to an embodiment of the present invention, the heat dissipation device can not only significantly improve heat dissipation performance, but also improve the mutual bonding force between the heat-conducting panel on one side and the heat-conducting panel on the other side.

[0028] Furthermore, by forming a liquid refrigerant holding section at the condensation end corresponding to the condensation region, the present invention can achieve the effect of supplying a more uniform liquid refrigerant to the evaporation end side to improve heat dissipation performance. Attached Figure Description

[0029] Figure 1 This is a perspective view showing an application example of the heat dissipation device according to the present invention.

[0030] Figure 2 This is a perspective view showing the heat dissipation device according to the present invention.

[0031] Figure 3a and Figure 3b yes Figure 2 The exploded perspective views are exploded perspective views of the heat dissipation device according to one embodiment (200-1) and another embodiment (200-2) of the present invention.

[0032] Figure 4a and Figure 4b From Figure 2 The states with one side heat-conducting panel removed are front views showing the arrangement of the sintered body column assembly in the heat dissipation device according to one embodiment (200-1) and another embodiment (200-2) of the present invention.

[0033] Figure 5 yes Figure 2 The front view.

[0034] Figure 6 These are cross-sectional views taken along line AA, which are cross-sectional views of the heat dissipation device according to one embodiment (200-1) and another embodiment (200-2).

[0035] Figure 7 yes Figure 6 Enlarged view of parts "B" and "C".

[0036] Figure 8 It is shown Figure 2 The cross-sectional view and its enlarged portion are shown in the configuration of the heat-conducting panel on one side and the heat-conducting panel on the other side.

[0037] Figure 9a yes Figure 4aPart of the composition is a perspective view and a partial enlarged view of the sintered body base of the evaporation section applied to a heat dissipation device according to an embodiment of the present invention.

[0038] Figure 9b yes Figure 4b Part of the composition is a perspective view and a partial enlarged view of the sintered body base of the evaporation section applied to a heat dissipation device according to another embodiment of the present invention.

[0039] <Explanation of reference numerals in the attached figures> Detailed Implementation

[0040] Hereinafter, a heat dissipation device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0041] It should be noted that when affixing reference labels to the constituent elements of each figure, the same constituent elements should be assigned the same label as much as possible, even if they are displayed in different figures. Furthermore, when describing embodiments of the present invention, detailed descriptions of relevant well-known structures or functions are omitted if it is determined that such detailed descriptions would hinder the understanding of the embodiments of the present invention.

[0042] In describing the constituent elements of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are used only to distinguish the constituent element from other constituent elements, and the nature, order, or sequence of the constituent elements is not limited by the term. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms identical to those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and should not be construed as having an idealized or overly formal meaning unless explicitly defined in this application.

[0043] Figure 1 This is a perspective view showing an application example of the heat dissipation device according to the present invention.

[0044] like Figure 1 As shown, a heat dissipation device 200 according to an embodiment of the present invention may be configured to receive generated heat from an electronic device 50 (e.g., an LED unit, etc.) on which a heat-generating element 51 (e.g., an LED element in a lighting device) is installed as a heat dissipation object, and dissipate heat through heat exchange with external air (outer air).

[0045] Here, although the electronic device that dissipates heat through the heat dissipation device 200 according to an embodiment of the present invention is limited to an LED unit 50 including an LED element 51, the electronic device is not limited thereto, and electronic devices related to antenna devices or similar technical fields that are the main technical field of the applicant of the present invention are not excluded.

[0046] LED unit 50 in Figure 1 The heat generated by the LED element 51 is transferred and supplied to the heat dissipation device 200 according to an embodiment of the present invention via the back side.

[0047] However, in order to facilitate the installation on the back of the LED unit 50 and the heat transfer to the heat dissipation device 200, a plurality of heat transfer medium blocks 160 can be provided between the LED unit 50 and the heat dissipation device 200. By forming grooves 165 between the plurality of heat transfer medium blocks 160 or on themselves, the evaporation end 201 of the heat dissipation device 200, which will be described below, can be connected.

[0048] Figure 2 This is a perspective view showing the heat dissipation device according to the present invention. Figure 3a and Figure 3b yes Figure 2 The exploded perspective views are exploded perspective views of the heat dissipation device according to one embodiment (200-1) and another embodiment (200-2) of the present invention. Figure 4a and Figure 4b From Figure 2 The states with one side heat-conducting panel removed are shown in the front views of the arrangement of the sintered body column assembly in the heat dissipation device according to one embodiment (200-1) and another embodiment (200-2) of the present invention.

[0049] like Figures 1 to 4b As shown, the heat dissipation device 200 according to the present invention includes: a heat-conducting panel 200A on one side of a metal plate component and a heat-conducting panel 200B on the other side of a metal plate component.

[0050] Specifically, a refrigerant flow space 205, having a structure that is sealed (shielded) from the outside, is formed in the area corresponding to the space between one side heat-conducting panel 200A and the other side heat-conducting panel 200B, as will be described below. The refrigerant fills this space and undergoes a phase change within the refrigerant flow space 205 due to heat supplied by an external heating element (e.g., referring to reference numeral "51" as described below), thereby dissipating system heat. This will be explained in more detail below.

[0051] Here, the heat-conducting panel 200A on one side and the heat-conducting panel 200B on the other side can be made of the same metal material (metal sheet material) with a thermal conductivity of more than a predetermined value.

[0052] Preferably, in order to facilitate the smooth phase change of the refrigerant (especially the phase change of the refrigerant from gaseous to liquid state) through heat exchange with the outside air, the material can be stainless steel (SUS), which is one of the metal materials with a thermal conductivity of at least less than that of aluminum (Al).

[0053] Therefore, the specific reasons for using stainless steel as the metal material for the heat-conducting panel 200A on one side and the heat-conducting panel 200B on the other side will be explained in more detail below.

[0054] Furthermore, in the heat dissipation device 200 according to the first embodiment of the present invention, the heat-conducting panel 200A on one side and the heat-conducting panel 200B on the other side can be formed by sheet metal processing using a stamping die process.

[0055] For reference, although the stamping die process is not shown in the figure, it can be understood as a process of sheet metal processing of stainless steel metal base panel through stamping die equipment, so that at least each edge end can be joined to each other through the joint medium frame body 280.

[0056] At this time, the stamping die process can not only form the shape of one side heat-conducting panel 200A and the other side heat-conducting panel 200B, but also simultaneously form multiple strength-reinforcing parts 230, which will be described below, as well as one side thickness-forming panel 200A-P and the other side thickness-forming panel 200B-P, which will be described below.

[0057] Here, the heat-conducting panel 200A on one side and the heat-conducting panel 200B on the other side can be sheet metal parts made of stainless steel. The thickness of the heat-conducting panel 200A on one side and the heat-conducting panel 200B on the other side is set to be extremely thin, and can be set to a thickness of no more than 0.15t.

[0058] Generally speaking, among metallic materials, aluminum (Al) is the most widely used material considering thermal conductivity and weight. Here, when the heat dissipation device, which essentially performs heat dissipation or heat exchange, is itself in the form of heat dissipation fins, and does not use a phase-change refrigerant as described in one embodiment of the present invention as the heat transfer medium, but performs heat transfer solely through the material itself, it is natural that aluminum can be chosen as the optimal material.

[0059] In other words, aluminum not only has an excellent thermal conductivity of 230, but also has a low specific gravity, making it one of the most widely used materials for heat dissipation components.

[0060] However, although aluminum has a higher thermal conductivity and specific gravity than stainless steel (which has a thermal conductivity of 20) used in one embodiment of the present invention for the heat-conducting panel 200A on one side and the heat-conducting panel 200B on the other side, its price is relatively high, and the amount of refrigerant that can be filled is very limited.

[0061] For example, when distilled water (water) is used as a refrigerant, it can cause a chemical reaction in the case of aluminum materials, making it unable to perform its function as a refrigerant. Therefore, there is a problem that distilled water must be excluded from the alternative refrigerants.

[0062] To address the issues with this aluminum material, in a heat dissipation device 200, 200-1 according to an embodiment of the present invention, stainless steel, which hardly reacts chemically with distilled water, is used as the metal material for one side heat-conducting panel 200A and the other side heat-conducting panel 200B.

[0063] The edges of the heat-conducting panel 200A on one side and the heat-conducting panel 200B on the other side are joined together to form a refrigerant flow space 205, in which the refrigerant undergoes a phase change and flows.

[0064] Here, one side heat-conducting panel 200A and the other side heat-conducting panel 200B can be joined together along their respective edge ends to form the aforementioned refrigerant flow space 205 inside.

[0065] However, for the aforementioned heat-conducting panel 200A on one side and the aforementioned heat-conducting panel 200B on the other side, as described above, when the edge ends of two metal plate components with an extremely thin thickness (0.15T) are joined together, the thickness of the edge ends is only 0.3T. Therefore, if they are not processed separately, they have very sharp ends, which poses a risk of injury to workers during the work process.

[0066] To minimize the risk of injury to such workers (set-up personnel) during the work process, such as Figure 1 As shown in Figure 3, either one of the heat-conducting panel 200A on one side or the heat-conducting panel 200B on the other side can be joined by inserting the other into the other.

[0067] More in detail, such as Figure 3a and Figure 3bAs shown, all edge ends (refer to reference numerals "200A-P" and "200B-P") of one side heat-conducting panel 200A and the other side heat-conducting panel 200B are formed as bends. Each bend is formed by one side thickness forming panel 200A-P and the other side thickness forming panel 200B-P. The one side thickness forming panel 200A-P of one side heat-conducting panel 200A and the other side thickness forming panel 200B-P of the other side heat-conducting panel 200B can be arranged to partially overlap in the thickness direction of the refrigerant flow space 205.

[0068] Here, the thickness forming panel 200A-P on one side is a part that is bent along the edge of the heat-conducting panel 200A on one side, and can be bent approximately orthogonally toward the heat-conducting panel 200B on the other side. The thickness forming panel 200B-P on the other side is a part that is bent along the edge of the heat-conducting panel 200B on the other side, and can be bent approximately orthogonally toward the heat-conducting panel 200A on one side.

[0069] Thus, the edge ends of one side heat-conducting panel 200A and the edge ends of the other side heat-conducting panel 200B are bent along the thickness direction of the refrigerant flow space 205, thereby forming the aforementioned one-sided thickness forming panel 200A-P and the other-sided thickness forming panel 200B-P.

[0070] At this time, the other side thickness forming panel 200B-P of the other side heat-conducting panel 200B is inserted relative to the side thickness forming panel 200A-P of the one side heat-conducting panel 200A, so that at least the front end of the other side thickness forming panel 200B-P can be joined in a concealed state from the outside by being shielded by the side thickness forming panel 200A-P of the one side heat-conducting panel 200A.

[0071] Thus, the thickness forming panel 200A-P of one side of the heat-conducting panel 200A performs the function of forming a thickness forming panel that forms the overall thickness of the refrigerant flow space 205. As a result, by forming the thickness of the edge end to be at least sufficiently greater than the sum of the thickness of the material itself of the heat-conducting panel 200A on one side and the heat-conducting panel 200B on the other side, it is possible to perform the additional function of preventing workers (including assembly workers) from being injured while working by eliminating sharp edge ends.

[0072] A refrigerant flow space 205 is formed inside the space between the heat-conducting panel 200A on one side and the heat-conducting panel 200B on the other side, which are joined together. The refrigerant flow space 205 is filled with refrigerant, and the refrigerant undergoes a phase change and flows. It is also capable of communicating with a heating element (e.g., installed on a device that supplies heat to the filled refrigerant). Figure 1 The LED elements 51 on the LED substrate 50 of the lighting device 100 are made into surface thermal contact.

[0073] That is, such as Figure 1 As shown, the LED element 51 mounted on the LED substrate 50 of the lighting device 100 in the electronic device (electronic product) that is the object of heat dissipation is illustrated and described as a representative example of the heat dissipation device 200, 200-1 according to the present invention.

[0074] However, the electronic device that dissipates heat through the heat dissipation device 200, 200-1 according to the present invention is not limited to the lighting device 100, but should be understood to include the concept of all electronic devices related to antenna devices or similar technical fields corresponding to the applicant's main products manufactured and sold by the present invention.

[0075] The LED element 50 can transfer the generated heat through the back side of the LED substrate 50 and supply it to the heat dissipation device 200, 200-1 according to the present invention.

[0076] The refrigerant filled in the refrigerant flow space 205 is a phase change substance that can undergo a phase change due to the heat supplied by the heating element 51 (LED element) or through heat exchange with the outside air (outdoor air). In particular, as the refrigerant here, if aluminum (Al) is excluded from the metal material constituting the heat-conducting panel 200A on one side and the heat-conducting panel 200B on the other side, distilled water (water) which does not raise concerns about environmental pollution is preferably used.

[0077] Hereinafter, the portion of the edge end of the heat dissipation device 200 according to an embodiment of the present invention that receives heat from the heat-generating element 51 (LED element) is defined as the evaporation end 201, and all other portions except the evaporation end 201 are defined as the condensation end 203.

[0078] More specifically, in the refrigerant flow space 205, a portion of the lower part relative to the direction of gravity can be understood as the area where liquid refrigerant is stored and evaporates into gaseous refrigerant as heat is supplied (evaporation region), and a portion of the upper part relative to the direction of gravity can be understood as the area where gaseous refrigerant flows actively and condenses into liquid refrigerant through heat exchange with external air (outside air) (condensation region).

[0079] The following can be understood as... Figure 2 The attached diagram, with the dashed line 200C as the reference, divides the area into an evaporation zone and a condensation zone. Most of the liquid refrigerant is stored below the dashed line 200C due to gravity. The gaseous refrigerant is not related to the dashed line 200C. Once a phase change occurs from the liquid refrigerant, it flows and diffuses to all parts of the refrigerant flow space 205, including the evaporation zone.

[0080] Furthermore, based on reference numeral 200C, the portion corresponding to the lower direction of gravity is defined as the evaporation region, and the portion corresponding to the upper direction of gravity is defined as the condensation region, based on reference numeral 200C, is defined as the condensation region, and the portion corresponding to the upper direction of gravity is defined as the condensation region, and the portion corresponding to the upper direction of gravity is defined as the condensation region, and the portion corresponding to the upper direction of gravity, ... lower direction of gravity, is defined as the condensation region, and the portion corresponding to the upper direction of gravity, is defined as the condensation region, and the portion corresponding

[0081] However, the reference numeral 200C in the attached figure cannot be used as a complete physical reference for dividing the above-mentioned evaporation zone and condensation zone. It should be noted that condensation may occur in the evaporation zone depending on the properties (and specifications) of the refrigerant, and similarly, evaporation may occur in the condensation zone.

[0082] On the other hand, such as Figures 1 to 4b As shown, the heat dissipation device 200 according to an embodiment of the present invention may further include a sintered body column assembly 250 arranged in the refrigerant flow space 205.

[0083] Here, the sintered body column assembly 250 may include: a plurality of condensing sintered body columns 251 arranged at intervals in the condensing region corresponding to the condensing end 203, and an evaporating sintered body base 255 arranged in the evaporating region corresponding to the evaporating end 201 and connected to at least one 251-1 of the plurality of condensing sintered body columns 251.

[0084] In addition, the sintered body column assembly 250 may also include a sintered body additional base 255-1, which is arranged at the condensation end 203 corresponding to the condensation region and connected to the lower ends of a plurality of condensation section sintered body columns 251.

[0085] However, as Figure 3a and Figure 4a and Figure 3b and Figure 4b As shown, the liquid refrigerant (condensing refrigerant) flowing through the condensing end 203 corresponding to the condensing region via multiple condensing section sintered body columns 251 may vary depending on the presence or absence of the sintered body additional base 255-1. The specific arrangement and configuration of the evaporating section sintered body base 255 for the design of the liquid refrigerant holding section 204, which will be described below, may differ. The aforementioned sintered body additional base 255-1 mediates the transfer to the evaporating section sintered body base 255 side corresponding to the evaporating end 201 side of the evaporating region. Therefore, in this respect, the presence or absence of the sintered body additional base 255-1 can be a distinguishing feature of this invention. Figure 3a and Figure 4a ) and another embodiment ( Figure 3b and Figure 4b The standard is as follows. This will be explained in more detail below.

[0086] The multiple sintered column 251 of the condenser section can be arranged vertically or inclined such that the liquid refrigerant condensed in the condensation region corresponding to the condensation end 203 flows downward naturally due to gravity. The upper end of the column is located above the direction of gravity, and the lower end is located below the direction of gravity.

[0087] In addition, through Figure 3a and Figure 4a The sintered body additional base 255-1 included in the heat dissipation device 200-1 according to an embodiment of the present invention can facilitate the easy and uniform distribution and collection of the liquid refrigerant to the evaporation area corresponding to the evaporation end 201 when the condensed liquid refrigerant is guided downward along the direction of gravity by the sintered body columns 251 of the plurality of condensation sections.

[0088] However, in passing Figure 3b and Figure 4b In the case of the heat dissipation device 200-2 according to another embodiment of the present invention, since no sintered body additional base 255-1 is provided, the liquid refrigerant flowing down through the multiple condensing section sintered body columns 251 flows along the inclined end corresponding to the condensing end 203 located below the direction of gravity, and moves to the evaporation area corresponding to the evaporation end 201 where the evaporation section sintered body base 255 is provided and is stored.

[0089] Hereinafter, for ease of understanding of the heat dissipation device 200 according to the present invention, the portion of the condensation region arranged in the sintered body additional base 255-1 in one embodiment (200) of the present invention, and the edge end portion inclined towards the evaporation end 201 as part of the condensation end 203 in another embodiment (200-1) of the present invention will be defined as the liquid phase refrigerant holding section 204.

[0090] The liquid refrigerant holding section 204 is not actually part of the evaporation region where the liquid refrigerant phases into the gaseous refrigerant, but it can perform the following function: after the liquid refrigerant flowing through the multiple condensation section sintered body columns 251 at the condensation end 203 corresponding to the condensation region is held for as long as possible, it flows uniformly to the evaporation section sintered body base 255 side of the evaporation end 201.

[0091] The sintered body base 255 of the evaporation section is actually located at the evaporation end 201 closest to the heating element 51 (LED element) in the evaporation region, and performs the function of directly receiving heat transfer from the heating element 51 (LED element) to evaporate the liquid refrigerant.

[0092] That is, the evaporation section sintered body base 255 is a component that is joined by brazing to make surface thermal contact with the evaporation end 201, which substantially receives heat transfer from the heating element 51 (LED element), and can perform the function of converting the liquid refrigerant stored in the refrigerant flow space 205 into a gaseous refrigerant.

[0093] However, the liquid refrigerant is preferably stored (water stored) in the entire evaporation area including the evaporation end 201 (especially up to the water level above 200°C, indicated by the dashed line). But due to the change in the installation position of the heat dissipation device 200 according to the invention, the water level of the liquid refrigerant may be lower than the upper end of the evaporation section sintered body base 255. In this case, the liquid refrigerant may not be able to evaporate evenly throughout the entire part of the evaporation section sintered body base 255.

[0094] Therefore, the purpose of setting up the liquid refrigerant holding section 204 is to uniformly supply liquid refrigerant to the sintered body base 255 of the evaporation section.

[0095] Here, the sintered body column assembly 250 can be formed entirely from stainless steel powder by sintering, and the evaporation section sintered body base 255 arranged near the evaporation end 201 can be formed from copper sintered body in order to evaporate the liquid phase refrigerant in the refrigerant flow space 205 into gas phase refrigerant, since a high thermal conductivity is required.

[0096] More specifically, the plurality of condensing sintered body columns 251 or sintered body additional bases 255-1 arranged in the sintered body column assembly 250 at the condensing end 203 corresponding to the condensing region can be formed by sintering metal powder (powder) of the same material as the metal sheet components of the heat-conducting panel 200A on one side and the heat-conducting panel 200B on the other side.

[0097] Therefore, as explained, when it is understood that one side heat-conducting panel 200A and the other side heat-conducting panel 200B are metal sheet components made of stainless steel, although their formation or processing methods are slightly different, it can be understood that multiple condensation section sintered body pillars 251 or sintered body additional bases 255-1 are formed by sintering metal powder of stainless steel to have the same thermal conductivity.

[0098] However, given the high thermal conductivity required to convert the liquid refrigerant into a gaseous refrigerant by the heat supplied by the heating element 51 (LED element), as described above, the evaporation section sintered body base 255 arranged near the evaporation end 201 can be formed from a sintered body made of copper material with a thermal conductivity higher than that of stainless steel.

[0099] Here, in order to maximize the function of the liquid phase refrigerant holding section 204, the effective arrangement relationship of the sintered body column assembly 250 is explained as follows.

[0100] First, such as Figure 3a and Figure 4a As shown, the plurality of condensing sintered body columns 251 in the sintered body column assembly 250 can be arranged to be generally vertical or inclined from the top to the bottom, so that the liquid refrigerant condensed on the entire heat dissipation surface of the condensing end 203 corresponding to the condensing region is uniformly dispersed and guided to flow and be transported to the liquid refrigerant holding section 204 located lower with respect to the direction of gravity.

[0101] Here, in the case of a heat dissipation device 200 according to an embodiment of the present invention, in which the sintered body auxiliary base 255-1 connecting the lower ends of the plurality of condensing section sintered body columns 251 is arranged to be inclined to one side in the liquid phase refrigerant holding section 204, the inclined lower end of the sintered body auxiliary base 255-1 can be arranged to avoid the upper end of the evaporating section sintered body base 255 and connect to one side of the upper end.

[0102] At this time, the upper end of the evaporation section sintered body base 255 is located at a position that is at least higher than the inclined lower end of the sintered body auxiliary base 255-1 based on the direction of gravity, so that it can perform the function of a wall to retain more of the liquid refrigerant that is guided to flow along the sintered body auxiliary base 255-1 in the inclined direction.

[0103] More preferably, the upper end of the evaporation section sintered body base 255 can be set to a position higher than the lower end of the condensation section sintered body column 251, which is most closely connected to the inclined lower end of the sintered body auxiliary base 255-1.

[0104] Therefore, except for the upper end of the condensation section sintered body column 251 which is most closely connected to the inclined lower end of the sintered body additional base 255-1, in addition to the upper end of the column, the condensation section sintered body column 251 is connected to the upper end of the column. Figure 3a and Figure 4a Apart from the condensing refrigerant (liquid phase refrigerant) that moves directly downwards to the right side of the evaporation end 201 in the figure, almost all of the condensing refrigerant (liquid phase refrigerant) can be uniformly supplied to the evaporation end 201 side after being retained for a longer time through multiple condensation section sintered body columns 251 or sintered body additional bases 255-1.

[0105] Next, as Figure 3b and Figure 4b As shown, in the case of the heat dissipation device 200-2 according to another embodiment of the present invention, in which the sintered body additional base 255-1 is not provided in the region corresponding to the liquid refrigerant holding section 204, the upper end of the evaporation section sintered body base 255 and the lower end of the condensation section sintered body column 251 closest to the evaporation end 201 corresponding to the evaporation region among the plurality of condensation section sintered body columns 251 can be arranged to be interconnected.

[0106] At this time, the lower end of the condenser sintered body column 251 is preferably arranged to avoid the upper end of the evaporator sintered body base 255 and to be connected to one side.

[0107] That is, the lower end of the condenser sintered body column 251 can be exposed above the upper end of the evaporator sintered body base 255 with respect to gravity, while being grounded to one side of the upper end of the evaporator sintered body base 255.

[0108] Thus, the lower end of the condenser sintered body column 251 is connected in a manner that avoids the upper end of the evaporator sintered body base 255, so that the liquid refrigerant held in the liquid refrigerant holding section 204 can be absorbed through the upper end of the evaporator sintered body base 255.

[0109] Therefore, in addition to the upper end of the condensation section sintered body column 251 that extends beyond the upper end of the evaporation section sintered body base 255, Figure 3b and Figure 4b Apart from the condensing refrigerant (liquid phase refrigerant) that moves directly downwards to the right of the evaporation end 201 in the figure, almost all of the condensing refrigerant (liquid phase refrigerant) is uniformly collected at the liquid phase refrigerant holding section 204 through multiple condensing section sintered body columns 251. After remaining for a long time, it is supplied to the evaporation section sintered body base 255 on the evaporation end 201 side.

[0110] Figure 5 yes Figure 2 Front view, Figure 6 For along Figure 5 The cross-sectional views taken along line AA in the figures are cross-sectional views of the heat dissipation devices according to one embodiment (200-1) and another embodiment (200-2), respectively. Figure 7 yes Figure 6 Enlarged views of parts "B" and "C". Figure 8 It is shown Figure 2 The cross-sectional view and its enlarged portion show the joint state of the heat-conducting panel on one side and the heat-conducting panel on the other side in the structure. Figure 9a yes Figure 4a Part of the composition is a perspective view and a partially enlarged view of the sintered body base of the evaporation section applied to a heat dissipation device according to an embodiment of the present invention. Figure 9b yes Figure 4b Part of the composition is a perspective view and a partial enlarged view of the sintered body base of the evaporation section applied to a heat dissipation device according to another embodiment of the present invention.

[0111] In the heat dissipation device 200 according to the present invention, such as Figure 5As shown in Figure 9, multiple strength reinforcement portions 230 and column support protrusions 235 can be further formed on one side of the heat-conducting panel 200A and the other side of the heat-conducting panel 200B. The multiple strength reinforcement portions 230 are recessed towards the refrigerant flow space 205 during the stamping die process. The column support protrusions 235 support the sintered body column assembly 250.

[0112] The multiple strength-enhancing parts 230 not only enhance the strength of the heat-conducting panel 200A and the heat-conducting panel 200B formed with an extremely thin thickness, but also can actively respond to the internal pressure changes generated during the phase change of the refrigerant by welding the joints in the refrigerant flow space 205.

[0113] On the other hand, in the process of joining one side heat-conducting panel 200A and the other side heat-conducting panel 200B according to the embodiments of the present invention, the heat dissipation devices 200 and 200-1 are joined by using the filler metal coating gap 210 formed to be welded by filler metal 220, as will be described below, so that the refrigerant flow space 205 is completely shielded (sealed) from the outside.

[0114] like Figure 6 and Figure 8 As shown, the filling metal coating gap 210 formed by the side thickness forming panel 200A-P of one side heat-conducting panel 200A and the other side thickness forming panel 200B-P of the other side heat-conducting panel 200B, and the bonding process performed by the filling metal 220 coated therein are described in more detail below.

[0115] In the heat dissipation device 200 according to the present invention, such as Figure 6 and Figure 8 As shown, bonding can be achieved by applying filler metal 220 in the filler metal coating gap 210, which corresponds to the space between the rounded outer surface of the other side thickness forming panel 200B-P (described below) which is the edge end of the other side heat-conducting panel 200B, and the front end of the one side thickness forming panel 200A-P (which is the edge end of the other side heat-conducting panel 200A).

[0116] In order to form the filler metal coating gap 210 as described above, the outer side of the other side heat-conducting panel 200B and the front end of the panel 200A-P formed by the thickness of one side of the heat-conducting panel 200A can be configured to match each other.

[0117] More specifically, the other side thickness forming panel 200B-P of the other side heat-conducting panel 200B can be formed by bending in an arc shape with a predetermined radius relative to the outer side surface of the other side heat-conducting panel 200B, so that the aforementioned filler metal coating gap 210 is formed between it and the front end of the other side thickness forming panel 200A-P of the other side heat-conducting panel 200A.

[0118] Here, the filler metal coating gap 210 can be defined as the gap between the front end of the thickness forming panel 200A-P, which is bent perpendicularly to the outer side of the heat-conducting panel 200A on one side, and the rounded outer side of the heat-conducting panel 200B on the other side.

[0119] Thus, when the other heat-conducting panel 200B is configured to be inserted relative to the heat-conducting panel 200A on one side, as... Figure 5 and Figure 6 As shown, a filler metal coating gap 210 is naturally formed between the rounded outer surface of the panel 200B-P on the other side of the heat-conducting panel 200B and the front end of the panel 200A-P on one side of the heat-conducting panel 200A. After the filler metal 220 is coated, the filler metal 220 is melted and penetrated by a brazing process and then hardened, thereby joining the heat-conducting panel 200A on one side to the heat-conducting panel 200B on the other side.

[0120] On the other hand, such as Figure 6 and Figure 7 As shown, the process of setting the sintered body bases 255A and 255B of the evaporation section on the evaporation end 201 corresponding to the evaporation region is briefly described below.

[0121] That is, the sintered body base 255 of the evaporation section is formed from a sintered body of copper material as described above, and is joined to the evaporation end 201 by brazing so as to make surface thermal contact with the side of the evaporation end 201. However, when the brazing method is applied, it may affect the formation of multiple pores that should be formed as micropores on the sintered body itself.

[0122] However, as mentioned above, there will be no major problems if a combination method is applied that eliminates any possibility of issues in the formation process of multiple pores on the sintered body itself. Therefore, as... Figure 7 As shown in part (a), it can also be configured such that the evaporation section sintered body base 255A is directly attached to the evaporation end 201 side.

[0123] However, as Figure 7 Part (b) and Figure 9bAs shown, when the evaporation section sintered body base 255B may affect the formation of multiple pores due to the application of the brazing bonding method, the evaporation section sintered body base 255B can be configured to include a sintered body foam section 255B-1 sintered from copper material powder and a joining panel 255B-2 formed by bending a thin copper material panel into a "C" - shaped cross - section with one - side open, and can be sintered in a form where the sintered body foam section 255B-1 is inserted into the interior of the joining panel 255B-2.

[0124] Here, the joining panel 255B-2, as a joining part substantially inside the evaporation end 201, not only increases its joining force by preventing damage to multiple pores caused by the heat transferred through the brazing bonding method and melting of the pores, but also prevents damage to multiple pores directly participating in the phase change of the liquid - phase refrigerant.

[0125] On the other hand, joining - avoidance cut - out portions 255A-3 and 255B-3 can be formed by cutting on the evaporation section sintered body bases 255A and 255B. The joining - avoidance cut - out portions 255A-3 and 255B-3 are used to avoid joining with the other - side thickness - forming panel 200B - P of the other - side heat - conducting panel 200B.

[0126] The joining - avoidance cut - out portions 255A-3 and 255B-3 as described above are formed by chamfer - cutting the portions where heat is expected to be transferred to the evaporation section sintered body bases 255A and 255B during the application of the filler metal 220 through the filler - metal - coated gap 210 and welding. They not only prevent unnecessary thermal deformation but also function to easily accommodate the other - side thickness - forming panel 200B - P of the other - side heat - conducting panel 200B inserted relative to the one - side heat - conducting panel 200A.

[0127] As above, the heat - dissipation device according to an embodiment of the present invention has been described in detail with reference to the accompanying drawings. However, the embodiments of the present invention are not necessarily limited to the above - mentioned one embodiment. It should be noted that for those of ordinary skill in the art, various modifications and improvements within an equivalent range can be made without departing from the inventive concept of the present invention patent. Therefore, the patent and protection scope of the present invention should be based on the appended claims.

[0128] Industrial Applicability The present invention provides a heat - dissipation device that maximizes heat - dissipation performance and can improve the joining force between panels.

Claims

1. A heat dissipation device, characterized in that, include: One-sided heat-conducting panel; The other heat-conducting panel is joined to the heat-conducting panel on the other side, and a refrigerant flow space is formed between them. The refrigerant flow space is a space for refrigerant to be filled and undergo phase change. as well as The sintered column assembly is arranged in the aforementioned refrigerant flow space. The aforementioned sintered column assembly includes: Multiple sintered column condensers are arranged in the refrigerant flow space at locations corresponding to the condensation ends, where the condensation ends participate in the condensation of the refrigerant through heat exchange with external air (outdoor air); and An evaporation section sintered body base is arranged near the evaporation end of the heating element. The evaporation end is the part in the refrigerant flow space other than the condensation end. The evaporation section sintered body base is connected to at least one of the plurality of condensation section sintered body columns.

2. The heat dissipation device according to claim 1, characterized in that, The aforementioned heat-conducting panel on one side and the heat-conducting panel on the other side are made of the same metallic material with a thermal conductivity of a predetermined value or higher.

3. The heat dissipation device according to claim 1, characterized in that, The aforementioned heat-conducting panel on one side and the heat-conducting panel on the other side are metal sheet components made of stainless steel.

4. The heat dissipation device according to claim 1, characterized in that, The aforementioned heat-conducting panel on one side and the heat-conducting panel on the other side are processed by sheet metal through a stamping die process.

5. The heat dissipation device according to claim 1, characterized in that, The aforementioned sintered body column assembly also includes a sintered body auxiliary base, which is connected to the aforementioned evaporation section sintered body base and is located on the lower side of the aforementioned condensation end, with the direction of gravity as the reference. The lower ends of each of the aforementioned sintered body columns in the condensation section are connected to the aforementioned additional base of the sintered body.

6. The heat dissipation device according to claim 5, characterized in that, When the aforementioned additional base of the sintered body is arranged inclined in the vertical direction along the aforementioned condensation end... The lower end of the aforementioned sintered body additional base avoids the upper end of the aforementioned evaporation section sintered body base, and is grounded to one side of the upper end of the aforementioned evaporation section sintered body base.

7. The heat dissipation device according to claim 6, characterized in that, The upper end of the sintered body base of the evaporation section is located at a position that is at least higher than the inclined lower end of the additional sintered body base, based on the direction of gravity.

8. The heat dissipation device according to claim 1, characterized in that, The lower end of the condenser sintered body column arranged near the evaporator sintered body base of the above-mentioned plurality of condenser sintered body columns is connected to the evaporator sintered body base of the above-mentioned condenser sintered body column.

9. The heat dissipation device according to claim 8, characterized in that, The lower end of the aforementioned condensation section sintered body column avoids the upper end of the aforementioned evaporation section sintered body base and is grounded to one side of the aforementioned evaporation section sintered body base.

10. The heat dissipation device according to claim 9, characterized in that, The lower end of the aforementioned condensation section sintered body column protrudes upward from the upper end of the aforementioned evaporation section sintered body base with respect to the direction of gravity, and is grounded to one side of the upper end of the aforementioned evaporation section sintered body base.

11. The heat dissipation device according to claim 1, characterized in that, The above evaporation section sintered body base is joined in such a manner as to be in surface thermal contact with the above evaporation end portion.

12. The heat dissipation device according to claim 11, wherein the above evaporation section sintered body base is joined to the above evaporation end portion by a brazing method.

13. The heat dissipation device according to claim 11 or claim 12, wherein the above evaporation end portion joined to the above evaporation section sintered body base is set as the inner side surface of the thickness forming panel on the side where the edge end portion of the above one-side heat conducting panel is bent to form the above refrigerant flow space.

14. The heat dissipation device according to claim 13, wherein a joining avoidance cut portion is provided in a chamfered shape on the above evaporation section sintered body base, and the joining avoidance cut portion is used to avoid joining with the other thickness forming panel of the other thickness forming panel bent to be joined to the inner side surface of the thickness forming panel of the above one side.

15. The heat dissipation device according to claim 12, wherein the above evaporation section sintered body base includes: a joining panel, which is formed by bending a panel made of copper material into a "C" - shaped cross section with one side open; and a sintered body foam portion, which is formed by sintering copper material powder inside the above joining panel.

16. The heat dissipation device according to claim 5, wherein in the above sintered body column assembly, the above plurality of condensation section sintered body columns and the above sintered body additional base are formed by sintering metal powder of the same stainless steel material as the metal material constituting the above one-side heat conducting panel and the other-side heat conducting panel.

17. The heat dissipation device according to claim 5, wherein in the above sintered body column assembly, the above evaporation section sintered body base is formed by sintering metal powder of copper material.

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