Parallel flow radiator

Abstract

A fluid-cooled parallel heat sink includes a fluid inlet and a fluid outlet and a cooling chamber defined by a cover and a slot. The fluid-cooled parallel heat sink also includes an intermediate member located within the cooling chamber, where the intermediate member at least partially divides the cooling chamber into an inlet chamber, a fin chamber, and an outlet chamber, and a plurality of fins located in the fin chamber. The slot may include an inlet cavity and an outlet cavity, wherein the cavities are shaped to create a uniform flow rate across the plurality of fins.

Description

Cross-references to related applications

[0001] This application claims priority to U.S. Provisional Patent Application No. 63 / 533,870, filed August 21, 2023, the entire disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] This disclosure relates to a heat sink for dissipating heat from components. More specifically, this disclosure relates to a parallel flow heat sink for cooling semiconductor components. Background Technology

[0003] In the context of heat sinks, there is a need for better heat dissipation, especially for more uniform dissipation of heat from multiple semiconductor components. Traditional fluid-cooled heat sinks, often referred to as series heat sinks, involve fluid flowing in a uniform direction within the heat sink, allowing some semiconductor components to receive heated fluid from other upstream semiconductor components. However, traditional heat sinks fail to provide uniform flow or uniform cooling, resulting in inefficient systems and increased costs. Summary of the Invention

[0004] The apparatus, system, and method disclosed herein have several features, none of which alone is responsible for their desired properties. Without limiting the scope expressed by the claims, their more prominent features will now be briefly discussed. After considering this discussion, and particularly after reading the section entitled "Detailed Description," one will understand how the features of one or more embodiments of the system and method provide several advantages over conventional systems and methods.

[0005] In some aspects, the technology described herein relates to a fluid-cooled parallel radiator comprising: an inlet; an outlet; a cover including multiple component mounting locations; a tank connected to the cover, wherein the tank and the cover structurally form a cooling chamber; an intermediate member located within the cooling chamber; and multiple fins located within the cooling chamber, wherein the intermediate member at least partially divides the cooling chamber into an inlet chamber, a fin chamber, and an outlet chamber, the multiple fins being located within the fin chamber; and wherein a fluid flow path flows from the inlet into the inlet chamber, into the fin chamber, into the outlet chamber, and out through the outlet.

[0006] In some respects, the technology described herein relates to a fluid-cooled parallel radiator in which multiple fins are located between a cover and an intermediate member.

[0007] In some respects, the technology described herein relates to a fluid-cooled parallel radiator, wherein the tank includes an inner wall, and wherein the inner wall at least partially defines an inlet chamber and an outlet chamber, wherein the inlet chamber forms at least a portion of an inlet chamber; and wherein the outlet chamber forms at least a portion of an outlet chamber.

[0008] In some respects, the technology described herein relates to a fluid-cooled parallel radiator, wherein the inlet cavity reduces in volume along the length of the fluid-cooled parallel radiator.

[0009] In some respects, the technology described herein relates to a fluid-cooled parallel radiator, wherein the inlet cavity decreases in width along the length of the fluid-cooled parallel radiator.

[0010] In some respects, the technology described herein relates to a fluid-cooled parallel radiator in which the inlet and outlet chambers are shaped to produce a uniform flow rate across multiple fins.

[0011] In some aspects, the technology described herein relates to a radiator comprising: a cover and a tank that structurally at least partially form a cooling chamber; an intermediate member located within the cooling chamber to partially define an inlet chamber, a fin chamber, and an outlet chamber within the cooling chamber; and a plurality of fins disposed within the fin chamber and in contact with the cover, wherein the dimensions and shapes of the inlet chamber, the fin chamber, and the outlet chamber are configured to allow the flow of fluid through the radiator to uniformly dissipate heat from the plurality of fins.

[0012] In some respects, the technology described herein relates to a radiator in which a tank includes a plurality of tank columns located within a cooling chamber, and wherein the plurality of tank columns are configured to guide the flow of fluid.

[0013] In some respects, the technology described herein relates to a heat sink, wherein a cover includes a cover connection feature and a slot includes a slot connection feature, wherein the cover connection feature has a concave shape and the slot connection feature has a convex shape, wherein the cover connection feature and the slot connection feature are configured to connect the cover and the slot.

[0014] In some respects, the technology described herein relates to a heat sink in which a first fin of a plurality of fins includes a plurality of recesses configured to connect the first fin to a second fin of the plurality of fins.

[0015] In some aspects, the technology described herein relates to a radiator comprising: a cover; a tank, wherein the cover and the tank structurally at least partially form a cooling chamber; an intermediate member located within the cooling chamber; and a plurality of fins located between the intermediate member and the cover, wherein the plurality of fins are configured to dissipate heat from the cover into the fluid as fluid flows across the plurality of fins.

[0016] In some respects, the technology described herein relates to a heat sink in which the cover includes multiple mounting locations, heat is generated from the multiple mounting locations, and heat is dissipated uniformly in the multiple mounting locations.

[0017] In some respects, the technology described herein relates to a heat sink in which each of a plurality of mounting locations accommodates a semiconductor device that generates heat.

[0018] In some respects, the technology described herein relates to a radiator in which a tank includes a plurality of tank columns located within a cooling chamber, and wherein the plurality of tank columns are configured to guide the flow of fluid.

[0019] In some respects, the technology described herein relates to a heat sink, wherein a cover includes a cover connection feature and a slot includes a slot connection feature, wherein the cover connection feature has a concave shape and the slot connection feature has a convex shape, wherein the cover connection feature and the slot connection feature are configured to connect the cover and the slot.

[0020] In some respects, the technology described herein relates to a radiator that further includes a tank-to-cover brazed filler, wherein at least a portion of the tank-to-cover brazed filler is located between the cover connection feature and the tank connection feature.

[0021] In some respects, the technology described herein relates to a heat sink in which a first fin of a plurality of fins includes a plurality of recesses configured to connect the first fin to a second fin of the plurality of fins.

[0022] In some respects, the technology described herein relates to a heat sink in which a first fin includes a first edge and a second edge, wherein the first edge and the second edge are connected to an intermediate member.

[0023] In some respects, the technology described herein relates to a radiator in which a cover, a tank, and an intermediate member at least partially define an inlet chamber, a fin chamber, and an outlet chamber within a cooling chamber, and wherein a plurality of fins are disposed within the fin chamber.

[0024] In some aspects, the technology described herein relates to a radiator that further includes an inlet and an outlet, wherein the inlet is configured to allow fluid flowing into an inlet chamber toward a fin chamber and an outlet chamber, and wherein the outlet is configured to allow fluid to flow out of the outlet chamber. Attached Figure Description

[0025] These and other features, aspects and advantages of this disclosure are described herein with reference to the accompanying drawings of preferred embodiments, which are intended to illustrate and not limit this disclosure.

[0026] Figure 1 This is an exploded perspective view of a parallel heat sink according to an embodiment of the present disclosure.

[0027] Figure 2 This is a cross-sectional view of a parallel heat sink.

[0028] Figure 3 This is a perspective view of the slot of the parallel heat sink.

[0029] Figure 4 This is a view of the cover and multiple fins of a parallel heatsink.

[0030] Figure 5 It is similar to Figure 4 The view differs in that the middle component is placed above multiple fins.

[0031] Figure 6 This is an exploded perspective view of a parallel heat sink.

[0032] Figure 7A This is a view of the top surface of the cover.

[0033] Figure 7B This is a view of the bottom surface of the cover.

[0034] Figure 8A This is a view of the top surface of the tank.

[0035] Figure 8B This is a view of the bottom surface of the tank.

[0036] Figure 9A This is a detailed view of an exemplary component of a parallel heat sink.

[0037] Figure 9B This is a detailed view of an exemplary component of a parallel heat sink.

[0038] Figure 10A This is a view of the brazed packing material of the tank body and cover.

[0039] Figure 10B This is a cross-sectional view of the brazed packing material of the tank body and cover.

[0040] Figure 11 This is a perspective view of the intermediate component.

[0041] Figure 12A This is a view of a single fin element among multiple fins.

[0042] Figure 12B This is another view of a single fin piece with multiple fins.

[0043] Figure 12C This is an end view of a single fin element among multiple fins.

[0044] Figure 13AThis is a view of an exemplary component of a parallel heat sink.

[0045] Figure 13B This is another view of an exemplary component of a parallel heat sink.

[0046] Figure 14A This is a view of traditional heatsink fins.

[0047] Figure 14B This is a view of traditional heatsink fins.

[0048] Figure 15A This is a cross-sectional view seen along the length of the parallel heat sink.

[0049] Figure 15B yes Figure 15A An alternative embodiment of the cross-sectional view seen along the length of the parallel heat sink.

[0050] Figure 15C This is an embodiment of a cross-sectional view of a parallel heat sink.

[0051] Figure 16A It is a top view of the semiconductors arranged in two rows on the cover of a parallel heat sink.

[0052] Figure 16B It is a graph showing the uniform heat dissipation on semiconductors mounted on parallel heat sinks.

[0053] Figure 16C It is a graph that shows the uneven heat dissipation on semiconductors mounted on conventional heat sinks.

[0054] Figure 17A This is a thermal perspective view of a traditional radiator design.

[0055] Figure 17B This is a thermal perspective view of another traditional radiator design.

[0056] Figure 17C This is a thermal perspective view of another traditional radiator design.

[0057] Figure 17D This is a thermal perspective view of another traditional radiator design.

[0058] Figure 18 This is a thermal view of one embodiment of a parallel heat sink. Detailed Implementation

[0059] Generally, one or more aspects of this disclosure relate to a heat sink. More specifically, this disclosure relates to a fluid-cooled heat sink configured to cool semiconductor devices associated with an electric vehicle. The heat sink structures and methods disclosed herein have broad applicability in many products and industries, including automotive, marine, aerospace, and robotics. For ease of description, the heat sinks and methods will be discussed in the context of vehicles, specifically cooling semiconductors within a vehicle. However, the semiconductor structures disclosed herein are not limited to vehicles and are applicable to many industries.

[0060] The radiator disclosed herein is a parallel flow radiator with a two-layer structure. In some embodiments, the parallel flow radiator includes a cover, a tank, and an intermediate member. The cover may be attached to the tank to form a cooling chamber. The intermediate member is located inside the cooling chamber and divides the cooling chamber into an inlet chamber and an outlet chamber. It should be understood that the inlet chamber and the outlet chamber are hydraulically connected, and the intermediate member does not completely separate the inlet chamber from the outlet chamber. When fluid flows into the parallel flow radiator, it enters the inlet chamber. The inlet chamber is configured to provide a uniform flow distribution through each of its smaller fin channels, which may be referred to as microchannels. These smaller fin channels then flow into and are collected by the outlet chamber. Specifically, the outlet chamber may be adjacent to the cover and the tank, and the inlet chamber may be adjacent only to the tank.

[0061] Figure 1 This is an exploded view of an embodiment of a parallel radiator 100, which may also be referred to as a fluid-cooled parallel radiator. The parallel radiator 100 includes at least one inlet 102 and at least one outlet 104. In some embodiments, the radiator 100 is reversible because at least one inlet 102 can serve as an outlet connection pipe, and at least one outlet 104 can serve as an inlet connection pipe.

[0062] In some embodiments, the parallel heat sink 100 includes a cover 200, a tank 300, an intermediate member 400, and a plurality of fins 500. In some embodiments, the cover 200 is connected to the tank 300 to form a sealed cooling chamber 110. In some embodiments, the intermediate member 400 is located within the cooling chamber 110 between the cover 200 and the tank 300. In some embodiments, the intermediate member 400 may be parallel or relatively parallel to the cover 200 and / or the tank 300. In some embodiments, the plurality of fins 500 are located between the intermediate member 400 and the cover 200. The plurality of fins 500 absorb heat from the cover 200 and dissipate heat into the fluid as fluid flows across the plurality of fins 500. In some embodiments, the cover 200, the plurality of fins 500, the intermediate member 400, and the tank 300 are all connected. For example, the cover 200, the plurality of fins 500, the intermediate member 400, and the tank 300 can be connected to dissipate heat from the cover 200 through the heat sink 100. In some embodiments, the cover 200, the plurality of fins 500, the intermediate member 400, and the tank 300 can be connected by brazing, welding, or can be formed into a single unit by additive manufacturing.

[0063] The parallel heat sink 100 is designed to withstand the forces of sintering. Sintering is a process that requires the structure to withstand enormous pressure and heat. In this embodiment, the parallel heat sink 100 is designed to have multiple mounting locations 210 where semiconductors are mounted on the cover 200 via sintering. Sintering creates an excellent thermal bond between the component and the parallel heat sink 100. Furthermore, this thermal bond is more durable. Conventional bonding methods, such as using grease or paste to bond screws, cannot produce the same effect and also have lifespan issues. In addition, conventional structures cannot withstand the heat and strength requirements of sintering.

[0064] Figure 2 yes Figure 1 A cross-sectional view of the parallel heat sink 100. Figure 2 The flow is illustrated in the X and Y directions as shown by arrow 10. It should be understood that the fluid also flows in the Z direction. In some embodiments, the intermediate member 400 divides the cooling chamber 110 into portions that can be characterized as three sub-cavities: an inlet chamber 120, which may also be referred to as the first cavity; a finned chamber 130, which may be referred to as the second cavity; and an outlet chamber 140, which may also be referred to as the third cavity. In some embodiments, fluid enters the parallel radiator 100 via inlet 102 and is configured to flow from inlet chamber 120, through intermediate channel 125 into finned chamber 130, into outlet chamber 140, and out through outlet 104. It should be understood that inlet chamber 120, finned chamber 130, and outlet chamber 140 are not completely separate chambers. These chambers are hydraulically connected, allowing fluid to flow between them.

[0065] Figure 3This is a view of the slot 300 of the parallel heat sink 100. Figure 3 The flow in the Z direction is illustrated as shown by arrow 20. In some embodiments, the tank 300 may include a plurality of tank columns 304 ( Figure 8A The plurality of groove pillars 304 can be configured to guide fluid flow within the inlet chamber 120, or can be used for purely structural purposes, particularly to withstand sintering forces. The number or size of the plurality of groove pillars 304 can be adapted to the sintering load requirements associated with sintering the semiconductor onto the cap 200. Furthermore, the plurality of groove pillars 304 can be elliptical to generate the smallest possible pressure drop in the manifold. The groove 300 may include an inlet cavity 320 and an outlet cavity 340, wherein the inlet cavity 320 at least partially defines the inlet chamber 120, and the outlet cavity 340 at least partially defines the outlet chamber 140. The inlet cavity 320 may be separated from the outlet cavity 340 by an inner wall 302, which may also define at least a portion of the inlet cavity 320 and the outlet cavity 340. The inlet cavity 320 may be configured to generate flow through the intermediate channel 125 ( Figure 2 (As shown) and a uniform flow rate across multiple fins 500 in the fin chamber 130. The inlet 320 can generate a uniform flow rate across multiple fins 500.

[0066] The inlet cavity 320 can be shaped to reduce its volume or width along the length of the parallel radiator 100. The length of the parallel radiator 100 can also be referred to as the Z-axis. The reduction in volume along the length of the inlet cavity 320 results in a reduction in the overall volume of the inlet chamber 120 along the length of the parallel radiator 100. This reduction in volume allows for more uniform pressure within the inlet chamber 120. Thus, the flow velocity exiting the inlet chamber 120 through the intermediate channel 125 and across the multiple fins 500 within the fin chamber 130 is uniform along the length of the parallel radiator 100. Furthermore, the increase in volume along the length of the outlet chamber 140, driven by the shape of the outlet cavity 340, generates uniform pressure along the length of the outlet chamber 140. This uniform pressure also generates uniform flow across the multiple fins 500 due to the absence of pressure buildup. In some embodiments, the unique shapes of the inlet cavity 320 and the outlet cavity 340 produce optimal uniform flow. It should be understood that various shapes and / or inner wall configurations can be used to reduce the volume of the inlet chamber 120 along its length or increase the volume of the outlet chamber 140 along its length. Furthermore, the system can be used in reverse, where the shape will allow for similarly efficient heat dissipation. In some embodiments, the combined radiator 100 produces a lower total pressure loss compared to conventional radiator designs.

[0067] Figure 4 This is a view of some components of the parallel heat sink 100. Figure 4 The flow in the X direction across multiple fins 500 is shown, as indicated by arrow 30. The multiple fins 500 are connected to the cover 200. Figure 4 In the middle, cover 200 is located below multiple fins 500. Figure 4 A trough 300 (not shown) is connected to the visible side of a plurality of fins 500, forcing fluid through the plurality of fins 500. As the fluid leaves the plurality of fins 500, it enters an outlet cavity 340, which at least partially defines an outlet chamber 140.

[0068] Figure 5 yes Figure 4 A view of the intermediate member 400 has been added. The intermediate member 400 is connected to a plurality of fins 500 on the fin side 402. Although not shown, the intermediate member 400 is connected to the tank 300 on the tank side 404. Figure 5 The flow is shown in the Z direction as indicated by arrow 40. However, it should be understood that the flow can be in other directions, such as the Y direction. The fluid leaves the fin chamber 130 and enters the outlet chamber 140. Once the fluid is in the outlet chamber 140, it flows out of the outlet 104.

[0069] Figure 6 This is an exploded view of an embodiment of a parallel heat sink 100. The parallel heat sink 100 may include a cover 200, a channel 300, an intermediate member 400, and a plurality of fins 500. The parallel heat sink 100 may also include an inlet 112 and an outlet 114. The parallel heat sink may also include a first threaded boss 150 and a second threaded boss 152. Components of the parallel heat sink 100 may be connected via brazing, therefore the parallel heat sink 100 may include brazed components 600. Brazed components 600 may include channel-cover brazing filler 610, fin-cover brazing filler 620, boss brazing rings 630, and fitting brazing rings 640.

[0070] Figure 7A This is a view of an embodiment of cover 200. In some embodiments, cover 200 includes a plurality of mounting positions 210 on its top surface 202. The plurality of mounting positions 210 are configured for mounting semiconductors or other components thereon. A parallel heat sink 100 is configured to dissipate heat from these components.

[0071] Figure 7B yes Figure 7A A view of an embodiment of the cover 200 shown. The bottom surface 204 of the cover 200 includes an outer wall 206. The outer wall 206 is configured to connect to the outer tank wall 306 (e.g., Figure 8A(As shown). In some embodiments, the top surface of the outer wall 206 includes a cover connection feature 208. The cover connection feature 208 is configured to connect the cover 200 to the groove 300, and more specifically, to connect the outer groove wall 306 to the outer wall 206. In some embodiments, the cover connection feature 208 may be a groove or a wedge-shaped groove. In some embodiments, the bottom surface 204 of the cover 200 also includes a fin cavity 230. The fin cavity 230 at least partially defines a fin chamber 130.

[0072] Figure 8A This is a view of an embodiment of the tank 300. In some embodiments, the tank 300 includes a plurality of tank pillars 304, an inner wall 302, and an outer tank wall 306. The tank pillars 304 are located on the inner side 308 of the tank 300. The top surfaces of the tank pillars 304 and the top surfaces of the inner wall 302 are configured to connect to an intermediate member 400. In some embodiments, they may be connected to the intermediate member 400 via brazing or some other connection type.

[0073] The tank 300 may also include an inlet 102 and an outlet 104. The top surface of the outer tank wall 306 may also include a tank connection feature 314 (such as...). Figure 9A (As shown). The groove connection feature 314 can be configured to connect the cover 200 to the groove 300, more specifically to connect the outer groove wall 306 to the outer wall 206, and even more specifically to connect the cover connection feature 208 to the groove connection feature 314. The groove connection feature 314 can be a recess or a wedge-shaped groove, wherein the cover connection feature 208 includes a shape opposite to it.

[0074] Figure 8B yes Figure 8A A view of an embodiment of the channel 300 shown. The channel 300 may include a plurality of supports 310 located on the outer side 312 of the channel 300.

[0075] Figure 9A This is a detailed view of the components of the parallel heatsink 100. (See attached image.) Figure 9A As shown, the parallel heat sink 100 may include a single tank-to-cap brazed filler 610 or multiple tank-to-cap brazed fillers 610. The cap 200 includes a cap connection feature 208. In the illustrated embodiment, the cap connection feature 208 has a concave shape. During the brazing process, the tank-to-cap brazed filler 610 melts and forms a pool of material in the cap connection feature 208. The outer tank wall 306 of the tank 300 is then inserted into the pool of material to form a sealing connection. This type of connection may be referred to as a molten pool brazed connection 800. Molten pool brazing allows for strong seals with the ability to accommodate large tolerances. In some embodiments, the molten pool brazed connection 800 can form a seal as long as the tip of the convex outer tank wall 306 contacts the pool of material. Thus, the tolerance range that the system can accommodate is determined by the depth of the concave cap connection feature 208. Figure 9B The brazed connection 800 in the background of the parallel heat sink 100 is shown.

[0076] Figure 10A This is an embodiment of the tank-to-cover brazed filler 610. In some embodiments, the tank-to-cover brazed filler 610 may be shaped to match the geometry of the outer wall 206 and the outer tank wall 306. Figure 10B It also shows Figure 10A The diagram shows a cross-section of the tank-to-cap brazing filler 610. The cross-section of the tank-to-cap brazing filler 610 can be shaped to fit within a concave portion of the cap connection feature 208. Furthermore, the cross-section of the tank-to-cap brazing filler 610 may include a tank retaining connection 612. In some embodiments, the tank retaining connection 612 may be a concave feature configured to receive a convex portion of the tank connection feature 314. The tank retaining connection 612 can help retain, guide, or position the tank 300 during manufacturing, particularly during the brazing process.

[0077] Figure 11 This is an embodiment of the intermediate member 400. In some embodiments, the intermediate member 400 may be a plate. In some embodiments, the intermediate member 400 includes a central slot 410. In some embodiments, the central slot 410 is configured to mate with a slot in the inner wall 302, wherein the central slot 410 may form part of the outlet chamber 140. The dimensions of the intermediate member 400 may be set to withstand sintering forces. Specifically, the thickness of the intermediate member 400 may be based on a minimum thickness capable of distributing sintering compressive forces between the brazed component 600 and the tank body 300 or the plurality of tank body pillars 304.

[0078] Figure 12A , Figure 12B and Figure 12CAn embodiment of a single fin member 510 among multiple fins 500 is illustrated. In this embodiment, a single fin member 510 includes two fins; however, it should be understood that a single fin member 510 may contain a single fin or more than two fins. In some embodiments, these fin members may be between 0.4 mm and 0.6 mm, or between 0.3 mm and 0.7 mm, or between 0.2 mm and 1 mm. In some embodiments, a single fin member 510 may include multiple recesses 520. The multiple recesses 520 may be produced via half-shear stamping. The height of the recesses may determine or set the gap between the fins. The recesses 520 may be connected, contacted, or brazed to adjacent fins. The connection between the recesses 520 and adjacent fin members 510 can be used to reinforce the multiple fins 500 and the overall parallel heatsink structure. This connection between the multiple recesses 520 and the single fin member 510 can also be considered as lateral support. Specifically, when under sintering load, the recesses 520 can be used to increase the compressive strength of the multiple fins 500 and / or the parallel heat sink 100. The multiple recesses 520 can also allow heat to be transferred more efficiently from the multiple fins 500 to the fluid. Figure 13A and Figure 13B An additional embodiment of the parallel heat sink 100 is illustrated, along with the mounting positions of the plurality of fins 500.

[0079] It should also be understood that in some embodiments, the plurality of fins 500 are composed of a single fin element 510. For example... Figure 12C As shown, each of these individual fins includes a first edge 530 and a second edge 540. By giving each individual fin 510 edges 530 and 540, the multiple fins 500 are able to handle higher compressive loads and thus support semiconductor sintering onto the parallel heat sink 100. In some embodiments, each fin 510 forms a mating joint with the intermediate member 400 and the cover 200. Thus, either the first edge 530 or the second edge 540 is connected to the intermediate member 400, while the other edge 530, 540 is also connected to the intermediate member 400. The first edge 530 and the second edge 540 are sintered to their respective joints. This mating joint connection, combined with the connection of multiple recesses 520 to adjacent fins 510, produces an extremely robust structure capable of withstanding the forces associated with sintering the semiconductor onto the cover 200. Figure 14A and Figure 14B A conventional finned structure for use in series or parallel heatsinks is shown. It should be understood that this structure cannot withstand the forces of sintering, as the fins will buckle under load.

[0080] Figure 15A and Figure 15BThe illustration shows a cross-sectional view along the Z-axis of the parallel heatsink 100. In some embodiments, the cover 200 is brazed to a plurality of fins 500. In some embodiments, the plurality of fins 500 are brazed to an intermediate member 400. In some embodiments, the intermediate member 400 is brazed to a tank 300. The cover 200, the plurality of fins 500, the intermediate member 400, and the tank 300 may all be brazed to each other and may collectively form a compressed stack. In some embodiments, these plurality of components are formed into a compressed stack during manufacturing. In some embodiments, it should also be understood that the connection between the outer wall 206 of the cover 200 and the outer tank wall 306 of the tank 300 is not part of the compressed stack. Figure 15C A central component 160 is shown, which may include a plurality of fins 500, an intermediate member 400, and / or a plurality of channel columns 304. Figure 9A and Figure 9B The brazed joint 800 shown can be used to absorb tolerances and allow for higher compression, thereby achieving a better connection between the component and the interface within the cooling chamber 110. For example... Figure 15C As shown, as long as the tank connection feature 314 extends into the cover connection feature 208, the molten pool brazed connection 800 between the cover 200 and the tank 300 can form a sealing connection. Thus, the connection 800 can form a seal with a stack height tolerance of up to 1 mm, 0.8 mm, or 0.6 mm, depending on the embodiment. Although in Figure 15A and Figure 15B Different types of connectors are shown, but it should be understood that they can be used in... Figure 15C The brazed joint of the molten pool is described and shown in the text.

[0081] Figure 16A This is a top view of the semiconductors mounted on the parallel heat sink 100. (Example) Figure 16A As shown, each of the following regions—BL1, BL2, BL3, BL4, BH1, BH2, BH3, BH4, CL1, CL2, CL3, CL4, CH1, CH2, CH3, CH4, AL1, AL2, AL3, AL4, AH1, AH2, AH3, and AH4—can correspond to one of a plurality of mounting positions 210 on the cover 200. In some embodiments, Figure 16A Each mounting location shown can accommodate a semiconductor device (e.g., a semiconductor power switch). Figure 16B It is a graph showing the uniform heat dissipation of semiconductors mounted on the parallel heat sink 100. Figure 16B The temperature distribution shown is uniform across all semiconductor locations. This uniform heat dissipation contrasts with traditional fluid-cooled radiator designs. Figure 16C As shown. Figure 16C The results show that semiconductors located at the end of a conventional heatsink operate at significantly higher temperatures than those closer to the flow initiation point. Figure 17A , Figure 17B , Figure 17C and Figure 17D The illustration shows an embodiment of the thermal characteristics of a conventional fluid-cooled radiator, such as... Figure 16C As shown in the figure, a significant temperature gradient exists on a conventional radiator. This can negatively impact the performance and efficiency of the system (in this case, a vehicle). The entire system is limited because semiconductors or other components cannot be cooled uniformly. Without these limitations, semiconductors or other components are more likely to fail when using a conventional radiator. Figure 18 This is a thermal view of the currently publicly available parallel heatsink 100. Uniform heat dissipation can improve performance and efficiency. This can be achieved directly in the form of semiconductors or by reducing the flow rate of the system, thereby saving energy.

[0082] The foregoing disclosure is not intended to limit this disclosure to the precise form or particular field of use disclosed. Therefore, it is conceivable that various alternative embodiments and / or modifications to this disclosure, whether expressly described or implied herein, are possible. Embodiments of this disclosure have been thus described, and those skilled in the art will recognize that changes in form and detail may be made without departing from the scope of this disclosure. Therefore, this disclosure is limited only by the claims.

[0083] In the foregoing specification, this disclosure has been described with reference to specific embodiments. However, as those skilled in the art will recognize, various embodiments disclosed herein may be modified or implemented in various other ways without departing from the spirit and scope of this disclosure. Therefore, this description is intended to be illustrative and to teach those skilled in the art how to manufacture and use various embodiments of the disclosed parallel heat sink. It should be understood that the forms of disclosure shown and described herein are to be considered representative embodiments. Equivalent elements, materials, processes, or steps may be substituted for those elements, materials, processes, or steps representatively illustrated and described herein. Furthermore, certain features of this disclosure may be utilized independently of the use of other features, as will be apparent to those skilled in the art who benefit from the description of this disclosure. Expressions such as “comprising,” “including,” “incorporated,” “consisting of,” “having,” and “is” used to describe and claim the contents of this disclosure are intended to be interpreted in a non-exclusive manner, allowing for the presence of items, components, or elements not explicitly described. References to the singular should also be interpreted as relating to the plural.

[0084] Furthermore, the various embodiments disclosed herein are for illustrative and explanatory purposes and should in no way be construed as limiting this disclosure. All connecting references (e.g., attachment, fixation, coupling, connection, etc.) are used only to aid the reader in understanding this disclosure and do not impose limitations, particularly regarding the location, orientation, or use of the systems and / or methods disclosed herein. Therefore, any connecting references should be interpreted broadly. Moreover, such connecting references do not necessarily imply that two elements are directly connected to each other. Furthermore, all numerical terms, such as, but not limited to, “first,” “second,” “third,” “primary,” “secondary,” “main,” or any other common and / or numerical terms, should also be considered merely as identifiers to aid the reader in understanding the various elements, embodiments, variations, and / or modifications of this disclosure and should not impose any limitations, particularly regarding the order or preference of any element, embodiment, variation, and / or modification relative to or exceeding another element, embodiment, variation, and / or modification.

[0085] It should also be understood that one or more elements depicted in the figures / graphs may also be implemented in a more separate or more integrated manner, or even removed or rendered inoperable in some cases, which may be useful for a particular application.

Claims

1. A fluid-cooled parallel radiator, comprising: Entrance; exit; The cover includes multiple component mounting locations; A tank body connected to the cover, wherein the tank body and the cover structurally form a cooling chamber; An intermediate component, located within the cooling chamber; as well as Multiple fins, the multiple fins being located within the cooling chamber, The intermediate member at least partially divides the cooling chamber into an inlet chamber, a fin chamber, and an outlet chamber, with the plurality of fins located in the fin chamber; and The fluid flow path is as follows: from the inlet, it flows into the inlet chamber, into the fin chamber, into the outlet chamber, and out of the outlet.

2. The fluid-cooled parallel radiator according to claim 1, wherein the plurality of fins are located between the cover and the intermediate member.

3. The fluid-cooled parallel radiator of claim 1, wherein the tank includes an inner wall, and wherein the inner wall at least partially defines an inlet chamber and an outlet chamber. The inlet oral cavity forms at least a portion of the inlet chamber, and The outlet cavity forms at least a portion of the outlet chamber.

4. The fluid-cooled parallel radiator of claim 3, wherein the inlet cavity decreases in volume along the length of the fluid-cooled parallel radiator.

5. The fluid-cooled parallel radiator of claim 3, wherein the inlet cavity decreases in width along the length of the fluid-cooled parallel radiator.

6. The fluid-cooled parallel radiator of claim 3, wherein the inlet chamber and the outlet chamber are shaped to produce a uniform flow rate across the plurality of fins.

7. A radiator, comprising: A cover and a tank, the cover and the tank structurally forming at least partially a cooling chamber; An intermediate component located within the cooling chamber to partially define an inlet chamber, a fin chamber, and an outlet chamber within the cooling chamber; as well as Multiple fins are placed in the fin chamber and in contact with the cover. The dimensions and shapes of the inlet chamber, the fin chamber, and the outlet chamber are configured to allow the flow of fluid through the radiator to dissipate heat from the plurality of fins evenly.

8. The radiator of claim 7 further includes a plurality of channel pillars located within the cooling chamber, wherein the plurality of channel pillars are configured to structurally support loads from sintering.

9. The radiator of claim 7, wherein the cover includes a first connecting feature and the slot includes a second connecting feature, wherein the first connecting feature has a first curved shape and the second connecting feature has a second curved shape different from the first curved shape, and wherein the first connecting feature and the second connecting feature are configured to connect the cover and the slot during assembly.

10. The heat sink of claim 7, wherein the first fin of the plurality of fins includes a plurality of recesses configured to connect the first fin to a second fin of the plurality of fins.

11. A radiator, comprising: build; A tank, wherein the cover and the tank structurally at least partially form a cooling chamber; An intermediate component, located within the cooling chamber; as well as Multiple fins are located between the intermediate member and the cover. The plurality of fins are configured to dissipate heat from the cover into the fluid as the fluid flows across the plurality of fins.

12. The radiator of claim 11, wherein the cover includes a plurality of mounting locations, wherein the heat originates from the plurality of mounting locations, and wherein the heat is uniformly dissipated in the plurality of mounting locations.

13. The heat sink of claim 12, wherein each of the plurality of mounting locations accommodates a semiconductor device that generates the heat.

14. The radiator of claim 11, wherein the tank comprises a plurality of columns located within the cooling chamber, and wherein the plurality of columns are configured to structurally support loads from sintering.

15. The radiator of claim 11, wherein the cover includes a first connecting feature and the slot includes a second connecting feature, wherein the first connecting feature has a first curved shape and the second connecting feature has a second curved shape different from the first curved shape, and wherein the first connecting feature and the second connecting feature are configured to connect the cover and the slot during assembly.

16. The radiator of claim 15 further includes brazing filler, wherein at least a portion of the brazing filler is located between the first connection feature and the second connection feature.

17. The heat sink of claim 11, wherein the first fin of the plurality of fins includes a plurality of recesses configured to connect the first fin to a second fin of the plurality of fins.

18. The heat sink of claim 17, wherein the first fin includes a first edge and a second edge, and wherein the first edge and the second edge are connected to the intermediate member.

19. The radiator of claim 11, wherein the cover, the slot and the intermediate member at least partially define an inlet chamber, a fin chamber and an outlet chamber within the cooling chamber, and wherein the plurality of fins are disposed within the fin chamber.

20. The radiator of claim 19, further comprising an inlet and an outlet, wherein the inlet is configured to allow the fluid flowing into the inlet chamber to flow toward the fin chamber and the outlet chamber, and wherein the outlet is configured to allow the fluid to flow out of the outlet chamber.

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