Electronic equipment, board structure thereof and preparation method of board structure

Abstract

The invention relates to the technical field of electronic products, in particular to electronic equipment, a board structure thereof and a preparation method of the board structure. The electronic equipment comprises a shell and an electronic device, wherein the electronic device is mounted in the shell; the shell comprises a plate structure, the plate structure comprises a conductive layer and a fiberboard layer, the fiberboard layer comprises a resin layer and at least one fiber layer immersed in the resin layer, and the conductive layer is embedded in the fiberboard layer; the board structure of the electronic equipment comprises a conductive layer and a fiberboard layer, the fiberboard layer comprises a resin layer and at least one fiber layer immersed in the resin layer, and the conductive layer is embedded in the fiberboard layer; the strength of the fiberboard layer of the board structure can be improved through the at least one fiber layer immersed in the resin layer, so that a larger mounting space can be reserved for conductive layers such as an antenna on the fiberboard layer; the conductive layer is embedded in the fiberboard layer, so that the space utilization rate of the conductive layer to the interior of the fiberboard layer is improved, and the available space of the conductive layer is increased.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, and in particular to an electronic device and its board structure, and a method for preparing the board structure. Background Technology

[0002] For electronic devices such as mobile phones and tablets, the antennas of these devices are usually attached to the surface of the back cover or other plate structures.

[0003] As electronic devices become thinner, the space available for antennas in the thickness direction of the electronic device decreases, given that electronic components such as batteries, speakers, and microphones occupy a certain height. Summary of the Invention

[0004] This application provides an electronic device and its board structure, as well as a method for fabricating the board structure, which is beneficial to increasing the usable space of conductive layers such as antennas.

[0005] In a first aspect, this application provides an electronic device, the electronic device including a housing and electronic components, the electronic components being mounted on the housing; the housing including a plate structure, the plate structure including a conductive layer and a fiberboard layer, the fiberboard layer including a resin layer and at least one fiber layer impregnated in the resin layer, the conductive layer being embedded in the fiberboard layer.

[0006] By configuring the board structure of the electronic device to include a conductive layer and a fiberboard layer, wherein the fiberboard layer includes a resin layer and at least one fiber layer impregnated within the resin layer, and the conductive layer is embedded in the fiberboard layer; the fiberboard layer of the board structure can improve its strength through the at least one fiber layer impregnated within the resin layer, thereby allowing for a larger installation space for conductive layers such as antennas in the fiberboard layer; the embedded conductive layer in the fiberboard layer improves the utilization rate of the conductive layer within the fiberboard layer and increases the usable space of the conductive layer.

[0007] In one possible implementation, the fiber layer includes a first filament layer and a second filament layer that are layered along the thickness direction of the plate structure, and at least a portion of the area between adjacent first filament layers and second filament layers is provided with the resin layer, and the conductive layer is embedded in the resin layer on one side of the first filament layer.

[0008] In another possible implementation, the conductive layer is embedded in the resin layer between adjacent first filament layers and second filament layers, wherein the first filament layer, the conductive layer, and the second filament layer are sequentially layered; the first filament layer includes a first fiber bundle extending along a first direction, and the second filament layer includes a second fiber bundle extending along a second direction, wherein the first direction and the second direction intersect; along the thickness direction of the plate structure, the first fiber bundle, the conductive layer, and the second fiber bundle are sequentially layered.

[0009] In another possible implementation, the thickness of at least a portion of the first fiber bundle closest to one side of the conductive layer is less than the thickness of the first fiber bundle closest to the other side of the conductive layer.

[0010] In another possible implementation, the first filament layer consists of at least one bundle of the first fibers, and the second filament layer consists of at least one bundle of the second fibers; the thickness of at least a portion of the first filament layer closest to one side of the conductive layer is less than the thickness of the first filament layer closest to the other side of the conductive layer.

[0011] In another possible implementation, the fiber layer includes a first filament layer, the first filament layer including a first fiber bundle extending along a first direction; the conductive layer includes a first conductive filament extending along the first direction, the first conductive filament being at least partially embedded in the first filament layer, and the first conductive filament and at least a portion of the first fiber bundle being arranged side by side.

[0012] In another possible implementation, the first fiber bundle includes at least one first fiber filament extending along the first direction, the first conductive filament being provided along at least one side of the plate plane of the plate structure, and the first conductive filament being provided along at least one side of the plate thickness direction of the plate structure.

[0013] In another possible implementation, the first fiber bundle includes at least two first fiber filaments extending along the first direction, the diameter of the first conductive filament is larger than the diameter of the first fiber filament, and at least two first fiber filaments arranged along the thickness direction of the plate structure are provided on the side of the first conductive filament along the plate plane of the plate structure.

[0014] In another possible implementation, the first filament layer is composed of the first fiber bundle; the fiber layer further includes a second filament layer, which is composed of a second fiber bundle extending along a second direction, the first direction intersecting the second direction; the first filament layer and the second filament layer are layered along the thickness direction of the plate structure.

[0015] In another possible implementation, the first filament layer further includes a second fiber bundle, wherein the first fiber bundle of the first filament layer and the second fiber bundle of the first filament layer are interwoven.

[0016] In another possible implementation, the fiber layer includes a first filament layer and a second filament layer. The first filament layer includes a first fiber bundle extending along a first direction, and the second filament layer includes a second fiber bundle extending along a second direction. The first direction and the second direction intersect. The conductive layer includes a second conductive filament. The first fiber bundle, a portion of the second conductive filament, and the second fiber bundle are sequentially arranged in layers. Another portion of the second conductive filament passes through a hole formed by the intersection of the first fiber bundle and the second fiber bundle.

[0017] In another possible implementation, the second conductive filament includes a first conductive segment and a second conductive segment, the extension directions of the first conductive segment and the second conductive segment being parallel to the plane of the plate structure, and the first conductive segment and the second conductive segment being respectively disposed on both sides of one of the first filament layers or on both sides of one of the second filament layers.

[0018] In another possible implementation, the projection is made along the thickness direction of the plate structure, and the first conductive segment and the second conductive segment are at least partially offset.

[0019] In another possible implementation, the first conductive segment and the second conductive segment are projected along the thickness direction of the plate structure, and are arranged parallel to each other and at least partially spaced apart, or the first conductive segment and the second conductive segment have an angle between them.

[0020] In another possible implementation, the first conductive filament of the conductive layer includes a bent section that extends at least outward to the surface of the fiber layer.

[0021] In another possible implementation, the surface of the fiber layers is provided with a metal layer, and the bent section is connected to the metal layer.

[0022] In another possible implementation, the bent section extends at least outward to the surface of the plate structure, the surface of which is provided with a covering layer that covers the end of the bent section.

[0023] In another possible implementation, the fiberboard layer has a connection recess, and a connection conductor is provided in the connection recess, the connection conductor being connected to the conductive layer.

[0024] In another possible implementation, the depth of the connecting recess is set along the thickness direction of the plate structure, and at least a portion of the depth of the connecting recess is arranged side by side with and independently of the fiber filaments of the fiber layer.

[0025] Secondly, this application provides a board structure applied to electronic devices. The board structure includes a conductive layer and a fiberboard layer. The fiberboard layer includes a resin layer and at least one fiber layer immersed in the resin layer. The conductive layer is embedded in the fiberboard layer.

[0026] Thirdly, this application provides a method for preparing a plate structure, the method comprising the following steps: At least one layer of fiber is impregnated with resin to form a fiberboard layer; The conductive layer is embedded in the fiberboard layer; The fiberboard layers are pressed together to form a board structure.

[0027] In one possible implementation, the step of forming a fiberboard layer by impregnating at least one layer of fiber with resin includes: impregnating the fiber structure with resin to form at least one layer of fiberboard; The step of embedding a conductive layer in a fiberboard layer includes: after the step of impregnating a fiber structure with resin to form at least one fiberboard layer, disposing at least a portion of the conductive layer on one side of one of the fiberboard layers. The step of pressing fiberboard layers to form a board structure includes: after the step of disposing at least a portion of a conductive layer on one side of one of the fiberboard layers, pressing the conductive layer and all the fiberboard layers together to form a board structure.

[0028] In another possible implementation, the conductive layer includes a first conductive filament extending along a first direction, and the step of embedding the conductive layer in the fiberboard layer includes: arranging at least a portion of the first conductive filament alongside a first fiber bundle of fiber layers; After the step of arranging at least a portion of the first conductive wire and the first fiber bundle of fiber layers side by side, the step of impregnating at least one layer of fiber layers with resin to form a fiberboard layer is performed.

[0029] In another possible implementation, the step of forming a fiberboard layer by impregnating at least one layer of fibers with resin includes: The fiber bundles, which have at least one layer of fiber, intersect to form holes; The conductive layer includes a second conductive filament, and the step of embedding the conductive layer in the fiberboard layer includes: The second conductive wire is then passed through the hole.

[0030] In another possible implementation, prior to the step of pressing the fiberboard layers to form the board structure, the preparation method further includes the following steps: Through holes are formed in the pores formed by the intersection of fiber bundles in at least one layer of fiberboard; The preparation method further includes the following steps: A connecting conductor is formed within the through-hole, and the connecting conductor is connected to the conductive layer. Attached Figure Description

[0031] Figure 1 A schematic diagram of the structure of an embodiment of the electronic device provided in this application; Figure 2 A schematic diagram of the manufacturing process of an embodiment of the plate structure provided in this application; Figure 3 This is a schematic diagram of the manufacturing process of another embodiment of the plate structure provided in this application; Figure 4 A schematic diagram of the manufacturing process of a partial structure of another embodiment of the plate structure provided in this application; Figure 5 A schematic diagram of the manufacturing process of a partial structure of another embodiment of the plate structure provided in this application; Figure 6 A schematic diagram of the manufacturing process of a partial structure of another embodiment of the plate structure provided in this application; Figure 7 A cross-sectional schematic diagram of an embodiment of the plate structure provided in this application; Figure 8 A schematic diagram of the front view of an embodiment of the plate structure provided in this application; Figure 9 A cross-sectional schematic diagram of another embodiment of the plate structure provided in this application; Figure 10 A schematic diagram of another embodiment of the plate structure provided in this application, viewed from the front. Figure 11 A cross-sectional schematic diagram of another embodiment of the plate structure provided in this application; Figure 12 A schematic diagram of another embodiment of the plate structure provided in this application, viewed from the front. Figure 13 A cross-sectional schematic diagram of another embodiment of the plate structure provided in this application; Figure 14 A cross-sectional schematic diagram of another embodiment of the plate structure provided in this application; Figure 15 A cross-sectional schematic diagram of another embodiment of the plate structure provided in this application; Figure 16 A cross-sectional schematic diagram of another embodiment of the plate structure provided in this application; Figure 17 A cross-sectional schematic diagram of another embodiment of the plate structure provided in this application; Figure 18 A cross-sectional schematic diagram of another embodiment of the plate structure provided in this application; Figure 19 A cross-sectional schematic diagram of another embodiment of the plate structure provided in this application; Figure 20 This is a three-dimensional schematic diagram of a partial structure of another embodiment of the plate structure provided in this application. Detailed Implementation

[0032] The terms "first," "second," and "third," etc., used in this application specification, claims, and drawings are used to distinguish different objects, not to limit a specific order.

[0033] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0034] For electronic devices such as mobile phones and tablets, the antennas of these devices are usually attached to the surface of the back cover or other plate structures.

[0035] As electronic devices become thinner, the space available for antennas in the thickness direction of the electronic device decreases, given that electronic components such as batteries, speakers, and microphones occupy a certain height.

[0036] Therefore, this application provides an electronic device and its board structure, as well as a method for fabricating the board structure, to increase the usable space of conductive layers such as antennas. The electronic device provided in this application can include, but is not limited to, mobile phones, tablets, laptops, PCs (Personal Computers), UltraMobile Personal Computers (UMPCs), handheld computers, walkie-talkies, netbooks, POS machines, Personal Digital Assistants (PDAs), wearable devices, security equipment, televisions, and speakers, etc., as mobile or fixed terminals. Mobile phones can include candybar phones and foldable phones, etc., and wearable devices can include VR glasses (Virtual Reality), smart glasses, headphones, smartwatches, and smart bracelets, etc. The embodiments of this application are mainly described using mobile phones as an example. Without obvious conflict, the following structure can also be applied to other electronic devices besides mobile phones.

[0037] Figure 1 A schematic diagram of an electronic device 100 according to one embodiment of this application is shown. The electronic device 100 includes a housing and electronic components, including a battery, a speaker, a microphone, etc., which are mounted on the housing. The housing may include a mid-frame and a back cover. When the electronic device has a display function, it may also include a screen. A mid-frame and electronic components such as a circuit board, battery, camera module, and USB device may be disposed between the screen and the back cover. The housing includes the mid-frame. The mid-frame serves as a mounting frame for the electronic device, and the circuit board, battery, camera module, USB device, speaker, etc., can be mounted on the mid-frame.

[0038] Furthermore, in the electronic device 100 provided in this application embodiment, the device circuit board may also include electronic components such as a main device circuit board and a secondary device circuit board. The main device circuit board may be used to integrate a control chip, which may be configured as an application processor (AP). In some embodiments, the main device circuit board may be electrically connected to a screen, and the main device circuit board may be used to control the screen to display images or videos. The secondary device circuit board may be used to connect electronic components such as antennas (e.g., 5G antennas) and radio frequency front-ends. The secondary device circuit board may also be electrically connected to the main device circuit board through an electrical connection structure to realize data and signal transmission between the secondary device circuit board and the main device circuit board. The electrical connection structure may be a flexible printed circuit (FPC), a wire, or an enameled wire, etc.

[0039] The speaker can be electrically connected to the device's secondary circuit board to receive electrical signals used to generate sound and emit sound. At this time, the audio signal type electrical signal sent by the device's main circuit board is transmitted to the speaker via the secondary circuit board and converted into sound waves by the speaker for output, specifically through the sound outlet on the housing.

[0040] Reference Figure 1 and Figure 2 The housing of the electronic device 100 includes a plate structure 101, which can be configured as a cover plate (e.g., a back cover closer to the battery) of the electronic device 100, a decorative plate connected to the cover plate of the electronic device, a screen back plate, etc. It is understood that the plate structure 101 can be a part or all of the cover plate, decorative plate, and screen back plate. The plate structure 101 includes a conductive layer 200 and a fiberboard layer. The conductive layer 200 can be understood as a generally layered structure capable of conducting electrical signals, such as the metal foil of an antenna or the wiring of an NFC coil (NFC, Near Field Communication). The fiberboard layer can be understood as an integrally plate-like structure including fibers; wherein, the fiberboard layer includes a resin layer 310 and at least one fiber layer 320 impregnated within the resin layer 310, and the fiber layer can be understood as an integrally layered structure including fibers. The conductive layer 200 is embedded in the fiberboard layer, including the conductive layer 200 embedded in the resin layer 310 and the fiber layer 320, and the conductive layer 200 being divided into two parts and embedded in the resin layer 310 and the fiber layer 320 respectively. Furthermore, the conductive layer 200 is embedded in the fiberboard layer in several ways, including the conductive layer 200 being entirely embedded within the fiberboard layer, and the conductive layer 200 having a portion embedded within the fiberboard layer and another portion extending out of the fiberboard layer. This embodiment does not impose any limitations on this.

[0041] In this embodiment, by configuring the board structure 101 of the electronic device 100 to include a conductive layer 200 and a fiberboard layer, the fiberboard layer includes a resin layer 310 and at least one fiber layer 320 impregnated in the resin layer 310, and the conductive layer 200 is embedded in the fiberboard layer; the fiberboard layer of the board structure 101 can be strengthened by the at least one fiber layer 320 impregnated in the resin layer 310, thereby allowing for a larger installation space for the conductive layer 200 such as the antenna in the fiberboard layer; the conductive layer 200 is embedded in the fiberboard layer, which improves the space utilization rate of the conductive layer 200 within the fiberboard layer and increases the usable space of the conductive layer 200.

[0042] Based on the embodiments of the electronic device 100 and the board structure 101, this application also provides a method for fabricating the board structure 101, the method comprising the following steps: At least one fiber layer 320 is impregnated with resin to form a fiberboard layer, such that the formed fiberboard layer includes a resin layer 310 and at least one fiber layer 320 impregnated in the resin layer 310.

[0043] The conductive layer 200 is embedded in the fiberboard layer; it is understood that this step can be performed after the resin impregnation step in the previous paragraph, or it can be performed before the resin impregnation step in the previous paragraph, and this embodiment does not limit this.

[0044] The fiberboard layer is pressed together to form the board structure 101. Specifically, the fiberboard layer can be placed in a hot press mold and pressed together through a hot pressing process to form the board structure 101.

[0045] In some implementations, refer to Figure 2 or Figure 3 The fiber layer 320 includes a first fiber layer and a second fiber layer arranged in layers along the thickness direction of the board structure 101. This can be understood as the fiberboard layer comprising at least two layers of fiber layers 320, with some layers being the first fiber layer and others the second fiber layer. The first fiber layer may include a first fiber bundle 321 extending along a first direction, and the second fiber layer may include a second fiber bundle 322 extending along a second direction, where the first and second directions intersect. It is understood that the first and second directions may be perpendicular, and the angle between them may be greater than 0 degrees and less than 90 degrees, for example, 30 degrees, 45 degrees, or 60 degrees. Furthermore, the first fiber bundle 321 and the second fiber bundle 322 may each include at least one fiber filament; that is, the first fiber bundle 321 and the second fiber bundle 322 can be understood as bundle-like structures formed by the aggregation of fiber filaments.

[0046] In this configuration, at least a portion of the area between adjacent first and second filament layers is provided with a resin layer 310, thereby achieving the connection and fixation of the first and second filament layers. This connection and fixation can be achieved by fusing the first and second filament layers, as well as the resin layer between them, through a hot-pressing process. It is understood that the conductive layer 200 can be embedded in the resin layer 310 on one side of the first filament layer. For example, refer to... Figure 2 The conductive layer 200 is embedded in the resin layer 310 between adjacent first filament layers (e.g., including first fiber bundle 321) and second filament layers (e.g., including second fiber bundle 322). Along the thickness direction of the plate structure 101, the first filament layer, the conductive layer 200 and the second filament layer are arranged in sequence. Specifically, it can be configured such that along the thickness direction of the plate structure 101, the first fiber bundle 321, the conductive layer 200 and the second fiber bundle 322 are arranged in sequence.

[0047] Of course, refer to Figure 3 The conductive layer 200 can also be embedded on the outermost first filament layer, for example, embedded in... Figure 3 The uppermost first filament layer (corresponding to the uppermost fiber layer 320) is located above this layer. It is understood that in this embodiment, the first filament layer consists of at least one bundle of first fibers 321, meaning the first filament layer can be configured to include only the first fiber bundle 321 extending along the first direction. Alternatively, the first filament layer may also include the second fiber bundle 322, and the first fiber bundle 321 and the second fiber bundle 322 of the first filament layer can be interwoven. Furthermore, the second filament layer can consist of at least one bundle of second fibers 322, meaning the second filament layer can be configured to include only the second fiber bundle 322 extending along the second direction. Alternatively, the second filament layer may also include the first fiber bundle 321, and the first fiber bundle 321 and the second fiber bundle 322 of the second filament layer can be interwoven.

[0048] Based on the embodiments of the electronic device 100 and the board structure 101, the step of forming a fiberboard layer by impregnating at least one layer of fiber layer 320 with resin in the preparation method of the board structure 101 includes: impregnating the fiber structure with resin to form at least one layer of fiberboard layer, for example, impregnating the first fiber bundle 321 independently with resin to form at least one layer of fiberboard layer, or impregnating the second fiber bundle 322 independently with resin to form at least one layer of fiberboard layer, or impregnating the interwoven first fiber bundle 321 and second fiber bundle 322 with resin to form at least one layer of fiberboard layer.

[0049] The step of embedding the conductive layer 200 in the fiberboard layer includes: after the step of impregnating the fiber structure with resin to form at least one fiberboard layer, disposing at least a portion of the conductive layer 200 on one side of one of the fiberboard layers, for example, embedding it in the resin layer 310 between adjacent first filament layers (e.g., the first filament layer includes a first fiber bundle 321) and second filament layers (e.g., the second filament layer includes a second fiber bundle 322), or embedding it on the outer side of the outermost first filament layer.

[0050] The step of pressing fiberboard layers to form a board structure 101 includes: after the step of disposing at least a portion of the conductive layer 200 on one side of one of the fiberboard layers, pressing the conductive layer 200 and all the fiberboard layers together to form the board structure 101.

[0051] In the above embodiments, the conductive layer 200 is embedded in the resin layer 310 on one side of the first filament layer. The conductive layer 200 can be easily embedded in the resin layer 310, reducing the manufacturing difficulty of the corresponding board structure 101 and electronic device 100. In the embodiment where the first filament layer is composed of at least one bundle of first fiber 321 and the second filament layer is composed of at least one bundle of second fiber 322, the layer where the first fiber bundle 321 is located is relatively flat, and the layer where the second fiber bundle 322 is located is relatively flat, which is beneficial to improving the density of the fiber layer 320 and further increasing the usable space for the conductive layer 200. In addition, the fiber layer 320 can be formed by laminating the first fiber bundle 321 and the second fiber bundle 322.

[0052] In some embodiments, the thickness of at least a portion of the first fiber bundle 321 nearest to one side of the conductive layer 200 is less than the thickness of the first fiber bundle 321 nearest to the other side of the conductive layer 200, for example, referring to... Figure 2 The thickness h1 of the layer containing the nearest first fiber bundle 321 to the lower side of the conductive layer 200 is less than the thickness h2 of the layer containing the nearest first fiber bundle 321 to the upper side of the conductive layer 200. It is understood that the thickness of the layer containing the nearest first fiber bundle 321 to one side of the conductive layer 200 can be set to be less than the thickness of the nearest first fiber bundle 321 to the other side of the conductive layer 200 in a partial or complete area; furthermore, the layer containing the first fiber bundle 321 can include only the first fiber bundle 321, or it can include interwoven first fiber bundles 321 and second fiber bundles 322. In embodiments where the first filament layer consists of at least one bundle of first fiber bundles 321 and the second filament layer consists of at least one bundle of second fiber bundles 322, the board structure 101 and the electronic device 100 can also be configured such that the thickness h1 of at least a portion of the first filament layer to one side of the conductive layer 200 is less than the thickness h2 of the nearest first filament layer to the other side of the conductive layer 200.

[0053] In this embodiment, the board structure 101 and the electronic device 100 can provide greater structural strength through the layer containing the thicker first fiber bundle 321, and provide greater installation space for the conductive layer 200 through the layer containing the thinner first fiber bundle 321. Thus, the overall structural strength of the board structure 101 is improved at the same time, and the usable space of the conductive layer 200 is increased.

[0054] It is understood that the conductive layer 200 can be coupled and fed to transmit electrical signals. Of course, in some embodiments, refer to... Figure 3 and Figure 4 , Figure 5 , Figure 6The fiberboard layer may have a connecting recess 301, which may penetrate the corresponding layer (the layer may be fiber layer 320 or board structure 101), or it may not penetrate the corresponding layer. Furthermore, the connecting recess 301 may be formed by drilling or hot-melt processing. A connecting conductor 302 is provided within the connecting recess 301, and the connecting conductor 302 is connected to the conductive layer 200. It is understood that the connecting conductor 302 may be set into the connecting recess 301 by electroplating, embedding, or other methods. Furthermore, the connecting conductor 302 includes, but is not limited to, metal needles, metal pillars, and metal clips, and the connecting conductor 302 may be made of silver, copper, or other metal materials.

[0055] in Figure 4 , Figure 5 , Figure 6 The following are schematic diagrams illustrating the manufacturing process of partial structures of the plate structure 101 in various embodiments. The conductive layer 200 can be arranged side by side with the fiber layer 320 along the plane of the plate structure 101, or it can be arranged side by side with the fiber layer 320 along the thickness direction of the plate structure 101. This embodiment does not impose any limitations on this. When the conductive layer 200 is disposed on the outer surface, the conductive layer 200 and the connecting conductor 302 can be electrically connected by means of welding or the like.

[0056] In this embodiment, the electronic device 100 can achieve direct-feed electrical connection by connecting conductor 302, such as electrical connection with conductive terminals such as springs and probes on external electrical connection structures such as PCB (Printed Circuit Board) and FPC (Flexible Printed Circuit), thereby improving the ease of use of the board structure 101.

[0057] In some implementations, refer to Figure 4 , Figure 5 or Figure 6 The depth of the connecting recess 301 is set along the thickness direction of the plate structure 101. At least a portion of the depth of the connecting recess 301 is segmented and arranged parallel to and independent of the fiber filaments of the fiber layer 320, for example, arranged parallel to each other along the plane of the plate structure 101. The fact that at least a portion of the depth of the connecting recess 301 is independent of the fiber filaments of the fiber layer 320 can be understood as ensuring that when the connecting recess 301 is formed by drilling or other methods, the processing can avoid damaging the fiber filaments, or that the fiber filaments avoid the connecting recess 301. For example, projected along the thickness direction of the plate structure 101, the connecting recess 301 can be located within a hole formed by the intersection of the first fiber bundle 321 and the second fiber bundle 322.

[0058] Based on this embodiment, in some embodiments of the method for preparing the above-mentioned board structure 101, before the step of forming the board structure 101 by pressing the fiberboard layers, the preparation method further includes the following steps: On at least one fiberboard layer, through holes are formed within the pores formed by the intersection of fiber bundles in fiber layer 320.

[0059] The above preparation method also includes the following steps: A connecting conductor 302 is formed inside the through hole, and the connecting conductor 302 is connected to the conductive layer 200.

[0060] In this embodiment, the connecting recess 301 can improve space utilization through the holes formed by the intersecting fiber filaments, and reduce the loss of conductive signals to the conductive layer 200 by avoiding damage to the fiber filaments, thereby improving the conductive signal transmission capability of the plate structure 101.

[0061] It is understandable that, in the absence of obvious contradictions, the connecting recess 301, the connecting conductor 302, and the corresponding preparation method can also be applied to the plate structure 101 and preparation method in other embodiments.

[0062] In some implementations, refer to Figure 7 and Figure 8 ,in Figure 7 A cross-sectional schematic diagram of the plate structure 101 in this embodiment is shown. Figure 8 A schematic diagram of the plate structure 101 in this embodiment is shown in the front view direction; wherein, the fiber layer 320 includes a first filament layer, and the first filament layer includes a first fiber bundle 321 extending along a first direction; Figure 7 and Figure 8 The first filament layer is composed of a first fiber bundle 321. Of course, the first filament layer can also be configured to include interwoven first fiber bundles 321 and second fiber bundles 322, and this embodiment is not limited in this respect. In addition, the conductive layer 200 includes a first conductive wire 210 extending along a first direction. The first conductive wire 210 is at least partially embedded in the first filament layer, and the first conductive wire 210 and at least a portion of the first fiber bundle 321 are arranged side by side. For example, the first conductive wire 210 and at least a portion of the first fiber bundle 321 are arranged side by side along the plate plane of the plate structure 101, or the first conductive wire 210 and at least a portion of the first fiber bundle 321 are arranged side by side along the plate thickness direction of the plate structure 101.

[0063] Among them, reference Figure 7 and Figure 8In the case where the fiber layer 320 includes a second filament layer and the second filament layer includes the aforementioned second fiber bundle 322 extending along a second direction, it can be configured such that in a single-layer first filament layer, the first conductive wire 210 and at least a portion of the first fiber bundle 321 are arranged side by side along the plate plane of the plate structure 101.

[0064] Of course, refer to Figure 9 and Figure 10 In the case where the fiber layer 320 includes a second filament layer and the second filament layer includes the aforementioned second fiber bundle 322 extending along a second direction, it can be configured such that in at least two first filament layers, the first conductive wire 210 and at least a portion of the first fiber bundle 321 are arranged side by side along the plate plane of the plate structure 101.

[0065] In addition, refer to Figure 11 and Figure 12 In the case where the fiber layer 320 includes a second filament layer, and the second filament layer includes the aforementioned second fiber bundles 322 extending along a second direction, it can be configured such that in at least one first filament layer, the first conductive filament 210 and at least a portion of the first fiber bundles 321 are arranged side-by-side along the plane of the plate structure 101; and in at least one second filament layer, the first conductive filament 210 and at least a portion of the second fiber bundles 322 are arranged side-by-side along the plane of the plate structure 101. It can be understood that the conductive layer 200 includes first conductive filaments 210 extending along the aforementioned first direction and first conductive filaments 210 extending along the aforementioned second direction. In this embodiment, the second filament layer can be composed of second fiber bundles 322, or it can be configured to include interwoven first fiber bundles 321 and second fiber bundles 322.

[0066] In some further embodiments, the first filament layer may be composed of a first fiber bundle 321, which can be understood as the first filament layer only including the first fiber bundle 321 extending along the first direction; the fiber layer 320 also includes a second filament layer, which is composed of a second fiber bundle 322 extending along a second direction. The first direction and the second direction intersect, which can be understood as the second filament layer only including the second fiber bundle 322 extending along the second direction; when the first conductive wire 210 and at least a portion of the first fiber bundle 321 are arranged side by side, the first filament layer and the second filament layer are arranged in layers along the thickness direction of the plate structure 101.

[0067] In some further embodiments, when the first conductive filament 210 is arranged side by side with at least a portion of the first fiber bundle 321, the first filament layer further includes a second fiber bundle 322, wherein the first fiber bundle 321 and the second fiber bundle 322 of the first filament layer are interwoven with each other.

[0068] Based on the above-described embodiment in which the first conductive wire 210 and at least a portion of the first fiber bundle 321 are arranged side by side, in some embodiments of the method for preparing the above-described plate structure 101, the step of embedding the conductive layer 200 in the fiberboard layer includes: arranging at least a portion of the first conductive wire 210 and the first fiber bundle 321 of the fiber layer 320 side by side. In the case where the first filament layer includes interwoven first fiber bundles 321 and second fiber bundles 322 (and further, the second filament layer may include interwoven first fiber bundles 321 and second fiber bundles 322), the first conductive wire 210 can be arranged side by side with the first fiber bundle 321, and then interwoven with the second fiber bundle 322, thereby fixing the side-by-side first conductive wire 210 and first fiber bundle 321 by the interweaving of the second fiber bundle 322; in the case where the first filament layer is composed of the first fiber bundle 321 (and further, the second filament layer may be composed of the second fiber bundle 322), the first conductive wire 210 and first fiber bundle 321 can be arranged side by side, and then the following steps of forming a fiberboard layer by resin impregnation can be performed, followed by hot pressing and other pressing steps.

[0069] After the step of arranging at least a portion of the first conductive wire 210 and the first fiber bundle 321 of the fiber layer 320 side by side, the step of impregnating at least one layer of fiber layer 320 with resin to form a fiberboard layer is performed.

[0070] In the embodiments of the above-mentioned board structure 101, electronic device 100, and the method for preparing board structure 101, the first conductive wire 210 is arranged side by side with at least a portion of the first fiber bundle 321. The first conductive wire 210 can improve its positional stability through the first fiber bundle 321, and can further improve its positional stability through the interwoven second fiber bundle 322. This is conducive to the formation of a stable electrical connection structure between the conductive layer 200 and the PCB board, etc., and improves the transmission stability of electrical signals and the durability of the conductive layer 200.

[0071] In some implementations, refer to Figure 13The first fiber bundle 321 includes at least one first fiber filament 3211 extending along a first direction. The first conductive filament 210 has the first fiber filament 3211 disposed on at least one side of the plate plane of the plate structure 101, including the first conductive filament 210 having the first fiber filament 3211 disposed on one side of the plate plane of the plate structure 101 and the first conductive filament 210 having the first fiber filament 3211 disposed on both sides of the plate plane of the plate structure 101. Furthermore, the first conductive filament 210 has the first fiber filament 3211 disposed on at least one side of the plate thickness direction of the plate structure 101. It can be understood that at least two first fiber filaments 3211 are arranged along the circumferential direction of the first conductive filament 210, and at least two first fiber filaments 3211 wrap around the first conductive filament 210 with a predetermined central angle, thereby improving the compactness of the arrangement of the first conductive filament 210 in the first fiber bundle 321, which is beneficial for reducing the overall thickness of the plate structure 101.

[0072] In some implementations, refer to Figure 13 The first fiber bundle 321 includes at least two first fiber filaments 3211 extending along a first direction. The diameter of the first conductive filament 210 is larger than the diameter of the first fiber filament 3211. For example, the first conductive filament 210 can be made of copper wire, in which case the diameter of the first conductive filament 210 is approximately 1.6 to 2 times that of the first fiber filament 3211. It is understood that the step difference between the first conductive filament 210 and the first fiber filament 3211 can be reduced by setting the ratio of the number of first conductive filaments 210 to the number of first fiber filaments 3211. Correspondingly, at least two first fiber filaments 3211 arranged along the thickness direction of the plate structure 101 are provided on the side of the first conductive filament 210 along the plate plane of the plate structure 101. This is beneficial to improving the overall flatness of the side-by-side first conductive filaments 210 and the first fiber bundle 321 by adjusting the ratio of the number of first conductive filaments 210 to the number of first fiber filaments 3211, thereby improving the overall flatness of the corresponding plate structure 101.

[0073] In some alternative implementations, refer to Figure 14 , Figure 15 , Figure 16 , Figure 17 and Figure 18The fiber layer 320 includes a first filament layer and a second filament layer. The first filament layer includes a first fiber bundle 321 extending along a first direction, and the second filament layer includes a second fiber bundle 322 extending along a second direction. The first and second directions intersect. The conductive layer 200 includes a second conductive filament 220. The first fiber bundle 321, a portion of the second conductive filament 220, and the second fiber bundle 322 are sequentially arranged in layers. Another portion of the second conductive filament 220 passes through a hole formed by the intersection of the first fiber bundle 321 and the second fiber bundle 322. It can be understood that the first fiber bundle 321 of the first filament layer and the second fiber bundle 322 of the second filament layer are arranged in layers, and a portion of the second conductive filament 220 is disposed between the layered first fiber bundle 321 and the second fiber bundle 322. The first filament layer may be composed of the first fiber bundle 321 (it can be understood that the first filament layer only includes the first fiber bundle 321), and the first filament layer may also include the second fiber bundle 322, and the first fiber bundle 321 and the second fiber bundle 322 of the first filament layer are interwoven. Furthermore, the second filament layer may be composed of second fiber bundles 322 (which can be understood as the second filament layer only including second fiber bundles 322), and the second filament layer may also include first fiber bundles 321, and the first fiber bundles 321 and the second fiber bundles 322 of the second filament layer are interwoven with each other. Correspondingly, the holes through which another part of the second conductive wire 220 passes may include holes formed by first fiber bundles 321 (e.g., the first fiber bundles 321 of the first filament layer) and second fiber bundles 322 (e.g., the second fiber bundles 322 of the second filament layer) of different layers, or holes formed by first fiber bundles 321 (e.g., the first fiber bundles 321 of the first filament layer) and second fiber bundles 322 (e.g., the second fiber bundles 322 of the first filament layer) of the same layer.

[0074] Correspondingly, in some embodiments of the method for preparing the above-mentioned board structure 101, the step of forming a fiberboard layer by impregnating at least one fiber layer 320 with resin includes: To form a hole by intersecting fiber bundles of at least one layer of fiber layer 320, including intersecting first fiber bundles 321 (e.g., first fiber bundle 321 of the first filament layer) and second fiber bundles 322 (e.g., second fiber bundle 322 of the second filament layer) of different layers to form a hole, and intersecting first fiber bundles 321 (e.g., first fiber bundle 321 of the first filament layer) and second fiber bundles 322 (e.g., second fiber bundle 322 of the first filament layer) of the same layer to form a hole.

[0075] The step of embedding the conductive layer 200 in the fiberboard layer includes: The second conductive wire 220 is passed through the hole, for example, by means of puncture.

[0076] In the embodiments of the above-described plate structure 101, electronic device 100, and method for fabricating plate structure 101, the second conductive wire 220 of the conductive layer 200 can pass through the hole formed by the intersection of the first fiber bundle 321 and the second fiber bundle 322, thereby improving the positional stability of the second conductive wire 220, the electrical connection between the second conductive wire 220, the conductive layer 200, and the external components, which is beneficial to improving the transmission stability of electrical signals and the durability of plate structure 101.

[0077] In some implementations, refer to Figure 14 or Figure 15 The first conductive filament 210 of the conductive layer 200 includes a bent section 211, which extends at least outward to the surface of the fiber layer 320. The bent section 211 may extend outward and protrude from the surface of the fiber layer 320, or it may extend outward and be flush with the surface of the fiber layer 320. The bent section 211 extending at least outward to the surface of the fiber layer 320 facilitates the connection of other electrical connection structures to this surface of the fiber layer 320, thereby increasing the connection area and improving the connectability of the conductive layer 200.

[0078] In some implementations, refer to Figure 16 The surface of the fiber layer 320 is provided with a metal layer 330, and the bent section 211 is connected to the metal layer 330, thereby increasing the connection area through the metal layer 330 and improving the connectability of the conductive layer 200. The metal layer 330 can be made of silver or copper. The metal layer 330 can be formed by electroplating the exposed portion of the bent section 211, or it can be formed by welding, snapping metal plates, or other methods. Furthermore, the fiber layer 320 with the metal layer 330 on its surface can be either the outermost fiber layer 320 or an inner fiber layer 320.

[0079] In some implementations, refer to Figure 17 The bent section 211 extends outward to at least the surface of the board structure 101. This includes the bent section 211 protruding from the surface of the board structure 101 to facilitate connection with electrical connection structures such as a PCB, or the end of the bent section 211 being flush with the surface of the board structure 101 to improve surface flatness. Furthermore, the surface of the board structure 101 may be provided with a covering layer 340, which covers the end of the bent section 211. This covering layer 340 may be a surface coating or similar material, thereby reducing the risk of corrosion, scratches, etc., caused by the exposed bent section 211.

[0080] It is understandable that, in the absence of obvious contradictions, the aforementioned bending segment 211, metal layer 330, and covering layer 340 can also be applied to other embodiments of the plate structure 101.

[0081] In some implementations, refer to Figure 19 or Figure 20 The second conductive filament 220 includes a first conductive segment 221 and a second conductive segment 222. The extending directions of the first conductive segment 221 and the second conductive segment 222 are parallel to the plane of the plate structure 101, respectively. The first conductive segment 221 and the second conductive segment 222 are respectively disposed on both sides of one of the first filament layers or on both sides of one of the second filament layers. One or at least two layers of first filament layer (or second filament layer) may be disposed between the first conductive segment 221 and the second conductive segment 222. It is understood that, referring to... Figure 19 The second conductive wire 220 further includes a third conductive segment passing through the hole formed by the intersection of the first fiber bundle 321 and the second fiber bundle 322. The two ends of the third conductive segment are respectively connected to the first conductive segment 221 and the second conductive segment 222. In some embodiments, the first conductive segment 221, the third conductive segment, and the second conductive segment 222 can be integrally formed, or they can be connected by welding or other methods. In this embodiment, the first conductive segment 221 and the second conductive segment 222 included in the second conductive wire 220 are beneficial for improving the overall signal transmission capability of the second conductive wire 220 and the conductive layer 200, and also for improving the positional stability of the second conductive wire 220 and the conductive layer 200.

[0082] In some implementations, refer to Figure 19 or Figure 20 Projecting along the thickness direction of the plate structure 101, the first conductive segment 221 and the second conductive segment 222 are at least partially offset, thereby further improving the positional stability of the second conductive wire 220 and the conductive layer 200.

[0083] In some implementations, refer to Figure 19 or Figure 20 Projecting along the thickness direction of the plate structure 101, the first conductive segment 221 and the second conductive segment 222 are parallel to each other and at least partially spaced apart, thereby further improving the positional stability of the second conductive wire 220 and the conductive layer 200; or, the first conductive segment 221 and the second conductive segment 222 have an angle between them, such as an angle of 30 degrees, 45 degrees, 60 degrees, etc., thereby further improving the positional stability of the second conductive wire 220 and the conductive layer 200.

[0084] It is understandable that, in the absence of obvious contradictions, the conductive layer 200 may include both the first conductive wire 210 and the second conductive wire 220.

[0085] It is understood that the manufacturing methods of the above-mentioned electronic device 100 and board structure 101 adopt all the technical solutions of all embodiments of the above-mentioned board structure 101, and therefore have at least all the beneficial effects brought about by the technical solutions of the above-mentioned embodiments, which will not be repeated here.

[0086] The above description is merely a specific embodiment of this application. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the protection scope of this application. The protection scope of this application should be determined by the protection scope of the claims.

Claims

1. An electronic device (100), characterized in that, The electronic device (100) includes a housing and electronic components, the electronic components being mounted on the housing; the housing includes a plate structure (101), the plate structure (101) including a conductive layer (200) and a fiberboard layer, the fiberboard layer including a resin layer (310) and at least one fiber layer (320) immersed in the resin layer (310), the conductive layer (200) being embedded in the fiberboard layer.

2. The electronic device (100) as claimed in claim 1, characterized in that, The fiber layer (320) includes a first fiber layer and a second fiber layer that are layered along the thickness direction of the plate structure (101). At least a portion of the area between adjacent first fiber layers and second fiber layers is provided with the resin layer (310). The conductive layer (200) is embedded in the resin layer (310) on one side of the first fiber layer.

3. The electronic device (100) as claimed in claim 2, characterized in that, The conductive layer (200) is embedded in the resin layer (310) between adjacent first filament layers and second filament layers, and the first filament layer, the conductive layer (320) and the second filament layer are arranged in sequence. The first filament layer includes a first fiber bundle (321) extending along a first direction, and the second filament layer includes a second fiber bundle (322) extending along a second direction, the first direction intersecting the second direction; along the thickness direction of the plate structure (101), the first fiber bundle (321), the conductive layer (200) and the second fiber bundle (322) are sequentially layered.

4. The electronic device (100) as claimed in claim 3, characterized in that, The thickness of at least a portion of the first fiber bundle (321) closest to one side of the conductive layer (200) is less than the thickness of the first fiber bundle (321) closest to the other side of the conductive layer (200).

5. The electronic device (100) as claimed in claim 4, characterized in that, The first filament layer is composed of at least one bundle of the first fiber (321), and the second filament layer is composed of at least one bundle of the second fiber (322); the thickness of at least a portion of the first filament layer closest to one side of the conductive layer (200) is less than the thickness of the first filament layer closest to the other side of the conductive layer (200).

6. The electronic device (100) as claimed in claim 1, characterized in that, The fiber layer (320) includes a first filament layer, which includes a first fiber bundle (321) extending along a first direction. The conductive layer (200) includes a first conductive filament (210) extending along the first direction. The first conductive filament (210) is at least partially embedded in the first fiber layer, and the first conductive filament (210) is arranged side by side with at least a portion of the first fiber bundle (321).

7. The electronic device (100) as claimed in claim 6, characterized in that, The first fiber bundle (321) includes at least one first fiber filament (3211) extending along the first direction. The first conductive filament (210) is provided with the first fiber filament (3211) along at least one side of the plate plane of the plate structure (101). The first conductive filament (210) is provided with the first fiber filament (3211) along at least one side of the plate thickness direction of the plate structure (101).

8. The electronic device (100) as claimed in claim 6, characterized in that, The first fiber bundle (321) includes at least two first fiber filaments (3211) extending along the first direction. The diameter of the first conductive filament (210) is larger than the diameter of the first fiber filament (3211). The first conductive filament (210) has at least two first fiber filaments (3211) arranged along the thickness direction of the plate structure (101) on the side of the plate plane of the plate structure (101).

9. The electronic device (100) as claimed in claim 6, characterized in that, The first filament layer is composed of the first fiber bundle (321); the fiber layer (320) further includes a second filament layer, which is composed of a second fiber bundle (322) extending along a second direction, the first direction intersecting the second direction; the first filament layer and the second filament layer are arranged in layers along the thickness direction of the plate structure (101).

10. The electronic device (100) as claimed in claim 6, characterized in that, The first filament layer also includes a second fiber bundle (322), and the first fiber bundle (321) of the first filament layer and the second fiber bundle (322) of the first filament layer are interwoven with each other.

11. The electronic device (100) as claimed in claim 1, characterized in that, The fiber layer (320) includes a first filament layer and a second filament layer. The first filament layer includes a first fiber bundle (321) extending along a first direction, and the second filament layer includes a second fiber bundle (322) extending along a second direction. The first direction and the second direction intersect. The conductive layer (200) includes a second conductive filament (220), a first fiber bundle (321), a portion of the second conductive filament (220) and the second fiber bundle (322) are arranged in layers in sequence, and another portion of the second conductive filament (220) passes through the hole formed by the intersection of the first fiber bundle (321) and the second fiber bundle (322).

12. The electronic device (100) as claimed in claim 11, characterized in that, The second conductive filament (220) includes a first conductive segment (221) and a second conductive segment (222). The extension directions of the first conductive segment (221) and the second conductive segment (222) are parallel to the plate plane of the plate structure (101). The first conductive segment (221) and the second conductive segment (222) are respectively disposed on both sides of one of the first filament layers or on both sides of one of the second filament layers.

13. The electronic device (100) as claimed in claim 12, characterized in that, Projecting along the thickness direction of the plate structure (101), the first conductive segment (221) and the second conductive segment (222) are at least partially offset.

14. The electronic device (100) as claimed in claim 13, characterized in that, Projecting along the thickness direction of the plate structure (101), the first conductive segment (221) and the second conductive segment (222) are parallel to each other and at least partially spaced apart, or there is an angle between the first conductive segment (221) and the second conductive segment (222).

15. The electronic device (100) as claimed in any one of claims 1 to 14, characterized in that, The first conductive filament (210) of the conductive layer (200) includes a bent section (211) that extends at least outward to the surface of the fiber layer (320).

16. The electronic device (100) as claimed in claim 15, characterized in that, The surface of the fiber layer (320) is provided with a metal layer (330), and the bent section (211) is connected to the metal layer (330).

17. The electronic device (100) as claimed in claim 15, characterized in that, The bent section (211) extends at least outward to the surface of the plate structure (101), the surface of the plate structure (101) is provided with a covering layer (340), the covering layer (340) covering the end of the bent section (211).

18. The electronic device (100) as claimed in any one of claims 1 to 14, characterized in that, The fiberboard layer is provided with a connecting recess (301), and a connecting conductor (302) is provided in the connecting recess (301). The connecting conductor (302) is connected to the conductive layer (200).

19. The electronic device (100) as claimed in claim 18, characterized in that, The depth of the connecting recess (301) is set along the thickness direction of the plate structure (101), and at least a portion of the depth of the connecting recess (301) is arranged in parallel with the fiber filaments of the fiber layer (320) and is independent of each other.

20. A plate structure (101), characterized in that, The board structure (101) is applied to an electronic device (100). The board structure (101) includes a conductive layer (200) and a fiberboard layer. The fiberboard layer includes a resin layer (310) and at least one fiber layer (320) immersed in the resin layer (310). The conductive layer (200) is embedded in the fiberboard layer.

21. A method for preparing a plate structure (101), characterized in that, The preparation method includes the following steps: At least one layer of fiber is impregnated with resin to form a fiberboard layer; The conductive layer (200) is embedded in the fiberboard layer; The fiberboard layers are pressed together to form a board structure (101).

22. The preparation method according to claim 21, characterized in that, The step of forming a fiberboard layer by impregnating at least one layer of fiber (320) with resin includes: impregnating the fiber structure with resin to form at least one layer of fiberboard; The step of embedding the conductive layer (200) in the fiberboard layer includes: after the step of forming at least one fiberboard layer by impregnating the fiber structure with resin, disposing at least a portion of the conductive layer (200) on one side of one of the fiberboard layers. The step of pressing fiberboard layers to form a board structure (101) includes: after the step of disposing at least a portion of a conductive layer (200) on one side of one of the fiberboard layers, pressing the conductive layer (200) and all the fiberboard layers together to form a board structure (101).

23. The preparation method according to claim 21, characterized in that, The conductive layer (200) includes a first conductive filament (210) extending along a first direction. The step of embedding the conductive layer (200) in the fiberboard layer includes: arranging at least a portion of the first conductive filament (210) and the first fiber bundle (321) of the fiber layer (320) side by side. After the step of arranging at least a portion of the first conductive wire (210) and the first fiber bundle (321) of the fiber layer (320) side by side, the step of impregnating at least one layer of fiber layer (320) with resin to form a fiberboard layer is performed.

24. The preparation method according to claim 21, characterized in that, The step of forming a fiberboard layer by impregnating at least one layer of fiber (320) with resin includes: The fiber bundles, which are at least one layer of fiber (320), intersect to form a hole; The conductive layer (200) includes a second conductive filament (220), and the step of embedding the conductive layer (200) in the fiberboard layer includes: The second conductive wire (220) is passed through the hole.

25. The preparation method according to any one of claims 21 to 24, characterized in that, Prior to the step of pressing the fiberboard layers to form the board structure (101), the preparation method further includes the following steps: On at least one fiberboard layer, through holes are formed in the pores formed by the intersection of fiber bundles in the fiber layer (320); The preparation method further includes the following steps: A connecting conductor (302) is formed within the through hole, and the connecting conductor (302) is connected to the conductive layer (200).

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