Exhaust device of ICP (Inductively Coupled Plasma) equipment
By designing a rotating assembly with multiple sets of vent holes, scrapers, and sealing plates in the ICP equipment, the problem of slow exhaust speed of waste gas and impurities in the ICP etching equipment was solved, thus improving etching uniformity and rate and ensuring a clean environment in the reaction chamber.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HEFEI XINHAO SEMICON EQUIP CO LTD
- Filing Date
- 2024-04-01
- Publication Date
- 2026-04-28
AI Technical Summary
In existing ICP etching equipment, the exhaust gas and impurities are discharged slowly from the cavity, resulting in poor uniformity of etching quality and low etching rate near the molecular pump area.
Design an exhaust device for an ICP device, including a first chamber and a second chamber within a housing, with multiple sets of exhaust holes, scrapers and sealing plates. A rotating assembly drives a connecting shaft and a mounting ring to achieve impurity cleaning and gas dispersion. Conical exhaust holes are used and are evenly distributed, combined with blades and extrusion rods to accelerate gas flow.
It improves the discharge speed of waste gas and impurities, reduces the deposition of foreign matter in the chamber, ensures etching uniformity and etching rate, prevents waste gas backflow, and improves the working environment inside the reaction chamber.
Smart Images

Figure CN121938818A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of etching apparatus technology, specifically to an exhaust device for an ICP (Inductively Coupled Processing) device. Background Technology
[0002] Inductively coupled plasma (ICP) etching is a semiconductor process in which ions ionized from reactive gas are bombarded on the substrate surface through electrodes in a vacuum-sealed reaction chamber according to the mask pattern or design requirements, thereby creating the desired pattern. Etching technology is not only a basic manufacturing process for semiconductor devices and integrated circuits, but is also applied to the processing of thin-film circuits, printed circuits, and other micro-patterns.
[0003] During production, a molecular pump is needed to continuously provide a vacuum environment for the chamber, while simultaneously removing and venting the sublimated etching byproducts from the reaction chamber. Otherwise, the byproducts will adhere to the wafer surface, and the etching reaction cannot proceed. Common ICP etching equipment includes a reaction chamber exhaust port and a molecular pump, located on the lower side of the reaction chamber, to provide a vacuum environment for the chamber and extract the waste gas generated during etching from the reaction chamber.
[0004] In current ICP etching equipment, the molecular pump exhaust device is located far to the side and below the reaction chamber. The exhaust gas and impurities after etching have a long movement time before being discharged from the chamber, which increases the probability of impurities remaining and depositing in the chamber, thus affecting the etching quality. Furthermore, during the etching process, the plasma is pumped away faster in the area near the molecular pump port, and the wafer surface near this area has less plasma contact with the opposite area, resulting in a lower etching rate and ultimately poor wafer etching uniformity. Summary of the Invention
[0005] The purpose of this invention is to provide an exhaust device for ICP equipment, solving the following technical problems:
[0006] How to increase the discharge speed of exhaust gas and impurities in the cavity and improve the etching rate.
[0007] The objective of this invention can be achieved through the following technical solutions:
[0008] An exhaust device for an ICP device includes a housing, in which a first chamber and a second chamber are respectively arranged from bottom to top. A molecular pump is fixedly connected to the first chamber, and a reaction chamber is fixedly connected to the second chamber. A platform is fixedly connected to the reaction chamber.
[0009] The reaction chamber has multiple sets of exhaust holes on its outer walls. Each exhaust hole has a mounting groove on its outer wall. A connecting shaft is rotatably connected to each mounting groove. A connecting rod is fixedly connected to the side wall of the connecting shaft located in the second chamber. A mounting ring is fixedly connected to the end of the connecting rod away from the connecting shaft. Multiple sets of fixing rods are provided in the mounting ring. A rotating shaft is rotatably connected to the center of the multiple sets of fixing rods. A squeezing rod is fixedly connected to the side wall of the rotating shaft near the reaction chamber.
[0010] A circular groove is provided on the outer wall of the reaction chamber and outside each exhaust hole. A slider is slidably connected in the circular groove. A connecting block is fixedly connected to the outer wall of the slider. The connecting block is set towards the inside of the exhaust hole. A scraper is fixedly connected to the bottom of the connecting block. The scraper contacts the inner wall of the exhaust hole. Multiple sets of blades are fixedly connected to the end of the rotating shaft away from the extrusion rod. A rotating assembly is provided outside the reaction chamber. The rotating assembly includes a connecting plate, a telescopic rod and a mounting rod. The rotating assembly is used to drive the connecting shaft to rotate. A driving component is provided in the second chamber. The driving component is used to drive the connecting plate to move.
[0011] Furthermore, the distance by which the slider extends outside the circular groove is less than the distance between the mounting ring and the reaction chamber, and a sealing plate is fixedly connected to the end of each connecting shaft away from the connecting rod, with the sealing plate facing away from the connecting rod.
[0012] Furthermore, the exhaust port has a conical structure design, and the opening area facing the second chamber is larger than the opening facing the inside of the reaction chamber. The exhaust ports are equidistantly distributed.
[0013] Furthermore, each of the mounting slots is fixedly connected to a bearing, and the connecting shaft is rotatably mounted in the mounting slot via the bearing.
[0014] Furthermore, the rotating assembly includes four sets of connecting plates fixedly connected to the outside of the reaction chamber. The four sets of connecting plates correspond to the four sides of the reaction chamber. Two sets of telescopic rods are fixedly connected between the connecting plates and the reaction chamber. Multiple sets of mounting rods are fixedly connected to the side of the connecting plates near the reaction chamber. Each connecting shaft has a connecting hole at the end near the adjacent connecting plate. The multiple mounting rods correspond one-to-one with the multiple connecting holes. The mounting rods are slidably installed in the connecting holes. Each connecting hole has a spiral groove. A protrusion is fixedly connected to the side wall of the end of each mounting rod away from the connecting plate. The protrusion is located inside the spiral groove.
[0015] Furthermore, a threaded rod is rotatably connected to the second chamber, and a rectangular frame is threaded to the outer wall of the threaded rod. The rectangular frame is fitted outside the reaction chamber, and multiple sets of extrusion blocks are fixedly connected to the bottom of the rectangular frame. The bottom of the extrusion blocks is set with an inclined surface. A drive motor is fixedly connected to the top of the housing, and the output shaft of the drive motor is fixedly connected to the threaded rod.
[0016] Furthermore, each of the connecting plates has two sets of springs fixedly connected to the outer wall of the side closest to the reaction chamber. The end of the spring away from the connecting plate is fixedly connected to the reaction chamber, and the two adjacent sets of springs are respectively arranged on both sides of the connecting plate.
[0017] Furthermore, a limiting rod is fixedly connected in the second chamber. The limiting rod and the threaded rod are symmetrically arranged relative to the reaction chamber. A through hole is opened at the top of the rectangular frame, and the limiting rod is disposed in the through hole. The size of the limiting rod and the through hole are adapted to each other.
[0018] The beneficial effects of this invention are:
[0019] (1) The present invention drives the extrusion rod at the bottom of the rotating shaft to rotate synchronously. During the rotation, the extrusion rod will contact the outer surface of the slider. As the extrusion rod continues to rotate, it will push the slider to move in the circular groove. During this process, the scraper on the outside of the slider can clean the impurities attached to the inner wall of the exhaust hole, thereby preventing foreign objects from staying and depositing in the exhaust hole. With this setting, it is possible to avoid foreign objects staying and depositing in the exhaust hole, which would cause the exhaust hole to become blocked, thereby ensuring good output of exhaust gas flow and thus accelerating the discharge of reaction by-products.
[0020] (2) By setting up multiple layers of exhaust holes, with each layer distributed longitudinally at equal intervals, and each layer of exhaust holes evenly arranged along the same plane direction and located on the outer walls of the reaction chamber, the exhaust holes can effectively disperse the reaction gas, achieving a stable and good airflow output. At the same time, the pressure control inside the reaction chamber is simple, avoiding the concentrated discharge of reaction gas, which would cause differences in its distribution between the wafer edge area and the center area, ultimately affecting the etching uniformity of the wafer. Furthermore, the distance and time that the etched waste gas and impurities travel before being discharged from the reaction chamber are reduced, thus reducing the probability of foreign matter remaining and depositing in the chamber.
[0021] (3) In this invention, the connecting plate will be reset under the action of the spring's own elastic restoring force, and drive the mounting rod to move into the connecting hole. As the mounting rod moves, the connecting shaft will move along the trajectory of the spiral groove, thereby driving the mounting ring and the sealing plate to rotate in opposite directions. At this time, the sealing plate will move to the outside of the exhaust hole again with the rotation of the connecting shaft and seal the exhaust hole, thereby preventing the exhaust gas from flowing back after the etching operation, causing the exhaust gas and impurities to return to the reaction chamber, thereby reducing the probability of foreign matter staying and depositing in the reaction chamber, and preventing foreign matter deposited in the exhaust hole from entering the reaction chamber through the backflow of exhaust gas, thereby improving the working environment inside the reaction chamber. Attached Figure Description
[0022] The invention will now be further described with reference to the accompanying drawings.
[0023] Figure 1 This is a perspective view of the present invention;
[0024] Figure 2 This is a planar sectional view of the present invention;
[0025] Figure 3 This is a cross-sectional structural diagram of the connecting shaft in this invention;
[0026] Figure 4 This is a partial cross-sectional view of the present invention;
[0027] Figure 5 yes Figure 4 Enlarged view of point A in the middle;
[0028] Figure 6 This is a planar sectional view of the shell in this invention;
[0029] Figure 7 yes Figure 6 Enlarged view at point B in the middle;
[0030] Figure 8 This is a cross-sectional perspective view of the present invention;
[0031] Figure 9 yes Figure 8 Enlarged view of point C in the middle.
[0032] Reference numerals: 1. Shell; 2. Reaction chamber; 21. Stage; 22. Exhaust port; 23. First chamber; 24. Second chamber; 3. Connecting shaft; 31. Mounting groove; 32. Bearing; 33. Connecting hole; 34. Spiral groove; 35. Protrusion; 36. Mounting rod; 37. Sealing plate; 4. Connecting rod; 41. Mounting ring; 42. Rotating shaft; 43. Blade; 44. Extrusion rod; 45. Fixing rod; 5. Circular slide; 51. Slider; 52. Connecting block; 53. Scraper; 6. Threaded rod; 61. Drive motor; 62. Rectangular frame; 63. Extrusion block; 64. Limiting rod; 65. Connecting plate; 66. Telescopic rod; 67. Spring. Detailed Implementation
[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0034] Please see Figure 1 - Figure 9 As shown, in one embodiment, this application provides an exhaust device for an ICP device, including a housing 1. The housing 1 has a first chamber 23 and a second chamber 24 respectively arranged from bottom to top. A molecular pump is fixedly connected in the first chamber 23, and a reaction chamber 2 is fixedly connected in the second chamber 24. A platform 21 is fixedly connected in the reaction chamber 2.
[0035] The reaction chamber 2 has multiple sets of exhaust holes 22 on its outer walls. Each exhaust hole 22 has a mounting groove 31 on one side of its outer wall. Each mounting groove 31 is rotatably connected to a connecting shaft 3. A connecting rod 4 is fixedly connected to one end of the connecting shaft 3 on the side wall of the second chamber 24. An installation ring 41 is fixedly connected to the end of the connecting rod 4 away from the connecting shaft 3. Multiple sets of fixing rods 45 are provided in the installation ring 41. A rotating shaft 42 is rotatably connected to the center of the multiple sets of fixing rods 45. A pressing rod 44 is fixedly connected to the side wall of the rotating shaft 42 near the reaction chamber 2.
[0036] A circular groove 5 is provided on the outer wall of the reaction chamber 2 and outside each exhaust hole 22. A slider 51 is slidably connected in the circular groove 5. A connecting block 52 is fixedly connected to the outer wall of the slider 51. The connecting block 52 is set towards the inside of the exhaust hole 22. A scraper 53 is fixedly connected to the bottom of the connecting block 52. The scraper 53 contacts the inner wall of the exhaust hole 22. Multiple sets of blades 43 are fixedly connected to the end of the rotating shaft 42 away from the extrusion rod 44. A rotating assembly is provided outside the reaction chamber 2. The rotating assembly includes a connecting plate 65, a telescopic rod 66 and a mounting rod 36. The rotating assembly is used to drive the connecting shaft 3 to rotate. A driving component is provided in the second chamber 24. The driving component is used to drive the connecting plate 65 to move.
[0037] In the initial state, the mounting ring 41 is located on one side of the exhaust port 22. During the etching operation, the connecting shaft 3 is first driven to rotate 180 degrees by the rotating component. During the rotation of the connecting shaft 3, the mounting ring 41 will be moved to the outside of the exhaust port 22. At this time, the etching will begin. During the etching operation, the molecular pump located in the first chamber 23 will draw out the air in the reaction chamber 2 and provide it with a vacuum environment. At the same time, the waste gas generated by the etching will be extracted from the reaction chamber 2. During this process, the waste gas will be discharged from the exhaust port 22. Since there are multiple sets of exhaust ports 22, which are located on the outer walls of the reaction chamber 2, the vents can effectively disperse the reaction gas and achieve a stable and good airflow output. At the same time, the internal pressure control of the reaction chamber 2 is simple, avoiding the concentrated discharge of reaction gas, which will cause differences in its distribution in the wafer edge area and the center area, ultimately affecting the etching uniformity of the wafer. Furthermore, the distance and time that the etched waste gas and impurities travel before being discharged from the reaction chamber 2 are reduced, which reduces the probability of foreign matter staying and depositing in the chamber.
[0038] Furthermore, as the exhaust gas exits from the exhaust port 22, it drives multiple sets of blades 43 and the rotating shaft 42 to rotate. The rotation of the blades 43 increases the gas flow rate, which can accelerate the discharge of reaction byproducts to a certain extent and reduce the probability of foreign matter remaining and depositing in the cavity. During the rotation of the rotating shaft 42, the extrusion rod 44 at its bottom rotates synchronously. During the rotation of the extrusion rod 44, it contacts the outer surface of the slider 51. As the extrusion rod 44 continues to rotate, it pushes the slider 51 to move within the circular groove 5. During this process, the scraper 53 on the outside of the slider 51 can clean the impurities attached to the inner wall of the exhaust port 22, thereby preventing foreign matter from remaining and depositing in the exhaust port 22. Through this setting, the blockage of the exhaust port 22 caused by foreign matter remaining and depositing in the exhaust port 22 can be avoided, thus ensuring good output of exhaust gas flow and accelerating the discharge of reaction byproducts.
[0039] Please see Figure 4 -Figure 7 As shown, the distance from which the slider 51 extends to the outside of the circular groove 5 is less than the distance between the mounting ring 41 and the reaction chamber 2. Each connecting shaft 3 is fixedly connected to a sealing plate 37 at the end away from the connecting rod 4. The sealing plate 37 is arranged facing the side away from the connecting rod 4.
[0040] Initially, the sealing plate 37 is located outside the vent 22, thus sealing the vent 22. During etching, the connecting shaft 3 is driven to rotate 180 degrees via the rotating assembly. As the connecting shaft 3 rotates, it moves the mounting ring 41 to the outside of the vent 22. Simultaneously, the sealing plate 37 at the other end of the connecting shaft 3 rotates and moves away from the outside of the vent 22, facilitating the discharge of exhaust gas during subsequent etching operations. After one etching operation is completed, the rotating assembly rotates 180 degrees in the opposite direction. The sealing plate 37 moves back to the outside of the vent 22 along with the rotation of the connecting shaft 3, sealing the vent 22. This prevents the exhaust gas from flowing back after the etching operation, thus reducing the probability of foreign matter remaining and depositing in the reaction chamber 2. It also prevents foreign matter deposited in the vent 22 from entering the reaction chamber 2 through the backflow of exhaust gas, thereby improving the working environment inside the reaction chamber 2.
[0041] Furthermore, since the distance from which the slider 51 extends to the outside of the circular groove 5 is less than the distance between the mounting ring 41 and the reaction chamber 2, the mounting ring 41 will not contact the slider 51 during rotation, thereby preventing the slider 51 from blocking the mounting ring 41 and ensuring that the mounting ring 41 can rotate stably to the outside of the exhaust port 22.
[0042] Please see Figure 2 , Figure 6 and Figure 7 As shown, the exhaust port 22 has a conical structure design, and the opening area facing the second chamber 24 is larger than the opening facing the inside of the reaction chamber 2. The exhaust ports 22 are evenly distributed.
[0043] Since the exhaust holes 22 are arranged in multiple layers with equal longitudinal spacing between each layer and evenly spaced along the same plane, the multiple exhaust holes 22 can effectively disperse the reaction gas and achieve stable and good airflow output. Furthermore, the exhaust holes 22 are designed with a conical structure, with the opening area facing the outside of the cavity being larger than the opening area facing the inside. This structural design can accelerate the discharge of reaction byproducts to a certain extent and reduce the probability of foreign matter remaining and depositing in the cavity.
[0044] Please see Figure 3 and Figure 7As shown, each of the mounting slots 31 is fixedly connected to a bearing 32, and the connecting shaft 3 is rotatably mounted in the mounting slot 31 through the bearing 32;
[0045] During use, bearing 32 not only reduces friction and makes rotation smoother, but also protects the rotating support part, keeping the rotating connecting shaft 3 in the correct position and preventing the connecting shaft 3 from tilting during rotation, which would cause the mounting ring 41 to tilt synchronously during subsequent use. This ensures that the mounting ring 41 will not be deflected or blocked by the slider 51 during rotation, thus ensuring the normal progress of the etching operation.
[0046] Please see Figure 6 - Figure 9 As shown, the rotating assembly includes four sets of connecting plates 65 fixedly connected to the outside of the reaction chamber 2. The four sets of connecting plates 65 correspond to the four sides of the reaction chamber 2. Two sets of telescopic rods 66 are fixedly connected between the connecting plates 65 and the reaction chamber 2. Multiple sets of mounting rods 36 are fixedly connected to the side of the connecting plates 65 near the reaction chamber 2. Each connecting shaft 3 has a connecting hole 33 at one end near the adjacent connecting plate 65. The multiple mounting rods 36 correspond one-to-one with the multiple connecting holes 33. The mounting rods 36 are slidably installed in the connecting holes 33. Each connecting hole 33 has a spiral groove 34. A protrusion 35 is fixedly connected to the side wall of the end of each mounting rod 36 away from the connecting plate 65. The protrusion 35 is located inside the spiral groove 34.
[0047] Before etching, the connecting plate 65 is moved away from the reaction chamber 2 by the drive assembly. During the movement, the connecting plate 65 will move the mounting rod 36 to the outside of the connecting hole 33. Since the protrusion 35 is located inside the spiral groove 34 and the position of the protrusion 35 remains unchanged, the connecting shaft 3 will move along the trajectory of the spiral groove 34 as the mounting rod 36 moves under the limit of the protrusion 35, so that the connecting shaft 3 will rotate, thereby causing the sealing plate 37 to separate from the exhaust hole 22, and causing the mounting ring 41 and the blade 43 to rotate to the outside of the exhaust hole 22, ensuring the normal operation of subsequent work.
[0048] Please see Figure 2 and Figure 8 As shown, a threaded rod 6 is rotatably connected inside the second chamber 24. A rectangular frame 62 is threadedly connected to the outer wall of the threaded rod 6. The rectangular frame 62 is sleeved outside the reaction chamber 2. Multiple sets of extrusion blocks 63 are fixedly connected to the bottom of the rectangular frame 62. The bottom of the extrusion block 63 is set with an inclined surface. A drive motor 61 is fixedly connected to the top of the housing 1. The output shaft of the drive motor 61 is fixedly connected to the threaded rod 6.
[0049] During the etching operation, the drive motor 61 is first turned on. The output shaft of the drive motor 61 drives the threaded rod 6 to rotate. During the rotation of the threaded rod 6, the rectangular frame 62 moves downward through the threaded transmission. During the downward movement of the rectangular frame 62, the inclined surface of the bottom pressing block 63 will contact the upper side wall of the connecting plate 65 near the reaction chamber 2. As the rectangular frame 62 continues to move, the pressing block 63 will press the connecting plate 65 away from the reaction chamber 2, thereby causing the connecting plate 65 to drive the mounting rod 36 to move outward of the connecting hole 33, realizing the rotation of the connecting shaft 3 and ensuring the normal progress of the etching operation.
[0050] Please see Figure 8 and Figure 9 As shown, each of the connecting plates 65 has two sets of springs 67 fixedly connected to the outer wall of the side closest to the reaction chamber 2. The end of the spring 67 away from the connecting plate 65 is fixedly connected to the reaction chamber 2, and the two adjacent sets of springs 67 are respectively arranged on both sides of the connecting plate 65.
[0051] Initially, spring 67 is unloaded. When connecting plate 65 moves towards the reaction chamber 2 under the pressure of extrusion block 63, it simultaneously stretches spring 67. After one etching operation is completed, drive motor 61 is turned on to reverse the threaded rod 6. At this time, rectangular frame 62 moves upward. As rectangular frame 62 moves, extrusion block 63 gradually separates from connecting plate 65. At this time, connecting plate 65 will reset under the elastic restoring force of spring 67 and drive mounting rod 36 to move into connecting hole 33. As mounting rod 36 moves, connecting shaft 3 moves along the trajectory of spiral groove 34, thereby driving mounting ring 41 and sealing plate 37 to rotate in opposite directions. This moves sealing plate 37 to the outside of exhaust hole 22 and seals it, preventing foreign matter deposited in exhaust hole 22 from flowing back into reaction chamber 2 through exhaust gas, thereby improving the working environment inside reaction chamber 2.
[0052] Please see Figure 8 As shown, a limiting rod 64 is fixedly connected inside the second chamber 24. The limiting rod 64 and the threaded rod 6 are symmetrically arranged relative to the reaction chamber 2. A through hole is opened at the top of the rectangular frame 62, and the limiting rod 64 is disposed in the through hole. The size of the limiting rod 64 is adapted to the through hole.
[0053] During the movement of the rectangular frame 62, the limiting rod 64 can limit its movement, preventing the threaded rod 6 from deflecting or even rotating due to excessive friction between the rectangular frame 62 and the threaded rod 6. This ensures that the extrusion block 63 does not skew during use, and thus ensures that the extrusion block 63 can have a good extrusion effect on the connecting plate 65.
[0054] Working principle: In the initial state, the mounting ring 41 is located on one side of the vent hole 22. When etching is performed, the drive motor 61 is turned on. The output shaft of the drive motor 61 will drive the threaded rod 6 to rotate. During the rotation of the threaded rod 6, the rectangular frame 62 will move downward through the threaded transmission. During the downward movement of the rectangular frame 62, the inclined surface of the bottom extrusion block 63 will contact the upper side wall of the connecting plate 65 near the reaction chamber 2. As the rectangular frame 62 continues to move, the extrusion block 63 will press the connecting plate 65 away from the reaction chamber 2. During the movement of the connecting plate 65, the mounting rod 36 will move outward of the connecting hole 33. Since the protrusion 35 is set inside the spiral groove 34 and the position of the protrusion 35 remains unchanged, under the limit of the protrusion 35, as the mounting rod 36 moves, the connecting shaft 3 will move along the trajectory of the spiral groove 34, so that the connecting shaft 3 will rotate, thereby causing the sealing plate 37 to separate from the vent hole 22, and causing the mounting ring 41 and the blade 43 to rotate to the outside of the vent hole 22.
[0055] Etching then begins. During the etching process, the molecular pump located in the first chamber 23 draws out the air from the reaction chamber 2 and provides it with a vacuum environment. At the same time, it extracts the waste gas generated during etching from the reaction chamber 2. During this process, the waste gas is discharged from the exhaust port 22. Since there are multiple exhaust ports 22, which are located on the outer walls of the reaction chamber 2, this arrangement can effectively disperse the reaction gas, achieving a stable and good airflow output. At the same time, the internal pressure control of the reaction chamber 2 is simple, avoiding the concentrated discharge of reaction gas, which would cause differences in its distribution between the wafer edge area and the center area, ultimately affecting the etching uniformity of the wafer. Furthermore, the distance and time that the etched waste gas and impurities travel before being discharged from the reaction chamber 2 are reduced, thus reducing the probability of foreign matter remaining and depositing in the chamber.
[0056] Furthermore, as the exhaust gas exits from the exhaust port 22, it drives multiple sets of blades 43 and the rotating shaft 42 to rotate. During the rotation of the blades 43, the gas flow rate can be increased, which can accelerate the discharge of reaction by-products to a certain extent and reduce the probability of foreign matter staying and depositing in the cavity. During the rotation of the rotating shaft 42, the extrusion rod 44 at its bottom will rotate synchronously. During the rotation of the extrusion rod 44, it will contact the outer surface of the slider 51. As the extrusion rod 44 continues to rotate, it will push the slider 51 to move in the circular groove 5. During this process, the scraper 53 on the outside of the slider 51 can clean the impurities attached to the inner wall of the exhaust port 22, thereby preventing foreign matter from staying and depositing in the exhaust port 22. With this setting, the blockage of the exhaust port 22 caused by foreign matter staying and depositing in the exhaust port 22 can be avoided, thereby ensuring good output of exhaust gas flow and thus accelerating the discharge of reaction by-products.
[0057] After an etching operation is completed, the drive motor 61 is turned on to reverse the threaded rod 6. At this time, the rectangular frame 62 will move upward. As the rectangular frame 62 moves, the extrusion block 63 will gradually detach from the connecting plate 65. The connecting plate 65 will then reset under the elastic restoring force of the spring 67 and drive the mounting rod 36 to move into the connecting hole 33. As the mounting rod 36 moves, the connecting shaft 3 will move along the trajectory of the spiral groove 34, thereby driving the mounting ring 41 and the sealing plate 37 to rotate in opposite directions. At this time, the sealing plate 37 will move back to the outside of the exhaust hole 22 with the rotation of the connecting shaft 3 and seal the exhaust hole 22. This prevents the exhaust gas from flowing back after the etching operation, causing the exhaust gas and debris to return to the reaction chamber 2. This reduces the probability of foreign matter staying and depositing in the reaction chamber 2 and prevents foreign matter deposited in the exhaust hole 22 from entering the reaction chamber 2 through the backflow of exhaust gas, thereby improving the working environment inside the reaction chamber 2.
[0058] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.
Claims
1. An exhaust device for an ICP device, comprising a housing (1), wherein a first chamber (23) and a second chamber (24) are respectively arranged from bottom to top in the housing (1), a molecular pump is fixedly connected in the first chamber (23), a reaction chamber (2) is fixedly connected in the second chamber (24), and a platform (21) is fixedly connected in the reaction chamber (2); Its features are, The reaction chamber (2) has multiple sets of exhaust holes (22) on its outer walls. The reaction chamber (2) has an installation groove (31) on one side of each exhaust hole (22). A connecting shaft (3) is rotatably connected in each installation groove (31). A connecting rod (4) is fixedly connected to one end of the connecting shaft (3) located in the second chamber (24). An installation ring (41) is fixedly connected to one end of the connecting rod (4) away from the connecting shaft (3). Multiple sets of fixing rods (45) are provided in the installation ring (41). A rotating shaft (42) is rotatably connected to the center of the multiple sets of fixing rods (45). A squeezing rod (44) is fixedly connected to one end of the rotating shaft (42) near the reaction chamber (2). A circular groove (5) is provided on the outer wall of the reaction chamber (2) and outside each exhaust hole (22). A slider (51) is slidably connected in the circular groove (5). A connecting block (52) is fixedly connected to the outer wall of the slider (51). The connecting block (52) is set facing the inside of the exhaust hole (22). A scraper (53) is fixedly connected to the bottom of the connecting block (52). The scraper (53) contacts the inner wall of the exhaust hole (22). Multiple sets of blades (43) are fixedly connected to the end of the rotating shaft (42) away from the extrusion rod (44). A rotating assembly is provided outside the reaction chamber (2). The rotating assembly includes a connecting plate (65), a telescopic rod (66), and a mounting rod (36). The rotating assembly is used to drive the connecting shaft (3) to rotate. A driving component is provided in the second chamber (24). The driving component is used to drive the connecting plate (65) to move.
2. The exhaust device for an ICP device according to claim 1, characterized in that, The distance by which the slider (51) extends to the outside of the circular groove (5) is less than the distance between the mounting ring (41) and the reaction chamber (2). Each of the connecting shafts (3) is fixedly connected to a sealing plate (37) at the end away from the connecting rod (4). The sealing plate (37) is arranged facing away from the connecting rod (4).
3. The exhaust device for an ICP device according to claim 1, characterized in that, The exhaust port (22) is designed with a conical structure, and the opening area facing the second chamber (24) is larger than the opening facing the inside of the reaction chamber (2). The exhaust ports (22) are evenly distributed.
4. The exhaust device for an ICP device according to claim 1, characterized in that, Each of the mounting slots (31) is fixedly connected to a bearing (32), and the connecting shaft (3) is rotatably mounted in the mounting slot (31) through the bearing (32).
5. The exhaust device for an ICP device according to claim 1, characterized in that, The rotating assembly includes four sets of connecting plates (65) fixedly connected to the outside of the reaction chamber (2). The four sets of connecting plates (65) correspond to the four sides of the reaction chamber (2). Two sets of telescopic rods (66) are fixedly connected between the connecting plates (65) and the reaction chamber (2). Multiple sets of mounting rods (36) are fixedly connected to the side of the connecting plate (65) near the reaction chamber (2). Each connecting shaft (3) has a connecting hole (33) at one end near the adjacent connecting plate (65). Multiple mounting rods (36) correspond one-to-one with multiple connecting holes (33). The mounting rods (36) are slidably installed in the connecting holes (33). Each connecting hole (33) has a spiral groove (34). A protrusion (35) is fixedly connected to the side wall of the end of each mounting rod (36) away from the connecting plate (65). The protrusion (35) is located inside the spiral groove (34).
6. The exhaust device for an ICP device according to claim 5, characterized in that, A threaded rod (6) is rotatably connected inside the second chamber (24). A rectangular frame (62) is threadedly connected to the outer wall of the threaded rod (6). The rectangular frame (62) is fitted outside the reaction chamber (2). Multiple sets of extrusion blocks (63) are fixedly connected to the bottom of the rectangular frame (62). The bottom of the extrusion block (63) is set with an inclined surface. A drive motor (61) is fixedly connected to the top of the housing (1). The output shaft of the drive motor (61) is fixedly connected to the threaded rod (6).
7. The exhaust device for an ICP device according to claim 6, characterized in that, Two sets of springs (67) are fixedly connected to the outer wall of each connecting plate (65) near the reaction chamber (2). The end of the spring (67) away from the connecting plate (65) is fixedly connected to the reaction chamber (2). The two adjacent sets of springs (67) are respectively arranged on both sides of the connecting plate (65).
8. The exhaust device for an ICP device according to claim 7, characterized in that, A limiting rod (64) is fixedly connected inside the second chamber (24). The limiting rod (64) and the threaded rod (6) are symmetrically arranged relative to the reaction chamber (2). A through hole is opened at the top of the rectangular frame (62). The limiting rod (64) is set in the through hole. The size of the limiting rod (64) is adapted to the through hole.