Temperature and humidity pressure sensor core, sensor and packaging method

Abstract

The invention relates to the technical field of sensors, and particularly discloses a temperature and humidity pressure sensor core, a sensor and a packaging method, and the core comprises a shell structure which is provided with a medium flow channel along the axis direction; the composite sintering seat is connected to one end of the shell structure and comprises a metal base and a conductive needle; the metal base is provided with a containing cavity in the axis direction and a pressure guide hole spaced from the containing cavity, and the conductive needle penetrates through the containing cavity in the axis direction and is fixed based on the sintering technology. Wherein a sintered body for sealing the accommodating cavity is sintered in the accommodating cavity, and two ends of the conductive needle respectively protrude out of the end surfaces of the metal base and the shell structure; the main conditioning circuit board covers the end face of the metal base and is electrically connected with the conductive needles; the pressure sensing chip is arranged on the metal base and blocks one end of the pressure guide hole; the temperature and humidity sensing component is electrically connected with the conductive needle away from the main conditioning circuit board, the sensor is compact in structure, the sealing performance is improved, and the sensor can stably operate under the working conditions of continuous vibration, high temperature and high pressure.

Description

A temperature, humidity and pressure sensor core, sensor and packaging method Technical Field

[0001] This application relates to the field of sensor technology, and in particular to a temperature, humidity and pressure sensor core, sensor and packaging method. Background Technology

[0002] Currently, in vehicle piping systems, such as air suspension systems or braking systems, these piping systems need to withstand vibrations, temperature cycles, and high-pressure conditions during vehicle operation for extended periods. Furthermore, the temperature, humidity, and pressure parameters of the gas within these piping systems change dynamically in real time. To obtain these parameters in real time, automotive-grade temperature, humidity, and pressure sensors often employ a separate design, meaning that independent temperature and pressure sensors collect piping parameters separately. Some integrated solutions can only achieve dual-parameter integration of temperature and pressure, while humidity parameters require an additional external sensor. A few solutions attempting to integrate three parameters (temperature, humidity, and pressure) still rely on traditional designs for pressure bearing and electrical connections. This involves forming a sealed transmission path through wire welding, adhesive application, and rubber insulation assembly, followed by insulation isolation using plastic gaskets and ceramic insulators.

[0003] Because these types of sensors need to operate in harsh environments such as continuous vibration and high temperature and pressure, multiple different components are combined with rubber sealing structures through adhesive application or multiple welding points. On the one hand, the rubber material is prone to aging and cracking, and multiple welding points are prone to desoldering due to increased vibration, leading to sealing failure, insufficient sealing reliability, and affecting pressure measurement accuracy. On the other hand, there is a prominent contradiction between structural compatibility and compactness. The conductivity, sealing, and insulation functions of existing solutions rely on the assembly of multiple independent components, which occupies a large space and is difficult to adapt to the compact layout requirements of miniaturized integrated sensors. Moreover, the assembly process is complex, the assembly process of multiple separate components is cumbersome, and the welding quality and sealing effect are easily affected by process parameters, resulting in high quality control difficulty and production costs. Summary of the Invention

[0004] This application aims to propose a temperature, humidity and pressure sensor core, sensor, and packaging method to at least solve the technical problems of existing automotive-grade temperature, humidity and pressure sensors, which are prone to sealing failure and inaccurate parameter acquisition under vibration, high temperature, high pressure and high humidity environments, and have complex sensor assembly processes and cumbersome assembly procedures for multiple separate components.

[0005] In a first aspect, this application provides a temperature, humidity, and pressure sensor core, comprising: a housing structure having a medium flow channel along its axial direction; a composite sintered base connected to one end of the housing structure, the composite sintered base including a metal base and a conductive pin; the metal base having a receiving cavity and pressure guiding holes spaced apart from the receiving cavity along its axial direction, at least one of the conductive pins passing through the receiving cavity along its axial direction and fixed by a sintering process; wherein, a sintered body sealing the receiving cavity is formed within the receiving cavity, one end of the conductive pin protruding from the end face of the metal base, and the other end extending along the medium flow channel and protruding from the end face of the housing structure; a main conditioning circuit board covering the end face of the metal base opposite to the housing structure and electrically connected to the conductive pin; a pressure sensing chip disposed on the metal base and sealing the end of the pressure guiding hole opposite to the medium flow channel; and a temperature and humidity sensing component electrically connected to the end of the conductive pin opposite to the main conditioning circuit board.

[0006] In some embodiments, the composite sintering base further includes an insulator disposed on the conductive pin, the insulator being spaced apart from the metal base, and the insulator having at least one through hole; multiple conductive pins are provided, the multiple conductive pins being spaced apart around the through hole, and the projected outline of the multiple conductive pins along the axial direction is located within the projected outline of the insulator.

[0007] In some embodiments, the temperature and humidity sensing component includes a temperature and humidity circuit board and a temperature and humidity sensing chip disposed on the temperature and humidity circuit board. Multiple conductive pins are electrically connected to the temperature and humidity circuit board at one end away from the main conditioning circuit board. The temperature and humidity circuit board has blind holes adapted to the conductive pins, and one end of the conductive pin extends into the blind hole and is soldered and fixed.

[0008] In some embodiments, the medium flow channel is coaxially provided with an enlarged cavity at one end near the metal base; the metal base is provided with a boss and a fitting groove surrounding the boss at one end near the housing structure; wherein the boss extends into the enlarged cavity, and the two intersecting inner surfaces of the fitting groove are respectively sealed and fitted to the end face of the metal base and at least a portion of the inner sidewall of the enlarged cavity, so that the enlarged cavity communicates only with the medium flow channel and the pressure guiding hole.

[0009] In some embodiments, a notch is provided on the main conditioning circuit board near the pressure guide hole, the pressure sensing chip is connected to the metal base at the notch, and the pressure sensing chip completely covers and seals the pressure guide hole near one end of the main conditioning circuit board.

[0010] The one or more technical solutions provided in the first aspect of this application have at least the following technical effects or advantages: The sensor core provided in this application provides a medium transmission path through the medium flow channel of the shell structure. Combined with the integrated design of the composite sintering base, the receiving cavity of the metal base and the sintered body form a sealed structure. With the conductive pins fixed by the sintering process, this replaces traditional dispensing, multi-point welding, and rubber sealing solutions. This avoids the aging and cracking problems of rubber materials under high temperature, high pressure, vibration, and alternating temperature and humidity environments, and also avoids the risk of detachment at multiple welding points due to continuous vibration, thus improving the sealing reliability of the sensor core. The structure's vibration resistance ensures that pressure measurement accuracy is not affected by seal failure. Meanwhile, the composite sintered base integrates conductive transmission and sealing protection functions into one unit. Combined with the pressure sensing chip's sealing of the pressure guide hole, the direct electrical connection between the temperature and humidity sensing components and the conductive needle, and the compact layout of the main conditioning circuit board cover, the number of independent components is significantly reduced, effectively compressing the overall space occupied. This is highly suitable for automotive-grade miniaturized integration requirements, simplifies the assembly process, reduces the impact of process parameter fluctuations on product quality, thereby reducing quality control difficulty and production costs, and ensuring that the sensor core can stably and accurately monitor temperature, humidity, and pressure parameters under harsh automotive-grade conditions.

[0011] Secondly, this application also provides a sensor, the sensor comprising: a temperature, humidity and pressure sensor core as described in any of the first aspects above; an inner support frame coaxially connected to one end of the metal base away from the housing structure, the inner support frame having a mounting portion spaced apart from the main conditioning circuit board in the axial direction; an upper circuit board disposed in the mounting portion and electrically connected to the main conditioning circuit board; wherein, the bottom surface of the upper circuit board and the bottom surface of the main conditioning circuit board are respectively fitted with misaligned wiring plates, the two misaligned wiring plates are connected by a flexible flat cable, the edge of the inner support frame is provided with a clearance groove along the axial direction, the two ends of the clearance groove extend to the mounting portion and the main conditioning circuit board respectively, wherein the clearance groove cooperates with the misaligned wiring plate so that the upper circuit board can be flipped and fixed to the mounting portion after being electrically connected to the main conditioning circuit board through the flexible flat cable.

[0012] In some embodiments, the sensor further includes a shaped connector coaxially connected to the inner support frame and an outer sleeve coaxially sleeved on the shaped connector, wherein the outer sleeve completely encapsulates the inner support frame, the upper circuit board, the main conditioning circuit board, and the metal base and welds them to the housing structure.

[0013] In some embodiments, the circumferential wall of the metal base is provided with at least two first slots spaced apart, and the bottom end face of the inner support frame is provided with a first buckle that engages with the slots; and / or the side wall of the upper circuit board is provided with at least two limiting grooves spaced apart, and the side wall of the inner support frame is provided with at least two second slots, each second slot communicating with the limiting groove in the axial direction, and the bottom end face of the irregular connector is provided with a second buckle that passes through the limiting groove and engages with the slot.

[0014] In some embodiments, the mounting portion is provided with at least two positioning pins offset from the end face of the main conditioning circuit board, and the upper circuit board is provided with positioning holes that cooperate with the positioning pins.

[0015] The one or more technical solutions provided in the second aspect of this application have at least the following technical effects or advantages: The sensor provided in this application improves sealing reliability and structural vibration resistance by integrating a temperature, humidity and pressure sensor core, avoiding the risks of aging and cracking of traditional rubber seals and multi-point welding detachment, and ensuring that the accuracy of parameter monitoring is not affected by harsh working conditions; the coaxial connection design between the inner support frame and the metal base ensures both assembly coaxiality and structural stability, and the mounting parts spaced apart from the main conditioning circuit board in the axial direction provide a precise mounting reference for the upper circuit board, which is combined with the staggered wiring boards that are respectively attached to the bottom surfaces of the upper circuit board and the main conditioning circuit board, and the electrical connection between the two constructed by the flexible flat cable. The passageway effectively prevents excessive bending of the flexible flat cable due to space constraints, improving the long-term stability of the electrical connection. The inner support frame has clearance grooves along the axial direction at both ends, extending to the mounting part and the main conditioning circuit board, forming a precise fit with the misaligned wiring board. This provides reliable housing and protection space for the flexible flat cable, and also supports flipping and fixing after connection to the upper circuit board. The optimized compact layout of the overall structure simplifies the assembly process, reduces the interference of process parameter fluctuations on product quality, adapts to the miniaturized integration requirements of automotive grade, reduces the difficulty of quality control and production costs, and ensures that the sensor can stably achieve accurate acquisition, transmission and processing of temperature, humidity and pressure parameters under harsh conditions of continuous vibration, high temperature and high pressure.

[0016] Thirdly, this application also provides a sensor packaging method, which is applied to a sensor as described in any of the second aspects above, comprising: placing a sintered blank on the corresponding positions of multiple conductive pins, then simultaneously inserting the conductive pins with the sintered blank on them into the receiving cavity of a metal base, and cooling and solidifying them after high-temperature sintering to solidify and seal the conductive pins with the metal base to obtain a composite sintered base; pre-setting blind holes matching the number of conductive pins on a temperature and humidity circuit board, inserting the end of the conductive pin away from the metal base into the blind hole, and completing the fixed connection between the two by a soldering process; attaching and fixing two misaligned wiring boards to the opposite end faces of the main conditioning circuit board and the upper circuit board respectively, and the two misaligned wiring boards are pre-connected by a flexible flat cable; and connecting the main conditioning circuit board through... The conductive pin is fixed to the preset end face of the metal base by an adhesive bonding process. The end of the conductive pin away from the temperature and humidity circuit board is inserted into the preset through hole of the main conditioning circuit board. The conductive pin is electrically connected to the main conditioning circuit board by any of the following methods: soldering, fisheye pin crimping, or wire bonding. The inner support frame is coaxially snapped and fixed to the metal base. The upper circuit board is flipped upward along the extension direction of the flexible flat cable so that the upper circuit board is snapped and positioned in the mounting part of the inner support frame, and the flexible flat cable is limited to the relief groove of the inner support frame. The irregular connector is coaxially snapped and fixed to the inner support frame. The outer sleeve is used to encapsulate the inner support frame, upper circuit board, main conditioning circuit board, and metal base from top to bottom. The end of the outer sleeve away from the irregular connector is fixedly connected to the shell structure by laser welding.

[0017] The one or more technical solutions provided in the third aspect of this application have at least the following technical effects or advantages: The sensor packaging method provided in this application adopts an integrated sintering process of sintering conductive pins and metal bases onto sintered blanks, forming a solid structure with better resistance to high temperature, high pressure, and corrosion, replacing traditional dispensing, welding, and rubber sealing, avoiding the risks of rubber aging and solder joint detachment, and improving sealing reliability and vibration resistance; the connection is ensured by pre-positioning holes on the temperature and humidity circuit board and inserting conductive pins with tin-filled soldering, simplifying the assembly process; the pre-assembly of the misaligned wiring board, the pre-connection of the flexible flat cable and the positioning and accommodation of the clearance groove, and the flip-and-locking process of the upper circuit board avoid excessive bending of the flexible flat cable, achieving a compact layout; the rapid positioning through coaxial snap-fit ​​fastening, combined with the overall packaging of the outer sleeve and laser welding fixation, improves the overall integrity and sealing of the sensor structure, reduces dispersed assembly links, reduces the impact of process fluctuations, improves quality consistency, reduces production costs, adapts to harsh automotive-grade working conditions, and ensures stable and accurate operation of the sensor.

[0018] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 is a first-view structural schematic diagram of the sensor core provided according to an embodiment of this application; Figure 2 is a second-view structural schematic diagram of the sensor core provided according to an embodiment of this application; Figure 3 is a cross-sectional view along the AA direction in Figure 2; Figure 4 is a first-view structural schematic diagram of the composite sintering seat provided according to an embodiment of this application; Figure 5 is a second-view structural schematic diagram of the composite sintering seat provided according to an embodiment of this application; Figure 6 is a cross-sectional view along the BB direction in Figure 5; Figure 7 is a first-view structural schematic diagram of the sensor provided according to an embodiment of this application; Figure 8 is a structural schematic diagram of the sensor's internal structure provided according to an embodiment of this application; Figure 9 is a structural schematic diagram of the inner support frame provided according to an embodiment of this application; Figure 10 is a first-view structural schematic diagram of the misaligned wiring board and flexible flat cable provided according to an embodiment of this application; Figure 11 is a first-view structural schematic diagram of the misaligned wiring board and flexible flat cable provided according to an embodiment of this application; Figure 12 is a second-view structural schematic diagram of the sensor provided according to an embodiment of this application; Figure 13 is a cross-sectional view along the CC direction in Figure 12; Figure 14 is a structural schematic diagram of the outer sleeve provided according to an embodiment of this application.

[0021] Reference numerals: 1000, sensor; 100, sensor core; 10, housing structure; 11, medium flow channel; 111, expansion cavity; 20, composite sintering base; 21, metal base; 211, receiving cavity; 212, pressure guiding hole; 213, boss; 214, fitting groove; 215, first slot; 22, conductive pin; 23, sintered body; 24, insulator; 241, through hole; 30, main conditioning circuit board; 31, notch; 40, pressure sensing chip; 50 51. Temperature and humidity sensing component; 52. Temperature and humidity circuit board; 53. Temperature and humidity sensing chip; 54. Blind hole; 55. Inner support frame; 26. Mounting part; 27. Positioning pin; 28. Clearance groove; 29. ​​First buckle; 20. Second buckle groove; 200. Upper circuit board; 301. Limiting groove; 302. Positioning hole; 400. Offset wiring board; 410. Flexible flat cable; 500. Irregularly shaped connector; 510. Connector; 511. Second buckle; 512. Limiting hole; 520. Spring terminal; 600. Outer sleeve; 601. Irregularly shaped hole; Z, Axis direction. Detailed Implementation

[0022] The embodiments of this application are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. It should be understood that the specific embodiments described herein are merely for explaining this application and are not intended to limit this application.

[0023] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0025] Please refer to Figures 1 to 3. This embodiment provides a temperature, humidity, and pressure sensor core. The sensor core 100 may include a housing structure 10, a composite sintered base 20, a main conditioning circuit board 30, a pressure sensing chip 40, and a temperature and humidity sensing component 50. The housing structure 10 is made of metal and has a medium flow channel 11 extending through it along the axial direction Z. The composite sintered base 20 is connected to one end of the housing structure 10 and includes a metal base 21 and a conductive pin 22. The metal base 21 has a receiving cavity 211 and pressure guiding holes 212 spaced apart from the receiving cavity 211 along the axial direction Z. At least one The conductive needle 22 passes through the receiving cavity 211 along the axial direction Z and is fixed by a sintering process; wherein, a sintered body 23 sealing the receiving cavity 211 is formed by sintering inside the receiving cavity 211, one end of the conductive needle 22 protrudes from the end face of the metal base 21, and the other end extends along the medium flow channel 11 and protrudes from the end face of the shell structure 10; the main conditioning circuit board 30 is covered on the end face of the metal base 21 away from the shell structure 10 and is electrically connected to the conductive needle 22; the pressure sensing chip 40 is disposed on the metal base 21 and blocks the end of the pressure guiding hole 212 away from the medium flow channel 11; the temperature and humidity sensing component 50 is electrically connected to the end of the conductive needle 22 away from the main conditioning circuit board 30.

[0026] It should be noted that the shell structure 10 can be integrally molded from automotive-grade corrosion-resistant and wear-resistant metal material. The composite sintered base 20 is coaxially fixed to one end of the shell structure 10, forming an integrated force-bearing structure with the shell structure 10. The metal base 21 is made of metal material compatible with the shell structure 10, and its outer contour is equivalent to the outer contour of the shell structure 10 along the Z-projection contour of the axial direction. At the same time, the metal base 21 and the shell structure 10 can be fixedly sealed at the connection point by laser welding. When the composite sintered base 20 and the shell structure 10 are coaxially fixedly connected, the end of the medium flow channel 11 near the composite sintered base 20 is completely sealed. The receiving cavity 211 opened in the composite sintered base 20 is a through cavity. The receiving cavity 211 provides installation space for the conductive needle 22 to be fixedly connected to the metal base 21 and for the sintered body 23, and runs through the central axis. The pressure guiding hole 212 and the receiving cavity 211 are eccentrically spaced, so that the pressure guiding hole 212 and the medium flow channel 11 form an independent pressure transmission path, realizing that temperature and humidity detection and pressure detection are independent of each other.

[0027] It should also be noted that the number of conductive pins 22 can be set to multiple. In this embodiment, the number of conductive pins 22 is four. The specific number can be selected according to actual needs. A preset insulation distance is maintained between adjacent conductive pins 22. One end of the conductive pin 22 protrudes from the end face of the housing structure 10, which facilitates the collection of temperature and humidity parameters of the flow channel in the vehicle pipeline system. The conductive pin 22 serves as the core carrier for electrical signal transmission. One end is fixed to the temperature and humidity circuit board 51 by welding to receive the original signal collected by the temperature and humidity sensing chip 52. The other end is electrically connected to the main conditioning circuit board 30 by welding, pressing or bonding to transmit the original signal to the main conditioning circuit board 30 for processing. The sintered body 23 forms a mechanical limit to prevent the conductive pin 22 from moving axially and circumferentially. The sintered body 23 can be formed by vacuum high-temperature sintering of glass sintering blank and furnace cooling and solidification. It has a dense block structure that completely fills the gap of the metal base 21 receiving cavity 211 and forms a completely sealed joint surface with the outer periphery of the conductive pin 22 and the inner wall of the receiving cavity 211.

[0028] Meanwhile, it should be understood that the temperature and humidity sensing chip 52 and the pressure sensing chip 40 can be obtained from existing technologies. Their specific structures and working principles will not be elaborated here. The main conditioning circuit board 30 is covered on the end face of the metal base 21 away from the housing structure 10 by an adhesive bonding process. Its preset through holes are precisely aligned with the protruding ends of the conductive pins 22. A stable electrical connection is established by soldering, fisheye pin crimping, or wire bonding to achieve centralized signal conditioning. The pressure sensing chip 40 is fixed to the end face of the metal base 21 away from the housing structure 10 by an adhesive bonding process. The chip precisely seals the end of the pressure guiding hole 212 away from the medium flow channel 11. The sensing surface of the chip is in direct contact with the medium pressure in the pressure guiding hole 212 to ensure the timeliness and accuracy of pressure signal transmission. The temperature and humidity sensing component 50 is electrically connected to the end of the conductive pin 22 away from the main conditioning circuit board 30 to achieve independent acquisition and transmission of temperature and humidity signals.

[0029] The sensor core 100 provided in this embodiment provides a medium transmission path through the medium flow channel 11 of the shell structure 10. Combined with the integrated design of the composite sintering base 20, the receiving cavity 211 of the metal base 21 and the sintered body 23 form a sealed structure. With the conductive needle 22 solidified and fixed based on the sintering process, it replaces the traditional dispensing, multi-point welding and rubber sealing solutions. This avoids the aging and cracking problems of rubber materials under high temperature, high pressure, vibration and alternating temperature and humidity environments, and also avoids the risk of desoldering at multiple welding points due to continuous vibration. This improves the sealing reliability and structural vibration resistance of the sensor core 100, and ensures the accuracy of pressure measurement. Affected by sealing failure; at the same time, the composite sintered base 20 integrates conductive transmission and sealing protection functions into one, and with the pressure sensing chip 40 sealing the pressure guide hole 212, the temperature and humidity sensing component 50 being directly electrically connected to the conductive needle 22, and the main conditioning circuit board 30 being covered and connected in a compact layout, the number of independent components is greatly reduced, effectively compressing the overall space occupied, which is very suitable for the automotive-grade miniaturized integration requirements, and simplifies the assembly process, reduces the impact of process parameter fluctuations on product quality, thereby reducing the difficulty of quality control and production costs, and ensuring that the sensor core 100 can stably achieve accurate monitoring of temperature, humidity and pressure parameters under harsh automotive-grade working conditions.

[0030] In some embodiments, referring to FIG4, the composite sintering base 20 further includes an insulator 24 disposed on the conductive needles 22. The insulator 24 is spaced apart from the metal base 21, and at least one through hole 241 is provided on the insulator 24. Multiple conductive needles 22 are provided, and the multiple conductive needles 22 are spaced apart around the through hole 241. The projected outline of the multiple conductive needles 22 along the axial direction Z is located within the projected outline of the insulator 24. Specifically, the insulator 24 can be made of insulating ceramic or glass material by sintering. In this way, the multiple conductive needles 22 are fixed and limited at the end near the temperature and humidity component. At the same time, the projected outline of the insulator 24 along the axial direction Z is located within the projected outline of the medium flow channel 11.

[0031] This configuration prevents electrical connection between the conductive pins 22 and the housing structure 10. The insulator 24 has at least one through hole 241 extending along the axial direction Z. This through hole 241 is used for medium conduction to avoid blockage of the medium flow channel 11. Multiple conductive pins 22 are arranged in a ring with equal intervals around the through hole 241, and the projected outline of each conductive pin 22 along the axial direction Z is completely within the projected outline of the insulator 24. The insulator 24 forms a radial limit on the conductive pins 22 to prevent the conductive pins 22 from swaying under vibration conditions. At the same time, it ensures that the insulation distance between each conductive pin 22 meets the electrical safety requirements and reduces the risk of signal crosstalk.

[0032] In some embodiments, referring to Figures 3 and 4, the temperature and humidity sensing component 50 includes a temperature and humidity circuit board 51 and a temperature and humidity sensing chip 52 disposed on the temperature and humidity circuit board 51. Multiple conductive pins 22 are electrically connected to the temperature and humidity circuit board 51 at one end away from the main conditioning circuit board 30. The temperature and humidity circuit board 51 has blind holes 511 adapted to the conductive pins 22, and one end of each conductive pin 22 extends into the blind hole 511 and is soldered and fixed. The temperature and humidity circuit board 51 can be made of a miniaturized rigid PCB board, and its surface is covered with a moisture-proof insulating coating to improve environmental adaptability. The sensing chip 52 can be disposed on the upper or lower surface of the temperature and humidity circuit board 51. At the same time, the temperature and humidity circuit board 51 has a blind hole 511 that matches the outer diameter of the conductive pin 22 at the corresponding position. The inner wall of the blind hole 511 is metallized to enhance conductivity. After one end of the conductive pin 22 is inserted into the blind hole 511 to a preset depth, solder is filled by laser brazing process to form a strong metallurgical bond between the conductive pin 22 and the blind hole 511. This improves the vibration resistance of the connection structure while ensuring low contact resistance of the electrical connection and avoids desoldering failure during long-term use.

[0033] In some embodiments, referring to Figures 3 and 5, the medium flow channel 11 has an enlarged cavity 111 coaxially disposed at one end near the metal base 21; the metal base 21 has a boss 213 and a fitting groove 214 surrounding the boss 213 at one end near the housing structure 10; wherein, the boss 213 extends into the enlarged cavity 111, and the two intersecting inner surfaces of the fitting groove 214 are respectively sealed and fitted to the end face of the metal base 21 and at least part of the inner sidewall of the enlarged cavity 111, so that the enlarged cavity 111 communicates only with the medium flow channel 11 and the pressure guiding hole 212; specifically, the inner wall of the enlarged cavity 111 can be configured as a conical transition structure to facilitate the positioning and assembly of the metal base 21; the metal base 21 is located near the housing. One end of the structure 10 is integrally formed with a boss 213 and an annular fitting groove 214 surrounding the boss 213. The outer diameter of the boss 213 is adapted to the inner diameter of the expansion cavity 111. It extends along the axis into the expansion cavity 111 and fits against the conical surface of the expansion cavity 111, realizing the coaxial positioning and pre-tightening of the metal base 21 and the shell structure 10. The fitting groove 214 is composed of mutually perpendicular axial end faces and radial end faces. The two inner surfaces are tightly fitted against the end face of the metal base 21 and the inner sidewall of the expansion cavity 111, respectively. Then, the metal base 21 and the shell structure 10 are connected and fixed by laser welding to ensure that the expansion cavity 111 is only sealed and connected to the medium flow channel 11 and the pressure guide hole 212 to avoid medium leakage.

[0034] In some embodiments, referring to Figures 4 and 6, a notch 31 is provided on the main conditioning circuit board 30 near the pressure guide hole 212. The pressure sensing chip 40 is connected to the metal base 21 through the notch 31, and the pressure sensing chip 40 completely covers and seals one end of the pressure guide hole near the main conditioning circuit board 30. Specifically, the outline of the notch 31 is adapted to the package shape of the pressure sensing chip 40, and a flat mounting reference surface is formed on the metal base 21 at its bottom. The pressure sensing chip 40 is fixed to the reference surface by an adhesive process, and the sensing area of ​​the chip completely covers the pressure guide hole 212 near the main conditioning circuit. At one end of the board 30, multiple electrical connection points can be set on the main conditioning circuit board 30 near the notch 31. The pressure sensing chip 40 and the main conditioning circuit board 30 are electrically connected through bonding wires. The design of the notch 31 provides independent installation space for the pressure sensing chip 40, avoiding interference with other electronic components on the main conditioning circuit board 30, and shortens the distance between the pressure sensing chip 40 and the pressure guide hole 212, improving the transmission efficiency of the pressure signal. The outer periphery of the chip can also be coated with high-temperature resistant sealant to further enhance the sealing performance of the pressure guide hole 212 and prevent external moisture or impurities from entering and affecting the detection accuracy.

[0035] It should be noted that in some embodiments, the sintered body 23 can be integral glass sintering or independent terminal glass sintering. The temperature and humidity sensing circuit board and one end of the conductive pin 22 can be electrically connected in various forms. In the above embodiments, only the circuit board blind hole 511 design is preferred and tin-filled reflow soldering is performed. Meanwhile, the other end of the conductive pin 22 can be electrically connected to the main conditioning circuit in various forms, with tin soldering, fish-eye pin crimping, or bonding wire preferred.

[0036] Please refer to Figures 7 to 11. This embodiment provides a sensor 1000, which includes a temperature, humidity, and pressure sensor core 100, an inner support frame 200, and an upper circuit board 300 as described in any of the above embodiments. The inner support frame 200 is coaxially connected to one end of the metal base 21 away from the housing structure 10. The inner support frame 200 has a mounting portion 210 spaced Z-distance from the main conditioning circuit board 30 in the axial direction. The upper circuit board 300 is disposed on the mounting portion 210 and electrically connected to the main conditioning circuit board 30. The upper circuit board 300... The bottom surface of the upper circuit board 30 and the bottom surface of the main conditioning circuit board 30 are respectively fitted with misaligned wiring boards 400. The two misaligned wiring boards 400 are connected by a flexible flat cable 410. The edge of the inner support frame 200 is provided with a relief groove 230 along the axial direction Z. The two ends of the relief groove 230 extend to the mounting part 210 and the main conditioning circuit board 30 respectively. The relief groove 230 cooperates with the misaligned wiring board 400 so that the upper circuit board 300 can be flipped and fixed to the mounting part 210 after being electrically connected to the main conditioning circuit board 30 through the flexible flat cable 410.

[0037] It should be noted that the inner support frame 200 can be integrally injection molded from engineering plastic to reduce the manufacturing cost of the sensor. The overall outline of the inner support frame 200 can be cylindrical, with a multi-support arm type mounting part 210 integrally formed at the other end. The axis of the inner support frame 200 is collinear with the axis of the metal base 21 and the housing structure 10. The mounting part 210 and the main conditioning circuit board 30 maintain a preset distance in the axial direction Z, forming an independent space for mounting the upper circuit board 300. The upper circuit board 300 adopts a high-density wiring PCB board, which is adapted to the outline size of the mounting part 210. The upper circuit board 300 receives the temperature, humidity, and pressure preprocessing signals transmitted by the main conditioning circuit board 30, and can further complete the secondary integration of signals, protocol conversion, or external interface adaptation.

[0038] It should also be noted that, to solve the problem of difficult electrical connection caused by the need for spatial spacing and staggered arrangement of the two circuit boards, staggered wiring boards 400 are respectively bonded and fixed to the bottom surface of the upper circuit board 300 and the bottom surface of the main conditioning circuit board 30 using thermally conductive and conductive adhesive or reflow soldering process. The staggered wiring board 400 can be made of thin rigid PCB. The substrate is made with metallized conductive pads etched on its surface. Two staggered connectors 400 are connected by a flexible flat cable 410. The conductive terminals at both ends of the flexible flat cable 410 can be firmly bonded to the connector pads through a soldering process, ensuring low contact resistance and vibration resistance reliability. One end of the clearance groove 230 extends through to the lower surface of the mounting part 210, and the other end extends to the corresponding mating area of ​​the main conditioning circuit board 30. The width of the groove is precisely matched with the width of the flexible flat cable 410, and the depth of the groove is sufficient to accommodate the thickness of the flexible flat cable 410. The position layout of the clearance groove 230 and the staggered connectors 400 forms a precise match, so that after the upper circuit board 300 is pre-connected to the main conditioning circuit board 30 through the flexible flat cable 410, it can flexibly rotate around the connection end of the flexible flat cable 410 and finally be stably mated to the mounting part 210 for fixation. The entire connection structure does not require additional fasteners, which simplifies the assembly process and absorbs vibration stress through the flexibility of the flexible flat cable 410, ensuring the stability of the electrical connection under harsh working conditions.

[0039] The sensor 1000 provided in this embodiment improves sealing reliability and structural vibration resistance by integrating a temperature, humidity, and pressure sensor core 100, avoiding the risks of aging and cracking of traditional rubber seals and multi-point welding detachment, and ensuring that the accuracy of parameter monitoring is not affected by harsh working conditions. The coaxial connection design between the inner support frame 200 and the metal base 21 ensures assembly coaxiality and structural stability. The mounting part 210, which is spaced Z-interval with the main conditioning circuit board 30 in the axial direction, provides a precise mounting reference for the upper circuit board 300. Combined with the misaligned wiring plates 400 that are respectively attached to the bottom surfaces of the upper circuit board 300 and the main conditioning circuit board 30, and the electrical connection path between the two constructed by the flexible flat cable 410, the problems of the flexible flat cable 410 are effectively avoided. Excessive bending due to space constraints improves the long-term stability of the electrical connection. The inner support frame 200 has Z-shaped openings along the axial direction and extends to the mounting part 210 and the main conditioning circuit board 30 at both ends, forming a precise fit with the misaligned wiring board 400. This provides reliable housing and protection space for the flexible flat cable 410 and supports the flip-fixing of the upper circuit board 300 after connection. It optimizes the compact layout of the overall structure, simplifies the assembly process, reduces the interference of process parameter fluctuations on product quality, adapts to the miniaturized integration requirements of automotive grade, reduces the difficulty of quality control and production costs, and ensures that the sensor can stably achieve accurate acquisition, transmission and processing of temperature, humidity and pressure parameters under harsh working conditions of continuous vibration, high temperature and high pressure.

[0040] In some embodiments, please refer to Figures 4, 8 and 9. The circumferential wall of the metal base 21 is provided with at least two first slots 215 spaced apart. The bottom end face of the inner support frame 200 is provided with a first buckle 240 that engages with the slots. And / or the side wall of the upper circuit board 300 is provided with at least two limiting grooves 301 spaced apart. The side wall of the inner support frame 200 is provided with at least two second slots 250. Each second slot 250 communicates with the limiting groove 301 in the axial direction Z. The bottom end face of the irregular connector 500 is provided with a second buckle 511 that passes through the limiting groove 301 and engages with the slot.

[0041] Specifically, two first slots 215 are symmetrically arranged on opposite sides of the metal base 21. The first slot 215 has a groove structure with a flat limiting surface at the bottom. The bottom end of the inner support frame 200 corresponds to the position of the first slot 215 and is integrally formed with a first buckle 240 that has elastic deformation capability. The buckle adopts a wedge-shaped or hook-shaped design, and its material selection and structural thickness are selected according to actual needs to ensure that moderate elastic deformation can be generated during assembly. After being inserted into the slot, it forms a pre-tightening force through its own elastic recovery and fits tightly with the limiting surface of the slot. This structure can achieve rapid coaxial positioning and fixation of the inner support frame 200 and the metal base 21 without additional fasteners, while ensuring the consistency of their axes and avoiding internal component interference caused by assembly deviation. In addition, the buckle and slot can absorb some vibration energy and improve the vibration resistance stability of the structure.

[0042] Further, please refer to Figures 8, 9, and 13. For the fixing of the upper circuit board 300, the inner support frame 200, and the irregular connector 500, at least two axially penetrating limiting grooves 301 are evenly spaced along the circumferential direction on the side wall of the upper circuit board 300, and the groove width is precisely matched with the size of the second buckle 511. Corresponding to the position of the limiting groove 301, the side wall of the inner support frame 200 has at least two second slots 250 that are aligned and connected to the limiting groove 301 in the Z-axis direction. The second slots 250 have a circumferential limiting function. It should be noted that the second slots 250 and the clearance grooves 230 are staggered, and the number of second slots 250 should correspond to the limiting grooves 301. The bottom end of the irregular connector 500 corresponds to the position of the limiting groove 301, and the second buckle is integrally formed with a rigid or elastic design. 511. The buckle shape is perfectly matched with the second slot 250. During assembly, the upper circuit board 300 is first pre-positioned in the mounting part 210 of the inner support frame 200 through the positioning structure. Then, the irregular connector 500 is moved coaxially to the inner support frame 200, so that the second buckle 511 is inserted axially along the limiting groove 301 of the upper circuit board 300. Subsequently, the second buckle 511 is snapped into the second slot 250 of the inner support frame 200, forming a triple fixation between the upper circuit board 300 and the inner support frame 200, and between the irregular connector 500 and the inner support frame 200. This not only restricts the axial movement and circumferential rotation of the upper circuit board 300, but also strengthens the connection between the irregular connector 500 and the inner support frame 200. The limiting groove 301 also serves as an assembly guide, ensuring accurate alignment of each component and improving the efficiency of batch assembly.

[0043] Of course, it should also be noted that the specific structure of the irregular connector 500 varies depending on the application scenario. The irregular connector 500 in this embodiment only shows a structure for an automotive-grade application scenario. Preferably, in one example, the irregular connector 500 includes a connector 510 with four limiting holes 512 inside. The four limiting holes 512 are through holes that pass through along the Z-axis direction. At the same time, four spring terminals 520 are provided in the four limiting holes 512. When the irregular connector 500 is snapped onto the inner support frame 200, pressing down causes one end of the four springs to be electrically connected to the upper circuit board 300. Then, the signals of the upper circuit board 300 are transmitted to the external processor or signal receiving device through the four spring terminals 520, thereby realizing signal transmission.

[0044] In some embodiments, referring to Figures 8 and 9, the mounting part 210 is provided with at least two positioning pins 220 offset from the end face of the main conditioning circuit board 30. The upper circuit board 300 is provided with positioning holes 302 that cooperate with the positioning pins 220. Specifically, in order to further improve the assembly accuracy of the upper circuit board 300 and the mounting part 210 of the inner support frame 200 and avoid the flexible flat cable 410 from being pulled or the buckle from failing to engage properly due to misalignment, the mounting part 210 is provided with at least two positioning pins 220 evenly offset from the end face of the main conditioning circuit board 30 in the circumferential direction. In this embodiment, four positioning pins 220 are preferably provided at intervals. The positioning pins 220 and the mounting part 210 can be integrally formed by a mold, and the whole is cylindrical, which is convenient for quick insertion during assembly. The upper circuit board 300 is provided with positioning holes 302 at the positions corresponding to the positioning pins 220. The inner diameter of the positioning hole 302 and the outer diameter of the positioning pin 220 adopt a transition fit design to ensure positioning accuracy and avoid damage to the circuit board due to excessive tightness during assembly.

[0045] During assembly, the positioning pin 220 is inserted into the positioning hole 302 to achieve real-time pre-positioning of the upper circuit board 300 on the mounting part 210, precisely limiting the circumferential rotation and radial displacement of the upper circuit board 300. This ensures that key structures such as the limiting groove 301 and electrical connection pads of the upper circuit board 300 are fully aligned with components such as the second slot 250 of the inner support frame 200, providing a precise reference for subsequent snap-fit ​​and electrical connection assembly. This effectively avoids problems such as excessive bending and poor contact of the flexible flat cable 410 caused by assembly deviations. Combined with the snap-fit ​​structure, it forms a double positioning and fixing, improving the stability and consistency of the upper circuit board 300 installation, and adapting to the needs of compact sensor layout and mass production.

[0046] In some embodiments, referring to Figures 12 to 14, the sensor further includes a shaped connector 500 coaxially connected to the inner support frame 200 and an outer sleeve 600 coaxially sleeved on the shaped connector 500. The outer sleeve 600 completely encapsulates the inner support frame 200, the upper circuit board 300, the main conditioning circuit board 30, and the metal base 21 and welds them to the housing structure 10. Specifically, one end of the outer sleeve 600 is provided with a shaped hole 601 that matches the end structure of the shaped connector 500. In this way, during the installation of the outer sleeve 600, the end of the shaped connector 500 can be limited and fixed, further enhancing the overall structural integrity and environmental protection capabilities.

[0047] Furthermore, the outer sleeve 600 can be made of corrosion-resistant metal and processed into a cylindrical structure with open ends. Its inner diameter is sequentially adapted to the outer circumference of the irregular connector 500, the inner support frame 200, and the metal base 21. Its axial length completely covers the overall axial range of the inner support frame 200, the upper circuit board 300, the main conditioning circuit board 30, and the metal base 21. During assembly, it is inserted from one end of the irregular connector 500 until its bottom end fits and is positioned against the outer circumference of the housing structure 10. Then, the outer sleeve 600 is fixedly connected to the housing structure 10 through laser welding, forming a continuous and dense annular weld. This ensures the connection strength and avoids damage to the internal electronic components caused by high temperature conduction. The outer sleeve 600, through full-encapsulation, completely isolates the internal core components from the external environment, effectively blocking the intrusion of dust, moisture, and corrosive media. At the same time, it improves the overall vibration resistance, sealing performance, and environmental adaptability of the sensor, making it suitable for complex and harsh working scenarios in automotive applications.

[0048] In some embodiments, a sensor packaging method is also provided, the method being applied to a sensor as described in any of the above embodiments, the packaging method comprising the following steps S100-S600: Step S100: A sintered blank is fitted onto the corresponding positions of multiple conductive pins, and then the conductive pins fitted with the sintered blank are simultaneously inserted into the receiving cavity of a metal base, and after high-temperature sintering treatment, cooled and solidified to solidify and seal the conductive pins with the metal base, thereby obtaining a composite sintered base; Step S200: Blind holes matching the number of conductive pins are pre-set on the temperature and humidity circuit board, and the end of the conductive pin away from the metal base is inserted into the blind hole, and the two are fixedly connected by a soldering process; Step S300: Two misaligned wiring boards are respectively attached and fixedly connected on the opposite end faces of the main conditioning circuit board and the upper circuit board, and the two misaligned wiring boards are pre-connected by a flexible flat cable. Step S400: Fix the main conditioning circuit board to the preset end face of the metal base using an adhesive bonding process. Insert the end of the conductive pin away from the temperature and humidity circuit board into the preset through hole of the main conditioning circuit board. Use any one of the following methods: soldering, fisheye pin crimping, or wire bonding to form an electrical connection between the conductive pin and the main conditioning circuit board. Step S500: Coaxially snap-fit ​​the inner support frame to the metal base. Flip the upper circuit board upward along the extension direction of the flexible flat cable so that the upper circuit board is snapped and positioned in the mounting part of the inner support frame, and the flexible flat cable is limited to the clearance groove of the inner support frame. Step S600: Coaxially snap-fit ​​the irregular connector to the inner support frame. Encapsulate the inner support frame, upper circuit board, main conditioning circuit board, and metal base as a whole from top to bottom with the outer sleeve. The end of the outer sleeve away from the irregular connector is fixedly connected to the shell structure by laser welding.

[0049] The sensor packaging method provided in this embodiment adopts an integrated sintering process where conductive pins are fitted onto a sintered blank and a metal base, forming a solid structure with better resistance to high temperatures, high pressures, and corrosion. This replaces traditional dispensing, welding, and rubber sealing, avoiding the risks of rubber aging and solder joint detachment, and improving sealing reliability and vibration resistance. Pre-set holes on the temperature and humidity circuit board and the conductive pin insertion are combined with tin-filled soldering to ensure precise and secure connections, simplifying the assembly process. Pre-assembly using a staggered wiring board, pre-connection of the flexible flat cable, positioning and accommodating with clearance slots, and flip-and-locking of the upper circuit board prevent excessive bending of the flexible flat cable, achieving a compact layout. Coaxial snap-fit ​​fastening for rapid positioning, combined with overall packaging of the outer sleeve and laser welding for fixation, improves the overall structural integrity and sealing of the sensor, reduces dispersed assembly steps, minimizes the impact of process fluctuations, improves quality consistency, reduces production costs, adapts to harsh automotive-grade operating conditions, and ensures stable and accurate sensor operation.

[0050] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial direction", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the invention.

[0051] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0052] Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. The reference to "embodiment" herein means that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily indicate the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0053] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A temperature, humidity, and pressure sensor core, characterized in that, include: A housing structure with a medium flow channel along its axial direction; a composite sintering base connected to one end of the housing structure, the composite sintering base including a metal base and conductive pins; the metal base having a receiving cavity and pressure guiding holes spaced apart from the receiving cavity along its axial direction, at least one of the conductive pins passing through the receiving cavity along its axial direction and fixed by a sintering process; wherein, a sintered body sealing the receiving cavity is formed within the receiving cavity, one end of the conductive pin protruding from the end face of the metal base, and the other end extending along the medium flow channel and protruding from the end face of the housing structure; a main conditioning circuit board covering the end face of the metal base opposite to the housing structure and electrically connected to the conductive pins; a pressure sensing chip disposed on the metal base and sealing the end of the pressure guiding hole opposite to the medium flow channel; and a temperature and humidity sensing component electrically connected to the end of the conductive pin opposite to the main conditioning circuit board.

2. The temperature, humidity, and pressure sensor core according to claim 1, characterized in that, The composite sintering base also includes an insulator disposed on the conductive needle, the insulator being spaced apart from the metal base, and the insulator having at least one through hole; multiple conductive needles are disposed, the multiple conductive needles being spaced apart around the through hole, and the projected outline of the multiple conductive needles along the axial direction being located within the projected outline of the insulator.

3. The temperature, humidity, and pressure sensor core according to claim 2, characterized in that, The temperature and humidity sensing component includes a temperature and humidity circuit board and a temperature and humidity sensing chip disposed on the temperature and humidity circuit board. Multiple conductive pins are electrically connected to the temperature and humidity circuit board at one end away from the main conditioning circuit board. The temperature and humidity circuit board has blind holes adapted to the conductive pins, and one end of the conductive pin extends into the blind hole and is soldered and fixed.

4. The temperature, humidity, and pressure sensor core according to claim 1, characterized in that, The medium flow channel is coaxially provided with an enlarged cavity at one end near the metal base; the metal base is provided with a boss and a fitting groove surrounding the boss at one end near the housing structure; wherein the boss extends into the enlarged cavity, and the two intersecting inner surfaces of the fitting groove are respectively sealed and fitted to the end face of the metal base and at least part of the inner sidewall of the enlarged cavity, so that the enlarged cavity communicates only with the medium flow channel and the pressure guiding hole.

5. The temperature, humidity, and pressure sensor core according to any one of claims 1-4, characterized in that, The main conditioning circuit board has a notch near the pressure guide hole. The pressure sensing chip is connected to the metal base at the notch, and the pressure sensing chip completely covers and seals the pressure guide hole near one end of the main conditioning circuit board.

6. A sensor, characterized in that, The sensor includes: a temperature, humidity, and pressure sensor core as described in any one of claims 1-5; an inner support frame coaxially connected to one end of the metal base away from the housing structure, the inner support frame having a mounting portion spaced apart from the main conditioning circuit board in the axial direction; an upper circuit board disposed on the mounting portion and electrically connected to the main conditioning circuit board; wherein, the bottom surface of the upper circuit board and the bottom surface of the main conditioning circuit board are respectively fitted with misaligned wiring plates, the two misaligned wiring plates are connected by a flexible flat cable, the edge of the inner support frame is provided with a clearance groove along the axial direction, the two ends of the clearance groove extend to the mounting portion and the main conditioning circuit board respectively, wherein the clearance groove cooperates with the misaligned wiring plate so that the upper circuit board can be flipped and fixed to the mounting portion after being electrically connected to the main conditioning circuit board through the flexible flat cable.

7. The sensor according to claim 6, characterized in that, The sensor also includes an irregularly shaped connector coaxially connected to the inner support frame and an outer sleeve coaxially sleeved on the irregularly shaped connector. The outer sleeve completely encapsulates the inner support frame, the upper circuit board, the main conditioning circuit board, and the metal base and welds them to the housing structure.

8. The sensor according to claim 6, characterized in that, The circumferential wall of the metal base is provided with at least two first slots spaced apart, and the bottom end face of the inner support frame is provided with a first buckle that engages with the slots; and / or the side wall of the upper circuit board is provided with at least two limiting grooves spaced apart, and the side wall of the inner support frame is provided with at least two second slots, each second slot communicating with the limiting groove in the axial direction, and the bottom end face of the irregular connector is provided with a second buckle that passes through the limiting groove and engages with the slot.

9. The sensor according to claim 6, characterized in that, The mounting section is provided with at least two positioning pins offset from the end face of the main conditioning circuit board, and the upper circuit board is provided with positioning holes that cooperate with the positioning pins.

10. A sensor packaging method, characterized in that, The method, applied to the sensor as described in any one of claims 6-9, includes: fitting a sintered blank onto the corresponding positions of multiple conductive pins; simultaneously inserting the conductive pins fitted with the sintered blank into the receiving cavity of a metal base; subjecting the insertion to high-temperature sintering followed by cooling and solidification to achieve a sealed bond between the conductive pins and the metal base, thus obtaining a composite sintered base; pre-setting blind holes matching the number of conductive pins on a temperature and humidity circuit board; inserting the end of a conductive pin furthest from the metal base into the blind hole; and completing the fixed connection between the two via a soldering process; attaching and fixing two misaligned wiring boards to the opposite end faces of the main conditioning circuit board and the upper circuit board, with the two misaligned wiring boards pre-connected via flexible flat cables; and fixing the main conditioning circuit board to the metal base via an adhesive bonding process. On the pre-set end face of the base, the end of the conductive pin away from the temperature and humidity circuit board is inserted into the pre-set through hole of the main conditioning circuit board. Electrical connection between the conductive pin and the main conditioning circuit board is formed using any one of the following methods: soldering, fisheye pin crimping, or wire bonding. The inner support frame is coaxially snapped and fixed to the metal base. The upper circuit board is flipped upwards along the extension direction of the flexible flat cable, so that the upper circuit board is snapped and positioned in the mounting part of the inner support frame, and the flexible flat cable is confined within the clearance groove of the inner support frame. The irregularly shaped connector is coaxially snapped and fixed to the inner support frame. The outer sleeve is used to encapsulate the inner support frame, upper circuit board, main conditioning circuit board, and metal base from top to bottom. The end of the outer sleeve away from the irregularly shaped connector is fixedly connected to the shell structure using laser welding.

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