Substrate processing apparatus and power transmission method in vacuum chamber

Abstract

The invention provides a substrate processing apparatus and a power transmission method in a vacuum chamber. The apparatus includes: at least one transfer chamber; and a transfer robot which is linearly movable in a transfer chamber and transfers a substrate, in which the transfer robot includes a power receiving unit that receives power, the transfer chamber including: a chamber base; and a power feeding unit disposed on the chamber base and wirelessly transmitting power to the power receiving unit, the power feeding unit including: a plurality of power feeding cables; a plurality of terminal units connected to the plurality of feed cables; and at least one connection member connected to at least one of the plurality of terminal units so as to switch a direction of a current flowing in the feed cable at least two or more times.

Description

Cross-reference to applications related to substrate processing apparatus and power transmission method in vacuum chamber

[0001] This application claims priority and benefit to Korean Patent Application No. 10-2024-0151211, filed with the Korean Intellectual Property Office on October 30, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This invention relates to a substrate processing apparatus and a power transmission method within a vacuum chamber. Background Technology

[0003] Semiconductor manufacturing processes are performed through multiple steps, requiring high-precision fine-tuning. Among these fine-tuning processes, plasma processing plays a crucial role in semiconductor manufacturing. Plasma processing ionizes reactive / deposit gases to generate a plasma state containing high-energy ions, electrons, and neutral particles, performing various functions such as forming desired patterns on wafers or removing impurities using plasma. In some cases, plasma processing can perform the function of depositing films on wafers.

[0004] To perform plasma processing, semiconductor manufacturing facilities include processing chambers that generate plasma to process wafers. The interior of the chamber is designed to convert reactive / deposit gases into a plasma state, and the processing is carried out under highly controlled vacuum conditions, allowing the plasma to be uniformly distributed on the wafer surface. Plasma processing involves multiple steps such as etching and deposition, and is a crucial technique for forming the fine structures of semiconductor devices.

[0005] Simultaneously, the handling of substrates, such as wafers, from semiconductor manufacturing facilities is also crucial. The plasma processing chamber and the transfer chamber for transporting substrates are interconnected, and the transfer chamber must be regulated to a vacuum atmosphere (VE) similar to or the same as the processing chamber. This is essential to prevent external air inflow and maintain the high level of cleanliness required for plasma processing. The vacuum state within the transfer chamber ensures the smooth movement of substrates into the plasma processing chamber and minimizes contamination or damage to the substrates during processing.

[0006] Therefore, in order to stably perform plasma processing in semiconductor manufacturing processes, maintaining the vacuum between the transfer chamber and the plasma processing chamber, the reliability of substrate transfer, and the power transmission efficiency in the process are considered to be very important factors. Summary of the Invention

[0007] This invention aims to provide a substrate processing apparatus and a power transmission method that can efficiently transmit power to a conveying robot.

[0008] The present invention also aims to provide a substrate processing apparatus and a power transmission method that minimizes the heat generated when transmitting power to a conveying robot.

[0009] The present invention also aims to provide a substrate processing apparatus and a power transmission method capable of extending the transmission chamber.

[0010] The purpose of this disclosure is not limited thereto, and other purposes not mentioned herein will be clearly understood by those skilled in the art from the following description.

[0011] Exemplary embodiments of this disclosure relate to an apparatus for processing a substrate, the apparatus comprising: at least one transfer chamber; and a transfer manipulator linearly movable within the transfer chamber for transferring the substrate, wherein the transfer manipulator includes a power receiving unit for receiving power, the transfer chamber comprising: a chamber base; and a power supply unit disposed on the chamber base and wirelessly transmitting power to the power receiving unit, and the power supply unit may include: a plurality of power supply cables; a plurality of terminal units connected to the plurality of power supply cables; and at least one connecting member connected to at least one of the plurality of terminal units to switch the direction of current flowing in the power supply cables at least twice or more.

[0012] Exemplary embodiments of this disclosure relate to a method for transmitting power to a robotic arm that moves linearly within a vacuum chamber. The method may include: connecting a supply cable to only a portion of a plurality of terminals of a front terminal unit; supplying current via the supply cable to a first set of feed cables among a plurality of feed cables disposed between the front and rear terminal units; when current flows into the rear terminal unit, returning the current from the rear terminal unit to the front terminal unit once via a second set of feed cables through a first connecting member; and when the returned current flows into the front terminal unit, returning the current a second time via a third set of feed cables through a second connecting member.

[0013] Exemplary embodiments of this disclosure relate to an apparatus for processing a substrate, the apparatus comprising: at least one transfer chamber; a processing chamber; and a transfer robot that is linearly movable within the transfer chamber and transfers the substrate into the transfer chamber, wherein the transfer robot includes a power receiving unit for receiving power, the transfer chamber includes: a chamber base; and a power supply unit disposed in the chamber base, the power supply unit including: a plurality of power supply cables; a plurality of terminal units connected to one end and the other end of the plurality of power supply cables, the plurality of terminal units including: a front terminal unit connected to a power supply device; and a rear terminal unit connected to the power supply device. The electrical distance of the device is greater than that of the front terminal unit, which includes: a first front terminal unit electrically adjacent to the power supply device; and a second front terminal unit electrically further from the power supply device than the first front terminal unit. The first and second front terminal units include a plurality of terminals, and the terminals included in the first and second front terminal units are arranged in pairs for electrical connection to each other. A supply cable for supplying current to the power supply device is connected to a portion of the plurality of terminals of the first front terminal unit, and a second connecting member for returning current flowing from the rear terminal unit to the rear terminal unit can be connected to another portion.

[0014] According to an exemplary embodiment of the present invention, power can be efficiently transmitted to the conveying robot.

[0015] Furthermore, according to an exemplary embodiment of the present invention, the heat generated when transmitting power to the delivery robot can be minimized.

[0016] According to an exemplary embodiment of the present invention, the delivery chamber can be extended.

[0017] The effects of this disclosure are not limited to those described above, and those skilled in the art will clearly understand from the specification and drawings any effects not mentioned. Attached Figure Description

[0018] Figure 1 is a schematic top plan view of a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0019] Figure 2 is a schematic diagram of the power transmission structure used to transmit power to the robotic arm of Figure 1.

[0020] Figure 3 is a schematic diagram showing the structure of a power supply device located outside the transmission chamber that is powered by the feeder cable shown in Figure 2.

[0021] Figure 4 is a schematic diagram illustrating the structure of the power supply equipment in Figure 3 circulating current to the feeder cable.

[0022] Figure 5 is a schematic top plan view of a substrate processing apparatus according to another exemplary embodiment of the present invention.

[0023] Figure 6 is a schematic diagram illustrating the structure of the power supply device in another exemplary embodiment of Figure 5, through which current circulates via a feeder cable.

[0024] Figure 7 is a schematic top plan view of a substrate processing apparatus according to another exemplary embodiment of the present invention.

[0025] Figure 8 is a schematic diagram illustrating a method for extending power supply lines using a base plate.

[0026] Figure 9 is a schematic diagram showing the end of the base plate of Figure 8.

[0027] Figure 10 is a schematic diagram illustrating the communication method between an external controller located outside the transfer chamber of Figure 1 and a robot controller located inside the transfer chamber.

[0028] Figure 11 is a schematic diagram illustrating a heat dissipation method for dissipating heat generated by an active device located in the conveying robot of Figure 1 to the outside.

[0029] Figures 12 and 13 are schematic diagrams illustrating a method of transferring a substrate to a processing chamber using the transfer robot shown in Figure 1.

[0030] Various features and advantages of the non-limiting exemplary embodiments of this specification will become apparent from a review of the detailed description and the accompanying drawings. The accompanying drawings are for illustrative purposes only and should not be construed as limiting the scope of the claims. Unless explicitly stated otherwise, the drawings are not intended to be drawn to scale. For clarity, the various dimensions in the drawings may be exaggerated. Detailed Implementation

[0031] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. Exemplary embodiments are provided to make this disclosure thorough and to fully convey the scope to those skilled in the art. Numerous specific details, such as embodiments of specific components, devices, and methods, are set forth to provide a thorough understanding of embodiments of this disclosure. It will be apparent to those skilled in the art that the specific details are not required, that exemplary embodiments may be embodied in many different forms, and that the specific details should not be construed as limiting the scope of this disclosure. In some exemplary embodiments, well-known processes, well-known device structures, and well-known techniques have not been described in detail.

[0032] The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” may be intended to include the plural forms. The terms “comprises,” “comprising,” “including,” and “having” are inclusive and therefore specifically refer to the presence of the stated feature, integer, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof. Unless expressly identified as an order of execution, the method steps, processes, and operations described herein should not be construed as necessarily having to be performed in the specific order discussed or illustrated. It should also be understood that additional or alternative steps may be employed.

[0033] When an element or layer is referred to as “on another element or layer,” “joined to,” “connected to,” or “coupled to” another element or layer, the element or layer may be directly on, joined to, connected to, or coupled to the other element or layer, or there may be intermediate elements or layers. Conversely, when an element is referred to as “directly on another element or layer,” “directly joined to,” “directly connected to,” or “directly coupled to” another element or layer, there may be no intermediate elements or layers. Other terms used to describe relationships between elements should be interpreted similarly (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0034] Although the terms “first,” “second,” “third,” etc., may be used herein to describe different elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms unless otherwise stated. These terms may be used only to distinguish one element, component, region, layer, and / or segment from another. When used herein, terms such as “first,” “second,” and other numerical terms do not imply order or sequence unless the context clearly indicates otherwise. Therefore, without departing from the teachings of the exemplary embodiments, the first element, first component, first region, first layer, or first segment discussed below may be referred to as a second element, second component, second region, second layer, or second segment.

[0035] For ease of description, spatial relative terms (such as "inside," "outside," "below," "below," "below," "above," and "above," etc.) may be used herein to describe the relationship of one element or feature shown in the accompanying drawings to another element (or other) element or feature. Spatial relative terms may be intended to cover different orientations of the device in use or operation other than those described in the accompanying drawings. For example, if the device in the figures is flipped, an element described as "below" or "below" other elements or features will subsequently be oriented "above" other elements or features. Thus, the embodiment term "below" may cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or oriented in other orientations), and the spatial relative descriptors used herein will be interpreted accordingly.

[0036] When the terms “same” or “identical” are used in the description of exemplary embodiments, it should be understood that some imprecision may exist. Therefore, when an element or value is said to be the same as another element or value, it should be understood that the element or value is the same as the other element or value within a range of manufacturing or operational tolerances (e.g., ±10%).

[0037] When the terms “about” or “substantially” are used with numerical values, it should be understood that the associated numerical value includes manufacturing or operational tolerances (e.g., ±10%) around the value. Furthermore, when the words “generally” and “substantially” are used with geometry, it should be understood that the geometry is not required to be precise, but the latitude of the shape is within the scope of this disclosure.

[0038] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which the exemplary embodiments pertain. It should be further understood that terms, including those defined in commonly used dictionaries, shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0039] In the following description, the present invention will be described using the case where the substrate processing apparatus 10 processes a substrate W such as a wafer as an example. Furthermore, in the following description, the present invention will be described based on the case where the substrate processing apparatus 10 is a semiconductor manufacturing facility performing at least some of a plurality of processes performed for manufacturing semiconductor devices. Additionally, in the following description, the present invention will be described using the case where the substrate processing apparatus 10 processes the substrate W using plasma as an example. Furthermore, in the following description, the present invention will be described based on the case where the substrate processing apparatus 10 performs etching or ashing processes to remove a film on the substrate W, or performs deposition processes to form a film on the substrate W using plasma.

[0040] Figure 1 is a schematic top plan view of a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0041] Referring again to FIG1, the substrate processing apparatus 10 according to an exemplary embodiment of the present invention may include a front-end module 100, a loading and locking chamber 200, a transfer chamber 300, a transfer robot 400, a feedthrough 500, a processing chamber 600, and an external controller 700.

[0042] The front-end module 100 can be used as a load / unload module for loading unprocessed substrate W or unloading processed substrate W. The front-end module 100 may include an index chamber 110 and a loading port 120.

[0043] The index chamber 110 may be equipped with a transfer robot (not shown). The transfer robot provided in the index chamber 110 can unload the substrate W from the container placed on the loading port 120 and transfer the substrate W to the loading locking chamber 200, which will be described later, or unload the substrate W from the loading locking chamber 200 and transfer the substrate W to the container placed on the loading port 120.

[0044] The atmosphere in the index chamber 110 can be controlled to be a first atmosphere that is the same as or similar to the external environment of the substrate processing apparatus 10. For example, the first atmosphere can be an atmospheric pressure atmosphere AE. An atmospheric pressure atmosphere AE can represent a pressure state. Therefore, the pressure state in the index chamber 110 can be the same as or similar to the external environment, but the cleanliness state (e.g., particle level) in the index chamber 110 can be maintained in a better state than the external environment.

[0045] In addition, the index chamber 110 may be equipped with a fan filter unit capable of supplying clean dry air (CDA) or nitrogen, so that the atmosphere in the index chamber 110 can be maintained in the first atmosphere.

[0046] Multiple loading ports 120 may be provided. These loading ports 120 may be arranged side-by-side on one side of the index chamber 110. Specifically, the loading ports 120 may be connected to the index chamber 110 located on the opposite side of the loading locking chamber 200, which will be described later. A container holding the substrate W is located on the loading port 120. This container may be a container referred to as a Front-Opening Unified Pod (FOUP), a container referred to as a Front-Opening Shipping Box (FOSB), a container referred to as a Standard Mechanical Interface (SMIF) wafer transport box, or a container referred to as a cassette. Each container may hold multiple substrates W.

[0047] Containers can be transported to or unloaded from the front-end module 100 via overhead transport devices (OHTs) mounted on the ceiling of the semiconductor production line, automated guided vehicles (AGVs) that travel along the floor of the semiconductor production line, or autonomous mobile robots (AMRs).

[0048] The loading and locking chamber 200 can be disposed between the front-end module 100 and the transfer chamber 300. The atmosphere within the loading and locking chamber 200 can be changed between a first atmosphere and a second atmosphere. As described above, the first atmosphere can be an atmospheric pressure atmosphere AE. The second atmosphere can be a vacuum atmosphere VE. Here, vacuum atmosphere VE can refer to a pressure state. Vacuum atmosphere VE can be an atmosphere with a pressure state significantly lower than that of atmospheric pressure atmosphere AE.

[0049] The loading locking chamber 200 may include a gas nozzle capable of supplying an inert gas such as CDA or nitrogen into the chamber, and at least one discharge port formed to discharge the interior of the chamber, thereby switching the internal atmosphere between a first atmosphere AE and a second atmosphere VE.

[0050] When the transfer robot (not shown) located in the front-end module 100 and / or the transfer robot 400 located in the transfer chamber 300 loads the substrate W into or unloads the substrate W from the loading locking chamber 200, the atmosphere inside the loading locking chamber 200 may change.

[0051] For example, when the substrate W is loaded from the front-end module 100 into the loading locking chamber 200 under a first atmosphere (i.e., atmospheric pressure atmosphere AE), the atmosphere inside the loading locking chamber 200 is maintained at the first atmosphere before the substrate W is loaded into the loading locking chamber 200. When the substrate W is fully loaded into the loading locking chamber 200, the atmosphere inside the loading locking chamber 200 is changed from the first atmosphere (i.e., atmospheric pressure atmosphere AE) to a second atmosphere (i.e., vacuum atmosphere VE). When the atmosphere inside the loading locking chamber 200 changes to the second atmosphere, the door of the loading locking chamber 200 is opened, and then the transfer robot 400 provided in the transfer chamber 300 can unload the substrate W from the loading locking chamber 200. At this time, the atmosphere inside the transfer chamber 300 can be maintained at the second atmosphere (i.e., vacuum atmosphere VE), which will be described later.

[0052] In short, when the loading locking chamber 200 is disposed between the front-end module 100 which is maintained in an atmospheric pressure atmosphere AE and the transfer chamber 300 which is maintained in a vacuum atmosphere VE, and the substrate W is transferred between spaces with different atmospheres, the loading locking chamber 200 can be used as an atmosphere switching module to change the atmosphere.

[0053] The loading and locking chamber 200 may have a first loading and locking chamber 201 and a second loading and locking chamber 202. The first loading and locking chamber 201 may provide a portion of a first transport path through which the unprocessed substrate W to be processed in the processing chamber 600 is transported. The second loading and locking chamber 202 may provide a portion of a second transport path through which the processed substrate W, which has already been processed in the processing chamber 600, is transported. This is because the processed substrate W maintains a higher level of cleanliness than the unprocessed substrate W. In other words, the substrate processing apparatus 10 can improve the cleanliness maintenance efficiency of the processed substrate W by providing different transport paths for the unprocessed substrate W and the processed substrate W.

[0054] The transfer chamber 300 provides space for mounting the transfer robot 400. The internal atmosphere of the transfer chamber 300 can be maintained under a vacuum atmosphere. The second atmosphere can be a vacuum atmosphere VE. To maintain the atmosphere within the transfer chamber 300 under a vacuum atmosphere VE, at least one discharge port connected to a pump providing pressure reduction, etc., can be formed in the transfer chamber 300. Since a discharge device (such as a pump) discharges through the discharge port, the internal atmosphere of the transfer chamber 300 can be maintained under the second atmosphere.

[0055] When the internal atmosphere of the transfer chamber 300 becomes the second atmosphere, impurities such as particles that may be present in the transfer chamber 300 can be discharged to the outside of the transfer chamber 300. Furthermore, as described later, the atmosphere of the processing chamber 600 can be controlled to be the second atmosphere. By controlling the atmospheres of the transfer chamber 300 and the processing chamber 600 to be the same as or similar to the second atmosphere, impurities such as particles generated due to the pressure difference when the transfer chamber 300 and the processing chamber 600 are interconnected can be minimized.

[0056] The transfer chamber 300 may include a chamber base 302, which serves as the bottom surface of the chamber space, and a travel track 303 mounted on the chamber base 302. The transfer robot 400, which will be described later, can move linearly along the travel track 303 of the transfer chamber 300.

[0057] A transfer robot 400 can be disposed within a transfer chamber 300. The transfer robot 400 can transfer substrate W. The transfer robot 400 can move linearly within the transfer chamber 300. Furthermore, the transfer robot 400 may include multiple arms. For example, the multiple arms may include a first arm 421 having a first end effector 423 and a second arm 422 having a second end effector 424 (as described below). The first arm 421 and the second arm 422 can extend and retract. When the transfer robot 400 moves linearly within the transfer chamber 300 and the first arm 421 and the second arm 422 extend and retract, the substrate W can be loaded into or unloaded from the processing chamber 600.

[0058] The feedthrough 500 can be positioned between the substrate processing apparatus 10 and the externally located power supply device 20. The feedthrough 500 can act as a medium for electrically connecting the exterior of the transfer chamber 300, which is in an atmospheric pressure atmosphere AE, and the interior of the transfer chamber 300, which is in a vacuum atmosphere VE. The power supply device 20 can be electrically connected to the feedthrough 500, and the feedthrough 500 can be electrically connected to the power supply unit 310, which will be described later. The structure and method of supplying power to the transfer robot 400 via the power supply device 20 will be described later.

[0059] Processing chamber 600 can process substrate W. Processing chamber 600 can perform at least one process required for manufacturing semiconductor devices. For example, processing chamber 600 can be configured to perform plasma processing to process substrate W using plasma. Processing chamber 600 can perform processes such as etching or ashing to remove films formed on substrate W using plasma. Conversely, processing chamber 600 can use plasma to perform processes such as deposition and passivation to form films on substrate W.

[0060] The atmosphere within processing chamber 600 can be controlled by a second atmosphere (i.e., a vacuum atmosphere VE). The vacuum atmosphere VE can be an atmosphere with a pressure significantly lower than atmospheric pressure AE. The atmospheres of processing chamber 600 and transfer chamber 300 can be controlled to be the same as the second atmosphere. The concept that the atmospheres of processing chamber 600 and transfer chamber 300 are the same should be understood to include not only the case where the pressures are exactly the same, but also the case where the atmospheres of both chambers 300 and 600 are maintained at a near-vacuum level even with a small pressure difference.

[0061] Furthermore, the processing chamber 600 can have various configurations for performing the plasma processing described above. For example, the processing chamber 600 may include a plasma source consisting of counter electrodes, an antenna, and a radio frequency power supply; a gas supply unit for supplying reactive or deposited gases into the processing chamber 600; an exhaust port for venting air from the processing chamber 600 (the exhaust port being connected to an exhaust device such as a vacuum pump); a support unit for supporting the substrate W; and a temperature control device (such as a heater and a cooler) for controlling the temperature of the substrate W. The configuration of the processing chamber 600 is not limited to these and can be modified in various ways to become a known processing chamber configuration for performing plasma processing.

[0062] An external controller 700 may be disposed outside the transfer chamber 300. The external controller 700 can generate control signals for controlling the aforementioned configuration of the substrate processing apparatus 10. The external controller 700 may be disposed outside the transfer chamber 300, i.e., in a space having a first atmosphere (i.e., atmospheric pressure atmosphere AE). The external controller 700 controls the substrate processing apparatus 10. The external controller 700 may include: a processing controller comprised of a microprocessor (computer) that performs control of the substrate processing apparatus 10; a user interface including a keyboard on which an operator performs command input operations to manage the substrate processing apparatus 10; a display for visualizing and displaying the operating status of the substrate processing apparatus 10; and a storage unit storing control programs for executing processes performed in the substrate processing apparatus 10 under the control of the processing controller, or storing programs (i.e., processing schemes) for executing processes in various components according to various data and processing conditions. Further, the user interface and the storage unit may be connected to the processing controller. The processing solution can be stored in a storage medium in the storage unit, and the storage medium can be a hard disk, and can also be a portable disk (such as a CD-ROM or DVD) or a semiconductor memory (such as flash memory).

[0063] The system and method for transmitting power from an external power supply device 20 to the transfer robot 400 will be described in detail below.

[0064] Figure 2 is a schematic diagram of the power transmission structure for transmitting power to the conveying robot of Figure 1. Figure 3 is a schematic diagram of the structure of the power supply equipment located outside the conveying chamber using the feed cable of Figure 2 for power supply, and Figure 4 is a schematic diagram of the structure of the power supply equipment of Figure 3 circulating current to the feed cable.

[0065] Referring to Figures 2 to 4, the power transmission system can be composed of a power supply device 20, a power supply unit 310 for the transmission chamber 300, and a transmission robot 400.

[0066] The power supply device 20 may include a power supply 21 and a primary-side converter unit 22 connected to the power supply 21. The primary-side converter unit 22 may include a primary-side converter 23 and a primary-side resonant circuit 24. The primary-side converter 23 may be an AC-DC or DC-AC converter. The primary-side resonant circuit 24 may have a circuit structure that can improve power supply efficiency by achieving impedance matching.

[0067] The transfer chamber 300 may have a chamber base 302, a travel track 303, and a power supply unit 310. The travel track 303 and the power supply unit 310 may be disposed on the chamber base 302. The power supply unit 310 may be fixedly disposed to the chamber base 302 of the transfer chamber 300. The power supply unit 310 may be referred to as a fixed power supply component.

[0068] The power supply unit 310 disposed in the transmission chamber 300 may include a first ferrite core 311, a support member 312, a support frame 313, a power supply cable 314, and multiple terminal units 320 and 330. The multiple terminal units 320 and 330 may include a first terminal unit 320 and a second terminal unit 330. The first terminal unit 320 may be configured as a front terminal unit electrically adjacent to the power supply device 20. Furthermore, the second terminal unit 330 may be configured as a rear terminal unit with an electrical distance from the power supply device 20 greater than that of the first terminal unit 320. The first terminal unit 320 and the second terminal unit 330 may be electrically connected to each other via the power supply cable 314.

[0069] The first ferrite core 311 can be disposed on the chamber base 302 provided by the transfer chamber 300. The chamber base 302 can be part of the bottom surface defining the internal space provided by the transfer chamber 300. A groove can be formed in the chamber base 302, and the first ferrite core 311 can be disposed in the groove. The groove can be formed downward from the upper surface of the chamber base 302. The first ferrite core 311 can be E-shaped.

[0070] Support member 312 and support frame 313 can be disposed on the first ferrite core 311. Both support member 312 and support frame 313 can be made of insulating material. Support member 312 and support frame 313 can prevent physical and electrical contact between the feed cable 314 and the first ferrite core 311. Support frame 313 can be configured to be detachable from support member 312. Support frame 313 can be replaced with support frame 313 of different shapes. The shape of support frame 313 can be modified in various ways according to the number or shape of feed cables 314 of feed unit 310.

[0071] The feed cable 314 can be placed on the support frame 313. The feed cable 314 can be respectively arranged in the two spaces formed by the E-shaped first ferrite core 311. The feed cable 314 can be arranged at a height lower than the upper end of the first ferrite core 311. The upper part of the feed cable 314 can be covered with a plate-shaped cover 319.

[0072] The current supplied by the power supply device 20 can flow through the feed cable 314. The current flowing through the feed cable 314 can generate an electromagnetic field. The electromagnetic field generated by the current flowing through the feed cable 314 can be induced in the first ferrite core 311, which has an E-shape. The electromagnetic field induced in the first ferrite core 311 can inductively couple with the second ferrite core 432, which will be described later. Using this inductive coupling, the feed unit 310 can wirelessly (contactlessly) transmit power to the power receiving unit 430.

[0073] Referring again to Figure 4, the power supply unit 310 may include the first terminal unit 320 and the second terminal unit 330 as described above. The first terminal unit 320 may be a front terminal unit. The second terminal unit 330 may be a rear terminal unit.

[0074] The first terminal unit 320 may include a first terminal subunit 321 and a second terminal subunit 322. The first terminal subunit 321 may include multiple terminals. The second terminal subunit 322 may include multiple terminals. The first terminal subunit 321 may be connected to the supply cable 503, the return cable 504, and the connecting member 380 described later. The second terminal subunit 322 may be connected to the aforementioned feed cable 314.

[0075] The terminals of the first terminal subunit 321 and the terminals of the second terminal subunit 322 form multiple pairs, and the paired terminals can be electrically connected to each other. For example, a terminal of the second terminal subunit 322 parallel to any of the terminals of the first terminal subunit 321 can be electrically connected to that terminal of the first terminal subunit 321. Furthermore, a terminal of the second terminal subunit 322 parallel to another terminal of the first terminal subunit 321 can be electrically connected to that other terminal of the first terminal subunit 321. The first terminal subunit 321 can be referred to as a first front terminal unit, or, if necessary, a first outer terminal unit. The second terminal subunit 322 can be referred to as a second front terminal unit, or, if necessary, a first inner terminal unit.

[0076] In order to clearly illustrate the connection structure between the power supply cable 314 and the connecting member 380, the terminals of each terminal subunit 321, 322 will be referred to as terminal 1, terminal 2, ..., terminal 8 in sequence.

[0077] For example, the terminal of the first terminal subunit 321 that is connected to one supply cable 503 is called terminal number 1 of the first terminal subunit 321, the terminal that is connected to another supply cable 503 is called terminal number 2 of the first terminal subunit 321, and so on. Similarly, the terminal of the second terminal subunit 322 that is paired with terminal number 1 of the first terminal subunit 321 is called terminal number 1 of the second terminal subunit 322, the terminal of the second terminal subunit 322 that is paired with terminal number 2 of the first terminal subunit 321 is called terminal number 2 of the second terminal subunit 322, and so on.

[0078] The second terminal unit 330 may include a third terminal subunit 331 and a fourth terminal subunit 332. The third terminal subunit 331 may include multiple terminals. The fourth terminal subunit 332 may include multiple terminals. The aforementioned feed cable 314 may be connected to the third terminal subunit 331. At least one connecting member 380, described later, may be connected to the fourth terminal subunit 332.

[0079] The terminals of the third terminal subunit 331 and the fourth terminal subunit 332 form multiple pairs, and the paired terminals can be electrically connected to each other. For example, a terminal of the fourth terminal subunit 332 parallel to any of the third terminal subunits 331 can be electrically connected to that terminal in the third terminal subunit 331. Furthermore, a terminal of the fourth terminal subunit 332 parallel to another terminal of the third terminal subunit 331 can be electrically connected to that other terminal of the third terminal subunit 331. The third terminal subunit 331 can be referred to as a first rear terminal unit, or, if necessary, a second inner terminal unit. The fourth terminal subunit 332 can be referred to as a second rear terminal unit, or, if necessary, a second outer terminal unit.

[0080] The first terminal subunit 321, the second terminal subunit 322, the third terminal subunit 331, and the fourth terminal subunit 332 can be electrically adjacent to the power supply device 20 in this order.

[0081] The connecting member 380 can electrically connect the terminals of the first terminal unit 320 and the terminals of the second terminal unit 330. One or more, for example, multiple connecting members 380 may be provided. The connecting member 380 may be a member made of a conductive material. For example, the connecting member 380 may be a member made of a metallic material through which current can flow. Multiple connecting members 380 may include a first connecting member 381, a second connecting member 382, ​​and a third connecting member 383.

[0082] The first connecting member 381 can be configured to return current flowing into the second terminal unit 330 via the first terminal unit 320 back to the first terminal unit 320. The first connecting member 381 can be connected to the fourth terminal subunit 332 of the second terminal unit 330. For example, one end of the first connecting member 381 can be connected to terminals 1 and 2 of the fourth terminal subunit 332, and the other end of the first connecting member 381 can be connected to terminals 5 and 6 of the fourth terminal subunit 332.

[0083] The second connecting member 382 can be configured to return the current flowing into the first terminal unit 320 through the second terminal unit 330 back to the second terminal unit 330. The second connecting member 382 can be connected to the first terminal subunit 321 of the first terminal unit 320. For example, one end of the second connecting member 382 can be connected to terminals 5 and 6 of the first terminal subunit 321, while the other end of the second connecting member 382 can be connected to terminals 3 and 4 of the first terminal subunit 321.

[0084] The third connection member 383 can be configured to return the current flowing through the first terminal unit 320 to the second terminal unit 330 back to the first terminal unit 320. The third connection member 383 can be connected to the fourth terminal subunit 332 of the second terminal unit 330. For example, one end of the third connection member 383 can be connected to terminals 3 and 4 of the fourth terminal subunit 332, and the other end of the third connection member 383 can be connected to terminals 7 and 8 of the fourth terminal subunit 332.

[0085] The first terminal unit 320 and the second terminal unit 330 can be interconnected via a feed cable 314. Multiple feed cables 314 can be provided. The feed cables 314 can be divided into multiple groups. For example, in each feed cable 314, the first group of feed cables 314a can be connected to terminals 1 and 2 of the second terminal subunit 322, and terminals 1 and 2 of the third terminal subunit 331. For example, in each feed cable 314, the second group of feed cables 314b can be connected to terminals 5 and 6 of the second terminal subunit 322, and terminals 5 and 6 of the third terminal subunit 331. In each feed cable 314, the third group of feed cables 314c can be connected to terminals 3 and 4 of the second terminal subunit 322, and terminals 3 and 4 of the third terminal subunit 331. In each of the power supply cables 314, the fourth set of power supply cables 314d can be connected to terminals 7 and 8 of the second terminal subunit 322, and terminals 7 and 8 of the third terminal subunit 331.

[0086] Figure 4 illustrates, as an example, multiple feeder cables 314 belonging to each group. However, the invention is not limited to this; the number of feeder cables 314 belonging to each group can vary depending on the number of supply cables 503 connecting the supply feeder 501 and the first terminal unit 320. For example, when one supply cable 503 is provided, the number of feeder cables 314 belonging to each group can be set to one; when three supply cables 503 are provided, the number of feeder cables 314 belonging to each group can be set to three.

[0087] The current flow in the power supply unit 310 proceeds in the following order.

[0088] 1) The power supply equipment 20 supplies power to the supply feeder 501 via the external cable 25.

[0089] 2) The current supplied to the supply feeder 501 is supplied to the first terminal unit 320.

[0090] 3) The current supplied to the first terminal unit 320 is supplied to the second terminal unit 330 along the first set of feed cables 314a. In this case, the current flows in the first direction.

[0091] 4) The current supplied to the second terminal unit 330 returns to the first terminal unit 320 through the first connecting member 381. The current direction is switched from the first direction to the second direction through the first connecting member 381.

[0092] 5) Current that switches to the second direction via the first connecting member 381 is supplied to the first terminal unit 320 along the second set of feed cables 314b. In this case, the current flows in the second direction.

[0093] 6) The current supplied to the first terminal unit 320 returns to the second terminal unit 330 through the second connecting member 382. The current direction is switched from the second direction to the first direction through the second connecting member 382.

[0094] 7) Current, whose direction is switched to the first direction via the second connecting member 382, ​​is supplied to the second terminal unit 330 along the third set of feed cables 314c. In this case, the current flows in the first direction.

[0095] 8) The current supplied to the second terminal unit 330 returns to the first terminal unit 320 through the third connecting member 383. The current direction is switched from the first direction to the second direction through the third connecting member 383.

[0096] 9) Current that switches to the second direction via the third connecting member 383 is supplied to the first terminal unit 320 along the fourth set of feed cables 314d. In this case, the current flows in the second direction.

[0097] 10) The current supplied to the first terminal unit 320 is supplied to the return feeder 502 via the return cable 504.

[0098] 11) The current supplied to the return feeder 502 is returned to the power supply equipment 20 via the external cable 25.

[0099] In other words, according to an exemplary embodiment of the present invention, the supply cable 503 is connected to a portion of the terminals of the first terminal subunit 321 that are electrically closest to the power supply device 20, the second connecting member 382 is connected to another portion of the terminals of the first terminal subunit 321, and the return cable 504 is connected to yet another portion of the terminals of the first terminal subunit 321. Therefore, even if the supply cable 503 is connected to only a few terminals, for example, two terminals, current can flow through a majority of the feeder cables 314, for example, eight feeder cables 314.

[0100] When a large current flows through a small number of feed cables 314, a large electromagnetic field is generated within a narrow area. When a large electromagnetic field is generated within such a narrow area and power is transmitted wirelessly, high heat may be generated in the corresponding feed cables 314 and their surrounding configuration. This heat generation may not only make it difficult to maintain a constant atmosphere within the transmission chamber 300, but may also cause configuration malfunctions of the substrate processing apparatus 10.

[0101] On the other hand, when a relatively small current flows through a large number of feeder cables 314, a small electromagnetic field is generated over a wide range. Furthermore, power is transmitted over this wide range using this small electromagnetic field. When a small electromagnetic field is generated over such a wide range and power is transmitted wirelessly, a small amount of heat may be generated in the feeder cables 314 and their surrounding environment. Therefore, the problems that arise from the aforementioned large amount of heat generation can be minimized.

[0102] In an exemplary embodiment of the present invention, current can flow through the eight feed cables 314 even if the supply cable 503 is connected to only two terminals. That is, the present invention is configured to generate a low-intensity electromagnetic field over a wide range, thereby achieving the aforementioned technical effects. Furthermore, continuous power supply to the feed cables 314 is required for the conveyor robot 400 to operate smoothly. In the present invention, since a relatively small number of supply cables 503 are configured to supply current, the power consumption per unit time can be relatively low.

[0103] In short, the present invention can reduce power consumption, improve power transmission efficiency, and minimize heat generation during power transmission.

[0104] Referring again to Figures 2 to 4, the transfer robot 400 may include a housing 410, a robotic arm 420, a power receiving unit 430, a secondary-side converter unit 433, a traveling actuator 440, and a robot controller 450.

[0105] The housing 410 can provide space therein. The space provided by the housing 410 can have an atmosphere different from the second atmosphere of the transfer chamber 300. For example, the atmosphere of the space provided by the housing 410 can be an atmospheric pressure atmosphere AE. Various components can be housed inside the housing 410. For example, multiple motors for driving the robotic arm 420 can be housed inside the housing 410. Furthermore, a robotic arm controller 450 for receiving control signals from an external controller 700 can be housed inside the housing 410 to operate the robotic arm 420. The robotic arm controller 450 can receive control signals from the external controller 700 and control the multiple motors for driving the robotic arm 420 based on the received control signals and the drive of the traveling actuator 440, described later.

[0106] The description of robotic arm 420 is the same as above.

[0107] The power receiving unit 430 can be attached to the lower part of the housing 410. The power receiving unit 430 of the transfer robot 400 can wirelessly receive power from the power supply unit 310 of the transfer chamber 300. The power receiving unit 430 can be referred to as a movable power receiving component.

[0108] The power receiving unit 430 may include a housing 431 and a second ferrite core 432 disposed within the space provided by the housing 431. The second ferrite core 432 may be configured to face the first ferrite core 311. The second ferrite core 432 has an E-shape but a shape symmetrical to the first ferrite core 311, and may be configured to face the first ferrite core 311. In this invention, due to the provision of the first ferrite core 311 and the second ferrite core 432, the power transmission efficiency via inductive coupling can be improved. With the improved power transmission efficiency via inductive coupling, the same level of power transmission can be achieved even when a relatively small current flows through the feed cable 314. Therefore, the heat generation problem that may occur when a high-intensity current flows through the feed cable 314 can be further reduced.

[0109] The current flowing through the feed cable 314 generates an electromagnetic field, which is inductively coupled through the first ferrite core 311 and the second ferrite core 432. Therefore, power can be wirelessly transmitted to the power receiving unit 430.

[0110] Power transmitted to the power receiving unit 430 can be transmitted to a secondary-side converter unit 433 disposed within the housing 410. The secondary-side converter unit 433 may include a secondary-side converter 434 and a secondary-side resonant circuit 435. The secondary-side converter 434 may be an AC-DC or DC-AC converter. The secondary-side resonant circuit 435 may be configured to improve power supply efficiency by achieving impedance matching. Power transmitted to the secondary-side converter unit 433 can be transmitted to actuators of the transfer manipulator 400, such as multiple motors driving the manipulator arm 420, and / or the traveling actuator 440 described below.

[0111] The traveling actuator 440 can move along the traveling track 303 provided on the chamber base 302. The traveling actuator 440 and the traveling track 303 can be configured to allow the transfer manipulator 400 to move linearly in a magnetic levitation manner.

[0112] In the above embodiments, the present invention is described based on the example of providing a transfer chamber 300, but the present invention is not limited thereto. For example, as shown in FIG5, multiple transfer chambers 300 can be provided. The multiple transfer chambers 300 may include a first transfer chamber 300A and a second transfer chamber 300B. The user can selectively connect the second transfer chamber 300B to the first transfer chamber 300A as needed, thereby increasing the number of processing chambers 600 connected to a substrate processing apparatus 10. That is, each transfer chamber 300 can be provided in the form of an expandable module.

[0113] As shown in Figure 5, when the transfer chamber 300 expands, the transfer robot 400 can move continuously and linearly between the first transfer chamber 300A and the second transfer chamber 300B. The first transfer chamber 300A and the second transfer chamber 300B can have the same configuration as the transfer chamber 300 described above. When the second transfer chamber 300B is connected to the first transfer chamber 300A, the travel track 303 provided in the first transfer chamber 300A and the travel track 303 provided in the second transfer chamber 300B can be continuously connected. Therefore, the transfer robot 400 can move freely and linearly between the first transfer chamber 300A and the second transfer chamber 300B.

[0114] At the same time, even if the first transmission chamber 300A and the second transmission chamber 300B are connected to each other, the power supply must be provided by a power supply device 20.

[0115] Figure 6 is a schematic diagram illustrating the structure of the power supply device in another exemplary embodiment of Figure 5, through which current circulates via a feeder cable.

[0116] Referring again to Figure 6, the first terminal unit 320 and the second terminal unit 330 can be disposed in the first transfer chamber 300A. The third terminal unit 340 and the fourth terminal unit 350 can be disposed in the second transfer chamber 300B.

[0117] Supply cable 503, return cable 504, and second connecting member 382 can be connected to first terminal unit 320. First terminal unit 320 and second terminal unit 330 can be connected via feed cable 314.

[0118] The first connecting member 381 and the third connecting member 383 can be connected to the fourth terminal unit 350. The third terminal unit 340 and the fourth terminal unit 350 can be connected via a power supply cable 314.

[0119] The first terminal unit 320 can be provided as a front terminal unit. The fourth terminal unit 350 can be provided as a rear terminal unit.

[0120] The second terminal unit 330 and the third terminal unit 340, located between the first terminal unit 320 and the fourth terminal unit 350, can be configured as connection terminal units. A connection cable 315 can be connected between the connection terminal units. One end of the connection cable 315 can be disposed in the first transfer chamber 300A, and the other end of the connection cable 315 can be disposed in the second transfer chamber 300B. Since the current flow is similar to that in Figure 4, repeated descriptions are omitted.

[0121] In the above embodiments, the present invention is described based on the example of setting two transmission chambers 300. However, as shown in FIG7, three transmission chambers 300 can be set. For example, the multiple transmission chambers 300 may include a first transmission chamber 300A, a second transmission chamber 300B, and a third transmission chamber 300C. The power supply structure can be similar to the example above.

[0122] In the above embodiments, the present invention is described based on the case of adding a transmission chamber 300 when expanding the power supply structure as an example, but the present invention is not limited thereto.

[0123] For example, as shown in Figure 8, multiple base plates 304 can be provided on the chamber base 302 of a transfer chamber 300. Two terminal units can be provided on one base plate 304, and the two terminal units can be interconnected via a power supply cable 314. In addition, the aforementioned travel track 303 can also be provided on each base plate 304. That is, the user can connect multiple base plates 304 provided in modular form as needed to adjust the drive length of the transfer robot 400 within a transfer chamber 300.

[0124] Furthermore, when multiple base plates 304 are connected, the alignment unit 305 shown in FIG9 can be disposed at the end of the base plate 304, so that the base plates 304 can be aligned with each other. The alignment unit 305 can be configured as a non-flat structure, but the present invention is not limited thereto, and the alignment unit 305 can be modified into various forms, through which the positions of the base plates 304 can be aligned when the base plates 304 are connected to each other.

[0125] Figure 10 is a schematic diagram illustrating the communication method between an external controller located outside the transfer chamber of Figure 1 and a robot controller located inside the transfer chamber.

[0126] Referring again to Figure 10, the external controller 700 can be communicatively connected to the robot controller 450, which can be housed within the housing 410 of the transfer robot 400. Therefore, control signals from the external controller 700 can be transmitted to the robot controller 450. The external controller 700, housed in an atmospheric pressure atmosphere AE, may include a communication device (such as a LAN card), and its external communication link 801 can be coupled to a fixed communication feeder 802, which can be housed within the transfer chamber 300. The fixed communication feeder 802 can be located at the interface between the external atmospheric pressure atmosphere AE and the vacuum atmosphere VE inside the transfer chamber 300. The fixed communication feeder 802 can be communicatively connected to a mobile communication feeder 803. The mobile communication feeder 803 can be housed within the transfer robot 400 and can move linearly with the transfer robot 400.

[0127] The mobile communication feeder 803 can be located at the interface between the atmospheric pressure atmosphere AE provided by the housing 410 and the vacuum atmosphere VE inside the transfer chamber 300. The mobile communication feeder 803 can be coupled to the internal communication link 804 of the robot controller 450.

[0128] During the transmission of control signals from the external controller 700 to the robot controller 450, the control signals need to pass through atmospheric pressure atmosphere AE, vacuum atmosphere VE, and atmospheric pressure atmosphere AE again in sequence. In this situation, the communication connection may be unsuccessful. However, in an exemplary embodiment of the present invention, since the fixed communication feeder 802 and the mobile communication feeder 803 are located at the interface between atmospheric pressure atmosphere AE and vacuum atmosphere VE, respectively, the aforementioned communication connection can be established smoothly.

[0129] Figure 11 is a schematic diagram illustrating a heat dissipation method for dissipating heat generated by an active device located in the conveying robot of Figure 1 to the outside.

[0130] As described above, various active components 460 can be disposed within the housing 410 of the transfer robot 400. These active components 460 can be the aforementioned actuators, the aforementioned robot controller 450, and / or various components used to operate the transfer robot 400. The active components 460 can be components that operate by receiving electrical power. Therefore, the active components 460 may generate heat. The internal space provided by the housing 410 can be provided in a sealed manner relative to the internal atmosphere of the transfer chamber 300. To maintain airtightness, the housing 410 may be provided with sealing devices, such as O-rings. Therefore, the heat generated by the active components 460 may be difficult to dissipate from the internal space of the housing 410 to the outside.

[0131] Therefore, exemplary embodiments of the present invention may further include a heat pump 470, a movable heat dissipation component 480, and a fixed heat dissipation component 390.

[0132] A heat pump 470 can be disposed within the housing 410 to transfer heat from the active component 460 to the movable heat sink 480. One surface of the movable heat sink 480 can face the interior space of the housing 410, and the other surface can face the fixed heat sink 390. The fixed heat sink 390 can be located at the interface between the vacuum atmosphere VE in the transfer chamber 300 and the external atmospheric pressure atmosphere AE. Alternatively, the fixed heat sink 390 can also be configured to extend along the travel track 303.

[0133] In other words, the heat from the active component 460 is transferred to the movable heat dissipation component 480 via the heat pump 470, and the heat transferred to the movable heat dissipation component 480 is then transferred to the fixed heat dissipation component 390, where the heat can be dissipated to the outside. This heat dissipation structure prevents the internal temperature of the outer casing 410 from becoming excessively high.

[0134] Figures 12 and 13 are schematic diagrams illustrating a method of transferring a substrate to a processing chamber using the transfer robot of Figure 1. Referring to Figures 12 and 13, in order to shorten the time for the transfer robot 400 to transfer the substrate W, the linear movement of the transfer robot 400 and the extension-retraction operation of the robotic arm 420 can be performed simultaneously. For example, the transfer robot 400 can extend and retract the robotic arm 420 while moving linearly along the travel track 303 and the travel actuator 440 to load the substrate into or unload the substrate W from the processing chamber 600.

[0135] It should be understood that exemplary embodiments have been disclosed herein and other variations are possible. Elements or features of a particular exemplary embodiment are generally not limited to that particular exemplary embodiment, but are interchangeable and may be used in selected exemplary embodiments where applicable, even if not specifically described or illustrated. These modifications should not be considered as departing from the spirit and scope of the invention, and all modifications that will be obvious to those skilled in the art are intended to be included within the scope of the appended claims.

Claims

1. An apparatus for processing a substrate, the apparatus comprising: At least one delivery chamber; The system also includes a transfer robot that can move linearly within the transfer chamber to transfer a substrate. The transfer robot includes a power receiving unit that receives power. The transfer chamber includes a chamber base and a power supply unit disposed on the chamber base and wirelessly transmitting power to the power receiving unit. The power supply unit includes a plurality of power supply cables; a plurality of terminal units connected to the plurality of power supply cables; and at least one connecting member connected to at least one of the plurality of terminal units to switch the direction of current flowing in the power supply cables at least two or more times.

2. The apparatus according to claim 1, wherein, The plurality of terminal units include: a front terminal unit electrically adjacent to the power supply device; and a rear terminal unit electrically further from the power supply device than the front terminal unit. The front terminal unit includes a plurality of terminals, and a portion of the plurality of terminals of the front terminal unit is connected to a supply cable for receiving current supplied by the power supply device, and another portion is connected to the connecting member.

3. The apparatus according to claim 2, wherein, The front terminal unit includes: a first front terminal unit adjacent to the power supply device; and a second front terminal unit electrically farther from the power supply device than the first front terminal unit. The first front terminal unit and the second front terminal unit include multiple terminals, and the terminals included in the first front terminal unit and the terminals included in the second front terminal unit are arranged in pairs for electrical connection to each other.

4. The apparatus according to claim 3, wherein, The supply cable is connected to a portion of the plurality of terminals of the first front terminal unit, the connecting member is connected to another portion of the plurality of terminals of the first front terminal unit, and the return cable for returning current to the power supply device is connected to yet another portion of the plurality of terminals of the first front terminal unit.

5. The apparatus according to claim 4, wherein, The plurality of connecting members include: a first connecting member; and a second connecting member, the first connecting member being connected to a terminal of a rear terminal unit to return current to the front terminal unit when current supplied from the supply cable flows through the front terminal unit into the rear terminal unit, and the second connecting member being a connecting member connected to the first front terminal unit and configured to return the current returned by the first connecting member back to the rear terminal unit.

6. The apparatus according to claim 2, wherein, The power supply equipment is located outside the transmission chamber, and a feeder is provided in the transmission chamber. The power supply equipment and the feeder are connected by an external cable, and the feeder and the front terminal unit are connected by the supply cable.

7. The apparatus according to claim 1, wherein, The atmosphere within the transfer chamber is controlled by a vacuum atmosphere.

8. The apparatus according to claim 1, wherein, The power supply cable is disposed above the first ferrite core, and the power receiving unit includes a second ferrite core having a shape symmetrical to the first ferrite core and facing the first ferrite core.

9. The apparatus according to claim 2, wherein, The power supply device includes: a power source; and a primary-side converter unit connected to the power source, and the robotic arm includes: a secondary-side converter unit for converting the power received by the power receiving unit; and an actuator that receives power from the secondary-side converter unit.

10. The apparatus according to claim 2, wherein, The transmission chambers are configured in multiple ways, and multiple connecting terminal units are provided between the front terminal unit and the rear terminal unit. Any one of the multiple connecting terminal units is connected to one of the multiple transmission chambers, and the other of the multiple connecting terminal units is connected to the other of the multiple transmission chambers.

11. The apparatus according to claim 10, wherein, The conveying robot is configured to move continuously and linearly between the plurality of conveying chambers.

12. A method for transmitting electrical power to a robotic arm that moves linearly within a vacuum chamber, the method comprising: Connect the supply cable to only a portion of the multiple terminals of the front terminal unit; Current is supplied by the supply cable, and the current flows to the first set of feed cables among the multiple feed cables disposed between the front terminal unit and the rear terminal unit; When current flows into the rear terminal unit, the current is returned from the rear terminal unit to the front terminal unit once via the first connecting member using the second set of feed cables among the plurality of feed cables; and when the returned current flows into the front terminal unit, the current is returned from the front terminal unit to the rear terminal unit a second time via the second connecting member using the third set of feed cables among the plurality of feed cables.

13. The method according to claim 12, wherein, The connecting member connected to the front terminal unit enables the secondary return.

14. The method according to claim 12, further comprising: When the secondary return current flows into the rear terminal unit, the current is returned from the rear terminal unit to the front terminal unit three times through the third connecting member and using the fourth set of feed cables among the plurality of feed cables.

15. The method according to claim 14, wherein, When the three returned currents flow into the front terminal unit, the incoming current flows through the return cable to the external equipment of the vacuum chamber.

16. The method according to claim 12, wherein, The feed cable has current flowing while it is placed on the E-shaped first ferrite core.

17. The method according to claim 16, wherein, The E-shaped second ferrite core of the power receiving unit of the conveying robot wirelessly receives power transmitted by the feed cable while facing the first ferrite core.

18. An apparatus for processing a substrate, the apparatus comprising: At least one delivery chamber; And processing chambers; The transfer robot is linearly movable within the transfer chamber and transfers the substrate into the transfer chamber. The transfer robot includes a power receiving unit that receives power. The transfer chamber includes a chamber base and a power supply unit disposed within the chamber base. The power supply unit includes multiple power supply cables and multiple terminal units connected to one end and the other end of the power supply cables. The terminal units include a front terminal unit connected to a power supply device and a rear terminal unit, the rear terminal unit being electrically further from the power supply device than the front terminal unit. The front-end terminal unit includes: a first front terminal unit electrically adjacent to the power supply device; and a second front terminal unit electrically further from the power supply device than the first front terminal unit. The first and second front terminal units include a plurality of terminals, and the terminals included in the first and second front terminal units are arranged in pairs for electrical connection to each other. A supply cable for supplying current to the power supply device is connected to a portion of the plurality of terminals of the first front terminal unit, and a second connecting member for returning current flowing from the rear terminal unit to the rear terminal unit is connected to another portion.

19. The apparatus according to claim 18, wherein, The return cable for returning current to the power supply device is connected to another portion of the plurality of terminals of the first front terminal unit.

20. The apparatus of claim 18, further comprising: A first connecting member is connected to a terminal of the rear terminal unit to return current to the front terminal unit when current supplied from the supply cable flows through the front terminal unit into the rear terminal unit. The power supply device is disposed outside the transmission chamber, and a feeder is disposed in the transmission chamber. The power supply device and the feeder are connected by an external cable, and the feeder and the front terminal unit are connected by the supply cable.

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