Side end contact structure of PCB

Abstract

The invention discloses a side end contact structure of a PCB. The side end contact structure comprises a substrate; the plurality of contact elements are respectively arranged at the upper end position of the base body, and two ends of each contact element are respectively connected with a first pin; the two side walls of one end of the main PCB are respectively provided with a plurality of connecting parts, the plurality of connecting parts are respectively arranged corresponding to the plurality of contact pieces, and one end, far away from the contact pieces, of each first pin is connected with the corresponding connecting part; and the target connecting body is respectively provided with a plurality of connecting pieces, and the plurality of connecting pieces are respectively and correspondingly connected with the plurality of contact pieces, so that the target connecting body and the main PCB are connected together. The structure is simple, the TOP top surface and the BOT bottom surface of the PCB are connected to provide the contact conduction capability of the third side edge, the space of the surface of the main PCB can be effectively released, and a key solution is provided for the ultrathin design of equipment.

Description

Technical Field

[0001] This invention relates to the field of connector technology, and more particularly to a side contact structure for a PCB board. Background Technology

[0002] In the existing technology, when most PCB boards are connected to FPC circuit boards, a patch is usually placed on the surface of the PCB board. The patch is used to stack the PCB board and the FPC circuit board together. However, this will greatly increase the thickness of the product, resulting in the PCB board occupying a large space, which is not conducive to the ultra-thin design of the equipment. Summary of the Invention

[0003] This invention aims to at least partially solve one of the problems existing in the prior art. To this end, this invention proposes a side contact structure for a PCB board. Its structure is simple and can effectively free up space on the surface of the main PCB board. At the same time, it can also realize a reliable connection of multi-point contact connection on the side of the main PCB board, thus providing a key solution for the ultra-thin design of equipment.

[0004] The above objective is achieved through the following technical solution: A side contact structure for a PCB board, comprising: Matrix; Multiple contacts are respectively disposed at the upper end of the base, and each contact is connected to a first pin at both ends; The main PCB board has multiple connecting parts on both side walls at one end. Each of the multiple connecting parts corresponds to a multiple of the contacts. Each first pin is connected to its corresponding connecting part at the end away from the contact. The target connector has multiple connectors on it, and each connector is connected to a plurality of contacts to connect the target connector to the main PCB board.

[0005] In some embodiments, each of the contact members is provided with a contact point, and each of the connectors is provided with a target contact point, the target contact point being connected to the contact point.

[0006] In some implementations, when the target contact is a raised structure, the contact point is a recessed structure; when the target contact is a recessed structure, the contact point is a raised structure.

[0007] In some embodiments, when the connection portion is a first pad, each of the first pins is provided with a second pad at the end away from the contact member, and the second pad is soldered together with the corresponding first pad.

[0008] In some embodiments, when the connection portion is a through hole, each of the first pins is provided with a plug at the end away from the contact member, and the plug is inserted into the corresponding through hole and connected together.

[0009] In some embodiments, when the connecting part is a connection point, a pressing part is bent and provided on each of the first pins, and the pressing part is connected to the connection point by the elasticity of the first pin.

[0010] In some embodiments, the pressing part is wavy or stepped.

[0011] In some embodiments, a magnet is provided on the substrate, and a corresponding magnetic attracting element is provided on the main PCB board. The magnetic attracting element and the magnet are magnetically attracted to each other by magnetic force, so that the main PCB board and the substrate are magnetically attracted to each other.

[0012] In some embodiments, the contact is made of a conductive material.

[0013] In some implementations, the target connector is a target PCB board, a battery, or an FPC circuit board.

[0014] Compared with the prior art, the present invention has at least the following beneficial effects: 1. The side contact structure of the PCB board of the present invention has a simple structure, which can effectively release the space on the surface of the main PCB board, and at the same time realize the reliable connection on the side of the main PCB board, thus providing a key solution for the ultra-thin design of equipment. Attached Figure Description

[0015] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the PCB board connection structure in an embodiment of the present invention; Figure 2 This is a cross-sectional view of the PCB board connection structure in an embodiment of the present invention; Figure 3 This is a schematic diagram of the PCB board connection structure in an embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of the contact element without contact points in an embodiment of the present invention; Figure 5 This is a schematic diagram of the structure of the contact element when it has contact points in an embodiment of the present invention. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions in the embodiments of this invention will be clearly and completely described below in conjunction with the embodiments of this invention. Obviously, the described embodiments are only some embodiments of this invention, and not all embodiments. The components of the embodiments of this invention can be arranged and designed in various different configurations.

[0018] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of the claimed technical solutions of the invention.

[0019] Example: like Figures 1 to 5 As shown, this embodiment provides a side contact structure for a PCB board, including: Matrix 1; Multiple contact elements 2 are respectively disposed at the upper end of the base 1, and a first pin 3 is connected to both ends of each contact element 2. The main PCB board 4 has multiple connecting parts on both sides of one end of the main PCB board 4. The multiple connecting parts are respectively arranged corresponding to multiple contact parts 2. Each first pin 3 is connected to its corresponding connecting part at the end away from the contact part 2. The target connector has multiple connectors, which are connected to multiple contacts 2 to connect the target connector to the main PCB board 4.

[0020] In this embodiment, multiple contacts 2 are spaced laterally along the left-right direction at the upper end of the substrate 1. First pins 3 are connected to the front and rear ends of each contact 2. Multiple connecting portions are spaced on both sides of the upper end of the main PCB board 4, each corresponding to a contact 2. This allows each first pin 3 to be bent downwards at the end furthest from the contact 2 and connected to its corresponding connecting portion. Specifically, the upper end of the first pin 3 connects to the contact 2, and its lower end connects to the connecting portion of the main PCB board 4, thus achieving an electrical connection between the main PCB board 4, the first pins 3, and the contacts 2. Since multiple connectors are provided on the target connector, and each connector is connected to a corresponding contact 2, the target connector is electrically connected to the main PCB board 4 via the contact 2 and the first pin 3 in sequence. This makes the connection between the target connector and the main PCB board 4 highly flexible and simple in structure. It can effectively free up space on the surface of the main PCB board 4 and also achieve a reliable connection on the side of the main PCB board 4. This provides a key solution for the ultra-thin design of the equipment, effectively improves the space utilization of the main PCB board 4, and further reduces the assembly cost of the product.

[0021] More preferably, the side contact structure of the PCB board in this embodiment can be widely used in fields that are extremely sensitive to space and weight, such as drone flight control modules, robot joint modules, VR glasses motherboards, parallel connections between solid-state battery modules, or memory card interfaces, but is not limited to the above-mentioned devices. Other more suitable devices can also be selected according to actual needs. At the same time, in this embodiment, the base 1 serves as the main support structure, and its shape can be designed as a long strip structure, a block structure, a U-shaped structure, or a frame structure according to actual needs. However, it is not limited to the above-mentioned shapes and structures, and other more suitable shapes and structures can also be selected according to actual needs.

[0022] Furthermore, each contact 2 is provided with a contact point 21, and each connector is provided with a target contact point, which is connected to the contact point 21.

[0023] Preferably, when the target contact point is a raised structure, the contact point 21 is a recessed structure; when the target contact point is a recessed structure, the contact point 21 is a raised structure.

[0024] Preferably, the target connector is a target PCB board, battery module, or FPC circuit board.

[0025] In this embodiment, a contact point 21 is provided at the middle position of the top wall of each contact 2. The contact points 21 can be staggered or aligned in the lateral direction. A target contact point 21 is provided on each connector. The target contact is connected to the contact point 21 so that the target connector is electrically connected to the main PCB board 4 through the connector, contact 2, and first pin 3 in sequence. The spacing between two adjacent contact points 21 can be customized according to the actual PCB pad layout to adapt to different electrical and physical isolation requirements. In addition, when the target contact is a raised junction... In this configuration, contact point 21 is a recessed structure; when the target contact point is a recessed structure, contact point 21 is a raised structure. The recessed structure is suitable for accommodating the raised structure, thus allowing the target contact point and contact point 21 to fit together, thereby improving the stability of the connection between the contact member 2 and the connector. Alternatively, the contact member 2 can be configured as a planar structure, in which case the corresponding connector has a raised target contact point; or, the connector can be configured as a planar structure, in which case the corresponding contact member 2 has a raised contact point 21. More preferably, in this embodiment, the raised structure can be configured in different shapes according to actual needs. For example, the raised structure can be circular, rectangular, square, etc., and the recessed structure is matched with the raised structure to effectively improve the stability of the connection between contact point 21 and the target contact point.

[0026] In addition, the target connector is preferably a target PCB board, a battery module, or an FPC circuit board. Of course, other suitable connectors can be selected according to the actual situation. For example, when the target connector is a target PCB board, mating parts can be provided on both sides of the side wall of the target PCB board. Then, a base is added to the side of the target PCB board. The base is connected to the target PCB board in sequence through contacts and pins. In this way, the contacts of the target PCB board can be mated and connected with the contacts of the main PCB board 4.

[0027] In this way, the main PCB board 4 can meet various connection requirements from single point to high-density array or from plane to side. The shapes of contact point 21 and target contact point can be mixed to meet different electrical and mechanical requirements, such as foolproof, shockproof, and low impedance requirements.

[0028] Preferably, when the connection part is a first pad, each first pin 3 is provided with a second pad at the end away from the contact member 2, and the second pad is soldered together with the corresponding first pad.

[0029] Furthermore, when the connection part is a through hole, each first pin 3 is provided with a plug at the end away from the contact member 2, and the plug is inserted into the corresponding through hole and connected together.

[0030] Specifically, when the connecting part is a connection point, a pressing part 31 is bent and provided on each first pin 3, and the pressing part 31 is connected to the connection point by the elastic force of the first pin 3.

[0031] Preferably, the pressing part 31 is wavy or stepped.

[0032] Specifically, a magnet is provided on the substrate 1, and a corresponding magnetic attracting component is provided on the main PCB board 4. The magnetic attracting component and the magnet are magnetically attracted to each other through magnetic force so that the main PCB board 4 and the substrate 1 are magnetically attracted to each other.

[0033] In this embodiment, when the connecting part is a first pad, each first pin 3 has a second pad at the end away from the contact 2. After the second pad is connected to the corresponding first pad, the second pad and the first pad are soldered together by solder paste printing and reflow soldering processes, thereby electrically connecting the contact 2 to the main PCB board 4 through the first pin 3. Of course, when the connecting part is a through hole, each first pin 3 has a connector at the end away from the contact 2. After the connector is inserted into the corresponding through hole, the first pin 3 is connected to the through hole. Preferably, the connector is a pin-shaped structure or a strip-shaped structure. Of course, other more suitable structures can be selected according to appropriate needs. In addition, when the connecting part is a connection point, each first pin 3 has a second pad at the end away from the contact 2. A pressing part 31 is bent on one of the pins 3. That is, the upper end of the first pin 3 is connected to the contact 2, and its lower end is connected to the connection part of the main PCB board 4. The pressing part 31 is protruding from the outside to the inside at the middle position of the first pin 3. In this way, the pressing part 31 is protruding at both the front and rear ends of each contact 2. The spring force of the two first pins 3 makes the pressing part 31 and the connection point cooperate and connect together. Of course, a magnetic magnet is provided on the base 1, and a corresponding magnetic suction part is provided on the main PCB board 4. The magnetic suction part can preferably be made of a magnetic metal part. In this way, the magnetic suction part and the magnet can be magnetically attracted to each other through magnetic force, so that the main PCB board 4 and the base are magnetically attracted to each other, thereby further improving the stability of the connection between the main PCB board 4 and the base.

[0034] More preferably, the shape of the pressing part 31 is wavy or stepped, but not limited to the above shape. Other more suitable shapes can be selected according to appropriate needs, so that the first pin 3 forms an elastic force relative to the two ends of the contact 2, thereby making the first pin 3 at both ends of the contact 2 more stably clamped on the connecting part. At the same time, the design of the first pin 3 can provide elastic contact pressure, compensate for installation tolerances, adapt to the special angle requirements of side soldering of the main PCB board 4, and provide stronger mechanical holding force after soldering.

[0035] Furthermore, multiple grooves are spaced apart on the top wall of the substrate 1, and the contact 2 is disposed in the corresponding groove. An installation port is provided on both sides of each groove, and the upper end of each first pin 3 passes through the installation port and is connected to one end of the contact 2.

[0036] Specifically, contact 2 is made of a conductive material.

[0037] In this embodiment, multiple grooves are recessed laterally along the top wall of the substrate 1. A contact element 2 is disposed in each groove, and a mounting port is provided at both ends of each groove. The upper end of each first pin 3 passes through the mounting port and connects to one end of the contact element 2, thereby connecting a first pin 3 to each end of the contact element 2. More preferably, the first pin 3 and the contact element 2 are integrally formed, thereby effectively improving the stability of the product. In addition, the contact element 2 and / or the first pin 3 are made of conductive materials. Specifically, the contact element 2 and / or the first pin 3 are preferably made of copper, gold, silver, or nickel. Since the contact element 2 and the first pin 3 are integrally formed metal structures, an additional connection interface is avoided, resulting in low resistance, high mechanical strength, and reliable connection. The above description is only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, and these all fall within the protection scope of the present invention.

Claims

1. A side contact structure for a PCB board, characterized in that, include: Matrix (1); Multiple contacts (2) are respectively disposed at the upper end of the base (1), and a first pin (3) is connected to each end of each contact (2). The main PCB board (4) has multiple connecting parts on both side walls at one end. The multiple connecting parts are respectively arranged corresponding to multiple contact members (2). Each first pin (3) is connected to its corresponding connecting part at the end away from the contact member (2). The target connector is provided with a plurality of connectors, and the plurality of connectors are respectively connected to the plurality of contacts (2) so that the target connector is connected to the main PCB board (4).

2. The side contact structure of a PCB board according to claim 1, characterized in that, A contact point (21) is provided on each of the contact members (2), and a target contact point is provided on each of the connectors, the target contact point being connected to the contact point (21).

3. The side contact structure of a PCB board according to claim 2, characterized in that, When the target contact point is a raised structure, the contact point (21) is a recessed structure; when the target contact point is a recessed structure, the contact point (21) is a raised structure.

4. The side contact structure of a PCB board according to claim 1, characterized in that, When the connection portion is a first pad, each of the first pins (3) is provided with a second pad at the end away from the contact (2), and the second pad is soldered together with the corresponding first pad.

5. The side contact structure of a PCB board according to claim 1, characterized in that, When the connection part is a through hole, each of the first pins (3) is provided with a plug at the end away from the contact (2), and the plug is inserted into the corresponding through hole and connected together.

6. The side contact structure of a PCB board according to claim 1, characterized in that, When the connecting part is a connection point, a pressing part (31) is bent and provided on each of the first pins (3), and the pressing part (31) is connected to the connection point by the elastic force of the first pin (3).

7. The side contact structure of a PCB board according to claim 6, characterized in that, The pressing part (31) is wavy or stepped.

8. The side contact structure of a PCB board according to claim 1, characterized in that, A magnet is provided on the substrate (1), and a corresponding magnetic attractor is provided on the main PCB board (4). The magnetic attractor and the magnet are magnetically attracted to each other by magnetic force so that the main PCB board (4) and the substrate (1) are magnetically attracted to each other.

9. The side contact structure of a PCB board according to claim 1, characterized in that, The contact (2) is made of conductive material.

10. The side contact structure of a PCB board according to claim 1, characterized in that, The target connector is a target PCB board, battery module, or FPC circuit board.

Images