Heat dissipation device for power electronic device and converter equipment

Abstract

The embodiment of the invention relates to the field of power electronic devices, and discloses a heat dissipation device for a power electronic device and converter equipment. The heat dissipation device for the power electronic device comprises a box body and a circuit board, the box body comprises a cover plate and a first cavity, the circuit board is fixed in the first cavity of the box body, and the cover plate is used for covering the first cavity and is arranged opposite to the circuit board; a plurality of potting areas and non-potting areas located on the peripheries of the potting areas are arranged on the circuit board, each potting area comprises an electronic device area and a potting adhesive, and the potting adhesive wraps the electronic device area, extends to the cover plate of the box body in the first direction and is connected with the cover plate; the electronic device area dissipates heat to the box body through the pouring sealant, and the first direction is the direction from the circuit board to the cover plate. According to the heat dissipation device for the power electronic device, the insulation and heat dissipation requirements are met through local encapsulation, and meanwhile the problem that the internal stress of the box body cannot be released is solved.

Description

Technical Field

[0001] The present invention relates to the field of power electronic devices, and in particular to a heat dissipation device and a power converter for power electronic devices. Background Technology

[0002] Electronic devices are widely used in various electronic equipment. Power electronic devices have developed alongside power technology and AC speed control technology, and are the core components of power electronic devices and modern AC speed control devices. In the industrial field, power electronic devices generate a large amount of heat during operation, which affects their operation, thus requiring heat dissipation.

[0003] In existing technologies, the control circuit board of power electronic converter equipment is a PCB (Printed Circuit Board) that provides control signals to power devices. It is typically installed inside a control box, the entire interior of which is protected and cooled by potting compound. Because the potting compound fills the entire box, stress can easily build up inside the compound under high temperatures. This stress cannot be released and can cause damage to electronic components due to pressure. As power electronic converter equipment develops towards miniaturization, lightweight design, and reliability, more effective heat dissipation technologies have become a key research focus. Summary of the Invention

[0004] The purpose of this invention is to provide at least one heat dissipation device and converter for power electronic devices, which can at least solve the problem of stress inside the control box not being released, and at least achieve the technical effect of reducing the stress of the entire box.

[0005] To solve the above-mentioned technical problems, at least one embodiment of this application provides a heat dissipation device for power electronic devices, including: a housing and a circuit board, the housing including a cover plate and a first cavity, the circuit board being fixed in the first cavity of the housing, and the cover plate being used to cover the first cavity and being disposed opposite to the circuit board;

[0006] The circuit board has multiple potting areas and non-potting areas located around the potting areas. Each potting area includes an electronic component area and potting compound. The potting compound covers the electronic component area and extends along a first direction to the cover plate of the housing and is connected to the cover plate. The electronic component area dissipates heat to the housing through the potting compound. The first direction is the direction from the circuit board to the cover plate.

[0007] At least one embodiment of this application also provides a power converter including a heat dissipation device for power electronic devices as described above.

[0008] The heat dissipation device and converter for power electronic devices provided in the embodiments of this application, compared with the prior art, form multiple potting areas and non-potting areas on the circuit board. Each potting area is covered with the electronic device area by the potting glue. The potting glue is connected to the cover plate so as to directly transfer the heat generated by the electronic device area to the housing by the potting glue. Thus, the insulation and heat dissipation requirements are achieved by local potting. At the same time, it solves the problem that the stress caused by the potting glue filling the entire housing cannot be released. Moreover, by reducing the amount of potting glue, the weight and volume of the control box can be reduced and the cost is reduced.

[0009] In addition, the heat dissipation device for power electronic devices also includes a plurality of potting partitions, each of which extends from the circuit board to the cover plate, and the plurality of potting partitions surround to form the plurality of potting areas.

[0010] Additionally, the electronic device area includes at least one first electronic device, the electronic device including an insulating layer formed by the potting compound.

[0011] In addition, the electronic device area includes at least one second electronic device, which is an electronic device whose maximum operating junction temperature is greater than or equal to a first preset temperature value.

[0012] In addition, the electronic device area includes at least one third electronic device, which is an electronic device whose operating voltage is greater than or equal to a first preset voltage value.

[0013] In addition, the cover plate is provided with multiple filling holes, and the multiple filling holes are arranged corresponding to the multiple filling areas.

[0014] In addition, the heat dissipation device for power electronic devices also includes a heat dissipation structure, which is disposed on the side of the cover plate of the housing corresponding to the potting area and away from the circuit board. The heat dissipation structure is used to perform secondary heat dissipation on the potting area.

[0015] In addition, the heat dissipation structure includes heat dissipation fins.

[0016] In addition, the non-encapsulated area is provided with at least one fourth electronic device, which is an electronic device with an operating voltage lower than the second preset voltage value and / or an electronic device with a maximum operating junction temperature lower than the second preset temperature value; the first preset voltage value is greater than the second preset voltage value, and the first preset temperature value is greater than the second preset temperature value.

[0017] In addition, each side of the box is provided with multiple ventilation openings, some of which are corresponding to the non-filled area, for convective heat dissipation of the non-filled area.

[0018] In addition, the housing also includes a second cavity adjacent to the first cavity. The second cavity is located on the side away from the electronic device area of ​​the circuit board, and a heat source device is disposed in the second cavity.

[0019] In addition, the heat dissipation device for power electronic devices also includes a heat insulation layer, which is disposed between the circuit board and the heat source device, and is used to insulate the heat source device from heat.

[0020] In addition, the material of the insulation layer includes materials with a thermal conductivity lower than a preset thermal conductivity.

[0021] In addition, the heat source device includes a power semiconductor device. Attached Figure Description

[0022] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0023] Figure 1 This is a schematic diagram of a heat dissipation device for power electronic devices according to an embodiment of the present invention.

[0024] Figure 2 This is a schematic diagram of a heat dissipation device for power electronic devices according to an embodiment of the present invention.

[0025] Figure 3 This is a schematic diagram of a heat dissipation device for power electronic devices according to an embodiment of the present invention.

[0026] Figure 4 This is a schematic diagram of a heat dissipation device for power electronic devices according to an embodiment of the present invention. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been presented in the various embodiments of the present invention to enable the reader to better understand the present invention. However, the technical solutions claimed in the present invention can be implemented even without these technical details and various changes and modifications based on the following embodiments.

[0028] To facilitate understanding of the embodiments of this application, relevant content regarding power electronic converter equipment will be introduced first.

[0029] The control circuit board (PCB) of power electronic converter equipment provides control signals to power devices. The PCB serves as the support for electronic components and the carrier for their electrical interconnections. It is typically installed within a control box and connects to semiconductor switching devices via circuitry. Some electronic components operate at high voltages, thus requiring insulation design to meet the insulation requirements of high-voltage circuits. Simultaneously, these electronic components generate significant heat during control circuit operation, which is conducted into the control box, causing the PCB temperature to become excessively high. To prevent damage to some electronic components due to overheating, effective cooling methods need to be designed to ensure the longevity and stable operation of the control circuit board.

[0030] In existing technologies, the entire interior of the control box is encapsulated with potting compound for protection and heat dissipation. However, because the entire box is filled with potting compound, stress can easily build up inside the compound under high temperatures. This stress cannot be released and can cause damage to electronic components due to pressure. Furthermore, considering heat dissipation requirements, the control box cannot meet the requirements for high power density and high reliability.

[0031] The present invention relates to a heat dissipation device for power electronic devices, comprising: a housing and a circuit board; the housing includes a cover plate and a first cavity; the circuit board is fixed in the first cavity of the housing; the cover plate is used to cover the first cavity and is disposed opposite to the circuit board; the circuit board is provided with a plurality of potting areas and a non-potting area located around the potting areas; each potting area includes an electronic device area and potting compound; the potting compound covers the electronic device area and extends along a first direction to the cover plate of the housing and is connected to the cover plate; the electronic device area dissipates heat to the housing through the potting compound; the first direction is the direction from the circuit board to the cover plate.

[0032] Compared with the prior art, the embodiments of the present invention, in order to avoid damage to electronic components in the circuit board due to excessive temperature and the inability to release stress due to the filling of the box with glue, form multiple potting areas and non-potting areas on the circuit board. Each potting area uses potting glue to cover the electronic component area. The potting glue is connected to the cover plate so that the heat generated by the electronic component area can be directly transferred to the box using the potting glue. Thus, the insulation and heat dissipation requirements are achieved by using local potting. At the same time, it solves the problem that the stress caused by the filling of the entire box with potting glue cannot be released. Moreover, by reducing the amount of potting glue used, the weight and volume of the control box can be reduced, and the cost can be reduced.

[0033] In addition, partial potting of the circuit board inside the box can reduce the reserved insulation and ventilation gaps, effectively compress the space inside the box, thereby increasing power density. By using the potting area to cover electronic components that require heat dissipation and / or insulation, the requirements of high power density and high reliability can be met.

[0034] The following is a detailed description of the implementation details of the heat dissipation device for power electronic devices in this embodiment. The following implementation details are provided for ease of understanding and are not necessary for implementing this solution.

[0035] Example 1:

[0036] refer to Figure 1 The present invention provides a heat dissipation device for power electronic devices, comprising: a housing 100 and a circuit board 200. The housing 100 includes a cover plate 110 and a first cavity 120. The circuit board 200 is fixed in the first cavity 120 of the housing 100. The cover plate 110 is used to cover the first cavity 120 and is disposed opposite to the circuit board 200. The circuit board 200 is provided with a plurality of potting areas 300 and a non-potting area 400 located around the potting areas 300. Each potting area 300 includes an electronic device area 310 and a potting compound 320. The potting compound 320 covers the electronic device area 310 and extends along a first direction X to the cover plate 110 of the housing 100 and is connected to the cover plate 110. The electronic device area 310 dissipates heat to the housing 100 through the potting compound 320. The first direction X is the direction from the circuit board 200 to the cover plate 110.

[0037] refer to Figure 1 The box body 100 is surrounded by side walls and then covered by a cover plate 110 and a bottom plate (not shown in the figure), with the cover plate 110 and the bottom plate facing each other. The box body 100 includes a first cavity 120, and the cover plate 110 is used to cover the first cavity 120, which can serve as a control box. The cover plate 110 can be arranged parallel to the circuit board 200. The circuit board 200 is fixedly installed in the first cavity 120 of the box body 100 by fasteners (not shown in the figure), and the circuit of the circuit board 200 includes various electronic components such as capacitors, resistors, and transformers. The fasteners are, for example, multiple bolts.

[0038] refer to Figure 1 The circuit board 200 has multiple potting areas 300 and non-potting areas 400 surrounding the potting areas 300. For example, each potting area 300 contains an electronic component area 310 and potting compound 320. The potting compound 320 covers the electronic component area 310 and extends along a first direction X to the cover plate 110 of the housing 100, and contacts and connects with the cover plate 110. The electronic component area 310 is a circuit area composed of multiple electronic components. During operation, the heat generated by the circuit composed of the various electronic components contained in the electronic component area 310 can be directly transferred to the housing 100 through the potting compound 320 for heat dissipation, thereby preventing damage to the electronic components due to overheating.

[0039] The heat dissipation device for power electronic devices provided in this embodiment forms a local potting area 300 on the circuit board 200 to cover the electronic device area 310 inside the housing 100 that requires heat dissipation. The potting compound 320 is connected to the cover plate 110 to transfer the heat generated by the electronic device area 310 to the housing 100. This local potting method achieves the insulation and heat dissipation requirements of the electronic device area 310, solving the problem in related technologies where filling the entire housing 100 results in unreleased stress. Furthermore, the local potting method reduces the reserved insulation and ventilation gaps, thereby reducing the overall size of the housing 100, increasing power density, and meeting the requirements of high power density and high reliability. In addition, the local potting method also reduces the amount of potting compound 320 used, reducing the weight and volume of the control box and lowering costs.

[0040] Example 2:

[0041] The embodiments of the present invention are a detailed description of the above-described potting area. For the purpose of achieving partial potting, refer to... Figure 2 The heat dissipation device also includes multiple potting partitions 330. These partitions can be pre-installed at corresponding positions within the potting area 300 inside the housing 100. The potting area 300 on the circuit board 200 is formed by multiple potting partitions 330. For example, if the potting area 300 is rectangular, it can be formed by four potting partitions 330 connected together. Each potting partition 330 extends from the circuit board 200 to the cover plate 110 and contacts the cover plate 110. In other embodiments, the shape of the potting area 300 can be irregular or circular. The number of potting partitions can be set according to actual conditions, and no specific limitation is made here.

[0042] refer to Figure 2 Multiple potting separators 330 and circuit board 200 form an isolated space for filling potting compound 320, thus forming potting area 300. The material of potting compound 320 can have higher dielectric strength and thermal conductivity than air. Potting compound 320 can be a gel with high thermal conductivity and high dielectric strength or other potting materials with self-healing properties.

[0043] like Figure 2 As shown, an electronic device area 310 is provided in the potting area 300. There is a certain gap between each potting partition 330 and the electronic device area 310, so that the potting area 300 is larger than the electronic device area 310, so that the potting glue 320 can cover the entire electronic device area 310, thereby achieving the purpose of conducting its heat to a larger area outside the box 100 and reducing the local heat flux density.

[0044] In this embodiment, a potting partition 330 is used to separate the potting area 300 from the non-potting area 400 so that the electronic devices arranged in the potting area 300 can be completely covered by potting adhesive 320. The wider the size of the potting area 300, the better the heat dissipation of the electronic device area 310, so as to improve the heat dissipation effect of the electronic device area 310 in a targeted manner.

[0045] refer to Figure 2 One or more potting holes 130 are provided on the cover plate 110 at positions corresponding to the potting area 300. For example, one potting hole 130 can be provided on the cover plate 110 corresponding to the potting area 300 to fill the potting area 300 with potting compound 320. Alternatively, two potting holes 130 can be provided on the cover plate 110 corresponding to the potting area 300 so that during the process of filling the housing 100 with potting compound 320 through one potting hole 130, the air in the containment space can be discharged through the other potting hole 130. In this way, the potting compound 320 can fill the entire potting area 300, resulting in a better potting effect, thereby further realizing the effect of protecting electronic components and heat dissipation using potting compound 320.

[0046] In one embodiment, reference Figure 2 Electronic components requiring insulation can be arranged in the electronic component area 310 of the potting area 300, facilitating the application of potting compound 320 to insulate these components. For example... Figure 2 As shown, the electronic device area 310 contains multiple electronic devices, at least one of which can be a first electronic device 311 requiring insulation. In related technologies, the main characteristic of electronic devices requiring insulation is that they have a built-in insulating layer, which can be called a potting layer. Because the built-in potting layer is relatively thick, the size of the electronic device requiring insulation is relatively large, generally the tallest electronic device on the entire PCB. In this embodiment, the insulating layer of the electronic device with a built-in insulating layer can be eliminated, and its insulation requirement can be compensated by local potting within the housing 100. The advantage of doing so is that the thickness after local potting is thinner than that of the electronic device with a built-in potting layer, thus reducing the overall thickness of the housing 100, i.e., reducing the overall volume of the housing 100 and increasing the overall power density.

[0047] In this embodiment, the insulation requirements of the first electronic device 311 are compensated by partially potting the first electronic device 311 within the housing 100. For example, if the first electronic device 311 is a pulse transformer, it can be designed to be flat. Then, it can be directly potted with potting compound 320. The potting compound 320 can provide insulation for the first electronic device 311. Therefore, the potting compound 320 can be directly used as an insulating layer for the first electronic device 311, eliminating the need for electronic devices with built-in insulating layers, thereby reducing the height of the housing 100 and the overall volume.

[0048] In one embodiment, reference Figure 2 For example, the electronic device area 310 can also be a high-temperature circuit area, which can be, for example, an electronic device area 310 on the circuit board 200 with a high temperature that may be close to or exceed its allowable temperature. The high-temperature circuit area can also be a circuit area composed of multiple electronic devices with an operating junction temperature exceeding a preset voltage range.

[0049] For example, the electronic device area 310 includes one or more second electronic devices 312. The second electronic device 312 is a high-temperature component, that is, an electronic device whose maximum operating junction temperature is greater than or equal to a first preset temperature value, which is in the range of 150℃-180℃. For example, the second electronic device 312 is a surface-mount power switch device with a maximum operating junction temperature below 150℃ and a long-term operating temperature close to 150℃. Due to its high heat loss, its lifespan is shorter. Therefore, it is necessary to minimize its operating temperature to ensure its long-term stable operation. Therefore, the second electronic device 312 in the electronic device area 310 is potted. The potting compound 320 connects the second electronic device 312 and the housing 100. Thus, the heat of the second electronic device 312 can be directly conducted to the housing 100 through the potting compound 320. Then, the heat is dissipated to the external environment through heat exchange between the housing 100 and the air environment, so as to conduct its heat to a larger area of ​​the housing 100 and reduce the local heat flux density.

[0050] In one embodiment, reference Figure 2For example, the electronic device area 310 can also be a high-voltage circuit area. This high-voltage circuit area can be composed of multiple electronic devices, with an operating voltage exceeding a preset voltage range. It can also be an electronic device area 310 with external insulation requirements. For example, the electronic device area 310 includes one or more third electronic devices 313, which are high-voltage components, i.e., electronic devices with an operating voltage greater than or equal to a first preset voltage value. For the local potting of the high-voltage circuit area, the area and thickness of the potting area 300 can be determined by calculation, ensuring that the potting area 300 and the thickness of the potting compound 320 meet the insulation and creepage requirements of the electronic device itself and the installation environment. (Reference) Figure 2 When the electronic device area 310 is a high-voltage circuit area, or contains electronic devices whose operating voltage exceeds the preset voltage range, potting compound 320 can be applied to both the front and back sides of the circuit board 200 corresponding to the electronic device area 310 to ensure the insulation and creepage requirements between the electronic device pins.

[0051] Example 3:

[0052] The embodiments of the present invention are a detailed description of the above-mentioned non-filling area.

[0053] See Figure 2 One or more fourth electronic devices 410 are provided in the non-encapsulated area 400. These fourth electronic devices 410 are electronic devices with low heat dissipation requirements, which can be met by reserving insulation and ventilation space within the housing 100. For example, the fourth electronic device 410 is an electronic device with an operating voltage lower than a second preset voltage value and / or an electronic device with a maximum operating junction temperature lower than a second preset temperature value; wherein, the first preset voltage value is greater than the second preset voltage value, and the first preset temperature value is greater than the second preset temperature value.

[0054] In one embodiment, reference Figures 2 to 3 Furthermore, multiple ventilation holes can be opened on other sides of the housing 100 to allow air circulation for convective heat exchange and cooling of the circuit board 200 inside the housing 100, thereby enhancing the heat dissipation effect. For example... Figure 3 As shown, a number of ventilation openings 600 are provided corresponding to the non-filled area 400 for convective heat dissipation of the non-filled area 400.

[0055] Example 4:

[0056] refer to Figure 3 The present invention provides a heat dissipation device for power electronic devices, the heat dissipation device further comprising a heat dissipation structure 500.

[0057] To further enhance heat dissipation efficiency, a heat dissipation structure 500 can be provided on the outside of the cover plate 110 corresponding to the potting area 300. Specifically, the heat dissipation structure 500 is provided on the side of the cover plate 110 of the housing 100 corresponding to the potting area 300 and away from the circuit board 200. The heat dissipation structure 500 is used for secondary heat dissipation of the potting area 300. This heat dissipation structure 500 can be heat dissipation fins. Adding heat dissipation fins to the outside of the cover plate 110 corresponding to the potting area 300 increases the heat exchange area, thereby enhancing the heat dissipation of the housing 100 to the external environment. The heat dissipation structure 500 can also be a fan, which blows air onto the outside of the housing 100 to enhance the heat dissipation of the outer shell to the environment.

[0058] Example 5:

[0059] refer to Figure 4 The present invention provides a heat dissipation device for power electronic devices. The housing 100 further includes a second cavity 140 adjacent to the first cavity 120. The second cavity 140 is located on the side away from the electronic device area 310 of the circuit board 200. A heat source device 700 is disposed in the second cavity 140.

[0060] With the pursuit of high power density and high reliability, it is necessary to integrate the housing 100 and the heat source device 700. To compress the space within the housing 100 and improve integration and overall power density, the housing 100 can be divided into two cavities: a first cavity 120 and a second cavity 140. The first cavity 120 is used to install the circuit board 200, and the second cavity is used to install the heat source device 700. The heat source device 700 can be an electronic device that generates continuous or intermittent heat, such as a power semiconductor device. The internal temperature of the heat source device 700 can reach 100℃~150℃. To meet the requirements of insulation and heat dissipation, and to prevent the circuit board 200 from being easily affected by the heat source, resulting in excessively high temperatures that could damage the electronic devices, the heat source device 700 is installed on the side of the circuit board 200 away from the electronic device area 310, thereby reducing the impact of the heat source device 700 on the electronic devices.

[0061] In one embodiment, to reduce the impact of the heat source device 700 on the heat dissipation of electronic devices, a heat insulation layer 800 is provided between the circuit board 200 and the heat source device 700. The heat insulation layer 800 is used to insulate the heat source device 700 from heat. For example, the heat insulation layer 800 may be positioned at the interface between the circuit board 200 and the heat source device 700, such as the common surface connecting the first cavity 120 and the second cavity 140, as a heat insulation material. This serves as a heat insulation layer to isolate the heat source in the second cavity 140 and reduce the heating effect on the first cavity 120. The material of the heat insulation layer 800 includes materials with a thermal conductivity lower than a preset thermal conductivity.

[0062] In one embodiment, a low thermal conductivity insulating material can also be provided between the circuit board 200 and the heat source device 700 as a heat insulation layer. This low thermal conductivity insulating material can be any form of low thermal conductivity material, such as a heat-insulating coating, heat-insulating paper, or other heat-insulating composite materials.

[0063] Example 6:

[0064] Embodiments of the present invention also provide a power converter, which includes the heat dissipation device for power electronic devices provided in any of the above embodiments. The power converter is, for example, a converter, which is an electrical device that changes the voltage, frequency, number of phases, and other electrical quantities or characteristics of a power supply system. Converters include rectifiers (AC to DC), inverters (DC to AC), AC converters (AC frequency converters), and DC converters (DC choppers). Open-loop control circuits and closed-loop control circuits are used according to the control method. In addition to the main circuit, the converter also requires a trigger circuit for controlling the on / off state of power switching elements and a control circuit for regulating and controlling electrical energy. The power converter includes the heat dissipation device for power electronic devices provided in any of the above embodiments to improve the heat dissipation of various power modules in the converter and reduce manufacturing costs.

[0065] In this embodiment, since the converter includes the heat dissipation device for power electronic devices provided in any of the above embodiments, and since the principle of the converter in solving the problem is similar to that of the aforementioned heat dissipation device for power electronic devices, the implementation of the heat dissipation device for power electronic devices in the converter can refer to the implementation of the aforementioned heat dissipation device for power electronic devices, and the repeated parts will not be described again.

[0066] It should be understood that the terms "mechanism," "device," "component," etc., used in this application are merely one method of distinguishing different components, elements, parts, sections, or assemblies at different levels. However, if other terms can achieve the same purpose, they can be replaced by other expressions.

[0067] Those skilled in the art will understand that the above embodiments are specific examples of implementing the present invention. In practical applications, the technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification, and various changes can be made to them in form and detail without departing from the spirit and scope of the present invention.

Claims

1. A heat dissipation device for power electronic devices, characterized in that, include: The box body and the circuit board, wherein the box body includes a cover plate and a first cavity, the circuit board is fixed in the first cavity of the box body, and the cover plate is used to cover the first cavity and is disposed opposite to the circuit board; The circuit board has multiple potting areas and non-potting areas located around the potting areas. Each potting area includes an electronic component area and potting compound. The potting compound covers the electronic component area and extends along a first direction to the cover plate of the housing and is connected to the cover plate. The electronic component area dissipates heat to the housing through the potting compound. The first direction is the direction from the circuit board to the cover plate.

2. The heat dissipation device according to claim 1, characterized in that, It also includes a plurality of potting partitions, each of which extends from the circuit board to the cover plate, and the plurality of potting partitions surround to form the plurality of potting areas.

3. The heat dissipation device according to claim 1 or 2, characterized in that, The electronic device region includes at least one first electronic device, the electronic device including an insulating layer formed by the potting compound.

4. The heat dissipation device according to claim 3, characterized in that, The electronic device area includes at least one second electronic device, wherein the second electronic device is an electronic device whose maximum operating junction temperature is greater than or equal to a first preset temperature value.

5. The heat dissipation device according to claim 4, characterized in that, The electronic device area includes at least one third electronic device, which is an electronic device whose operating voltage is greater than or equal to a first preset voltage value.

6. The heat dissipation device according to claim 1, characterized in that, The cover plate is provided with multiple filling holes, and the multiple filling holes are arranged corresponding to the multiple filling areas.

7. The heat dissipation device according to claim 6, characterized in that, It also includes a heat dissipation structure, which is disposed on the side of the cover plate of the housing corresponding to the potting area and away from the circuit board. The heat dissipation structure is used to perform secondary heat dissipation on the potting area.

8. The heat dissipation device according to claim 7, characterized in that, The heat dissipation structure includes heat dissipation fins.

9. The heat dissipation device according to claim 5, characterized in that, The non-encapsulated area is provided with at least one fourth electronic device, which is an electronic device whose operating voltage is lower than the second preset voltage value, and / or an electronic device whose maximum operating junction temperature is lower than the second preset temperature value. The first preset voltage value is greater than the second preset voltage value, and the first preset temperature value is greater than the second preset temperature value.

10. The heat dissipation device according to claim 9, characterized in that, The box body has multiple ventilation openings on each side, and some of the ventilation openings are arranged corresponding to the non-filled area for convective heat dissipation in the non-filled area.

11. The heat dissipation device according to claim 1, characterized in that, The housing also includes a second cavity adjacent to the first cavity. The second cavity is located on the side away from the electronic device area of ​​the circuit board, and a heat source device is disposed in the second cavity.

12. The heat dissipation device according to claim 11, characterized in that, It also includes a heat insulation layer, which is disposed between the circuit board and the heat source device, and the heat insulation layer is used to insulate the heat source device.

13. The heat dissipation device according to claim 12, characterized in that, The material of the insulation layer includes materials with a thermal conductivity lower than a preset thermal conductivity.

14. The heat dissipation device according to claim 11, characterized in that, The heat source device includes a power semiconductor device.

15. A converter device, characterized in that, The converter includes a heat dissipation device for power electronic devices as described in any one of claims 1 to 14.

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