Substrate processing apparatus

Abstract

The invention provides a mechanism which can adjust the position of a nozzle and can easily perform maintenance work when parts are replaced in a substrate processing apparatus in which the nozzle is arranged below a substrate. A substrate processing apparatus (1) is provided with a nozzle mechanism (50). The nozzle mechanism is provided with two or more nozzle parts (51) each having a nozzle body (52) and a nozzle drive part (53) that reciprocates the nozzle body in the radial direction of the substrate, and a support part (54) that supports the two or more nozzle parts in a unified manner, and the support part can support each of the nozzle parts in an independently detachable manner without removing the support part. The nozzle driving part of each of the support part and the nozzle part is provided with a concave-convex shape (560) used for defining the position of each of the more than two nozzle parts relative to the support part.

Description

Technical Field

[0001] The present invention relates to a substrate treatment apparatus that supplies a treatment liquid to the periphery of a substrate within the internal space of a chamber to treat the periphery. Background Technology

[0002] As a process for processing circular or nearly circular substrates such as semiconductor wafers, there is a process that removes only the thin film at the periphery of the substrate formed on at least one main surface of the substrate. For example, a technique is known in which etchant is supplied to the periphery of the substrate while it is rotated, and only the thin film further outward than the location where the etchant is supplied is removed. This process of removing thin films is sometimes referred to as bevel etching.

[0003] For example, in Patent Document 1, in a substrate processing apparatus housed within a processing chamber, a lower peripheral nozzle is provided below the substrate for etching the lower peripheral surface of a horizontally oriented substrate. In the lower peripheral nozzle, multiple nozzles are mounted on a nozzle support member, and each of these nozzles sprays a processing liquid such as a chemical solution or cleaning solution upwards toward the lower peripheral surface of the substrate.

[0004] [Background Technical Documents]

[0005] [Patent Literature]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2022-052835 Summary of the Invention

[0007] [The problem the invention aims to solve]

[0008] In this process, the width of the area removed from the film (etch width) needs to meet a preset target value. Therefore, in the substrate processing apparatus, before use after assembly or component replacement, the nozzle position needs to be adjusted to achieve the specified etch width. Furthermore, the required etch width is not fixed and may vary depending on the purpose. In cases where the etch width is changed, nozzle position adjustment is also necessary.

[0009] However, the background art does not disclose in detail the mounting structure of the multiple nozzles relative to the nozzle support component. Therefore, it is unclear how to adjust the nozzle position. Furthermore, how to replace parts is not described at all. As mentioned above, nozzle position adjustment is required after replacing parts, but the background art lacks innovative approaches to facilitate easy replacement of parts during maintenance.

[0010] The present invention was made in view of the aforementioned problems, and its object is to provide a mechanism in a substrate processing apparatus in which the nozzle is disposed below the substrate, which enables the adjustment of the nozzle position and facilitates maintenance operations when replacing parts.

[0011] [Technical means to solve the problem]

[0012] To address the aforementioned problem, a substrate processing apparatus according to one aspect of the present invention includes: a rotation mechanism for holding a circular substrate in a horizontal position and rotating it about a vertical axis passing through the center of the substrate; and a nozzle mechanism disposed below the substrate; wherein the nozzle mechanism includes: two or more nozzle portions having: a nozzle body for spraying processing liquid from a nozzle outlet toward a peripheral portion of the lower surface of the substrate, and a nozzle drive portion for reciprocating the nozzle body in a radial direction of the substrate by an actuator; and a support portion for uniformly supporting the two or more nozzle portions; wherein the support portion supports each of the two or more nozzle portions independently without removing the support portion; wherein the support portion and the nozzle drive portion of each of the two or more nozzle portions are provided with a concave-convex shape for defining the position of each of the two or more nozzle portions relative to the support portion.

[0013] [The effects of the invention]

[0014] According to one aspect of the present invention, a mechanism is provided in a substrate processing apparatus in which the nozzle is disposed below the substrate, allowing for nozzle position adjustment and easy maintenance operations when replacing parts. Attached Figure Description

[0015] Figure 1 This is a top view showing a schematic configuration of a substrate processing system equipped with the substrate processing apparatus, or processing unit, of the present invention.

[0016] Figure 2 This is a side view showing the internal structure of the processing unit.

[0017] Figure 3 This is a top view of the processing unit.

[0018] Figure 4 This is a diagram showing the structure and configuration of the processing mechanism equipped in the processing unit.

[0019] Figure 5 This is a cross-sectional view of a nozzle block showing the structure of a processing liquid ejection nozzle section equipped with the processing mechanism, showing the nozzle body in its forwardmost position.

[0020] Figure 6 This is a perspective view of the nozzle block equipped with the processing mechanism, showing the state in which a processing liquid is separated and sprayed out of the nozzle section.

[0021] Figure 7 This is a cross-sectional view of the nozzle head in the treatment liquid ejection nozzle section.

[0022] Figure 8 This is a perspective view of the nozzle head as seen from the outlet side.

[0023] Figure 9 This is a perspective view of the nozzle head as seen from the lower surface side. Detailed Implementation

[0024] Hereinafter, one embodiment of the present invention will be described in detail. Figure 1 This is a top view showing a schematic configuration of a substrate processing system equipped with one aspect of the substrate processing apparatus of the present invention, namely processing unit 1. Figure 1 This is a schematic diagram showing the internal structure of the substrate processing system 100, excluding the outer wall panel or other components. The substrate processing system 100 is, for example, located in a cleanroom and is a monolithic device for processing substrates S one by one.

[0025] The substrate processing system 100 includes multiple processing units (substrate processing apparatuses) 1, each serving as a processing entity for the substrate S. Figure 1 Although four processing units 1 are shown arranged in a horizontal direction, each processing unit 1 can also be stacked in multiple segments in the vertical direction. In each of the plurality of processing units 1 equipped in the substrate processing system 100, substrate processing with processing liquid is performed.

[0026] Here, the term "substrate" in this embodiment can be applied to various substrates, such as semiconductor wafers, photomask glass substrates, liquid crystal display glass substrates, plasma display glass substrates, field emission display (FED) substrates, optical disc substrates, magnetic disk substrates, and magneto-optical disk substrates. Although the following description uses a substrate processing apparatus primarily used for processing semiconductor wafers as an example and refers to the accompanying drawings, it can also be applied to the processing of the various substrates illustrated above.

[0027] The processing unit 1 of this embodiment performs the following process: receiving a substrate S on which a thin film of metal or metal compound is formed on one main surface, and removing only the peripheral portion of the thin film formed on the substrate S by etching. This etching process is sometimes referred to as "bevel etching" or simply "bevel processing". In addition, this bevel etching process can be performed by all of the multiple processing units 1 included in the substrate processing system 100, or multiple processing units performing different processes can be combined.

[0028] like Figure 1As shown, the substrate processing system 100 has a substrate processing region 110 for processing a substrate S. A transfer unit 120 is disposed adjacent to the substrate processing region 110. The transfer unit 120 has a container holding section 121 capable of holding multiple containers C for accommodating substrates S. The transfer unit 120 includes a transfer robot 122 for picking up the containers C held by the container holding section 121, removing unprocessed substrates S from the containers C, or storing processed substrates S in the containers C. In each container C, multiple substrates S are accommodated in a generally horizontal orientation.

[0029] In the substrate processing area 110, a stage 112 is configured to hold a substrate S from a transfer robot 122. Furthermore, in top view, a substrate transfer robot 111 is positioned approximately at the center of the substrate processing area 110. Additionally, multiple processing units 1 are arranged to surround the substrate transfer robot 111.

[0030] Relative to these processing units 1, the substrate transfer robot 111 randomly picks up the mounting stage 112 and transfers the substrate S between itself and the mounting stage 112. On the other hand, each processing unit 1 performs a specified process on the substrate S, equivalent to the substrate processing apparatus of the present invention. In this embodiment, these processing units (substrate processing apparatus) 1 have the same function. Therefore, parallel processing of multiple substrates S is possible. Furthermore, in Figure 1 In the diagram, symbol 11 represents the partition, or chamber, of processing unit 1, and the component with additional symbol 15 is the baffle installed in chamber 11.

[0031] Figure 2 This is a side view showing the internal structure of processing unit 1. Figure 3 This is its top view. Figure 2 and Figure 3 In order to facilitate understanding, there are instances where the size or quantity of each part is exaggerated or simplified in the map.

[0032] like Figure 2 and Figure 3 As shown, the processing unit 1 has a structure in which a substrate processing section SP is disposed in an internal space 12 within a chamber 11. The substrate processing section SP is disposed on the upper surface of a base member 17 with a high base plate structure. Each component constituting the substrate processing section SP is electrically connected to a control unit 10, which is part of the overall control device, and operates according to instructions from the control unit 10.

[0033] To clarify the configuration and operation of the various parts of the device, a coordinate system with the Z-direction as the vertical direction and the XY plane as the horizontal plane is appropriately added below. Figure 3 In the coordinate system, the horizontal direction, which is equivalent to the up and down direction on the paper, is designated as the "X direction", and the horizontal direction orthogonal to it is designated as the "Y direction".

[0034] The substrate processing unit SP includes a rotation holding mechanism 2, an anti-scattering mechanism 3, an upper surface protection heating mechanism 4, a processing mechanism 5, an atmosphere separation mechanism 6, a lifting mechanism 7, a centering mechanism 8, and a substrate observation mechanism 9. These mechanisms are mounted on the base component 17.

[0035] The holding and rotating mechanism (rotating mechanism) 2 holds the substrate S in a horizontal position and rotates it about a vertical axis passing through the center of the substrate S. The holding and rotating mechanism 2 includes: a substrate holding part 2A, which holds the substrate S in a substantially horizontal position with the film forming surface of the substrate S facing downward; and a rotating mechanism part 2B, which rotates the substrate holding part 2A holding the substrate S and a part of the anti-scattering mechanism 3, namely the rotating cup part 31, synchronously.

[0036] The substrate holding section 2A includes a circular plate-shaped component, namely a rotary chuck 21, which is smaller than the substrate S. The rotary chuck 21 is arranged with its central axis aligned with the rotation axis AX, and uses the suction force of the pump 26 to hold the substrate S from below. Room temperature nitrogen is supplied to the rotary chuck 21 from the nitrogen supply section 29.

[0037] A cylindrical rotating shaft portion 22 is connected to the lower surface of the rotating suction cup 21. The rotating shaft portion 22 extends in the vertical direction Z with its axis aligned with the rotating axis AX. Furthermore, a rotating mechanism portion 2B is connected to the rotating shaft portion 22.

[0038] The rotating mechanism 2B includes an electric motor 23 that generates a rotational driving force for rotating the substrate holding part 2A and the rotating cup part 31 of the anti-scattering mechanism 3, and a power transmission part 27 for transmitting the rotational driving force.

[0039] The rotating mechanism 2B not only enables the rotating suction cup 21 to rotate integrally with the substrate S, but also includes a power transmission section 27 for synchronizing the rotation of the rotating cup section 31 with the rotation. The power transmission section 27 has a circular plate component 27a made of non-magnetic material or resin. The circular plate component 27a is coaxially mounted with the rotating shaft section 22 and can rotate together with the rotating shaft section 22 around the rotating axis AX.

[0040] The anti-splash mechanism 3 prevents the etching solution sprayed during the etching process from scattering and recovers the treated liquid. The anti-splash mechanism 3 includes: a rotating cup portion 31 capable of rotating around a rotation axis AX while surrounding the outer periphery of the substrate S held by the rotating suction cup 21; and a fixed cup portion 34 fixedly disposed around the rotating cup portion 31. The rotating cup portion 31 is a connector linking the lower cup 32 and the upper cup 33. The droplets captured by the rotating cup portion 31, along with gas components, are recovered and collected by the fixed cup portion 34. The droplets are drained, and the gas components are effectively vented by adjusting the pressure of the fixed cup portion 34 through the operation of the venting portion 38.

[0041] The upper surface protection heating mechanism 4 protects the upper surface of the substrate S in a manner that prevents it from being exposed to the surrounding atmosphere. The upper surface protection heating mechanism 4 has a baffle plate 41 disposed above the upper surface of the substrate S held by the rotating chuck 21. The baffle plate 41 has a circular plate portion 42 held in a horizontal position. The circular plate portion 42 houses a heater (not shown) that is driven and controlled by a heater drive unit 422.

[0042] When the circular plate portion 42 is positioned close to the processing position of the substrate S, the upper surface protection heating mechanism 4 supplies heating gas from the heating gas supply portion 47 between the substrate S and the circular plate portion 42. The heating gas is supplied from the central side of the circular plate portion 42 and flows toward the periphery. As a result, it is possible to prevent the surrounding atmosphere of the substrate S from entering the upper surface of the substrate S.

[0043] The atmosphere separation mechanism 6 separates the internal space 12 within the chamber 11 into a sealed space 12a capable of performing inclined surface treatment on the substrate S, and an outer space 12b of the sealed space 12a. The atmosphere separation mechanism 6 is configured to completely surround the rotating chuck 21, the substrate S held by the rotating chuck 21, the rotating cup portion 31, and the upper surface protection heating mechanism 4 from above. The atmosphere separation mechanism 6 has a lower sealed cup component 61 and an upper sealed cup component 62. The lower sealed cup component 61 is configured to be movable in the vertical direction (able to move up and down).

[0044] like Figure 2 As shown, the lower sealing cup component 61 descends and is positioned at the lower limit position, while in the vertical direction, the upper sealing cup component 62, the lower sealing cup component 61 and the fixed cup part 34 are connected, and the upper sealing cup component 62, the lower sealing cup component 61 and the fixed cup part 34 form a sealed space 12a.

[0045] Furthermore, although not shown, when the lower sealing cup component 61 rises and moves to the retracted position, it engages with the upper cup 33, and the upper cup 33 also rises together. Thus, the upper cup 33 and the upper surface protection heating mechanism 4 move upwards from the rotary suction cup 21. The movement of the lower sealing cup component 61 to the retracted position creates a transport space for the substrate transport robot 111 to receive the rotary suction cup 21.

[0046] The lifting mechanism 7 moves the lower sealed cup component 61 up and down. The lifting mechanism 7 has two lifting drive units, namely a first lifting drive unit 71 and a second lifting drive unit 72. The first and second lifting drive units 71 and 72 synchronize two different circumferentially different parts of the side surface of the lower sealed cup component 61 and move them vertically. Therefore, the lifting and lowering of the upper surface protection heating mechanism 4 and the lower sealed cup component 61 can be performed stably. Furthermore, as the lower sealed cup component 61 rises and falls, the lifting mechanism 7 also raises and lowers the upper cup 33, which is connected to the lower cup 32 and forms the rotating cup part 31.

[0047] The centering mechanism 8 eliminates the eccentricity of the substrate S and performs a centering process that aligns the center of the substrate S with the rotation axis AX. The centering mechanism 8 has a single abutting part 81 and multiple abutting parts 82 arranged on opposite sides of each other across the rotation axis AX of the rotating chuck 21, and a centering drive part 83 that moves the single abutting part 81 and multiple abutting parts 82 in the abutting movement direction.

[0048] The substrate observation mechanism 9 is a mechanism for optically observing the periphery Ss of the substrate S being processed, for the purpose of confirming whether the processing is appropriate. The substrate observation mechanism 9 includes a light source unit 91, an imaging unit 92, an observation head 93, and an observation head drive unit 94.

[0049] Processing unit 5 performs an etching process to remove only the peripheral portion of the thin film formed on substrate S. For example... Figure 3 As shown, the processing mechanism 5 includes a nozzle block (nozzle mechanism) 50 disposed on the lower surface side of the substrate S, and a processing liquid supply section 59 for supplying processing liquid to the nozzle block 50. As described later, the nozzle block 50 has a plurality of processing liquid ejection nozzle sections (nozzle sections) 51 (see reference). Figure 4 The treatment fluid supply unit 59 is connected to each treatment fluid ejection nozzle unit 51.

[0050] The treatment liquid supply unit 59 is configured to supply SC1 liquid, DHF (diluted hydrofluoric acid) or functional water (CO2 water, etc.) as treatment liquid, and can independently spray SC1 liquid, DHF and functional water from each treatment liquid spray nozzle unit 51.

[0051] like Figure 2 As shown, in this embodiment, in order to spray the processing liquid toward the periphery of the lower surface of the substrate S, the nozzle support portion 57 of the nozzle support block 50 is provided below the substrate S held by the rotating suction cup 21. The nozzle support portion 57 has a thin-walled cylindrical portion 571 extending in the vertical direction and an annular flange portion 572 with a radially outwardly bent flange at the upper end of the cylindrical portion 571.

[0052] The cylindrical portion 571 has a shape that allows it to move freely within the air gap formed between the circular plate member 27a and the lower cup 32. The nozzle support portion 57 is fixedly configured such that the cylindrical portion 571 moves into the air gap, and the flange portion 572 is located between the substrate S held by the rotating chuck 21 and the lower cup 32. The nozzle block 50 is mounted on a portion of the peripheral edge of the upper surface of the flange portion 572.

[0053] (Processing Agency)

[0054] Next, use Figures 4-6 The processing mechanism 5 will be explained in detail. Figure 4 This is a diagram showing the structure and configuration of the processing mechanism 5 equipped in the processing unit 1. Figure 5 This is a cross-sectional view of a nozzle block showing the structure of a processing liquid ejection nozzle section equipped with the processing mechanism 5, showing the nozzle body 52 in its forwardmost state. Figure 6 This is a perspective view of the nozzle block 50 equipped with the processing unit 5, showing the state in which a processing liquid is separated and sprayed out of the nozzle section 51A.

[0055] like Figure 4 As shown, the nozzle block 50 has three sets of treatment liquid ejection nozzles 51A, 51B, and 51C that respectively eject treatment liquid, and a support base 54 that supports them. Each treatment liquid ejection nozzle 51A to 51C has the same shape. Although the nozzle block 50 is shown here with three treatment liquid ejection nozzles 51, it is sufficient to have two or more.

[0056] The support base 54 is mounted on the nozzle support 57 (reference). Figure 2 The upper part of the generally circular flange portion 572. The support base 54 uniformly supports the three treatment liquid spray nozzle portions 51A to 51C. Hereinafter, the direction in which the three treatment liquid spray nozzle portions 51A to 51C are arranged will be referred to as the transverse direction of the support base 54.

[0057] The support base 54 has large lugs 542 with screw holes at both transverse ends. The support base 54 abuts the two large lugs 542 against the upper surface of the flange portion 572 and is fixed to the flange portion 572 by screws 543 inserted into the screw holes formed in the large lugs 542.

[0058] The upper surface 541 of the base 54 between the large lugs 542 and the large lugs 542 serves as a support surface for supporting the three treatment liquid ejection nozzles 51A to 51C. The three treatment liquid ejection nozzles 51A to 51C are detachably mounted on the support base 54, as will be described later.

[0059] First, taking a treatment fluid ejection nozzle section 51A as an example, refer to... Figure 5 The structure will be explained. Furthermore, when there is no need to distinguish between the individual treatment fluid ejection nozzle sections 51A to 51C, they will sometimes be simply referred to as "treatment fluid ejection nozzle section 51". Additionally, Figure 5 The structure of the treatment liquid ejection nozzle 51A shown is one example. There are no limitations on the configuration of the support base 54, which can detachably support the treatment liquid ejection nozzles 51A to 51C.

[0060] like Figure 5 As shown, the processing liquid ejection nozzle section 51 includes a main part, namely a nozzle body 52, and a nozzle drive section 53 for reciprocating the nozzle body 52 in the radial direction of the substrate S. The nozzle body 52 is used to eject the processing liquid from the ejection outlet 521 toward the periphery of the lower surface of the substrate S.

[0061] The nozzle body 52 has an elongated shape along the radial direction of the substrate S, with a nozzle head 52a on the outer side in the radial direction and an axial shape portion 52b on the inner side in the radial direction.

[0062] At the outermost, or top, end of the nozzle head 52a in the radial direction, a nozzle outlet 521 for dispensing treatment fluid is provided. The nozzle outlet 521 receives treatment fluid from the treatment fluid supply unit 59 (see reference). Figure 3 The processing liquid supplied through the internal manifold 522 is sprayed outward at an elevation angle of 45 degrees when viewed from the rotation axis AX. The processing liquid is sprayed toward the periphery of the lower surface of the substrate S.

[0063] A metal thin film or a metal compound thin film is formed on the lower surface of the substrate S. When the sprayed processing liquid has a dissolving effect on the film, the thin film in the area where the processing liquid is attached to the lower surface of the substrate S is etched away. When the substrate S is rotated, the processing liquid extends to a position further outward than the attachment position due to the centrifugal force, and as a result, the thin film further outward than the attachment position is removed.

[0064] The shaft-shaped portion 52b extends inward toward the substrate S in the radial direction within the nozzle body 52, and is inserted into and supported by a bearing 533 provided in the nozzle drive unit 53. The nozzle drive unit 53 includes a motor (actuator) 531, a shaft 532 connected at one end to the motor 531, a bearing 533 supporting the shaft-shaped portion 52b of the nozzle body 52, and a housing (accommodating and fixing portion) 534.

[0065] The shaft 532 is integrally mounted with the motor 531 and coaxially configured with the bearing 533. The top end of the shaft 532 engages with the shaft-shaped portion 52b of the nozzle body 52. ​​The housing 534 fixes and houses the motor 531 and the bearing 533. The bearing 533 is a sleeve-type bearing, configured to support the shaft-shaped portion 52b when the nozzle body 52 is moved to its outermost radial position.

[0066] The shaft-shaped portion 52b of the nozzle body 52 has a shaft hole 523 for inserting a shaft 532, and a nut 524 is fixed in the shaft hole 523. A thread is formed on the outer periphery of the shaft 532 to engage with the nut 524. The shaft 532 is engaged with the shaft-shaped portion 52b by being screwed into the nut 524 through the thread on the outer periphery of the shaft 532.

[0067] When shaft 532 rotates due to the driving force of motor 531, nut 524, which is screwed onto the outer circumference of shaft 532, moves along the radial direction of substrate S. The direction of movement is determined by the rotation direction of shaft 532, and the amount of movement is determined by the amount of rotation of shaft 532. As nut 524 moves along the radial direction of substrate S, nozzle body 52, which is fixed to nut 524, moves along the radial direction of substrate S.

[0068] Next, refer to Figure 6 The mounting structure of the three treatment liquid ejection nozzles 51A to 51C of the nozzle block 50 relative to the support base 54 will be described.

[0069] like Figure 6 As shown, the support base 54 has large ears 542 at both lateral ends. The large ears 542 are arranged to rise from the main surface of the support base 54, i.e., the upper surface 541 of the base, and protrude laterally outwards, with threaded holes 542a provided in pairs. The support base 54 abuts the large ears 542 on both sides against the flange portion 572 (see reference). Figure 4 The upper surface of the screw 543 (reference) is inserted into the threaded hole 542a. Figure 4 It is screwed into the threaded hole (not shown) provided in the flange portion 572 and fixed to the flange portion 572.

[0070] The upper surface 541 of the base between the large ear portions 542 becomes a support surface 541a supporting the three treatment liquid ejection nozzle portions 51A to 51C. The support base 54 uniformly supports the three treatment liquid ejection nozzle portions 51A to 51C, and each of the treatment liquid ejection nozzle portions 51A to 51C can be independently mounted and detached without removing the support base 54. Thus, each treatment liquid ejection nozzle portion 51A to 51C can be mounted and detached relative to the support base 54. In this embodiment, as an example of a detachable configuration, each treatment liquid ejection nozzle portion 51A to 51C is screwed to the support base 54. This will be described later.

[0071] Support surface 541a is provided for each of the processing liquid ejection nozzles 51A to 51C. Each processing liquid ejection nozzle 51A to 51C is fixed by the lower surface of the nozzle drive unit 53 (the lower surface of the housing 534) abutting against the support surface 541a.

[0072] The support base 54 and the nozzle drive 53 of each of the treatment liquid ejection nozzles 51A to 51C are provided with a concave-convex shape 560 for defining the position of each of the treatment liquid ejection nozzles 51A to 51C on the support base 54.

[0073] The concave-convex shape 560 is used to define the mounting positions of each treatment liquid ejection nozzle portion 51A to 51C on each support surface 541a of the upper surface 541 of the base. One of the concave-convex shapes 560 is formed on each support surface 541a, and the other of the concave-convex shapes 560 is formed on the lower surface 511 of the nozzle portion of each treatment liquid ejection nozzle portion 51A to 51C that abuts against the support surface 541a.

[0074] According to the above configuration, the processing liquid ejection nozzle section 51 includes a nozzle body 52 and a nozzle drive section 53. The nozzle drive section 53 uses a motor 531 to reciprocate the nozzle body 52 in the radial direction of the substrate S, thereby adjusting the position of the nozzle body 52. ​​As a result, the contact position of the processing liquid ejected from the ejection port 521 provided on the nozzle body 52 with the substrate S can be changed, thereby adjusting the etching width.

[0075] Furthermore, because the configuration of multiple liquid spray nozzles 51 assembled into a single support body as a single component allows for easy installation and miniaturization, it enables the multiple liquid spray nozzles 51 to be treated as a single unit. However, if one of the multiple liquid spray nozzles 51 needs to be replaced, that component must be temporarily removed, and the assembly between the support body and the multiple liquid spray nozzles 51 must be disassembled. Therefore, after replacing the component, the multiple liquid spray nozzles 51 must be reassembled into the support body, and the component must be reinstalled. In this case, because the support body is removed, adjustments must be made in two directions orthogonal to the movement direction of the liquid spray nozzles 51, which is the radial direction of the substrate. Moreover, in addition, the movement direction of the nozzle body 52 of all liquid spray nozzles 51 needs to be adjusted. Therefore, maintainability during component replacement decreases.

[0076] According to the above configuration, the support base 54 can support each of the multiple treatment fluid spray nozzles 51 independently without removing the support base 54. Therefore, only the treatment fluid spray nozzle 51 that needs to be replaced can be removed from the support base 54.

[0077] Since the support base 54 does not need to be removed, there is no need to adjust the two directions orthogonal to the moving direction of the processing liquid ejection nozzle 51, which is the radial direction of the substrate. Furthermore, there is absolutely no need to adjust the moving direction of the nozzle body 52 of the processing liquid ejection nozzle 51 that has not been removed from the support base 54. Therefore, only the moving direction of the nozzle body 52 needs to be adjusted for the processing liquid ejection nozzle 51 that has been removed from the support base 54, ensuring good maintainability when replacing parts.

[0078] Furthermore, because the support base 54 and the treatment fluid nozzle portion 51 are provided with concave and convex shapes 560 for defining the position of the treatment fluid nozzle portion 51 relative to the support base 54, the treatment fluid nozzle portion 51 can be easily positioned relative to the support base 54. As a result, maintainability when replacing parts is improved.

[0079] In this embodiment, the convex-concave shape 560 forms a positioning pin 561a and a pin hole 561b for the positioning pin 561a to engage. Even if the support surface 541a is relatively narrow, the positioning pin 561a and the pin hole 561b can be easily formed.

[0080] Furthermore, in this embodiment, there is a combination of multiple positioning pins 561a and pin holes 561b. This prevents rotation of the treatment fluid ejection nozzle portion 51 centered on the positioning pins 561a.

[0081] Furthermore, in this embodiment, the combination of positioning pin 561a and pin hole 561b is arranged along the radial direction of substrate S. Therefore, the combination of positioning pin 561a and pin hole 561b is positioned along the length of nozzle drive unit 53 (processing liquid ejection nozzle unit 51), ensuring a longer distance between each combination, thus enabling more stable positioning.

[0082] Furthermore, in this embodiment, a pin hole 561b is provided on the side of the treatment liquid ejection nozzle 51, that is, the nozzle drive 53, and a positioning pin 561a is provided on the support base 54.

[0083] If a locating pin 561a is provided on the side of the processing liquid ejection nozzle 51, there is a concern that the locating pin 561a side may be damaged when the removed processing liquid ejection nozzle 51 is placed on a stage or similar surface. Furthermore, since the processing liquid flowing from the nozzle 521 tends to accumulate around the locating pin 561a, there is a concern that it may contaminate the stage. Therefore, by providing the locating pin 561a on the support base 54 side, this undesirable situation can be avoided. Additionally, this configuration is common in the concave-convex shape 560; preferably, the concave side of the concave-convex shape 560 is provided on the nozzle drive portion 53, and the convex side of the concave-convex shape 560 is provided on the support base 54.

[0084] Additionally, as an example of the concave-convex shape 560, a positioning pin 561a is shown engaging with a pin hole 561b, but it is not limited to this. Furthermore, if the cross-sectional shape of the concave-convex shape 560 in the direction orthogonal to the engaging direction is a quadrilateral, a triangle, or other shape that is restricted in rotation when engaged, then the concave-convex shape 560 may also be a single shape.

[0085] In the support base 54, partitions 544 are formed on both sides of each support surface 541a in the transverse direction, and the partitions 544 divide each support surface 541a. The partitions 544 are vertical walls that rise from the upper surface 541 of the base and extend in the radial direction of the substrate S, which is the forward and backward direction of each processing liquid ejection nozzle portion 51A to 51C.

[0086] The partition 544 is also a protrusion, forming threaded first and second holes 544a and 544b for fixing each treatment liquid spray nozzle portion 51A to 51C to the support base 54. As described above, as an example of a detachable configuration, each treatment liquid spray nozzle portion 51A to 51C is screwed to the support base 54.

[0087] Among them, on both sides of the support surface 541a of the processing liquid ejection nozzle part 51B located in the center of the support, there are two partitions 544, along the advance and retreat direction of the nozzle body 52, which is the radial direction of the substrate S, a first threaded hole 544a located inside the radial direction and a second threaded hole 544b located outside the radial direction.

[0088] On the other hand, when viewed from the outer radial direction, the partition 544 at the left end of the support surface 541a of the support fluid ejection nozzle portion 51A has only a first threaded hole 544a located on the inner radial direction. Furthermore, although not shown, when viewed from the outer radial direction, the partition 544 at the right end of the support surface 541a of the support fluid ejection nozzle portion 51C has only a second threaded hole 544b located on the outer radial direction.

[0089] Small ears 538 with threaded holes 538a are formed on both sides of the nozzle portions 51A to 51C of each processing liquid. The small ears 538 are formed at positions corresponding to the first threaded hole 544a and the second threaded hole 544b of the support base 54, offset in the radial direction of the substrate S. When viewed from the radially outer side, i.e., the nozzle head 52a side, the small ears 538 are formed at positions corresponding to the first threaded hole 544a on the left side and at positions corresponding to the second threaded hole 544a on the right side. The small ears 538 are integrally formed on the outer surface of the housing 534.

[0090] Each of the treatment liquid spray nozzles 51A to 51C is fixed to the support base 54 by screwing a screw 548, which is inserted into the threaded hole 538a of the small ear 538, into the first threaded hole 544a and the second threaded hole 544b of the support base 54 while it is placed on the support surface 541a.

[0091] In other words, each of the three liquid ejection nozzles 51A to 51C is screwed onto the support base 54 on both sides of the liquid ejection nozzle 51 in an adjacent direction. The screwing positions on both sides are offset in the radial direction of the substrate S, and the screwing positions of the adjacent liquid ejection nozzles 51 are arranged in the radial direction of the substrate S. The screwing positions are arranged in a left-right symmetrical manner.

[0092] Because the nozzle body 52 and the tube supplying the ejected liquid exist in the radial direction of the substrate S in the nozzle drive section 53, it is difficult to ensure sufficient space for screw fixing. As described above, it is more suitable to perform screw fixing on both sides of the processing liquid ejection nozzle section 51 in the direction adjacent to the nozzle drive section 53.

[0093] Furthermore, in this configuration, the screw positions on both sides are offset in the radial direction of the substrate S, and the screw positions of adjacent liquid ejection nozzle portions 51 are arranged in the radial direction of the substrate S. This avoids interference between the screw positions of adjacent liquid ejection nozzle portions 51, allowing them to be arranged close to each other. This saves space, making the support base 54 smaller and forming a compact configuration. In addition, this effectively avoids interference with the substrate transport robot 111 (see reference). Figure 1 Interference from the hand.

[0094] Furthermore, the support base 54 detachably supports the nozzles 51A to 51C from which the treatment liquid is sprayed. An example of this is a screw-on connection, but it is not limited to this. For example, a snap-fit ​​mechanism could also be used. However, since there are concerns about the effects of heat on snap-fit ​​mechanisms, a screw-on connection is preferred.

[0095] Figures 7-9 This is a diagram showing the structure of the nozzle head 52a of the nozzle body 52 in the treatment liquid ejection nozzle section 51. Figure 7 This is a cross-sectional view of nozzle head 52a. Figure 8 This is a perspective view of the nozzle head 52a as seen from the side of the nozzle outlet 521. Figure 9 This is a perspective view of the nozzle head 52a as seen from the lower surface side.

[0096] like Figures 7-9 As shown, the nozzle head 52a has a head support portion 525 integrally formed with the shaft-shaped portion 52b, and the connector member 580 is fitted into the recess 525a formed in the head support portion 525. The connector member 580 is positioned in the head support portion 525 by means of an embedded abutment surface structure. With the base 580a fitted into the recess 525a, the connector member 580 is fixed to the nozzle body 52 by screwing it into the head support portion 525 with a screw 575.

[0097] A flow path constituting a manifold portion 522 is formed inside the connector component 580. A pipe 585 for supplying the treatment fluid is installed at the connecting portion 580d, which is located at the base 580a and serves as the inlet of the flow path. The pipe 585 is butt-welded to the connecting portion 580d.

[0098] A nozzle tip part 581 with a spray outlet 521 is mounted on the cylindrical portion 580b opposite to the base 580a. Specifically, the nozzle tip part 581 is embedded inside the cylindrical portion 580b. Threads are formed on the outer peripheral surface of the cylindrical portion 580b, and the nut part 582 is fixed to the connector member 580 by screwing it into the threads on the outer peripheral surface of the cylindrical portion 580b. In other words, the nozzle tip part 581 is detachably mounted to the connector member 580.

[0099] A step 580c is formed on the inner circumferential surface of the cylindrical portion 580b of the connector component 580, which is positioned by abutting against the lower end of the nozzle tip part 581. The nozzle tip part 581 is positioned by its lower end abutting against the step 580c.

[0100] The nut portion 582 has a bottom 582a on one side of the axial direction, through which the nozzle tip part 581 is inserted and installed in the through hole 582b provided in the bottom 582a. The tightness of the nut portion 582 is determined by the thickness tolerance between the inner surface of the bottom 582a of the nut portion 582 and the upper surface of the cylindrical portion 580b.

[0101] In this configuration, the nut part 582 can be removed, and only the nozzle tip part 581 needs to be replaced. In the configuration where the nozzle tip part 581 and the connector part 580 are integrally set and welded, the tube 585 needs to be removed together. However, by separating the nozzle tip part 581 and the connector part 580, it is not necessary to remove the tube 585, thereby improving maintainability.

[0102] The treatment fluid ejection nozzle 51 (51A-51C) and the support base 54 are made of a material with excellent chemical resistance, such as a resin material. For example, depending on the purpose, polyethylene resin, PTFE (polytetrafluoroethylene) resin, PEEK (polyetheretherketone) resin, etc. can be appropriately selected and used.

[0103] 〔Summarize〕

[0104] A substrate processing apparatus according to one aspect of the present invention includes: a rotator for holding a circular substrate in a horizontal position and rotating it about a vertical axis passing through the center of the substrate; and a nozzle mechanism disposed below the substrate; wherein the nozzle mechanism includes: two or more nozzle portions having: a nozzle body for spraying processing liquid from a spray outlet toward a peripheral portion of the lower surface of the substrate, and a nozzle drive portion for reciprocating the nozzle body in a radial direction of the substrate by an actuator; and a support portion for uniformly supporting the two or more nozzle portions; wherein the support portion supports each of the two or more nozzle portions independently without removing the support portion; wherein the support portion and the nozzle drive portion of each of the two or more nozzle portions are provided with a concave-convex shape for defining the position of each of the two or more nozzle portions relative to the support portion.

[0105] According to the aforementioned configuration, the nozzle section includes a nozzle body and a nozzle drive. The nozzle drive section uses an actuator to reciprocate the nozzle body in the radial direction of the substrate, thereby adjusting the position of the nozzle body. This allows for variation in the contact position of the processing liquid ejected from the nozzle body's outlet onto the substrate, thereby adjusting the etching width.

[0106] Furthermore, because the configuration of multiple nozzles as a single component, assembled onto a support body, allows for easy assembly and miniaturization, it addresses the issue of replacing one nozzle. This requires temporarily removing that component and disassembling the support body from the nozzles. Therefore, after replacing the component, the nozzles must be reassembled onto the support body, and the component reinstalled. In this case, because the support body is removed, adjustments are needed in two directions orthogonal to the nozzle's movement direction (i.e., the radial direction of the substrate). Moreover, all nozzles require adjustments to their movement direction. This reduces maintainability during component replacement.

[0107] According to the configuration described above, the support portion supports each of two or more nozzle portions independently without removing the support portion. Therefore, only the nozzle portion that needs to be replaced can be removed from the support portion.

[0108] Since the support portion does not need to be removed, there is no need to adjust the two directions orthogonal to the movement direction of the nozzle portion, which is the radial direction of the substrate. Furthermore, there is absolutely no need to adjust the movement direction of the nozzle body of the nozzle portion that has not been removed from the support portion. Therefore, only the movement direction of the nozzle body of the nozzle portion removed from the support portion needs to be adjusted, resulting in good maintainability when replacing parts.

[0109] Furthermore, because the support and nozzle drive sections are provided with concave and convex shapes to define the position of the nozzle section relative to the support, the removed nozzle section can be easily positioned relative to the support. This makes maintenance easier when replacing parts.

[0110] In addition, in the invention, the concept of "circular substrate" is: in addition to the main surface of the substrate being circular in a strict sense when viewed from above, it also includes "approximately circular substrate" in which a portion of the outer periphery with a circular envelope has a part that is different from the circumference, such as an orientation plane or a notch.

[0111] [Additional Notes]

[0112] This invention is not limited to the various embodiments described. Various modifications can be made within the scope of the claims. Embodiments obtained by appropriately combining the technical methods disclosed in different embodiments are also included within the technical scope of this invention.

[0113] [Explanation of Symbols]

[0114] 1. Processing Unit (Substrate Processing Apparatus)

[0115] 2. Maintaining the rotating mechanism (rotating mechanism)

[0116] 5 processing facilities

[0117] 50 Nozzle Blocks (Nozzle Mechanisms)

[0118] 51, 51A, 51B, 51C Treatment fluid ejection nozzle section (nozzle section)

[0119] 52 Nozzle Body

[0120] 53 Nozzle Drive Unit

[0121] 54 Support base (support section)

[0122] 57 Nozzle Support

[0123] 59 Processing Fluid Supply Department

[0124] 110 substrate processing area

[0125] 521 nozzle

[0126] 560 concave-convex shape

[0127] 561a positioning pin

[0128] 561b pin hole.

Claims

1. A substrate processing apparatus comprising: A rotating mechanism holds a circular substrate in a horizontal position, allowing it to rotate about a vertical axis passing through the center of the substrate; and A nozzle mechanism is disposed below the substrate; and The nozzle mechanism includes: Two or more nozzle sections, comprising a nozzle body for spraying processing liquid from a nozzle outlet toward the lower surface periphery of the substrate, and a nozzle drive section for reciprocating the nozzle body in the radial direction of the substrate by means of an actuator; as well as The support section provides unified support for the two or more nozzle sections; The support can independently support each of the two or more nozzles without removing the support; The nozzle drive portion of each of the support portion and the two or more nozzle portions is provided with a concave-convex shape for defining the position of each of the two or more nozzle portions relative to the support portion.

2. The substrate processing apparatus according to claim 1, wherein the irregular shape has a positioning pin and a pin hole for engaging the positioning pin.

3. The substrate processing apparatus according to claim 2, characterized in that... It has a combination of multiple positioning pins and pin holes.

4. The substrate processing apparatus of claim 3, wherein the combination of the plurality of positioning pins and the pin holes is arranged along the radial direction.

5. The substrate processing apparatus according to claim 1, wherein the nozzle driving portion has a concave side of the uneven shape; and The support portion has a convex side with the concave-convex shape.

6. The substrate processing apparatus according to claim 1, characterized in that, Each of the two or more nozzle portions is screwed to the support portion on both sides of the nozzle portion in an adjacent direction; and The screw positions on both sides are offset in the radial direction, and the screw positions of each adjacent nozzle portion are arranged in the radial direction.

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