Etching device for semiconductor chip production
By designing an etching device with feeding, lifting, and protective mechanisms, the problem of damage to semiconductor chips caused by friction and collision during processing was solved, achieving safe and efficient etching processing and convenient chip removal, thus improving processing safety and sealing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- JIANGSU TANGLONG ELECTRONIC TECH CO LTD
- Filing Date
- 2026-02-03
- Publication Date
- 2026-05-01
AI Technical Summary
In existing semiconductor chip etching equipment, the microstructure of semiconductor chips is easily damaged by friction and collision during processing, resulting in low safety.
An etching device comprising a feeding mechanism, a lifting mechanism, and a protective mechanism was designed. The feeding mechanism enables the safe immersion and removal of semiconductor chips, the lifting mechanism facilitates chip removal, and the protective mechanism ensures the device's airtightness and prevents solution evaporation.
It improves the safety and convenience of semiconductor chip etching processes, prevents chips from being damaged by friction and collision during processing, and ensures the sealing of the processing to prevent solution gas from escaping.
Smart Images
Figure CN121969045A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor chip manufacturing and processing, specifically to an etching apparatus for semiconductor chip manufacturing. Background Technology
[0002] Semiconductor chips are functional devices made by etching and wiring on semiconductor wafers. They integrate a large number of transistors, resistors, capacitors and other components and interconnects on semiconductor substrates such as silicon to realize specific electronic functions. They are the core of modern electronic devices.
[0003] In semiconductor chip manufacturing, etching is one of the core processes in wafer fabrication. Essentially, it involves using chemical or physical methods to precisely remove the material not protected by photoresist from the wafer surface, thereby carving the designed circuit patterns onto the wafer. The mainstream etching technologies are divided into two main categories: wet etching and dry etching. Wet etching involves immersing the wafer in a chemical etching solution, using a chemical reaction to dissolve the material not protected by photoresist. To improve the safety of semiconductor chip etching, existing etching equipment slides the chip from a ramp into a housing, allowing the etching liquid inside the housing to etch the chip. However, the microstructure of semiconductor chips is fragile, and sliding into the housing causes significant friction, which can lead to collisions and breakage, resulting in low safety. Summary of the Invention
[0004] The purpose of this invention is to provide an etching apparatus for semiconductor chip manufacturing, so as to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, the present invention provides the following technical solution: An etching apparatus for semiconductor chip manufacturing includes: an apparatus housing and a placement frame disposed inside the apparatus housing; a baffle is provided on the top of the placement frame, and protective grilles are installed on the inner sides of both the placement frame and the baffle; a rotating rod is fixedly installed on the outer side of the baffle, and two symmetrically distributed sleeves are hinged to the outer side of the rotating rod, with the sleeves fixedly installed on the outer side of the placement frame; the apparatus further includes: a feeding mechanism for vertically feeding semiconductor chips, the feeding mechanism being installed inside the apparatus housing, and the feeding mechanism including a movable plate slidably installed inside the apparatus housing. The movable plate can adjust the position of the placement frame and the shield; the lifting mechanism is used to lift the etched semiconductor chip, the lifting mechanism is installed at the bottom of the placement frame, the lifting mechanism includes a plurality of push rods arranged in a rectangular array at the bottom of the placement frame, the push rods can lift the semiconductor chip; the protective mechanism is used to open the device housing to remove the etched semiconductor chip, the protective mechanism is installed on the outside of the device housing, the protective mechanism includes a sealing plate disposed on the outside of the device housing, the sealing plate can open the device housing after the semiconductor chip etching is completed.
[0006] Preferably, the feeding mechanism further includes two support plates symmetrically fixedly installed on the outside of the movable plate. The support plates are fixedly installed on the bottom of the placement frame. A movable block is fixedly installed on the side of the movable plate away from the support plates. A mounting shell is fixedly installed on the outside of the device housing. A slide is fixedly installed on the inside of the mounting shell, and the movable block is slidably installed on the inside of the slide. A screw is rotatably installed on the inside of the slide, and the movable block is threadedly fitted onto the outside of the screw. A sliding groove is provided on the outside of the device housing for the movable block to slide in a limited manner. A drive motor is fixedly installed on the outside of the mounting shell, and the output end of the drive motor is connected to the screw via a synchronous belt. First gears are fixedly installed at both ends of the rotating rod. Two first racks are fixedly installed on the inside of the device housing, each located above one of the two first gears.
[0007] Preferably, the lifting mechanism further includes a second gear fixedly installed on the outside of the rotating rod, a U-shaped rod fixedly installed between the placement frame and the moving plate, a second rack slidably installed on the outside of the U-shaped rod and meshing with the second gear, a pusher fixedly installed at the bottom of the second rack, four push blocks arranged in a rectangular array fixedly installed at the top of the pusher, two symmetrically distributed guide rods fixedly installed between the bottom of the placement frame and the outside of the moving plate, the pusher slidably installed on the outside of the two guide rods, an installation plate fixedly installed between the bottom ends of the multiple push rods, four stops fixedly installed at the bottom of the installation plate respectively contacting the four push blocks, four fixing rods slidably penetrating the installation plate fixedly installed at the bottom of the placement frame, and a tension spring fixedly installed between the bottom end of the fixing rod and the bottom of the installation plate, and the contact surfaces of the stops and the push blocks are all inclined structures.
[0008] Preferably, the protective mechanism further includes a top cover fixedly installed on the top of the movable plate, the bottom of the top cover contacting the top of the device housing, a material inlet being provided on the side of the device housing away from the mounting shell, and a sealing plate being slidably installed inside the material inlet, two symmetrically distributed third racks being fixedly installed on the bottom of the top cover, two symmetrically distributed fourth racks being fixedly installed on the side of the sealing plate near the third racks, a third gear being fitted between the fourth racks and the third racks, and two symmetrically distributed mounting seats being fixedly installed on the inner side of the device housing, with the two third gears being rotatably mounted on the inner sides of the two mounting seats respectively.
[0009] Preferably, two symmetrically distributed sliding plates are fixedly installed on the inner side of the device housing, and positioning grooves for limiting the sliding of the sliding plates are provided on both sides of the movable plate.
[0010] Preferably, an arc-shaped rod is fixedly installed on both sides of the shield, a sleeve block is slidably installed on the outer side of the arc-shaped rod, and the sleeve block is fixedly installed on the outer side of the placement frame. An arc-shaped spring is fixedly installed between the sleeve block and the top end of the arc-shaped rod.
[0011] Preferably, a retaining plate is fixedly installed on both sides of the push block, and the size of the retaining plate is larger than the size of the push block, with one side of each retaining plate in contact with the outer side of the stop block.
[0012] Preferably, a slide bar is fixedly installed on the side of the sealing plate near the fourth rack, and two symmetrically distributed positioning rods are fixedly installed on the inner side of the material inlet of the device housing, with the slide bar slidably installed on the outer side of the positioning rods.
[0013] Preferably, the mounting base has a U-shaped structure and is sleeved on the outside of the third rack.
[0014] Preferably, two symmetrically distributed diagonal braces are fixedly installed between the top cover and the movable plate.
[0015] Compared with the prior art, the beneficial effects of the present invention are: This invention, through a feeding mechanism, enables the semiconductor chip to be placed in a placement frame, which then immerses the semiconductor chip in an etching solution with the frame facing downwards. A shield can cover the placement frame, and during the process of resetting the placement frame upwards after etching, the shield opens the placement frame, thereby improving the safety of the semiconductor chip etching process.
[0016] This invention uses a lifting mechanism where the inclined surface of the pusher can push the inclined surface of the stop block, causing the stop block to move the mounting plate along the outside of the four fixed rods. The mounting plate lifts the semiconductor chip in the placement frame via the push rod, making it easier for workers to remove the etched semiconductor chip, thereby improving the convenience of semiconductor chip retrieval.
[0017] This invention, through a protective mechanism, allows the top cover to move away from the top of the device housing when the placement frame moves upward, and the sealing plate to open the material inlet, making it easy for workers to take out the etched semiconductor chip from the material inlet. After the semiconductor chip is immersed in the etching solution, the top cover and the sealing plate can seal the device housing, preventing the gas from the evaporating etching solution from escaping, thereby achieving a sealing and protective effect. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the outer shell and support plate structure of the device in this invention; Figure 3 This is a partial cross-sectional structural diagram of the sealing plate and mounting shell in this invention; Figure 4 for Figure 3 Enlarged structural diagram of area A in the middle; Figure 5 This is a schematic diagram of the baffle and placement frame structure in this invention; Figure 6 This is a schematic diagram of the pusher and guide rod structure in this invention; Figure 7 This is a schematic diagram of the structure of the second gear and the second rack in this invention; Figure 8 This is a schematic diagram of the push rod and mounting plate structure in this invention.
[0019] In the diagram: 1. Device housing; 2. Placement frame; 3. Baffle; 4. Protective grille; 5. Rotating rod; 6. Sleeve; 7. Moving plate; 8. Push rod; 9. Sealing plate; 10. Support plate; 11. Moving block; 12. Mounting shell; 13. Slide; 14. Screw; 15. Drive motor; 16. First gear; 17. First rack; 18. Second gear; 19. U-shaped rod; 20. Second rack; 21. Push frame; 22. Push block; 23. Guide rod; 24. Mounting plate; 25. Stop block; 26. Fixing rod; 27. Tension spring; 28. Top cover; 29. Third rack; 30. Fourth rack; 31. Third gear; 32. Mounting seat; 33. Slide plate; 34. Arc rod; 35. Sleeve; 36. Arc spring; 37. Clamping plate; 38. Slide bar; 39. Positioning rod; 40. Diagonal rod. Detailed Implementation
[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0021] Example 1: Please refer to Figures 1-8 The diagram shows an etching apparatus for semiconductor chip production, comprising an apparatus housing 1 and a placement frame 2 installed inside the apparatus housing 1. An injection valve is provided on the outside of the apparatus housing 1, through which etching solution is injected into the apparatus housing 1. A baffle 3 is provided on the top of the placement frame 2, and protective grids 4 are installed on the inner sides of both the placement frame 2 and the baffle 3. The semiconductor chip is placed into the placement frame 2, and the baffle 3 is placed on top of the placement frame 2, so that the etching solution inside the apparatus housing 1 passes through the protective grids 4 to etch the semiconductor chip. A rotating rod 5 is fixedly installed on the outside of the baffle 3. Two symmetrically distributed sleeves 6 are hinged to the outside of the rotating rod 5, and the sleeves 6 are fixedly installed on the outside of the placement frame 2. The baffle 3 can rotate the rotating rod 5 with the sleeves 6 as the fulcrum, so that the baffle 3 is separated from the placement frame 2, making it easier to place the semiconductor chip into the placement frame 2, and then place the baffle 3 on the placement frame 2 to protect the semiconductor chip. The feeding mechanism includes a movable plate 7 slidably mounted inside the device housing 1. The movable plate 7 can adjust the position of the placement frame 2 and the baffle 3. The feeding mechanism also includes two support plates 10 symmetrically fixedly mounted on the outside of the movable plate 7. The support plates 10 are fixedly mounted on the bottom of the placement frame 2. When the movable plate 7 moves, it can drive the placement frame 2 to move synchronously through the support plates 10. A movable block 11 is fixedly mounted on the side of the movable plate 7 away from the support plates 10. A mounting shell 12 is fixedly mounted on the outside of the device housing 1. A slide 13 is fixedly mounted on the inside of the mounting shell 12, and the movable block 11 is slidably mounted on the inside of the slide 13. A screw 14 is rotatably mounted on the inside of the slide 13, and the movable block 11 is threadedly assembled with the screw. On the outer side of rod 14, a sliding groove is provided on the outer side of the device housing 1 for the movable block 11 to slide in a limited manner. When the screw 14 rotates, it can drive the movable block 11 to move along the inner side of the slide 13, so that the movable block 11 drives the movable plate 7 to move, thereby moving the placement frame 2 and immersing the semiconductor chip in the placement frame 2 into the etching solution. A drive motor 15 is fixedly installed on the outer side of the mounting shell 12, and the output end of the drive motor 15 is connected to the screw 14 through a synchronous belt. The drive motor 15 can drive the screw 14 to rotate through the synchronous belt. First gears 16 are fixedly installed at both ends of the rotating rod 5. Two first racks 17 are fixedly installed on the inner side of the device housing 1, respectively located above the two first gears 16. When the frame 2 moves upward, it can drive the rotating rod 5 to move synchronously through the sleeve 6, so that the two first gears 16 at the end of the rotating rod 5 contact the two first racks 17 respectively, causing the first racks 17 to drive the first gears 16 to rotate, and the first gears 16 to drive the rotating rod 5 to rotate. The rotating rod 5 can then drive the baffle 3 to swing upward, making it easier for the operator to remove the semiconductor chip. Two symmetrically distributed sliding plates 33 are fixedly installed on the inner side of the device housing 1, and positioning grooves for limiting the sliding of the sliding plates 33 are opened on both sides of the moving plate 7. The moving plate 7 can move between the two sliding plates 33, so that the moving plate 7 can fit tightly against the inner side of the device housing 1, ensuring the seal of the sliding groove on the device housing 1. The baffle 3 has two sides All are fixedly installed with an arc-shaped rod 34. A sleeve 35 is slidably installed on the outer side of the arc-shaped rod 34 and fixedly installed on the outer side of the placement frame 2. An arc-shaped spring 36 is fixedly installed between the sleeve 35 and the top of the arc-shaped rod 34. When the first rack 17 drives the rotating rod 5 to rotate through the first gear 16, the rotating rod 5 can drive the shield 3 to swing upward, so that the shield 3 drives the arc-shaped rod 34 to move along the inner side of the sleeve 35 and stretches the arc-shaped spring 36. Therefore, when the first gear 16 moves away from the first rack 17, the rebound force of the arc-shaped spring 36 is used to keep the shield 3 against the top of the placement frame 2, preventing the shield 3 from loosening and falling off the placement frame 2, and ensuring the protection of the semiconductor chip.
[0022] Example 2: Please refer to Figures 6-7This embodiment further illustrates Example 1. The lifting mechanism shown in the figure includes multiple push rods 8 arranged in a rectangular array at the bottom of the placement frame 2. The push rods 8 can lift the semiconductor chip. The lifting mechanism also includes a second gear 18 fixedly installed on the outside of the rotating rod 5. A U-shaped rod 19 is fixedly installed between the placement frame 2 and the moving plate 7. A second rack 20 that meshes with the second gear 18 is slidably installed on the outside of the U-shaped rod 19. A push frame 21 is fixedly installed at the bottom of the second rack 20, and four push frames 21 are fixedly installed at the top of the push frame 21. The push blocks 22 are arranged in a rectangular array. Two symmetrically distributed guide rods 23 are fixedly installed between the bottom of the placement frame 2 and the outer side of the moving plate 7. The push frame 21 is slidably installed on the outer side of the two guide rods 23. When the rotating rod 5 rotates, it can drive the second rack 20 to move through the second gear 18. The second rack 20 can drive the push frame 21 to move along the outer side of the two guide rods 23. The push frame 21 can drive the four push blocks 22 to move synchronously. A mounting plate 24 is fixedly installed between the bottom ends of the multiple push rods 8. The bottom of the mounting plate 24 Four stops 25 are fixedly installed, each contacting one of the four push blocks 22. Four fixed rods 26 are fixedly installed at the bottom of the placement frame 2, sliding through the mounting plate 24. A tension spring 27 is fixedly installed between the bottom end of the fixed rod 26 and the bottom of the mounting plate 24. The contact surfaces of the stops 25 and the push blocks 22 are both inclined surfaces. When the pusher 21 moves the push blocks 22, the inclined surfaces of the push blocks 22 push the inclined surfaces of the stops 25, causing the stops 25 to move the mounting plate 24 along the outer side of the four fixed rods 26, and thus pressurizing the tension springs 27. The stretching and mounting plate 24 drives the push rod 8 to move upward, causing the push rod 8 to lift the semiconductor chip in the placement frame 2, making it easier for the staff to remove the etched semiconductor chip and improving the convenience of semiconductor chip retrieval. Both sides of the push block 22 are fixedly installed with a clamping plate 37, and the size of the clamping plate 37 is larger than the size of the push block 22. The corresponding side of the two clamping plates 37 is in contact with the outer side of the stop block 25. The push block 22 can drive the two clamping plates 37 to move along the outer side of the stop block 25, making it easy for the push block 22 to smoothly push the stop block 25 to move.
[0023] Example 3: Please refer to Figures 2-4This embodiment further illustrates other embodiments. The protective mechanism shown in the figure includes a sealing plate 9 disposed on the outside of the device housing 1. The sealing plate 9 can open the device housing 1 after the semiconductor chip etching is completed. The protective mechanism also includes a top cover 28 fixedly installed on the top of the movable plate 7. The bottom of the top cover 28 contacts the top of the device housing 1. A material inlet is opened on the side of the device housing 1 away from the mounting shell 12, and the sealing plate 9 is slidably installed inside the material inlet. Two symmetrically distributed third toothed racks 29 are fixedly installed on the bottom of the top cover 28. Two symmetrically distributed fourth racks 30 are fixedly installed on the side of the sealing plate 9 near the third rack 29. A third gear 31 is assembled between the fourth rack 30 and the third rack 29. Two symmetrically distributed mounting seats 32 are fixedly installed on the inner side of the device housing 1, and the two third gears 31 are rotatably mounted on the inner side of the two mounting seats 32 respectively. When the moving plate 7 moves upward, it can drive the top cover 28 away from the top of the device housing 1. The top cover 28 drives the two third racks 29 to move, so that the third racks 29 drive the third gears 31 to rotate. The third gear 31 drives the fourth rack 30 to move, causing the fourth rack 30 to move the sealing plate 9 downwards along the inner side of the feeding port. The sealing plate 9 opens the feeding port, allowing workers to easily remove the etched semiconductor chip from it. After the semiconductor chip is immersed in the etching solution, the top cover 28 and the sealing plate 9 seal the device housing 1, preventing the release of gases from the evaporating etching solution. A slide bar 38 is fixedly installed on the side of the sealing plate 9 near the fourth rack 30. Two symmetrically arranged slide bars 38 are fixedly installed on the inner side of the feeding port of the device housing 1. The positioning rod 39 of the cloth is slidably installed on the outside of the positioning rod 39, and the sealing plate 9 can drive the sliding strip 38 to move along the outside of the positioning rod 39 to ensure the smooth movement of the sealing plate 9. The mounting seat 32 has a U-shaped structure and is sleeved on the outside of the third rack 29, so that the third rack 29 can move along the inside of the mounting seat 32 to ensure the smooth movement of the third rack 29. Two symmetrically distributed diagonal rods 40 are fixedly installed between the top cover 28 and the moving plate 7, so that the diagonal rods 40 provide support for the top cover 28 and the moving plate 7.
[0024] Working principle: First, the operator places the semiconductor chip on the protective grid 4 inside the placement frame 2 and starts the drive motor 15. The drive motor 15 drives the screw 14 to rotate via the synchronous belt. The screw 14 drives the moving block 11 to move along the inner side of the slide 13, causing the moving block 11 to drive the moving plate 7 to move downward. The moving plate 7 drives the top cover 28 and the two support plates 10 to move synchronously. The top cover 28 drives the two third racks 29 to move downward synchronously, causing the third racks 29 to drive the fourth rack 30 to move upward via the third gear 31. The fourth rack 30 drives the sealing plate 9 to move along the inner side of the material inlet of the device housing 1, so that the sealing plate 9 seals the material inlet. The bottom of the top cover 28 contacts the top of the device housing 1, sealing the top of the device housing 1. Simultaneously, the two support plates 10 move the placement frame 2 downwards, causing the placement frame 2 to move the rotating rod 5 via the sleeve 6. The two first gears 16 at the end of the rotating rod 5 move along the outside of the first rack 17, causing the first rack 17 to rotate the first gears 16. The first gears 16 then rotate the rotating rod 5, causing the rotating rod 5 to swing the baffle 3 downwards and contact the top of the placement frame 2, covering and transporting the semiconductor chip to the inner bottom of the device housing 1. Then, the operator injects the etching solution into the device housing 1 through the injection valve. Inside, the semiconductor chip undergoes an etching process. Finally, the etching solution inside the device housing 1 is drained, and the drive motor 15 is activated. The drive motor 15 drives the moving block 11 upward to reset via the screw 14. The moving block 11 drives the moving plate 7 upward to reset, allowing the top cover 28 and the sealing plate 9 to open the device housing 1. Simultaneously, the placement frame 2 moves upward. When the first gear 16 contacts the first rack 17, the first rack 17 drives the rotating rod 5 upward through the first gear 16, causing the rotating rod 5 to move the baffle 3 away from the placement frame 2. The rotating rod 5 drives the second gear 18 to rotate synchronously, causing the second gear 18 to drive the second rack 20 to move. The pusher 21 moves along the outside of the two guide rods 23, causing the pusher 21 to move the four push blocks 22 synchronously. The inclined surface of the push block 22 can push the inclined surface of the stop block 25, causing the stop block 25 to move the mounting plate 24 upward along the outside of the four fixed rods 26 and stretch the tension spring 27. The mounting plate 24 moves the push rod 8 upward, causing the push rod 8 to pass through the protective grille 4 and contact the bottom of the semiconductor chip, lifting the semiconductor chip. The operator can then remove the semiconductor chip after testing. During this process, the semiconductor chip will not collide, and the gas generated during etching will be prevented from escaping, thereby improving the safety of semiconductor chip etching.
[0025] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0026] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. An etching apparatus for semiconductor chip manufacturing, characterized in that, include: The device housing (1) and the placement frame (2) installed inside the device housing (1) are provided with a cover (3) on the top of the placement frame (2), and protective grilles (4) are installed on the inner sides of both the placement frame (2) and the cover (3). A rotating rod (5) is fixedly installed on the outer side of the cover (3), and two sleeves (6) are hinged to the outer side of the rotating rod (5), and the sleeves (6) are installed on the outer side of the placement frame (2). Also includes: A feeding mechanism is used to feed semiconductor chips up and down. The feeding mechanism is installed inside the housing (1) of the device. The feeding mechanism includes a movable plate (7) that is slidably installed inside the housing (1) of the device. The movable plate (7) can adjust the position of the placement frame (2) and the cover (3). A lifting mechanism is used to lift the etched semiconductor chip. The lifting mechanism is installed at the bottom of the placement frame (2). The lifting mechanism includes a plurality of push rods (8) arranged in a rectangular array at the bottom of the placement frame (2). The push rods (8) can lift the semiconductor chip. A protective mechanism is provided for opening the device housing (1) to remove the etched semiconductor chip. The protective mechanism is installed on the outside of the device housing (1). The protective mechanism includes a sealing plate (9) disposed on the outside of the device housing (1). The sealing plate (9) is capable of opening the device housing (1) after the semiconductor chip is etched.
2. The etching apparatus for semiconductor chip manufacturing according to claim 1, characterized in that: The feeding mechanism also includes two support plates (10) installed on the outside of the movable plate (7). The support plates (10) are installed at the bottom of the placement frame (2). A movable block (11) is installed on the side of the movable plate (7) away from the support plates (10). A mounting shell (12) is installed on the outside of the device housing (1). A slide (13) is installed on the inside of the mounting shell (12). The movable block (11) is slidably installed on the inside of the slide (13). A screw (14) is rotatably installed on the inside of the slide (13). The movable block (11) is threaded onto the outside of the screw (14). The outer side of the device housing (1) is provided with a sliding groove for the movable block (11) to limit sliding. The outer side of the mounting shell (12) is equipped with a drive motor (15), and the output end of the drive motor (15) is connected to the screw (14) through a synchronous belt. Both ends of the rotating rod (5) are fixedly installed with first gears (16). The inner side of the device housing (1) is fixedly installed with two first racks (17) located above the two first gears (16).
3. The etching apparatus for semiconductor chip manufacturing according to claim 2, characterized in that: The lifting mechanism also includes a second gear (18) installed on the outside of the rotating rod (5), a U-shaped rod (19) fixedly installed between the placement frame (2) and the moving plate (7), a second rack (20) slidably installed on the outside of the U-shaped rod (19) and meshing with the second gear (18), a pusher (21) fixedly installed at the bottom of the second rack (20), four push blocks (22) arranged in a rectangular array installed on the top of the pusher (21), and two guide rods (23) installed between the bottom of the placement frame (2) and the outside of the moving plate (7). The pusher (21) is slidably mounted on the outside of the two guide rods (23). A mounting plate (24) is installed between the bottom ends of the multiple push rods (8). Four stops (25) are installed on the bottom of the mounting plate (24) respectively, which are in contact with the four push blocks (22). Four fixing rods (26) that slide through the mounting plate (24) are fixedly installed on the bottom of the placement frame (2). A tension spring (27) is installed between the bottom end of the fixing rod (26) and the bottom of the mounting plate (24). The contact surfaces of the stops (25) and the push blocks (22) are both inclined structures.
4. The etching apparatus for semiconductor chip manufacturing according to claim 3, characterized in that: The protective mechanism also includes a top cover (28) installed on the top of the movable plate (7). The bottom of the top cover (28) is in contact with the top of the device housing (1). A material inlet is provided on one side of the device housing (1), and the sealing plate (9) is slidably installed on the inside of the material inlet. Two third racks (29) are installed on the bottom of the top cover (28). Two fourth racks (30) are installed on the side of the sealing plate (9) near the third racks (29). A third gear (31) is assembled between the fourth rack (30) and the third rack (29). Two mounting seats (32) are fixedly installed on the inside of the device housing (1), and the two third gears (31) are rotatably installed on the inside of the two mounting seats (32).
5. The etching apparatus for semiconductor chip manufacturing according to claim 2, characterized in that: The inner side of the outer shell (1) of the device is equipped with two symmetrically distributed sliding plates (33), and both sides of the movable plate (7) are provided with positioning grooves for limiting the sliding of the sliding plates (33).
6. The etching apparatus for semiconductor chip manufacturing according to claim 2, characterized in that: Arc rods (34) are installed on both sides of the shield (3). A sleeve block (35) is slidably installed on the outer side of the arc rod (34), and the sleeve block (35) is installed on the outer side of the placement frame (2). An arc spring (36) is installed between the sleeve block (35) and the top of the arc rod (34).
7. The etching apparatus for semiconductor chip manufacturing according to claim 3, characterized in that: Both sides of the push block (22) are equipped with a clamping plate (37), and the size of the clamping plate (37) is larger than the size of the push block (22). The corresponding side of the two clamping plates (37) is in contact with the outer side of the stop block (25).
8. The etching apparatus for semiconductor chip manufacturing according to claim 4, characterized in that: A slide bar (38) is installed on one side of the sealing plate (9), and two positioning rods (39) are fixedly installed inside the material inlet of the device housing (1), and the slide bar (38) is slidably installed on the outside of the positioning rods (39).
9. The etching apparatus for semiconductor chip manufacturing according to claim 4, characterized in that: The mounting base (32) has a U-shaped structure and is sleeved on the outside of the third rack (29).
10. The etching apparatus for semiconductor chip manufacturing according to claim 4, characterized in that: Two diagonal rods (40) are installed between the top cover (28) and the movable plate (7).