Ground transportation device and logistics processing system comprising same

Abstract

A ground transport device for transporting containers within a semiconductor manufacturing plant, comprising: a drive controller configured to move the ground transport device on a ground of the semiconductor manufacturing plant; a housing on the drive controller; a shelf structure within the housing and including a plurality of shelves; and a robotic arm assembly within the housing and spaced apart from the shelf structure. The robotic arm assembly is configured to remove a container from a first shelf of the plurality of shelves and place the container on a second shelf of the plurality of shelves. The drive controller is further configured to transport the container between the plurality of facilities and store the container in a ground storage device disposed on the ground of the semiconductor manufacturing plant. Each of the plurality of facilities includes a substrate processing apparatus. The container stores a substrate.

Description

Ground transport equipment and logistics processing system including the ground transport equipment

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0148239, filed on October 28, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] This disclosure generally relates to ground transportation devices, and more specifically, to ground transportation devices for transporting containers holding substrates in a semiconductor manufacturing plant, and to a logistics handling system including the ground transportation device. Background Technology

[0004] When a substrate is processed to produce semiconductors, the substrate may be moved to a facility where one or more processes (such as, but not limited to, photolithography, etching, cleaning, deposition, ion implantation, etc.) can be performed, while the substrate is stored in a container (such as a front-opening wafer transfer box (FOUP)).

[0005] Semiconductor manufacturing plants may employ overhead transport systems (e.g., overhead cranes (OHT)) and / or ground transport systems (e.g., autonomous mobile robots (AMRs) or automated guided vehicles (AGVs)) to transport containers. However, workspace may be limited due to the arrangement of numerous facilities within the confined ground space. Accordingly, overhead transport systems can be used to transport containers. Summary of the Invention

[0006] One or more exemplary embodiments of this disclosure provide a ground transportation device capable of overcoming workspace limitations and a logistics processing system including the ground transportation device.

[0007] According to one aspect of this disclosure, a ground transport device for transporting containers within a semiconductor manufacturing plant includes: a drive controller configured to move the ground transport device on the floor of the semiconductor manufacturing plant; a housing on the drive controller; a shelf structure within the housing and including a plurality of shelves; and a robotic arm assembly within the housing and spaced apart from the shelf structure. The robotic arm assembly is configured to remove a container from a first shelf of the plurality of shelves and to place the container on a second shelf of the plurality of shelves. The drive controller is also configured to transport the container between multiple facilities and to store the container in a ground storage device disposed on the floor of the semiconductor manufacturing plant. Each of the multiple facilities includes a substrate handling device. The container stores a substrate.

[0008] According to one aspect of this disclosure, a logistics handling system includes: a substrate processing apparatus configured to process substrates; an overhead storage apparatus configured to store containers for storing substrates, the overhead storage apparatus being mounted on the ceiling of a semiconductor manufacturing plant; a ground storage apparatus mounted on the floor of the semiconductor manufacturing plant and configured to store containers; an overhead transport apparatus configured to move along tracks mounted on the ceiling of the semiconductor manufacturing plant and transport containers; and a ground transport apparatus configured to move on the floor of the semiconductor manufacturing plant and transport containers. The ground transport apparatus includes: a drive controller configured to move the ground transport apparatus on the floor of the semiconductor manufacturing plant; a housing on the drive controller; a shelf structure within the housing and including a plurality of shelves; and a robotic arm assembly within the housing and spaced apart from the shelf structure. The robotic arm assembly is configured to remove containers from a first shelf of the plurality of shelves and to place containers on a second shelf of the plurality of shelves. The drive controller is also configured to transport containers between a plurality of facilities and the ground storage apparatus. Each of the plurality of facilities includes the substrate processing apparatus.

[0009] According to one aspect of this disclosure, a ground transport device for transporting containers within a semiconductor manufacturing plant includes: a drive controller configured to move the ground transport device on the floor of the semiconductor manufacturing plant; a housing on the drive controller; a shelf structure within the housing and including a plurality of shelves; and a robotic arm assembly within the housing and spaced apart from the shelf structure. The robotic arm assembly is configured to remove a container from a first shelf of the plurality of shelves and to place the container on a second shelf of the plurality of shelves. The drive controller is configured to transport the container between a plurality of facilities, each of the plurality of facilities including a substrate handling device, the container storing a substrate, and storing the container in a ground storage device disposed on the floor of the semiconductor manufacturing plant. The drive controller includes: a barcode reader configured to identify an identification code attached to each of the plurality of facilities; a first distance sensor configured to measure a first distance between the ground transport device and the facilities of the plurality of facilities; and a second distance sensor configured to measure a second distance between the ground transport device and the facilities. The second distance sensor is adjacent to the first distance sensor. The drive controller is configured to dock a ground transport device with a facility based on an identification code, a first distance, and a second distance. The identification code includes at least one of the following: a plurality of vertical codes attached to the upper part of the front panel of the facility, or a horizontal code attached to the side surface of the front panel of the facility. The drive controller is configured to: correct the docking attitude of the ground transport device based on a first angle between a first line segment and a second line segment, based on the identification code including the plurality of vertical codes; and correct the docking attitude based on a second angle between a third line segment and a fourth line segment, based on the identification code including the horizontal code. The first line segment connects the first vertical code to the second vertical code among the plurality of vertical codes. The second line segment is parallel to the front surface of the drive controller. The third line segment connects a first ranging sensor to a second ranging sensor. The fourth line segment is parallel to the front surface of the front panel of the facility.

[0010] It should be noted that the effects of this disclosure are not limited to those described above, and other effects of this disclosure may be apparent from the following description and / or learned by practicing the embodiments presented. Attached Figure Description

[0011] The above and other aspects, features, and advantages of some embodiments of this disclosure will become clearer from the following description taken in conjunction with the accompanying drawings, in which:

[0012] Figure 1 is a first example diagram illustrating the concept of a logistics processing system according to some embodiments of the present disclosure;

[0013] Figure 2 is a second example diagram illustrating the concept of a logistics processing system according to some embodiments of the present disclosure;

[0014] Figure 3 is a first example diagram showing the structure of a ground transportation device of a logistics handling system according to some embodiments of the present disclosure;

[0015] Figure 4 is a first example diagram illustrating a drive module of a ground transportation device according to some embodiments of the present disclosure;

[0016] Figure 5 is a second example diagram illustrating a drive module of a ground transportation device according to some embodiments of the present disclosure;

[0017] Figure 6 is a first example diagram showing the housing and shelf module of a ground transportation device according to some embodiments of the present disclosure;

[0018] Figure 7 is a second example diagram illustrating the housing and shelf module of a ground transportation device according to some embodiments of the present disclosure;

[0019] Figure 8 is a second example diagram showing the structure of a ground transportation device of a logistics handling system according to some embodiments of the present disclosure;

[0020] Figure 9 is a first example diagram illustrating a robotic arm module of a ground transportation device according to some embodiments of the present disclosure;

[0021] Figure 10 is a second example diagram illustrating a robotic arm module of a ground transportation device according to some embodiments of the present disclosure;

[0022] Figure 11 is a third example diagram illustrating a robotic arm module of a ground transportation device according to some embodiments of the present disclosure;

[0023] Figure 12 is a first example diagram illustrating the docking sequence of a ground transport device according to some embodiments of the present disclosure;

[0024] Figure 13 is a second example diagram illustrating the docking sequence of a ground transport device according to some embodiments of the present disclosure;

[0025] Figure 14 is a third example diagram illustrating the docking sequence of a ground transport device according to some embodiments of the present disclosure;

[0026] Figure 15 is a fourth example diagram illustrating the docking sequence of a ground transport device according to some embodiments of the present disclosure;

[0027] Figure 16 is a fifth example diagram illustrating the docking sequence of a ground transport device according to some embodiments of the present disclosure;

[0028] Figure 17 is a sixth example diagram illustrating the docking sequence of a ground transport device according to some embodiments of the present disclosure;

[0029] Figure 18 is a first example diagram illustrating the processing sequence of a ground transportation device according to some embodiments of the present disclosure;

[0030] Figure 19 is a second example diagram illustrating the processing sequence of a ground transportation device according to some embodiments of the present disclosure;

[0031] Figure 20 is a third example diagram illustrating the processing sequence of a ground transportation device according to some embodiments of the present disclosure;

[0032] Figure 21 is a fourth example diagram illustrating the processing sequence of a ground transportation device according to some embodiments of the present disclosure; and

[0033] Figure 22 is a fifth example diagram illustrating the processing sequence of a ground transportation device according to some embodiments of the present disclosure. Detailed Implementation

[0034] The following description, with reference to the accompanying drawings, is provided to aid in a full understanding of the embodiments of this disclosure as defined by the claims and their equivalents. Various specific details are included to aid understanding, but these details are to be considered exemplary only. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of this disclosure. Furthermore, for the purposes of clarity and conciseness, descriptions of well-known functions and structures have been omitted.

[0035] For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It should be understood that the singular form of a noun corresponding to an item may include one or more things unless the relevant context explicitly indicates otherwise. As used herein, each phrase such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B or C” may include any one or all possible combinations of the items listed together in the corresponding phrase. As used herein, terms such as “first” and “second” or “first” and “second” may be used simply to distinguish corresponding components from other components and do not otherwise limit the components (e.g., in terms of importance or order). It should be understood that if an element (e.g., a first element) is referred to as being “coupled,” “coupled to,” “connected,” or “linked” to another element (e.g., a second element), whether or not the terms “operationally” or “communically” are used, it may indicate that the element can be coupled to the other element directly (e.g., wired), wirelessly, or via a third element.

[0036] It will be understood that when an element or layer is referred to as being "above," "on top of," "above," "below," "under," "connected to," or "coupled to" another element or layer, it may be directly above, above, above, below, below, or under that other element or layer, or there may be intermediate elements or layers. Conversely, when an element is referred to as being "directly above," "above," "above," "below," "under," "under," "directly connected to," or "directly coupled to" another element or layer, there are no intermediate elements or layers.

[0037] As used herein, when an element or layer is referred to as “covering,” “overlapping,” or “enclosing” another element or layer, the element or layer may cover at least a portion of the other element or layer, wherein the portion may include a part of the other element or may include the entirety of the other element. Similarly, when an element or layer is referred to as “penetrating” another element or layer, the element or layer may penetrate at least a portion of the other element or layer, wherein the portion may include a part of the other element or may include the entire dimensions (e.g., length, width, depth) of the other element.

[0038] References to "an embodiment," "an embodiment," "an exemplary embodiment," or similar language throughout this disclosure may indicate that a particular feature, structure, or characteristic described in connection with the indicated embodiment is included in at least one embodiment of the solution. Therefore, the phrases "in one embodiment," "in an embodiment," "in an exemplary embodiment," and similar language throughout this disclosure may, but not necessarily, refer to the same embodiment. The embodiments described herein are exemplary embodiments, and therefore, this disclosure is not limited thereto and may be implemented in various other forms.

[0039] The embodiments described herein can be illustrated and described in blocks as shown in the figures, which perform one or more of the described functions. These blocks may be referred to herein as units or modules, or by names such as (but not limited to) devices, logic, circuits, controllers, counters, comparators, generators, converters, etc., and may be physically implemented by one or more analog and / or digital circuits including logic gates, integrated circuits, microprocessors, microcontrollers, memory circuits, passive electronic components, active electronic components, optical components, etc.

[0040] In this disclosure, the article “a” is intended to include one or more items and may be used interchangeably with “one or more.” The term “a” or similar language is used when intended to refer to only one item. For example, the term “processor” can refer to a single processor or multiple processors. When a processor is described as performing operations and it is mentioned that the processor performs additional operations, the multiple operations may be performed by a single processor, or by any one or a combination of multiple processors.

[0041] In the following description, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0042] Figure 1 is a first example diagram illustrating the concept of a logistics processing system according to some embodiments of the present disclosure. Referring to Figure 1, the logistics processing system 100 may be configured to include a plurality of substrate processing devices (e.g., a first substrate processing device 110a, a second substrate processing device 110b to an nth substrate processing device 110n, wherein n is a positive integer greater than one (1), collectively referred to below as "110"), one or more container storage devices (e.g., an overhead storage device 120 and a ground storage device 130) and one or more container transport devices (e.g., an overhead transport device 140 and a ground device 150).

[0043] The logistics processing system 100 can be built and / or located within a semiconductor manufacturing plant. The logistics processing system 100 can be embodied as a logistics automation system. The multiple substrate processing devices 110, one or more container storage devices 120 and 130, and one or more container transport devices 140 and 150 in the logistics processing system 100 can be used for semiconductor production.

[0044] Multiple substrate processing apparatuses 110 can perform different substrate processing processes to produce semiconductors. For example, a first substrate processing apparatus 110a can perform an etching process. The first substrate processing apparatus 110a can be provided in multiple locations in a semiconductor manufacturing plant, or it can be provided as a single location in a semiconductor manufacturing plant. As another example, a second substrate processing apparatus 110b can perform a cleaning process. The second substrate processing apparatus 110b can be provided in multiple locations in a semiconductor manufacturing plant, or it can be provided as a single location in a semiconductor manufacturing plant. As another example, an nth substrate processing apparatus 110n can perform a photolithography process. The nth substrate processing apparatus 110n can be provided in multiple locations in a semiconductor manufacturing plant, or it can be provided as a single location in a semiconductor manufacturing plant.

[0045] In the embodiments, the material handling system 100 may include various types of substrate processing apparatus, such as, but not limited to, substrate processing apparatus for performing deposition and / or ion implantation, substrate processing apparatus for performing packaging, substrate processing apparatus for performing heat treatment, etc.

[0046] One or more container storage devices 120 and 130 may store containers therein. One or more container storage devices 120 and 130 may temporarily store containers therein. Multiple substrates may be accommodated in the containers. One or more container storage devices 120 and 130 may store containers therein for accommodating unprocessed substrates. One or more container storage devices 120 and 130 may store containers therein for receiving processed substrates. For example, the container may be embodied as a front-opening wafer transfer box (FOUP). As another example, the substrate may be and / or may include a wafer or photomask.

[0047] The overhead storage unit 120 can be installed on the ceiling of a semiconductor manufacturing plant. The overhead storage unit 120 can store containers on the ceiling of the semiconductor manufacturing plant. In embodiments, multiple overhead storage units 120 can be installed on the ceiling of the semiconductor manufacturing plant. The overhead storage unit 120 can include multiple shelves. Each shelf can hold one or more containers. However, this disclosure is not limited thereto, and the overhead storage unit 120 can include a single shelf. For example, the overhead storage unit 120 can be embodied as a side rail buffer (STB).

[0048] Ground storage device 130 can be installed on the floor of a semiconductor manufacturing plant. Ground storage device 130 can store containers on the floor of a semiconductor manufacturing plant. Ground storage device 130 can be provided in multiple ways on the floor of a semiconductor manufacturing plant. However, this disclosure is not limited thereto, and ground storage device 130 can be provided in a single way. Ground storage device 130 may include multiple shelves. However, this disclosure is not limited thereto, and ground storage device 130 may include a single shelf. For example, ground storage device 130 may be embodied as a storage container.

[0049] One or more container transport devices 140 and 150 can transport containers. One or more container transport devices 140 and 150 can transport containers from one of the plurality of substrate processing devices 110 to another substrate processing device. One or more container transport devices 140 and 150 can transport containers from one substrate processing device to another for subsequent processing of the substrate. For example, one or more container transport devices 140 and 150 can transport containers from a first substrate processing device 110a to a second substrate processing device 110b. One or more container transport devices 140 and 150 can transport containers from the plurality of substrate processing devices 110 to one or more container storage devices 120 and 130 for temporary storage, for example, due to work delays.

[0050] One or more container transport devices 140 and 150 can transport containers from one container storage device to another. One or more container transport devices 140 and 150 can transport containers from overhead storage device 120 to ground storage device 130. One or more container transport devices 140 and 150 can transport containers from ground storage device 130 to overhead storage device 120. One or more container transport devices 140 and 150 can transport containers from one of the multiple overhead storage devices 120 to another. One or more container transport devices 140 and 150 can transport containers from one of the multiple ground storage devices 130 to another. One or more container transport devices 140 and 150 can transport containers from one or more container storage devices 120 and 130 to one of the multiple substrate processing devices 110 for subsequent processing of the substrate.

[0051] The overhead transport unit 140 can move along tracks installed on the ceiling of a semiconductor manufacturing plant. The overhead transport unit 140 can carry a single container or multiple containers simultaneously. The overhead transport unit 140 can be provided in multiple configurations or as a single configuration within a semiconductor manufacturing plant. For example, the overhead transport unit 140 can be embodied as an overhead crane transport (OHT).

[0052] Ground transport device 150 can move on the floor of a semiconductor manufacturing plant. Ground transport device 150 can be embodied as a robot that can use sensors and / or machine vision to recognize its surroundings and can move autonomously without being restricted to a predetermined fixed path. Ground transport device 150 can carry multiple containers simultaneously or a single container at a time. Ground transport device 150 can be provided in multiple ways in a semiconductor manufacturing plant, or it can be provided as a single container. For example, ground transport device 150 can be embodied as an autonomous mobile robot (AMR), an automated guided vehicle (AGV), etc.

[0053] Ground transport device 150 can be associated with elevated transport device 140 using, for example, parallel input / output (PIO) sensors and can operate based on identification results that determine whether it can operate without repetitive work or without interference during transport to the facility.

[0054] The ground transport device 150 can overcome workspace limitations. For example, the ground transport device 150 can move in confined spaces and can carry containers. The ground transport device 150 is described with reference to Figures 3 through 22.

[0055] The control device 160 can control each component of the logistics processing system 100. That is, the control device 160 can control the operation of each of the multiple substrate processing devices 110. The control device 160 can also control the operation of each of the container transport devices 140 and 150.

[0056] The control device 160 may include: a processor for controlling each component of the logistics processing system 100; a network interface for wired and / or wireless communication with each component; a memory for storing one or more instructions related to the function and / or operation of each component; and a memory for storing processing schemes including instructions, various data, etc. The control device 160 may also include: a user interface, including input devices (e.g., keyboard, mouse, pointer, etc.), through which an operator can perform command input operations to manage the logistics processing system 100; and output devices (e.g., display, touchscreen, etc.) for visualizing and / or displaying the operating status of the logistics processing system 100. The control device 160 may be specifically embodied as a computing device for performing data processing and analysis, command transmission, etc.

[0057] Instructions may be provided in the form of a computer program or application. A computer program may include one or more instructions and is stored in a computer-readable recording medium. These instructions may include code generated by a compiler, code executable by an interpreter, etc. Storage devices may be and / or may include one or more storage media, which may include at least one of the following: flash memory, hard disk drive (HDD), solid-state drive (SSD), card memory, random access memory (RAM), static RAM (SRAM), read-only memory (ROM), electrically erasable programmable ROM (EEPROM), programmable ROM (PROM), magnetic storage, magnetic disk, optical disk, etc.

[0058] Figure 2 is a second example diagram illustrating the concept of a logistics processing system according to some embodiments of the present disclosure.

[0059] Referring to Figure 2, one or more container transport devices of the logistics handling system 100 may further include inter-level transport devices 170. Inter-level transport devices 170 can perform inter-level transport of containers within a semiconductor manufacturing plant. Inter-level transport devices 170 can transport containers from the floor to the ceiling of the semiconductor manufacturing plant. Inter-level transport devices 170 can transport containers from the ceiling to the floor of the semiconductor manufacturing plant. Inter-level transport devices 170 can connect the floor and ceiling of the semiconductor manufacturing plant to each other. Inter-level transport devices 170 can carry a single container or can carry multiple containers simultaneously. Inter-level transport devices 170 can be provided individually or in multiples within a semiconductor manufacturing plant. For example, inter-level transport devices 170 can be embodied as elevators.

[0060] Despite the narrow spacing between the ground-based devices, the associated ground transport equipment can still transport containers between one or more container storage devices 120 and 130. However, despite the narrow spacing between the ground-based devices, the associated ground transport equipment may not be able to transport containers between multiple substrate processing devices 110. In this regard, "spacing" refers to the defined space and / or passageway between facilities required for semiconductor manufacturing in a semiconductor manufacturing plant. Therefore, ground transport equipment is needed to transport transport targets (e.g., containers) between facilities with defined spacing. However, due to product size, rotation radius, etc., the associated ground transport equipment may not be able to enter the spacing, and therefore the associated ground transport equipment may not be able to operate. Furthermore, even if the associated ground transport equipment can enter the spacing, it may not be able to operate.

[0061] For example, solutions using devices such as mobile robots can be employed, but are not limited to this. In this case, a multi-jointed robot can be used as a robotic arm; therefore, its operation may require a relatively wide workspace, and correspondingly, the number of transportable objects that the robot can carry may be relatively small. Consequently, the transport efficiency of the mobile robot may be relatively low. Furthermore, the overall size of the mobile robot may be relatively large, making it difficult to apply in narrow spaces. In other words, considering movement within confined spaces and traffic between multiple mobile robots, the mobile robot may need to be designed with a minimum size, and it may need to be designed to carry a relatively large number of transportable objects.

[0062] To address the aforementioned problems and situations, according to this disclosure, the ground transport device 150 can directly transport or deliver target objects from or to a facility, and can be designed with minimal dimensions for operation in confined spaces. The ground transport device 150 according to this disclosure will be described below.

[0063] Ground transport device 150 can be embodied as a mobile robot configured to transport target objects (or articles) directly from or to facilities used for manufacturing semiconductor devices. Ground transport device 150 can be equipped with a robotic arm including a Selective Flexible Assembly Arm (SCARA) and can use the robotic arm to load and / or unload target objects (e.g., containers). Furthermore, ground transport device 150 can be configured for autonomous driving on the ground to transport target objects to or from various facilities (e.g., but not limited to, article storage facilities and semiconductor manufacturing facilities). Ground transport device 150 can load target objects onto or unload them from article storage facilities (i.e., the manual port of ground storage device 130). Additionally, ground transport device 150 can load target objects onto or unload them from equipment front-end modules (EFEMs) of semiconductor manufacturing facilities (e.g., each of the multiple substrate processing units 110). Ground transport device 150 can include, but is not limited to, precise positioning and / or docking capabilities, facility interface capabilities, multi-loading structures for transporting target objects, robotic arms, etc.

[0064] Figure 3 is a first example diagram illustrating the structure of a ground transport device 150 of a logistics handling system 100 according to some embodiments of the present disclosure. Referring to Figure 3, the ground transport device 150 may be configured to include a drive module 210, a housing 220, a shelf structure including a first shelf module 230a and a second shelf module 230b, and a robotic arm module 240.

[0065] The first direction D1 and the second direction D2 can form a two-dimensional plane. The first direction D1 can be the X-axis direction, and the second direction D2 can be the Y-axis direction. The first direction D1 can be a left-right direction, and the second direction D2 can be a front-back direction. However, this disclosure is not limited to this. For example, the first direction D1 can be a front-back direction, and the second direction D2 can be a left-right direction. The third direction D3 can form a three-dimensional solid together with the first direction D1 and the second direction D2. The third direction D3 can be a direction perpendicular to the plane defined by the first direction D1 and the second direction D2. The third direction D3 can be the Z-axis direction. The third direction D3 can be a vertical direction.

[0066] The drive module 210 can perform the autopilot, charging, and power supply functions of the ground transportation device 150. For example, the drive module 210 may include hardware and / or software components for providing autopilot, charging, and power supply functions to the ground device 150. In embodiments, the drive module 210 may include, but is not limited to, motors, brakes, sensors (e.g., tilt sensors, speed sensors, accelerometers, distance sensors, etc.), actuators, charging circuits, batteries, transformers, etc., for providing autopilot, charging, and power supply functions to the ground device 150. In embodiments, the drive module 210 may be physically implemented by analog and / or digital circuitry, including one or more of logic gates, integrated circuits, microprocessors, microcontrollers, memory circuits, passive electronic components, active electronic components, optical components, etc. For example, a field-programmable gate array (FPGA) can be used to implement custom logic including the functions of the drive module 210. As another example, one or more processors combined with memory can be used to execute one or more instructions individually or jointly to perform at least some of the functions of the drive module 210 and / or the ground transportation device 150. Alternatively or additionally, at least some of the functions of the drive module 210 may be incorporated into the control device 160 and / or implemented as instructions executed by the control device 160. In embodiments, the drive module 210 may be referred to as a drive controller.

[0067] When the drive module 210 performs autonomous driving functions, the drive module 210 can use one or more sensors (such as, but not limited to, light detection and ranging (LiDAR) sensors, laser distance sensors (LDS), etc.) to identify geographic features and search for the best path for movement based on the identified geographic features, thereby performing autonomous driving between facilities.

[0068] When the ground transport device 150 engages with the manual port of the EFEM and / or ground storage device 130 of each of the plurality of substrate processing devices 110 for loading and unloading operations, the drive module 210 can use a quick response (QR) reader to identify and / or correct the relative position between the ground transport device 150 and the facility (EFEM or manual port) to achieve precise positioning. However, this disclosure is not limited thereto, and the ground transport device 150 can achieve precise positioning in various other ways without departing from the scope of this disclosure.

[0069] In one embodiment, the drive module 210 may include a wireless charging system. A receiving (RX) module may be installed in the drive module 210, and a transmitting (TX) module may be installed in the facility, allowing the RX module of the ground transport device 150 to wirelessly receive power from the TX module during loading and unloading operations, thereby charging its built-in battery. Accordingly, the ground transport device 150 can operate for relatively long periods (e.g., 24 hours) without requiring separate charging during loading and unloading operations.

[0070] The drive module 210 may include a first body 211 and a plurality of wheels 212. The plurality of wheels 212 may be mounted on the bottom surface of the first body 211. The ground transport device 150 may use the plurality of wheels 212 to move automatically on the ground of the semiconductor manufacturing plant.

[0071] Figure 4 is a first example diagram illustrating the drive module 210 of a ground transportation device 150 according to some embodiments of the present disclosure. Referring to Figure 4, the first body 211 may include a barcode reader 310, a charging plate 320, a first image measurement sensor 330, and a second image measurement sensor 340. For ease of illustration, the plurality of wheels 212 are omitted in Figure 4. However, it is clear that the plurality of wheels 212 may be mounted on the bottom surface of the first body 211, as described with reference to Figure 3.

[0072] The barcode reader 310 can read the code attached to the EFEM and / or manual port of the ground storage device 130 of each of the plurality of substrate processing devices 110. This code can store information about the corresponding facility. The control device 160 can determine whether the corresponding facility is the destination based on the code read by the barcode reader 310. The code attached to the EFEM and / or manual port can be a two-dimensional (QR) code or a barcode. However, the codes in this disclosure are not limited to these.

[0073] The charging pad 320 can receive power from the EFEM and / or the manual port. For example, the charging pad 320 may include an RX module, and each of the EFEM and the manual port may include a TX module. The RX module of the charging pad 320 can receive power from the TX module to charge the battery installed in the ground transportation device 150. The charging pad 320 may be embodied as a wireless charging pad for wireless charging. However, this disclosure is not limited thereto; for example, the charging pad may be embodied as a contact charging pad.

[0074] In one embodiment, the charging plate 320 may be charged when the ground transport device 150 loads the container into each of the plurality of substrate processing devices 110. Alternatively or additionally, the charging plate 320 may be charged when the ground transport device 150 unloads the container from each of the plurality of substrate processing devices 110. In one embodiment, the charging plate 320 may be charged when the ground transport device 150 loads the container into the ground storage device 130. As another example, the charging plate 320 may be charged when the ground transport device 150 unloads the container from the ground storage device 130.

[0075] As shown in Figure 4, the barcode reader 310 and the charging plate 320 may not be covered by the surface of the first body 211, thus being exposed to the outside. The barcode reader 310 and the charging plate 320 may be mounted on the same surface of the first body 211, or they may be mounted on different surfaces respectively.

[0076] The first image measurement sensor 330 and the second image measurement sensor 340 can acquire environmental images around the ground transportation device 150. The first image measurement sensor 330 and the second image measurement sensor 340 can acquire environmental images using different methods. For example, the first image measurement sensor 330 can be embodied as a camera sensor, while the second image measurement sensor 340 can be embodied as a LiDAR sensor. However, this disclosure is not limited thereto, and the first image measurement sensor 330 and the second image measurement sensor 340 can use the same or different methods to acquire surrounding images.

[0077] The first image measurement sensor 330 and the second image measurement sensor 340 may not be covered by the surface of the first body 211 and may be exposed to the outside. The first image measurement sensor 330 and the second image measurement sensor 340 may be mounted on different surfaces of the first body 211 and acquire different images of the ground transportation device 150 from different directions. However, this disclosure is not limited thereto. For example, at least one of the first image measurement sensor 330 and the second image measurement sensor 340, as well as the barcode reader 310 and the charging plate 320, may be mounted on the same surface of the first body 211.

[0078] Figure 5 is a second example diagram illustrating the drive module 210 of a ground transportation device 150 according to some embodiments of the present disclosure. The first body 211a may include the first body 211 described above with reference to Figures 3 and 4, and / or be similar in many respects to the first body 211 described above with reference to Figures 3 and 4, and may include additional features not mentioned above. Therefore, for the sake of brevity, repeated descriptions of the first body 211a described above with reference to Figures 3 and 4 may be omitted. For ease of illustration, the plurality of wheels 212 may be omitted in Figure 5. However, it is clear that the plurality of wheels 212 may be mounted on the bottom surface of the first body 211a, as described with reference to Figure 3.

[0079] Referring to Figure 5, the first body 211a may also include a first ranging sensor 350a and a second ranging sensor 350b.

[0080] Each of the first ranging sensor 350a and the second ranging sensor 350b can measure the distance between the ground transportation device 150 and the EFEM. Each of the first ranging sensor 350a and the second ranging sensor 350b can measure the distance between the EFEM and the ground transportation device 150 when the barcode reader 310 reads the code attached to the EFEM. Each of the first ranging sensor 350a and the second ranging sensor 350b can measure the distance between the ground transportation device 150 and the manual port. Each of the first ranging sensor 350a and the second ranging sensor 350b can measure the distance between the ground transportation device 150 and the manual port when the barcode reader 310 reads the code on the manual port. The first ranging sensor 350a and the second ranging sensor 350b can use substantially similar and / or identical schemes to measure the distance between the ground transportation device 150 and the facility. For example, each of the first ranging sensor 350a and the second ranging sensor 350b can be embodied as a laser rangefinder (LDS).

[0081] Figure 6 is a first example diagram showing the housing and shelf module of a ground transportation device according to some embodiments of the present disclosure.

[0082] Referring together to Figures 3 and 6, housing 220 can be mounted on drive module 210. First shelf module 230a, second shelf module 230b, and robotic arm module 240 can be mounted within housing 220. As shown in Figure 6, not all sides of housing 220 may be closed. For example, two (2) sides of housing 220 may be closed, while the other two (2) sides may be open. However, this disclosure is not limited to this; three (3) sides of housing 220 may be closed, while one (1) side may be open. In this example, robotic arm module 240 can insert and remove containers through the open side.

[0083] The first shelf module 230a and the second shelf module 230b can be supported by the housing 220. The first shelf module 230a and the second shelf module 230b can be and / or include multiple shelves housed within the housing 220. For example, the first shelf module 230a and the second shelf module 230b can include a first shelf 230a and a second shelf 230b. The first shelf 230a and the second shelf 230b can be arranged in a third direction D3. The first shelf 230a can be stacked on top of the second shelf 230b. However, this disclosure is not limited thereto, and the first shelf 230a and the second shelf 230b can be arranged in a first direction D1 or a second direction D2. For example, the first shelf 230a and the second shelf 230b can be arranged side-by-side in a horizontal direction.

[0084] The first shelf module 230a and the second shelf module 230b may include multiple vertically arranged layers to simultaneously load multiple transport target objects, and the robotic arm module 240 may be installed in its adjacent space. The ground transport device 150 may be designed with the above structure to provide relatively high transport efficiency within a relatively limited size compared to the relevant mobile robot.

[0085] The first shelf module 230a and the second shelf module 230b may include various types of sensors. The first shelf module 230a and the second shelf module 230b may include sensors for detecting whether a transport target object is loaded on it. The first shelf module 230a and the second shelf module 230b may include sensors for detecting whether the transport target object is in the correct position. The first shelf module 230a and the second shelf module 230b may include sensors for detecting whether the container lid is open.

[0086] Referring to Figure 6, the pin assembly 410 and the sensor 420 may be disposed on the upper surface of the first shelf 230a. The sensor 420 may be a sensor capable of detecting whether a container is loaded. Alternatively or additionally, the sensor 420 may be a sensor capable of detecting whether a container is in the correct position. Although Figure 6 shows the sensor 420 provided in a single manner, multiple sensors 420 may also be provided. For example, multiple sensors 420 may include sensors for detecting whether a container is loaded and sensors for detecting whether a container is in the correct position. In embodiments, the sensor 420 may be an optical sensor, and / or may include, but is not limited to, optical sensors.

[0087] When the container is placed on the first shelf 230a, the pin assembly 410 can secure the container. Multiple pin assemblies 410 can be provided on the first shelf 230a to minimize container sway. However, this disclosure is not limited thereto, and the container can be secured to the first shelf 230a using various other embodiments. The pin assembly 410 can be provided singly or in multiples.

[0088] Figure 7 is a second example diagram illustrating the housing 220 and shelf module 230a of a ground transport device 150 according to some embodiments of the present disclosure. Referring to Figure 7, the pin assembly 410 may include a retaining pin 411 and a vibration damping structure 412. The retaining pin 411 may secure the container. For example, the retaining pin 411 may be a moving pin, and / or may include, but is not limited to, a moving pin. The vibration damping structure 412 may be mounted below the retaining pin 411. The retaining pin 411 may be exposed externally above the first shelf 230a, while the vibration damping structure 412 is not exposed when disposed on the first shelf 230a. The vibration damping structure 412 may be made of a polymer. The vibration damping structure 412 may minimize (reduce) the transmission of vibrations generated during the movement of the ground transport device 150 to the container. For example, the vibration damping structure 412 may be a shock absorber, and / or may include a shock absorber.

[0089] The second shelf 230b can provide a support surface for placing containers and provide support for the containers when they are placed on it. For example, the configuration of the second shelf 230b can be similar in many respects to the configuration of the first shelf 230a described above with reference to Figures 6 and 7, and can include additional functions not mentioned above. Furthermore, the pin assembly 410 and the sensor 420 can also be applied to the second shelf 230b. Therefore, for the sake of brevity, a repeated description of the second shelf 230b described above with reference to Figures 6 and 7 will be omitted.

[0090] In this embodiment, the barcode reader 310, the first image measurement sensor 330, and the second image measurement sensor 340 may be disposed on the housing 220. In this example, the barcode reader 310, the first image measurement sensor 330, and the second image measurement sensor 340 may not be disposed on the drive module 210. Alternatively, the barcode reader 310, the first image measurement sensor 330, and the second image measurement sensor 340 may be disposed on both the drive module 210 and the housing 220.

[0091] In this embodiment, a power switch, a reset switch, a touch panel, a brake release switch, and a black box may also be provided on the housing 220. The power switch can start the ground transportation device 150. The reset switch can reset the operation of the ground transportation device 150 when an operational malfunction occurs. The touch panel can perform information input and output functions. The brake release switch can release the brakes of the ground transportation device 150. The black box can store images and / or sounds around the ground transportation device 150 during operation. Alternatively or additionally, the black box can also store telemetry and / or diagnostic data, which, for example, can be used to analyze the operational status of the ground transportation device 150 during faulty operation.

[0092] In this embodiment, the housing 220 may also be equipped with a status indicator, a communication module, a vision sensor, an ultrasonic sensor, etc. The status indicator can indicate the status of the ground transportation device 150. The communication module can be used to communicate with another ground transportation device 150, an elevated transportation device 140, a control device 160, etc. For example, the communication module may include, but is not limited to, a wireless local area network (WLAN) module, a PIO sensor, etc. The vision sensor can be associated with the black box. For example, the ultrasonic sensor can detect whether the container lid is open.

[0093] Figure 8 is a second example diagram illustrating the structure of a ground transportation device of a logistics processing system 100 according to some embodiments of the present disclosure. Referring to Figure 8, the ground transportation device 150a may include the ground transportation device 150 described above with reference to Figures 1 to 7, and / or be similar in many respects to the ground transportation device 150 described above with reference to Figures 1 to 7, and may include additional features not mentioned above. Therefore, for the sake of brevity, the repeated description of the ground transportation device 150a described above with reference to Figures 1 to 7 may be omitted.

[0094] In an embodiment, the ground transport device 150a may further include an elastic structure 430. The elastic structure 430 may be mounted between the drive module 210 and the housing 220. However, this disclosure is not limited thereto, and the elastic structure 430 may be mounted on the outer surface of the housing 220. When the ground transport device 150 collides with another device or facility, the elastic structure 430 can absorb the impact force. The elastic structure 430 can minimize the impact force transmitted to the container. For example, the elastic structure 430 may be a buffer, and / or may include a buffer.

[0095] Referring back to Figure 3, the first shelf module 230a, the second shelf module 230b, and the robotic arm module 240 can be disposed within the internal space of the housing 220. The robotic arm module 240 can be disposed within the housing 220 and spaced apart from the first shelf module 230a and the second shelf module 230b.

[0096] The manipulator module 240 may include a SCARA for planar motion and a linear actuator for vertical motion. However, this disclosure is not limited thereto, and the manipulator module 240 may include various other devices and / or components to achieve the functions of the manipulator module 240 described herein without departing from the scope of this disclosure. As used herein, the manipulator module 240 may be referred to as a robotic arm assembly. The manipulator module 240 may perform a combination of planar and / or vertical motions to access the first shelf module 230a and the second shelf module 230b. Furthermore, the manipulator module 240 may perform a combination of planar and / or vertical motions to access the EFEM and / or manual ports.

[0097] SCARA may include multiple components, such as, but not limited to, a base assembly, a first arm assembly, a second arm assembly, and a manipulator assembly. The base assembly connects the SCARA to a linear actuator. The first and second arm assemblies enable planar motion. The manipulator assembly performs the transport of a target object. The manipulator assembly may include, but is not limited to, grippers, optical sensors, etc., for performing the transport of the target object. The gripper may include, for example, but not limited to, elements such as motors, linear motion (LM) guides, ball screws, etc. In an embodiment, the manipulator assembly may include multiple optical sensors. At least one of the multiple optical sensors can capture an image and / or identify (determine) the flange of a container based on the captured image. The gripper may be associated with the optical sensors and may be configured to hold the container when the optical sensors identify the flange of the container.

[0098] Figure 9 is a first example diagram illustrating a robotic arm module of a ground transportation device 150 according to some embodiments of the present disclosure. Figure 10 is a second example diagram illustrating a robotic arm module of a ground transportation device 150 according to some embodiments of the present disclosure. Figure 11 is a third example diagram illustrating a robotic arm module of a ground transportation device 150 according to some embodiments of the present disclosure. Referring to Figures 9 to 11, the robotic arm module 240 may include a second body 510, a first arm 520a, a second arm 520b, and a robotic arm 530.

[0099] The first arm 520a can be connected to the second body 510. The first arm 520a can rotate clockwise. Alternatively or additionally, the first arm 520a can rotate counterclockwise. The first arm 520a can rotate along a first direction D1 and a second direction D2. The first arm 520a may include a base assembly and a first arm assembly.

[0100] The second arm 520b can be connected to the first arm 520a. The second arm 520b can rotate clockwise. Alternatively or additionally, the second arm 520b can rotate counterclockwise. The second arm 520b can rotate along a first direction D1 and a second direction D2. The second arm 520b may include the first arm assembly.

[0101] Referring to Figure 9, the second arm 520b can be located at a different height than the first arm 520a. The second arm 520b can also be located at a lower height than the first arm 520a. However, this disclosure is not limited thereto. For example, as shown in Figure 10, the second arm 520b can be located at the same height as the first arm 520a. The first arm 520a and the second arm 520b can rotate in the same direction. The first arm 520a and the second arm 520b can rotate in different directions. The first arm 520a and the second arm 520b can operate independently.

[0102] The robotic arm 530 can be attached to the end of the second arm 520b. Although the robotic arm 530 is shown attached to the bottom surface of the end of the second arm 520b in Figures 9 through 11, this disclosure is not limited thereto; for example, the robotic arm 530 can be attached to the upper or side surface of the end of the second arm 520b. The robotic arm 530 can grasp a container. The robotic arm 530 can be an end effector, and / or can include, but is not limited to, end effectors. The robotic arm 530 can include a robotic arm assembly.

[0103] Referring to Figure 11, the first arm 520a, the second arm 520b, and the robotic arm 530 are movable along a third direction D3. The first arm 520a, the second arm 520b, and the robotic arm 530 are movable along the third direction D3 while connected to the second body 510. The second body 510 may include a linear actuator. The second body 510 can move the first arm 520a, the second arm 520b, and the robotic arm 530 along the third direction D3.

[0104] The docking sequence of the ground transport device 150 will be described below with reference to FIG12. FIG12 is a first example diagram illustrating the docking sequence of the ground transport device 150 according to some embodiments of the present disclosure.

[0105] The ground transport device 150 can access each of the multiple substrate processing devices 110 to remove containers from or place containers into each of the multiple substrate processing devices 110. The ground transport device 150 can access the EFEM of each of the multiple substrate processing devices 110. An identification code may be attached to the EFEM.

[0106] The identification code may be and / or may include a vertical code and may be attached to the EFEM. Alternatively or additionally, the identification code may be and / or may include a horizontal code and may be attached to the EFEM. A vertical code may refer to a code that can be attached to the upper surface of the board. When the board 610 forms a side of the EFEM, multiple identification codes (e.g., a first identification code 620a, a second identification code 620b, and a third identification code 620c, collectively referred to below as "620") may be formed on the upper surface of the board 610. When multiple identification codes 620 are vertical codes, multiple vertical identification codes may be provided. For example, three (3) identification codes may be provided (e.g., first to third identification codes 620a to 620c). Hereinafter, the docking sequence when the identification codes are vertical codes will be described with reference to Figures 12 to 14.

[0107] When the ground transport device 150 is in an incorrect orientation, it may be unable to bring containers into and / or remove containers from the EFEM. Accordingly, it may be necessary to correct the orientation of the ground transport device 150 towards the EFEM before bringing containers into and / or removing them. X-axis coordinate information, Y-axis coordinate information, and θ-axis coordinate information may be required to correct the orientation of the ground transport device 150.

[0108] Figure 13 is a second example diagram illustrating the docking sequence of a ground transportation device 150 according to some embodiments of the present disclosure. Referring to Figure 13, the ground transportation device 150 can use the x-axis coordinate of the first identification code 620a as x-axis coordinate information. Furthermore, the ground transportation device 150 can use the y-axis coordinate of the first identification code 620a as y-axis coordinate information. The ground transportation device 150 can receive the x-axis and y-axis coordinates of the first identification code 620a from the control device 160, and / or can directly measure the x-axis and y-axis coordinates of the first identification code 620a using sensors.

[0109] Figure 14 is a third example diagram illustrating the docking sequence of a ground transportation device according to some embodiments of the present disclosure. Referring to Figure 14, a second identification code 620b and a third identification code 620c can be respectively disposed on two opposite sides of a first identification code 620a. When the line segment connecting the second identification code 620b and the third identification code 620c is defined as a first line segment, and the line segment parallel to the front surface of the drive module 210 is defined as a second line segment, a first angle θ1 defined between the first line segment and the second line segment can be measured. The ground transportation device 150 can use the first angle θ1 as θ-axis coordinate information.

[0110] For example, when there are three (3) or more identification codes, the line segment connecting the two (2) outermost codes can be defined as the first line segment. When the identification code is a vertical code, the first ranging sensor 350a and the second ranging sensor 350b may not be used for docking sequence. The ground transport device 150 may not include the first ranging sensor 350a and the second ranging sensor 350b.

[0111] Figure 15 is a fourth example diagram illustrating the docking sequence of a ground transport device according to some embodiments of the present disclosure. Referring to Figure 15, a horizontal code may refer to a code attached to the side surface of a plate. When the side surface of the EFEM includes plate 610, a fourth identification code 620d may be formed on the side surface of plate 610. When the fourth identification code 620d is a horizontal code, the fourth identification code 620d may be set as a single code. Hereinafter, the docking sequence when the identification code is a horizontal code will be described with reference to Figures 15 to 17.

[0112] Figure 16 is a fifth example diagram illustrating the docking sequence of a ground transportation device 150 according to some embodiments of the present disclosure. Referring to Figure 16, the ground transportation device 150 can use the x-axis coordinate of the fourth identification code 620d as x-axis coordinate information. Furthermore, the ground transportation device 150 can use the y-axis coordinate of the fourth identification code 620d as z-axis coordinate information. The ground transportation device 150 can receive the x-axis and z-axis coordinates of the fourth identification code 620d from the control device 160, and / or can directly measure the x-axis and z-axis coordinates of the fourth identification code 620d using sensors.

[0113] The ground transportation device 150 can generate y-axis coordinate information using a first ranging sensor 350a and a second ranging sensor 350b. For example, the ground transportation device 150 can generate y-axis coordinate information based on the average of the measurements from the first ranging sensor 350a and the second ranging sensor 350b.

[0114] Figure 17 is a sixth example diagram illustrating the docking sequence of a ground transportation device 150 according to some embodiments of the present disclosure. Referring to Figure 17, a first ranging sensor 350a and a second ranging sensor 350b may be disposed on the front surface of the drive module 210. When the line segment connecting the first ranging sensor 350a and the second ranging sensor 350b is defined as a third line segment, and a line segment parallel to the front surface of the plate 610 is defined as a fourth line segment, a second angle θ2 defined between the third and fourth line segments can be measured. The ground transportation device 150 can use the second angle θ2 as θ-axis coordinate information.

[0115] For example, the reader coordinate system applicable when the identification code is horizontal may be different from the reader coordinate system applicable when the identification code is vertical.

[0116] The ground transport device 150 can access the ground storage device 130 to input and / or retrieve containers from the ground storage device 130. The ground transport device 150 can access the manual port of the ground storage device 130. An identification code may be affixed to the manual port. The identification code may be specific as a vertical or horizontal code and may be affixed to the manual port. The docking sequence when the docking target is a manual port can be substantially similar to and / or the same as the docking sequence when the docking target is an EFEM. Therefore, for the sake of brevity, repeated descriptions will be omitted.

[0117] The processing sequence of the ground transport device 150 will be described below with reference to Figures 18 to 22.

[0118] Figure 18 is a first example diagram illustrating the processing sequence of a ground transport device 150 according to some embodiments of the present disclosure. Figure 19 is a second example diagram illustrating the processing sequence of a ground transport device according to some embodiments of the present disclosure. Figure 20 is a third example diagram illustrating the processing sequence of a ground transport device according to some embodiments of the present disclosure. Figure 21 is a fourth example diagram illustrating the processing sequence of a ground transport device according to some embodiments of the present disclosure. Figure 22 is a fifth example diagram illustrating the processing sequence of a ground transport device according to some embodiments of the present disclosure. Hereinafter, examples of the ground transport device 150 removing containers to the EFEM and / or manual ports will be described.

[0119] Referring to Figures 18 and 19, the ground transport device 150 can have a reduced size compared to related devices, allowing it to move within confined spaces on the ground. Accordingly, the internal space IS of the housing 220 may be relatively narrow. Typically, considering the narrow internal space IS, the first arm 520a, the second arm 520b, and the robotic arm 530 can be positioned above each other. For example, the second arm 520b can completely and / or partially overlap with the first arm 520a.

[0120] As shown in Figure 19, the first arm 520a and the second arm 520b can perform articulated movements to position the robotic arm 530 on top of the container 630. The robotic arm 530 can grasp the container 630. When the vertical height of the robotic arm 530 is different from the vertical height of the container 630, the linear actuator in the second body 510 can adjust the vertical height of the first arm 520a, the second arm 520b, and the robotic arm 530.

[0121] Subsequently, referring to Figure 20, the first arm 520a and the second arm 520b can retract. Due to the retraction of the first arm 520a and the second arm 520b, the container 630 can be moved from the seat surface of the first shelf module 230a and the second shelf module 230b, and then moved to a position in front of the front surface of the second body 510.

[0122] Then, referring to Figure 21, the second arm 520b can rotate clockwise. For example, the first arm 520a can remain in its current position and / or can move slightly in a direction opposite to the first direction. As the second arm 520b rotates, the container 630 can move further forward, beyond its previous position.

[0123] As shown in Figure 22, the first arm 520a and the second arm 520b can extend to allow the container 630 to reach the EFEM or manual port. The first arm 520a and the second arm 520b can be deployed relative to each other so that their longitudinal directions are aligned. With the first arm 520a and the second arm 520b deployed relative to each other, the container 630 can be transported to the EFEM and / or the manual port. The ground transport device 150 can minimize the range of movement described above, ensuring that there is essentially no positional deviation from the internal space IS of the housing 220, while simultaneously delivering the container 630 into the EFEM or the manual port. Even in confined spaces, the ground transport device 150 can place the container 630 into the EFEM or the manual port.

[0124] When the container 630 is not delivered to the EFEM and / or manual port with the first arm 520a and the second arm 520b extended relative to each other, the drive module 210 can further access the EFEM and / or manual port. Alternatively, a third arm embedded in the second body 510 can protrude outward to push the first arm 520a and the second arm 520b toward the EFEM and / or manual port. When the robot module 240 also includes a third arm, the third arm can connect the second body 510 and the first arm 520a to each other.

[0125] The process of removing container 630 can be substantially similar to and / or identical to the process performed in reverse order of the ground transport device 150 described above with reference to Figures 19 to 22. Therefore, for the sake of brevity, its repeated description will be omitted.

[0126] The ground transport device 150 has been described above with reference to Figures 3 through 22. The ground transport device 150 can be configured as an autonomous robot equipped with SCARA for directly transporting containers between semiconductor facilities. The ground transport device 150 can transport containers directly to various types of facilities, such as (but not limited to) product storage facilities and semiconductor manufacturing facilities. Even in confined spaces within semiconductor manufacturing facilities, the ground transport device 150 can transport containers to and / or from facilities. According to this disclosure, the transportation of containers to and from various facilities can be automated. Furthermore, mobile robots can be used to automate the transportation of containers to and from facilities in confined spaces.

[0127] Although embodiments of the present disclosure have been described with reference to the accompanying drawings, the present disclosure is not limited to the above embodiments, but can be implemented in various different forms. Those skilled in the art will understand that the present disclosure can be implemented in other specific forms without changing the technical concept or features of the present disclosure. Therefore, it should be understood that the above embodiments are illustrative in all respects and are not limiting.

Claims

1. A ground transport device for transporting containers within a semiconductor manufacturing plant, the ground transport device comprising: A drive controller is configured to move the ground transport device on the ground of the semiconductor manufacturing plant; The housing is located on the drive controller; A shelving structure, within the housing and including a plurality of shelves; and a robotic arm assembly, within the housing and spaced apart from the shelving structure, wherein the robotic arm assembly is configured to: remove the container from a first shelf of the plurality of shelves; and place the container on a second shelf of the plurality of shelves, and wherein the drive controller is further configured to: transport the container between a plurality of facilities, each of the plurality of facilities including a substrate processing apparatus, the container storing a substrate; and store the container in a ground storage device disposed on the ground of the semiconductor manufacturing plant.

2. The ground transportation device according to claim 1, wherein, The drive controller includes a code reader configured to identify an identification code attached to each of the plurality of facilities; and wherein the drive controller is further configured to use the identification code to dock the ground transport device with a facility among the plurality of facilities.

3. The ground transportation device according to claim 2, wherein, The drive controller is also configured to use the barcode reader to scan the identification code attached to the upper part of the front panel of the facility, wherein the identification code comprises a plurality of vertical bars.

4. The ground transportation device according to claim 3, wherein, The drive controller is also configured to correct the docking attitude of the ground transport device relative to the facility based on the angle between the first line segment and the second line segment, wherein the first line segment connects a first vertical code of the plurality of vertical codes of the identification code to a second vertical code of the plurality of vertical codes of the identification code, and wherein the second line segment is parallel to the front surface of the drive controller.

5. The ground transportation device according to claim 2, wherein, The drive controller includes: a first ranging sensor configured to measure a first distance between the ground transport device and a facility among the plurality of facilities; and a second ranging sensor configured to measure a second distance between the ground transport device and the facility, wherein the second ranging sensor is adjacent to the first ranging sensor, and wherein the drive controller is further configured to dock the ground transport device with the facility based on the first distance and the second distance.

6. The ground transportation device according to claim 5, wherein, The drive controller is also configured to use the barcode reader to scan the identification code attached to the side surface of the front panel of the facility, wherein the identification code comprises a single horizontal code.

7. The ground transportation device according to claim 6, wherein, The drive controller is also configured to correct the docking attitude of the ground transport device based on a value obtained by calculating a first measurement value from the first ranging sensor and a second measurement value from the second ranging sensor.

8. The ground transportation device according to claim 6, wherein, The drive controller is also configured to correct the docking attitude of the ground transport device based on the angle between the first line segment and the second line segment, wherein the first line segment connects the first ranging sensor to the second ranging sensor, and wherein the second line segment is parallel to the front surface of the front panel of the facility.

9. The ground transportation device according to claim 1, further comprising: The battery, wherein the drive controller includes a charging plate configured to charge the battery, and wherein the drive controller is further configured to use the charging plate to charge the battery when the robotic arm assembly performs at least one of the following: removing the container from the first shelf or placing the container on the second shelf.

10. The ground transportation device according to claim 1, wherein, The housing includes at least one open side surface.

11. The ground transportation device according to claim 1, wherein, Each of the plurality of shelves includes: a pin assembly configured to secure the container; and a sensor configured to detect at least one of: whether the container has been loaded onto the shelf or whether the container is in the correct position, wherein the pin assembly at least partially surrounds the sensor.

12. The ground transportation device according to claim 11, wherein, The pin assembly includes: a moving pin; and a vibration damping structure located below the moving pin and configured to absorb vibration.

13. The ground transportation device of claim 1, further comprising an elastic structure between the drive controller and the housing, the elastic structure being configured to absorb impacts applied to the ground transportation device from the outside.

14. The ground transportation device according to claim 1, wherein, The robotic arm assembly includes: a body; a first arm pivotally connected to the body; a second arm pivotally connected to the first arm; and a robotic hand mounted at the end of the second arm.

15. The ground transportation device according to claim 14, wherein, The second arm is located at a different vertical height than the first arm.

16. The ground transportation device according to claim 14, wherein, The main body is configured to move the first arm in a direction perpendicular to the pivot direction.

17. The ground transportation device according to claim 14, wherein, The robotic arm assembly is configured to perform at least one of the following by performing a backward movement of the second arm, a pivoting movement of the second arm, and a forward movement of the first arm: removing the container from the first shelf or placing the container on the second shelf.

18. A logistics processing system, comprising: A substrate processing apparatus configured to process substrates; An overhead storage device, configured to store containers for storing the substrate, is installed on the ceiling of a semiconductor manufacturing plant; A ground storage device is installed on the ground of the semiconductor manufacturing plant and configured to store the container; An overhead transport device is configured to move along tracks installed on the ceiling of the semiconductor manufacturing plant and transport the containers; and a ground transport device configured to move on the ground of the semiconductor manufacturing plant and transport the container, wherein the ground transport device includes: a drive controller configured to move the ground transport device on the ground of the semiconductor manufacturing plant; a housing on the drive controller; a shelf structure within the housing and including a plurality of shelves; and a robotic arm assembly within the housing and spaced apart from the shelf structure, wherein the robotic arm assembly is configured to: remove the container from a first shelf of the plurality of shelves; and place the container on a second shelf of the plurality of shelves, and wherein the drive controller is further configured to transport the container between a plurality of facilities and the ground storage device, each of the plurality of facilities including the substrate processing device.

19. The logistics processing system according to claim 18, further comprising: Inter-floor transport device, configured to connect the floor of the semiconductor manufacturing plant to the ceiling of the semiconductor manufacturing plant; And the container used for transportation.

20. A ground transport device for transporting containers within a semiconductor manufacturing plant, the ground transport device comprising: A drive controller is configured to move the ground transport device on the ground of the semiconductor manufacturing plant; The housing is located on the drive controller; A shelving structure, within the housing and including a plurality of shelves; and a robotic arm assembly, within the housing and spaced apart from the shelving structure, wherein the robotic arm assembly is configured to: remove the container from a first shelf of the plurality of shelves; and place the container on a second shelf of the plurality of shelves, wherein a drive controller is configured to: transport the container between a plurality of facilities, each of the plurality of facilities including a substrate processing device, the container storing a substrate; and store the container in a ground storage device disposed on the ground of the semiconductor manufacturing plant, wherein the drive controller includes: a barcode reader configured to identify an identification code attached to each of the plurality of facilities; a first distance sensor configured to measure a first distance between the ground transport device and the facilities of the plurality of facilities; and a second distance sensor configured to measure a second distance between the ground transport device and the facilities, wherein the second distance sensor is adjacent to the first distance sensor. In this configuration, the drive controller is configured to dock the ground transport device with the facility based on the identification code, the first distance, and the second distance. The identification code includes at least one of the following: a plurality of vertical codes attached to the upper part of the front panel of the facility or a horizontal code attached to the side surface of the front panel of the facility. The drive controller is configured to: correct the docking posture of the ground transport device based on a first angle between a first line segment and a second line segment, based on the identification code including the plurality of vertical codes; and correct the docking posture based on a second angle between a third line segment and a fourth line segment, based on the identification code including the horizontal code. The first line segment connects the first vertical code to the second vertical code among the plurality of vertical codes. The second line segment is parallel to the front surface of the drive controller. The third line segment connects the first ranging sensor to the second ranging sensor. The fourth line segment is parallel to the front surface of the front panel of the facility.

Images