Chip mounting device for wafer tape-out

Abstract

The invention relates to a chip mounting device for wafer tape-out, and relates to the technical field of wafer chip mounting, the chip mounting device comprises a support frame used for placing a chip, a support push plate is fixed in the middle of the support frame, the support push plate is fixedly installed on a longitudinal moving plate, the longitudinal moving plate is installed on a fixed support plate through a cylinder, and the longitudinal moving plate is fixed on the support frame. And a plurality of vacuum adsorption holes are uniformly formed in the supporting push plate, and the guiding inclined plane and the limiting inclined plane on the supporting frame form an intelligent positioning structure. Chips in regular positions can smoothly slide to the bottom to be adsorbed by vacuum; and the chip at an incorrect position is clamped at the inclined surface and cannot be adsorbed, so that the chip is automatically identified as a defective product (Bug chip) by a system. Therefore, preliminary quality screening in the feeding process is achieved.

Description

Wafer fabrication and placement equipment Technical Field

[0001] This invention relates to the field of wafer mounting technology, specifically to a wafer fabrication mounting apparatus. Background Technology

[0002] During wafer fabrication and die bonding, the diced chips are typically mounted onto a substrate or lead frame. This process requires precisely picking up individual chips from the diced blue film and placing them at designated positions on the packaging substrate, lead frame, or housing, and then bonding and fixing them with conductive adhesive or solder.

[0003] In the above process, the chips need to be evenly placed on the placement tray, and the placement tray is placed in the pick-and-place machine. The pick-and-place machine picks up the chips from the placement tray one by one and places them. The chip position accuracy is required in this process, and the placement trays need to be removed one by one after the placement trays are placed. The movement of the placement tray will affect the position of the chips, thus affecting the position of the chips. Summary of the Invention

[0004] The purpose of this invention is to provide a chip mounting device for wafer fabrication.

[0005] The technical problem solved by this invention is to solve the chip placement error problem caused by inaccurate chip positioning during chip placement in the prior art.

[0006] The present invention can be achieved by the following technical solution: a wafer fabrication chip placement device, including a support frame for placing chips, a support push plate fixed in the middle of the support frame, the support push plate fixedly mounted on a longitudinal moving plate, the longitudinal moving plate being mounted on a fixed support plate by a cylinder, and a plurality of vacuum adsorption holes uniformly arranged on the support push plate.

[0007] A further technical improvement of the present invention is that: the support frame is provided with a guide slope and a limiting slope, the guide slope is inclined, and the four guide slopes are connected to each other, while a limiting slope is provided at the bottom of the guide slope.

[0008] A further technical improvement of the present invention is that: a magnetic connecting block is fixed on the side of the fixed support plate, and a feeding longitudinal moving component for realizing the feeding function is also included. An electromagnetic connecting block is provided at the output end of the feeding longitudinal moving component, and the electromagnetic connecting block and the magnetic connecting block are magnetically connected.

[0009] A further technical improvement of the present invention is that: the feeding longitudinal moving component includes a side base, an annular groove is provided on the side base, an annular conveyor belt is provided inside the annular groove through a drive conveyor roller, a conveyor block is uniformly slidably provided on the annular conveyor groove, and an electromagnetic connecting plate is fixed to the side of the conveyor block.

[0010] A further technical improvement of the present invention is that it also includes a lateral moving component for moving the chip to the pick-up position. The lateral moving component includes a moving frame, a moving slide groove is provided on the moving frame, a drive screw is driven by a motor inside the moving slide groove, a moving slider is threaded on the drive screw, the moving slider and the moving slide groove are slidably connected, and a moving plate is fixed to the side of the moving slider. A push cylinder is fixed on the moving plate, a push frame is fixed to the output end of the push cylinder, a limit plate is fixed to the side of the connecting plate, and an electromagnetic block for magnetically engaging with the limit plate is provided inside the push frame.

[0011] A further technical improvement of the present invention is that it also includes an auxiliary mechanism for assisting in the feeding of chips. The auxiliary mechanism includes an intermediate connecting magnetic plate, and a pushing mechanism is also provided on the side of the intermediate connecting magnetic plate. The intermediate connecting magnetic plate is installed at the output end of the unloading longitudinal moving component. The intermediate connecting magnetic plate is an electromagnet for cooperating with a metal plate, and a pushing plate is provided on the bottom frame via a telescopic rod.

[0012] A further technical improvement of the present invention is that: the pushing mechanism includes a pushing connecting bracket, the pushing connecting bracket is fixed to the side of the fixed support plate, a rotating rod is rotatably provided on the pushing connecting bracket, the middle position of the rotating rod is rotatably mounted on the adjusting sliding rod, and the other end of the rotating rod is rotatably mounted on the adjusting plate, the adjusting plate is connected to the metal plate through the adjusting mechanism.

[0013] A further technical improvement of the present invention is that: the adjustment mechanism includes an adjustment slider, which is mounted on a metal plate. The adjustment plate and the adjustment slider are slidably connected by an adjustment spring. A connecting frame is fixed on the metal plate, and an adaptive adjustment sleeve is fixed on the connecting frame. An adjustment sliding rod is provided inside the adaptive adjustment sleeve by an internal spring. The internal spring is a tension spring. A limit sleeve is fixed at the bottom of the adjustment sliding rod. The limit sleeve and the push connecting bracket are slidably connected. A rotating shaft is rotatably provided on the adjustment sliding rod. The rotating shaft and the rotating rod are rotatably connected by a torsion spring.

[0014] Compared with the prior art, the present invention has the following advantages: 1. This application uses a support push plate and support frame with vacuum adsorption holes to directly fix the chip, replacing the traditional simple placement tray. The chip is adsorbed and fixed after being placed, eliminating minor slippage or vibration during subsequent transmission; at the same time, this application achieves rapid and stable docking and separation of the carrying unit and the feeding and lateral movement components through the cooperation of magnetic connecting blocks and electromagnetic connecting blocks / electromagnetic blocks. The entire transmission process is controlled by the longitudinal movement component and the lateral movement component of the feeding unit, with precise action paths, avoiding positional interference that may be caused by manual or mechanical clamping.

[0015] 2. The guide ramp and limiting ramp on the support frame of this application constitute an intelligent positioning structure. Chips in a well-positioned position can smoothly slide to the bottom and be vacuum-attracted; chips in an incorrect position will be stuck at the ramp and cannot be attracted, thus being automatically identified as defective products (bug chips) by the system. This achieves preliminary quality screening during the loading process, and this application integrates a complete process of loading, lateral transfer, and unloading. Through the cooperation of magnetic docking and a conveyor belt / screw mechanism, the automatic circulation of the carrying unit is realized: an empty unit enters from the loading end, loads chips, moves to the placement position, becomes an empty tray after the chips are removed, and moves to the unloading end. The entire process is continuous and automated, reducing manual intervention and improving production efficiency.

[0016] 3. This application utilizes electromagnets to achieve the connection and separation between various components, which not only ensures a firm connection but also provides a rapid response, facilitating automated program control and making equipment maintenance and module replacement easier. Furthermore, the adjusting spring, internal spring (tension spring), and torsion spring in the auxiliary feeding mechanism constitute an adaptive system that can buffer and adapt to the movement of the frame in different positions or states, ensuring smooth and gentle pushing action and preventing impact on precision components. Attached Figure Description

[0017] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to the accompanying drawings.

[0018] Figure 1 is a schematic diagram of the support frame structure of the present invention; Figure 2 is a schematic diagram of the installation position of the support frame of the present invention; Figure 3 is a schematic diagram of the suction position of the present invention; Figure 4 is a schematic diagram of the arrangement of the support frame of the present invention; Figure 5 is a partial enlarged view of point A in Figure 4 of the present invention; Figure 6 is a schematic diagram of the longitudinal moving component structure for feeding of the present invention; Figure 7 is a schematic diagram of the annular groove structure of the present invention; Figure 8 is a schematic diagram of the auxiliary mechanism of the present invention.

[0019] In the diagram: 1. Connecting plate; 2. Support mechanism; 3. Longitudinal moving plate; 4. Fixed support plate; 5. Connecting piece; 6. Limiting slope; 7. Guide slope; 8. Support frame; 9. Support push plate; 10. Loading longitudinal moving assembly; 11. Loading position; 12. Empty tray position; 13. Unloading longitudinal moving assembly; 14. Defective material unloading position; 15. Lateral moving assembly; 16. Suction position; 17. Pushing frame; 18. Limiting plate; 19. Electromagnetic block; 20. Pushing cylinder; 21. Moving slide; 22. Drive screw; 23. Moving slider 24. Moving frame; 25. Moving plate; 26. Side base; 27. Conveying block; 28. Circular conveyor belt; 29. ​​Electromagnetic connecting plate; 30. Magnetic connecting block; 31. Drive conveyor roller; 32. Circular groove; 33. Limiting sleeve; 34. Limiting bracket; 35. Push connecting bracket; 36. Rotating shaft; 37. Rotating rod; 38. Push plate; 39. Adjusting slider; 40. Adjusting plate; 41. Intermediate connecting magnetic plate; 42. Metal plate; 43. Connecting frame; 44. Adaptive adjusting sleeve; 45. Internal spring; 46. Adjusting sliding rod. Detailed Implementation

[0020] To further illustrate the technical means and effects adopted by the present invention in order to achieve the intended purpose, the following detailed description is provided in conjunction with the accompanying drawings and preferred embodiments, based on the specific implementation methods, structures, features and effects of the present invention.

[0021] Please refer to Figures 1-8. The wafer fabrication placement device includes a support frame 8 for placing chips. A support pusher 9 is fixed in the middle of the support frame 8. The support pusher 9 is fixedly mounted on a longitudinal moving plate 3. The longitudinal moving plate 3 is mounted on a fixed support plate 4 by a cylinder. The position of the longitudinal moving plate 3 is controlled by the cylinder on the fixed support plate 4, thereby controlling the position of the support pusher 9. This allows the support pusher 9 to support the chips, facilitating chip removal and unloading. The support pusher 9 has several vacuum adsorption holes evenly distributed on it for adsorbing and fixing the chips. Additionally, the support frame 8 is provided with a guide ramp 7 and a limiting surface. The inclined plane 6 has four guide inclined planes 7 that are connected to each other. At the same time, a limit inclined plane 6 is provided at the bottom of the guide inclined plane 7 to maintain the stability of the chip. That is, when the chip enters the guide inclined plane 7, if the chip is not in a regular position, it will be stuck on the guide inclined plane 7. The guide inclined plane 7 does not contact the support push plate 9. At this time, the vacuum adsorption hole does not adsorb the chip, and the chip is judged to be a bug chip for subsequent removal. Meanwhile, the support frame 8 is connected by a connecting piece 5, and the connecting piece 5 is connected to the fixed support plate 4 by a connecting plate 1. The fixed support plate 4 and the longitudinal moving plate 3 are fixedly connected.

[0022] Furthermore, to achieve uniform feeding of the support frame 8, a magnetic connecting block 30 is fixed to the side of the fixed support plate 4, and a feeding longitudinal moving assembly 10 is provided on the feeding position 11. The feeding longitudinal moving assembly 10 includes a side base 26, on which an annular groove 32 is formed. An annular conveyor belt 28 is provided inside the annular groove through a drive conveyor roller 31. A conveyor block 27 is uniformly slidably arranged on the annular conveyor belt 28. An electromagnetic connecting plate 29 is fixed to the side of the conveyor block 27, and the electromagnetic connecting plate 29 and the magnetic connecting block 30 are magnetically connected. In use, the electromagnetic connecting plate 29 is activated, causing the electromagnetic connecting plate 29 and the magnetic connecting block 30 to form a magnetic connection. At this time, the fixed support plate 4 and the feeding longitudinal moving assembly 10 are connected. When the longitudinal motor drives the drive conveyor roller 31 to rotate, it drives the annular conveyor belt 28, thereby driving the conveyor block 27 to move, further realizing the gradual movement of the fixed support plate 4 from the feeding position 11 to the suction position 16.

[0023] To achieve lateral movement of the fixed support plate 4, moving it to the suction position 16, the lateral movement assembly 15 includes a moving frame 24. The moving frame 24 has a moving slide groove 21. Inside the moving slide groove 21, a drive screw 22 is driven by a motor. A moving slider 23 is threaded onto the drive screw 22 and slidably connected to the moving slide groove 21. A moving plate 25 is fixed to the side of the moving slider 23, and a push cylinder 20 is fixed to the moving plate 25. A push frame 17 is fixed to the output end of the push cylinder 20. A limiting plate 18 is fixed to the side of the receiving plate 1. An electromagnetic block 19 is provided inside the pushing frame 17 for magnetic engagement with the limiting plate 18. In use, when the fixed support plate 4 is moved to the highest position, the pushing cylinder 20 pushes the pushing frame 17, so that the electromagnetic block 19 inside the pushing frame 17 contacts the limiting plate 18. At this time, the electromagnetic block 19 is energized and uses the electromagnetic block 19 to attract the limiting plate 18. Then, when the motor drives the drive screw 22, it drives the moving plate 25 to move, so that the fixed support plate 4 is moved to the pick-up position 16, realizing the pick-up and placement of the chip.

[0024] Furthermore, in order to realize the unloading of the fixed support plate 4, the other end of the fixed support plate 4 is provided with a mechanism for cooperating with the unloading longitudinal moving component 13. The unloading longitudinal moving component 13 has the same structure as the loading longitudinal moving component 10. A defective material unloading station 14 is provided on the unloading longitudinal moving component 13, and an empty tray station 12 is provided at the end of the unloading longitudinal moving component 13 for unloading defective products and for loading empty trays again.

[0025] In another embodiment of this application, an auxiliary mechanism is provided on the empty tray station 12 for pushing the fixed support plate 4 to facilitate loading. Specifically, a pushing connecting bracket 35 is fixed to the side of the fixed support plate 4, and a rotating rod 37 is rotatably mounted on the pushing connecting bracket 35. The middle position of the rotating rod 37 is rotatably mounted on the adjusting sliding rod 46, and the other end of the rotating rod 37 is rotatably mounted on the adjusting plate 40. The adjusting plate 40 is connected to the metal plate 42 through an adjusting mechanism. The auxiliary mechanism includes an intermediate connecting magnetic plate 41, which is mounted on the unloading longitudinal moving assembly. The output end of 13, and the unloading longitudinal moving component 13 adopts the same screw component as the loading longitudinal moving component 10, and the intermediate connecting magnetic plate 41 is an electromagnet, which is used to cooperate with the metal plate 42. At the same time, a push plate 38 is set on the bottom frame through a telescopic rod. When in use, when the telescopic rod controls the push plate 38 to act on the bottom of the adjustment plate 40, the adjustment plate 40 is controlled to move longitudinally relative to the metal plate 42. At this time, under the action of the rotating rod 37, the fixed support plate 4 moves downward and to the side, which facilitates the loading of the fixed support plate 4 and realizes the uniform placement of the chip.

[0026] Specifically, an adjusting slider 39 is fixed on the side of the metal plate 42. The adjusting plate 40 and the adjusting slider 39 are slidably connected by an adjusting spring. A connecting frame 43 is fixed on the metal plate 42, and an adaptive adjusting sleeve 44 is fixed on the connecting frame 43. An adjusting sliding rod 46 is provided inside the adaptive adjusting sleeve 44 by an internal spring 45. The internal spring 45 is a tension spring. A limiting sleeve 33 is fixed at the bottom of the adjusting sliding rod 46. The limiting sleeve 33 is slidably connected to the pushing connecting bracket 35. A rotating shaft 36 is rotatably provided on the adjusting sliding rod 46. The rotating shaft 36 and the rotating rod 37 are rotatably connected by a torsion spring.

[0027] In use, the chip is placed on the support push plate 9. When the chip enters the guide slope 7, if the chip's position is irregular, it will be stuck on the guide slope 7 and will not contact the support push plate 9. At this time, the vacuum adsorption hole will not adsorb the chip, indicating that the chip is a defective chip, which will be removed later. When loading the chip, the electromagnetic connection plate 29 is activated, causing the electromagnetic connection plate 29 and the magnetic connection block 30 to form a magnetic connection. This establishes the connection between the fixed support plate 4 and the loading longitudinal moving assembly 10. When the longitudinal motor drives the drive conveyor roller 31 to rotate, it drives the annular conveyor belt. 28, thereby driving the movement of the conveyor block 27, further realizing the gradual movement of the fixed support plate 4 from the loading position 11 to the suction position 16. When it reaches the suction position 16, when the fixed support plate 4 moves to the highest position, the push cylinder 20 pushes the push frame 17, so that the electromagnetic block 19 inside the push frame 17 contacts the limiting plate 18. At this time, the electromagnetic block 19 is energized, and the limiting plate 18 is attracted by the electromagnetic block 19. At this time, the electromagnetic connection plate 29 is de-energized. Then, when the motor drives the drive screw 22, it drives the moving plate 25 to move, so that the fixed support plate 4 is moved to the suction position 16, realizing the suction and placement of the chip.

[0028] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A wafer fabrication and placement device, characterized in that: It includes a support frame (8) for placing chips, a support push plate (9) is fixed in the middle of the support frame (8), the support push plate (9) is fixedly installed on a longitudinal moving plate (3), the longitudinal moving plate (3) is installed on a fixed support plate (4) by a cylinder, and a number of vacuum adsorption holes are evenly arranged on the support push plate (9).

2. The wafer fabrication and placement apparatus according to claim 1, characterized in that, The support frame (8) is provided with a guide slope (7) and a limiting slope (6). The guide slope (7) is inclined and the four guide slopes (7) are connected to each other. At the same time, a limiting slope (6) is provided at the bottom of the guide slope (7).

3. The wafer fabrication and placement apparatus according to claim 1, characterized in that, The fixed support plate (4) is fixed with a magnetic connecting block (30) on its side and also includes a feeding longitudinal moving component (10) for realizing the feeding function. The output end of the feeding longitudinal moving component (10) is provided with an electromagnetic connecting plate (29), and the electromagnetic connecting plate (29) and the magnetic connecting block (30) are magnetically connected.

4. The wafer fabrication and placement apparatus according to claim 3, characterized in that, The feeding longitudinal moving component (10) includes a side base (26), an annular groove (32) is provided on the side base (26), an annular conveyor belt (28) is provided inside the annular groove (32) through a drive conveyor roller (31), a conveyor block (27) is uniformly slidably provided on the annular conveyor belt (28), and an electromagnetic connecting plate (29) is fixed on the side of the conveyor block (27).

5. The wafer fabrication and placement apparatus according to claim 1, characterized in that, It also includes a lateral movement component (15) for moving the chip to the pick-up position (16). The lateral movement component (15) includes a moving frame (24). The moving frame (24) is provided with a moving slide (21). The moving slide (21) is driven by a motor to the inside of a driving screw (22). The driving screw (22) is threaded with a moving slider (23). The moving slider (23) and the moving slide (21) are slidably connected. The moving slider (23) is fixed with a moving plate (25) on its side. The moving plate (25) is fixed with a push cylinder (20). The output end of the push cylinder (20) is fixed with a push frame (17). The support frame (8) and the fixed support plate (4) are fixedly connected by a connecting plate (1). The side of the connecting plate (1) is fixed with a limit plate (18). The push frame (17) is provided with an electromagnetic block (19) for magnetic cooperation with the limit plate (18).

6. The wafer fabrication and placement apparatus according to claim 1, characterized in that, It also includes an auxiliary mechanism for assisting in the feeding of chips. The auxiliary mechanism includes an intermediate connecting magnetic plate (41), and a pushing mechanism is provided on the side of the intermediate connecting magnetic plate (41). The intermediate connecting magnetic plate (41) is installed at the output end of the unloading longitudinal moving component (13). The intermediate connecting magnetic plate (41) is an electromagnet for cooperating with the metal plate (42), and a pushing plate (38) is provided on the bottom frame through a telescopic rod.

7. The wafer fabrication and placement apparatus according to claim 6, characterized in that, The pushing mechanism includes a pushing connecting bracket (35), which is fixed to the side of the fixed support plate (4). A rotating rod (37) is rotatably mounted on the pushing connecting bracket (35). The middle position of the rotating rod (37) is rotatably mounted on the adjusting sliding rod (46), and the other end of the rotating rod (37) is rotatably mounted on the adjusting plate (40). The adjusting plate (40) is connected to the metal plate (42) through the adjusting mechanism.

8. The wafer fabrication and placement apparatus according to claim 7, characterized in that, The adjustment mechanism includes an adjustment slider (39), which is mounted on a metal plate (42). The adjustment plate (40) and the adjustment slider (39) are slidably connected by an adjustment spring. A connecting frame (43) is fixed on the metal plate (42). An adaptive adjustment sleeve (44) is fixed on the connecting frame (43). An adjustment sliding rod (46) is provided inside the adaptive adjustment sleeve (44) by an internal spring (45). The internal spring (45) is a tension spring. A limit sleeve (33) is fixed at the bottom of the adjustment sliding rod (46). The limit sleeve (33) and the push connecting bracket (35) are slidably connected. A rotating shaft (36) is rotatably provided on the adjustment sliding rod (46). The rotating shaft (36) and the rotating rod (37) are rotatably connected by a torsion spring.

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