Electronic component pin forming device

Abstract

The invention relates to the technical field of electronic component processing, in particular to an electronic component pin forming device which comprises a forming unit which comprises a machine body, a cutting assembly and a polishing assembly, and the cutting assembly and the polishing assembly are arranged at the top of the machine body. The feeding unit comprises a conveying assembly arranged on the top of the machine body. The device has the beneficial effects that through cooperation of the forming unit and the feeding unit, pin forming and grinding integrated machining is achieved, bending forming and fixed-length cutting are completed at the same time through one-time punching by means of cooperation of a waste discharge notch formed in a female die and a male die cutter, positioning errors and efficiency losses caused by step-by-step machining are avoided, meanwhile, a first air bag is arranged on the inner wall of a grinding frame, and machining efficiency is improved. The air bag pressing block on the back face of the adsorption assembly synchronously extrudes the second air bag, the friction piece is driven to be attached to the pin in a self-adaptive mode, the polishing pressure can be automatically adjusted without a motor, the structure is simplified, energy consumption and cost are reduced, multi-face synchronous polishing can be achieved, and it is ensured that burrs are evenly removed.

Description

Technical Field

[0001] This invention relates to the field of electronic component processing technology, and in particular to an electronic component lead forming device. Background Technology

[0002] Electronic components are the basic units that realize circuit functions. They typically consist of two parts: the functional body and metal leads. For example, components such as diodes, transistors, integrated circuits, capacitors, and resistors all rely on leads to achieve mechanical connection with the circuit board and transmit electrical signals. In the field of electronic manufacturing, lead forming refers to the process of mechanically bending and cutting the original straight metal leads of components to form specific shapes and sizes that meet the requirements of the mounting process, thereby satisfying the assembly needs of through-hole mounting or surface mounting, and ensuring soldering reliability and electrical performance stability. Traditional lead forming mainly relies on manual clamping or semi-automatic stamping equipment. After the operator fixes the component body, they use a mold to apply pressure to the leads to cause plastic deformation, while a cutter trims off the excess length to finally form the required lead shape.

[0003] A pin forming apparatus, as disclosed in Chinese Patent Publication No. (CN108856593B), is used for pin forming of electronic components. It includes a driving assembly, a first cutter, a second cutter, and a mold carrier assembly. The driving assembly includes a driving component and a receiving plate. The mold carrier assembly has a first receiving groove corresponding to the first cutter and a second receiving groove corresponding to the second cutter. When an electronic component is placed on the mold carrier assembly, the pins of the electronic component span across both the first and second receiving grooves. This pin forming apparatus drives the first and second cutters via the driving assembly, causing them to cut different pins of the electronic component simultaneously or at different times, and then bends the pins after cutting. This achieves the cutting of different pins, allowing pins to be cut into different specifications in one step without requiring two separate processes.

[0004] While existing technologies can cut and shape the pins of electronic components, the pins formed by this method will have defects such as burrs during the cutting process. These burrs not only affect the aesthetics of the pins, but also cause quality problems such as poor soldering and bridging in subsequent soldering processes, resulting in a decrease in the reliability and lifespan of electronic products. Existing technologies usually use manual grinding or additional independent grinding equipment to remove burrs. However, manual grinding is inefficient and inconsistent, while independent grinding equipment increases process flow time, equipment footprint and production costs, and is difficult to achieve efficient synchronization with the forming process. Summary of the Invention

[0005] In view of the problems existing in the above or prior art, the present invention is proposed.

[0006] Therefore, the purpose of this invention is to provide an electronic component lead forming device that can realize integrated lead forming and grinding. It completes bending and fixed-length cutting in one stamping process through a die and a punch. It uses an airbag linkage mechanism to drive the grinding part to adaptively fit the lead for multi-face synchronous grinding. It can automatically adjust the grinding pressure without the need for an additional motor, thereby eliminating the burrs formed by the cutter.

[0007] To solve the above-mentioned technical problems, the present invention provides the following technical solution: an electronic component lead forming device, which includes a forming unit, including a body, a cutting component and a polishing component disposed on the top of the body;

[0008] The feeding unit includes a conveying assembly disposed on the top of the machine body, and an adsorption assembly disposed on the top of the conveying assembly;

[0009] The cutting assembly includes a processing table fixedly disposed on the top of the machine body, a die disposed on the top of the processing table, a drive component disposed on the outside of the processing table, and a punch disposed on the bottom of the drive component.

[0010] The polishing assembly includes a support frame fixedly mounted on the top of the machine body and a polishing frame mounted on the top of the support frame. Adjustment components are provided on the inner walls of the upper and lower sides of the polishing frame, and friction components are provided on the outer sides of the adjustment components.

[0011] In a preferred embodiment of the electronic component lead forming device of the present invention, the interior of the concave mold is provided with a waste discharge slot, the convex mold is located above the concave mold, and a cutter is fixedly provided at the bottom of the convex mold.

[0012] In a preferred embodiment of the electronic component pin forming device of the present invention, the driving component includes a pad fixedly disposed on the outside of the processing table, a pneumatic push rod fixedly disposed on the top of the pad, a connecting plate fixedly disposed on the output end of the pneumatic push rod, and the bottom of the connecting plate being connected to the top of the punch.

[0013] As a preferred embodiment of the electronic component pin forming device of the present invention, the punch is fixedly provided with limit rings on both the left and right sides, and the processing table is fixedly provided with limit rods corresponding to the positions of the two sets of limit rings on the top.

[0014] The two sets of limiting rods are located inside the two sets of limiting rings, respectively.

[0015] In a preferred embodiment of the electronic component pin forming device of the present invention, the cross-sectional shape of the grinding frame is set to U-shape, and the grinding frame is located on the right side of the processing table.

[0016] As a preferred embodiment of the electronic component pin forming device of the present invention, the adjusting component includes first airbags respectively fixedly disposed on the inner walls of the upper and lower sides of the grinding frame, a three-way pipe is connected to the outer sides of the two sets of first airbags, a platform is fixedly disposed on the top of the machine body, a support frame is fixedly disposed on the top of the platform, a second airbag is embedded inside the support frame, and an airbag pressure block is fixedly disposed on the back of the adsorption component.

[0017] The end of the three-way tube furthest from the two sets of first airbags is connected to the second airbag.

[0018] In a preferred embodiment of the electronic component pin forming device of the present invention, the friction element includes an adhesive plate fixedly disposed on the outside of two sets of first airbags, the two sets of adhesive plates are disposed opposite to each other, and a horizontal polishing pad is adhesively disposed on the side of the two sets of adhesive plates that are close to each other, and a vertical polishing pad is adhesively disposed on the left inner wall of the polishing frame.

[0019] In a preferred embodiment of the electronic component lead forming device of the present invention, the conveying assembly includes two sets of stabilizing frames fixedly disposed on the top of the machine body. A rotating shaft is rotatably disposed inside each of the two sets of stabilizing frames. Gears are fixedly disposed on the outer side of each of the two sets of rotating shafts. A toothed conveyor belt is meshed on the outer side of each of the two sets of gears. A motor is fixedly disposed inside the left stabilizing frame, and the output end of the motor is connected to the left rotating shaft.

[0020] As a preferred embodiment of the electronic component lead forming device of the present invention, the adsorption component includes several sets of upright plates fixedly disposed on the top of the toothed conveyor belt, and each set of upright plates is fixedly provided with a pneumatic suction cup on its front side.

[0021] The airbag pressure block is fixedly installed on the back of the upright plate.

[0022] In a preferred embodiment of the electronic component pin forming device of the present invention, a plurality of sets of upright plates are spaced apart on the top of the toothed conveyor belt, and the distance between any two adjacent sets of upright plates is greater than the length of the grinding frame.

[0023] The beneficial effects of this invention are as follows: This invention achieves integrated pin forming and grinding through the collaboration of the forming unit and the feeding unit. By utilizing the waste discharge slot inside the die and cooperating with the punch cutter, bending and length cutting are completed simultaneously in one stamping, avoiding positioning errors and efficiency losses in step-by-step processing. At the same time, the inner wall of the grinding frame is equipped with a first airbag, which is connected to a second airbag through a three-way pipe. The airbag pressure block on the back of the adsorption component simultaneously squeezes the second airbag, driving the friction component to adaptively fit the pin. The grinding pressure can be automatically adjusted without a motor, simplifying the structure, reducing energy consumption and cost, and enabling simultaneous grinding on multiple sides to ensure uniform removal of burrs. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the overall structure of an electronic component lead forming device.

[0026] Figure 2 This is a partial structural diagram of an electronic component lead forming device.

[0027] Figure 3 This is a front view of the cut-off assembly of an electronic component lead forming device.

[0028] Figure 4 This is an isometric view of the cut-off assembly of an electronic component lead forming device.

[0029] Figure 5 This is a schematic diagram of the grinding assembly of an electronic component lead forming device.

[0030] Figure 6 Another perspective schematic diagram of the grinding assembly of an electronic component lead forming device.

[0031] Figure 7 This is a partial cross-sectional view of the feeding unit of an electronic component lead forming device.

[0032] Figure 8 For electronic component lead forming device Figure 7 Enlarged schematic diagram of the structure at point A in the middle.

[0033] In the diagram: 1. Molding unit; 11. Machine body; 12. Cutting component; 121. Machining table; 122. Die; 1221. Waste discharge slot; 123. Driving component; 1231. Pad block; 1232. Pneumatic push rod; 1233. Connecting plate; 124. Punch; 1241. Cutting knife; 1242. Limiting ring; 1243. Limiting rod; 13. Grinding component; 131. Support frame; 132. Grinding frame; 133. Adjusting component; 1331. First airbag; 133 2. T-pipe; 1333. Stand; 1334. Support frame; 1335. Second airbag; 1336. Airbag pressure block; 134. Friction component; 1341. Adhesive plate; 1342. Horizontal grinding pad; 1343. Vertical grinding pad; 2. Feeding unit; 21. Conveying assembly; 211. Stabilizer; 212. Rotating shaft; 213. Gear; 214. Toothed conveyor belt; 215. Motor; 22. Adsorption assembly; 221. Vertical plate; 222. Pneumatic suction cup. Detailed Implementation

[0034] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0035] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0036] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0037] Example 1, referring to Figures 1-8 This is the first embodiment of the present invention. This embodiment provides an electronic component pin forming device, which can simultaneously cut and form the pins of electronic components and polish the burrs. It includes a forming unit 1, which includes a body 11, a cutting component 12 and a polishing component 13 disposed on the top of the body 11; and a feeding unit 2, which includes a conveying component 21 disposed on the top of the body 11 and an adsorption component 22 disposed on the top of the conveying component 21.

[0038] Furthermore, the cutting assembly 12 includes a processing table 121 fixedly mounted on the top of the machine body 11, a die 122 mounted on the top of the processing table 121, a drive member 123 mounted on the outside of the processing table 121, and a punch 124 mounted on the bottom of the drive member 123; the grinding assembly 13 includes a support frame 131 fixedly mounted on the top of the machine body 11, a grinding frame 132 mounted on the top of the support frame 131, an adjusting member 133 mounted on the inner walls of the upper and lower sides of the grinding frame 132, and a friction member 134 mounted on the outer side of the adjusting member 133.

[0039] Furthermore, the interior of the die 122 is provided with a waste discharge slot 1221, the punch 124 is located above the die 122, and a cutter 1241 is fixedly provided at the bottom of the punch 124.

[0040] It should be noted that the die 122 is fixedly installed on the top of the processing table 121. Its top surface has a cavity that matches the contour of the component body, and a longitudinally penetrating waste discharge slot 1221 is provided inside for timely discharge of cut waste. The punch 124 is located directly above the die 122 and is rigidly connected to the output end of the pneumatic push rod 1232 through the connecting plate 1233. Cutters 1241 are fixedly installed on both sides of its bottom. The cutting edge angle of the cutter 1241 is 15-20°, which is used to achieve shearing cutting.

[0041] Furthermore, the driving component 123 includes a pad 1231 fixedly disposed on the outside of the processing table 121. A pneumatic push rod 1232 is fixedly disposed on the top of the pad 1231. A connecting plate 1233 is fixedly disposed on the output end of the pneumatic push rod 1232. The bottom of the connecting plate 1233 is connected to the top of the punch 124.

[0042] Furthermore, limit rings 1242 are fixedly provided on both the left and right sides of the punch 124, and limit rods 1243 corresponding to the positions of the two sets of limit rings 1242 are fixedly provided on the top of the processing table 121; the two sets of limit rods 1243 are respectively located inside the two sets of limit rings 1242.

[0043] Specifically, the limiting rings 1242 on the left and right sides of the punch 124 slide along the limiting rod 1243 on the top of the processing table 121 to ensure the precise alignment of the punch 124 and the die 122.

[0044] Furthermore, the cross-sectional shape of the grinding frame 132 is set to U-shape, and the grinding frame 132 is located on the right side of the processing table 121.

[0045] Furthermore, the adjusting component 133 includes first airbags 1331 fixedly disposed on the inner walls of the upper and lower sides of the grinding frame 132, a three-way pipe 1332 connecting the outer sides of the two sets of first airbags 1331, a platform 1333 fixedly disposed on the top of the machine body 11, a support frame 1334 fixedly disposed on the top of the platform 1333, a second airbag 1335 embedded inside the support frame 1334, and an airbag pressure block 1336 fixedly disposed on the back of the adsorption component 22; the end of the three-way pipe 1332 away from the two sets of first airbags 1331 is connected to the second airbag 1335.

[0046] Furthermore, the friction component 134 includes an adhesive plate 1341 fixedly disposed on the outside of the two sets of first airbags 1331. The two sets of adhesive plates 1341 are disposed opposite to each other, and a horizontal polishing pad 1342 is bonded to the side of the two sets of adhesive plates 1341 that are close to each other. A vertical polishing pad 1343 is bonded to the inner left wall of the polishing frame 132.

[0047] It should be noted that the grinding process relies on the coordinated action of the pneumatic linkage system and the friction component 134. When the component is transported to the grinding station, the airbag pressure block 1336 on the back of the adsorption component 22 moves synchronously with the upright plate 221 and squeezes the second airbag 1335 embedded in the support frame 1334. After the gas in the second airbag 1335 is compressed, it is diverted through the three-way pipe 1332 to the first airbag 1331 on the inner walls of the upper and lower sides of the grinding frame 132. After the first airbag 1331 expands, it pushes the adhesive plate 1341 of the friction component 134, so that the horizontal grinding pad 1342 adaptively adheres to the upper and lower surfaces of the pin with a certain pressure, and the vertical grinding pad 1343 synchronously adheres to the side of the pin. At this time, the motor 215 drives the toothed conveyor belt 214 to move continuously, and the component slides in the grinding frame 132 at a uniform speed to complete the multi-sided synchronous grinding.

[0048] It should also be noted that both the horizontal polishing pad 1342 and the vertical polishing pad 1343 are adhesively bonded. After the horizontal polishing pad 1342 and the vertical polishing pad 1343 are worn, they can be replaced by peeling off the horizontal polishing pad 1342 or the vertical polishing pad 1343 separately.

[0049] In use, when the component is transported to the cutting assembly 12 station, the component body is positioned on the die 122 at the top of the processing table 121, and the component pins are straddling the surface of the die 122. At this time, the pneumatic push rod 1232 of the drive component 123 is activated. The pneumatic push rod 1232 is fixed to the outside of the processing table 121 by the pad block 1231. Its output end pushes the connecting plate 1233 down, and the connecting plate 1233 drives the punch 124 to move downward synchronously. The cutter 1241 at the bottom of the punch 124 and the die 122 together apply shearing force and bending force to the pin, causing the pin to undergo plastic deformation and complete the fixed-length cutting. The waste generated by cutting is discharged through the waste discharge slot 1221 opened inside the die 122.

[0050] Furthermore, as the formed components continue to be conveyed to the right to the grinding assembly 13 station, the airbag pressure block 1336 fixed to the back of the upright plate 221 moves synchronously with the pneumatic suction cup 222. When the airbag pressure block 1336 contacts and squeezes the second airbag 1335 embedded in the support frame 1334, the gas in the second airbag 1335 is compressed and transmits pressure to the first airbag 1331 on the upper and lower inner walls of the grinding frame 132 through the three-way pipe 1332. The first airbag 1331 expands under the air pressure, pushing the horizontal grinding pad 1342 to adaptively conform to the upper and lower surfaces of the pin, while the vertical grinding pad 1343 conforms to the side of the pin. At this time, the toothed conveyor belt 214 continues to move, causing the component pin to slide relative to the friction part 134 in the U-shaped grinding frame 132, completing multi-sided synchronous grinding. After grinding is completed, the pneumatic suction cup 222 releases the components, completing the unloading.

[0051] In summary, through the collaboration of forming unit 1 and feeding unit 2, continuous automation of forming, cutting, and grinding processes is achieved. By utilizing airbag linkage to realize passive drive and adaptive pressure adjustment, the problems of complex structure and poor synchronization caused by traditional motor drive are avoided, and the processing efficiency, consistency and safety are significantly improved.

[0052] Example 2, refer to Figures 1-8 This is the second embodiment of the present invention, which differs from the first embodiment in that it also includes feeding and conveying electronic components for forming processing. In the previous embodiment, the electronic component lead forming device includes a friction member 134, which includes an adhesive plate 1341 fixedly disposed on the outside of two sets of first airbags 1331. The two sets of adhesive plates 1341 are disposed opposite to each other, and a horizontal polishing pad 1342 is adhesively disposed on the side of the two sets of adhesive plates 1341 that are close to each other. A vertical polishing pad 1343 is adhesively disposed on the left inner wall of the polishing frame 132.

[0053] Furthermore, the conveying assembly 21 includes two sets of stabilizing frames 211 fixedly mounted on the top of the machine body 11. A rotating shaft 212 is rotatably mounted inside each of the two sets of stabilizing frames 211. A gear 213 is fixedly mounted on the outer side of each of the two sets of rotating shafts 212. A toothed conveyor belt 214 is meshed on the outer side of each of the two sets of gears 213. A motor 215 is fixedly mounted inside the left stabilizing frame 211. The output end of the motor 215 is connected to the left rotating shaft 212.

[0054] It should be noted that the conveying assembly 21 uses the meshing transmission of the gear 213 and the toothed conveyor belt 214 to achieve movement and positioning. Specifically, the inner teeth of the toothed conveyor belt 214 mesh precisely with the outer teeth of the gear 213 to form a non-slip rigid transmission. The motor 215 drives the left rotating shaft 212 to rotate, and transmits the power to the toothed conveyor belt 214 through the gear 213, so that it makes a step-by-step precise displacement. The positioning accuracy is jointly guaranteed by the tooth pitch indexing of the gear 213 and the step control of the motor 215. The conveying distance each time is equal to the distance between adjacent workstations, realizing the precise rotation of components between the cutting assembly 12 and the grinding assembly 13 workstations.

[0055] Furthermore, the adsorption assembly 22 includes several sets of upright plates 221 fixedly disposed on the top of the toothed conveyor belt 214, and each set of upright plates 221 is fixedly disposed on the front side of a pneumatic suction cup 222; an airbag pressure block 1336 is fixedly disposed on the back side of the upright plate 221.

[0056] It should be noted that the pneumatic suction cup 222 is fixedly installed on the front side of the upright plate 221. Its negative pressure chamber is connected to the matching air pump (not shown in the figure) through the PU air pipe. The air pump is a miniature oil-free vacuum pump, which is controlled to start and stop by a solenoid valve. When the component is placed on the adsorption surface of the pneumatic suction cup 222, the solenoid valve is energized and opened. The air pump draws air to reduce the pressure in the negative pressure chamber to below -50kPa, generating an adsorption force of about 8-12N to firmly grasp the end of the component body.

[0057] Furthermore, several sets of upright plates 221 are spaced apart on the top of the toothed conveyor belt 214, and the distance between each pair of adjacent upright plates 221 is greater than the length of the grinding frame 132.

[0058] Specifically, since the spacing between each pair of adjacent upright plates 221 is greater than the length of the grinding frame 132, it ensures that the actions of each station do not interfere with each other.

[0059] During use, in the feeding stage, the electronic components to be processed are placed on the pneumatic suction cup 222 on the top of the machine body 11. The pneumatic suction cup 222 is fixedly installed on the front side of the upright plate 221, which is spaced apart on the top of the toothed conveyor belt 214. The toothed design of the toothed conveyor belt 214 ensures the stable spacing of the components. The toothed conveyor belt 214 is driven by the belt gear 213 meshing on its inner side. The belt gear 213 is fixed on the outer side of the rotating shaft 212. The rotating shaft 212 is rotatably set inside the two sets of stabilizers 211. The motor 215 inside the left stabilizer 211 drives the rotating shaft 212 to rotate, thereby driving the toothed conveyor belt 214 to make precise stepping movements and realize the conveying function of the feeding unit 2.

[0060] In summary, by designing the horizontal grinding pad 1342 and the vertical grinding pad 1343 of the friction component 134 as an adhesive fixing structure, the grinding pads can be removed and replaced separately after wear, without the need to replace the entire friction component 134 or grinding frame 132. This significantly reduces equipment maintenance costs and downtime, extends the service life of core components, and improves maintenance convenience and material utilization. It is particularly suitable for the rapid replacement needs of vulnerable parts in high-volume continuous production scenarios.

[0061] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. An electronic component lead forming apparatus, characterized in that: include, The molding unit (1) includes a body (11), a cutting component (12) disposed on the top of the body (11), and a polishing component (13). The feeding unit (2) includes a conveying assembly (21) disposed on the top of the body (11) and an adsorption assembly (22) disposed on the top of the conveying assembly (21). The cutting assembly (12) includes a processing table (121) fixedly disposed on the top of the body (11), a die (122) disposed on the top of the processing table (121), a drive member (123) disposed on the outside of the processing table (121), and a punch (124) disposed on the bottom of the drive member (123). The polishing assembly (13) includes a support frame (131) fixedly installed on the top of the body (11) and a polishing frame (132) installed on the top of the support frame (131). Adjustment members (133) are provided on the inner walls of the upper and lower sides of the polishing frame (132), and friction members (134) are provided on the outer side of the adjustment members (133).

2. The electronic component lead forming apparatus as described in claim 1, characterized in that: The cavity (122) has a waste discharge slot (1221) inside, the punch (124) is located above the cavity (122), and a cutter (1241) is fixedly provided at the bottom of the punch (124).

3. The electronic component lead forming apparatus as described in claim 2, characterized in that: The driving component (123) includes a pad (1231) fixedly disposed on the outside of the processing table (121). A pneumatic push rod (1232) is fixedly disposed on the top of the pad (1231). A connecting plate (1233) is fixedly disposed on the output end of the pneumatic push rod (1232). The bottom of the connecting plate (1233) is connected to the top of the punch (124).

4. The electronic component lead forming apparatus as described in claim 3, characterized in that: Limiting rings (1242) are fixedly provided on both the left and right sides of the punch (124), and limiting rods (1243) corresponding to the positions of the two sets of limiting rings (1242) are fixedly provided on the top of the processing table (121). The two sets of limiting rods (1243) are located inside the two sets of limiting rings (1242).

5. The electronic component lead forming apparatus as described in claim 4, characterized in that: The cross-sectional shape of the grinding frame (132) is set to U-shape, and the grinding frame (132) is located on the right side of the processing table (121).

6. The electronic component lead forming apparatus as described in claim 5, characterized in that: The adjusting component (133) includes first airbags (1331) fixedly disposed on the inner walls of the upper and lower sides of the grinding frame (132), and a three-way pipe (1332) is connected to the outer side of the two sets of first airbags (1331). A platform (1333) is fixedly disposed on the top of the body (11), and a support frame (1334) is fixedly disposed on the top of the platform (1333). A second airbag (1335) is embedded inside the support frame (1334), and an airbag pressure block (1336) is fixedly disposed on the back of the adsorption component (22). The end of the three-way tube (1332) away from the two sets of first airbags (1331) is connected to the second airbag (1335).

7. The electronic component lead forming apparatus as described in claim 6, characterized in that: The friction element (134) includes an adhesive plate (1341) fixedly disposed on the outside of the two sets of first airbags (1331). The two sets of adhesive plates (1341) are disposed opposite to each other, and a horizontal polishing pad (1342) is bonded to the side of the two sets of adhesive plates (1341) that are close to each other. A vertical polishing pad (1343) is bonded to the inner left wall of the polishing frame (132).

8. The electronic component lead forming apparatus as described in claim 7, characterized in that: The conveying assembly (21) includes two sets of stabilizing frames (211) fixedly installed on the top of the machine body (11). A rotating shaft (212) is rotatably installed inside each of the two sets of stabilizing frames (211). A gear (213) is fixedly installed on the outside of each of the two sets of rotating shafts (212). A toothed conveyor belt (214) is meshed on the outside of each of the two sets of gears (213). A motor (215) is fixedly installed inside the left stabilizer (211). The output end of the motor (215) is connected to the left rotating shaft (212).

9. The electronic component lead forming apparatus as described in claim 8, characterized in that: The adsorption assembly (22) includes several sets of upright plates (221) fixedly installed on the top of the toothed conveyor belt (214), and each set of upright plates (221) is fixedly provided with a pneumatic suction cup (222) on its front side. The airbag pressure block (1336) is fixedly installed on the back of the upright plate (221).

10. The electronic component lead forming apparatus as described in claim 9, characterized in that: Several sets of the upright plates (221) are spaced apart on the top of the toothed conveyor belt (214), and the distance between each two adjacent sets of the upright plates (221) is greater than the length of the grinding frame (132).

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