Semiconductor quartz product sand blasting device and sand blasting method

Abstract

The invention discloses a semiconductor quartz product sand blasting device and a sand blasting method.The semiconductor quartz product sand blasting device comprises a device base, an automatic rotating mechanism and a multi-angle adjusting type sand blasting mechanism are arranged in the device base, and the automatic rotating mechanism comprises a rotating driving device and a universal rotating device driven by the rotating driving device to rotate; the rotating device comprises a universal rotating disc and a limiting clamp arranged on the universal rotating disc in an adjusting mode, and the universal rotating disc and the horizontal plane are arranged in an inclined mode. According to the semiconductor quartz product sand blasting device, clamping and limiting of various quartz products are achieved, the sand blasting mechanism can be adjusted at any position in the space, and therefore sand blasting of the quartz products at any position can be achieved, the limitation that an existing sand blasting device can only conduct sand blasting on regular products of the same type is overcome, and the semiconductor quartz product sand blasting device is simple in structure and convenient to use. Operation is convenient, and production efficiency can be effectively improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device technology, and specifically to a sandblasting device and method for semiconductor quartz products. Background Technology

[0002] Currently, quartz products require sandblasting to achieve a certain roughness in many applications.

[0003] For example, in some etching and deposition processes, reaction byproducts from components such as quartz isolation rings used in semiconductor etching equipment can deposit as thin films on the inner walls of the chamber, including the quartz isolation rings. If the surfaces of components such as quartz isolation rings are very smooth, the adhesion of these films is usually poor; during the process, due to thermal stress or particle bombardment, the films are easily peeled off, generating particulate contaminants. Once these particles fall onto the wafer, they can cause fatal defects.

[0004] To achieve a certain surface roughness, two common methods are manual sandblasting and automatic sandblasting. Manual sandblasting suffers from low efficiency and poor stability. Automatic sandblasting is typically used for batch sandblasting of the same type of regular products. For example, Chinese patent document CN 121018413A describes an automatic sandblasting device for quartz rings, comprising: a frame; a conveying device mounted on the frame to drive the quartz rings in reciprocating motion; a rotating device mounted on the frame to drive the quartz rings to rotate around their own axis; a driving device mounted on the frame to drive the conveying device and the rotating device; a nozzle to spray material onto the quartz rings; a drying device for drying the quartz rings; and a unloading device for automatically unloading the processed quartz rings. Compared to existing technologies, this method provides a smoother and more continuous conveying of the quartz rings, without damaging the end face or outer surface of the quartz tube.

[0005] However, existing automated sandblasting devices are designed for sandblasting the exterior of regular products or products of specific shapes. For manufacturers that need to sandblast quartz products of different specifications and shapes, existing automated equipment cannot meet their production needs.

[0006] Therefore, it is necessary to design a device that can be used for all-around sandblasting of quartz products of various sizes and shapes. Summary of the Invention

[0007] The purpose of this invention is to address the problem that existing automatic sandblasting devices cannot meet the requirements of all-round sandblasting for quartz products of different specifications and shapes. This invention provides a sandblasting device and method for semiconductor quartz products that can meet the all-round sandblasting requirements for quartz products of different shapes and specifications, such as ring-shaped and irregularly shaped quartz products. Moreover, it is easy to operate, has a good sandblasting effect, and a simple structure.

[0008] The technical solution adopted by the present invention to achieve its purpose is: a sandblasting device for semiconductor quartz products, including a device base, an automatic rotating mechanism and a multi-angle adjustable sandblasting mechanism are provided inside the device base, the automatic rotating mechanism includes a rotating drive device and a universal rotating device driven by the rotating drive device, the rotating device includes a universal turntable and an adjustable limiting clamp set on the universal turntable, the universal turntable is set at an angle to the horizontal plane. This semiconductor quartz product sandblasting device features an automatic rotating mechanism and a multi-angle adjustable sandblasting mechanism within its base. The universal rotating device within the automatic rotating mechanism enables automatic sandblasting of various quartz rings and irregularly shaped quartz parts. The universal turntable allows for the installation of various types of limit clamps, thus achieving clamping and limiting of various quartz products. Since most quartz products are ring-shaped or irregularly shaped, the universal rotating device, i.e., the universal turntable, is set at a certain angle to the horizontal plane for easy installation and sandblasting position adjustment. This facilitates comprehensive sandblasting of all components of the quartz product. Furthermore, the multi-angle adjustable sandblasting mechanism allows for flexible and convenient adjustment, enabling sandblasting of any position on the quartz product. This overcomes the limitation of existing sandblasting devices that can only sandblast regular products of the same type. The device has a simple structure, is easy to operate, and effectively improves production efficiency.

[0009] Preferably, the universal turntable is provided with several adjustment mounting holes. These adjustment mounting holes allow for the installation of different limit clamps and facilitate the adjustment and positioning of these clamps. Furthermore, by installing balance adjustment components inside the adjustment mounting holes, the rotational stability of the universal turntable can be adjusted, thus achieving a universal design that can meet the clamping, limiting, and sandblasting requirements of various types of quartz products.

[0010] Preferably, the limiting fixture includes a limiting base plate and a radial limiting clamping block disposed on the limiting base plate. The limiting base plate has several adjusting positioning holes, and the radial limiting clamping block has a contour positioning structure. As a preferred embodiment, the limiting fixture can employ a limiting base plate and a radial limiting clamping block structure. The limiting base plate provides support for the quartz product to be sandblasted, while the radial limiting clamping block provides radial clamping and limiting of the quartz product. To achieve effective limiting of the quartz product, a contour positioning structure can be provided on the radial limiting clamping block. Using the same contour positioning structure for the same type of quartz product can greatly improve clamping efficiency.

[0011] Preferably, the limiting base plate is provided with a universal hole for inserting a limiting profile part or a leveling part. The universal hole on the limiting base plate allows for the installation of various limiting profile parts to limit irregularly shaped components on irregularly shaped parts, and also allows for the insertion of a leveling part for rotational leveling.

[0012] Preferably, the drive shaft in the rotary drive mechanism is set at a 45-degree angle to the horizontal bottom surface of the device base, and the drive shaft is vertically connected to the rotating device for driving. The universal turntable is set at a 45-degree angle to the horizontal plane. Alternatively, the drive shaft in the rotary drive mechanism can be set at an angle to the horizontal bottom surface of the device base, thereby achieving an inclined configuration of the rotating device.

[0013] Preferably, the sandblasting mechanism includes a sandblasting bracket disposed inside the device base, multiple multi-angle sandblasting adjustment mechanisms slidably adjusted on the sandblasting bracket, and sandblasting nozzles disposed on the multi-angle sandblasting adjustment mechanisms. The sandblasting mechanism mainly includes the sandblasting bracket disposed inside the device base, which is used to realize the horizontal displacement adjustment of the multi-angle sandblasting adjustment mechanisms. The multi-angle sandblasting adjustment mechanisms can realize multi-angle spatial adjustment, thereby driving the sandblasting nozzles thereon to adjust their spatial angle positions.

[0014] Preferably, the multi-angle sandblasting adjustment mechanism includes an adjustment slider slidably mounted on the sandblasting bracket and an angle adjustment rod connected to the adjustment slider. The multi-angle sandblasting adjustment mechanism mainly comprises an adjustment slider and an angle adjustment rod, thereby achieving horizontal displacement adjustment and spatial angle adjustment.

[0015] Preferably, the angle adjustment rod includes multiple adjustment rods that are rotatably connected to each other by a rotating adjustment member, and the sandblasting nozzle is connected to the free ends of the multiple adjustment rods by a hinge seat and can be adjusted at any angle of 360 degrees in space.

[0016] Preferably, a dust removal device is provided on the device base.

[0017] The technical solution adopted by the present invention to achieve its second objective is: a method for sandblasting semiconductor quartz products, which utilizes the aforementioned sandblasting device for semiconductor quartz products and includes the following steps: S1: Fix the quartz product to be sandblasted onto the universal turntable using the limiting clamp; S2: The semiconductor quartz product is rotated at an angle inclined to the horizontal plane by an automatic rotating mechanism; S3: Adjust the position and angle of the angle adjustment rod so that the sandblasting nozzle is aligned with the sandblasting area of ​​the quartz product to be sandblasted; S4: Turn on the sandblasting machine to perform sandblasting treatment on the quartz product to be sandblasted.

[0018] This sandblasting method for semiconductor quartz products can meet the sandblasting requirements of various parts of quartz products of different shapes, with reliable sandblasting quality and convenient and quick operation.

[0019] The beneficial effects of this invention are: the universal turntable of this semiconductor quartz product sandblasting device can realize the installation of various types of limiting clamps, thereby achieving clamping and limiting of various quartz products; the multi-angle adjustable sandblasting mechanism makes adjustment flexible and convenient, and can realize the adjustment of the sandblasting mechanism at any position in space, thereby realizing sandblasting of any position of the quartz product, solving the limitation of existing sandblasting devices that can only sandblast regular products of the same type; the structure is simple, the operation is convenient, and it can effectively improve production efficiency. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of a structure of the semiconductor quartz product sandblasting device of the present invention.

[0021] Figure 2 This is a schematic diagram of the semiconductor quartz product sandblasting device of the present invention from another angle.

[0022] Figure 3 This is a schematic diagram of the automatic rotating mechanism and sandblasting mechanism in this invention.

[0023] Figure 4 This is a structural schematic diagram of the automatic rotating mechanism and sandblasting mechanism in this invention from another angle.

[0024] Figure 5 This is a schematic diagram of an application structure of the semiconductor quartz product sandblasting device of the present invention.

[0025] Figure 6 This is a cross-sectional view of the application process of the semiconductor quartz product sandblasting device of the present invention.

[0026] Figure 7 This is a schematic diagram of the structure of the irregularly shaped part to be sandblasted in the embodiment.

[0027] Figure 8 This is a schematic diagram of a semiconductor quartz product sandblasting device in Embodiment 2 of the present invention.

[0028] Figure 9 This is a schematic diagram of an application structure of the semiconductor quartz product sandblasting device in Embodiment 2 of the present invention.

[0029] Figure 10 This is a schematic diagram of the application structure of the semiconductor quartz product sandblasting device in Embodiment 2 of the present invention from another angle.

[0030] In the figure: 1. Device base, 11. Device base opening, 12. Device base bottom plate, 13. Device base side plate, 14. Device base top plate, 15. Device cavity, 16. Dust removal device, 17. Controller. 2. Automatic rotation mechanism; 3. Sandblasting mechanism; 4. Rotary drive device; 41. Servo motor; 42. Belt drive assembly; 43. Drive shaft; 44. Drive shaft seat. 5. Rotating device; 51. Universal turntable; 511. Adjustment mounting hole; 52. Limiting clamp; 521. Limiting base plate; 522. Radial limiting clamping block; 523. Adjusting positioning hole; 53. Universal hole; 6. Sandblasting support frame; 7. Multi-angle sandblasting adjustment mechanism, 71. Adjustment slider, 72. Angle adjustment rod, 721. First adjustment rod, 722. Second adjustment rod, 723. Rotary adjustment component, 724. Third adjustment rod; 8. Sandblasting nozzle; 81. Hinge seat; 9. Quartz isolation ring to be sandblasted; 10. Quartz irregular part to be sandblasted; 101. Irregular foot; 102. Arc groove; 103. Waist-shaped groove. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Components not specifically described in the present invention are existing components or general components, and control methods not specifically described all adopt general existing technologies.

[0032] Example 1: exist Figure 1 , Figure 2 In the embodiment shown, a sandblasting device for semiconductor quartz products includes a device base 1, an automatic rotating mechanism 2 disposed inside the device base 1, and a multi-angle adjustable sandblasting mechanism 3.

[0033] The device base 1 adopts a protective cover structure. The device base 1 has a device base opening 11. The device base 1 includes a base plate 12, three side plates 13, and a top plate 14. The base plate 12, side plates 13, and top plate 14 together form a device cavity 15. A dust removal device 16 is installed on the top plate 14. The dust removal device can be a dust collector or similar device.

[0034] A controller 17 is provided outside the device base 1, which controls the automatic rotation mechanism 2 and the sandblasting mechanism 3.

[0035] See Figure 3 , Figure 4 The automatic rotating mechanism 2 includes a rotating drive device 4 and a general-purpose rotating device 5 driven by the rotating drive device 4. The rotating device 5 is set at an angle to the horizontal plane.

[0036] In this embodiment, the rotary drive device 4 is a drive motor, and the drive motor is a servo motor. The rotary drive device 4 includes a servo motor 41 and a belt drive assembly 42. The belt drive assembly 42 includes a drive pulley mounted on the output shaft of the servo motor, a drive shaft 43, and a driven pulley mounted on the drive shaft 43, with a drive belt wound around the drive pulley and the driven pulley.

[0037] The drive shaft 43 is mounted on the device base 1. Specifically, the drive shaft 43 is connected to the device base base 12 on the device base 1 via a drive shaft seat 44, and the axis of the drive shaft 43 is set at a certain angle α with the plane where the device base base 12 is located (see [reference]). Figure 6 ).

[0038] In this embodiment, the axis of the drive shaft 43 is set at a 45-degree angle to the plane of the device base plate. This angle between the drive shaft 43 and the device base plate 12 allows for an inclined arrangement of the universal turntable and the device base plate. This inclined structure facilitates the installation and positioning of various quartz ring products and irregularly shaped products, ensuring the center and center of gravity coincide. It also facilitates stable rotation via the universal turntable, thereby achieving uniform sandblasting. The inclined structure of the universal turntable facilitates sandblasting operations on various quartz products.

[0039] The rotating device 5 includes a universal turntable 51 and an adjustable limiting clamp 52 mounted on the universal turntable 51.

[0040] The universal turntable 51 is provided with several adjustment mounting holes 511.

[0041] The limiting clamp 52 adopts a replaceable structure, allowing for the replacement of different limiting clamps for different products to be sandblasted. In this embodiment, the limiting clamp 52 includes a limiting base plate 521 and a radial limiting clamping block 522 disposed on the limiting base plate 521. The radial limiting clamping block 522 can realize the clamping and positioning of the inner and outer diameters of the ring-shaped product. The limiting base plate 521 is used for connection and positioning with a universal turntable. Several adjusting positioning holes 523 are provided on the limiting base plate 521. During use, the product diameter can be selected to connect with the adjusting mounting hole 511 at a suitable position on the universal turntable 51, thereby realizing the clamping and positioning of the quartz ring-shaped product to be sandblasted.

[0042] The radial limiting clamping block 522 is equipped with a contour positioning structure. This contour positioning structure is designed according to the inner and outer diameters of the quartz ring product. For cylindrical inner and outer diameters, the contour positioning structure uses a planar or arc-shaped structure; for conical inner and outer diameters, it uses a wedge-shaped or other structure matching the conical shape. The radial limiting clamping block can be integrally formed with the limiting base plate or can be separate components connected as one unit via fasteners.

[0043] The sandblasting mechanism 3 includes a sandblasting bracket 6 disposed inside the device cavity 15 of the device base 1, multiple multi-angle sandblasting adjustment mechanisms 7 disposed on the sandblasting bracket in a sliding adjustment manner, and sandblasting nozzles 8 disposed on the multi-angle sandblasting adjustment mechanisms 7.

[0044] The sandblasting bracket 6 is horizontally mounted on the inner wall of the side plate of the device base. In this embodiment, the sandblasting bracket 6 adopts a rod structure.

[0045] The multi-angle sandblasting adjustment mechanism 7 is provided in at least one set. Each set of the multi-angle sandblasting adjustment mechanism 7 includes an adjustment slider 71 and an angle adjustment rod 72 connected to the adjustment slider 71. The angle adjustment rod 72 includes multiple rods that can rotate and adjust each other. The multiple angle adjustment rods 72 can achieve adjustment at any angle of 360 degrees in space.

[0046] In this embodiment, each set of angle adjusting rods 72 includes a first adjusting rod 721 and a second adjusting rod 722. The first adjusting rod 721 and the second adjusting rod 722 are connected by a rotating adjusting member 723 and can rotate relative to each other, thereby adjusting the included angle and relative position of the first adjusting rod 721 and the second adjusting rod 722. The sandblasting nozzle 8 is connected to the angle adjusting rod 72 via a hinge seat 81. Specifically, in this embodiment, the sandblasting nozzle 8 is rotatably connected to the end of the second adjusting rod 722.

[0047] The sandblasting nozzle 8 is connected to the sandblasting equipment via a pipeline. The sandblasting equipment is an existing sandblasting machine that can control the sandblasting speed and pressure. It is suitable for different types of sand and can meet the requirements of different sandblasting models for various quartz products.

[0048] The sandblasting nozzle 8 can be selected and configured according to the type of quartz product and sandblasting requirements. For example, it can be a single-hole sandblasting nozzle or a multi-hole sandblasting nozzle, etc.

[0049] In this embodiment, a method for sandblasting using a semiconductor quartz product as the quartz isolation ring 9 to be sandblasted is described, taking the semiconductor quartz product sandblasting device as an example. like Figure 5 , Figure 6 As shown, in this embodiment, the inner and outer surfaces are sandblasted in stages. In other embodiments, the inner and outer walls can be sandblasted simultaneously. In this case, multiple sandblasting mechanisms need to be set up. At the same time, the fixed position of the limiting clamp needs to be adjusted during the sandblasting process to achieve full sandblasting.

[0050] In this embodiment, during use, the inner surface is sandblasted first, followed by the outer surface sandblasting. The specific steps are as follows: Step 1: Fix the quartz isolation ring to be sandblasted onto the universal turntable using a limiting clamp. In this embodiment, the limiting clamp clamps and limits the outer wall of the quartz isolation ring.

[0051] Step 2: Start the automatic rotation mechanism. The automatic rotation mechanism drives the semiconductor quartz product, i.e. the quartz isolation ring to be sandblasted, to rotate at a suitable speed. The specific speed is selected and set according to the actual production needs. This is a routine operation and is not specifically limited. The quartz isolation ring to be sandblasted rotates at an angle inclined to the horizontal plane.

[0052] Step 3: Adjust the axial position and angle of the adjustment rod so that the sandblasting nozzle is aligned with the designated area on the inner wall of the quartz isolation ring 9 to be sandblasted.

[0053] Step 4: Select the appropriate grit and pressure, turn on the sandblasting machine, and sandblast the inner surface of the quartz isolation ring 9 to be sandblasted.

[0054] Step 5: After the inner surface is sandblasted, adjust the fixed position of the limiting clamp so that the limiting clamp matches the inner diameter of the quartz isolation ring after the inner surface is sandblasted.

[0055] Step 6: Start the automatic rotation mechanism, which will drive the semiconductor quartz product, i.e. the quartz isolation ring, to rotate at a suitable speed.

[0056] Step 7: Adjust the axial position and angle of the adjustment rod so that the sandblasting nozzle is aligned with the designated area on the outer wall of the quartz isolation ring to be sandblasted.

[0057] Step 8: Select the appropriate grit and pressure, turn on the sandblasting machine, and sandblast the outer surface of the quartz isolation ring to be sandblasted.

[0058] Example 2: like Figure 7 As shown, the semiconductor quartz product to be sandblasted is a quartz irregularly shaped part 10. The quartz irregularly shaped part 10 has two irregularly shaped feet 101, and an arc-shaped groove 102 is formed between the two irregularly shaped feet. The quartz irregularly shaped part 10 also has an oblong groove 103. The irregularly shaped part 10 needs to be fully sandblasted.

[0059] like Figure 8 , Figure 9 , Figure 10 As shown, a sandblasting device for semiconductor quartz products includes a device base 1, an automatic rotating mechanism 2 disposed inside the device base 1, and an adjustable sandblasting mechanism 3.

[0060] The device base 1 adopts a protective cover structure. The device base 1 has a device base opening 11. The device base 1 includes a base plate 12, three side plates 13, and a top plate 14. The base plate 12, side plates 13, and top plate 14 together form a device cavity 15. A dust removal device 16 is installed on the top plate 14. The dust removal device can be a dust collector or similar device.

[0061] A controller 17 is provided outside the device base 1, which controls the automatic rotation mechanism 2 and the sandblasting mechanism 3.

[0062] See Figure 3 , Figure 4 The automatic rotation mechanism 2 includes a rotation drive device 4 and a rotation device 5 connected to the rotation drive device 4.

[0063] In this embodiment, the rotary drive device 4 is a drive motor, and the drive motor is a servo motor. The rotary drive device 4 includes a servo motor 41 and a belt drive assembly 42. The belt drive assembly 42 includes a drive pulley mounted on the output shaft of the servo motor, a drive shaft 43, and a driven pulley mounted on the drive shaft 43, with a drive belt wound around the drive pulley and the driven pulley.

[0064] The drive shaft 43 is mounted on the device base 1. Specifically, the drive shaft 43 is connected to the device base base 12 on the device base 1 via a drive shaft seat 44, and the axis of the drive shaft 43 is set at a certain angle α with the plane where the device base base 12 is located (see [reference]). Figure 6 ).

[0065] In this embodiment, the axis of the drive shaft 43 is set at a 45-degree angle to the plane of the device base plate. This angle between the drive shaft 43 and the device base plate 12 allows for an inclined arrangement of the universal turntable and the device base plate. This inclined structure facilitates the installation and positioning of various quartz ring products and irregularly shaped products, ensuring the center and center of gravity coincide. It also facilitates stable rotation via the universal turntable, thereby achieving uniform sandblasting. The inclined structure of the universal turntable facilitates sandblasting operations on various quartz products.

[0066] The rotating device 5 includes a universal turntable 51 and an adjustable limiting clamp 52 mounted on the universal turntable 51.

[0067] The universal turntable 51 is provided with several adjustment mounting holes 511.

[0068] The limiting clamp 52 adopts a replaceable structure, allowing for the replacement of different limiting clamps for different products to be sandblasted. In this embodiment, the limiting clamp 52 includes a limiting base plate 521 and a radial limiting clamping block 522 disposed on the limiting base plate 521. The radial limiting clamping block 522 can realize the clamping and positioning of the inner and outer diameters of the ring-shaped product. The limiting base plate 521 is used for connection and positioning with a universal turntable. Several adjusting positioning holes 523 are provided on the limiting base plate 521. During use, the product diameter can be selected to connect with the adjusting mounting hole 511 at a suitable position on the universal turntable 51, thereby realizing the clamping and positioning of the quartz ring-shaped product to be sandblasted.

[0069] The radial limiting clamping block 522 is equipped with a contour positioning structure. This contour positioning structure is designed according to the inner and outer diameters of the quartz ring product. For cylindrical inner and outer diameters, the contour positioning structure uses a planar or arc-shaped structure; for conical inner and outer diameters, it uses a wedge-shaped or other structure matching the conical shape. The radial limiting clamping block can be integrally formed with the limiting base plate or can be separate components connected as one unit via fasteners.

[0070] In this embodiment, the limiting clamp 52 is further provided with a universal hole 53 for inserting limiting profile parts or leveling parts. Specifically, the universal hole is provided on the limiting base plate 521. In this embodiment, the universal hole 53 is a square hole, which is used to insert different limiting profile parts or leveling parts for different irregular quartz products such as irregular-shaped parts when installing them, thereby achieving clamping and positioning of the irregular-shaped parts or balancing adjustment after installation. The limiting profile part can be a hemispherical part, a groove-shaped part, etc.

[0071] The sandblasting mechanism 3 includes a sandblasting bracket 6 disposed inside the device cavity 15 of the device base 1, multiple multi-angle sandblasting adjustment mechanisms 7 disposed on the sandblasting bracket in a sliding adjustment manner, and sandblasting nozzles 8 disposed on the multi-angle sandblasting adjustment mechanisms 7.

[0072] The sandblasting bracket 6 is horizontally mounted on the inner wall of the side plate of the device base. In this embodiment, the sandblasting bracket 6 adopts a rod structure.

[0073] The multi-angle sandblasting adjustment mechanism 7 is provided in at least one set. Each set of the multi-angle sandblasting adjustment mechanism 7 includes an adjustment slider 71 and an angle adjustment rod 72 connected to the adjustment slider 71. The angle adjustment rod 72 includes multiple rods that can rotate and adjust each other. The multiple angle adjustment rods 72 can achieve adjustment at any angle of 360 degrees in space.

[0074] In this embodiment, each set of angle adjusting rods 72 includes a first adjusting rod 721, a second adjusting rod 722, and a third adjusting rod 724. The first adjusting rod 721, the second adjusting rod 722, and the third adjusting rod 724 are connected by a rotating adjusting member 723 and can rotate relative to each other, thereby adjusting the included angle and relative position of the first adjusting rod 721, the second adjusting rod 722, and the third adjusting rod 724. The sandblasting nozzle 8 is connected to the angle adjusting rod 72 via a hinge seat 81. Specifically, in this embodiment, the sandblasting nozzle 8 is rotatably connected to the end of the second adjusting rod 722.

[0075] The sandblasting nozzle 8 is connected to the sandblasting equipment via a pipeline. The sandblasting equipment is an existing sandblasting machine that can control the sandblasting speed and pressure. It is suitable for different types of sand and can meet the requirements of different sandblasting models for various quartz products.

[0076] The sandblasting nozzle 8 can be selected and configured according to the type of quartz product and sandblasting requirements. For example, it can be a single-hole sandblasting nozzle or a multi-hole sandblasting nozzle, etc.

[0077] In this embodiment, taking the semiconductor quartz product to be sandblasted as a quartz isolation ring as an example, the method of sandblasting using the sandblasting device for this semiconductor quartz product is described. See Figures 8 to 10 In this embodiment, the upper surface and the irregular foot are sandblasted in stages with the lower surface. During the sandblasting process, the fixed position of the limiting clamp needs to be adjusted to achieve full sandblasting.

[0078] The specific steps are as follows: Step 1: Fix the quartz irregular part to be sandblasted onto the universal turntable using a limiting clamp, and insert a limiting anti-formation component into the limiting clamp at the corresponding position of the irregular foot arc groove 102 to clamp and limit the irregular foot of the quartz irregular part; select a limiting clamp with the corresponding structure at other positions to position the quartz irregular part on the side.

[0079] Step 2: Start the automatic rotation mechanism. The automatic rotation mechanism will drive the quartz part to be sandblasted to rotate at a suitable speed. The specific speed can be selected and set according to the actual production needs. This is a routine operation and is not specifically limited. The quartz part to be sandblasted will rotate at an angle inclined to the horizontal plane.

[0080] Step 3: Adjust the axial position and angle of the adjustment rod so that the sandblasting nozzle is aligned with the designated area of ​​the quartz irregular part to be sandblasted.

[0081] Step 4: Select the appropriate grit and pressure, turn on the sandblasting machine, and sandblast the upper surface and irregular feet of the quartz part to be sandblasted.

[0082] Step 5: After the upper surface and irregular foot are sandblasted, the reverse side of the quartz irregular part to be sandblasted is fixed by setting a limiting clamp in the waist groove 103, and the fixing position of the limiting clamp in other positions is adjusted.

[0083] Step 6: Start the automatic rotation mechanism, which will drive the quartz shaped part to be sandblasted to rotate at a suitable speed.

[0084] Step 7: Adjust the axial position and angle of the adjustment rod so that the sandblasting nozzle is aligned with the designated area of ​​the quartz irregular part to be sandblasted.

[0085] Step 8: Select the appropriate grit and pressure, turn on the sandblasting machine, and perform sandblasting treatment on the quartz irregular part to be sandblasted.

[0086] The semiconductor quartz product sandblasting device and method described in the above embodiments solve the problems of large fluctuations in surface roughness, poor stability, and low efficiency associated with manual sandblasting. They also address the issue of poor versatility of existing automatic sandblasting devices, which cannot meet the sandblasting needs of various specifications and irregularly shaped quartz products. This semiconductor quartz product sandblasting device, through stable equipment rotation and appropriate sandblasting pressure, can obtain more stable surface roughness quality data, improving work efficiency. Furthermore, the inclusion of a protective cover-type base and a dust removal device enhances the working environment and prevents dust hazards to human health.

Claims

1. A sandblasting device for semiconductor quartz products, comprising a device base (1), characterized in that: An automatic rotating mechanism (2) and a multi-angle adjustable sandblasting mechanism (3) are provided inside the device base (1). The automatic rotating mechanism (2) includes a rotating drive device (4) and a universal rotating device (5) driven by the rotating drive device (4). The rotating device (5) includes a universal turntable (51) and an adjustable limit clamp (52) set on the universal turntable (51). The universal turntable (51) is set at an angle to the horizontal plane.

2. The semiconductor quartz product sandblasting device according to claim 1, characterized in that: The universal turntable (51) is provided with several adjustment mounting holes (511).

3. The semiconductor quartz product sandblasting device according to claim 2, characterized in that: The limiting clamp (52) includes a limiting base plate (521) and a radial limiting clamping block (522) disposed on the limiting base plate (521). A plurality of adjusting positioning holes (523) are provided on the limiting plate (521), and a contour positioning structure is provided on the radial limiting clamping block (522).

4. The semiconductor quartz product sandblasting device according to claim 3, characterized in that: The limiting base plate (521) is provided with a universal hole (53) for inserting the limiting profile or leveling part.

5. The semiconductor quartz product sandblasting apparatus according to any one of claims 1 to 4, characterized in that: The drive shaft (43) in the rotary drive mechanism (4) is set at a 45-degree angle to the horizontal bottom surface of the device base (1). The drive shaft (43) is vertically connected to the rotary device (5) for driving. The universal turntable (51) is set at a 45-degree angle to the horizontal plane.

6. The semiconductor quartz product sandblasting apparatus according to any one of claims 1 to 4, characterized in that: The sandblasting mechanism (3) includes a sandblasting bracket (6) installed inside the device base (1), multiple multi-angle sandblasting adjustment mechanisms (7) installed on the sandblasting bracket (6) in a sliding adjustment manner, and sandblasting nozzles (8) installed on the multi-angle sandblasting adjustment mechanisms (7).

7. The semiconductor quartz product sandblasting device according to claim 5, characterized in that: The multi-angle sandblasting adjustment mechanism (7) includes an adjustment slider (71) slidably disposed on the sandblasting bracket (6) and an angle adjustment rod (72) connected to the adjustment slider (71).

8. The semiconductor quartz product sandblasting device according to claim 7, characterized in that: The angle adjustment rod (72) includes multiple adjustment rods that are rotatably connected to each other by a rotating adjustment member (723). The sandblasting nozzle (8) is connected to the free end of the multiple adjustment rods by a hinge seat (81) and can be adjusted at any angle in space of 360 degrees.

9. The semiconductor quartz product sandblasting apparatus according to any one of claims 1 to 4, characterized in that: A dust removal device (16) is provided on the device base (1).

10. A method for sandblasting semiconductor quartz products, characterized in that: The device, utilizing the semiconductor quartz product sandblasting apparatus according to any one of claims 1 to 9, includes the following steps: S1: Fix the quartz product to be sandblasted onto the universal turntable using the limiting clamp; S2: The semiconductor quartz product is rotated at an angle inclined to the horizontal plane by an automatic rotating mechanism; S3: Adjust the position and angle of the angle adjustment rod so that the sandblasting nozzle is aligned with the sandblasting area of ​​the quartz product to be sandblasted; S4: Turn on the sandblasting machine to perform sandblasting treatment on the quartz product to be sandblasted.

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