Chip packaging cleaning agent and preparation method and application thereof

Abstract

The invention relates to the technical field of chip cleaning, in particular to a chip packaging cleaning agent as well as a preparation method and application of the chip packaging cleaning agent. The cleaning agent comprises the following components: 25-50% of a normal-temperature active solvent, 4-8% of a composite saponifying agent, 18-32% of a normal-temperature foam-free emulsifier, 3-7% of a pH regulator, 0.8-2% of a corrosion inhibitor, 0.5-2% of a functional dispersant, and the balance of deionized water. The chip packaging cleaning agent prepared by the invention has an excellent cleaning effect, is green and environment-friendly, and can avoid oxidation and corrosion of a base material.

Description

Technical Field

[0001] This invention relates to the field of chip cleaning technology, specifically to a chip packaging cleaning agent, its preparation method, and its application. Background Technology

[0002] In current chip packaging processes, solder paste, flux, and other auxiliary materials are used, which easily generate contaminants such as rosin residue, solder paste residue, and flux resin acid. Current cleaning solutions mainly fall into two categories: one is high-temperature cleaning agents (50-80℃), which rely on high temperatures to enhance solvent activity and remove residues. However, high temperatures can easily cause deformation of the thermal chip packaging colloid and lead bonding failure. Furthermore, products containing phosphorus and nitrogen-based additives are prone to releasing harmful volatile substances at high temperatures, polluting the environment. The other is ordinary room-temperature cleaning agents, which often use a single solvent combined with conventional emulsifiers. These have problems such as weak rosin residue dissolving ability (removal rate generally below 75%) and insufficient protection of metal substrates such as copper and tin (prone to oxidation, discoloration, and quality loss), making it difficult to meet the cleaning requirements of precision chip packaging. In addition, both types of cleaning agents have limitations in process compatibility; high-temperature types are energy-intensive, while room-temperature types are ineffective, failing to simultaneously meet the multiple requirements of high efficiency, environmental protection, substrate protection, and low-temperature compatibility.

[0003] In the prior art, patent CN112266832B discloses a semiconductor chip cleaning agent, its preparation method, and its application. This agent comprises a wetting and stripping composition consisting of a wetting and stripping agent and a perfluorinated terminal polyoxyethylene ether. It may also contain a penetrant, solubilizer, composite functional agent, nitrogen-containing complexing agent, polyol amine compound, and ultrapure water. This cleaning agent improves its effectiveness through a preferred combination and synergy of a wetting and stripping composition containing specific components, and the selection of sodium 1,4-di(2-ethylhexyl)succinate sulfonate as a penetrant, methyl 9,10-dihydroxystearate as a composite functional agent, and a nitrogen-containing complexing agent. However, the perfluorinated terminal polyoxyethylene ether in this system is difficult to degrade, and the nitrogen-containing complexing agent and polyol amine compound may cause slight corrosion to the aluminum layer and metal solder joints on the chip surface, affecting the chip's lifespan and reliability.

[0004] Patent CN116496851B discloses a semiconductor chip cleaning agent and its preparation method, comprising the following raw materials in the indicated mass percentages: 3-6% sulfonic acid-based fluorinated surfactant, 6-10% nonionic surfactant, 0.2-1% complexing agent, 0-3% ethanol, 3-8% diethylene glycol monobutyl ether, and the balance being deionized water. The preparation involves adding the sulfonic acid-based fluorinated surfactant and nonionic surfactant to deionized water and stirring; then adding ethanol and diethylene glycol monobutyl ether and stirring; finally adding the complexing agent and stirring again. This cleaning agent can effectively remove solder paste, flux residue, etc., from semiconductor chips, leaving minimal residue on the chip surface after cleaning. However, the sulfonic acid-based fluorinated surfactant has potential toxicity and is difficult to degrade.

[0005] Therefore, there is an urgent need in the market for a green and environmentally friendly chip packaging cleaning agent that can prevent substrate oxidation and corrosion. Summary of the Invention

[0006] In view of the problems existing in the prior art, the purpose of this invention is to obtain a chip packaging cleaning agent that has excellent cleaning effect under room temperature conditions, is green and environmentally friendly, and can avoid substrate oxidation and corrosion.

[0007] To achieve the above objectives, the technical solution adopted by the present invention is as follows: The first aspect of the present invention provides a chip packaging cleaning agent, which, by weight percentage (100%), comprises the following components: 25-50% room temperature active solvent, 4-8% composite saponifying agent, 18-32% room temperature non-foaming emulsifier, 3-7% pH adjuster, 0.8-2% corrosion inhibitor, 0.5-2% functional dispersant, and the balance being deionized water.

[0008] This application presents a chip packaging cleaning agent obtained by mixing a room-temperature active solvent, a composite saponifying agent, a room-temperature non-foaming emulsifier, a pH adjuster, a corrosion inhibitor, a functional dispersant, and deionized water. This agent exhibits excellent stability, superior cleaning performance, and the ability to prevent substrate oxidation and corrosion. Furthermore, the preparation method is simple and environmentally friendly. The room-temperature active solvent, composite saponifying agent, and functional dispersant work synergistically to rapidly dissolve rosin acid and resin polymers without heating. The corrosion inhibitor provides strong protection for copper and tin substrates. The cleaning agent prepared in this application requires no heating equipment during use, reducing energy consumption compared to high-temperature cleaning agents. The formulation is phosphorus- and nitrogen-free, with low solvent volatility and no harmful gas release. The preparation method is simple and easy to control, and the application can be directly adapted to existing production lines without equipment modification, making it suitable for industrial mass production. This cleaning agent can also be used for cleaning residual components in the packaging of thermistor electronic components (such as flexible circuit boards and microsensors).

[0009] In some embodiments, the room-temperature active solvent is one or more of ethylene glycol monobutyl ether, ethylene glycol monomethyl ether, propylene glycol ethyl ether, and propylene glycol methyl ether.

[0010] Preferably, the room-temperature active solvent is a mixture of ethylene glycol monobutyl ether and propylene glycol methyl ether, with a mass ratio of 1:(1.2-1.8).

[0011] In some embodiments, the composite saponifying agent is a mixture of sodium hydroxide and sodium bicarbonate, with a mass ratio of 1:(0.8-1.2).

[0012] In some embodiments, the room-temperature non-foaming emulsifier is a compound of isotridecyl alcohol polyoxyethylene ether and polyether-modified silicone oil.

[0013] Isotridecyl alcohol polyoxyethylene ether has a special emulsifying effect on silicone oils and greases that may be used in chip manufacturing. It can penetrate into the microscopic structure gaps, remove particles and organic contaminants, and reduce the surface tension of the cleaning solution, allowing it to uniformly cover the chip surface. Polyether-modified silicone oil has extremely low surface tension, which helps the cleaning solution spread quickly and prevents watermarks. The combination of the two has a synergistic effect: isotridecyl alcohol polyoxyethylene ether has a strong cleaning effect, while polyether-modified silicone oil ensures a smooth, foam-free cleaning process and easy rinsing.

[0014] In some embodiments, the mass ratio of the isomeric tridecyl alcohol polyoxyethylene ether to the polyether-modified silicone oil is (1.5-2.5):1.

[0015] In some embodiments, the corrosion inhibitor is one or more of benzotriazole, methylbenzotriazole, carboxybenzotriazole, and hydroxybenzotriazole.

[0016] Preferably, the corrosion inhibitor is a compound of benzotriazole and methylbenzotriazole.

[0017] Preferably, the mass ratio of benzotriazole to methylbenzotriazole is 1:(0.3-0.7).

[0018] In some embodiments, the method for preparing the functional dispersant includes the following steps: A1. Add 1,5-dimethyl-2-phenyl-4-amino-3-pyrazolone, acrylic acid, catalyst and polymerization inhibitor to toluene, heat to 110-120℃ and react for 4-8 hours, cool to room temperature, add desiccant to dry, filter and rotary evaporate to obtain the compound; A2. Dissolve the compound obtained in step A1 in isopropanol to obtain a mixture. Add the mixture to deionized water, heat to 75-80℃, and add acrylic acid and initiator aqueous solution dropwise. The addition is completed in 3-4 hours. Continue the reaction for 3-4 hours, cool to 30-45℃, add sodium hydroxide aqueous solution with a concentration of 25-35wt%, adjust the pH to 7-8, rotary evaporate, and dry at 55-65℃ to obtain the functional dispersant.

[0019] Preferably, the catalyst is p-toluenesulfonic acid.

[0020] Preferably, the polymerization inhibitor is hydroquinone.

[0021] Preferably, the initiator is potassium persulfate.

[0022] Preferably, the mass ratio of acrylic acid to catalyst in step A1 is 1:(0.01-0.025).

[0023] Preferably, the mass ratio of acrylic acid and polymerization inhibitor in step A1 is 1:(0.001-0.005).

[0024] Preferably, the ratio of acrylic acid and toluene in step A1 is 1g:(4-8)ml.

[0025] Preferably, the ratio of acrylic acid and deionized water in step A2 is 1g:(3-7)ml.

[0026] This application prepares a compound by reacting 1,5-dimethyl-2-phenyl-4-amino-3-pyrazolone with acrylic acid, then mixes it with isopropanol and polymerizes it with acrylic acid to obtain a functional dispersant. Applying this dispersant to the preparation of cleaning agents can improve the cleaning effect on rosin residues in solder paste and flux, as well as the storage stability of the cleaning agent. It also prevents substrate oxidation and corrosion. This is likely because, firstly, isopropanol can act as both a solvent and a chain transfer agent in the polymerization reaction. As a solvent, it can enhance the reaction efficiency between the compound and acrylic acid, thus improving the cleaning effect of the functional dispersant on rosin residues. Besides its effectiveness, as a chain transfer agent, it can control the molecular weight of polymers, preventing the formation of excessively high molecular weight or cross-linked products. This results in a functional dispersant with moderate molecular weight, narrow distribution, and good water solubility, promoting the dispersion of room-temperature active solvents and corrosion inhibitors in cleaning agents, thus improving the cleaning effect. On the other hand, the functional dispersant contains double bonds, benzene rings, amino groups, and amide groups. The double bonds and benzene rings can interact with the double bonds and carboxyl groups in rosin residues through π-π conjugation and hydrogen bonding. At the same time, the amino and amide groups also have certain anti-rust properties, which can produce additional synergistic effects with corrosion inhibitors, reducing the oxidation and corrosion of the chip substrate by the cleaning agent.

[0027] In some embodiments, the mass ratio of 1,5-dimethyl-2-phenyl-4-amino-3-pyrazolone to acrylic acid in step A1 is 1:(0.36-0.4).

[0028] In some embodiments, the mass ratio of the compound, isopropanol and acrylic acid in step A2 is (0.08-0.12):(0.15-0.2):1.

[0029] The second aspect of this invention provides a method for preparing a chip packaging cleaning agent, comprising the following steps: adding deionized water to a reaction vessel, adding a pH adjuster while stirring, stirring for 5-8 minutes, slowly adding a composite saponifying agent at a feeding rate of 1-2 g / s, stirring for 10-15 minutes, adding a room temperature active solvent at 23-27°C, stirring at 600-800 r / min for 15-20 minutes, reducing the stirring speed to 400-500 r / min, adding a room temperature non-foaming emulsifier and a corrosion inhibitor in sequence, stirring for 8-12 minutes each, and finally stirring for 20-25 minutes, filtering for later use, thus obtaining the cleaning agent.

[0030] A third aspect of this invention provides a method for applying a chip packaging cleaning agent, comprising the following steps: Step A: Rinse the chip package with deionized water and drain. Step B: Pour the cleaning agent into the cleaning tank, immerse the chip, and clean it at room temperature for 10-15 minutes under ultrasonic conditions with a power of 200-300W and a frequency of 35-45kHz. Step C: Rinse with deionized water 2-3 times, 3-7 minutes each time; Step D: Dry in a well-ventilated environment at room temperature for 30-40 minutes.

[0031] Compared with the prior art, the present invention has the following beneficial effects: (1) The cleaning agent obtained by mixing room temperature active solvent, composite saponifier, room temperature non-foaming emulsifier, pH adjuster, corrosion inhibitor, functional dispersant and deionized water has excellent stability, excellent cleaning effect and avoids substrate oxidation and corrosion. The preparation method is simple and environmentally friendly.

[0032] (2) The present invention prepares a compound by reacting 1,5-dimethyl-2-phenyl-4-amino-3-pyrazolone with acrylic acid, and then mixes it with isopropanol and polymerizes it with acrylic acid to obtain a functional dispersant. Isopropanol can act as both a solvent and a chain transfer agent in the polymerization reaction, which can improve the reaction efficiency between the compound and acrylic acid, which is beneficial to improving the removal effect of the functional dispersant on rosin residues. It can also regulate the polymerization reaction to improve the water solubility of the functional dispersant, which is beneficial to promoting the dispersion of room temperature active solvents and corrosion inhibitors in the cleaning agent, and further improving the cleaning effect of the cleaning agent.

[0033] (3) The functional dispersant prepared by the present invention contains double bonds, benzene rings, amino groups and amide groups. The double bonds and benzene rings can interact with the double bonds and carboxyl groups in rosin residues through π-π conjugation, hydrogen bonding and other interactions. At the same time, the amino and amide groups also have certain anti-rust properties and can produce additional synergistic effects with corrosion inhibitors, reducing the oxidation and corrosion of the chip substrate by the cleaning agent. Detailed Implementation

[0034] The present invention will be described below with reference to specific embodiments. It should be noted that the following embodiments are examples of the present invention and are used only to illustrate the invention, not to limit it. Other combinations and various modifications within the scope of the present invention can be made without departing from its spirit or scope.

[0035] In the following examples and comparative examples, except for the functional dispersant, all other compounds and related reagents used were commercially available, including the isotridecyl alcohol polyoxyethylene ether E-1310 and the polyether-modified silicone oil Dow Corning OFX-3667.

[0036] Preparation Example 1 The preparation method of functional dispersant-1 includes the following steps: A1. 10g of 1,5-dimethyl-2-phenyl-4-amino-3-pyrazolone, 3.8g of acrylic acid, 0.2g of p-toluenesulfonic acid, and 0.03g of hydroquinone were added to 50g of toluene. The mixture was heated to 115℃ and reacted for 6h. After cooling to room temperature, the mixture was washed twice each with 7wt% sodium carbonate aqueous solution, deionized water, and saturated brine. After drying with anhydrous magnesium sulfate, the mixture was filtered and concentrated using a rotary evaporator at 40℃ to obtain the compound. A2. Dissolve 1g of the compound obtained in step A1 in 1.7g of isopropanol to obtain a mixture. Add the mixture to 50ml of deionized water, heat to 77℃, and add 10g of acrylic acid and 12ml of 0.1mol / L potassium persulfate aqueous solution dropwise. The addition is completed in 3h, and the reaction continues for 4h. Cool to 40℃, add 30wt% sodium hydroxide aqueous solution, adjust the pH to 7, rotary evaporate at 45℃, and dry at 60℃ to obtain functional dispersant-1.

[0037] Preparation Example 2 The preparation method of functional dispersant-2 is the same as that of preparation example 1, except that the amount of acrylic acid added in step A1 is 3.2g.

[0038] Preparation Example 3 The preparation method of functional dispersant-3 is the same as that of preparation example 1, except that the amount of compound added in step A2 is 1.5g.

[0039] Preparation Example 4 The preparation method of functional dispersant-4 is the same as that of preparation example 1, except that the amount of isopropanol added in step A2 is 2.5g.

[0040] Preparation Example 5 The preparation method of sodium polyacrylate dispersant includes the following steps: 1.7g isopropanol is added to 50ml deionized water, the temperature is raised to 77℃, 10g acrylic acid and 12ml 0.1mol / L potassium persulfate aqueous solution are added dropwise, the addition is completed in 3h, the reaction continues for 4h, the temperature is lowered to 40℃, a 30wt% sodium hydroxide aqueous solution is added, the pH is adjusted to 7, rotary evaporated at 45℃, and dried at 60℃ to obtain sodium polyacrylate dispersant.

[0041] Example 1 A chip packaging cleaning agent, by weight percentage, comprises the following components: 35% room temperature active solvent, 6% composite saponifying agent, 25% room temperature non-foaming emulsifier, 5% sodium hydroxide, 1.5% corrosion inhibitor, 1.5% functional dispersant, and the balance being deionized water.

[0042] The room-temperature active solvent is a mixture of ethylene glycol monobutyl ether and propylene glycol methyl ether, with a mass ratio of 1:1.6.

[0043] The compound saponifying agent is a mixture of sodium hydroxide and sodium bicarbonate in a mass ratio of 1:1.

[0044] The room-temperature non-foaming emulsifier is a compound of isomeric tridecyl alcohol polyoxyethylene ether and polyether-modified silicone oil, with a mass ratio of 2:1.

[0045] The corrosion inhibitor is a compound of benzotriazole and methylbenzotriazole, with a mass ratio of 1:0.5.

[0046] The preparation method of the chip packaging cleaning agent in this embodiment includes the following steps: adding deionized water to a reaction vessel, adding sodium hydroxide while stirring, stirring for 6 minutes, slowly adding a composite saponifying agent at a feeding rate of 1.5 g / s, stirring for 12 minutes, adding a room temperature active solvent at 25°C, stirring at 700 r / min for 17 minutes, reducing the stirring speed to 450 r / min, adding a room temperature non-foaming emulsifier and a corrosion inhibitor in sequence, stirring for 10 minutes each, and finally stirring for 22 minutes, filtering and storing for later use, thus obtaining the cleaning agent.

[0047] Example 2 A chip packaging cleaning agent, by weight percentage, comprises the following components: 25% room temperature active solvent, 4% composite saponifying agent, 18% room temperature non-foaming emulsifier, 3% sodium hydroxide, 0.8% corrosion inhibitor, 0.5% functional dispersant, and the balance being deionized water.

[0048] The room-temperature active solvent is a mixture of ethylene glycol monobutyl ether and propylene glycol methyl ether, with a mass ratio of 1:1.2.

[0049] The compound saponifying agent is a mixture of sodium hydroxide and sodium bicarbonate, with a mass ratio of 1:0.8.

[0050] The room-temperature non-foaming emulsifier is a compound of isomeric tridecyl alcohol polyoxyethylene ether and polyether-modified silicone oil, with a mass ratio of 1.5:1.

[0051] The corrosion inhibitor is a compound of benzotriazole and methylbenzotriazole, with a mass ratio of 1:0.3.

[0052] The preparation method of the chip packaging cleaning agent in this embodiment includes the following steps: adding deionized water to a reaction vessel, adding sodium hydroxide while stirring, stirring for 5 minutes, slowly adding a composite saponifying agent at a feeding rate of 1 g / s, stirring for 15 minutes, adding a room temperature active solvent at 23°C, stirring at 600 r / min for 20 minutes, reducing the stirring speed to 400 r / min, adding a room temperature non-foaming emulsifier and a corrosion inhibitor in sequence, stirring for 12 minutes each, and finally stirring for 25 minutes. Filtering is then performed for later use to obtain the final product.

[0053] Example 3 A chip packaging cleaning agent, by weight percentage, comprises the following components: 50% room temperature active solvent, 8% composite saponifying agent, 32% room temperature non-foaming emulsifier, 7% sodium hydroxide, 2% corrosion inhibitor, 2% functional dispersant, and the balance being deionized water.

[0054] The room-temperature active solvent is a mixture of ethylene glycol monobutyl ether and propylene glycol methyl ether, with a mass ratio of 1:1.8.

[0055] The compound saponifying agent is a mixture of sodium hydroxide and sodium bicarbonate, with a mass ratio of 1:1.2.

[0056] The room-temperature non-foaming emulsifier is a compound of isomeric tridecyl alcohol polyoxyethylene ether and polyether-modified silicone oil, with a mass ratio of 2.5:1.

[0057] The corrosion inhibitor is a compound of benzotriazole and methylbenzotriazole, with a mass ratio of 1:0.7.

[0058] The preparation method of the chip packaging cleaning agent in this embodiment includes the following steps: adding deionized water to a reaction vessel, adding sodium hydroxide while stirring, stirring for 8 minutes, slowly adding a composite saponifying agent at a feeding rate of 2 g / s, stirring for 10 minutes, adding a room temperature active solvent at 27°C, stirring at 800 r / min for 15 minutes, reducing the stirring speed to 500 r / min, adding a room temperature non-foaming emulsifier and a corrosion inhibitor in sequence, stirring for 8 minutes each, and finally stirring for 20 minutes. Filtering is then performed for later use to obtain the final product.

[0059] Example 4 A chip packaging cleaning agent and its preparation method are disclosed. The specific implementation method is the same as that in Example 1, except that functional dispersant-1 is replaced with functional dispersant-2 in an equal amount.

[0060] Example 5 A chip packaging cleaning agent and its preparation method are described. The specific implementation method is the same as that in Example 1, except that functional dispersant-1 is replaced with functional dispersant-3 in equal amounts.

[0061] Example 6 A chip packaging cleaning agent and its preparation method are disclosed. The specific implementation method is the same as that in Example 1, except that functional dispersant-1 is replaced with functional dispersant-4 in an equal amount.

[0062] Example 7 A chip packaging cleaning agent and its preparation method are described. The specific implementation method is the same as that in Example 1, except that the room temperature non-foaming emulsifier is a compound of isomeric tridecyl alcohol polyoxyethylene ether and polyether modified silicone oil, with a mass ratio of 3.5:1.

[0063] Example 8 A chip packaging cleaning agent and its preparation method are disclosed. The specific implementation method is the same as that in Example 1, except that the room temperature non-foaming emulsifier is isomeric tridecyl alcohol polyoxyethylene ether.

[0064] Comparative Example 1 A chip packaging cleaning agent and its preparation method are disclosed. The specific implementation method is the same as that in Example 1, except that the functional dispersant-1 is replaced with an equal amount of sodium polyacrylate dispersant.

[0065] Performance testing The chip packaging cleaning agents obtained in the above embodiments and comparative examples were tested: (1) Sample preparation Step A: Rinse the chip package coated with a measured amount of water-white rosin (model AS-01, purchased from Jining Tangyi Chemical Co., Ltd.) with deionized water and drain. Step B: Pour the chip packaging cleaning agent into the cleaning tank, immerse the chips, and clean at room temperature for 12 minutes under ultrasonic conditions of 250W power and 40kHz frequency. Step C: Rinse three times with deionized water, three minutes each time; Step D: Dry at room temperature under ventilation for 35 minutes to obtain the cleaned samples.

[0066] (2) Test method 1. Cleaning effect: The rosin residue on each cleaned sample was measured according to the method in IPC-TM-650 2.3.27, and the rosin removal rate was calculated using the following formula: Removal rate (%) = (1 - Amount of rosin remaining after cleaning ÷ Amount of rosin initially applied) × 100%.

[0067] 2. Substrate Protection Effect: ICP-MS (Inductively Coupled Plasma Mass Spectrometry) was used to test the corrosion performance of the chip packaging cleaning agent on the metal. The specific test method was as follows: a 2×2cm substrate was prepared... 2The wafer (with a metal layer: Al-Cu) was placed on a mini microcontroller rotating table, and the cleaning agent was continuously sprayed at 40°C for 10 minutes using a water bath. Then, the film thickness of the wafer before and after spraying with the microcontroller was tested using a four-point probe instrument, thereby examining the corrosion rate of metal by different cleaning agents.

[0068] The test results are shown in Table 1: Table 1

[0069] As shown in Table 1, the chip encapsulation cleaning agents in Examples 1-3 of this invention exhibit excellent cleaning and substrate protection effects. A comparison between Example 4 and Example 1 reveals that altering the ratio of acrylic acid to 1,5-dimethyl-2-phenyl-4-amino-3-pyrazolone may result in unreacted 1,5-dimethyl-2-phenyl-4-amino-3-pyrazolone remaining in the compound, affecting the polymerization reaction of acrylic acid in step A2 and thus impairing the cleaning and protective effects of the cleaning agent. A comparison between Example 5 and Example 1 shows that altering the ratio of the compound to acrylic acid in step A2 may increase the number of hydrophobic segments on the functional dispersant, affecting its dispersing performance and thus reducing the cleaning and protective effects of the cleaning agent. The cleaning effect deteriorates; a comparison between Example 6 and Example 1 shows that changing the ratio of isopropanol and acrylic acid in step A2 may result in a smaller molecular weight of the functional dispersant, affecting its dispersibility and leading to a decrease in the cleaning effect and the protective effect on the substrate of the cleaning agent; a comparison between Example 7 and Example 1 shows that changing the ratio of isotridecyl alcohol polyoxyethylene ether and polyether-modified silicone oil worsens the cleaning effect of the cleaning agent; a comparison between Example 8 and Example 1 shows that changing the room temperature non-foaming emulsifier to isotridecyl alcohol polyoxyethylene ether worsens the cleaning effect of the cleaning agent; a comparison between Comparative Example 1 and Example 1 shows that the conventional cleaning agent obtained by using sodium polyacrylate as a dispersant has poor cleaning effect and poor protection effect on the substrate.

[0070] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it. They should not be used to limit the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A chip packaging cleaning agent, characterized in that, By weight percentage (100%), it contains the following components: 25-50% room temperature active solvent, 4-8% compound saponifying agent, 18-32% room temperature non-foaming emulsifier, 3-7% pH adjuster, 0.8-2% corrosion inhibitor, 0.5-2% functional dispersant, and the balance is deionized water.

2. The chip packaging cleaning agent according to claim 1, characterized in that, The room-temperature active solvent is one or more of ethylene glycol monobutyl ether, ethylene glycol monomethyl ether, propylene glycol ethyl ether, and propylene glycol methyl ether.

3. The chip packaging cleaning agent according to claim 1, characterized in that, The composite saponifying agent is a mixture of sodium hydroxide and sodium bicarbonate, with a mass ratio of 1:(0.8-1.2).

4. The chip packaging cleaning agent according to claim 1, characterized in that, The room-temperature non-foaming emulsifier is a compound of isomeric tridecyl alcohol polyoxyethylene ether and polyether-modified silicone oil.

5. The chip packaging cleaning agent according to claim 1, characterized in that, The corrosion inhibitor is one or more of benzotriazole, methylbenzotriazole, carboxybenzotriazole, and hydroxybenzotriazole.

6. The chip packaging cleaning agent according to claim 1, characterized in that, The preparation method of the functional dispersant includes the following steps: A1. 1,5-Dimethyl-2-phenyl-4-amino-3-pyrazolone, acrylic acid, catalyst and polymerization inhibitor were added to toluene, heated to 110-120℃ and reacted for 4-8 hours, cooled to room temperature, washed, dried with desiccant, filtered and rotary evaporated to obtain the compound. A2. Dissolve the compound obtained in step A1 in isopropanol to obtain a mixture. Add the mixture to deionized water, heat to 75-80℃, and add acrylic acid and initiator aqueous solution dropwise. The addition is completed in 3-4 hours. Continue the reaction for 3-4 hours, cool to 30-45℃, add sodium hydroxide aqueous solution with a concentration of 25-35wt%, adjust the pH to 7-8, rotary evaporate, and dry at 55-65℃ to obtain the functional dispersant.

7. The chip packaging cleaning agent according to claim 6, characterized in that, The mass ratio of 1,5-dimethyl-2-phenyl-4-amino-3-pyrazolone to acrylic acid in step A1 is 1:(0.36-0.4).

8. The chip packaging cleaning agent according to claim 6, characterized in that, The mass ratio of the compound, isopropanol and acrylic acid in step A2 is (0.08-0.12):(0.15-0.2):

1.

9. A method for preparing the chip packaging cleaning agent according to any one of claims 1-8, characterized in that, The process includes the following steps: Add deionized water to a reaction vessel, add a pH adjuster while stirring, stir for 5-8 minutes, slowly add a composite saponifying agent at a rate of 1-2 g / s, stir for 10-15 minutes, add a room temperature active solvent at 23-27°C, stir at 600-800 rpm for 15-20 minutes, reduce the stirring speed to 400-500 rpm, add a room temperature non-foaming emulsifier and a corrosion inhibitor in sequence, stirring for 8-12 minutes each, and finally stir for 20-25 minutes. Filter and set aside for later use.

10. The application of a chip packaging cleaning agent according to any one of claims 1-8 or a chip packaging cleaning agent obtained by the preparation method according to claim 9, characterized in that, The application method of the chip packaging cleaning agent includes the following steps: Step A: Rinse the chip package with deionized water and drain. Step B: Pour the cleaning agent into the cleaning tank, immerse the chip, and clean it at room temperature for 10-15 minutes under ultrasonic conditions with a power of 200-300W and a frequency of 35-45kHz. Step C: Rinse with deionized water 2-3 times, 3-7 minutes each time; Step D: Dry in a well-ventilated environment at room temperature for 30-40 minutes.

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