Semiconductor product processing equipment and mist discharging system

Abstract

According to the semiconductor product processing equipment and the mist discharging system, the mist discharging fan is connected with the rack through the damping mechanism, vibration of the mist discharging fan can be effectively prevented from being transmitted to the rack, the machining precision can be improved, the damping mechanism can adopt different structures according to needs, and when a connector is adopted, the connector is connected with the mist discharging fan through the damping mechanism. The connector is connected to the top of the first supporting rod through the first damping connecting base and connected to the bottom of the second supporting rod of the rack through the second damping connecting base, the second supporting rod can effectively limit the connector, and the problem that the connector topples due to the fact that the mist discharging fan is arranged on the first side of the connector is solved; shear force borne by bolts for connecting the first and second damping connecting seats with the first and second supporting rods is reduced, and the structural stability and safety of the damping structure are effectively guaranteed. When the bracket is adopted, the structure is simple, and a two-stage damping structure is adopted, so that the vibration of the fog exhaust fan can be isolated from the rack to the greatest extent, and the influence on the main shaft is avoided.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing equipment, and in particular to semiconductor product processing equipment and defogging systems. Background Technology

[0002] When thinning and cutting semiconductor products such as wafers, coolant needs to be sprayed onto the cutting or thinning area, which will cause a large amount of water mist to be generated inside the processing chamber of the processing mechanism. Therefore, a mist exhaust pipe is installed on the processing chamber and connected to a mist extraction fan to discharge the water mist inside the processing chamber to the outside.

[0003] As shown in the patent document disclosed in application publication number CN119897527A, the defogging fan is directly and rigidly connected to the frame. When only one defogging fan is used, the power of the defogging fan needs to be set to a large value, which will cause it to vibrate significantly during operation. The vibration of the defogging fan during operation will be transmitted to the spindle of the machining mechanism, thereby affecting the machining accuracy of the spindle. Summary of the Invention

[0004] The purpose of this invention is to solve the above-mentioned problems existing in the prior art and to provide a semiconductor product processing equipment and a defogging system.

[0005] The objective of this invention is achieved through the following technical solution: Semiconductor product processing equipment includes a defogging system, the defogging system including a defogging fan, the defogging fan being connected to the frame via a shock-absorbing mechanism; The shock absorption mechanism includes a connector, and the defogging fan is disposed on a first side of the main body of the connector. A first connecting member is disposed on the first side of the main body, and a second connecting member is disposed on a second side of the main body opposite to the first side. The first connecting member is connected to the top of a first support rod on the frame through a first shock absorption connecting seat. The extension direction of the first support rod is perpendicular to the distribution direction of the first connecting member and the second connecting member. The second connecting member is connected to the bottom of a second support rod on the frame through a second shock absorption connecting seat. Alternatively, the shock absorption mechanism may include a bracket, on which a third shock absorption connecting seat for connecting the mist exhaust fan is provided, and the bracket is connected to the frame through the shock absorption connecting mechanism.

[0006] Preferably, the defogging fan includes a housing, an air inlet pipe is provided at the bottom of the housing, an air outlet pipe is provided on the side of the housing, and a power source is provided at the top of the housing.

[0007] Preferably, a first connecting pipe is provided on the first side of the main body and a second connecting pipe is provided on the second side. The first connecting pipe and the second connecting pipe are coaxial and extend horizontally. The air inlet pipe of the de-misting fan is connected to the first connecting pipe through a 90° elbow. The second connecting pipe is used to connect to the first de-misting pipe of the processing box.

[0008] Preferably, the third side of the main body is provided with a third connecting pipe for connecting to the second mist exhaust pipe on the cleaning tank, and the third connecting pipe extends downward at an angle.

[0009] Preferably, an automatic valve is provided between the third connecting pipe and the second mist exhaust pipe.

[0010] Preferably, the second connecting pipe of the connector is connected to the first mist exhaust pipe of the processing box via a hose or a corrugated pipe and / or the third connecting pipe of the connector is connected to the second mist exhaust pipe of the cleaning tank via a hose.

[0011] Preferably, there are three or four third shock-absorbing connecting seats, which are evenly distributed around the circumference.

[0012] Preferably, the shock-absorbing connection mechanism includes a rubber pad, a locking plate, and connecting bolts. The rubber pad is clamped on both sides of the vertical plate of the bracket. The rubber pad and the vertical plate are connected to the third support rod of the frame through the connecting bolts passing through them and the locking plate. The connecting bolts do not contact the rubber pad and the locking plate.

[0013] Preferably, the air intake pipe is connected to one end of a T-junction via a flexible hose, and the other two ends of the T-junction are connected to the first mist exhaust pipe and the second mist exhaust pipe.

[0014] The defogging system includes a defogging fan, which is mounted on a shock-absorbing mechanism. The shock absorption mechanism includes a connector, and the defogging fan is disposed on a first side of the main body of the connector. A first connecting member is disposed on the first side of the main body, and a second connecting member is disposed on a second side of the main body opposite to the first side. The first connecting member is connected to the top of a first support rod on the frame through a first shock absorption connecting seat. The extension direction of the first support rod is perpendicular to the distribution direction of the first connecting member and the second connecting member. The second connecting member is connected to the bottom of a second support rod on the frame through a second shock absorption connecting seat. Alternatively, the shock absorption mechanism may include a bracket, on which a third shock absorption connecting seat for connecting the mist exhaust fan is provided, and the bracket is connected to the frame through the shock absorption connecting mechanism.

[0015] The advantages of the technical solution of this invention are mainly reflected in: This invention connects the de-fogging fan to the frame via a vibration damping mechanism, effectively preventing the vibration of the de-fogging fan from being transmitted to the frame and affecting the stable operation of the main shaft. This is beneficial for improving the processing accuracy of semiconductor products. Furthermore, the vibration damping mechanism can employ different structures as needed. When a connector is used, not only is vibration damping achieved, but the connector is also connected to the top of the first support rod using a first vibration damping connector and to the bottom of the second support rod of the frame using a second vibration damping connector. The second support rod effectively limits the connector's position, preventing it from tipping over due to the de-fogging fan being located on its first side. This also reduces the shear force on the bolts connecting the first and second vibration damping connectors to the first and second support rods, effectively ensuring the structural stability and safety of the vibration damping structure. When a bracket is used, vibration damping can be achieved with a simpler and more compact structure. The two-stage vibration damping structure maximizes the isolation of the de-fogging fan's vibration from the frame, thereby avoiding any impact on the main shaft.

[0016] The connector structure of the present invention can be easily connected to the second mist exhaust pipe of the cleaning mechanism, thereby facilitating the sharing of a single mist exhaust fan between the cleaning mechanism and the processing mechanism, which helps to reduce the use of the mist exhaust fan and thus reduce space occupation.

[0017] The arrangement of the de-fogging fan in this invention can effectively protect the power source of the de-fogging fan and prevent the problem of condensate backflow. Attached Figure Description

[0018] Figure 1 This is a first-view perspective perspective view of a partial structure of the semiconductor product processing equipment of the present invention; Figure 2 This is a perspective view of the defogging system of the present invention connected to the frame; Figure 3 yes Figure 2 The front view; Figure 4 This is a second-view perspective perspective view of a partial structure of the semiconductor product processing equipment of the present invention; Figure 5 This is a cross-sectional view of the main body of the invention; Figure 6 This is a perspective view of the control valve of the present invention; Figure 7 This is a partial perspective view of another embodiment of the defogging system of the present invention; Figure 8 This is a three-dimensional sectional view of the bracket of the present invention connected to the frame via a shock-absorbing connection mechanism. Detailed Implementation

[0019] The objectives, advantages, and features of this invention will be illustrated and explained through the following non-limiting description of preferred embodiments. These embodiments are merely typical examples of applying the technical solutions of this invention, and all technical solutions formed by equivalent substitutions or equivalent transformations fall within the scope of protection claimed by this invention.

[0020] In the description of the solution, it should be noted that the terms "center," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience and simplification of description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0021] Example 1 The semiconductor product processing equipment disclosed in this invention will now be described with reference to the accompanying drawings. This semiconductor product processing equipment can be a known thinning machine or dicing machine. The equipment includes a frame and processing mechanisms and / or cleaning mechanisms mounted on the frame. When the equipment is a thinning machine, the processing mechanism is used to perform grinding, polishing, and other processing on the semiconductor product. When the equipment is a dicing machine, the processing mechanism is used to perform cutting, circumferential cutting, and other processing on the semiconductor product. In some embodiments, the semiconductor product processing equipment may only have a processing mechanism; in other embodiments, it may only have a cleaning mechanism.

[0022] In this embodiment, the semiconductor product processing equipment is equipped with both the processing mechanism and the cleaning mechanism.

[0023] As attached Figure 1 As shown, the processing mechanism typically includes a processing chamber 100 and processing components (not shown in the figure) for performing the various processing operations described above. The specific structure of the processing chamber 100 and the processing components is known technology and is not an innovation of this invention, so it will not be described in detail here. In order to discharge water mist inside the processing chamber 100, a first mist exhaust pipe 110 is provided on the processing chamber 100, and the axis of the first mist exhaust pipe 110 extends horizontally along the X-axis direction.

[0024] The cleaning mechanism is used to clean the products processed by the processing mechanism. It typically includes a cleaning tank 200, cleaning components within the cleaning tank 200, and a turntable, etc. The specific structure of the cleaning mechanism is known and not an innovation of this invention, so it will not be described in detail here. The cleaning tank 200 is equipped with a second mist exhaust pipe 210 for discharging water mist from its processing chamber 100. The axis of the second mist exhaust pipe 210 extends horizontally along the Y-axis direction, which is perpendicular to the X-axis direction. The specific processes of processing and cleaning, as well as the specific process of transferring the processed workpiece from the processing mechanism to the cleaning mechanism, are known technologies and not innovations of this invention, so they will not be described in detail here.

[0025] As attached Figure 1 Appendix Figure 2 As shown, the first mist exhaust pipe 110 and the second mist exhaust pipe 210 are connected to the mist exhaust system 300. After the processing mechanism starts processing, the mist exhaust system 300 starts to exhaust mist, and the mist exhaust system 300 continues to exhaust mist until the processing equipment stops.

[0026] The defogging system 300 includes a defogging fan 310, which is connected to the frame via a shock-absorbing mechanism 330, thereby effectively preventing the vibration of the defogging fan 310 from being transmitted to the frame.

[0027] As attached Figure 1 As shown, the defogging fan 310 can be any known feasible fan. In this embodiment, the defogging fan 310 includes a housing 311, an air inlet pipe 312 is provided at the bottom of the housing 311, an air outlet pipe 313 is provided on the side of the housing 311, and a power source 314 is provided at the top of the housing 311. The power source 314 can be various motors, electric motors, etc. During defogging, the power source 314 drives an impeller (not shown in the figure) inside the housing to rotate, thereby drawing water mist from the processing box 100 and the cleaning tank 200 through the air inlet pipe 312 and discharging it through the side air outlet pipe 313.

[0028] The connection between the defogging fan 310 and the shock absorption mechanism 330 can be implemented in different ways depending on the different shock absorption mechanisms 330.

[0029] For example, in one embodiment, as shown in the appendix Figure 2 Appendix Figure 3 As shown, the shock absorption mechanism 330 includes a connector 331, and the connector 331 includes a body 332. The shape of the body 332 can be designed into a suitable shape as needed. In this embodiment, the body 332 is a hollow cuboid box. A first connecting pipe 333 is provided on the first side of the body 332, and a second connecting pipe 334 is provided on the second side of the body 332 opposite to the first side.

[0030] The first connecting pipe 333 extends horizontally along the X-axis direction, and the first connecting pipe 333 is connected to the air inlet pipe 312 of the de-fogging fan 310 through a 90° elbow 350. The 90° elbow 350 is a rigid pipe and the de-fogging fan 310 is connected above the first connecting pipe 333. This design can effectively make the condensate generated during de-fogging flow downward without backflowing into the power source 314.

[0031] The second side is the side close to the first mist exhaust pipe 110. The second connecting pipe 334 is connected to the first mist exhaust pipe 110. In order to reduce the airflow resistance during mist exhaust, the first connecting pipe 333 and the second connecting pipe 334 are coaxial and extend horizontally. At the same time, the second connecting pipe 334 is coaxially arranged with the first mist exhaust pipe 110.

[0032] Since the connector 331 is rigidly connected to the de-fogging fan 310, the vibration of the de-fogging fan 310 will be transmitted to the connector 331. Therefore, in order to prevent the vibration of the connector 331 from being transmitted to the first de-fogging pipe 110, the second connecting pipe 334 can be connected to the first de-fogging pipe 110 by a hose or a corrugated pipe (not shown in the figure), and the hose or corrugated pipe can be kept horizontally and straight to reduce resistance.

[0033] To connect the main body 332 to the frame, a first connector 335 is provided on the first side of the main body 332, and a second connector 336 is provided on the second side. The first connector 335 is connected to the top of the first support rod 400 on the frame through a first shock-absorbing connecting seat 337. The extension direction of the first support rod 400 is perpendicular to the distribution direction of the first connector 335 and the second connector 336, that is, the first support rod 400 extends horizontally along the Y-axis. The second connector 336 is connected to the bottom of the second support rod 500 through a second shock-absorbing connecting seat 338. The second support rod 500 can be parallel to the first support rod 400 or perpendicular to the first support rod 400. Preferably, the first support rod and the second support rod are parallel and they are staggered in the first direction.

[0034] The first shock-absorbing connecting seat 337 and the second shock-absorbing connecting seat 338 have the same structure. They can be rubber shock absorbers, which include cylindrical, frustum-shaped, bowl-shaped, frustum-shaped or other feasible shapes of rubber, as well as horizontal connecting plates and screws disposed at both ends of the rubber. The axis of the connecting hole on the horizontal connecting plate is parallel to the axis of the screw and extends in the vertical direction. The screw is coaxially disposed with the rubber. The horizontal connecting plate is connected to the first support rod 400 or the second support rod 500 by bolts and nuts passing through the connecting holes thereon. The screw passes through the connecting holes on the first or second connecting member and is fastened by nuts.

[0035] The number and position of the first shock-absorbing connecting seat 337 and the second shock-absorbing connecting seat 338 can be designed as needed. In a preferred embodiment, there are two first shock-absorbing connecting seats 337 distributed along the extension direction of the first support rod 400, and one second shock-absorbing connecting seat 338 located in the middle of the two first shock-absorbing connecting seats 337.

[0036] The present invention connects the top of the first support rod 400 with two first damping connectors 337 and the bottom of the second support rod 500 with a second damping connector 338, forming a spatial triangular stable structure, which increases the stability of the overall structure. At the same time, the first damping connectors 337 and the second damping connectors 338, which are not on the same straight line, constitute a spatial flexible system that can allow and absorb linear movement in the X-axis, Y-axis and vertical directions, as well as rotational movement in these three directions, effectively achieving damping in six degrees of freedom.

[0037] Furthermore, the horizontal connecting plates of the first and second damping connecting seats can be connected to the first and second support rods via a damping connecting mechanism, the specific structure of which will be described in detail below. This more effectively prevents vibration transmission to the first and second support rods.

[0038] As attached Figure 3 Appendix Figure 4As shown, to facilitate connection to the second mist exhaust pipe 210, a third connecting pipe 339 for connecting to the second mist exhaust pipe 210 is provided on the third side of the main body 332. In a preferred embodiment, the third connecting pipe 339 is positioned higher than the second mist exhaust pipe 210 and extends downwards at an angle. Simultaneously, the third connecting pipe 339 can be connected to the second mist exhaust pipe 210 via a downwardly extending adapter pipe 370. This arrangement allows condensate flowing back into the main body 332 to flow directly into the cleaning tank 200 via the third connecting pipe 339 and the adapter pipe 370, eliminating the need for an additional condensate drainage structure.

[0039] Correspondingly, in order to allow condensate to enter the third connecting pipe 339 more smoothly, as shown in the attached... Figure 5 As shown, the main body 332 is provided with a first through hole 340 communicating with the first connecting pipe 333, a second through hole 341 communicating with the second connecting pipe 334, and a third through hole 342 communicating with the third connecting pipe 339. The first through hole 340 and the second through hole 341 are located above the top surface 343 of the bottom plate of the main body 332, and the lowest position of the third through hole 342 is not higher than the top surface 343 of the bottom plate of the main body 332. Therefore, the condensate flowing back from the first connecting pipe 333 to the bottom plate will not flow into the second connecting pipe 334, and can flow downwards from the third connecting pipe 339 into the cleaning tank 200 and be discharged from the drain port of the cleaning tank.

[0040] Furthermore, since the top of the cleaning tank 200 is an open opening, and the power of the de-mist fan 310 is fixed, the opening will greatly affect the efficiency of the de-mist fan 310 in discharging water mist from the processing box 100. Therefore, in order to fully utilize the function of the de-mist fan 310 when water mist does not need to be discharged from the cleaning tank 200, an automatic valve 371 is provided between the third connecting pipe 339 and the second de-mist pipe 210.

[0041] For details, see attached. Figure 4 Appendix Figure 6As shown, the transfer pipe 370 includes the automatic valve 371, which is preferably a butterfly valve, and can be any known electric butterfly valve, pneumatic butterfly valve, etc., without limitation here. Furthermore, in a preferred embodiment, the automatic valve 371 can be directly connected to the third connecting pipe 339. In this case, the automatic valve 371 is inclined, and its lower end is connected to the second mist exhaust pipe 210 via a downwardly inclined pipe 372. Thus, when the automatic valve 371 is closed, the returning condensate will remain at a higher position, so that when the automatic valve 371 is opened, the condensate still has relatively large potential energy and can flow into the cleaning tank 200.

[0042] When water mist discharge from the cleaning tank 200 is not required, the automatic valve 371 can be shut off, thereby cutting off the connection between the third connecting pipe 339 and the second mist exhaust pipe 210. In this case, the mist exhaust fan 310 can only discharge water mist from the processing box 100, effectively improving the water mist discharge efficiency. When water mist discharge from the cleaning tank 200 is required, the automatic valve 371 can be activated, allowing simultaneous discharge of water mist from both the processing box 100 and the cleaning tank 200.

[0043] Similarly, to prevent vibrations from the connector 331 from being transmitted to the cleaning tank 200, the downward-sloping pipe 372 is a flexible hose. Of course, in other embodiments, the automatic valve 371 can also be directly connected to the second mist exhaust pipe 210, and the automatic valve 371 can be connected to the third connecting pipe via a flexible hose.

[0044] In another embodiment, as shown in the appendix Figure 7 As shown, the shock absorption mechanism 330 includes a bracket 33a. The structure of the bracket 33a can be designed as needed. In this embodiment, the bracket 33a is an L-shaped plate. The top of the horizontal plate 33b of the L-shaped plate is provided with a set of third shock absorption connecting seats 33c for connecting the mist exhaust fan 310. The vertical plate 33d of the L-shaped plate is connected to the frame through the shock absorption connecting mechanism.

[0045] In this embodiment, the air intake pipe 312 of the de-fogging fan 310 is also oriented in the same direction. Since the weight of the de-fogging fan 310 is supported by the bracket 33a, the air intake pipe 312 can be connected to the first de-fogging pipe 110 through a flexible hose or corrugated pipe, thereby effectively preventing the vibration of the de-fogging fan 310 from being transmitted to the first de-fogging pipe 110.

[0046] The number of the third shock-absorbing connecting seats 33c can be set as needed. In a preferred embodiment, as shown in the attached figure... Figure 7As shown, three or four third shock-absorbing connecting seats 33c are evenly distributed circumferentially on the horizontal plate 33b. They connect to the housing 311 of the mist exhaust fan 310 and are distributed around the outer periphery of the air intake pipe 312. The structure of the third shock-absorbing connecting seat 33c can refer to the first and second shock-absorbing connecting seats. Of course, in another embodiment, the third shock-absorbing connecting seat 33c may also include a cylindrical rubber and screws coaxially connected to both ends of the rubber. One end of the screw passes through a hole on the horizontal plate 33b and is fastened by a nut. The other end of the screw can be threaded to a screw hole on the housing 311. Alternatively, the housing 311 can be connected to the screw by screwing a nut onto the other end of the screw.

[0047] As attached Figure 7 Appendix Figure 8 As shown, the vertical plate 33d is connected to the side of the third support rod 600 facing the mist exhaust fan 310. The third support rod 600 is a profile, and the two sides of the profile are respectively provided with vertically distributed through grooves 610 that are opposite to each other. The through grooves that are directly opposite each other are connected by a set of connecting holes 620. The diameter of the connecting holes is smaller than the width of the through grooves.

[0048] Correspondingly, the shock-absorbing connection mechanism may be one or more, depending on the specific needs, and is not limited here.

[0049] As attached Figure 8 As shown, each of the shock-absorbing connection mechanisms includes a rubber pad 33e, a locking plate 33f, and a connecting bolt 33g. There are two rubber pads 33e, which are clamped on both sides of the vertical plate 33d. The rubber pads 33e and the vertical plate 33d are connected to the third support rod 600 by the connecting bolt 33g passing through them and cooperating with the locking plate 33f. The connecting bolt 33g passes through the connecting hole from the side of the third support rod away from the mist exhaust fan to the other side, and then passes through the rubber pad, the vertical plate, and the through hole on the rubber pad in sequence, and finally is threaded into the screw hole 33h on the locking plate 33f, thereby pressing the rubber pad and the vertical plate tightly against the side of the third support rod by the locking plate.

[0050] Meanwhile, the connecting bolt 33g does not contact the rubber pad 33e and the locking plate 33f. Specifically, threaded through holes 33i are provided on the rubber pad 33e and the vertical plate 33d to allow the connecting bolt 33g to pass through without contact. That is, the diameter of the through holes on the rubber pad 33e and the vertical plate 33d for the connecting bolt 33g to pass through is larger than the outer diameter of the thread of the connecting bolt 33g. Furthermore, the connecting bolt 33g is coaxially arranged with the holes on the rubber pad 33e and the vertical plate 33d.

[0051] Furthermore, to facilitate the positioning of the vertical plate 33d and ensure that the connecting bolt 33g remains coaxial with the hole on the vertical plate 33d, a support pad 33j is provided on the third support rod to limit the position below the vertical plate 33d. The support pad 33j is, for example, a rubber pad 33e. When the bottom surface of the vertical rod abuts against the support pad, the perforation on it is at a height that can remain coaxial with the connecting hole. This effectively ensures that the connecting bolt will not contact the vertical plate when connected, and at the same time, it can prevent the vertical plate from moving downward due to gravity, and also prevent the vibration of the vertical plate from being transmitted to the third support rod.

[0052] In a more preferred embodiment, in order to connect the first mist exhaust pipe and the second mist exhaust pipe 210 simultaneously, the air intake pipe 312 is connected to one end of a tee (not shown in the figure) via a hose or corrugated pipe, and the other two ends of the tee are connected to the first mist exhaust pipe 110 and the second mist exhaust pipe 210. At the same time, the tee is rigidly connected to the first mist exhaust pipe 110.

[0053] This invention has many other embodiments, and all technical solutions formed by equivalent transformation or equivalent transformation fall within the protection scope of this invention.

Claims

1. Semiconductor product processing equipment, including a defogging system, said defogging system including a defogging fan, said defogging fan being connected to the frame via a shock-absorbing mechanism; characterized in that: The shock absorption mechanism includes a connector, and the defogging fan is disposed on a first side of the main body of the connector. A first connecting member is disposed on the first side of the main body, and a second connecting member is disposed on a second side of the main body opposite to the first side. The first connecting member is connected to the top of a first support rod on the frame through a first shock absorption connecting seat. The extension direction of the first support rod is perpendicular to the distribution direction of the first connecting member and the second connecting member. The second connecting member is connected to the bottom of a second support rod on the frame through a second shock absorption connecting seat. Alternatively, the shock absorption mechanism may include a bracket, on which a third shock absorption connecting seat for connecting the mist exhaust fan is provided, and the bracket is connected to the frame through the shock absorption connecting mechanism.

2. The semiconductor product processing equipment according to claim 1, characterized in that: The de-fogging fan includes a housing, an air inlet pipe at the bottom of the housing, an air outlet pipe on the side of the housing, and a power source at the top of the housing.

3. The semiconductor product processing equipment according to claim 1, characterized in that: The main body has a first connecting pipe on its first side and a second connecting pipe on its second side. The first and second connecting pipes are coaxial and extend horizontally. The air inlet pipe of the de-fogging fan is connected to the first connecting pipe through a 90° elbow. The second connecting pipe is used to connect to the first de-fogging pipe of the processing box.

4. The semiconductor product processing equipment according to claim 3, characterized in that: The third side of the main body is provided with a third connecting pipe for connecting to the second mist exhaust pipe on the cleaning tank, and the third connecting pipe extends downward at an angle.

5. The semiconductor product processing equipment according to claim 4, characterized in that: An automatic valve is installed between the third connecting pipe and the second mist exhaust pipe.

6. The semiconductor product processing equipment according to any one of claims 1-5, characterized in that: The second connecting pipe of the connector is connected to the first mist exhaust pipe of the processing box via a hose or corrugated pipe, and / or the third connecting pipe of the connector is connected to the second mist exhaust pipe of the cleaning tank via a hose.

7. The semiconductor product processing equipment according to claim 1, characterized in that: The third shock-absorbing connecting seat consists of three or four seats, evenly distributed around the circumference.

8. The semiconductor product processing equipment according to claim 1, characterized in that: The shock-absorbing connection mechanism includes a rubber pad, a locking plate, and connecting bolts. The rubber pad is clamped on both sides of the vertical plate of the bracket. The rubber pad and the vertical plate are connected to the third support rod of the frame through the connecting bolts passing through them and the locking plate. The connecting bolts do not contact the rubber pad and the locking plate.

9. The semiconductor product processing equipment according to claim 7 or 8, characterized in that: The air intake pipe is connected to one end of a T-junction via a flexible hose, and the other two ends of the T-junction are connected to the first mist exhaust pipe and the second mist exhaust pipe.

10. A defogging system, including a defogging fan, wherein the defogging fan is mounted on a shock-absorbing mechanism, characterized in that: The shock absorption mechanism includes a connector, and the defogging fan is disposed on a first side of the main body of the connector. A first connecting member is disposed on the first side of the main body, and a second connecting member is disposed on a second side of the main body opposite to the first side. The first connecting member is connected to the top of a first support rod on the frame through a first shock absorption connecting seat. The extension direction of the first support rod is perpendicular to the distribution direction of the first connecting member and the second connecting member. The second connecting member is connected to the bottom of a second support rod on the frame through a second shock absorption connecting seat. Alternatively, the shock absorption mechanism may include a bracket, on which a third shock absorption connecting seat for connecting the mist exhaust fan is provided, and the bracket is connected to the frame through the shock absorption connecting mechanism.

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