Passive heat dissipation cloud node and travel service case comprising same

Abstract

The invention relates to the technical field of travel service case manufacturing, in particular to a passive heat dissipation cloud node and a travel service case comprising the same. For the passive heat dissipation cloud node, a cloud node main body comprises a PCBA substrate and a chip integrated on the PCBA substrate; the core heat conduction module comprises a heat dissipation base, a heat pipe assembly and a high heat conduction interface material. The high-thermal-conductivity interface material is filled between the chip and the heat dissipation base; the evaporation section of the heat pipe assembly corresponds to the chip, and the condensation section of the heat pipe assembly exceeds the upper end and the lower end of the cloud node main body; the upper epitaxy heat dissipation unit is fixed with the condensation section at the upper end of the heat pipe assembly and is exposed outside; the lower epitaxy heat dissipation unit is in thermal conduction with the heat dissipation base and is exposed to the outside. Through cooperation of the low-resistance heat conduction path and the heat pipe assembly, the heat conduction efficiency of the passive heat dissipation cloud node is greatly improved; and the double-path heat dissipation expansion module synchronously dissipates heat from an upper independent path and a lower independent path through an upper epitaxial heat dissipation unit and a lower epitaxial heat dissipation unit, so that the heat exchange efficiency is effectively improved.

Description

Technical Field

[0001] This invention relates to the field of travel suit cabinet manufacturing technology, and in particular to a passive heat dissipation cloud node and a travel suit cabinet including the same. Background Technology

[0002] The passenger service system control cabinet is a dedicated hardware platform customized for passenger service systems in the rail transit industry. Its core functions include integrating, hosting, and running passenger service-related software modules such as ticketing information display and train arrival announcements. With the continuous evolution of intelligent technology in the rail transit field, the passenger service system control cabinet is gradually introducing cloud node technology to achieve performance upgrades: by virtualizing computing, storage, and service functions, it aggregates them into a resource pool that can be flexibly scheduled, transforming the traditional independent cabinets scattered in various stations into centrally managed, on-demand allocated cloud nodes.

[0003] However, the application of cloud node technology also presents a heat dissipation challenge for the underlying hardware: in order to meet the high concurrency processing requirements of cloud nodes, the power consumption of core chips has increased significantly, and the heat (heat flux density) that needs to be dissipated per unit area has increased dramatically; furthermore, there are clear requirements for fanless operation of hardware equipment in rail transit sites, that is, to avoid equipment downtime caused by fan mechanical failure, noise interference with the station environment, and reduced heat dissipation efficiency caused by dust accumulation on fans.

[0004] Traditional passive heat dissipation solutions (such as single aluminum heat sinks and fin structures) have physical limits to their heat dissipation capacity. They cannot effectively dissipate the large amount of heat generated by the core chip of the cloud node under existing constraints. This inevitably leads to the chip operating at high temperatures for a long time, which can easily cause system lag, functional failure, or even hardware damage, seriously threatening the stable operation of the travel service system.

[0005] Therefore, it is urgent for technical personnel to solve the above problems. Summary of the Invention

[0006] The purpose of this invention is to provide a passive heat dissipation cloud node, which aims to solve the problem that after introducing cloud node technology into the control chassis of the travel service system in the existing design, the increased power consumption of the core chip leads to a surge in heat flux density. However, due to the rigid constraints of fanless operation in rail transit, the heat dissipation capacity of traditional passive heat dissipation solutions reaches the physical limit and cannot effectively dissipate heat.

[0007] This invention relates to a passive heat dissipation cloud node, comprising a cloud node body, a core heat conduction module, and a dual-path heat dissipation extension module; The main body of the cloud node includes a PCBA substrate and chips integrated on the PCBA substrate; The core heat conduction module includes a heat dissipation base, a heat pipe assembly, and a high thermal conductivity interface material. The high thermal conductivity interface material is filled between the chip and the heat dissipation base to form a low-resistance heat conduction path. The heat pipe assembly is in contact with the heat dissipation base, with its evaporation section corresponding to the chip arrangement and its condensation section extending along the length of the cloud node body and exceeding the upper and lower ends of the cloud node body by a set distance. The dual-path heat dissipation extension module includes an upper-level extended heat dissipation unit and a lower-level extended heat dissipation unit; the upper-level extended heat dissipation unit is fixedly connected to the condensation section of the heat pipe assembly extending beyond the upper end of the cloud node body and is exposed to the outside of the cloud node body; the lower-level extended heat dissipation unit is thermally connected to the heat dissipation base and is exposed to the outside of the cloud node body.

[0008] As a further improvement to the technical solution disclosed in this invention, the heat pipe assembly includes an upper heat pipe and a lower heat pipe; the evaporation section of the upper heat pipe and the evaporation section of the lower heat pipe are arranged corresponding to the chip; the condensation section of the upper heat pipe extends to the upper end of the cloud node body and is thermally connected to the upper epitaxial heat dissipation unit; the condensation section of the lower heat pipe extends to the lower end of the cloud node body and is thermally connected to the lower epitaxial heat dissipation unit.

[0009] As a further improvement to the technical solution disclosed in this invention, the upper extended heat dissipation unit is an aluminum alloy heat sink with fins, and it is fixedly connected to the condensation section of the upper heat pipe by a thermally conductive adhesive that has both bonding and thermal conductivity functions.

[0010] As a further improvement to the technical solution disclosed in this invention, the lower epitaxial heat dissipation unit is an integrated heat dissipation module, and thermal conductivity between it and the heat dissipation base is achieved through high thermal conductivity silicone grease used only for heat conduction; the lower epitaxial heat dissipation unit and the condensation section of the lower heat pipe are fixedly connected by thermally conductive adhesive that has both bonding and thermal conductivity functions.

[0011] As a further improvement to the technical solution disclosed in this invention, the thermal conductivity of the high thermal conductivity interface material is not less than 3W / (m·K), and the thickness is controlled between 0.1 and 0.3 mm.

[0012] As a further improvement to the technical solution disclosed in this invention, the heat dissipation base is composed of a base body and heat dissipation fins; the base body is flat, its bottom surface is bonded to a high thermal conductivity interface material, and its top surface is the forming carrier for the heat dissipation fins; the array direction of the heat dissipation fins is consistent with the extension direction of the condensation section of the heat pipe assembly.

[0013] Furthermore, the present invention also discloses a travel service chassis, including a main frame, a top cover, a left sealing plate, a right sealing plate, a bottom plate, and the aforementioned passive heat dissipation cloud nodes; the main frame has a rectangular frame structure; the top cover, left sealing plate, right sealing plate, and bottom plate are all detachably connected to the main frame, forming a chassis housing cavity; the top cover has process holes; the passive heat dissipation cloud nodes are installed inside the chassis housing cavity, and the upper external heat dissipation unit passes through the process holes to be exposed to the outside of the travel service chassis.

[0014] As a further improvement to the technical solution disclosed in this invention, the base plate also has a heat dissipation function, and it is in contact with the lower extended heat dissipation unit to achieve thermal conductivity.

[0015] Regarding the design of passive heat dissipation cloud nodes, its practical applications can achieve at least the following beneficial technical effects, specifically: 1) In the core heat conduction module, a high thermal conductivity interface material is used to fill the gap between the chip and the heat sink base. By eliminating contact thermal resistance, a low-resistance heat conduction path is formed to ensure that the chip's heat is quickly transferred to the heat sink base. In addition, the heat pipe assembly is in close contact with the heat sink base, and its evaporation section is precisely aligned with the chip. It can directly absorb the core heat and quickly export it through the condensation section, which greatly improves the heat conduction efficiency from the source. 2) The dual-path heat dissipation extension module further expands the heat dissipation capability of the cloud node. The upper-level extended heat dissipation unit is fixedly connected to the upper condensation section of the heat pipe assembly, while the lower-level extended heat dissipation unit is thermally connected to the heat dissipation base. Both are exposed to the outside of the cloud node body, allowing heat to be dissipated simultaneously from two independent paths, significantly increasing the total heat dissipation area and heat exchange efficiency. This not only meets the heat dissipation requirements of high-power chips in the cloud node but also avoids heat dissipation failures caused by a single heat dissipation path failure, significantly enhancing the reliability and redundancy of the heat dissipation system.

[0016] Regarding the design of the travel service chassis, it can achieve at least the following beneficial technical effects in practical applications: Firstly, by adapting its structure and heat dissipation function, the travel service chassis maximizes the heat dissipation performance of the passive cooling cloud nodes. Its core design lies in the specially molded process holes on the top cover, allowing the upper-level extended heat dissipation units to precisely pass through and be fully exposed to the outside of the chassis. This avoids the chassis shell obstructing the upper-level heat dissipation path, ensuring that the upper-level extended heat dissipation units can fully contact the external environment to efficiently dissipate heat. Secondly, when integrating the cloud nodes into the chassis cavity, the structural layout reserves space for heat exchange between the lower-level extended heat dissipation units and the external environment, ensuring that both paths of the heat dissipation system can operate without obstruction. This provides stable support for the efficient passive cooling of the cloud nodes from a structural perspective, significantly improving overall heat dissipation efficiency. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a three-dimensional schematic diagram of the travel service chassis disclosed in this invention from one perspective.

[0019] Figure 2 This is a three-dimensional schematic diagram of the travel service chassis disclosed in this invention from another perspective.

[0020] Figure 3 This is a three-dimensional schematic diagram of the travel service chassis disclosed in this invention from another perspective.

[0021] Figure 4 This is a three-dimensional schematic diagram of the passive heat dissipation cloud node disclosed in this invention from one perspective.

[0022] Figure 5 This is a three-dimensional schematic diagram of the passive heat dissipation cloud node disclosed in this invention from another perspective.

[0023] Figure 6 yes Figure 4 Side view.

[0024] Figure 7 yes Figure 1 Top view.

[0025] Figure 8 yes Figure 7 AA sectional view.

[0026] Figure 9 This is also a three-dimensional schematic diagram of the travel service chassis disclosed in this invention from one perspective (with the passive heat dissipation cloud nodes hidden).

[0027] 1-Main frame; 2-Top cover plate; 3-Left sealing plate; 4-Right sealing plate; 5-Base plate; 6-Passive heat dissipation cloud node; 61-Cloud node body; 611-PCBA substrate; 612-Chip; 62-Core heat conduction module; 621-Heat dissipation base; 6211-Base body; 6212-Heat dissipation fins; 622-Heat pipe assembly; 6221-Upper heat pipe; 6222-Lower heat pipe; 623-High thermal conductivity interface material; 63-Dual-path heat dissipation extension module; 631-Upper epitaxial heat dissipation unit; 632-Lower epitaxial heat dissipation unit. Detailed Implementation

[0028] The following detailed description of the invention, in conjunction with specific embodiments, further illustrates the content of this invention. As an integrated equipment installation and operation carrier, the heat dissipation efficiency of the internal components of the travel service chassis directly affects the operational stability and lifespan of the core equipment, thus impacting the continuous and reliable operation of the equipment in travel service scenarios. Addressing the integrated installation requirements and efficient heat dissipation demands of the passive cooling cloud node 6, the travel service chassis achieves adaptation through two core design aspects: firstly, optimizing the structural layout to ensure the passive cooling cloud node 6 is securely installed within the chassis; secondly, enhancing heat dissipation functionality to create an unobstructed operating space for the dual-path heat dissipation system of the passive cooling cloud node 6. In this way, the travel service chassis can guide the rapid dissipation of the core heat generated by the passive cooling cloud node 6 without requiring additional active cooling equipment, thus meeting both the low-energy consumption requirements of travel service scenarios and the high reliability design requirements of this scenario.

[0029] like Figures 1-3 As shown, the travel service chassis mainly consists of a main frame 1, a top cover 2, a left sealing plate 3, a right sealing plate 4, a bottom plate 5, and passive heat dissipation cloud nodes 6. The main frame 1 serves as the overall mounting base and has a rectangular frame structure. The main frame 1 provides mounting support for the top cover 2, left sealing plate 3, right sealing plate 4, bottom plate 5, and passive heat dissipation cloud nodes 6. The top cover 2, left sealing plate 3, right sealing plate 4, and bottom plate 5 are all detachably connected to the main frame 1, collectively forming a closed chassis cavity, providing a safe installation space for the passive heat dissipation cloud nodes 6. The passive heat dissipation cloud nodes 6 are installed within the chassis cavity to achieve efficient dissipation of core heat.

[0030] like Figures 4-6 As shown, the passive heat dissipation cloud node 6 adopts an integrated design, mainly composed of a cloud node body 61, a core heat conduction module 62, and a dual-path heat dissipation expansion module 63. The cloud node body 61 includes a PCBA substrate 611 and a chip 612 integrated on the PCBA substrate 611. The PCBA substrate 611 provides the mounting carrier and circuit connection foundation for the chip 612, which serves as the core computing unit and continuously generates heat during operation. The core heat conduction module 62 is directly connected to the chip 612 and is responsible for rapidly conducting the core heat generated by the chip 612. The dual-path heat dissipation expansion module 63 is thermally connected to the core heat conduction module 62 and is used to dissipate the heat conducted to the core heat conduction module 62 to the external environment.

[0031] Similarly, Figures 4-6 As shown, the core heat dissipation module 62 includes a heat dissipation base 621, a heat pipe assembly 622, and a high thermal conductivity interface material 623. The high thermal conductivity interface material 623 is filled between the chip 612 and the heat dissipation base 621, and its thermal conductivity is not less than 3 W / (m²). The heat sink 621 has a thickness of 0.1–0.3 mm, which effectively eliminates the contact gap between the chip 612 and the heat sink 621, forming a low-resistance heat conduction path and ensuring that the heat generated by the chip 612 is quickly transferred to the heat sink 621. The heat sink 621 consists of a base body 6211 and heat sink fins 6212. The base body 6211 is flat, with its bottom surface attached to a high thermal conductivity interface material 623, and its top surface serving as the forming carrier for the heat sink fins 6212. The array direction of the heat sink fins 6212 is consistent with the extension direction of the condensation section of the heat pipe assembly 622, which can increase the heat dissipation area of ​​the heat sink 621 and improve the heat conduction efficiency. The heat pipe assembly 622 is in close contact with the heat dissipation base 621, including the upper heat pipe 6221 and the lower heat pipe 6222. The evaporation sections of the upper heat pipe 6221 and the lower heat pipe 6222 are precisely arranged to correspond to the chip 612, and can directly absorb the core heat emitted by the chip 612. Its condensation section extends along the length of the cloud node body 61 and exceeds the upper and lower ends of the cloud node body 61 by a set distance, providing a basis for connection with the dual-path heat dissipation expansion module 63, and realizing rapid heat dissipation.

[0032] like Figure 4 , Figure 5 As shown, the dual-path heat dissipation extension module 63 includes an upper external heat dissipation unit 631 and a lower external heat dissipation unit 632. The upper external heat dissipation unit 631 and the lower external heat dissipation unit 632 are respectively set for the upper and lower condensation sections of the heat pipe assembly 622, and both are exposed to the outside of the cloud node body 61, forming independent upper and lower heat dissipation paths.

[0033] Similarly, Figure 4 , Figure 5 As shown, the upper-level extended heat dissipation unit 631 is preferably an aluminum alloy heat sink with fins, which is fixedly connected to the upper-level heat pipe 6221 extending beyond the condensation section of the cloud node body 61 by a thermally conductive adhesive that has both adhesive and thermal conductivity functions. The combination of aluminum alloy material and fin structure can further expand the heat dissipation area and improve the heat exchange efficiency with the external environment; the lower-level extended heat dissipation unit 632 is preferably an integrated heat dissipation module, which is thermally connected to the heat dissipation base 621 by a high thermal conductivity silicone grease used only for heat conduction, and is fixedly connected to the lower-level heat pipe 6222 extending beyond the condensation section of the cloud node body 61 by a thermally conductive adhesive, ensuring that the heat conducted by the core heat conduction module 62 is fully transferred to the lower-level extended heat dissipation unit 632. Through the coordinated action of the upper epitaxial heat dissipation unit 631 and the lower epitaxial heat dissipation unit 632, heat can be dissipated simultaneously from two independent paths, significantly improving the total heat dissipation area and heat exchange efficiency. This fully meets the heat dissipation requirements of the high-power cloud node chip 612 and avoids heat dissipation failure caused by a single heat dissipation path failure, thereby significantly enhancing the reliability and redundancy of the heat dissipation system.

[0034] The structural adaptation design of the travel-style chassis and the passive cooling cloud node 6 is key to ensuring overall heat dissipation efficiency. For example... Figure 9 As shown, the upper cover plate 2 is specially formed with process holes. When the passive heat dissipation cloud node 6 is installed in the chassis cavity, the upper extended heat dissipation unit 631 passes through the process holes and is exposed to the outside of the travel service chassis, avoiding the chassis shell from blocking the upper heat dissipation path and ensuring that the upper extended heat dissipation unit 631 is in full contact with the external environment to efficiently dissipate heat.

[0035] As a further optimization of the above technical solution, such as Figure 7 , Figure 8 As shown, the base plate 5 also serves a heat dissipation function, and it is in contact with the lower extended heat dissipation unit 632 to achieve thermal conductivity. The travel service chassis also provides sufficient heat exchange space for the lower extended heat dissipation unit 632 in its structural layout, ensuring unobstructed operation of the lower heat dissipation path. In this way, it provides stable support for the efficient passive heat dissipation of the cloud node from a structural perspective, so that the heat dissipation system formed by the core heat conduction module 62 and the dual-path heat dissipation extension module 63 can fully play its role and significantly improve the overall heat dissipation efficiency.

[0036] In actual operation, the heat generated by the chip 612 is first rapidly transferred to the heat dissipation base 621 through the high thermal conductivity interface material 623. The heat dissipation base 621 expands the heat dissipation contact area through its own heat dissipation fins 6212, transferring the heat to the upper heat pipe 6221 and the lower heat pipe 6222. The upper heat pipe 6221 and the lower heat pipe 6222 conduct the heat to the upper epitaxial heat dissipation unit 631 and the lower epitaxial heat dissipation unit 632 respectively through the condensation section. The upper epitaxial heat dissipation unit 631 is in full contact with the external environment through the process holes of the upper cover plate 2 of the travel service chassis, and the lower epitaxial heat dissipation unit 632 exchanges heat with the external environment through thermal conductivity with the base plate 5 and the reserved heat exchange space. Finally, the heat is simultaneously and efficiently dissipated from the upper and lower paths, ensuring that the chip 612 is always in a suitable operating temperature range, ensuring the stable operation of the passive heat dissipation cloud node 6, and thus providing a solid foundation for the reliable operation of the travel service chassis.

[0037] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A passive heat dissipation cloud node, characterized in that, Includes the main body of the cloud node, the core heat conduction module, and the dual-path heat dissipation expansion module; The cloud node body includes a PCBA substrate and a chip integrated on the PCBA substrate; The core heat conduction module includes a heat dissipation base, a heat pipe assembly, and a high thermal conductivity interface material; the high thermal conductivity interface material is filled between the chip and the heat dissipation base to form a low-resistance heat conduction path; the heat pipe assembly is in contact with the heat dissipation base, its evaporation section is arranged corresponding to the chip, and its condensation section extends along the length direction of the cloud node body and exceeds the upper and lower ends of the cloud node body by a set distance; The dual-path heat dissipation extension module includes an upper extended heat dissipation unit and a lower extended heat dissipation unit; the upper extended heat dissipation unit is fixedly connected to the heat pipe assembly extending beyond the condensation section at the upper end of the cloud node body and exposed to the outside of the cloud node body; the lower extended heat dissipation unit is thermally connected to the heat dissipation base and exposed to the outside of the cloud node body.

2. The passive heat dissipation cloud node according to claim 1, characterized in that, The heat pipe assembly includes an upper heat pipe and a lower heat pipe; the evaporation section of the upper heat pipe and the evaporation section of the lower heat pipe both correspond to the chip arrangement; the condensation section of the upper heat pipe extends to the upper end of the cloud node body and is thermally connected to the upper epitaxial heat dissipation unit; the condensation section of the lower heat pipe extends to the lower end of the cloud node body and is thermally connected to the lower epitaxial heat dissipation unit.

3. The passive heat dissipation cloud node according to claim 2, characterized in that, The upper-level extended heat dissipation unit is an aluminum alloy heat sink with fins, and it is fixedly connected to the condensation section of the upper-level heat pipe by a thermally conductive adhesive that has both bonding and thermal conductivity functions.

4. The passive heat dissipation cloud node according to claim 2, characterized in that, The lower-level epitaxial heat dissipation unit is an integrated heat dissipation module, and it is thermally connected to the heat dissipation base through high thermal conductivity silicone grease used only for heat conduction; the lower-level epitaxial heat dissipation unit and the condensation section of the lower-level heat pipe are fixedly connected by thermally conductive adhesive that has both bonding and thermal conduction functions.

5. The passive heat dissipation cloud node according to claim 1, characterized in that, The thermal conductivity of the high thermal conductivity interface material is not less than 3 W / (m·K), and the thickness is controlled between 0.1 and 0.3 mm.

6. The passive heat dissipation cloud node according to claim 1, characterized in that, The heat dissipation base consists of a base body and heat dissipation fins; the base body is flat, with its bottom surface in contact with the high thermal conductivity interface material, and its top surface serving as the forming carrier for the heat dissipation fins; the array direction of the heat dissipation fins is consistent with the extension direction of the condensation section of the heat pipe assembly.

7. A travel service chassis, characterized in that, The system includes a main frame, a top cover, a left sealing plate, a right sealing plate, a bottom plate, and a passive heat dissipation cloud node as described in any one of claims 1-6; the main frame has a rectangular frame structure; the top cover, the left sealing plate, the right sealing plate, and the bottom plate are all detachably connected to the main frame, forming a chassis housing cavity; the top cover has process holes; the passive heat dissipation cloud node is installed inside the chassis housing cavity, and the upper extended heat dissipation unit passes through the process holes and is exposed to the outside of the travel service chassis.

8. The travel service chassis according to claim 7, characterized in that, The base plate also has a heat dissipation function, and it is in contact with the lower extended heat dissipation unit to achieve thermal conductivity.

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