Display packaging structure and packaging method

Abstract

The invention relates to a display packaging structure and packaging method, and the structure is provided with a reflection and light isolation integrated structure on the top surface of a printed circuit board, and independent light-emitting cavities in matrix arrangement in the structure provide independent installation spaces for light-emitting units. The light reflecting layer on the inner side wall of the display device can directionally reflect lateral light generated when the light emitting unit works, so that the lateral light which is not effectively utilized originally is guided to the forward light emitting direction, and the overall light emitting efficiency of the display device is further improved. Meanwhile, the light isolation layer covers the top surface of the printed circuit board and is arranged around the independent light-emitting cavities, light propagation paths between the adjacent independent light-emitting cavities can be physically blocked, and inter-pixel light crosstalk caused by lateral light leakage is avoided, so that the contrast ratio and the color separation degree of a display picture are optimized, and the display performance is comprehensively improved.

Description

Technical Field

[0001] This application relates to the field of LED displays, specifically to a display packaging structure and packaging method. Background Technology

[0002] Currently, small-pitch, high-brightness display technology has become the core development direction in the display field. MiP (Micro LED In Package) and COB (Chip On Board) packaging technologies, with their advantages of high-density integration and high image quality, are widely used in many scenarios such as indoor high-definition displays, outdoor high-brightness displays, and special environment displays. As terminal applications continue to increase their requirements for display resolution, image contrast, and brightness, how to further optimize light utilization efficiency and reduce light loss while ensuring pixel isolation has become a key need that the industry urgently needs to overcome. This is also driving the related packaging structures to iterate and upgrade towards "precise light control and efficient light utilization".

[0003] In related technologies, both MiP and COB display devices use direct die bonding of chips or integrated die bonding of modules to achieve pixel array arrangement. To meet the pixel isolation requirements, optical isolation structures are usually set between pixels to reduce mutual interference of light.

[0004] However, in the MiP packaging structure, the LED is directly bonded to the surface of the printed circuit board, and in the COB packaging structure, the chip is directly mounted on the PCB. Both of them generate a high proportion of lateral light emission during operation. Existing optical isolation structures mostly focus on blocking light between pixels and lack effective design for recovering and utilizing lateral light. This causes this part of the lateral light to either leak to adjacent pixels, causing optical crosstalk and affecting the contrast and color separation of the display, or it is directly absorbed by the light-shielding structure, causing light loss, resulting in limited effective light emission from the front of the device. Summary of the Invention

[0005] This application provides a display packaging structure and packaging method, which can solve the technical problems in related technologies where MiP and COB display devices have limited front light emission due to the inability to effectively recycle side light, and the easy occurrence of light crosstalk between pixels, thus affecting the contrast, color separation and brightness of the display screen.

[0006] In a first aspect, embodiments of this application provide a display packaging structure, which includes: Printed circuit boards; The integrated reflective and optical isolation structure disposed on the printed circuit board includes multiple independent light-emitting chambers, a reflective layer, and an optical isolation layer arranged in a matrix. The optical isolation layer is disposed on the top surface of the printed circuit board, the light-emitting independent chamber is formed on the top surface of the optical isolation layer, and the reflective layer is disposed on the inner side wall of the light-emitting independent chamber; The optical isolation layer is used to block optical crosstalk between adjacent light-emitting independent chambers, and the reflective layer is used to reflect the side light from the light-emitting independent chamber to the positive light-emitting direction.

[0007] In conjunction with the first aspect, in one embodiment, the sidewalls of the reflective layer are arranged in an arc shape.

[0008] In conjunction with the first aspect, in one embodiment, the integrated reflection and optical isolation structure further includes: The arc-shaped gel fills the light-emitting independent cavity and covers the inner wall of the reflective layer; The top surface of the arc-shaped gel has a light-emitting hole, which is used to accommodate the light-emitting unit.

[0009] In conjunction with the first aspect, in one embodiment, the display packaging structure further includes: An encapsulation layer covers the top surface of the light-isolating layer, fills the gap between the light-emitting unit and the light-emitting independent chamber, and covers the surface of the light-emitting unit.

[0010] In conjunction with the first aspect, in one embodiment, the display packaging structure further includes: Multiple light-emitting units are housed in corresponding independent light-emitting chambers and are all mounted on the printed circuit board.

[0011] Secondly, embodiments of this application provide a packaging method for a display packaging structure, which includes the following steps: A matrix of arc-shaped gel particles is formed on the top surface of the substrate to serve as the basic structure of the light-emitting independent chamber; A reflective layer is covered on the surface of the substrate and the arc-shaped colloid, and a light-isolating layer is covered on the surface of the reflective layer, so that the arc-shaped colloid, the reflective layer and the light-isolating layer form a composite structure. A placement window is formed by processing the top surface of the light-isolating layer and the arc-shaped gel, the composite structure is inverted and the reflective layer 4 covering the surface of the light-isolating layer 5 is removed; Light-emitting holes are formed in the central area of ​​each arc-shaped colloid, and the composite structure is mounted on the top surface of a printed circuit board with light-emitting units.

[0012] In conjunction with the second aspect, in one embodiment, the formation of a matrix of arc-shaped aggregates on the top surface of the supporting substrate as the basic structure of the light-emitting independent chamber includes: Adhesive is applied to the top surface of the substrate using a dispensing method according to a preset matrix coordinate. The adhesive spreads naturally under its own surface tension and gravity, forming an arc-shaped adhesive mass. The curved surface gel is cured to fix the curved surface contour, and the arrangement density of the cured curved surface gel is adapted to the array density of the light-emitting unit.

[0013] In conjunction with the second aspect, in one embodiment, covering the surface of the substrate and the curved adhesive surface with a reflective layer, and then covering the surface of the reflective layer with a light-isolating layer, includes: A uniform reflective layer is formed on the top surface of the substrate and the outer surface of the curved adhesive pad by spraying. A light-isolating material is applied to the entire surface of the reflective layer by coating or dispensing. After curing, a light-isolating layer is formed, and the thickness of the light-isolating layer is higher than the height of the curved adhesive pad.

[0014] In conjunction with the second aspect, in one embodiment, the process of forming a placement window on the top surface of the optically insulating layer and the arc-shaped gel, inverting the composite structure, and removing the reflective layer covering the surface of the optically insulating layer includes: The top surface of the light-isolating layer and the arc-shaped gel are ground using a grinding equipment. The grinding depth is controlled to expose the top of the arc-shaped gel, forming a placement window that matches the light-emitting surface of the light-emitting unit. The composite structure consisting of the carrier substrate, reflective layer, light-isolating layer and curved surface gel is separated by dissociation treatment; Invert the composite structure so that the bottom surface of the optical isolation layer faces upward, and remove the reflective layer covering the surface of the optical isolation layer by grinding or polishing, leaving only the reflective layer on the outer surface of the curved gel.

[0015] In conjunction with the second aspect, in one embodiment, the step of forming a light-emitting hole in the central region of each arc-shaped adhesive mass and mounting a light-isolating layer on the top surface of the printed circuit board with the light-emitting unit includes: A through-hole is formed in the central region of each arc-shaped colloid; The position of the printed circuit board and the light-emitting holes is calibrated by a visual recognition system, so that the light-emitting units on the printed circuit board correspond one-to-one with the multiple light-emitting holes; The printed circuit board is precisely aligned and bonded to the bottom surface of the optical isolation layer; The bonded structure is baked and cured in a vacuum environment to ensure a firm bond between the printed circuit board and the photoisolation layer.

[0016] The beneficial effects of the technical solutions provided in this application include: By setting an integrated reflective and light-isolation structure on the top surface of the printed circuit board, the matrix-arranged independent light-emitting chambers in this structure provide independent installation space for the light-emitting units. The reflective layer on its inner sidewall can directionally reflect the side light generated when the light-emitting units are working, so that the side light that was not effectively utilized is guided to the positive light direction, thereby improving the overall luminous efficiency of the display device. At the same time, the light-isolation layer covers the top surface of the printed circuit board and surrounds the independent light-emitting chambers, which can physically block the light propagation path between adjacent independent light-emitting chambers, avoid inter-pixel light crosstalk caused by side light leakage, thereby optimizing the contrast and color separation of the display image and achieving a comprehensive improvement in display performance. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram illustrating the deposition of an ultraviolet-dissociable film on a substrate, as provided in an embodiment of this application. Figure 2 This is a schematic diagram of dispensing and forming arc-shaped adhesive balls on an ultraviolet-dissociable film according to an embodiment of this application; Figure 3 This is a schematic diagram of laying a reflective layer on an ultraviolet-dissociative thin film and an arc-shaped colloid, provided as an embodiment of this application. Figure 4 This is a schematic diagram of laying a light-isolating layer on a reflective layer, provided in an embodiment of this application. Figure 5 This is a schematic diagram illustrating the fabrication and placement of a window on an optically insulating layer, provided as an embodiment of this application. Figure 6 This is a schematic diagram of the peeling off of the carrier substrate and the inverted light-isolating layer provided in an embodiment of this application; Figure 7 This is a schematic diagram illustrating the removal of the reflective layer covering the optical isolation layer, as provided in an embodiment of this application. Figure 8 A schematic diagram illustrating the formation of a light-emitting hole on an arc-shaped colloid, provided as an embodiment of this application; Figure 9 This is a schematic diagram of mounting a printed circuit board on the bottom surface of an optical isolation layer, provided as an embodiment of this application. Figure 10 This is a schematic diagram of mounting an encapsulation layer on the top surface of an optical isolation layer, as provided in an embodiment of this application.

[0019] In the figure: 1. Substrate; 2. UV-dissociative film; 3. Curved surface gel; 4. Reflective layer; 5. Optical isolation layer; 6. Printed circuit board; 7. Light-emitting unit; 8. Encapsulation layer; 9. Independent light-emitting chamber; 10. Light-emitting hole; 11. Placement window. Detailed Implementation

[0020] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0021] This application provides a display packaging structure and packaging method, which can solve the technical problems in related technologies where MiP and COB display devices have limited front light emission due to the inability to effectively recycle side light, and are prone to optical crosstalk between pixels, thus affecting the contrast, color separation and brightness of the display screen.

[0022] Firstly, such as Figure 9 and Figure 10 As shown, this application embodiment provides a display packaging structure, which includes: a printed circuit board 6; an integrated reflective and optical isolation structure disposed on the printed circuit board 6, the integrated reflective and optical isolation structure including a plurality of light-emitting independent chambers 9 arranged in a matrix, a reflective layer 4 and an optical isolation layer 5; the optical isolation layer 5 is disposed on the top surface of the printed circuit board 6, the light-emitting independent chambers 9 are formed on the top surface of the optical isolation layer 5, and the reflective layer 4 is disposed on the inner sidewall of the light-emitting independent chambers 9; the optical isolation layer 5 is used to block the light crosstalk between adjacent light-emitting independent chambers 9, and the reflective layer 4 is used to reflect the side light of the light-emitting independent chambers 9 to the forward light emission direction.

[0023] In this embodiment, an integrated reflective and light-isolation structure is provided on the top surface of the printed circuit board 6. The matrix-arranged independent light-emitting chambers 9 in this structure provide independent installation space for the light-emitting units. The reflective layer 4 on its inner sidewall can directionally reflect the side light generated when the light-emitting units are working, so that the side light that was not effectively utilized is guided to the positive light direction, thereby improving the overall luminous efficiency of the display device. At the same time, the light-isolation layer 5 covers the top surface of the printed circuit board 6 and surrounds the independent light-emitting chambers 9. It can physically block the light propagation path between adjacent independent light-emitting chambers 9, avoid inter-pixel light crosstalk caused by side light leakage, thereby optimizing the contrast and color separation of the display screen and achieving a comprehensive improvement in display performance.

[0024] In conjunction with the first aspect, in one implementation, such as Figure 9 and Figure 10As shown, the sidewalls of the reflective layer 4 are curved.

[0025] In this embodiment, the curved surface structure can adapt to the divergence trajectory of the side light from the light-emitting unit, so that side light from different angles can be accurately guided to the front light direction after being reflected by the reflective layer 4, thereby improving the recycling rate of side light and further enhancing the front light brightness of the display device. At the same time, the curved surface structure can reduce the diffuse reflection of light on the surface of the reflective layer 4, reduce the risk of reflected light leaking into adjacent light-emitting independent chambers 9, and further optimize the light isolation effect between pixels in conjunction with the light isolation layer 5, ensuring the color purity and contrast of the displayed image.

[0026] In conjunction with the first aspect, in one implementation, such as Figure 8 , Figure 9 and Figure 10 As shown, the integrated structure of reflection and light isolation also includes: an arc-shaped gel 3, which fills the light-emitting independent chamber 9 and covers the inner wall of the reflective layer 4; the top surface of the arc-shaped gel 3 is provided with a light-emitting hole 10, which is used to accommodate the light-emitting unit 7.

[0027] In this embodiment, the curved adhesive pad 3 is designed to fit the curved contour of the reflective layer 4, which can cover and protect the reflective layer 4, preventing it from falling off or being damaged by external forces or the encapsulation process, and ensuring the stability of the lateral light reflection function. At the same time, the light emission hole 10 is precisely matched with the shape of the light-emitting unit 7, which can position and limit the light-emitting unit 7, ensuring that the light-emitting surface of the light-emitting unit 7 is aligned with the light emission hole 10 after installation, reducing light loss caused by installation deviation, and further improving the light emission efficiency and light emission consistency in conjunction with the reflective layer 4.

[0028] In conjunction with the first aspect, in one implementation, such as Figure 10 As shown, the display packaging structure also includes: a packaging layer 8, which covers the top surface of the light isolation layer 5, for filling the gap between the light-emitting unit 7 and the light-emitting independent chamber 9, and for covering the surface of the light-emitting unit 7.

[0029] In this embodiment, the encapsulation layer 8 can fill the gap between the light-emitting unit 7 and the light-emitting independent chamber 9, preventing light leakage from the gap and aggravating light crosstalk. At the same time, it forms a sealed protection, isolating external moisture and dust from eroding the core structure such as the light-emitting unit 7 and the reflective layer 4, and ensuring the long-term stability of the encapsulation structure. In addition, the encapsulation layer 8 covers the surface of the light-emitting unit 7, which can provide physical protection for the light-emitting unit 7 and prevent it from being damaged by external impact. Moreover, the transparent encapsulation layer 8 does not affect the positive light emission of the light-emitting unit 7. Combined with the light recovery function of the reflective layer 4 and the light-shielding function of the light isolation layer 5, it further ensures the stable output of display performance.

[0030] In conjunction with the first aspect, in one implementation, such as Figure 10As shown, the display packaging structure also includes: multiple light-emitting units 7, which are housed in corresponding independent light-emitting chambers 9 and are all mounted on printed circuit boards 6.

[0031] In this embodiment, each light-emitting unit 7 is enclosed by an independent chamber structure. With the help of the light isolation layer 5, pixel-level optical isolation can be achieved, completely blocking light crosstalk between adjacent light-emitting units 7 and ensuring accurate color separation of the displayed image. At the same time, the side of the light-emitting unit 7 is arranged opposite to the reflective layer 4. The side light generated during operation can be directly reflected by the reflective layer 4 to the positive light output direction, reducing light loss, improving the light utilization rate of the light-emitting unit 7, and thus enhancing the overall brightness and image clarity of the display device.

[0032] Secondly, such as Figures 1 to 10 As shown in the figure, this application provides a packaging method for a display packaging structure, which includes the following steps: S1: As Figure 1 and Figure 2 As shown, a matrix of arc-shaped gel particles 3 are formed on the top surface of the substrate 1, serving as the basic structure of the light-emitting independent chamber 9. S2: As Figure 3 and Figure 4 As shown, a reflective layer 4 is covered on the surface of the substrate 1 and the arc-shaped gel 3, and a light-isolating layer 5 is covered on the surface of the reflective layer 4, so that the arc-shaped gel 3, the reflective layer 4 and the light-isolating layer 5 form a composite structure. S3: As Figure 5 , Figure 6 and Figure 7 As shown, a placement window 11 is formed on the top surface of the light-isolating layer 5 and the arc-shaped adhesive mass 3, the composite structure is inverted and the reflective layer 4 covering the surface of the light-isolating layer 5 is removed; S4: As Figure 8 , Figure 9 and Figure 10 As shown, a light-emitting hole is formed in the central region of each arc-shaped colloid 3, and the composite structure is mounted on the top surface of the printed circuit board 6 with the light-emitting unit 7.

[0033] In this embodiment, by forming a matrix of arc-shaped gel balls 3 on the top surface of the supporting substrate 1, a suitable basic contour is provided for the subsequent molding of the light-emitting independent chamber 9, ensuring the accuracy of the arc-shaped structure of the light-emitting independent chamber 9; by covering the surface of the supporting substrate 1 and the arc-shaped gel balls 3 with a reflective layer 4 and superimposing a light-isolating layer 5, the integrated molding of the light reflection and light-isolating functional layers can be completed simultaneously, simplifying the process flow and ensuring the tight fit between the reflective layer 4 and the arc-shaped gel balls 3, ensuring the lateral light reflection effect; a placement window 11 is formed on the top surface of the light-isolating layer 5 and the arc-shaped gel balls 3, and after peeling off the supporting substrate 1, it is inverted and the light-isolating layer 5 is removed. The reflective layer 4 on the surface can accurately retain the reflective layer 4 on the surface of the curved adhesive mass 3, avoiding light interference caused by the reflective layer 4 in non-target areas. At the same time, the forming of the placement window 11 provides a channel for the light emission of the subsequent light-emitting unit 7. A light-emitting hole is processed in the center of the curved adhesive mass 3 and a printed circuit board 6 is installed to achieve precise assembly of the light-emitting independent chamber 9 and the printed circuit board 6, ensuring the alignment accuracy of the light-emitting unit 7 with the light-emitting hole and the placement window 11. Finally, through the synergistic cooperation of each step, a display packaging structure with both high light recovery efficiency and high light isolation performance is efficiently prepared. Moreover, the overall process is simple and controllable, and it is suitable for mass production needs.

[0034] In conjunction with the second aspect, in one implementation, S1 includes the following steps: S1-1: Apply adhesive to the top surface of the substrate 1 using a dispensing method according to a preset matrix coordinate. The adhesive spreads naturally under its own surface tension and gravity, forming an arc-shaped adhesive mass 3. S1-2: The curved surface gel 3 is cured to fix the curved surface contour. The arrangement density of the cured curved surface gel 3 is adapted to the array density of the light-emitting unit 7.

[0035] In this embodiment, the precise application of adhesive using preset matrix coordinates ensures the arrangement accuracy of the curved adhesive mass 3, guaranteeing accurate alignment with the light-emitting unit 7 and the printed circuit board 6. The adhesive naturally spreads out using its own surface tension and gravity to form a curved surface, eliminating the need for additional mold shaping and simplifying the curved surface structure forming process. The curing process stabilizes and fixes the contour of the curved adhesive mass 3, preventing deformation of the curved surface in subsequent processes from affecting the bonding effect of the reflective layer 4 and the forming accuracy of the light-emitting independent chamber 9. At the same time, it adapts to the arrangement design of the array density of the light-emitting unit 7, ensuring the pixel array compatibility of the encapsulation structure.

[0036] In conjunction with the second aspect, in one implementation, S2 includes the following steps: S2-1: A uniform reflective layer 4 is formed on the top surface of the substrate 1 and the outer surface of the arc-shaped adhesive mass 3 by spraying; wherein, the reflective layer 4 can be cured to enhance the bonding strength between the reflective layer 4 and the substrate and prevent it from falling off in subsequent processes. S2-2: Apply a light-isolating material to the surface of the reflective layer 4 by coating or dispensing. After curing, a light-isolating layer 5 is formed, and the thickness of the light-isolating layer 5 is higher than the height of the curved adhesive mass 3.

[0037] In this embodiment, the spraying method allows the reflective layer 4 to uniformly cover the outer surface of the curved adhesive mass 3 and the top surface of the substrate 1, ensuring the consistency of the reflective layer 4 thickness and avoiding localized weak reflections that could affect the light recovery effect. By coating or applying adhesive to fully cover the light-isolating material, it can be ensured that the light-isolating layer 5 completely wraps the reflective layer 4 and the curved adhesive mass 3, achieving comprehensive light isolation between pixels. The design of the light-isolating layer 5 being thicker than the curved adhesive mass 3 provides sufficient margin for subsequent top surface processing to form the placement window 11, ensuring the processing accuracy of the placement window 11, and at the same time ensuring the stable light-shielding and isolation performance of the light-isolating layer 5.

[0038] In conjunction with the second aspect, in one implementation, S3 includes the following steps: S3-1: The top surface of the light-isolating layer 5 and the arc-shaped gel 3 is ground using a grinding equipment. The grinding depth is controlled so that the top of the arc-shaped gel 3 is exposed, forming a placement window 11 that is compatible with the light-emitting surface of the light-emitting unit 7. S3-2: Separate the supporting substrate 1 from the composite structure through a dissociation process; S3-3: Invert the composite structure so that the bottom surface of the light-isolating layer 5 faces upward. Remove the reflective layer 4 covering the surface of the light-isolating layer 5 by grinding or polishing, leaving only the reflective layer 4 on the outer surface of the arc-shaped gel 3.

[0039] In this embodiment, the grinding depth is precisely controlled by the grinding equipment, which allows the size of the placement window 11 to be precisely matched with the light-emitting surface of the light-emitting unit 7, ensuring smooth subsequent light emission. At the same time, it ensures the flatness of the plane where the placement window 11 is located, improving the consistency of light emission. The dissociation process can achieve non-damaging separation of the carrier substrate 1 and the composite structure, avoiding damage to the structural integrity of the reflective layer 4, the light isolation layer 5 and the arc-shaped adhesive 3 during the separation process. After the composite structure is inverted, the reflective layer 4 on the surface of the light isolation layer 5 is removed in a targeted manner, leaving only the reflective layer 4 on the outer surface of the arc-shaped adhesive 3. This can effectively avoid stray light interference caused by the reflective layer 4 in non-target areas, ensuring that the reflective layer 4 only plays the role of lateral light recovery. Together with the light isolation layer 5, it further enhances the light isolation effect between pixels and ensures the optical performance of the packaging structure.

[0040] In conjunction with the second aspect, in one implementation, step S4 includes the following steps: S4-1: A through-hole is formed in the central region of each arc-shaped colloid 3; the through-hole can be formed by laser processing. S4-2: The position of the printed circuit board 6 and the light-emitting holes is calibrated by the visual recognition system so that the light-emitting units on the printed circuit board 6 correspond one-to-one with the multiple light-emitting holes; S4-3: Precisely align and bond the printed circuit board 6 to the bottom surface of the optical isolation layer 5; S4-4: The bonded structure is baked and cured in a vacuum environment to ensure that the printed circuit board 6 and the photoisolation layer 5 are firmly bonded together.

[0041] In this embodiment, the laser processing method has high precision characteristics, which can ensure the accurate size and regularity of the light emission hole 10, and ensure the matching and installation accuracy with the light emission unit 7, laying the foundation for the subsequent accurate positioning of the light emission unit 7. The calibration function of the visual recognition system can achieve high-precision alignment between the printed circuit board 6 and the light emission hole 10, ensuring that the light emission unit 7 on the printed circuit board 6 corresponds one-to-one with the light emission hole 10, avoiding installation deviation and light loss of the light emission unit 7 caused by misalignment. Baking and curing in a vacuum environment can remove air in the bonding gap, preventing light leakage or weak bonding caused by residual air bubbles, strengthening the connection stability between the printed circuit board 6 and the optical isolation layer 5, and ensuring the mechanical reliability of the packaging structure. The precise matching of the light emission unit 7 and the light emission hole 10 can make the side of the light emission unit 7 precisely aligned with the reflective layer 4 on the outer surface of the curved adhesive 3, ensuring efficient recovery of lateral light. At the same time, it works with the optical isolation layer 5 to achieve pixel-level optical isolation, ultimately ensuring high light efficiency and high display quality of the packaging structure. Moreover, the entire process is precise and controllable, adapting to the needs of mass production.

[0042] In summary, the packaging method of the display packaging structure provided in this application is described in its entirety as follows: Step 1: Preparation of the basic structure of arc-shaped micelles 3 like Figure 1 As shown, a carrier substrate 1 is first provided, and an ultraviolet-dissociative film 2 is laid on the top surface of the carrier substrate 1 as a carrier base for subsequent colloidal molding, which facilitates the subsequent peeling of the structure.

[0043] like Figure 2 As shown, a matrix of arc-shaped adhesive clusters 3 are formed on the top surface of the ultraviolet dissociative film 2 (i.e., the top surface of the substrate 1), serving as the basic structure of the light-emitting independent chamber 9. Adhesive is applied to the top surface of the ultraviolet dissociative film 2 according to a preset matrix coordinate using a dispensing method. The adhesive spreads naturally under its own surface tension and gravity, forming the arc-shaped adhesive clusters 3. The arc-shaped adhesive clusters 3 are then cured to fix their arc contours. The arrangement density of the cured arc-shaped adhesive clusters 3 matches the array density of the light-emitting unit 7, ensuring precise alignment with the light-emitting unit 7 in subsequent applications.

[0044] Step 2: Sequentially prepare reflective layer 4 and light-isolating layer 5. like Figure 3As shown, a reflective layer 4 is applied to the surface of the substrate 1 (UV-dissociative film 2) and the curved surface gel 3. A uniform reflective layer 4 is formed on the top surface of the UV-dissociative film 2 and the outer surface of the curved surface gel 3 by spraying. After formation, the reflective layer 4 is cured to ensure the bonding strength and thickness consistency between the reflective layer 4 and the substrate.

[0045] like Figure 4 As shown, a light-isolating layer 5 is covered on the surface of the reflective layer 4. The light-isolating material is fully covered on the surface of the reflective layer 4 by coating or dispensing. After curing, the light-isolating layer 5 is formed, and the thickness of the light-isolating layer 5 is higher than the height of the curved adhesive mass 3, leaving a margin for subsequent top surface processing.

[0046] Step 3: Process and place window 11 and handle the composite structure. like Figure 5 As shown, the top surfaces of the light-isolating layer 5 and the curved surface gel 3 are processed to form a placement window 11. A grinding machine is used to grind the top surfaces of the light-isolating layer 5 and the curved surface gel 3, and the grinding depth is controlled to expose the top of the curved surface gel 3, forming a placement window 11 that matches the light-emitting surface of the light-emitting unit 7, ensuring the flatness of the plane of the placement window 11.

[0047] like Figure 6 As shown, the supporting substrate 1 at the bottom is peeled off, and the light-isolating layer 5 is inverted. The composite structure consisting of the supporting substrate 1, the reflective layer 4, the light-isolating layer 5, and the arc-shaped adhesive pad 3 is separated by a dissociation process, achieving non-damaging peeling; then the composite structure is inverted so that the bottom surface of the original light-isolating layer 5 faces upward, in preparation for the subsequent removal of the reflective layer 4 in the non-target area.

[0048] like Figure 7 As shown, the reflective layer 4 covering the optical isolation layer 5 is removed. The reflective layer 4 covering the surface of the optical isolation layer 5 is removed by grinding or polishing, leaving only the reflective layer 4 on the outer surface of the curved adhesive mass 3, to avoid stray light interference caused by the reflective layer 4 in non-target areas.

[0049] Step 4: Process the optical aperture 10 and complete the assembly of the optical isolation layer 5 on the printed circuit board 6. like Figure 8 As shown, a light-emitting hole 10 is formed in the central region of each arc-shaped gel mass 3. A through-hole 10 is formed in the central region of each arc-shaped gel mass 3 by laser processing to ensure that the light-emitting hole 10 is dimensionally accurate, has regular hole walls, and is adapted to the shape of the light-emitting unit 7.

[0050] like Figure 9As shown, a printed circuit board 6 is mounted on the bottom surface of the optical isolation layer 5. The printed circuit board 6 is precisely aligned and bonded to the bottom surface of the optical isolation layer 5. Before bonding, the position of the printed circuit board 6 and the light-emitting hole 10 is calibrated by a visual recognition system, so that the light-emitting unit 7 on the printed circuit board 6 corresponds one-to-one with each light-emitting hole 10. The bonded structure is baked and cured in a vacuum environment to firmly bond the printed circuit board 6 and the optical isolation layer 5 and avoid light leakage caused by residual air bubbles. After bonding, the side of the light-emitting unit 7 is precisely aligned with the reflective layer 4.

[0051] like Figure 10 As shown, an encapsulation layer 8 is installed on the top surface of the optical isolation layer 5. The encapsulation layer 8 covers the top surface of the optical isolation layer 5, fills the gap between the light-emitting unit 7 and the light-emitting independent chamber 9, and covers the surface of the light-emitting unit 7 to form a sealed protection, ensuring the stability and integrity of the encapsulation structure, and finally completing the fabrication of the display encapsulation structure.

[0052] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0053] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0054] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A display packaging structure, characterized in that, It includes: Printed circuit board (6); The integrated structure of reflection and light isolation is disposed on the printed circuit board (6). The integrated structure of reflection and light isolation includes multiple independent light-emitting chambers (9) arranged in a matrix, a reflective layer (4) and a light-isolating layer (5). The optical isolation layer (5) is disposed on the top surface of the printed circuit board (6), the light-emitting independent chamber (9) is opened on the top surface of the optical isolation layer (5), and the reflective layer (4) is disposed on the inner side wall of the light-emitting independent chamber (9); The optical isolation layer (5) is used to block optical crosstalk between adjacent light-emitting independent chambers (9), and the reflective layer (4) is used to reflect the side light of the light-emitting independent chamber (9) to the positive light-emitting direction.

2. The display packaging structure as described in claim 1, characterized in that, The sidewalls of the reflective layer (4) are curved.

3. The display packaging structure as described in claim 1, characterized in that, The integrated structure for reflection and optical isolation also includes: Arc-shaped colloid (3) fills the light-emitting independent chamber (9) and covers the inner wall of the reflective layer (4); The top surface of the arc-shaped gel (3) is provided with a light-emitting hole (10), which is used to accommodate the light-emitting unit (7).

4. The display packaging structure as described in claim 1, characterized in that, The display packaging structure further includes: An encapsulation layer (8) covers the top surface of the light-isolating layer (5) and is used to fill the gap between the light-emitting unit (7) and the light-emitting independent chamber (9) and to cover the surface of the light-emitting unit (7).

5. The display packaging structure as described in claim 1, characterized in that, The display packaging structure further includes: Multiple light-emitting units (7) are housed in corresponding light-emitting independent chambers (9) and are all mounted on the printed circuit board (6).

6. A packaging method for a display packaging structure, characterized in that, It includes the following steps: A matrix of arc-shaped colloids (3) is formed on the top surface of the substrate (1) as the basic structure of the light-emitting independent chamber (9); A reflective layer (4) is covered on the surface of the substrate (1) and the arc-shaped colloid (3), and a light-isolating layer (5) is covered on the surface of the reflective layer (4), so that the arc-shaped colloid (3), the reflective layer (4) and the light-isolating layer (5) form a composite structure; A placement window (11) is formed on the top surface of the light-isolating layer (5) and the arc-shaped gel (3), the composite structure is inverted and the reflective layer (4) covering the surface of the light-isolating layer (5) is removed. Light-emitting holes (10) are formed in the central area of ​​each arc-shaped colloid (3), and the composite structure is mounted on the top surface of a printed circuit board (6) with a light-emitting unit (7).

7. The packaging method for the display packaging structure as described in claim 6, characterized in that, The matrix-arranged arc-shaped aggregates (3) formed on the top surface of the substrate (1) serve as the basic structure of the light-emitting independent chamber (9), including: Adhesive is applied to the top surface of the substrate (1) using a dispensing method according to a preset matrix coordinate. The adhesive spreads naturally under its own surface tension and gravity, forming an arc-shaped adhesive mass (3). The arc-shaped gel (3) is cured to fix the arc-shaped contour. The arrangement density of the cured arc-shaped gel (3) is adapted to the array density of the light-emitting unit (7).

8. The packaging method for the display packaging structure as described in claim 6, characterized in that, The process of covering the surface of the substrate (1) and the arc-shaped colloid (3) with a reflective layer (4) and then covering the surface of the reflective layer (4) with a light-isolating layer (5) includes: A uniform reflective layer (4) is formed on the top surface of the substrate (1) and the outer surface of the arc-shaped adhesive mass (3) by spraying. The reflective layer (4) is fully covered with light-isolating material by coating or dispensing. After curing, a light-isolating layer (5) is formed, and the thickness of the light-isolating layer (5) is higher than the height of the arc-shaped adhesive matrix (3).

9. The packaging method for the display packaging structure as described in claim 6, characterized in that, The process of forming a placement window (11) on the top surface of the light-isolating layer (5) and the arc-shaped adhesive mass (3), inverting the composite structure and removing the reflective layer (4) covering the surface of the light-isolating layer (5) includes: The top surface of the light-isolating layer (5) and the arc-shaped gel (3) is ground using a grinding equipment. The grinding depth is controlled so that the top of the arc-shaped gel (3) is exposed, forming a placement window (11) that is compatible with the light-emitting surface of the light-emitting unit (7). The supporting substrate (1) is separated from the composite structure by a dissociation process; The composite structure is inverted so that the bottom surface of the light-isolating layer (5) faces upward. The reflective layer (4) covering the surface of the light-isolating layer (5) is removed by grinding or polishing, leaving only the reflective layer (4) on the outer surface of the arc-shaped gel (3).

10. The packaging method for the display packaging structure as described in claim 6, characterized in that, The process of forming a light-emitting hole (10) in the central region of each arc-shaped colloid (3) and mounting a light-isolating layer (5) on the top surface of a printed circuit board (6) with a light-emitting unit (7) includes: A through-hole (10) is formed in the central region of each arc-shaped colloid (3). The position of the printed circuit board (6) and the light-emitting hole (10) is calibrated by a visual recognition system so that the light-emitting unit (7) on the printed circuit board (6) corresponds one-to-one with the multiple light-emitting holes (10); The printed circuit board (6) is precisely aligned and bonded to the bottom surface of the optical isolation layer (5); The bonded structure is baked and cured in a vacuum environment to firmly bond the printed circuit board (6) with the photoisolator (5).

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