Slide glass boat circulation equipment, substrate processing system and slide glass boat circulation method
By optimizing the spatial layout of the wafer carrier transfer equipment and adopting a grabbing crane, wafer carrier transfer components, and inserting wafer components, the transfer steps are simplified, equipment costs are reduced, and production efficiency is improved. This solves the problems of complex wafer carrier replacement actions, high equipment costs, large footprint, and low work efficiency in the wafer carrier transfer system.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- JIANGSU MICROVIA NANO EQUIP TECH CO LTD
- Filing Date
- 2026-02-04
- Publication Date
- 2026-05-05
AI Technical Summary
The slide carrier transfer system involves complex boat-changing operations, high equipment costs, large footprint, and low work efficiency.
Optimize the spatial layout of the wafer carrier transfer equipment by using a grabbing crane, wafer carrier transfer components, and inserting wafer components to simplify the transfer steps, reduce the number of automated equipment, and shorten the transfer path.
It significantly simplifies the wafer carrier transfer process, reduces equipment costs, minimizes potential repair points, improves production efficiency, and meets the requirements of higher-efficiency production lines.
Smart Images

Figure CN121985771A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor manufacturing process technology, specifically to a wafer carrier transfer device, a substrate processing system, and a wafer carrier transfer method. Background Technology
[0002] Related technologies such as substrate processing systems Figure 1 As shown, the transfer process of the slide carrier boat is as follows: The paddle structure 1' removes the clinker boat from the chamber of the substrate processing equipment 2'. The outer gripper 3' transfers the clinker boat from the paddle structure 1' to the first transfer channel 4'. The first transfer channel 4' transfers the clinker boat from area A to area B. The boat-grabbing crane 5' transfers the clinker boat from the first transfer channel 4' to the cooling buffer area 6', and after cooling, transfers the clinker boat from the cooling buffer area 6' to the second transfer channel 7'. The second transfer channel 7' transfers the clinker boat from area B to the intercalation wafer assembly. The raw material boat is transferred from the insert assembly to area B; the grabber crane 5' first transfers the raw material boat from the second transfer channel 7' to the raw material buffer area 8', and when it is necessary to load the raw material, it transfers the raw material boat from the raw material buffer area 8' to the first transfer channel 4'. The first transfer channel 4' transfers the raw material boat from area B to area A. The outer gripper 3' transfers the raw material boat from the first transfer channel 4' to the paddle structure 1'. The paddle structure 1' sends the raw material boat into the cavity of the substrate processing equipment 2'.
[0003] It can be seen that the boat-changing operation of the related technology slide carrier transfer system is complex, and a lot of automated equipment is used. Not only is the equipment cost high and the footprint large, but it also increases the number of fault repair points and the work efficiency is low. Summary of the Invention
[0004] The purpose of this application is to provide a wafer carrier transfer device, a substrate processing system, and a wafer carrier transfer method to solve the problems of complex boat replacement operations, high equipment costs, and low work efficiency. The specific solution is as follows: A wafer carrier transfer device includes a wafer carrier crane, at least one set of wafer carrier transfer components, and at least one insert wafer assembly, wherein the wafer carrier transfer components include: The equipment includes a paddle structure, a raw material buffer zone, a cooling buffer zone, and a conveying mechanism distributed along the X direction. The paddle structure is configured to carry a wafer carrier boat into and out of the chamber of the substrate processing equipment along the Y direction. A grabbing crane is located above the wafer carrier boat transfer assembly and is configured to transfer the wafer carrier boat between the paddle structure, the raw material buffer zone, the cooling buffer zone, and the conveying mechanism. The insert assembly is configured to transfer the substrate between the substrate carrier boat and the basket; the conveying mechanism is configured to transfer the substrate carrier boat between the trajectory of the grab crane and the insert assembly.
[0005] Optionally, the cooling buffer area and the paddle structure are arranged adjacent to each other.
[0006] Optionally, the wafer carrier transfer assembly includes two conveying mechanisms, with the paddle structure and the cooling buffer area within the same wafer carrier transfer assembly located between the two conveying mechanisms.
[0007] Optionally, there are multiple slide carrier transfer components, and the raw material buffer area is located at the junction of two adjacent slide carrier transfer components and is configured to be shared by the two slide carrier transfer components.
[0008] Optionally, a plurality of the said slide boat transfer assemblies are distributed along the X direction.
[0009] Optionally, the conveying mechanism transports the slide boat along the Y direction.
[0010] Optionally, the interposer assembly includes a boat-side station, a basket-side station, and a robot arm; the boat-side station is connected to the conveying mechanism and is used to place the substrate boat; the basket-side station is used to place the basket; the robot arm is disposed between the boat-side station and the basket-side station and is configured to transfer the substrate between the substrate boat and the basket.
[0011] Optionally, the boat-side workstation and the flower basket-side workstation are arranged in pairs.
[0012] Optionally, one of the plug-in assembly includes two of the boat-side stations and at least two of the basket-side stations.
[0013] This application also provides a substrate processing system, including: At least one substrate processing device; In the aforementioned wafer carrier transfer device, the corresponding paddle structures in the substrate processing device and the wafer carrier transfer device are arranged opposite each other along the Y direction.
[0014] Optionally, the substrate processing device has multiple chambers distributed along the Z-direction, and the paddle structure has a paddle body for carrying a substrate boat, the paddle body being adjustable along the Z-direction to correspond to different chambers.
[0015] This application also provides a method for transferring a wafer carrier boat, applicable to the aforementioned wafer carrier boat transfer equipment, wherein the wafer carrier boat includes a clinker boat and a raw material boat, and the method for transferring the wafer carrier boat includes the following steps: The paddle structure removes the clinker boat from the chamber of the substrate processing equipment. The boat-grabbing crane transfers the clinker boat from the paddle structure to the cooling buffer area. After cooling is completed, the boat-grabbing crane transfers the clinker boat from the cooling buffer area to the conveying mechanism. The conveying mechanism then transfers the clinker boat to the insert assembly. The conveying mechanism transfers the raw material boat from the plug-in assembly to the workstation below the grab boat crane. The grab boat crane then transfers the raw material boat to the raw material buffer area. When feeding is required, the grab boat crane transfers the raw material boat from the raw material buffer area to the paddle structure. The paddle structure then feeds the raw material boat into the chamber of the substrate processing equipment.
[0016] The technical effects of this application are as follows: This application's wafer carrier transfer device optimizes the spatial layout of each mechanism, arranging the paddle structure, raw material buffer area, cooling buffer area, and conveying mechanism of the wafer carrier transfer assembly regularly along the X-direction. During the entire wafer carrier transfer process, a single grabbing crane can flexibly transfer the wafer carrier between the paddle structure, raw material buffer area, cooling buffer area, and conveying mechanism according to operational needs. It works in conjunction with the conveying mechanism to complete the transfer operation of the wafer carrier between the grabbing crane's running trajectory and the insert assembly. Compared to related technologies that require multiple automated components such as paddle structures, external grippers, multiple transfer channels, and grabbing cranes, this method offers a more efficient solution. This application significantly simplifies the transfer steps and transfer actions of the wafer carrier boat, shortening the transfer path, reducing transfer time, and increasing production cycle time. This is beneficial for adapting to the requirements of higher-efficiency production lines. It also reduces the number of automated equipment, effectively lowers equipment costs, significantly reduces the overall footprint of the equipment, reduces the number of fault repair points, reduces the equipment failure rate, and lowers the difficulty and cost of equipment maintenance. It effectively solves the problems of complex transfer actions, large number of automated equipment, high equipment costs, large footprint, and low work efficiency in related technologies. Attached Figure Description
[0017] Figure 1 A simplified structural diagram of the related technology slide carrier transfer system; Figure 2 A schematic diagram of a specific embodiment of the substrate processing system provided in this application; Figure 1 Explanation of reference numerals in the attached figures: Paddle structure 1'; Substrate processing equipment 2'; Outer gripper 3'; First transfer channel 4'; Boat grabber 5'; Cooling buffer area 6'; Second transfer channel 7'; Raw material buffer area 8'; Figure 2 Explanation of reference numerals in the attached figures: 100-meter-long overhead crane for navigating boats; 200: Carrier boat transfer assembly; 201: Paddle structure; 202: Raw material buffer zone; 203: Cooling buffer zone; 204: Conveying mechanism; 300; 301; 302; 303; 304; Connector assembly 300; Substrate processing equipment 400; Flower basket 500. Detailed Implementation
[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0019] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0020] It should be understood that the phrase "some embodiments" throughout the specification means that a specific feature, structure, or characteristic related to an embodiment is included in at least one embodiment of this application. Therefore, "some embodiments" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.
[0021] In this description, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art will understand the specific meaning of these terms in this document based on the specific circumstances.
[0022] Please refer to Figure 2 , Figure 2 This is a schematic diagram of a specific embodiment of the substrate processing system provided in this application.
[0023] This application provides a wafer carrier transfer device, including a wafer carrier crane 100, at least one wafer carrier transfer assembly 200, and at least one insert wafer assembly 300. The wafer carrier transfer assembly 200 includes: The paddle structure 201, raw material buffer zone 202, cooling buffer zone 203, and conveying mechanism 204 are distributed along the X direction. The paddle structure 201 is configured to carry the wafer carrier boat into and out of the chamber of the substrate processing equipment 400 along the Y direction. The wafer carrier boat grabbing crane 100 is located above the wafer carrier boat transfer assembly 200 and is configured to transfer the wafer carrier boat between the paddle structure 201, raw material buffer zone 202, cooling buffer zone 203, and conveying mechanism 204. The insert assembly 300 is configured to transfer substrates between the substrate carrier boat and the basket 500; the conveying mechanism 204 is configured to transfer the substrate carrier boat between the trajectory of the grabber crane 100 and the insert assembly 300.
[0024] The wafer carrier transfer device in this embodiment optimizes the spatial layout of each mechanism, simplifying the wafer carrier transfer steps. Specifically, during operation, the paddle structure 201 first removes the wafer carrier from the chamber of the substrate processing equipment 400 along the Y direction. The grabbing crane 100, located above the wafer carrier transfer assembly 200, then transfers the wafer carrier from the paddle structure 201 to the cooling buffer area 203. After the wafer carrier is cooled in the cooling buffer area 203, the grabbing crane 100 transfers the cooled wafer carrier to the conveying mechanism 204. The conveying mechanism 204 then precisely transfers the wafer carrier from the running trajectory of the grabbing crane 100 to the insert assembly 3. 00, the plug-in component 300 completes the clinker unloading operation between the clinker boat and the basket 500, and at the same time completes the raw material loading operation between the raw material boat and the basket 500. The subsequent conveying mechanism 204 then transfers the loaded raw material boat from the plug-in component 300 back to the running trajectory of the grab boat crane 100. The grab boat crane 100 first transfers the raw material boat to the raw material buffer area 202 for temporary storage. When the substrate processing equipment 400 has a material loading requirement, the grab boat crane 100 then transfers the raw material boat in the raw material buffer area 202 to the paddle structure 201. The paddle structure 201 finally carries the raw material boat and smoothly sends it into the cavity of the substrate processing equipment 400 along the Y direction.
[0025] Here, "cooked material" refers to substrates that have been processed by the substrate processing equipment 400, while "raw material" refers to substrates that have not yet been processed by the substrate processing equipment 400. A "cooked material boat" refers to a carrier boat loaded with substrates that have been processed by the substrate processing equipment 400, while a "raw material boat" refers to a carrier boat loaded with substrates that have not yet been processed by the substrate processing equipment 400. The substrate loading structures of the cooked material boat and the raw material boat are identical, and they transform into each other depending on the processing state of the substrates they contain. The substrate processing equipment 400 can specifically be equipment used in the photovoltaic substrate production process, such as thin film deposition equipment or oxidation / annealing equipment, to perform certain process treatments on the substrates.
[0026] As can be seen, in the embodiment of this application, the paddle structure 201, raw material buffer area 202, cooling buffer area 203, and conveying mechanism 204 of the paddle boat transfer component 200 are arranged regularly along the X direction. During the entire transfer process of the paddle boat, a single grabbing crane 100 can flexibly realize the position transfer of the paddle boat between the paddle structure 201, raw material buffer area 202, cooling buffer area 203, and conveying mechanism 204 according to the operation requirements. It works with the conveying mechanism 204 to complete the transfer operation of the paddle boat between the running trajectory of the grabbing crane 100 and the insert assembly 300. Compared with the complex boat picking and changing actions in related technologies that require multiple automated equipment such as paddle structure 1', outer gripper 3', multiple sets of transfer channels, and grabbing crane 5', this greatly simplifies the transfer steps and boat picking and changing actions of the paddle boat, reduces the number of automated equipment used, effectively reduces equipment costs, significantly reduces the overall footprint of the equipment, reduces the number of fault repair points, reduces the equipment failure rate, and reduces the maintenance difficulty and maintenance cost of the equipment.
[0027] Furthermore, in the wafer carrier transfer equipment of this application embodiment, the grabbing crane 100, in conjunction with the regular arrangement of each component in the wafer carrier transfer assembly 200 along the X-direction, significantly shortens the overall transfer path of the wafer carrier, improves the transfer efficiency of the wafer carrier and the overall working efficiency of the substrate processing system, reduces transfer time, and increases production cycle time, which is beneficial for adapting to the requirements of higher-efficiency production lines. Simultaneously, since the new layout eliminates a section of the transfer channel in the Y-direction, the overall length of the substrate processing system is also shortened, which is beneficial for improving site utilization efficiency and enhancing product competitiveness.
[0028] like Figure 2 As shown in the embodiment of this application, the cooling buffer area 203 and the paddle structure 201 are arranged adjacent to each other.
[0029] As described above, in this embodiment, the cooling buffer zone 203 and the paddle structure 201 are arranged adjacent to each other. This facilitates shortening the transport distance of the clinker boat, allowing it to quickly enter the cooling buffer zone 203 for cooling after being removed from the chamber of the substrate processing equipment 400. This enables the clinker boat to begin cooling rapidly, accelerating the cooling process and improving its turnover efficiency. Simultaneously, it reduces the transport distance of the clinker boat at higher temperatures, improving safety. Furthermore, the cooling buffer zone 203 can specifically be equipped with a fan mounted on the frame that holds the substrate carrier boat, using airflow to accelerate the heat dissipation of the substrate carrier boat and its internal substrates.
[0030] like Figure 2 As shown in the embodiment of this application, the wafer carrier transfer assembly 200 includes two conveying mechanisms 204, and the paddle structure 201 and the cooling buffer area 203 in the same wafer carrier transfer assembly 200 are located between the two conveying mechanisms 204.
[0031] As configured above, the paddle structure 201 and cooling buffer zone 203 within the same clinker boat transfer assembly 200 are located between two conveying mechanisms 204, thereby making the cooling buffer zone 203 adjacent to one of the conveying mechanisms 204, shortening the transfer path of the clinker boat between the cooling buffer zone 203 and the conveying mechanism 204. After the clinker boat has completed cooling in the cooling buffer zone 203, the boat grabbing crane 100 can quickly transfer the cooled clinker boat to the conveying mechanism 204 to complete the transfer, improving the turnover efficiency of the clinker boat.
[0032] In addition, the raw material buffer area 202 is also arranged adjacent to one of the conveying mechanisms 204, which shortens the flow path of the raw material boat between the raw material buffer area 202 and the conveying mechanism 204, so that the boat grabbing crane 100 can quickly transfer the raw material boat to the raw material buffer area 202, thereby improving the turnover efficiency of the raw material boat.
[0033] Please continue to refer to this. Figure 2 In this embodiment of the application, there are multiple sheet carrier transfer components 200, and the raw material buffer area 202 is located at the junction of two adjacent sheet carrier transfer components 200 and is configured to be shared by the two sheet carrier transfer components 200.
[0034] As configured above, in this embodiment, two adjacent wafer carrier transfer components 200 share a single raw material buffer area 202. This reduces the number of raw material buffer areas 202 required and decreases the space occupied by multiple wafer carrier transfer components 200 in the X direction, making the overall layout of the wafer carrier transfer equipment more compact. In actual production line layouts, equipment corresponding to different processes on a production line is typically arranged sequentially along one direction, while multiple production lines are usually arranged in parallel, with a passageway between adjacent lines. In this embodiment, the production line equipment is arranged along the Y direction, and different production lines are arranged parallel to each other along the X direction. This saves space in the X direction, allowing more production lines to be placed in the same space, which is beneficial for increasing production capacity.
[0035] Please continue to refer to this. Figure 2 In this embodiment of the application, multiple slide carrier transfer components 200 are distributed along the X direction.
[0036] As configured above, multiple wafer carrier transfer components 200 are distributed along the X-direction. These components can share a single grabber crane 100, reducing the number of grabber cranes required and lowering their construction costs. The grabber crane 100 can handle the following tasks based on the operational needs of the multiple wafer carrier transfer components 200: transferring clinker boats from the paddle structure 201 to the cooling buffer zone 203; transferring cooled clinker boats from the cooling buffer zone 203 to the conveying mechanism 204; transferring raw material boats from the conveying mechanism 204 to the raw material buffer zone 202; and transferring raw material boats from the raw material buffer zone 202 back to the paddle structure 201. This improves the utilization rate of the grabber crane 100 and enhances the smoothness of wafer carrier transfer operations. Furthermore, when a production line experiences substrate breakage or other malfunctions and temporary shutdowns, the grabber crane 100 can be used to schedule wafer carriers across production lines, preventing production delays and enhancing overall production adjustment capabilities.
[0037] Please continue to refer to this. Figure 2 In this embodiment of the application, the conveying mechanism 204 transports the carrier boat along the Y direction.
[0038] As set above, in this embodiment, the conveying mechanism 204 is configured to transport the sheet carrier boat along the Y direction. First, the sheet carrier boat transfer component 200 and the insert component 300 are correspondingly arranged along the Y direction. The insert component 300 will not occupy space in the X direction, thus avoiding any impact on the number of new sheet carrier boat transfer components 200 to increase production capacity. This makes the expansion of the number of sheet carrier boat transfer components 200 more flexible and the spatial layout more reasonable. Second, the boat grabbing crane 100 completes the transfer of the sheet carrier boat between the paddle structure 201, the raw material buffer area 202, the cooling buffer area 203, and the conveying mechanism 204 along the X direction of the sheet carrier boat transfer component 200. The conveying mechanism 204 completes the transfer of the sheet carrier boat between the sheet carrier boat transfer component 200 and the insert component 300 along the Y direction. The two are perpendicular to each other, which can shorten the transfer path of the sheet carrier boat as much as possible, speed up the transfer cycle of the sheet carrier boat, and improve the transfer efficiency of the sheet carrier boat.
[0039] Please continue to refer to this. Figure 2 In this embodiment of the application, the interposer assembly 300 includes a boat-side station 301, a basket-side station 302, and a robot arm 303; the boat-side station 301 is connected to the conveying mechanism 204 and is used to place the substrate boat; the basket-side station 302 is used to place the basket 500; the robot arm 303 is disposed between the boat-side station 301 and the basket-side station 302 and is configured to transfer the substrate between the substrate boat and the basket 500.
[0040] As configured above, the interposer assembly 300 in this embodiment includes a boat-side station 301, a basket-side station 302, and a robot arm 303. The boat-side station 301 is precisely docked with the conveying mechanism 204, enabling the substrate boat transported by the conveying mechanism 204 along the Y direction to be smoothly transferred to the boat-side station 301. The basket-side station 302 is used to constrain the position of the basket 500, maintaining the stability of the basket 500's position. The robot arm 303 is positioned between the boat-side station 301 and the basket-side station 302, enabling the substrate to be precisely transferred between the substrate boat and the basket 500, improving the substrate transfer efficiency. Specifically, the transmission mechanism can be a chute or rail with drive wheels, with the bottom area of the substrate boat contacting the drive wheels and being pushed to slide. The boat-side station 301 can be a transfer mechanism docked with the transmission mechanism.
[0041] In this embodiment, the boat-side workstation 301 and the flower basket-side workstation 302 are both arranged in pairs.
[0042] As configured above, paired boat-side stations 301 can position multiple sets of substrate carrier boats, and paired basket-side stations 302 can position multiple sets of baskets 500. After one boat-side station 301 or basket-side station 302 has completed its transfer, the robot arm 303 can switch to another boat-side station 301 or basket-side station 302 while the substrate lifting mechanism prepares for the next lifting operation. This reduces interruption time in substrate transfer and improves substrate transfer efficiency. The substrate lifting mechanism uses a set of jacking teeth to eject a certain number of substrates from the loading slots of the substrate carrier boats or baskets, facilitating substrate loading and unloading via the suction cups on the robot arm 303. This substrate lifting mechanism can be directly purchased from automation suppliers.
[0043] In this embodiment of the application, a plug-in assembly 300 includes two boat-side workstations 301 and at least two basket-side workstations 302.
[0044] As mentioned above, in this embodiment, the same substrate carrier transfer assembly 200 includes two conveying mechanisms 204, and the insert assembly 300 includes two boat-side stations 301. That is, the conveying mechanisms 204 and the boat-side stations 301 are correspondingly set. Each substrate carrier transported by the conveying mechanism 204 enters the corresponding boat-side station 301. Each of the two boat-side stations 301 is matched with at least one basket-side station 302. When the substrate transfer of one basket 500 is completed, it can be directly switched to the backup basket-side station 302. When the substrate transfer of one boat-side station 301 is completed, it can be directly switched to the other boat-side station 301 without interrupting the substrate transfer operation, thereby improving the substrate transfer efficiency.
[0045] This application also provides a substrate processing system, including: At least one substrate processing device 400; The aforementioned substrate transfer equipment, substrate processing equipment 400, and corresponding paddle structures 201 in the substrate transfer equipment are arranged opposite each other along the Y direction.
[0046] The substrate processing system of this application includes the aforementioned wafer carrier transfer device, and therefore has the same technical effects as the aforementioned wafer carrier transfer device, which will not be repeated here.
[0047] In this embodiment, the substrate processing device 400 has a plurality of chambers distributed along the Z direction, and the paddle structure 201 has a paddle body for carrying the substrate boat, the paddle body being adjustable along the Z direction to correspond to different chambers.
[0048] As configured above, the substrate processing equipment 400 has multiple chambers, which can process multiple sets of substrates simultaneously, thereby improving the substrate processing capacity of the substrate processing equipment 400. The distribution design of the chambers along the Z-direction helps to reduce the volume of the substrate processing equipment 400 in the horizontal direction and reduce the footprint of the substrate processing equipment 400. The propeller body can be adjusted along the Z-direction, so that the propeller structure 201 can complete the loading and unloading operations of each chamber by adjusting in the Z-direction and moving in the Y-direction, without the need for additional equipment such as external grippers, reducing the number of equipment and lowering equipment costs.
[0049] This application embodiment also provides a method for transferring a wafer carrier boat, applicable to the aforementioned wafer carrier boat transfer equipment. The wafer carrier boat includes a clinker boat and a raw material boat. The wafer carrier boat transfer method includes the following steps: The paddle structure 201 removes the clinker boat from the chamber of the substrate processing equipment 400. The boat grabbing crane 100 transfers the clinker boat from the paddle structure 201 to the cooling buffer area 203. After cooling is completed, the boat grabbing crane 100 transfers the clinker boat from the cooling buffer area 203 to the conveying mechanism 204. The conveying mechanism 204 transfers the clinker boat to the insert assembly 300. The conveying mechanism 204 transfers the raw material boat from the insert assembly 300 to the station below the grab boat crane 100. The grab boat crane 100 transfers the raw material boat to the raw material buffer area 202. When feeding is required, the grab boat crane 100 transfers the raw material boat from the raw material buffer area 202 to the paddle structure 201. The paddle structure 201 sends the raw material boat into the chamber of the substrate processing equipment 400.
[0050] The slide carrier transfer method of this application embodiment is applicable to the aforementioned slide carrier transfer equipment, and therefore has the same technical effects as the aforementioned slide carrier transfer equipment, which will not be repeated here.
[0051] The above are merely preferred embodiments of this application. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of this application, and these improvements and modifications should also be considered within the scope of protection of this application.
Claims
1. A slide carrier transfer device, characterized in that, The system includes a boat-grabbing crane (100), at least one set of wafer-carrying boat transfer assemblies (200), and at least one insert-piece assembly (300), wherein the wafer-carrying boat transfer assembly (200) includes: The equipment includes a paddle structure (201), a raw material buffer zone (202), a cooling buffer zone (203), and a conveying mechanism (204) distributed along the X direction. The paddle structure (201) is configured to carry a wafer carrier boat into and out of the chamber of the substrate processing equipment (400) along the Y direction. A grabber crane (100) is located above the wafer carrier boat transfer assembly (200) and is configured to transfer the wafer carrier boat between the paddle structure (201), the raw material buffer zone (202), the cooling buffer zone (203), and the conveying mechanism (204). The insert assembly (300) is configured to transfer the substrate between the substrate carrier boat and the basket (500); the conveying mechanism (204) is configured to transfer the substrate carrier boat between the trajectory of the grab crane (100) and the insert assembly (300).
2. The slide carrier transfer device according to claim 1, characterized in that, The cooling buffer area (203) and the paddle structure (201) are arranged adjacent to each other.
3. The slide carrier transfer device according to claim 1, characterized in that, The wafer carrier transfer assembly (200) includes two conveying mechanisms (204), and the paddle structure (201) and the cooling buffer area (203) within the same wafer carrier transfer assembly (200) are located between the two conveying mechanisms (204).
4. The slide carrier transfer device according to claim 3, characterized in that, The number of the slide carrier transfer components (200) is multiple, and the raw material buffer area (202) is located at the junction of two adjacent slide carrier transfer components (200) and is configured to be shared by the two slide carrier transfer components (200).
5. The slide carrier transfer device according to any one of claims 1-4, characterized in that, Multiple of the said slide carrier transfer components (200) are distributed along the X direction.
6. The slide carrier transfer device according to claim 5, characterized in that, The conveying mechanism (204) transports the slide boat along the Y direction.
7. The slide carrier transfer device according to any one of claims 1-4, characterized in that, The insert assembly (300) includes a boat-side station (301), a flower basket-side station (302), and a robot (303); the boat-side station (301) is connected to the conveying mechanism (204) and is used to place the substrate boat; the flower basket-side station (302) is used to place the flower basket (500); the robot (303) is located between the boat-side station (301) and the flower basket-side station (302) and is configured to transfer the substrate between the substrate boat and the flower basket (500).
8. The slide carrier transfer device according to claim 7, characterized in that, The boat-side workstation (301) and the flower basket-side workstation (302) are both set up in pairs.
9. The slide carrier transfer device according to claim 7, characterized in that, One of the said plug-in assembly (300) includes two said boat-side stations (301) and at least two said basket-side stations (302).
10. A substrate processing system, characterized in that, include: At least one substrate processing device (400); The substrate carrier transfer device according to any one of claims 1-9, wherein the substrate processing device (400) and the corresponding paddle structure (201) in the substrate carrier transfer device are arranged opposite to each other in the Y direction.
11. The substrate processing system according to claim 10, characterized in that, The substrate processing device (400) has multiple chambers distributed along the Z direction, and the paddle structure (201) has a paddle body for carrying a substrate boat, the paddle body being adjustable along the Z direction to correspond to different chambers.
12. A method for transferring a slide carrier, applicable to the slide carrier transfer device according to any one of claims 1-9, characterized in that, The sheet carrier boat includes a clinker boat and a raw material boat, and the sheet carrier boat transfer method includes the following steps: The paddle structure (201) removes the clinker boat from the chamber of the substrate processing equipment (400), and the boat grabbing crane (100) transfers the clinker boat from the paddle structure (201) to the cooling buffer area (203). After cooling is completed, the boat grabbing crane (100) transfers the clinker boat from the cooling buffer area (203) to the conveying mechanism (204), and the conveying mechanism (204) transfers the clinker boat to the insert assembly (300). The conveying mechanism (204) transfers the raw material boat from the plug-in assembly (300) to the station below the grab boat crane (100). The grab boat crane (100) transfers the raw material boat to the raw material buffer area (202). When feeding is required, the grab boat crane (100) transfers the raw material boat from the raw material buffer area (202) to the paddle structure (201). The paddle structure (201) sends the raw material boat into the chamber of the substrate processing equipment (400).