Support structure for bonding device and bonding device
By employing a support structure made of metal and organic materials in the bonding equipment and using a vacuum pump to create vacuum adsorption, the problem of insufficient friction between the DBC substrate and the metal support structure is solved, thereby improving the welding effect and product quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CR RUNAN TECHNOLOGIES (CHONGQING) CO LTD
- Filing Date
- 2024-10-30
- Publication Date
- 2026-05-05
AI Technical Summary
In existing bonding equipment, the friction between the DBC substrate and the metal support structure is relatively small during the welding process, resulting in poor welding effect and affecting product quality.
A support structure for bonding equipment is designed, comprising a first support block of metal or metal alloy and a second support block of organic material. The structure has internal air channels and passages. A vacuum is created by evacuating air through a vacuum pump, which firmly adsorbs the structure to be bonded onto the support surface and prevents relative movement.
It effectively prevents the structure to be bonded from moving relative to each other during ultrasonic bonding, reduces ultrasonic energy loss, improves welding effect, and ensures product quality.
Smart Images
Figure CN121985777A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor technology, and in particular to a support structure for bonding equipment and a bonding equipment. Background Technology
[0002] In common semiconductor packaging technologies, such as a chip packaging process, the chip is first mounted on a DBC (Direct Bond Copper) substrate, where the DBC substrate is soldered to the lead frame; then, bonding equipment is used to solder the two ends of the bonding wire to the chip and the lead frame pins, respectively.
[0003] The bonding equipment includes a metal support structure and a pressing structure. During the bonding process, the DBC substrate is placed on the metal support structure, and the pressing structure abuts against the lead frame to prevent the DBC substrate and lead frame from moving relative to the bonding equipment. When using existing bonding equipment, the bonding effect between the bonding wires and the chip and lead frame is poor, affecting product quality. Summary of the Invention
[0004] This application provides a support structure for a bonding device and a bonding device.
[0005] A first aspect of this application provides a support structure for a bonding device. The support structure includes a support surface for supporting a structure to be bonded.
[0006] The support structure has an air passage inside, and the support structure also has a plurality of dispersed channels located on the side of the air passage facing the support surface of the support structure; each of the channels is connected to the air passage and extends to the support surface; the support structure also has an air extraction hole connected to the air passage.
[0007] In one embodiment of this application, the support structure includes a first support block and a second support block; the top of the first support block is provided with a receiving groove; the second support block is disposed in the receiving groove of the first support block, and the top surface of the second support block is the support surface; the material of the first support block is metal or metal alloy; the material of the second support block is organic material.
[0008] In one embodiment of this application, each of the channels is disposed on the second support block and penetrates the second support block; the air passage is located between the bottom surface of the second support block and the receiving groove; and each side of the second support block is in contact with the side of the receiving groove.
[0009] In one embodiment of this application, the bottom surface of the receiving groove is provided with a plurality of protrusions arranged at intervals, and the bottom surface of the second support block abuts against each of the protrusions; the space between the second support block and its bottom surface and between adjacent protrusions is the air passage; the orthographic projection of each passage on the bottom surface of the receiving groove at least partially falls outside the orthographic projection of each protrusion on the bottom surface of the receiving groove.
[0010] In one embodiment of this application, the orthographic projections of each of the channels on the bottom surface of the receiving groove and the orthographic projections of each of the protrusions on the bottom surface of the receiving groove do not overlap.
[0011] In one embodiment of this application, the second support block is made of an elastic material, and the side of the second support block is interference-fitted with the side of the receiving groove.
[0012] In one embodiment of this application, the support structure further includes a one-way flow element located within the air extraction hole, the one-way flow element being configured so that gas from the air passage can flow out through the one-way flow element.
[0013] In one embodiment of this application, the top surface of the second support block extends beyond the top surface of the first support block.
[0014] In one embodiment of this application, the second support block is detachably disposed within the receiving groove; and / or,
[0015] The thickness of the second support block ranges from 3mm to 7mm.
[0016] A second aspect of this application provides a bonding apparatus, the bonding apparatus including the aforementioned support structure, crimping structure, first base, second base, and driving unit; the support structure is mounted on the first base, the crimping structure is mounted on the second base; the driving unit is used to drive the first base and / or the second base to move, so that the crimping structure abuts against the top of the structure to be bonded.
[0017] The main technical effects achieved by the embodiments of this application are:
[0018] The support structure and bonding equipment provided in this application embodiment allow for the placement of the structure to be bonded on the support surface of the support structure. A vacuum pump connected to an extraction port can be used to extract gas from the air passages and channels, creating a certain vacuum level within the passages and holes. This allows the structure to be bonded to adhere firmly to the support surface of the support structure. In other words, the support structure provided in this application embodiment ensures that the structure to be bonded is firmly adhered to the support surface, effectively preventing relative movement between the structure and the support structure during ultrasonic bonding, reducing the loss of ultrasonic energy during ultrasonic bonding, thereby improving the welding effect and ensuring product quality. Attached Figure Description
[0019] Figure 1 This is a side view of a bonding device provided in an exemplary embodiment of this application;
[0020] Figure 2 This is a side view of the bonding device provided in an exemplary embodiment of this application from another perspective;
[0021] Figure 3 This is a top view of a bonding device provided in an exemplary embodiment of this application;
[0022] Figure 4 This is a cross-sectional view obtained by cutting the support structure of the bonding device provided in an exemplary embodiment of this application along a direction perpendicular to the support surface;
[0023] Figure 5 This is a top view of the support structure of a bonding device provided in an exemplary embodiment of this application;
[0024] Figure 6 This is a top view of the second support block of the support structure provided in an exemplary embodiment of this application;
[0025] Figure 7 This is a top view of the first support block of the support structure provided in an exemplary embodiment of this application. Specific Implementation
[0026] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.
[0027] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.
[0028] The inventors discovered that the poor soldering effect of bonding wires to chips and lead frames using existing bonding equipment is due to the fact that the surface material of the DBC substrate in contact with the metal support structure is copper, resulting in low friction between the DBC substrate and the metal support structure, making slippage easy to occur during the soldering process. When ultrasonic soldering is used, part of the ultrasonic energy is used to counteract the relative slippage between the DBC substrate and the metal support structure, leading to a worse soldering effect.
[0029] This application provides a support structure for a bonding device and a bonding device in general, which can solve the above-mentioned technical problems. Some embodiments of this application will be described in detail below with reference to the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.
[0030] This application provides a bonding device. For example... Figure 1 and Figure 2 As shown, the bonding apparatus includes a support structure 10, a pressing structure 20, a first base 30, and a second base 40. The support structure 10 is mounted on the first base 30, and the pressing structure 20 is mounted on the second base 40. The pressing structure 20 is located above the support structure 10. The support structure 10 includes a support surface for supporting the structure to be bonded, and the pressing structure 20 is used to press the structure to be bonded. Figure 3 As shown, the crimping structure 20 includes a pressure plate 21 and a plurality of pressure pins 22 mounted on the pressure plate 21. The pressure plate 21 has an opening for exposing the structure to be bonded. The plurality of pressure pins 22 are arranged circumferentially along the opening of the pressure plate 21, and one end of each pressure pin 22 can extend into the opening of the pressure plate 21 to abut against the structure to be bonded. Each of the pressure pins 22 can be connected to the pressure plate 21 through a connector 23, which can also fix the pressure plate 21 to the second base 40.
[0031] See you again Figure 1 and Figure 2 When using a bonding device for bonding, the structure to be bonded 50 is placed on the support structure 10, and the pressure pin 22 of the pressing structure 20 abuts against the top of the structure to be bonded 50, thereby fixing the structure to be bonded 50 on the bonding device.
[0032] In one embodiment, the bonding apparatus further includes a driving unit that can drive the first base 30 and / or the second base 40 to move, bringing the crimping structure 20 closer to the support structure 10, thereby causing the crimping pins 22 of the crimping structure 20 to abut against the structure to be bonded placed on the top surface of the support structure 10. For example, the bonding apparatus may include a first driving member and a second driving member, the first driving member driving the first base 30 to move, and the second driving member driving the second base 40 to move. Specifically, the first driving member drives the first base 30 to move longitudinally, and the second driving member drives the second base 40 to move longitudinally.
[0033] In one embodiment, the first driving element and the second driving element may be motors.
[0034] In one embodiment, the bonding apparatus further includes a slide rail along which the first base 30 and the second base 40 are movable. The slide rail can be positioned longitudinally. This prevents the first base 30 from shifting position during the movement of the support structure 10, and prevents the second base 40 from shifting position during the movement of the crimping structure 20, thus preventing a situation where the pressure pins 22 of the crimping structure 20 cannot effectively abut against the structure to be bonded.
[0035] In one embodiment, such as Figure 1 and Figure 2 As shown, the bonding structure 50 includes a DBC substrate 51, a chip 52 mounted on the DBC substrate 51, and a lead frame 53 soldered to the DBC substrate 51, with the chip 52 and the lead frame 53 located on the same side of the DBC substrate 51. When the bonding structure 50 is placed on the support structure 10, the chip 52 and the lead frame 53 are located on the side of the DBC substrate 51 away from the support structure 10.
[0036] In one embodiment, such as Figure 2 and Figure 4 As shown, the support structure 10 has an air passage 101 inside, and the support structure 10 also has a plurality of dispersed channels 102 located on the side of the air passage 101 facing the support surface 104 of the support structure 10; each of the channels 102 is connected to the air passage 101 and extends to the support surface 104; the support structure 10 also has an air extraction hole 103 connected to the air passage 101.
[0037] After placing the structure to be bonded on the support surface 104 of the support structure 10, a vacuum pump can be connected to the evacuation port 103 to extract the gas from the air passage 101 and the channel 102, so that the air passage 101 and the through hole 102 reach a certain vacuum level (e.g., a vacuum level greater than or equal to 10). -6Pa), thereby causing the structure to be bonded to adhere to the support surface 104 of the support structure 10. It can be seen that the support structure 10 provided in this embodiment of the application can make the structure to be bonded firmly adhered to the support surface 104 of the support structure 10, effectively preventing relative movement between the structure to be bonded and the support structure 10 during ultrasonic bonding, reducing the loss of ultrasonic energy during ultrasonic bonding, thereby improving the welding effect and ensuring product quality.
[0038] In one embodiment, the suction port 103 is located on the side of the air passage 101. This facilitates connection of the suction port 103 to a vacuum pump.
[0039] In one embodiment, such as Figure 2 and Figure 4 As shown, the support structure 10 provided in this embodiment includes a first support block 11 and a second support block 12. The top of the first support block 11 is provided with a receiving groove 111. The second support block 12 is disposed in the receiving groove 111 of the first support block 11, and the top surface of the second support block 12 is the support surface 104; the material of the first support block 11 is metal or metal alloy; the material of the second support block 12 is organic material.
[0040] The support structure 10 provided in this embodiment ensures the strength of the support structure 10 and the support effect on the structure to be bonded by setting the material of the first support block 11 to metal or metal alloy; by setting the second support block 12 to be housed in the receiving groove 111 of the first support block 11, the receiving groove 111 can limit the second support block 12 to prevent the second support block 12 from causing the structure to be bonded to move relative to the first support block 11, thus affecting the welding quality; since the material of the second support block 12 is organic material, its surface roughness is large, and the friction between it and the structure to be bonded is large, which helps to reduce the loss of ultrasonic energy during ultrasonic bonding and improve the welding effect.
[0041] In one embodiment, the material of the first support block 11 may be copper or an iron alloy.
[0042] In one embodiment, the material of the second support block 12 is an elastic material. With this configuration, when the structure to be bonded is placed on the top surface of the second support block 12, after the pressure pins 22 of the pressing structure 20 apply force to the structure to be bonded, the second support block 12 will undergo a certain deformation, and the DBC substrate of the structure to be bonded will appear to be partially embedded in the second support block 12, which helps to further prevent relative sliding between the structure to be bonded and the second support block 12.
[0043] In one embodiment, the second support block 12 is made of rubber. This design allows the second support block 12 to have good elasticity, and the material is readily available and inexpensive. In other embodiments, the second support block 12 may be made of other organic materials.
[0044] In one embodiment, the top surface of the second support block 12 is substantially planar. This results in a high degree of planarity for the second support block 12. When the structure to be bonded is placed on the top surface of the second support block 12, the contact between the structure to be bonded and the top surface of the second support block 12 is better. This helps prevent air from entering the channel 102 along the gap between the structure to be bonded and the top surface of the second support block 12, thus improving the vacuum level of the air passage 101 and the channel 102, and ensuring that the structure to be bonded is firmly adsorbed onto the second support block 12.
[0045] In one embodiment, such as Figures 4 to 6 As shown, each of the channels 102 is disposed on the second support block 12 and penetrates the second support block 12; the air passage 101 is located between the bottom surface of the second support block 12 and the receiving groove 111; each side of the second support block 12 is in contact with the side of the receiving groove 111. In this way, the fabrication of the air passage 101 and the channel 102 is relatively simple.
[0046] In one embodiment, such as Figure 4 and Figure 7 As shown, the bottom surface of the receiving groove 111 is provided with a plurality of protrusions 112 arranged at intervals, and the bottom surface of the second support block 12 abuts against each of the protrusions 112; the space between the second support block 12 and its bottom surface and between adjacent protrusions 112 in the receiving groove 111 is the air passage 101; the orthographic projection of each passage 102 on the bottom surface of the receiving groove 111 at least partially falls outside the orthographic projection of each protrusion 112 on the bottom surface of the receiving groove 111. With this configuration, the second support block 12 can be placed in the receiving groove 111 to form the air passage 101. The structure of the first support block 11 is relatively simple, which can reduce its manufacturing difficulty. By setting the orthographic projection of each channel 102 on the bottom surface of the receiving groove 111 and the orthographic projection of each protrusion 112 on the bottom surface of the receiving groove 111 to at least partially not overlap, it can be ensured that each channel 102 is connected to the air passage 101, and thus each channel 102 can generate negative pressure, which helps to improve the adsorption force between the second support block 12 and the structure to be bonded.
[0047] Furthermore, the orthographic projections of each channel 102 onto the bottom surface of the receiving groove 111 and the orthographic projections of each protrusion 112 onto the bottom surface of the receiving groove 111 do not overlap. This arrangement improves the communication between the channel 102 and the air passage 101, allowing for a faster achievement of a higher vacuum level within each channel 102 when a vacuum pump is used to evacuate the air extraction port 103.
[0048] In some embodiments, the top surfaces of each protrusion 112 are on the same plane. This arrangement allows for better contact between the second support block 12 and each protrusion 112, which helps to improve the flatness of the top surface of the second support block 12.
[0049] In one embodiment, the second support block 12 is made of an elastic material, and the side of the second support block 12 is interference-fitted with the side of the receiving groove 111. This arrangement allows for a better sealing effect between the side of the second support block 12 and the side of the receiving groove 111. When a vacuum pump is used to evacuate the air extraction port 103, a higher vacuum can be achieved in the air passage 101 and channel 102, which helps the structure to be bonded to adhere more firmly to the support surface 104 of the support structure 10.
[0050] In one embodiment, the support structure 10 further includes a one-way flow element located within the evacuation port 103, which is configured to allow gas from the air passage 101 to flow out. By providing a one-way flow element within the evacuation port 103, after the vacuum pump finishes evacuating, the one-way flow element effectively prevents external air from entering the air passage 101, thus maintaining a better vacuum level within the air passage 101 and channel 102, ensuring that the structure to be bonded is firmly adsorbed onto the support structure 10.
[0051] In one embodiment, the one-way flow element is a one-way valve, which can be fixed inside the air extraction port 103, and the gap between the one-way valve and the side of the air extraction port 103 is filled with sealant.
[0052] In one embodiment, the support structure 10 is further provided with an air inlet and a sealing element detachably installed in the air inlet. With this configuration, after bonding is completed and it is necessary to separate the resulting bonded structure from the support structure 10, the sealing element is removed from the air inlet, and external air can quickly enter the air passage 101 through the air inlet, restoring the air pressure in the air passage 101 and channel 102 to normal pressure, thereby allowing the resulting bonded structure to be separated from the support structure 10.
[0053] Furthermore, the sealing element is made of an elastic material, and when installed inside the air inlet, it is press-fitted with the air inlet. This allows the sealing element to seal the air inlet, better preventing external air from entering the air passage 101 through the air inlet.
[0054] In another embodiment, the evacuation port 103 may not contain a unidirectional flow element, and the support structure 10 further includes a sealing portion detachably installed within the evacuation port 103. With this configuration, when evacuation of the air passage 101 is required, the sealing portion is removed from the evacuation port 103, and a vacuum pump is connected to the evacuation port 103; when the vacuum level in the air passage 101 and channel 102 reaches the required level, the vacuum pump is separated from the evacuation port 103, and the sealing portion is quickly installed within the evacuation port 103; after bonding is completed, when it is necessary to separate the resulting bonded structure from the support structure 10, the sealing portion is removed from the evacuation port 103, allowing the air pressure in the air passage 101 and channel 102 to return to normal atmospheric pressure, thereby separating the resulting bonded structure from the support structure 10.
[0055] Furthermore, the sealing element is made of an elastic material, and when the sealing element is installed in the air extraction port 103, the sealing element and the air extraction port 103 are press-fitted. This allows the sealing element to seal the air extraction port 103, better preventing external air from entering the air passage 101 through the air extraction port 103.
[0056] In one embodiment, such as Figure 4 As shown, the top surface of the second support block 12 extends beyond the top surface of the first support block 11. This arrangement helps ensure that the entire DBC substrate of the structure to be bonded is in contact with the top surface of the second support block 12 after the structure to be bonded is placed on the surface of the second support block 12, preventing the DBC substrate of the structure to be bonded from contacting the first support block 11, and thus increasing the friction between the structure to be bonded and the support structure 10.
[0057] In one embodiment, the height difference between the top surface of the second support block 12 and the top surface of the first support block 11 ranges from 50 μm to 100 μm. In some embodiments, the height difference between the top surface of the second support block 12 and the top surface of the first support block 11 can be 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, etc.
[0058] In one embodiment, the second support block 12 is detachably disposed within the receiving groove 111. This arrangement allows the second support block 12 to be removed from the receiving groove 111 and replaced when it becomes worn, eliminating the need to replace the first support block 11 and reducing the cost of the support structure 10. In some embodiments, the second support block 12 can be embedded within the receiving groove 111 of the first support block 11 without the use of adhesive; for example, the second support block 12 is embedded in the receiving groove 111 by an interference fit.
[0059] In one embodiment, the thickness of the second support block 12 ranges from 3mm to 7mm. This setting avoids the second support block 12 being too thin, which would prevent it from effectively recovering its deformation after being compressed, thus hindering the improvement of the friction between the second support block 12 and the structure to be bonded; it also avoids the second support block 12 being too thick, which would reduce the distance between the pressing structure 20 and the second support block 12, making it impossible to place a thicker structure to be bonded.
[0060] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and embodiments are to be considered exemplary only, and the true scope and spirit of this application are indicated by the claims.
Claims
1. A support structure for a bonding device, characterized in that, The support structure includes a support surface, which is used to support the structure to be bonded. The support structure has an air passage inside, and the support structure also has a plurality of dispersed channels located on the side of the air passage facing the support surface of the support structure; each of the channels is connected to the air passage and extends to the support surface; the support structure also has an air extraction hole connected to the air passage.
2. The support structure for bonding equipment according to claim 1, characterized in that, The support structure includes a first support block and a second support block; the top of the first support block is provided with a receiving groove; the second support block is disposed in the receiving groove of the first support block, and the top surface of the second support block is the support surface; the material of the first support block is metal or metal alloy; the material of the second support block is organic material.
3. The support structure for bonding equipment according to claim 2, characterized in that, Each of the aforementioned channels is located on the second support block and penetrates through the second support block; the air passage is located between the bottom surface of the second support block and the receiving groove; each side of the second support block is in contact with the side of the receiving groove.
4. The support structure for bonding equipment according to claim 3, characterized in that, The bottom surface of the receiving groove is provided with a plurality of protrusions arranged at intervals, and the bottom surface of the second support block abuts against each of the protrusions; the space between the second support block and its bottom surface and between adjacent protrusions is the air passage; the orthographic projection of each passage on the bottom surface of the receiving groove at least partially falls outside the orthographic projection of each protrusion on the bottom surface of the receiving groove.
5. The support structure for bonding equipment according to claim 4, characterized in that, The orthographic projections of each of the channels on the bottom surface of the receiving groove and the orthographic projections of each of the protrusions on the bottom surface of the receiving groove do not overlap.
6. The support structure for bonding equipment according to claim 3, characterized in that, The second support block is made of an elastic material, and the side of the second support block is interference-fitted with the side of the receiving groove.
7. The support structure for bonding equipment according to claim 1, characterized in that, The support structure also includes a one-way flow element located within the air extraction hole, the one-way flow element being configured so that gas from the air passage can flow out through the one-way flow element.
8. The support structure for bonding equipment according to claim 2, characterized in that, The top surface of the second support block extends beyond the top surface of the first support block.
9. The support structure for bonding equipment according to claim 2, characterized in that, The second support block is detachably disposed within the receiving groove; and / or, The thickness of the second support block ranges from 3mm to 7mm.
10. A bonding apparatus, characterized in that, The bonding apparatus includes a support structure, a pressing structure, a first base, a second base, and a driving unit as described in any one of claims 1 to 9; the support structure is mounted on the first base, and the pressing structure is mounted on the second base. The driving part is used to drive the first base and / or the second base to move, so that the pressing structure abuts against the top of the structure to be bonded.