Liquid-cooled negative pressure distribution system

Abstract

A data center cooling system for cooling at least one rack system of a data center includes a cooling circuit having a cooling fluid circulating therethrough. The cooling circuit includes a cooling distribution unit and a heat recovery component associated with at least one rack system. The heat recovery member is fluidly coupled to the cooling distribution unit. The cooling circuit has a negative pressure at the heat recovery member.

Description

[0001] Cross-reference to related applications This application claims the benefit of U.S. Provisional Patent Application No. 63 / 518670, filed August 10, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0002] Exemplary embodiments relate to the field of thermal management, and more specifically to the thermal management of servers within a data center. Background Technology

[0003] A “data center” refers to the physical location of one or more servers. Data centers and the servers housed within them typically consume a significant amount of electrical power. Existing servers are designed to be cooled at least partially by airflow. Such servers typically include one or more printed circuit boards with multiple operable heat-generating devices mounted on them. The printed circuit boards are usually housed in an enclosure with vents configured to guide outside air into, through, and out of the enclosure from the data center. The air absorbs heat dissipated by the components and mixes with ambient air after being exhausted from the enclosure. Air conditioning is then used to cool the heated air in the data center and recirculate it, repeating the cooling process.

[0004] Higher-performance server components typically dissipate more power. However, the amount of heat that a conventional cooling system can remove from a server is partly limited by the range of air conditioning available from the data center. Generally, the lower air temperatures in a data center allow each server component cooled by airflow to dissipate more power, and thus allow each server to operate at a correspondingly higher performance level. Summary of the Invention

[0005] According to an embodiment, a data center cooling system for cooling at least one rack system in a data center includes a cooling loop having a cooling fluid circulating therethrough. The cooling loop includes a cooling distribution unit and a heat recovery component associated with at least one rack system. The heat recovery component is fluidly connected to the cooling distribution unit. The cooling loop has a negative pressure at the heat recovery component.

[0006] In addition to one or more of the features described above, or as an alternative, in other embodiments, the cooling circuit includes a pump for moving cooling fluid within the cooling circuit. The pump is positioned downstream of the heat recovery component and upstream of the cooling distribution unit relative to the flow of the cooling fluid.

[0007] In addition to one or more of the features described above, or as an alternative, in other embodiments, the pump is located directly downstream of the outlet of the heat recovery component, and the operation of the pump generates negative pressure at the heat recovery component.

[0008] In addition to one or more of the features described above, or as an alternative, in other embodiments, the pump is a positive pressure pump.

[0009] In addition to one or more of the features described above, or as an alternative, in other embodiments, the cooling circuit includes a pump for moving cooling fluid within the cooling circuit. The pump is positioned downstream of the cooling fluid distribution unit and upstream of the heat recovery component.

[0010] In addition to one or more of the features described above, or as an alternative, in other embodiments, the cooling circuit includes an injector located upstream of the inlet of the heat recovery component.

[0011] In addition to one or more of the features described above, or alternatively, in other embodiments, the injector has a first inlet and a second inlet. The outlet of the heat recovery component is fluidly connected to the second inlet.

[0012] In addition to one or more of the features described above, or as an alternative, in other embodiments, the injector is arranged in parallel with the flow of cooling fluid and the heat recovery component.

[0013] In addition to one or more of the features described above, or as an alternative, in other embodiments, an inlet valve is provided directly upstream of the heat recovery component.

[0014] In addition to one or more of the features described above, or as an alternative, in other embodiments, an outlet valve is included that is disposed directly downstream of the heat recovery component.

[0015] In addition to one or more of the features described above, or as an alternative, in other embodiments, at least one manifold is included. The cooling distribution unit is fluidly connected to the heat recovery component via at least one manifold.

[0016] In addition to one or more of the features described above, or as an alternative, in other embodiments, the heat recovery component is vertically positioned below the cooling distribution unit.

[0017] In addition to one or more of the features described above, or as an alternative, in other embodiments, the heat recovery component is positioned vertically above the cooling distribution unit.

[0018] In addition to one or more of the features described above, or as an alternative, in other embodiments, the cooling circuit includes a plurality of fluid circuits arranged in parallel. Each of the plurality of fluid circuits includes a separate cooling distribution unit and a separate heat recovery component associated with at least one rack system.

[0019] In addition to one or more of the features described above, or as an alternative, in other embodiments, multiple fluid loops are fluidly connected by at least one manifold.

[0020] In addition to one or more of the features described above, or as an alternative, in other embodiments, the cooling distribution unit is a heat exchanger fluidly connected to the cooling system, wherein the heat transfer fluid is configured to absorb heat from the cooling fluid at the cooling distribution unit.

[0021] According to an embodiment, a method for cooling at least one rack system of a data center includes circulating cooling fluid through a cooling loop, transferring heat from the cooling fluid at a cooling distribution unit, and transferring heat to the cooling fluid at a heat recovery component associated with the rack system. The cooling loop has a negative pressure at the heat recovery component.

[0022] In addition to one or more of the features described above, or as an alternative, other embodiments include operating a pump to generate negative pressure at the heat recovery component. This pump is located directly downstream of the outlet of the heat recovery component.

[0023] In addition to one or more of the features described above, or as an alternative, other embodiments include providing a first portion of cooling fluid to a heat recovery member and a second portion of cooling fluid to a first inlet of an ejector in parallel. The flow of the second portion of cooling fluid within the ejector generates a negative pressure at the heat recovery member.

[0024] In addition to one or more of the features described above, or as an alternative, other embodiments include adjusting the position of at least one of the inlet valve and outlet valve associated with the heat recovery component in response to conditions at at least one rack system. Attached Figure Description

[0025] The following description should not be considered as limiting in any way. Referring to the accompanying drawings, similar element numbers are similar: Figure 1 This is a schematic diagram of an example of a cooling system according to an embodiment; Figure 2 This is a schematic diagram of a cooling system integrated into a building according to an embodiment; Figure 3 This is a schematic diagram of a cooling system integrally integrated into a building according to another embodiment; Figure 4 This is a schematic diagram of a cooling system integrated into a building according to an embodiment; Figure 5 This is a schematic diagram of a cooling system integrated into a building according to an embodiment; Figure 6 This is a schematic diagram of a cooling system integrated into a building according to an embodiment; and Figure 7 This is a schematic diagram of a cooling system according to another embodiment. Detailed Implementation

[0026] This document provides a detailed description of one or more embodiments of the disclosed apparatus and methods by way of example and without limitation, with reference to the figures.

[0027] refer to Figure 1 An example of a cooling system 20 is illustrated. As shown, the cooling system 20 includes a cooling distribution system 30 and multiple loads thermally coupled to the cooling distribution system 30. As used herein, the term "load" is intended to apply to any secondary system or component thermally coupled to the cooling distribution system 30, whether the secondary system or component is configured to transfer heat to or remove heat from the cooling distribution system 30. In the non-limiting embodiment shown, the multiple loads of the cooling distribution system 20 include a first load 32 and a second load 34. However, it should be appreciated that embodiments having any number of loads connected to the cooling distribution system 30 (e.g., such as three loads, four loads, or five loads) are within the scope of this disclosure. Examples of suitable loads include, but are not limited to, data center cooling systems, air conditioning systems (such as air handling units), cooler systems, heat pumps, and sanitation or drinking water systems.

[0028] As shown in the figure, the cooling distribution system 30 includes a cooling distribution loop through which the main heat transfer fluid F circulates. Examples of suitable heat transfer fluids F include, but are not limited to, water, propylene glycol, dielectric fluids, and refrigerants. The cooling distribution system 30 may include a pump or other moving device 36 for moving the heat transfer fluid F through the cooling distribution loop. In some embodiments, the cooling distribution loop may include one or more valves (not shown) to allow the heat transfer fluid F to selectively bypass one or more of the loads. Although the cooling distribution loop is shown as having a closed-loop configuration, embodiments in which the cooling distribution loop is not a closed loop are also contemplated herein.

[0029] The cooling distribution system 30 is configured to transfer heat between multiple loads. Figure 1 In the simplified cooling distribution system 30 shown in the embodiments, the heat transfer fluid F is configured to absorb heat from the first load 32 and transfer heat to the second load 34. Although the cooling distribution loop is thermally coupled to one or more loads via heat exchangers (such as via a first heat exchanger 38 and a second heat exchanger 40, respectively), it should be appreciated that embodiments in which the cooling distribution loop is thermally coupled to at least one load in another suitable manner are within the scope of this disclosure. The first heat exchanger 38 may also be referred to herein as a cooling distribution unit.

[0030] In the non-limiting embodiment shown, the first load 32 is a data center cooling system including a secondary cooling loop through which a coolant or secondary cooling fluid C is configured to circulate. In some embodiments, the cooling fluid C is a liquid, such as water, propylene glycol, or a dielectric fluid. The data center cooling system 32 is associated with one or more data centers 50, each data center having at least one rack system 52 containing at least one server or a component having heat-generating electronics 54 therein (referred to herein as a "server") (see [link to documentation]). Figure 2 Localized cooling at one or more servers 54 can be performed via a separate server cooling system having a separate fluid (not described herein). As shown, rack system 52 includes at least one heat recovery member 56 configured to receive a flow of cooling fluid C. In the non-limiting embodiment shown, heat recovery member 56 is a heat exchanger. However, in other embodiments, heat recovery member 56 may be a cold plate or other suitable heat transfer device. Within each heat recovery member 56, heat is transferred from rack system 52 (e.g., from one or more components of at least one server 54 disposed therein) to cooling fluid C. In embodiments where data center 50 includes multiple rack systems 52, as... Figure 1 As shown, cooling fluid C is supplied in parallel to heat recovery components 56 associated with each rack system 54. The flow of cooling fluid C exiting from each heat recovery component 56 then rejoins at a location upstream of the cooling distribution unit 38 or at other thermal connections of the cooling distribution system 30. It should be appreciated that in embodiments in which the data center cooling system 32 alternatively or additionally includes multiple data centers 50, cooling fluid C may be supplied in parallel to each data center 50, and may further be supplied in parallel to the heat recovery components 56 of each rack system 54 of the multiple data centers.

[0031] Now for reference Figure 2-6 Various embodiments of a cooling system 20 within a building are illustrated. Implementing the cooling system 20, particularly distributing the cooling fluid C and heat transfer fluid F among various loads, can be challenging. Furthermore, external leakage of the cooling fluid C (e.g., such as within the rack system 52) can potentially cause significant damage to the rack system 52. To minimize the risk of such leakage, in embodiments, the secondary cooling circuit has negative pressure (relative to atmospheric pressure) or zero pressure in at least one heat recovery component 56.

[0032] Now for reference Figure 2 and Figure 3In the illustrated non-limiting embodiment, the data center cooling system 32 has a secondary cooling loop comprising a tank or accumulator 60 at least partially filled with cooling fluid C. As shown, the tank 60 may be open to the atmosphere or may be sealed and pressurized by the secondary cooling loop. Thus, in some embodiments, such as when the tank 60 is open to the atmosphere, the secondary cooling loop has an open-loop configuration. The outlet 62 of the tank 60 is fluidly connected to an inlet valve 64 via a first conduit 66, and the inlet valve 64 is fluidly connected to an inlet 68 of at least one heat recovery component 56 via a second conduit 70. A third conduit 76 connects the outlet 72 of the heat recovery component 56 to the inlet 74 of a cooling distribution unit 38, and a fourth conduit 78 connects the outlet 80 of the cooling distribution unit 38 to the inlet 82 of the tank 60.

[0033] The first pump 84 is configured to circulate cooling fluid C within at least a portion of the secondary cooling circuit. As shown, the first pump 84 may be located between the outlet 62 and the inlet valve 64 of the tank 60. The second pump 86 may be located downstream of the heat recovery component 56 relative to the flow of cooling fluid C, for example, at a location such as upstream of the cooling distribution unit 38. In an embodiment, the second pump 86 is a positive displacement pump. A controller may be operatively coupled to at least one of the first pump 84, the second pump 86, and the inlet valve 64. The operation of one or more of the first pump 84, the second pump 86, and the inlet valve 64 may be controlled in response to a state or condition at the data center.

[0034] In operation, a first pump 84 directs the flow of cooling fluid C through a first conduit 66 to an inlet valve 64. Furthermore, the operation of a second pump 86, located downstream of at least one heat recovery component 56, creates negative or zero pressure within the heat recovery component 56, and in some embodiments, creates negative or zero pressure within a conduit 70 connected to the inlet valve 64. The position of the inlet valve 64 is adjustable to control the flow of cooling fluid C toward at least one heat recovery component 56. In the event of a leak or malfunction, the inlet valve 64 can be closed to stop the flow of cooling fluid C to the rack system 52, minimizing damage to it.

[0035] exist Figure 2 and Figure 3In the non-limiting embodiment shown, the various components of the cooling system 20 are arranged at different levels of the building (relative to the ground floor). For example, at least one rack system 52 of the data center 50 and its associated inlet valve 64 may both be vertically positioned below the thermal interface between the second pump 86 and / or the cooling distribution system and the data center cooling system (such as the cooling distribution unit 38). The inlet valve 64 may be vertically positioned above the inlet 68 of at least one heat recovery component 56, and the tank 60 and the first pump 84 may be vertically positioned below at least one heat recovery component 56. However, it should be understood that regardless of the configuration of the data center cooling system 32, at least one heat recovery component 56 is vertically positioned above the thermal interface between the cooling distribution system 30 and the data center cooling system 32. Figure 4 and Figure 6 Or at the same level as the thermal interface between the cooling distribution system 30 and the data center cooling system 32. Figure 5 Examples of this disclosure are also within the scope of this disclosure.

[0036] In some embodiments, the data center cooling system 32 is fluidly and thermally coupled to multiple data centers 50, such as those located on different floors of a building. In such embodiments, each of the multiple data centers 50 includes at least one rack system 52 containing one or more servers 54. When used to cool multiple data centers 50, the data center cooling system 32 may include multiple parallel fluid loops, each fluid loop associated with a corresponding data center 50. Reference Figure 3 In a non-limiting embodiment, each fluid loop includes an inlet valve 64, a second pump 86, and its own thermal interface with the cooling distribution system 30 via a cooling distribution unit 38. Although a single cooling distribution system 30 is shown, in some embodiments, the cooling distribution units 38, thermally coupled to multiple parallel loops of the data center cooling system 32, may originate from different cooling distribution systems. The flows of cooling fluid C output from each cooling distribution unit 38 then reconverge at a location upstream of the tank 60. Although the data center cooling system 32 is described as having multiple data centers 50 arranged in parallel, it should be recognized that the same construction of the data center cooling system 32 can be applied to a data center 50 having multiple rack systems 52 arranged in parallel relative to the flows of cooling fluid C within secondary cooling loops.

[0037] In other embodiments, the building may have a separate data center cooling system 32 for each data center 50. In such embodiments, such as Figure 4 As shown, the cooling distribution unit 38 of each data center cooling system 32 can be connected to the same cooling distribution system 30 or a different cooling distribution system.

[0038] Now continue with the reference. Figure 4-6This illustrates another embodiment of the data center cooling system 32. The data center cooling system 32 is related to... Figure 2 and Figure 3 Similar to data center cooling systems; however, with Figure 2 and Figure 3 Unlike the embodiments described herein, the secondary cooling loop of the data center cooling system 32 has a closed-loop configuration. Therefore, the data center cooling system 32 does not need to include a tank as previously described herein. In such embodiments, the outlet 72 of the heat recovery component 56 can be directly coupled to the inlet 74 of the cooling distribution unit 38. As shown, the inlet valve 64 can be arranged upstream of the inlet 74 of the cooling distribution unit 38, for example, directly upstream. In embodiments comprising multiple data centers 50 and / or multiple rack systems 52 arranged in parallel with respect to the flow of cooling fluid C within the secondary cooling loop, the inlet valve 64 can be located upstream of each of the multiple data centers 50 or each of the multiple rack systems 52 within a data center.

[0039] A single pump 88, replacing the first pump 84 and the second pump 86 previously described herein, may be located directly upstream of the inlet 74 of the cooling distribution unit 38 and directly downstream of the outlet 72 of the heat recovery component 56. In the non-limiting embodiment shown, the data center 50 is vertically positioned above the cooling distribution unit 38.

[0040] In operation, cold cooling fluid C is circulated through a secondary cooling circuit via pump 88. Cooling fluid C is heated as it passes through heat recovery member 56. From outlet 72 of at least one heat recovery member 56, cooling fluid C is supplied to inlet 74 of cooling distribution unit 38, where heat is transferred to the heat transfer fluid of cooling distribution system 20. From outlet 80 of cooling distribution unit 38, cooling fluid C returns to inlet of heat recovery member 56 via inlet valve 64. Operation of pump 88, located directly downstream of at least one heat recovery member 56, creates negative or zero pressure within heat recovery member 56, thereby drawing cooling fluid C through heat recovery member 56. One or more inlet valves 64 may be operable to control the flow of cooling fluid C supplied to heat recovery member 56.

[0041] Now for reference Figure 5 and Figure 6 This provides a similar closed-loop configuration for the data center cooling system 32. As shown, the secondary cooling loop may include at least one manifold, such as an inlet manifold 89 fluidly connected to the data center 50 or rack system 52 via a corresponding inlet branch, and an outlet manifold 91 fluidly connected to the outlet of each data center 50 or rack system 52 via a corresponding outlet branch. Furthermore, as... Figure 5As shown, the data center cooling system 32 may include not only inlet valves 64 associated with each inlet branch (e.g., directly upstream of the inlet 68 of the heat recovery component 56), but also outlet valves 65 associated with each outlet branch (e.g., directly downstream of the outlet 72 of the heat recovery component 56). As previously described, the controller may adjust (e.g., close) the position of at least one of the inlet valves 64 and outlet valves 65 associated with the heat recovery component 56 in response to detecting a condition (e.g., a fault) at at least one rack system.

[0042] In some embodiments, the data center cooling system 32 may also include vents 90 and / or expansion tanks 92 and corresponding control valves 94. Vents 90 can be used to remove any gases (e.g., air) that have accumulated in the cooling fluid C. Although Figure 5 Vent 90 is shown directly downstream of pump 88, but it should be understood that one or more vents 90 may be located anywhere relative to the secondary cooling circuit. For example, vent 90 may be associated with each inlet branch connected to the corresponding heat recovery component 56, such as between inlet valve 64 and inlet 68. Expansion tank 92 and corresponding control valve 94 may be used to maintain a constant pressure of the cooling fluid C downstream of pump 88. As shown, expansion tank 92 and control valve 94 may be directly upstream of cooling distribution unit 38 ( Figure 5 ), or may be located downstream of the cooling distribution unit 38, such as at a location upstream of one or more inlet valves 64 ( Figure 6 ).exist Figure 6 In the non-limiting embodiment shown, the expansion tank 92 and control valve 94 are directly connected to the manifold; however, any location downstream of the cooling distribution unit 38 and upstream of the heat recovery component 56 is within the scope of this disclosure.

[0043] Now for reference Figure 7 Another example of a data center cooling system 32 is shown. In the non-limiting embodiment shown, the data center cooling system 32 includes multiple fluid loops arranged in parallel. Each fluid loop includes a cooling distribution unit 38 of a cooling distribution system 30 as previously described and at least one data center 50 having one or more rack systems 52. A pump 100 may be arranged downstream of the cooling distribution unit 38 and upstream of the rack system 52 of the data center 50 relative to the flow direction of the cooling fluid C. In the non-limiting embodiment shown, an ejector or nozzle 102 is arranged at or upstream of the inlet of one or more rack systems 52. The ejector 102 may be a typical ejector having a first or main inlet 104, a second or secondary inlet 106, and an outlet 108. As is known, nozzles (e.g., such as convergent-diffusion nozzles) and diffusers are arranged internally within the ejector 102.

[0044] The ejector 102 is positioned such that the flow of cooling fluid C at the inlet of the rack system 52 is divided into two portions, C1 and C2. The first portion C1 of the cooling fluid is configured to flow through the heat recovery components of the rack system 52 and / or across one or more servers 54 or other heat-generating components within the rack system 52. The second portion C2 of the cooling fluid is provided to the first inlet 104 of the ejector 102. As the second portion C2 of the cooling fluid passes through the nozzle of the ejector 102, the flow accelerates and the pressure decreases, thereby creating a negative pressure at the second inlet 106. This pressure reduction draws the first portion C1 of the cooling fluid C through the rack system 52, where the first portion C1 absorbs heat and enters the secondary inlet 106 of the ejector 102. The first portion C1 and the second portion C2 of the cooling fluid then mix and exit from the outlet 108 of the ejector 102. The heated cooling fluid C is then provided to the inlet of the cooling distribution unit 38, where heat is released to the heat transfer fluid F.

[0045] Inlet valve 110 may be located downstream of pump 100 and directly upstream of the inlet of one or more rack systems 52 of data center 50. Similarly, outlet valve 112 may be located downstream of the outlet of one or more rack systems 52 of data center 50 and upstream of the inlet of cooling distribution unit 38.

[0046] The outlet of the cooling distribution unit 38 may be fluidly connected to the inlet of one or more rack systems 52 of one or more data centers 50, such as via inlet manifold 114. Similarly, the outlet of the rack system 52 may be fluidly connected to the inlet of the cooling distribution unit 38, such as via outlet manifold 116. In embodiments where the secondary cooling loop of the data center cooling system 32 comprises multiple fluid loops, the multiple fluid loops may be operatively connected via inlet manifold 114 and outlet manifold 116. Through such connections, in cases where cooling of one or more of the rack systems is not required (e.g., due to shutdown or failure), the rack system can be isolated from the fluid loops by closing its associated inlet valve 110 and outlet valve 112. In the non-limiting embodiment shown, the multiple fluid loops do not share components. Each fluid loop has its own cooling distribution unit 38, pump 100, ejector 102, and inlet valve 110 and outlet valve 112. However, embodiments in which one or more components (such as pump 100 or cooling distribution unit 38) are shared among the multiple fluid loops are also within the scope of this disclosure.

[0047] Using liquid cooling fluids to cool data centers is more effective than existing cooling methods that use airflow. Furthermore, by applying negative pressure to a portion of the secondary cooling loop associated with data center 50 or rack system 52, the potential for leakage within data center or rack system 52 is limited.

[0048] The term “about” is intended to include the degree of error associated with measurements based on a specific amount of equipment available at the time of application submission.

[0049] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. As used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It will be further understood that the terms “comprising” and / or “including” as used in this specification indicate the presence of the indicated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof.

[0050] Although this disclosure has been described with reference to one or more exemplary embodiments, it will be understood by those skilled in the art that various changes may be made and elements may be replaced with equivalents without departing from the scope of this disclosure. Furthermore, many modifications may be made to suit particular situations or materials to the teachings of this disclosure without departing from its essential scope. Therefore, this disclosure is intended to be limited to the specific embodiments disclosed as the best mode for carrying out the concepts of this disclosure, but rather to include all embodiments falling within the scope of the claims.

Claims

1. A data center cooling system for cooling at least one rack system in a data center, the data center cooling system comprising: A cooling circuit having a cooling fluid circulating therethrough, the cooling circuit comprising: Cooling distribution unit; and A heat recovery component associated with the at least one rack system, the heat recovery component being fluidly connected to the cooling distribution unit; The cooling circuit is under negative pressure at the heat recovery component.

2. The data center cooling system according to claim 1, wherein, The cooling circuit further includes a pump for moving the cooling fluid within the cooling circuit, the pump being arranged downstream of the heat recovery component and upstream of the cooling distribution unit relative to the flow of the cooling fluid.

3. The data center cooling system according to claim 2, wherein, The pump is located directly downstream of the outlet of the heat recovery component, and the operation of the pump generates the negative pressure at the heat recovery component.

4. The data center cooling system according to claim 2 or claim 3, wherein, The pump is a positive pressure pump.

5. The data center cooling system according to claim 1, wherein, The cooling circuit further includes a pump for moving the cooling fluid within the cooling circuit, the pump being arranged downstream of the cooling distribution unit and upstream of the heat recovery component relative to the flow of the cooling fluid.

6. The data center cooling system according to claim 1, wherein, The cooling circuit further includes an injector located upstream of the inlet of the heat recovery component.

7. The data center cooling system according to claim 6, wherein, The injector has a first inlet and a second inlet, wherein the outlet of the heat recovery component is fluidly connected to the second inlet.

8. The data center cooling system according to claim 6 or claim 7, wherein, The ejector is arranged in parallel with the flow of the cooling fluid relative to the heat recovery component.

9. The data center cooling system according to any one of the preceding claims further includes an inlet valve disposed directly upstream of the heat recovery component.

10. The data center cooling system of claim 9, further comprising an outlet valve disposed directly downstream of the heat recovery component.

11. The data center cooling system according to any one of the preceding claims, further comprising at least one manifold, the cooling distribution unit being fluidly connected to the heat recovery component via the at least one manifold.

12. The data center cooling system according to any one of the preceding claims, wherein, The heat recovery component is vertically positioned below the cooling distribution unit.

13. The data center cooling system according to any one of claims 1 to 11, wherein, The heat recovery component is vertically positioned above the cooling distribution unit.

14. The data center cooling system according to any one of the preceding claims, wherein, The cooling circuit includes multiple fluid circuits arranged in parallel, each of which includes a separate cooling distribution unit and a separate heat recovery component associated with the at least one rack system.

15. The data center cooling system according to claim 14, wherein, The plurality of fluid circuits are fluidly connected by at least one manifold.

16. The data center cooling system according to claim 14, wherein, The cooling distribution unit is a heat exchanger fluidly connected to the cooling system, wherein the heat transfer fluid is configured to absorb heat from the cooling fluid at the cooling distribution unit.

17. A method for cooling at least one rack system in a data center, comprising: The cooling fluid is circulated through the cooling circuit; Heat is transferred from the cooling fluid at the cooling distribution unit; as well as Heat is transferred to the cooling fluid at a heat recovery component associated with the rack system, wherein the cooling circuit is under negative pressure at the heat recovery component.

18. The method of claim 17, further comprising operating a pump to generate the negative pressure at the heat recovery member, the pump being located directly downstream of the outlet of the heat recovery member.

19. The method of claim 17, further comprising providing a first portion of the cooling fluid to the heat recovery member and a second portion of the cooling fluid to a first inlet of the ejector, wherein the flow of the second portion of the cooling fluid within the ejector generates the negative pressure at the heat recovery member.

20. The method according to any one of claims 17 to 19, further comprising adjusting the position of at least one of the inlet valve and outlet valve associated with the heat recovery component in response to conditions at the at least one rack system.

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