Jig disc, testing system and positioning rod for testing integrated circuit carrier plate

Abstract

The invention relates to a jig disc for testing an integrated circuit carrier plate, which comprises a base capable of defining a length axial direction, a width axial direction and a height axial direction, and two positioning rods arranged on the base in a manner of extending along the length axial direction, and at least one positioning rod can slide along the width axial direction relative to the base so as to be matched with the width of the carrier plate. The positioning rods are arranged on the base and can be fixed to the base so that the carrier plate can be clamped by the two positioning rods, each positioning rod comprises a main step downwards formed into a step shape from the edge of the top face of the positioning rod, each main step comprises a clamping face and a bearing face, the clamping faces of the two positioning rods face each other, and at least one of the clamping faces is made of elastic buffering materials. The carrier plate is clamped by the clamping surface and is supported on the bearing surface through a non-test contact area on the lower surface of the carrier plate, and a gap is formed between the test contact area and the base; according to the invention, the test requirements of support plates of various sizes and multiple support plates can be met, and the test flexibility is high.

Description

Technical Field

[0001] This invention relates to the testing of integrated circuit (IC) substrates, and particularly to a fixture, testing system, and positioning rod for testing integrated circuit substrates. Background Technology

[0002] IC carrier boards are key components in the packaging process. Their main function is to serve as carriers for ICs, which are placed on printed circuit boards (PCBs). The internal circuitry of the IC carrier board is electrically connected between the IC and the PCB, thereby transmitting signals between the IC and the PCB. It also has functions such as protecting circuits, fixing circuits, and dissipating residual heat.

[0003] Before placing an IC onto an IC carrier board, the IC carrier board needs to be tested to confirm the quality of its internal circuitry. Therefore, how to secure the IC carrier board, especially how to secure IC carrier boards of different sizes or multiple IC carrier boards at the same time, to facilitate handling and testing and improve testing flexibility, is an issue that industry players urgently need to address. Summary of the Invention

[0004] One aspect of the present invention is to provide a fixture tray for testing integrated circuit carrier boards, which can be adapted to fix IC carrier boards of various sizes and / or multiple IC carrier boards to improve the flexibility of testing.

[0005] Therefore, one aspect of the present invention provides a fixture tray for testing integrated circuit substrates, suitable for clamping substrates, the substrate including an upper surface and a lower surface, the lower surface including a test contact area and a non-test contact area; the fixture tray includes: a base capable of defining mutually perpendicular length, width, and height axes; and two positioning rods, each positioning rod extending along the length axis and disposed on the base, at least one of the two positioning rods being a slidable positioning rod, the slidable positioning rod being able to switch between a slidable state and a fixed state, the slidable positioning rod being able to slide relative to the base along the width axis in the slidable state to adapt to the width of the substrate, the slidable positioning rod being fixed to the base in the fixed state to allow the substrate to be clamped. The plate is clamped and fixed by the two positioning rods; wherein each positioning rod includes a top surface and a bottom surface facing two opposite directions along the height axis, and a stepped main step forming downward from the edge of the top surface. The main step includes a clamping surface adjacent to the top surface and a bearing surface adjacent to the clamping surface. The clamping surfaces of the main steps of the two positioning rods face each other and at least one of them is formed of an elastic cushioning material. The two positioning rods are configured such that the clamping surfaces of the main steps of the two positioning rods can be used to jointly clamp the plate, and the bearing surfaces of the main steps of the two positioning rods can be used to jointly support the non-test contact area of ​​the lower surface of the plate, so that there is a gap between the two positioning rods and the test contact area extending along the length axis and located on the lower surface of the plate and the base.

[0006] Therefore, both positioning rods can be sliding positioning rods, or only one of them can be sliding positioning rods while the other is fixed to the base and cannot slide. By sliding the sliding positioning rod relative to the base along the width axis in the sliding state, the relative position of the two positioning rods can be adjusted, thereby changing the distance between the clamping surfaces of the main steps of the two positioning rods to adapt to the width of the carrier plate to be clamped. After adjustment, the sliding positioning rod is converted to a fixed state, thus fixing the position of the sliding positioning rod and securing the carrier plate firmly on the jig plate for subsequent testing. In other words, the jig plate of the present invention can clamp carrier plates of different sizes by adjusting the distance between the two positioning rods, and multiple carrier plates of the same size can be arranged in a row along the length direction on the main steps of the two positioning rods without electrical interference. Even if carrier plates of the same size have manufacturing tolerances, the clamping surface formed by the elastic cushioning material can absorb these tolerances, allowing multiple carrier plates with slightly different dimensions due to manufacturing tolerances to be securely clamped by the two positioning rods. Furthermore, both the upper and lower surfaces of the carrier plates have contact points. During testing, the test probe will contact the contact points on the upper surface and press against the carrier plate. At this time, the bearing surfaces of the main steps of the two positioning rods support the non-test contact area on the lower surface of the carrier plate. Since there is a gap between the test contact area on the lower surface of the carrier plate and the base, the contact points on the lower surface of the carrier plate will not contact the fixture or base and be subject to electrical interference. Moreover, the bearing surfaces of the main steps of the two positioning rods can provide appropriate force to support the carrier plates, preventing them from detaching from the fixture.

[0007] Preferably, each positioning rod further includes a stepped secondary step forming downwards from the bearing surface of the main step, the secondary step including an upward-facing receiving surface; in the height axis, the bearing surface of the main step is located between the top surface of the positioning rod and the receiving surface of the secondary step, the receiving surface of the secondary step is located between the bearing surface of the main step and the bottom surface of the positioning rod, a first height can be defined between the top surface of the positioning rod and the bearing surface of the main step, a second height can be defined between the bearing surface of the main step and the receiving surface of the secondary step, and a third height can be defined between the receiving surface of the secondary step and the bottom surface of the positioning rod, the third height being greater than or equal to twice the sum of the first height and the second height.

[0008] Therefore, since the bearing surface of the main step can only contact the non-test contact area on the lower surface of the carrier plate, the bearing surface of the main step may be very narrow. This could cause the carrier plate to accidentally fall off the bearing surface of the main step. In this case, the bearing surface of the secondary step will catch the carrier plate, preventing it from falling onto the base. Furthermore, by designing a third height that is greater than or equal to twice the sum of the first and second heights, the height of the bearing surface of the secondary step will be quite close to the bearing surface of the main step. This makes the drop height of the carrier plate from the bearing surface of the main step to the bearing surface of the secondary step very small. Consequently, the return height for the tester to place the carrier plate back onto the bearing surface of the main step is also very small, thus reducing the risk of the carrier plate touching adjacent carrier plates during the return process and causing them to fall as well.

[0009] More preferably, in the width axis, the main step has a first width, and the secondary step has a second width, the second width being greater than or equal to three times the first width.

[0010] In this way, the secondary staircase can effectively catch the load plate falling from the main staircase and prevent the load plate from falling from the secondary staircase.

[0011] More preferably, the first height is less than or equal to the thickness of the carrier plate.

[0012] During testing on the carrier plate, the test probe and the fixture disk move relative to each other along the height axis and approach each other, so that the probe tip contacts the contact point on the upper surface of the carrier plate. However, if the probe contacts the positioning rod first, interference will occur, preventing the probe tip from contacting the contact point on the upper surface of the carrier plate, causing problems such as the test not being able to proceed smoothly and probe damage. The design of the first height being less than or equal to the thickness of the carrier plate ensures that the upper surface of the carrier plate is not lower than the top surface of the positioning rod, thus effectively avoiding the aforementioned interference problem between the probe and the positioning rod.

[0013] Preferably, the base includes a body and two width axis guide members. The two width axis guide members are spaced apart and extended along the width axis of the body. The slidable positioning rod includes a first end and a second end, which are respectively disposed on the two width axis guide members. When the slidable positioning rod is in the slidable state, it slides along the width axis through the guidance of the two width axis guide members.

[0014] In this way, the two width axis guide members can guide the sliding positioning rod to slide along the width axis, making it easier to adjust the position of the sliding positioning rod.

[0015] More preferably, each of the width axial guide members includes a guide groove extending along the width axial direction. The guide groove includes a guide portion and a receiving portion. The first end and the second end of the slidable positioning rod each have a through hole, and the first end and the second end are respectively provided with a bolt passing through the through hole and a nut screwed to the bolt. The bolt passes through the guide portion of the guide groove, and the nut is disposed in the receiving portion of the guide groove and can be locked with the bolt to fix the slidable positioning rod to the width axial guide member.

[0016] In this way, the user can make the sliding positioning rod slide by loosening the bolts at the first and second ends of the sliding positioning rod and the bolts can be guided by the guide part of the guide groove. The user can make the sliding positioning rod fix by tightening the bolts. The operation is quite quick and simple.

[0017] Preferably, when the carrier plate is clamped and fixed by the two positioning rods, the upper surface of the carrier plate is flush with or higher than the top surface of the two positioning rods.

[0018] In this way, when the test probe and the fixture disk move relative to each other in the height axis and approach each other, the probe will not contact the positioning rod first. Therefore, interference between the probe and the positioning rod can be effectively avoided, so that the test can be carried out smoothly and the probe can be protected from damage.

[0019] Preferably, each of the positioning rods includes a first end, a second end, and a stop portion connected to the first end, so that the carrier plate is stopped by the stop portions of the two positioning rods; the fixture disk further includes a length axial positioning member disposed between the two positioning rods, the length axial positioning member being adjustable in position along the length axial direction, so as to abut the carrier plate between the first end and the second end of the two positioning rods.

[0020] Therefore, in addition to clamping the carrier plate in the width axis through the clamping surfaces of the main steps of the two positioning rods, the jig disc of the present invention can also clamp a single carrier plate or multiple carrier plates arranged in a row along the length axis through the stop portions of the two positioning rods and the length axis positioning member, so as to more securely fix the carrier plate to the jig disc and prevent the carrier plate from moving along the length axis.

[0021] More preferably, the fixture disk further includes a length axis guide member disposed between the two positioning rods. The length axis guide member includes a guide groove extending along the length axis. The guide groove includes a guide portion and a receiving portion. The length axis positioning member includes a bolt and a nut screwed to the bolt. The bolt passes through the guide portion of the guide groove. The nut is disposed in the receiving portion of the guide groove and can be locked with the bolt to be fixed to the length axis guide member.

[0022] In this way, the user can simply loosen the bolts of the axial positioning component to allow it to slide along the guide groove, thereby moving the axial positioning component to the position abutting the carrier plate. Then, tightening the bolts will fix the position of the axial positioning component, making the operation quite quick and easy.

[0023] Preferably, at least one of the two positioning rods includes another main step forming a stepped shape downward from the other edge of the top surface, and at least one of the clamping surfaces of the two main steps included in the positioning rod is formed of the elastic cushioning material.

[0024] Therefore, the positioning rods, including the two main steps, can clamp the carrier plate together with the positioning rods arranged on its two sides. In other words, the jig disc of the present invention can have more than two positioning rods, and each pair of adjacent positioning rods can be used to clamp a carrier plate of one size. In other words, as long as the jig disc of the present invention has more than two positioning rods, it can clamp carrier plates of different sizes simultaneously. As long as one of the two clamping surfaces that jointly clamp the same carrier plate is formed of an elastic cushioning material, it can achieve the effect of absorbing the manufacturing tolerance of the carrier plate. Therefore, it is sufficient that at least one of the clamping surfaces of the two main steps included in the same positioning rod is formed of an elastic cushioning material.

[0025] Another aspect of the present invention is to provide a test system for testing integrated circuit substrates, suitable for testing substrates, the test system comprising: a carrier stage; a fixture disk as described above, disposed on the carrier stage for clamping the substrate; and a probe device comprising a probe holder and probes disposed on the probe holder for testing the substrate clamped by the fixture disk.

[0026] Therefore, the testing system of the present invention is equipped with the fixture tray as described above, and thus has its advantages and functions, which can meet the testing needs of IC carrier boards of various sizes and multiple IC carrier boards, thereby improving the flexibility of testing.

[0027] Preferably, each positioning rod of the fixture plate further includes a stepped secondary step forming downwards from the bearing surface of the main step, the secondary step including an upward-facing bearing surface; in the height axis, the bearing surface of the main step is located between the top surface of the positioning rod and the bearing surface of the secondary step; the height defined along the height axis between the top surface of each positioning rod and the bearing surface of the main step is less than or equal to the thickness of the carrier plate.

[0028] Therefore, if the carrier plate accidentally falls from the bearing surface of the main step, the bearing surface of the secondary step will catch the carrier plate, preventing it from falling onto the base. The tester can then easily place the carrier plate back onto the bearing surface of the main step. Furthermore, during carrier plate testing, the platform and probe device move relative to each other along the height axis, bringing them closer together. This allows the probe tip to contact the contact point on the upper surface of the carrier plate held by the fixture on the platform. However, if the probe contacts the positioning rod first, interference will occur, preventing the probe tip from contacting the contact point on the upper surface of the carrier plate, causing problems such as test failure and probe damage. The design that the height between the top surface of the positioning rod and the bearing surface of the main step is less than or equal to the thickness of the carrier plate ensures that the upper surface of the carrier plate will not be lower than the top surface of the positioning rod, effectively avoiding the aforementioned interference problem between the probe and the positioning rod.

[0029] Preferably, a vertical distance can be defined between the tip of the probe and the bottom surface of the probe holder along the height axis, and the height defined between the top surface of each positioning rod and the bearing surface of the main step along the height axis is less than half of the vertical distance.

[0030] In this way, probe collisions with the fixture tray or carrier plate can be avoided during carrier plate testing, thereby preventing damage to the probe or carrier plate that may result from such collisions.

[0031] Another aspect of the present invention provides a positioning rod for a fixture disk for testing integrated circuit substrates, capable of defining mutually perpendicular length, width, and height axes. The positioning rod extends elongated along the length axis. The positioning rod comprises a top surface and a bottom surface facing two opposite directions of the height axis, and two main steps forming a stepped shape from two opposite edges of the top surface. Each main step includes a clamping surface adjacent to the top surface and a bearing surface adjacent to the clamping surface. The clamping surface of each main step is used to clamp the substrate together with another positioning rod. At least one of the clamping surfaces of the two main steps is formed of an elastic cushioning material.

[0032] Therefore, the positioning rod can be applied to the aforementioned jig tray to allow each side of the positioning rod to clamp a single carrier plate or multiple carrier plates arranged in a row along the length direction, together with another positioning rod. In other words, the same positioning rod can be used to clamp carrier plates of the same or different sizes, thus expanding the placement space for batch inspection carrier plates in the jig tray and giving the jig tray greater flexibility. Secondly, as long as one of the clamping surfaces of the two positioning rods clamping the same carrier plate is formed of elastic cushioning material, it can absorb the manufacturing tolerances of the carrier plate. Therefore, at least one of the clamping surfaces of the two main steps included in the positioning rod needs to be formed of elastic cushioning material.

[0033] Preferably, the positioning rod further includes two secondary steps forming a stepped shape downwards from the bearing surfaces of the two main steps, each secondary step including an upward-facing bearing surface; in the height axis, the bearing surface of each main step is located between the top surface of the positioning rod and the bearing surface of each secondary step, and the bearing surface of each secondary step is located between the bearing surface of each main step and the bottom surface of the positioning rod. A first height can be defined between the top surface of the positioning rod and the bearing surface of each main step, a second height can be defined between the bearing surface of each main step and the bearing surface of each secondary step, and a third height can be defined between the bearing surface of each secondary step and the bottom surface of the positioning rod, wherein the third height is greater than or equal to twice the sum of the first height and the second height.

[0034] Therefore, since the main step's bearing surface is used to support the non-test contact area on the lower surface of the carrier plate, the bearing surface of the main step may be very narrow. If the carrier plate accidentally falls from the bearing surface of the main step, the bearing surface of the secondary step will catch it, making it easier for the tester to place the carrier plate back onto the bearing surface of the main step. Moreover, by designing a third height that is greater than or equal to twice the sum of the first and second heights, the height of the bearing surface of the secondary step will be quite close to the bearing surface of the main step. This results in a very small drop height for the carrier plate from the bearing surface of the main step to the bearing surface of the secondary step. Consequently, the height required for the tester to place the carrier plate back onto the bearing surface of the main step is also very small, thus reducing the risk of the carrier plate touching adjacent carrier plates during the return process and causing them to fall as well.

[0035] More preferably, in the width axis, each of the main steps has a first width, and each of the sub-steps has a second width, the second width being greater than or equal to three times the first width.

[0036] In this way, the secondary staircase can effectively catch the load plate falling from the main staircase and prevent the load plate from falling from the secondary staircase.

[0037] More preferably, the first height is less than or equal to the thickness of the carrier plate.

[0038] Therefore, during the testing of the carrier plate, the test probe moves relative to the positioning rod and the carrier plate in the height axis and approaches each other, so that the probe tip contacts the contact point on the upper surface of the carrier plate. However, if the probe contacts the positioning rod first, interference will occur, preventing the probe tip from contacting the contact point on the upper surface of the carrier plate, causing problems such as the test not being able to proceed smoothly and probe damage. The design of the first height being less than or equal to the thickness of the carrier plate ensures that the upper surface of the carrier plate is not lower than the top surface of the positioning rod, thus effectively avoiding the aforementioned interference problem between the probe and the positioning rod.

[0039] Detailed construction, features, assembly, and usage of the fixture tray, testing system, and positioning rod for integrated circuit substrate testing provided by this invention will be described in the subsequent detailed description of embodiments. However, those skilled in the art will understand that the detailed descriptions and specific embodiments listed for implementing this invention are for illustrative purposes only and are not intended to limit the scope of patent protection of this invention. Attached Figure Description

[0040] The fixture tray, testing system, and positioning rod for testing integrated circuit substrates provided by the present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a three-dimensional schematic diagram of a test system for testing integrated circuit substrates and multiple substrates provided in the first preferred embodiment of the present invention. Figure 2 for Figure 1 A partial front view schematic diagram; Figure 3 This is a schematic diagram of the bottom view of the carrier plate; Figure 4 A three-dimensional assembly diagram of the jig tray for testing the system; Figure 5 An exploded three-dimensional view of the jig disc; Figure 6 This is a three-dimensional assembly diagram of the jig disc and carrier plate; Figure 7 An exploded perspective view of the base of the jig tray; Figure 8 This is a magnified view of a portion of the base; Figure 9 for Figure 6 A partial sectional view along section line 9-9 shows the positioning rod of the jig disc in a fixed state; Figure 10 Similar to Figure 9 The indicator shows that the positioning rod is in a sliding state; Figure 11 A three-dimensional assembly diagram of the positioning rods of the jig disc; Figure 12 for Figure 11 A cross-sectional view of the positioning rod shown; Figure 13 and Figure 14 A three-dimensional assembly diagram of another positioning rod for the jig disc; Figure 15 for Figure 13 and Figure 14 A cross-sectional view of the positioning rod shown; Figure 16 for Figure 6 Sectional view along section line 16-16; Figure 17 A three-dimensional assembly diagram of another positioning rod for the jig plate; Figure 18 for Figure 17 A cross-sectional view of the positioning rod shown; Figure 19 This is a partial top view of the fixture tray and multiple substrates for testing integrated circuit substrates provided in the second preferred embodiment of the present invention. Figure 20 for Figure 19 A schematic sectional view along section line 20-20.

[0041] Explanation of reference numerals in the attached figures: 10: Test system; 11: Support platform; 12: Fixture tray; 122: Gap; 13: Probe device; 131: Probe holder; 132: Probe; 133: Connector; 134: Needle body; 135: Needle tip; 136: Bottom surface; 20: Carrier plate; 21: Upper surface; 22: Lower surface; 23: Test contact area; 24: Non-test contact area; 30: Base; 31: Body; 311: Upper surface; 32: Width axis guide; 321: Top surface; 322: Inner top surface; 33: Guide groove; 331: Guide part; 332: Receiving part; 40A: Positioning rod; 40B: Positioning rod; 40C: Positioning rod; 400: Body; 401: Bolt; 402: Nut; 403: Buffer strip; 41: First end; 42: Second end Two ends; 43: Body; 431: Side; 44: Perforation; 45: Top surface; 451: Edge; 452: Edge; 46: Bottom surface; 47: Main step; 47': Main step; 471: Clamping surface; 472: Bearing surface; 48: Secondary step; 481: Bearing surface; 49: Stop; 50: Length axial positioning device; 51: Length axial guide; 511: Guide groove; 512: Top surface; 513: Guide part; 514: Receiving part; 52: Length axial positioning part; 521: Bolt; 522: Nut; D: Vertical distance; G: Clearance; H1: First height; H2: Second height; H3: Third height; S1: Fixed state; S2: Sliding state; T: Thickness; W1: First width; W2: Second width Detailed Implementation The following description provides detailed examples and accompanying drawings, but these examples are not intended to limit the scope of this disclosure. For ease of understanding, in the embodiments and drawings described below, the same reference numerals denote the same or similar components or structural features thereof. It should be noted that the components and structures in the drawings are for illustrative purposes and are not drawn to scale or in quantity, and features of different embodiments may be used interchangeably if feasible. Furthermore, when it is stated that one element is disposed on another element, it means that the aforementioned element is directly disposed on the other element, or the aforementioned element is indirectly disposed on the other element; that is, one or more other elements are disposed between the two elements.

[0042] The terms “including,” “comprising,” and “having” used in this invention are all open-ended terms, meaning “including but not limited to.”

[0043] In the description of the various embodiments, when the terms "first," "second," "third," "fourth," etc. are used to describe elements, they are only used to distinguish these elements from each other and do not limit the order or importance of these elements.

[0044] Please refer to the following first. Figure 1 The first preferred embodiment of the present invention provides a test system 10 for testing integrated circuit substrates, including a stage 11, a fixture tray 12, and a probe device 13. The fixture tray 12 is detachably fixed to the stage 11. The fixing method is not directly related to the technical features of the present invention, therefore it is not described in detail here and is not shown in the drawings; the stage 11 is only schematically represented by a disc. The fixture tray 12 is used to hold multiple substrates 20 (described in detail below) for testing on the stage 11. The substrates 20 described in this invention are integrated circuit substrates, i.e., IC substrates.

[0045] Please see Figure 2 The probe device 13 includes a probe base 131, a probe 132 disposed on the probe base 131, and a connector 133. In this embodiment, the probe 132 is a high-frequency probe, including a body 134 and at least one tip 135 connected to the end of the body 134. The body 134 is made of a coaxial copper tube with a coaxial structure, including a copper core, an insulating layer, and an outer conductor layer (not shown) arranged coaxially from the inside out. Each tip 135 is a conductive sheet, typically two to five pieces, electrically connected to the copper core and outer conductor of the body 134. For example, two conductive sheets form a signal tip and a ground tip, used to contact the signal and ground contacts of the IC substrate. The connector 133 is used to connect a cable (not shown) so that the probe 132 can be electrically connected to a tester (not shown) via the cable.

[0046] At least one of the stage 11 and the probe assembly 13 is driven by a moving device (not shown). For example, the stage 11 is driven by the moving device (not shown) to move along the Z-axis, and the probe assembly 13 is driven by another moving device (not shown) to move along the X and Y axes, so that the tip 135 of the probe 132 contacts the contact point (not shown) on the upper surface 21 of the carrier plate 20. In this way, the carrier plate 20 can be electrically connected to the test equipment for testing. Please refer to [link to relevant documentation]. Figure 3 The lower surface 22 of the carrier plate 20 is also provided with contacts (not shown in the figure), and the test contact area 23 with contacts and the non-test contact area 24 without any contacts can be distinguished.

[0047] Please see Figures 4 to 6 In this embodiment, the jig plate 12 includes a base 30, a positioning rod 40A, a positioning rod 40B, and three positioning rods 40C. Positioning rods 40A and 40B can clamp the carrier plate 20 from only one side, while each positioning rod 40C can clamp the carrier plate 20 from both sides. Its structure will be described in detail below. Figure 6 As can be seen, each pair of adjacent positioning rods 40A, 40B, and 40C can clamp one carrier plate 20 or multiple carrier plates 20 arranged in a row along the Y-axis. Therefore, the fixture disk of the present invention only needs to include at least two positioning rods to achieve the function of clamping carrier plates.

[0048] Please see Figure 7 In this embodiment, the base 30 includes a rectangular plate-shaped body 31 and two long rod-shaped width axis guide members 32. The body 31 defines mutually perpendicular length axes (Y-axis), width axes (X-axis), and height axes (Z-axis). The width axis guide members 32 extend along the width axis and are respectively disposed on two edges of the body 31, thus the width axis guide members 32 are spaced apart to allow positioning rods 40A, 40B, and 40C to be positioned between the width axis guide members 32. Figure 8 As shown, the width axis guide member 32 is a guide rail, which can be made of aluminum or other machinable materials by extrusion molding. The width axis guide member 32 includes a guide groove 33 extending along the width axis. The guide groove 33 includes a guide portion 331 extending downward from the top surface 321 of the width axis guide member 32, and a receiving portion 332 extending downward from the guide portion 331, such that the guide groove 33 is inverted T-shaped in the YZ plane.

[0049] like Figure 4 and Figure 5As shown, each positioning rod 40A, 40B, and 40C includes a body 400, two bolts 401, and two nuts 402. The body 400 includes a first end 41, a second end 42, and an elongated body 43 extending between the first end 41 and the second end 42. The first end 41 and the second end 42 each have a through hole 44. Each positioning rod 40A, 40B, and 40C is disposed on the base 30 extending along the length axis (Y-axis). The first end 41 and the second end 42 are respectively disposed on the top surface 321 of the width axis guide member 32, and the body 43 is disposed on the upper surface 311 of the body 31. Bolts 401 of each positioning rod 40A, 40B, and 40C pass through through holes 44 in the first end 41 and the second end 42, respectively, and also pass through the guide portion 331 of the guide groove 33 of the width axial guide member 32. Nuts 402 of each positioning rod 40A, 40B, and 40C are non-rotatably disposed within the receiving portion 332 of the guide groove 33 of the width axial guide member 32, and are screwed to bolts 401. For example, square nuts can be used for nuts 402. In this way, each positioning rod 40A, 40B, and 40C can be in a fixed state S1 (e.g., Figure 9 (as shown) and the sliding state S2 (as shown) Figure 10 The conversion between the two is shown below. Taking the positioning rod 40C as an example, when the bolts 401 and nuts 402 at the first and second ends 41 and 42 of the positioning rod 40C are locked together, the nuts 402 are pressed against the inner top surface 322 of the width axis guide member 32 (located between the guide part 331 and the receiving part 332 of the guide groove 33). In this way, the positioning rod 40C is fixed to the width axis guide member 32, that is, it is in the fixed state S1. When the bolts 401 and nuts 402 at the first and second ends 41 and 42 of the positioning rod 40C are not locked together, the nuts 402 are away from the inner top surface 322 of the width axis guide member 32, and there is a gap G between the nuts 402 and the inner top surface 322. This puts the positioning rod 40C in the sliding state S2, which can be guided by the guide groove 33 of the width axis guide member 32 and slide along the width axis (X axis).

[0050] It should be noted that the positioning rods 40A, 40B, and 40C in this embodiment are designed to switch between a fixed state S1 and a sliding state S2. These positioning rods are also referred to as sliding positioning rods in this invention. However, the positioning rods included in the jig disc of this invention may only be partially sliding positioning rods; that is, some positioning rods may be fixed to the base 30 and not sliding. For example, positioning rod 40A in this embodiment may be modified to a non-sliding design, while positioning rods 40B and 40C remain sliding positioning rods. As long as at least one of the two positioning rods used to clamp the same carrier plate 20 or the same row of carrier plates 20 is a sliding positioning rod, the distance between the two positioning rods to be clamped can be adjusted according to the width of the carrier plate 20. Furthermore, as long as the jig disc 12 has at least three positioning rods, carrier plates 20 of different sizes can be clamped. For example, Figure 9 and Figure 10 The positioning rod 40C shown can, together with the positioning rod 40A on its right, clamp a single carrier plate 20 of any width or multiple carrier plates 20 arranged in a row along the length axis, and the positioning rod 40C can, together with another positioning rod 40C on its left (not shown), clamp a single carrier plate 20 of any width. Figure 9 and Figure 10 The positioning rod 40C can clamp a single carrier plate 20 of any width or multiple carrier plates 20 arranged in a row along its length axis. The carrier plates 20 clamped on the left and right sides of the positioning rod 40C can have different widths. Therefore, IC carrier plates of different widths can be simultaneously fixed on the fixture plate 12 for testing.

[0051] Please see Figure 11 and Figure 12The body 400 of the positioning rod 40A includes a top surface 45 and a bottom surface 46 facing two opposite directions along the height axis (i.e., the positive and negative directions of the Z-axis) and having long and short sides respectively. A main step 47 and a secondary step 48 form a stepped shape downwards from the top surface 45. The bottom surface 46 contacts the upper surface 311 of the body 31 of the base 30. The main step 47 forms a stepped shape downwards from the edge 451 (i.e., the edge of the long side of the top surface 45) along the parallel length axis (Y-axis) of the top surface 45, and the main step 47 extends further along the width axis (X-axis) to the side surface 431 of the body 43, so that the body 43 further forms two stops 49 connected to the first and second ends 41 and 42 respectively. In this embodiment, the body 43 has a U-shaped interconnected main staircase 47 and two stop portions 49. However, the present invention is not limited to this. For example, in addition to extending along the width axis (X-axis) to the side 431, the main staircase 47 can also extend along the length axis (Y-axis) to the first end 41 and the second end 42 respectively. In this way, the body 43 will have a straight main staircase 47 without the stop portions 49. Secondly, the main staircase 47 includes a clamping surface 471 adjacent to the top surface 45 and a bearing surface 472 adjacent to the clamping surface 471. The secondary staircase 48 forms a step shape downward from the bearing surface 472 of the main staircase 47 and has a bearing surface 481 extending to the side 431 of the body 43. The bearing surface 472 of the main staircase 47 and the bearing surface 481 of the secondary staircase 48 are both facing upward, that is, facing the positive Z-axis, which is facing the lower surface 22 of the carrier plate 20. In the height axis (Z-axis), the bearing surface 472 of the main step 47 is located between the top surface 45 of the positioning rod 40A and the bearing surface 481 of the secondary step 48, and the bearing surface 481 of the secondary step 48 is located between the bearing surface 472 of the main step 47 and the bottom surface 46 of the positioning rod 40A.

[0052] Please see Figures 13 to 15The positioning rod 40C includes a top surface 45 and a bottom surface 46 facing two opposite directions along the height axis (i.e., the positive and negative directions of the Z-axis), two main steps 47 and 47' forming a stepped shape downwards from the two opposite edges 451 and 452 of the top surface 45, and two secondary steps 48 forming a stepped shape downwards from the main steps 47 and 47'. The bottom surface 46 contacts the upper surface 311 of the body 31 of the base 30. Each main step 47 and 47' includes a clamping surface 471 adjacent to the top surface 45 and a bearing surface 472 adjacent to the clamping surface 471. Each secondary step 48 forms a stepped shape downwards from the bearing surface 472 of the main steps 47 and 47' and has a bearing surface 481. Therefore, it can be seen that the main steps 47 and 47' and the secondary steps 48 of the positioning rod 40C are similar to the main steps 47 and 48 of the positioning rod 40A. However, in addition to the body 400, bolt 401 and nut 402, the positioning rod 40C also includes a buffer strip 403 made of elastic buffer material (such as silicone or other elastic recovery material). The buffer strip 403 is embedded in the body 43 of the body 400, so that the body 400 and the buffer strip 403 together form the top surface 45 of the positioning rod 40C. The clamping surface 471 and the bearing surface 472 of the main step 47 are both part of the body 400, and the bearing surface 472 of the main step 47' is also part of the body 400, but the clamping surface 471 of the main step 47' is part of the buffer strip 403. In other words, the clamping surface 471 of the main step 47' is formed of elastic buffer material, thus having the effect of absorbing the manufacturing tolerance of the carrier plate, as detailed below.

[0053] Please see Figure 12 , Figure 15 and Figure 16 The clamping surface 471 of the main step 47 of the positioning rod 40A faces the clamping surface 471 of the main step 47' of the positioning rod 40C. The positions of the positioning rods 40A and 40C fixed on the base 30 are matched with the width of the carrier plate 20 they clamp, so that the carrier plate 20 is clamped and fixed by the clamping surfaces 471 of the main step 47 of the positioning rod 40A and the main step 47' of the positioning rod 40C. At this time, the non-test contact area 24 of the lower surface 22 of the carrier plate 20 (e.g., Figure 3 (As shown) rests on the bearing surface 472 of the main step 47 of the positioning rod 40A and the bearing surface 472 of the main step 47' of the positioning rod 40C, and there is a test contact area 23 between the positioning rods 40A and 40C extending along the length axis (Y-axis) and located on the lower surface 22 of the carrier plate 20 (as shown). Figure 3 The gap 122 between the base 30 and the (as shown) is as follows: Figure 16As shown, the aforementioned gap 122 will be formed between the two opposite sides 431 of the body 43 of the positioning rods 40A and 40C, the upper surface 311 of the body 31 of the base 30, and the imaginary plane formed by the bearing surfaces 472 of the positioning rods 40A and 40C (this imaginary plane coincides with the lower surface 22 of the carrier plate 20). More specifically, in the presence of the secondary step 48, this gap 122 will cover the space between the bearing surface 481 of the secondary step 48 and the aforementioned imaginary plane. When the carrier plate 20 rests on the bearing surface 472 of the main step 47 of the positioning rod 40A and the bearing surface 472 of the main step 47' of the positioning rod 40C, the aforementioned space corresponds to a portion of the test contact area 23 of the lower surface 22 of the carrier plate 20, thus preventing this portion of the test contact area 23 from directly contacting the bearing surface 481 of the secondary step 48.

[0054] Although a batch of carrier plates 20 of the same size are manufactured using the same process, there will still be manufacturing tolerances within the same batch of carrier plates 20, resulting in slight differences in width. Due to manufacturing tolerance factors, when the same batch of carrier plates 20 are placed on the main steps 47 and 47' of the positioning rods 40A and 40C, although the relative positions of the positioning rods 40A and 40C can be adjusted to fit the width of the carrier plate 20, if the clamping surfaces 471 of the main steps 47 and 47' are not elastic, some carrier plates 20 may still not be able to abut against the clamping surfaces 471 of the main steps 47 and 47'. As a result, when the fixture tray 12 is moved or the fixture tray 12 has been placed on the support table 11 for testing of the carrier plates 20, some carrier plates 20 may detach from between the positioning rods 40A and 40C, causing the carrier plates 20 to fail to be contacted by the tip 135 of the probe 132, resulting in unqualified test results. The present invention forms at least part of the clamping surface 471 by using an elastic buffer material, such that at least one of the two clamping surfaces 471 clamping the same carrier plate 20 is formed by an elastic buffer material, thereby achieving the effect of absorbing the carrier plate manufacturing tolerance, so that the carrier plates 20 with slightly different dimensions due to manufacturing tolerance can be firmly clamped. Figure 16 Although the clamping surface 471 of the main step 47 on the left side of the positioning rod 40C shown is not elastic, it is mated with the clamping surface 471 of the elastic main step 47' on the right side of another positioning rod 40C. When the two clamp the carrier plate 20 together, they can also achieve the effect of absorbing the manufacturing tolerance of the carrier plate.

[0055] Please see Figure 17 and Figure 18Positioning rod 40B is similar to positioning rod 40A, both of which can clamp the carrier plate on only one side. However, in addition to the body 400, bolt 401 and nut 402, positioning rod 40B also includes a buffer strip 403 made of elastic buffer material. The buffer strip 403 is embedded in the body 43 of the body 400, so that the body 400 and the buffer strip 403 together form the top surface 45 of positioning rod 40B. Positioning rod 40B has a stepped main step 47' that extends downward from the edge 452 formed by the buffer strip 403, and a stepped secondary step 48 that extends downward from the main step 47'. The main step 47' includes a clamping surface 471 adjacent to the top surface 45 and a bearing surface 472 adjacent to the clamping surface 471. The secondary step 48 extends downward from the bearing surface 472 of the main step 47' and has a bearing surface 481. In other words, the clamping surface 471 of the main step 47' of the positioning rod 40B is formed of an elastic buffer material, which has the function of absorbing the manufacturing tolerance of the carrier plate, and can clamp the carrier plate 20 together with the clamping surface 471 of the non-elastic main step 47 of the positioning rod 40C.

[0056] As can be seen from the foregoing, the jig disc 12 of the present invention can clamp carrier plates 20 of different sizes by adjusting the distance between two adjacent positioning rods 40A, 40B, and 40C, and the manufacturing tolerance of the carrier plate 20 can be absorbed by the clamping surface 471 formed by the elastic buffer material. Furthermore, when the carrier plate 20 is being tested, the tip 135 of the probe 132 will contact the contact point on the upper surface 21 and press the carrier plate 20. At this time, the bearing surface 472 of the main steps 47 and 47' of the positioning rods 40A, 40B, and 40C is supported on the non-test contact area 24 of the lower surface 22 of the carrier plate 20. There is a gap 122 between the test contact area 23 of the lower surface 22 of the carrier plate 20 and the base 30. Therefore, the contact point of the lower surface 22 of the carrier plate 20 will not contact the fixture plate 12 or the base 30 and be subject to electrical interference. Moreover, the bearing surface 472 of the main steps 47 and 47' of the positioning rods 40A, 40B, and 40C can provide appropriate force to support the carrier plate 20 so that the carrier plate 20 will not detach from the fixture plate 12.

[0057] Since the bearing surfaces 472 of the main steps 47 and 47' of the positioning rods 40A, 40B, and 40C can only contact the non-test contact area 24 of the lower surface 22 of the carrier plate 20, the width of the bearing surfaces 472 of the main steps 47 and 47' is very small. The carrier plate 20 may accidentally fall off the bearing surfaces 472 of the main steps 47 and 47'. At this time, the bearing surface 481 of the secondary step 48 will support the carrier plate 20 and prevent the carrier plate 20 from falling onto the base 30.

[0058] Furthermore, along the height axis (Z-axis), a first height H1 can be defined between the top surface 45 of each positioning rod 40A, 40B, and 40C and the bearing surface 472 of the main steps 47 and 47'; a second height H2 can be defined between the bearing surface 472 of the main steps 47 and 47' and the bearing surface 481 of the secondary step 48; and a third height H3 can be defined between the bearing surface 481 of the secondary step 48 and the bottom surface 46 of the positioning rods 40A, 40B, and 40C. A better design is that the third height H3 is greater than or equal to twice the sum of the first height H1 and the second height H2, that is, H3≧2(H1+H2). This will make the height of the receiving surface 481 of the secondary step 48 very close to the bearing surface 472, so that the drop height of the carrier plate 20 from the bearing surface 472 to the receiving surface 481 is very small. At this time, the return height of the carrier plate 20 to the bearing surface 472 is very small, which can reduce the risk of the adjacent carrier plate being touched during the return process and causing the adjacent carrier plate to fall as well. In addition, along the width axis (X-axis), each main staircase 47, 47' has a first width W1, and each secondary staircase 48 has a second width W2. The preferred design is that the second width W2 is greater than or equal to three times the first width W1, that is, W2≧3W1. This allows the secondary staircase 48 to effectively catch the carrier plate 20 falling from the main staircases 47, 47' and prevent the carrier plate 20 from falling from the secondary staircase 48.

[0059] On the other hand, during testing, the probe device 13 and the support stage 11 move relative to each other in the height axis and move closer to each other so that the tip 135 of the probe 132 (as shown in the image) is closer to the tip of the probe 132. Figure 2 (As shown) To avoid interference caused by the probe 132 contacting the positioning rod first during testing, which would prevent the tip 135 of the probe 132 from contacting the contact point on the upper surface 21 of the carrier plate 20, thus causing problems such as unsuccessful testing and probe damage, this invention proposes a preferred design to address this problem. Specifically, the first height H1 is preferably less than or equal to the thickness T of the carrier plate 20 (e.g., ...). Figure 16 (As shown). For example, through the design of H1≦T, Figure 16 When the positioning rods 40A and 40C clamp the carrier plate 20, the upper surface 21 of the carrier plate 20 is flush with or higher than the top surface 45 of the positioning rods 40A and 40C. In other words, the upper surface 21 of the carrier plate 20 is not lower than the top surface 45 of the positioning rods 40A and 40C. This effectively avoids the aforementioned interference problem between the probe and the positioning rods. Furthermore, a vertical distance D can be defined along the height axis between the tip 135 of the probe 132 and the bottom surface 136 of the probe base 131 (e.g., ...). Figure 2 As shown), the first height H1 is preferably less than half of the vertical distance D, which can effectively prevent the probe 132 from colliding with the fixture disk 12 or the carrier plate 20, thereby avoiding damage to the probe 132 or the carrier plate 20 that may be caused by the collision.

[0060] Please see Figure 19 and Figure 20 The second preferred embodiment of the present invention is similar to the first preferred embodiment, and the fixture plate in this embodiment further includes a length axial positioning device 50. This embodiment is only described by taking the example of setting the length axial positioning device 50 between the positioning rod 40A and its adjacent positioning rod 40C. The length axial positioning device 50 can also be set between other positioning rods.

[0061] The length axial positioning device 50 in this embodiment includes a length axial guide member 51 and a length axial positioning member 52. The length axial guide member 51 is similar to the aforementioned width axial guide member 32, except that the length axial guide member 51 is fixed to the upper surface 311 of the base 30 along the length axial direction (Y-axis). The length axial guide member 51 includes a guide groove 511 extending along the length axial direction. The guide groove 511 includes a guide portion 513 extending downward from the top surface 512 of the length axial guide member 51, and a receiving portion 514 extending downward from the guide portion 513, such that the guide groove 511 is inverted T-shaped in the XZ plane. The length axial positioning member 52 includes a bolt 521 and a nut 522. The bolt 521 passes through the guide portion 513 of the guide groove 511, and the nut 522 is disposed in the receiving portion 514 of the guide groove 511 and screwed to the bolt 521. In this way, bolt 521 and nut 522 can be locked together and fixed to the length axis guide member 51, while bolt 521 and nut 522 can slide together along the guide groove 511 when they are not locked together. In other words, the length axis positioning member 52 can be adjusted in position along the length axis by being guided by the length axis guide member 51, so as to abut against the carrier plate 20 between the first end 41 and the second end 42 of the positioning rods 40A and 40C.

[0062] In detail, when placing a single or multiple carrier plates 20 arranged in a row onto the main steps 47 and 47' of the positioning rods 40A and 40C, the carrier plate 20 can be brought closer to the first end 41 of the positioning rods 40A and 40C. This allows the carrier plate 20 closest to the first end 41 among the single carrier plate 20 or multiple carrier plates 20 arranged in a row to be stopped by the stop portion 49 connected to the first end 41 on the negative Y-axis side, while the carrier plate 20 furthest from the first end 41 among the single carrier plate 20 or multiple carrier plates 20 arranged in a row can be abutted by the length axial positioning member 52 on the positive Y-axis side. In this way, a single or multiple carrier plates 20 arranged in a row are not only clamped in the width axis by the clamping surfaces 471 of the main steps 47 and 47' of the positioning rods 40A and 40C, but also in the length axis by the stop portions 49 of 40A and 40C and the length axis positioning member 52. This more securely fixes the carrier plate 20 to the fixture tray 12, preventing the carrier plate 20 from moving along the length axis. Even when the fixture tray 12 is being moved or placed on the support platform 11 for testing, the carrier plate 20 may still slightly slip along the length axis, causing it to fail to be contacted by the tip 135 of the probe 132, resulting in unqualified test results. This invention, by using the length axis positioning member 52 in conjunction with the stop portion 49 of the positioning rod to position the carrier plate 20 in the length axis, avoids the problem of carrier plate slippage.

[0063] The length axial positioning element in this invention is not limited to that provided in this embodiment. For example, the length axial positioning element can be a magnet. In this case, the body 31 of the base 30 can be made of a magnetically conductive material, such as iron, so that the magnet can be attracted and fixed to the body 31 of the base 30. In addition, the width axial guiding element 32 of the base 30 in this invention is not limited to the guide rail as described in the first preferred embodiment. For example, the width axial guiding element 32 can be a guide rod, and the first end 41 and the second end 42 of the slidable positioning rod have a structure that can be sleeved on the guide rod and clamped and fixed to the guide rod. That is, the first end 41 and the second end 42 are provided with through holes extending along the width axial direction to be sleeved on the guide rod, and the first end 41 and the second end 42 are respectively provided with clamping elements that can clamp in the direction of the through holes or release clamping in the opposite direction. For example, the clamping elements can be roller clamping, pneumatic clamping, elastic clamping, etc. When the clamping members located at the first end 41 and the second end 42 release their clamping action, they will loosen their clamping effect on the first and second ends 41, 42 and the guide rod. At this time, the positioning rod is in a sliding state and its position can be adjusted to fit the width of the carrier plate 20. After the adjustment is completed, the clamping action of the clamping members can be reactivated to fix the positioning rod in a fixed state.

[0064] Finally, it must be stated again that the embodiments disclosed in this invention are merely illustrative examples and are not intended to limit the scope of this case. Substitutions or variations of other equivalent elements should also be covered by the patent protection scope of this case.

Claims

1. A fixture tray for testing integrated circuit substrates, used to hold the substrate, the substrate including an upper surface and a lower surface, the lower surface including a test contact area and a non-test contact area; characterized in that: The fixture tray includes: The base can define mutually perpendicular length, width, and height axes; and Two positioning rods are provided on the base, each extending along the length axis. At least one of the two positioning rods is a slidable positioning rod, which can switch between a slidable state and a fixed state. When the slidable positioning rod is in the slidable state, it can slide relative to the base along the width axis to adapt to the width of the carrier plate. When the slidable positioning rod is in the fixed state, it is fixed to the base so that the carrier plate is clamped and fixed by the two positioning rods. Each positioning rod includes a top surface and a bottom surface facing two opposite directions along the height axis, and a stepped main step forming downwards from the edge of the top surface. The main step includes a clamping surface adjacent to the top surface and a bearing surface adjacent to the clamping surface. The clamping surfaces of the main steps of the two positioning rods face each other, and at least one of them is formed of an elastic cushioning material. The two positioning rods are configured such that the clamping surfaces of the main steps of the two positioning rods can be used to jointly clamp the carrier plate, and the bearing surfaces of the main steps of the two positioning rods can be used to jointly support the non-test contact area of ​​the lower surface of the carrier plate, so that there is a gap between the two positioning rods and the test contact area extending along the length axis and located on the lower surface of the carrier plate and the base.

2. The fixture tray for testing integrated circuit carrier boards according to claim 1, characterized in that: Each of the positioning rods further includes a stepped secondary step forming downwards from the bearing surface of the main step, the secondary step including an upward-facing receiving surface; in the height axis, the bearing surface of the main step is located between the top surface of the positioning rod and the receiving surface of the secondary step, the receiving surface of the secondary step is located between the bearing surface of the main step and the bottom surface of the positioning rod, a first height can be defined between the top surface of the positioning rod and the bearing surface of the main step, a second height can be defined between the bearing surface of the main step and the receiving surface of the secondary step, and a third height can be defined between the receiving surface of the secondary step and the bottom surface of the positioning rod, the third height being greater than or equal to twice the sum of the first height and the second height.

3. The fixture tray for testing integrated circuit carrier boards according to claim 2, characterized in that: Along the width axis, the main step has a first width, and the secondary step has a second width, the second width being greater than or equal to three times the first width.

4. The fixture tray for testing integrated circuit carrier boards according to claim 2, characterized in that: The first height is less than or equal to the thickness of the carrier plate.

5. The fixture tray for testing integrated circuit carrier boards according to claim 1, characterized in that: The base includes a body and two width axis guide members. The two width axis guide members are spaced apart and extended along the width axis of the body. The slidable positioning rod includes a first end and a second end, which are respectively disposed on the two width axis guide members. When the slidable positioning rod is in the slidable state, it slides along the width axis by being guided by the two width axis guide members.

6. The fixture tray for testing integrated circuit carrier boards according to claim 5, characterized in that: Each of the width-axis guide members includes a guide groove extending along the width axis. The guide groove includes a guide portion and a receiving portion. The first end and the second end of the slidable positioning rod each have a through hole. The first end and the second end are respectively provided with a bolt passing through the through hole and a nut screwed to the bolt. The bolt passes through the guide portion of the guide groove. The nut is disposed in the receiving portion of the guide groove and can be locked with the bolt to fix the slidable positioning rod to the width-axis guide member.

7. The fixture tray for testing integrated circuit carrier boards according to claim 1, characterized in that: When the carrier plate is clamped and fixed by the two positioning rods, the upper surface of the carrier plate is flush with or higher than the top surface of the two positioning rods.

8. The fixture tray for testing integrated circuit carrier boards according to claim 1, characterized in that: Each of the positioning rods includes a first end, a second end, and a stop portion connected to the first end, for the carrier plate to be stopped by the stop portions of the two positioning rods; the fixture disk also includes a length axial positioning member disposed between the two positioning rods, the length axial positioning member being adjustable in position along the length axial direction, for abutting the carrier plate between the first end and the second end of the two positioning rods.

9. The fixture tray for testing integrated circuit carrier boards according to claim 8, characterized in that: The fixture disk further includes a length axis guide member disposed between the two positioning rods. The length axis guide member includes a guide groove extending along the length axis. The guide groove includes a guide portion and a receiving portion. The length axis positioning member includes a bolt and a nut screwed onto the bolt. The bolt passes through the guide portion of the guide groove. The nut is disposed in the receiving portion of the guide groove and can be locked with the bolt to be fixed to the length axis guide member.

10. The fixture tray for testing integrated circuit carrier boards according to claim 1, characterized in that: At least one of the two positioning rods includes another main step that forms a stepped shape downward from the other edge of the top surface, and at least one of the clamping surfaces of the two main steps included in the positioning rod is formed of the elastic cushioning material.

11. A test system for testing integrated circuit substrates, used for testing substrates; characterized in that: The testing system includes: Support platform; According to claim 1, the jig tray is disposed on the support platform for clamping the carrier plate; and The probe device includes a probe holder and a probe disposed on the probe holder for testing the carrier plate held by the fixture disk.

12. The test system for testing integrated circuit substrates according to claim 11, characterized in that: Each positioning rod of the fixture plate further includes a stepped sub-step forming downwards from the bearing surface of the main step, the sub-step including an upward-facing bearing surface; in the height axis, the bearing surface of the main step is located between the top surface of the positioning rod and the bearing surface of the sub-step; the height defined along the height axis between the top surface of each positioning rod and the bearing surface of the main step is less than or equal to the thickness of the carrier plate.

13. The test system for testing integrated circuit substrates according to claim 11, characterized in that: A vertical distance can be defined between the tip of the probe and the bottom surface of the probe holder along the height axis, and the height defined between the top surface of each positioning rod and the bearing surface of the main step along the height axis is less than half of the vertical distance.

14. A positioning rod for testing integrated circuit substrates, capable of defining mutually perpendicular length axes, width axes, and height axes, wherein the positioning rod extends elongated along the length axis, characterized in that: The positioning rod includes a top surface and a bottom surface facing two opposite directions of the height axis, and two main steps forming a stepped shape from two opposite edges of the top surface. Each main step includes a clamping surface adjacent to the top surface and a bearing surface adjacent to the clamping surface. The clamping surface of each main step is used to clamp the carrier plate together with another positioning rod. At least one of the clamping surfaces of the two main steps is formed of an elastic cushioning material.

15. The positioning rod for testing integrated circuit carrier boards according to claim 14, characterized in that: The positioning rod also includes two secondary steps forming a stepped shape downwards from the bearing surfaces of the two main steps, each secondary step including an upward-facing bearing surface; in the height axis, the bearing surface of each main step is located between the top surface of the positioning rod and the bearing surface of each secondary step, and the bearing surface of each secondary step is located between the bearing surface of each main step and the bottom surface of the positioning rod. A first height can be defined between the top surface of the positioning rod and the bearing surface of each main step, a second height can be defined between the bearing surface of each main step and the bearing surface of each secondary step, and a third height can be defined between the bearing surface of each secondary step and the bottom surface of the positioning rod. The third height is greater than or equal to twice the sum of the first height and the second height.

16. The positioning rod for testing integrated circuit carrier boards according to claim 15, characterized in that: Along the width axis, each of the main steps has a first width, and each of the sub-steps has a second width, the second width being greater than or equal to three times the first width.

17. The positioning rod for testing integrated circuit carrier boards according to claim 15, characterized in that: The first height is less than or equal to the thickness of the carrier plate.

Images