Control method and dual-node server

Abstract

The invention discloses a control method and a dual-node server, and the control method is applied to the dual-node server, and comprises the steps: determining a first control parameter through a substrate management controller of a main node, and obtaining a second control parameter determined by a standby node; wherein the substrate management controller of the main node is in communication connection with the substrate management controller of the standby node through a communication bus; performing weight calculation on the first control parameter and the second control parameter to obtain a third control parameter; and based on the third control parameter, controlling a heat dissipation device to operate so as to dissipate heat of the main node and / or the standby node.

Description

Technical Field

[0001] This application relates to the field of heat dissipation control technology, and in particular to a control method and a dual-node server. Background Technology

[0002] In the era of intelligentization, business continuity and complexity are increasing, leading to higher demands for zero business interruption, zero data loss, and the construction of complete fault-tolerant systems. Consequently, dual-node servers, characterized by reliability, availability, and flexible scalability, are gaining popularity. For servers, thermal management is a critical aspect of their management and operation. In a dual-node storage server, two physical nodes are integrated within a single server chassis. Each node has independent hardware resources such as CPU, memory, network interface card (NIC), and storage. However, they are typically designed to share a single thermal management system, meaning that the temperature of components in both nodes affects the overall system's cooling performance.

[0003] Currently, the solution for cooling a server with two physical nodes involves adding an adapter board between the two physical nodes and the fan. Custom cables connect the two physical nodes and the fan to the adapter board, where the two physical nodes send fan control parameters. The processor on the adapter board then controls the fan based on these parameters for cooling. However, this solution increases hardware costs (such as the adapter board and custom cables), thereby increasing the complexity of the server structure and subsequent maintenance costs. Summary of the Invention

[0004] The purpose of this application is to provide a control method and a dual-node server.

[0005] In a first aspect, embodiments of this application provide a control method applied to a dual-node server, the control method comprising: The master node's baseboard management controller determines a first control parameter and obtains a second control parameter determined by the backup node; wherein the master node's baseboard management controller and the backup node's baseboard management controller are connected via a communication bus. The weights of the first and second control parameters are calculated to obtain the third control parameter; Based on the third control parameter, the heat dissipation device is controlled to operate in order to dissipate heat from the master node and / or the backup node.

[0006] In one possible implementation, the dual-node server is provided with two slots for connecting nodes; The control method further includes: If nodes are connected to both slots, obtain the running status of each node; If both nodes are running normally, the node connected to the target slot is determined to be the master node; If the node connected to the target slot is in an abnormal running state, and the node not connected to the target slot is in a normal running state, then the node not connected to the target slot is determined to be the master node.

[0007] In one possible implementation, the control method further includes: If the operating status of the master node in the target slot changes from normal to abnormal, the backup node is updated to the master node.

[0008] In one possible implementation, the control method further includes: If only one slot has a node connected to it, that node is determined to be the master node.

[0009] In one possible implementation, where a node is connected to a slot, the control method includes: The first control parameter is determined by the baseboard management controller of the master node; Based on the first control parameter, the heat dissipation device is controlled to operate in order to dissipate heat from the master node.

[0010] In one possible implementation, where a node is connected to a slot, the control method includes: Check if a node is connected in another slot; If so, the primary node is re-determined from the two nodes.

[0011] In one possible implementation, the control method further includes: Acquire temperature values ​​collected by multiple temperature sensors; The preset algorithm is used to calculate the temperature value, the attribute parameters of the acquisition device corresponding to each temperature sensor and the heat dissipation device to obtain the first control parameter or the second control parameter; wherein the preset algorithm includes at least a proportional-integral-derivative control algorithm.

[0012] In one possible implementation, the step of weighting the first and second control parameters to obtain the third control parameter includes: For each heat dissipation device, the weights of the first and second control parameters are calculated to obtain a third control parameter for controlling the heat dissipation device.

[0013] In one possible implementation, When the dual-node server is in the power-on self-test process, the node's baseboard management controller controls the operation of the heat dissipation device based on preset control parameters and the coefficients corresponding to the preset control parameters. The coefficients corresponding to the preset control parameters differ depending on the number of nodes.

[0014] Secondly, this application embodiment also provides a dual-node server, configured with two nodes and multiple heat dissipation devices, wherein the baseboard management controllers of the two nodes are connected to each other via a communication bus; The master node of the two nodes determines the first control parameter through its baseboard management controller; The backup node of the two nodes determines the second control parameter through its baseboard management controller; and transmits the second control parameter to the master node according to the communication protocol. The master node performs weight calculations on the first and second control parameters to obtain the third control parameter; Based on the third control parameter, the heat dissipation device is controlled to operate in order to dissipate heat from the master node and / or the backup node. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 A flowchart of a control method provided in this application is shown; Figure 2 A schematic diagram of a two-node server structure is shown; Figure 3 This application provides a flowchart for determining a first control parameter or a second control parameter. Figure 4 This application provides a schematic diagram of the structure of a dual-node server. Figure 5 A schematic diagram of the structure of a node device provided in this application is shown. Detailed Implementation

[0017] Various embodiments and features of this application are described herein with reference to the accompanying drawings.

[0018] It should be understood that various modifications can be made to the embodiments described herein. Therefore, the above description should not be considered as limiting, but merely as an example of embodiments. Other modifications within the scope and spirit of this application will be apparent to those skilled in the art.

[0019] The accompanying drawings, which are included in and form part of this specification, illustrate embodiments of the present application and, together with the general description of the present application given above and the detailed description of the embodiments given below, serve to explain the principles of the present application.

[0020] These and other features of this application will become apparent from the following description of preferred forms of embodiments given as non-limiting examples, with reference to the accompanying drawings.

[0021] It should also be understood that although this application has been described with reference to some specific examples, those skilled in the art can certainly implement many other equivalent forms of this application, which have the features described in the claims and are therefore all within the scope of protection defined herein.

[0022] The above and other aspects, features and advantages of this application will become more apparent when taken in conjunction with the accompanying drawings and in view of the following detailed description.

[0023] Specific embodiments of this application are described thereafter with reference to the accompanying drawings; however, it should be understood that the claimed embodiments are merely examples of this application, which can be implemented in various ways. Well-known and / or repeated functions and structures are not described in detail to avoid unnecessary or redundant details that could obscure the application. Therefore, the specific structural and functional details claimed herein are not intended to be limiting, but merely serve as the basis and representative basis for the claims to teach those skilled in the art to use this application in a variety of substantially any suitable detailed structures.

[0024] This specification may use the phrases “in one embodiment,” “in another embodiment,” “in yet another embodiment,” or “in other embodiments,” all of which may refer to one or more of the same or different embodiments according to this application.

[0025] Compared to existing technologies that require additional adapter boards and corresponding custom cables, the control method of this application can achieve flexible heat dissipation control without introducing additional overhead. In other words, this application will not increase the hardware cost of the dual-node server, the manufacturing cost is low, the server structure is simple, and no additional operations are required during the manufacturing process, thus ensuring the manufacturing efficiency of the server; and it will not increase subsequent maintenance costs.

[0026] To facilitate understanding of this application, a control method provided in this application will be described in detail below.

[0027] As an example, Figure 1 A flowchart of the control method provided in the embodiments of this application is shown, wherein the specific steps include S101-S103.

[0028] S101, the first control parameters are determined by the baseboard management controller of the master node, and the second control parameters determined by the backup node are obtained; wherein, the baseboard management controller of the master node and the baseboard management controller of the backup node are connected to communicate via a communication bus.

[0029] The control method of this application embodiment is applied to a dual-node server. As an example, Figure 2 A schematic diagram of a two-node server structure is shown, with reference to... Figure 2 As can be seen, the dual-node server includes node A and node B, both of which are configured with a Baseboard Management Controller (BMC). Node A is configured as BMC1, and node B as BMC2. BMC1 and BMC2 are connected via a communication bus such as I2C (Inter-Integrated Circuit). (Continue referring to...) Figure 2 Node A and Node B are also connected to heat dissipation devices such as fans to control the operation of the heat dissipation devices; Node A and Node B are also connected to temperature sensors. It is worth noting that the temperature sensors connected to Node A and Node B can be completely different, or they can have some of the same temperature sensors.

[0030] In practical applications, a dual-node server chassis has two slots for connecting nodes. Nodes A and B can be connected to these slots to enable the dual-node server's functions. Correspondingly, there are cases where a slot is connected to a node and cases where a slot is not connected to a node. For example, both slots may be connected to nodes, or one slot may be connected to a node while the other is not.

[0031] Each node's BMC can detect whether it is connected to a card slot. After connecting to a card slot, it can further detect whether a node is connected to the other card slot. Based on this, the BMC of either of the two nodes can detect whether nodes are connected to both slots of the dual-node server. If nodes are connected to both slots, the operating status of each node can be obtained.

[0032] If both nodes are running normally, the node connected to the target slot is determined to be the master node. The two slots have different identifiers, and the target slot is pre-set. For example, the two slots are identified by the numbers 10 and 01, and the slot with identifier 10 is set as the target slot. That is, the node connected to the slot with identifier 10 is the master node.

[0033] Another example is the possibility of nodes encountering anomalies upon initial connection to the slot, such as node incompatibility or differing communication protocols. Therefore, when nodes are connected to both slots, if the node connected to the target slot is in an abnormal operating state, while the node not connected to the target slot is operating normally, the node not connected to the target slot is designated as the master node to ensure the dual-node server can function properly.

[0034] As another example, during the operation of a dual-node server, there are situations where the node's operating status changes from normal to abnormal, such as a sudden BMC failure or poor contact between the node and the slot due to external force. Based on this, the operating status of each node in the slot can be monitored in real-time or periodically, that is, the operating status of the primary and backup nodes can be monitored in real-time or periodically. During the monitoring process, if the operating status of the primary node in the target slot changes from normal to abnormal, the backup node is updated to the primary node.

[0035] Of course, if only one slot has a node connected, then that node is directly designated as the master node.

[0036] When a node is connected to a slot, there is a possibility of adding nodes midway. Therefore, the master node connected to a slot can check in real-time or periodically whether a node is connected to another slot. Furthermore, after detecting a connected node in another slot, the master node is re-determined from the two nodes using the method described above.

[0037] In this embodiment, the baseboard management controllers of the two nodes are connected via I2C communication and the master node is determined according to the above strategy so as to control the operation of the heat dissipation device through the master node, thereby ensuring that the dual-node server can dissipate heat normally.

[0038] After determining the master node, the baseboard management controller of the master node determines the first control parameters and obtains the second control parameters determined by the backup node. Both the first and second control parameters include the rotational speed and power of each heat dissipation device, or each heat dissipation device may have a corresponding first and second control parameters; this embodiment does not limit this.

[0039] In this embodiment, the baseboard management controller of the master node and the baseboard management controller of the backup node are connected via I2C communication. That is, after the baseboard management controller of the backup node determines the second control parameter, it transmits the second control parameter to the master node according to the I2C communication protocol, so that the master node obtains the second control parameter.

[0040] As an example, Table 1 below shows the data format defined by the communication protocol in this embodiment of the application. Correspondingly, the backup node packages the second control parameters according to the data format and transmits the resulting data packet to the master node. After receiving the data packet, the master node parses the data packet according to the data format to obtain the second control parameters.

[0041]

[0042] Table 1 S102, calculate the weights of the first and second control parameters to obtain the third control parameter.

[0043] After determining the first control parameter and obtaining the second control parameter, the master node reads the pre-set weight values ​​and calculation rules, performs weight calculations on the first and second control parameters, and obtains the third control parameter. The weight values ​​and calculation rules can be stored on the master node and / or the backup node.

[0044] For example, a dual-node server can be configured with multiple cooling devices, which can be fans. Optionally, each cooling device can also have a unique identifier, such as cooling device A, cooling device B, etc.

[0045] When calculating the weights of the first and second control parameters to obtain the third control parameter, the calculation is performed separately for each heat dissipation device. That is, for each heat dissipation device, the weights of the first and second control parameters of the heat dissipation device are calculated to obtain the third control parameter used to control the heat dissipation device.

[0046] As an example, the weights of the first and second control parameters can be calculated according to the following formula (1) to obtain the third control parameter.

[0047] (1) in, This represents the third control parameter of the heat dissipation device n. This represents the first control parameter of the heat dissipation device n. This represents the second control parameter of the heat dissipation device n. This indicates the weighted ratio of parameters.

[0048] S103 controls the operation of the heat dissipation device based on the third control parameter to dissipate heat from the primary node and / or backup node.

[0049] After obtaining the third control parameter, the heat dissipation device is controlled to operate according to the third control parameter in order to dissipate heat in the heat dissipation area or heat-generating device corresponding to the heat dissipation device, that is, to dissipate heat in the main node and / or backup node.

[0050] In another example, when one node is connected to a slot, the first control parameter is determined directly through the baseboard management controller of the main node, and the heat dissipation device is controlled to operate directly based on the first control parameter to dissipate heat from the main node. When two nodes are connected to the slot, at least one of the main node and the backup node can be cooled, for example, the main node can be cooled separately, the backup node can be cooled separately, or both the main node and the backup node can be cooled simultaneously.

[0051] This application embodiment controls the heat dissipation device through any node in the dual-node server to achieve the purpose of heat dissipation. It does not introduce additional overhead, and the control is simple and flexible. It does not increase the hardware cost of the dual-node server and the manufacturing cost is low. In addition, the server structure is simple and no additional operations are required in the manufacturing process, thereby ensuring the manufacturing efficiency of the server and ensuring low subsequent maintenance costs.

[0052] This application also provides steps for determining a first control parameter or a second control parameter, as detailed in the embodiments below. Figure 3 The flowchart shown includes S301 and S302.

[0053] S301 acquires temperature values ​​collected by multiple temperature sensors.

[0054] S302 calculates the temperature value, the attribute parameters of the acquisition device corresponding to each temperature sensor, and the heat dissipation device through a preset algorithm to obtain the first control parameter or the second control parameter; wherein the preset algorithm includes at least a proportional-integral-derivative control algorithm.

[0055] Next, we will take the determination of the first control parameter by the master node as an example for explanation.

[0056] The master node acquires temperature values ​​from the temperature sensors connected to it. Optionally, to more accurately detect the temperature of the entire dual-node server or individual master and backup nodes, multiple temperature sensors are configured for each node. Each temperature sensor corresponds to a temperature acquisition area, and the temperature value acquired by the sensor characterizes the temperature of its corresponding acquisition area. Different temperature sensors may have overlapping acquisition areas. As another example, each temperature sensor corresponds to one or more heating devices; that is, the temperature value acquired by the sensor characterizes the temperature of its corresponding heating device. Similarly, different temperature sensors may correspond to the same heating device, which to a certain extent ensures that the acquired temperature information of the heating device is relatively accurate.

[0057] While acquiring temperature values ​​from multiple temperature sensors, the master node further determines the parameter correspondence between each temperature sensor and each heat dissipation device, such as the correspondence between the temperature value of the temperature sensor and the rotational speed of the heat dissipation device. This parameter correspondence between the temperature sensors and the heat dissipation devices is pre-built and stored in the master node, and it conforms to the operating requirements of the heat dissipation devices and the heat dissipation requirements of the heat-generating components.

[0058] The temperature sensor starts operating simultaneously with the dual-node server startup to collect temperature values ​​from its corresponding temperature acquisition area or the temperature values ​​of its corresponding heat-generating devices. Correspondingly, a PWM signal is already present during dual-node server startup to control the heat dissipation device to operate according to the PWM signal and perform heat dissipation.

[0059] Based on the above, for each temperature sensor, the corresponding deviation is calculated according to the following formula (2).

[0060] (2) in, This represents the deviation at time t when the sampling interval is T. This represents the temperature value collected by the temperature sensor at time t. This indicates the upper limit of the temperature range that the temperature sensor is preset to allow for dynamic oscillation. This indicates the lower limit of the temperature that the temperature sensor is preset to allow for dynamic oscillation.

[0061] Furthermore, based on the deviation, the proportional (P), integral (I), and derivative (D) of the deviation are linearly combined to form an adjustment quantity to control the heat dissipation device, specifically by adjusting the PWM signal corresponding to the heat dissipation device. As an example, this application embodiment uses an incremental proportional-integral-derivative (PID) algorithm for discretization, wherein the basic discrete representation of the PID algorithm is as shown in formula (3), and the incremental PID algorithm representation can be derived from it as shown in formula (4).

[0062] (3) (4) in, This indicates the adjustment parameters for the PWM signal; This represents the proportional parameter, used in the deviation signal generated by the proportional control system. ; This represents the integral parameter, used to eliminate steady-state error. It adds the accumulated error of the system deviation to the original system to offset the steady-state error caused by the system. The differential parameter is used to characterize the deviation signal. The changing pattern, based on the deviation signal To increase system responsiveness, we can make proactive adjustments based on the changing patterns of the system. , as well as This represents the deviation obtained from three consecutive samples, where each sample corresponds to one deviation.

[0063] in, as well as It is determined based on the parameter correspondence between the temperature sensor and the heat dissipation device.

[0064] By using the discrete calculation of the incremental PID algorithm described above, errors caused by multiple oscillations in the cooling regulation of a dual-node server can be effectively avoided, thus enabling the cooling device of the dual-node server to achieve stability more accurately and efficiently. Furthermore, through formula (4), the adjustment parameters required for multiple oscillations of the dual-node server can be obtained in real time. Then, a more accurate PWM signal is calculated using the following formula (5).

[0065] (5) in, This represents the PWM signal that is currently oscillating and feeding back. This represents the PWM signal from the previous oscillation feedback; This represents the adjustment parameter. The adjustment parameter is used to adjust the duty cycle of the PWM signal.

[0066] The backup node determines the second control parameter in the same way as the master node determines the first control parameter, so we will not go into details here.

[0067] In this embodiment, the BMC of both physical nodes, namely the master node and the backup node, introduces an incremental PID algorithm, which enables each node to determine the control parameters of each heat dissipation device. Then, the control parameters of the two nodes are weighted and calculated to obtain the final control parameters, which effectively achieves precise adjustment of the heat dissipation device and thus achieves a balanced and stable heat dissipation effect. At the same time, it avoids the heat dissipation instability caused by multiple oscillations caused by real-time changes in the temperature sensor.

[0068] As another example, for the power-on self-test process of a dual-node server, heat dissipation can be carried out in the following manner: During the power-on self-test process of the dual-node server, the node's baseboard management controller controls the operation of the heat dissipation device based on preset control parameters and corresponding coefficients. The preset control parameters include a PWM signal, and the coefficients are used to adjust the duty cycle of the PWM signal.

[0069] Considering that there may be one node connected to a slot, or two nodes connected to a slot, meaning a dual-node server may include one node or two nodes, the coefficients of the preset control parameters differ depending on the number of nodes included in the dual-node server in this embodiment. For example, when the number of nodes connected to a slot is 1 (i.e., the dual-node server includes one node), the coefficient of the preset control parameter is set to 0.5; when the number of nodes connected to a slot is 2 (i.e., the dual-node server includes two nodes), the coefficient of the preset control parameter is set to 0.7. Therefore, more reasonable actual control parameters can be set for different numbers of nodes to control the operation of the heat dissipation device, achieving the purpose of heat dissipation while avoiding waste of operating resources.

[0070] This application also provides a dual-node server. Figure 4 This application shows a schematic diagram of the structure of a dual-node server according to an embodiment of the present application. Figure 4 It can be seen that the dual-node server is configured with two nodes and multiple heat dissipation devices, and the baseboard management controllers of the two nodes are connected to each other via a communication bus. The master node of the two nodes determines the first control parameter through its baseboard management controller; The backup node of the two nodes determines the second control parameter through its baseboard management controller; and transmits the second control parameter to the master node according to the communication protocol. The master node performs weight calculations on the first and second control parameters to obtain the third control parameter; Based on the third control parameter, the heat dissipation device is controlled to operate in order to dissipate heat from the master node and / or the backup node.

[0071] As another example, the dual-node server is provided with two slots for connecting nodes; If nodes are connected to both slots, obtain the running status of each node; If both nodes are running normally, the node connected to the target slot is determined to be the master node; If the node connected to the target slot is in an abnormal running state, and the node not connected to the target slot is in a normal running state, then the node not connected to the target slot is determined to be the master node. Another example, If the operating status of the master node in the target slot changes from normal to abnormal, the backup node is updated to the master node.

[0072] Another example, If only one slot has a node connected to it, that node is determined to be the master node.

[0073] Another example, When a node is connected to a slot, the first control parameter is determined by the baseboard management controller of the main node; Based on the first control parameter, the heat dissipation device is controlled to operate in order to dissipate heat from the master node.

[0074] Another example, If a node is connected to one slot, check if a node is connected to another slot. If so, the primary node is re-determined from the two nodes.

[0075] Another example, Acquire temperature values ​​collected by multiple temperature sensors; The preset algorithm is used to calculate the temperature value, the attribute parameters of the acquisition device corresponding to each temperature sensor and the heat dissipation device to obtain the first control parameter or the second control parameter; wherein the preset algorithm includes at least a proportional-integral-derivative control algorithm.

[0076] In another example, the weighting calculation of the first and second control parameters to obtain the third control parameter includes: For each heat dissipation device, the weights of the first and second control parameters are calculated to obtain a third control parameter for controlling the heat dissipation device.

[0077] Another example, When the dual-node server is in the power-on self-test process, the node's baseboard management controller controls the operation of the heat dissipation device based on preset control parameters and the coefficients corresponding to the preset control parameters. The coefficients corresponding to the preset control parameters differ depending on the number of nodes.

[0078] This application embodiment controls the heat dissipation device through any node in the dual-node server to achieve the purpose of heat dissipation. It does not introduce additional overhead, and the control is simple and flexible. It does not increase the hardware cost of the dual-node server and the manufacturing cost is low. In addition, the server structure is simple and no additional operations are required in the manufacturing process, thereby ensuring the manufacturing efficiency of the server and ensuring low subsequent maintenance costs.

[0079] A third aspect of this application also provides a node device, the structural schematic of which can be shown as follows: Figure 5 As shown, it includes at least a memory 501 and a processor 502. The memory 501 stores a computer program, and the processor 502 implements the method provided in any embodiment of this application when executing the computer program in the memory 501. Exemplarily, the steps of the electronic device computer program are as follows: S11-S13: S11, the first control parameter is determined by the baseboard management controller of the master node, and the second control parameter determined by the backup node is obtained; wherein, the baseboard management controller of the master node and the baseboard management controller of the backup node are connected in communication via a communication bus. S12, perform weight calculation on the first control parameter and the second control parameter to obtain the third control parameter; S13, based on the third control parameter, control the operation of the heat dissipation device to dissipate heat from the master node and / or the backup node.

[0080] A fourth aspect of this application also provides a storage medium, which is a computer-readable medium, carrying one or more computer programs that, when executed by a processor, implement the method provided in any embodiment of this application, including the following steps S21-S23: S21, the master node's baseboard management controller determines the first control parameter and obtains the second control parameter determined by the backup node; wherein the master node's baseboard management controller and the backup node's baseboard management controller are connected via a communication bus. S22, calculate the weights of the first control parameter and the second control parameter to obtain the third control parameter; S23, based on the third control parameter, control the operation of the heat dissipation device to dissipate heat from the master node and / or the backup node.

[0081] This application embodiment controls the heat dissipation device through any node in the dual-node server to achieve the purpose of heat dissipation. It does not introduce additional overhead, and the control is simple and flexible. It does not increase the hardware cost of the dual-node server and the manufacturing cost is low. In addition, the server structure is simple and no additional operations are required in the manufacturing process, thereby ensuring the manufacturing efficiency of the server and ensuring low subsequent maintenance costs.

[0082] It should be understood that in the embodiments of this application, the processor may be a central processing unit (CPU), or it may be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0083] Optionally, in this embodiment, the storage medium may include, but is not limited to, various media capable of storing program code, such as a USB flash drive, read-only memory (ROM), random access memory (RAM), portable hard drive, magnetic disk, or optical disk. Optionally, in this embodiment, the processor executes the method steps described in the above embodiments according to the program code stored in the storage medium. Optionally, specific examples in this embodiment can refer to the examples described in the above embodiments and optional implementations, which will not be repeated here. Obviously, those skilled in the art should understand that the modules or steps of this application described above can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed on a network of multiple computing devices. Optionally, they can be implemented using computer-executable program code, thereby storing them in a storage device for execution by a computing device. In some cases, the steps shown or described can be executed in a different order than those described here, or they can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, this application is not limited to any specific hardware and software combination.

[0084] Furthermore, although exemplary embodiments have been described herein, their scope includes any and all embodiments based on this application that have equivalent elements, modifications, omissions, combinations (e.g., schemes involving intersections of various embodiments), adaptations, or alterations. Elements in the claims will be interpreted broadly based on the language used in the claims and are not limited to the examples described in this specification or during the implementation of this application, which will be interpreted as non-exclusive. Therefore, this specification and examples are intended to be considered illustrative only, and the true scope and spirit are indicated by the following claims and the full scope of their equivalents.

[0085] The above description is intended to be illustrative and not restrictive. For example, the above examples (or one or more of them) can be used in combination with each other. Other embodiments may be used by those skilled in the art upon reading the above description. Furthermore, in the above detailed description, various features may be grouped together to simplify the application. This should not be construed as an intention that a disclosed feature not claimed is necessary for any claim. Rather, the subject matter of this application may be less than all the features of a particular disclosed embodiment. Thus, the following claims are incorporated herein by reference as examples or embodiments, wherein each claim is an independent, separate embodiment, and these embodiments are contemplated as being possible in various combinations or arrangements. The scope of this application should be determined by reference to the appended claims and the full scope of their equivalents.

[0086] The foregoing has described in detail several embodiments of this application, but this application is not limited to these specific embodiments. Those skilled in the art can make various variations and modifications based on the concept of this application, and all such variations and modifications should fall within the scope of protection claimed in this application.

Claims

1. A control method applied to a dual-node server, the control method comprising: The primary node's baseboard management controller determines the first control parameters and obtains the second control parameters determined by the backup node; wherein the primary node's baseboard management controller and the backup node's baseboard management controller are connected via a communication bus. The weights of the first and second control parameters are calculated to obtain the third control parameter; Based on the third control parameter, the heat dissipation device is controlled to operate in order to dissipate heat from the master node and / or the backup node.

2. The control method according to claim 1, wherein the dual-node server is provided with two slots, the slots being used to connect nodes; The control method further includes: If nodes are connected to both slots, obtain the running status of each node; If both nodes are running normally, the node connected to the target slot is determined to be the master node; If the node connected to the target slot is in an abnormal running state, and the node not connected to the target slot is in a normal running state, then the node not connected to the target slot is determined to be the master node.

3. The control method according to claim 1 or 2, further comprising: If the operating status of the master node in the target slot changes from normal to abnormal, the backup node is updated to the master node.

4. The control method according to claim 1, further comprising: If only one slot has a node connected to it, that node is determined to be the master node.

5. The control method according to claim 4, wherein when a node is connected to a slot, the control method includes: The first control parameter is determined by the baseboard management controller of the master node; Based on the first control parameter, the heat dissipation device is controlled to operate in order to dissipate heat from the master node.

6. The control method according to claim 4, wherein when a node is connected to a slot, the control method includes: Check if a node is connected in another slot; If so, re-determine the primary node from the two nodes.

7. The control method according to claim 1, further comprising: Acquire temperature values ​​collected by multiple temperature sensors; The preset algorithm is used to calculate the temperature value, the attribute parameters of the acquisition device corresponding to each temperature sensor and the heat dissipation device to obtain the first control parameter or the second control parameter; wherein the preset algorithm includes at least a proportional-integral-derivative control algorithm.

8. The control method according to claim 1, wherein the weight calculation of the first control parameter and the second control parameter to obtain the third control parameter includes: For each heat dissipation device, the weights of the first and second control parameters are calculated to obtain a third control parameter for controlling the heat dissipation device.

9. The control method according to any one of claims 1-8, When the dual-node server is in the power-on self-test process, the node's baseboard management controller controls the operation of the heat dissipation device based on preset control parameters and the coefficients corresponding to the preset control parameters. in, The number of nodes varies, and the corresponding coefficients for the preset control parameters are different.

10. A dual-node server, configured with two nodes and multiple heat dissipation devices, wherein the baseboard management controllers of the two nodes are connected via a communication bus; The master node of the two nodes determines the first control parameter through its baseboard management controller; The backup node of the two nodes determines the second control parameter through its baseboard management controller; and transmits the second control parameter to the master node according to the communication protocol. The master node performs weight calculations on the first and second control parameters to obtain the third control parameter; Based on the third control parameter, the heat dissipation device is controlled to operate in order to dissipate heat from the master node and / or the backup node.

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