Coil component

By forming a raised pattern and setting magnetic metal particles on the interface between the cover and the molded part of the inductor, the crack problem between the cover and the remaining part of the inductor is solved, thereby improving reliability and permeability.

CN122000178APending Publication Date: 2026-05-08SAMSUNG ELECTRO MECHANICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SAMSUNG ELECTRO MECHANICS CO LTD
Filing Date
2025-10-23
Publication Date
2026-05-08

AI Technical Summary

Technical Problem

Large-size inductors are prone to cracking between the covered and remaining parts due to differences in materials and pressing conditions, which affects reliability.

Method used

By forming a beam-shaped raised pattern at the interface between the cover and the molding part, stress propagation is controlled and cracks are prevented. Magnetic metal particles are also placed inside the main body to improve mechanical strength and magnetic permeability.

Benefits of technology

It effectively prevents cracks caused by stress propagation, improves the reliability and permeability of the coil assembly, and enhances mechanical strength.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a coil assembly. The coil component includes a body having a first surface and a second surface opposed to each other in a first direction, and a plurality of side surfaces connecting the first surface and the second surface. The body includes a magnetic material and accommodates a coil. First and second external electrodes are spaced apart from each other in a second direction on the body, and are connected to respective ends of the coil, respectively. The main body further includes a molded portion in which the coil is disposed, and a cover portion contacting the molded portion. A relief pattern protrudes from a surface of the cover portion facing the molded portion. At least a portion of the relief pattern overlaps the coil when viewed in the first direction. The structure is designed to improve reliability by inhibiting stress propagation and crack formation during manufacture or operation.
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Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0154648, filed on November 4, 2024, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] This disclosure relates to a coil assembly. Background Technology

[0003] Inductors (coil assemblies) are typical passive electronic components used in electronic devices, along with resistors and capacitors.

[0004] Inductors used in PC-related components (such as DDR5) have evolved towards higher efficiency and larger size due to their use of high-current components.

[0005] For large-size inductors, the main body can be formed using a single mold and can be divided into a cover section and a remaining section (molded section) containing the coil. Due to differences in the materials used and the pressing conditions, cracks may occur between the cover section and the remaining section. Summary of the Invention

[0006] One aspect of this disclosure is to provide a coil assembly with improved reliability by controlling the occurrence of cracks in the magnetic body.

[0007] According to one aspect of this disclosure, a coil assembly includes: a body including a first surface and a second surface opposite to each other in a first direction and a plurality of side surfaces connecting the first surface and the second surface, and the body comprising a magnetic material; a coil disposed within the body; and a first external electrode and a second external electrode disposed on the body, spaced apart from each other in a second direction and respectively connected to both ends of the coil, wherein the body includes a molded portion and a cover portion, the coil is disposed in the molded portion, the cover portion includes a surface in contact with the molded portion, a raised pattern protruding from the one surface of the cover portion, and at least a portion of the raised pattern overlaps with the coil when viewed along the first direction.

[0008] According to another aspect of this disclosure, a coil assembly includes: a body including a first surface and a second surface opposite to each other in a first direction and a plurality of side surfaces connecting the first surface and the second surface, and the body comprising a magnetic material; a coil disposed within the body and forming at least one turn; and a first external electrode and a second external electrode disposed on the body and spaced apart from each other in a second direction and connected to both ends of the coil, wherein the body includes a molding portion and a cover portion, the coil is disposed in the molding portion, the cover portion includes a surface in contact with the molding portion, a raised pattern protruding from the one surface of the cover portion, and the raised pattern being spaced apart from the plurality of side surfaces of the body when viewed along the first direction. Attached Figure Description

[0009] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed embodiments, taken in conjunction with the accompanying drawings, in which: Figure 1 This is a schematic perspective view of a coil assembly according to an embodiment of the present disclosure; Figure 2 It is along Figure 1 A cross-sectional view taken from line I-I'; Figure 3 It is along Figure 1 A diagram showing the view from the X direction; Figure 4 yes Figure 2 Enlarged views of parts A and B; Figure 5 This is used as an example of modification. Figure 2 Enlarged views of parts A and B; Figures 6A to 6E It is along Figure 1 A diagram of the covered area as viewed from the X direction; Figures 7A to 7E It is along Figure 1 A diagram showing the coverage area and coil as viewed from the X direction; Figure 8 This is a schematic perspective view of a coil assembly according to another embodiment of the present disclosure; Figure 9 It is along Figure 8 The cross-sectional view taken from line II-II'; and Figure 10 It is along Figure 8 A diagram showing the view from the X direction. Detailed Implementation

[0010] The terminology used herein to describe embodiments of this disclosure is not intended to limit the scope of this disclosure. The word “a” is singular because it has a single indicator; however, the use of the singular form in this document should not preclude the presence of more than one indicator. In other words, unless the context clearly indicates otherwise, the number of elements mentioned in the singular in this disclosure may be one or more. It will be further understood that the terms “comprising,” “including,” “having,” and / or “containing” as used herein specify the presence of the stated features, quantities, steps, operations, elements, components, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, steps, operations, elements, components, and / or combinations thereof.

[0011] The terminology used in this specification is for describing particular embodiments only and is not intended to limit this disclosure. Unless the context clearly distinguishes them, expressions used in the singular include plural expressions. It will be understood throughout this specification that terms such as “comprising” or “having” are intended to indicate the presence of the features, quantities, steps, actions, elements, components, or combinations thereof disclosed in the specification, and are not intended to exclude the possibility of the presence or addition of one or more other features, quantities, steps, actions, elements, components, or combinations thereof. Furthermore, throughout the specification, “on” means located “above” or “below” the target portion and does not necessarily mean located on the upper side relative to the direction of gravity.

[0012] Furthermore, “combination” not only means the contact relationship between the components is direct physical contact, but also applies to the concept of covering the situation where another component is disposed between the components such that the components are in contact with the other component.

[0013] Since the dimensions (e.g., thickness) of each component shown in the accompanying drawings are arbitrarily shown for ease of description, this disclosure is not necessarily limited to the dimensions (e.g., thickness) shown.

[0014] In the accompanying drawings, the X direction can be defined as a first direction or the thickness direction, the Y direction can be defined as a second direction or the length direction, and the Z direction can be defined as a third direction or the width direction.

[0015] In the following description, coil assemblies according to embodiments of the present disclosure will be described in detail with reference to the accompanying drawings, and in the description with reference to the drawings, the same or corresponding components are assigned the same reference numerals, and repeated descriptions of the same or corresponding components will be omitted.

[0016] Various types of electronic components are used in electronic devices, and various types of coil assemblies can be appropriately used among these electronic components for the purpose of noise removal.

[0017] In other words, in electronic devices, coil assemblies can be used as power inductors, high-frequency inductors, ordinary ferrite beads, high-frequency ferrite beads (e.g., ferrite beads suitable for the GHz band), common-mode filters, etc.

[0018] (First embodiment) Figure 1 This is a perspective view schematically illustrating a coil assembly according to an embodiment of the present disclosure. Figure 2 It is along Figure 1 The cross-sectional view taken from line I-I'. Figure 3 It is along Figure 1 A diagram showing the view from the X direction. Figure 4 yes Figure 2 Enlarged views of parts A and B. Figure 5 This is used as an example of modification. Figure 2 Enlarged views of parts A and B. Figures 6A to 6E It is along Figure 1 A diagram showing the covered portion as viewed from the X direction. Figures 7A to 7E It is along Figure 1 A diagram showing the cover and coil as viewed from the X direction.

[0019] Reference Figure 1 As shown in Figure 7, the coil assembly 1000 according to the first embodiment of the present disclosure includes a body 100, a coil 300, and external electrodes 400 and 500.

[0020] The main body 100 forms the shape of the coil assembly 1000 according to the first embodiment, and the coil 300 is embedded in the main body 100.

[0021] The main body 100 can be formed into the shape of an integral hexahedron.

[0022] Reference Figure 1 The main body 100 may include a first surface 101 and a second surface 102 that are opposite to each other in the X direction (first direction), a first side surface 103 and a second side surface 104 that are opposite to each other in the Y direction (second direction), and a third side surface 105 and a fourth side surface 106 that are opposite to each other in the Z direction (third direction). The first side surface 103, the second side surface 104, the third side surface 105, and the fourth side surface 106 of the main body 100 correspond to the plurality of side surfaces of the main body 100 that connect the first surface 101 and the second surface 102 of the main body 100.

[0023] The main body 100 may be formed such that, for example, the coil assembly 1000, which has the external electrodes 400 and 500 described below according to this embodiment, has a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.65 mm, but is not limited thereto. Furthermore, the above values ​​are design values ​​only without reflecting process errors, etc.; therefore, corresponding values ​​that can be identified as including process errors should also be considered to fall within the scope of this disclosure.

[0024] The main body 100 may include: a molding portion 120, in which the coil 300, described below, is disposed; and a cover portion 110, including a surface that contacts the molding portion 120. (See reference...) Figure 2 The main body 100 can be divided into a molding part 120 and a covering part 110 provided on the top of the coil 300.

[0025] The cover 110 may be disposed on the top of the coil 300, and one surface of the cover 110 ( Figure 2 The lower surface of the cover 110 may contact the molding portion 120. The cover 110 may include one surface and another surface facing said one surface in a first direction (X direction). Figure 2 The upper surface of the cover 110 and multiple side surfaces. Another surface of the cover 110 may form the second surface 102 of the main body 100, and multiple side surfaces of the cover 110 may form multiple side surfaces 103, 104, 105 and 106 of the main body 100.

[0026] A relief pattern 111 may be formed on one surface of the cover 110. The relief pattern 111 may protrude from one surface of the cover 110. The relief pattern 111 can prevent stress propagation within the body 100 and control cracks caused by stress propagation.

[0027] A large inductor, formed using a single mold, can be divided into a cover section and a remaining section (molded section) containing the coil. Due to differences in applied materials and pressing conditions, cracks may occur between the cover section and the remaining section. Specifically, the cover section and the molded section can be pressed sequentially. Due to differences in stiffness and coefficients of thermal expansion between the cover section and the molded section, expansion may occur due to temperature changes, and cracks may appear due to stress propagation caused by this expansion.

[0028] In the coil assembly according to this embodiment, the raised pattern 111 can be formed as a beam-shaped raised structure on the lower surface of the cover portion 110 (i.e., the interface where the cover portion 110 and the molding portion 120 meet), thereby preventing stress propagation and controlling cracks in the body 100 due to stress propagation.

[0029] Reference Figures 7A to 7EWhen viewed along the first direction (X direction), the raised pattern 111 can be superimposed on the coil 300; for example, at least a portion of the raised pattern 111 can be superimposed on the coil 300. That is, the raised pattern 111 can be formed across one surface of the contact molding portion 120 of the cover portion 110 and can have a radial shape radiating outward from the center of that surface. When viewed along the first direction, the raised pattern 111 can be superimposed on the core C of the molding portion 120, which will be described below. With the structure described above, stress propagation can be effectively prevented.

[0030] The raised pattern 111 can directly contact the coil 300 and can also contact the insulating film IF covering the coil 300, as described below. Figures 7A to 7E As shown, the raised pattern 111 may be formed at the center of one surface of the cover 110, but the raised pattern 111 may not penetrate the coil 300. Here, "not penetrating" may mean substantially not penetrating the hollow core formed by the coil 300. Due to errors in the manufacturing process, the raised pattern 111 may penetrate a small portion of the coil 300; however, in this disclosure, the part penetrating the coil 300 is the molding portion 120, and as will be described below, the molding portion 120 may include the core C penetrating the coil 300.

[0031] A portion of the molding portion 120 may be disposed between one surface of the cover portion 110 and the coil 300. Since the embossed pattern 111 is a part protruding from one surface of the cover portion 110, a portion of the molding portion 120 may be disposed in a non-protruding area of ​​the lower surface of the cover portion 110.

[0032] The raised pattern 111 may extend to the multiple side surfaces 103, 104, 105 and 106 of the body 100. However, it is not limited thereto, the raised pattern 111 may be formed only for the stress concentration area and may not extend to the multiple side surfaces 103, 104, 105 and 106 of the body 100.

[0033] The molding portion 120 may be disposed below the cover portion 110, and the coil 300 is disposed in the molding portion 120. The molding portion 120 may refer to the components of the body 100 other than the cover portion 110. The molding portion 120 may include a surface forming a first surface of the body 100, another surface facing the first surface and contacting the cover portion 110 in a first direction (X direction), and a plurality of side surfaces.

[0034] The plurality of side surfaces of the molding portion 120 may, together with the plurality of side surfaces of the cover portion 110, form the plurality of side surfaces 103, 104, 105 and 106 of the main body. However, as in the second embodiment described below, the plurality of side surfaces of the molding portion 120 may not form the plurality of side surfaces 103, 104, 105 and 106 of the main body.

[0035] The molding section 120 may include a core C that passes through the coil 300. Here, "passing through the coil 300" may refer to a hollow core that passes through the coil 300 forming at least one turn.

[0036] The molding part 120 can be formed by the following steps: placing the cover part 110 in the mold and placing the coil 300 on one surface of the cover part 110, filling the mold with the resin and magnetic metal particles described below, and then pressing and heating the mold.

[0037] The covering portion 110 and the molding portion 120 may include resin and magnetic metal particles dispersed in the resin. Specifically, the covering portion 110 may include first magnetic metal particles 11, and the molding portion 120 may include second magnetic metal particles 12.

[0038] The first magnetic metal particle 11 included in the covering portion 110 and the second magnetic metal particle 12 included in the molding portion 120 may have different particle size distributions. Specifically, the particle size distribution based on area analysis may differ in cross-sectional samples collected in the XY direction.

[0039] The diameter of the first magnetic metal particle 11 may differ from the diameter of the second magnetic metal particle 12. Furthermore, in this specification, the difference in diameter between the magnetic metal particles 11 and 12 may refer to a difference in their average diameter. Additionally, the difference in the average diameter of the magnetic metal particles 11 and 12 may refer to a difference in their particle size distribution values, expressed as D50 or D90.

[0040] Reference Figure 4 The covering portion 110 may consist only of first magnetic metal particles 11 having a relatively small average diameter. The molding portion 120 may include the first magnetic metal particles 11 and relatively large second magnetic metal particles 12. The magnetic metal particle filling rate of the covering portion 110 may be greater than that of the molding portion 120. The second magnetic metal particles 12 included in the molding portion 120 have a relatively large average diameter, thereby achieving high permeability (relative permeability). Furthermore, the molding portion 120 can further improve permeability (relative permeability) and enhance Q characteristics by mixing the first magnetic metal particles 11 and the second magnetic metal particles 12 together to improve the filling rate. Moreover, even when a relatively low pressure is applied, the molding portion 120 can be filled with a sufficient amount of magnetic metal particles, thereby ensuring a relatively high filling rate. Furthermore, since the cover portion 110 only includes first magnetic metal particles 11 with a relatively small average diameter, the cover portion 110 can have a relatively low permeability (relative permeability) compared to the molding portion 120. However, since the cover portion 110 is a low-loss material, the cover portion 110 can compensate for the increased core loss due to the use of a high permeability material with a relatively large diameter.

[0041] However, this disclosure is not limited thereto, and the average diameter of the first magnetic metal particle 11 may be greater than the average diameter of the second magnetic metal particle 12.

[0042] Figure 5 This is used as an example of modification. Figure 2 Enlarged views of parts A and B. (Refer to...) Figure 5 Compared to the molding portion 120, the cover portion 110 can have a higher resin R content and a lower magnetic metal particle filling rate. Since the resin R content of the cover portion 110 is greater than that of the molding portion 120, the magnetic metal particles can be firmly bonded together, and mechanical strength can be improved. The resin R content can be obtained as the ratio of the area occupied by resin R to the total area in a cross-sectional sample taken in the XY direction. Because the cover portion 110 can have a lower magnetic metal particle filling rate compared to the molding portion 120, the cover portion 110 can exhibit a relatively low permeability (relative permeability). The magnetic metal particle filling rate can be obtained as the volume fraction or area fraction of the magnetic metal particles dispersed in the resin R.

[0043] However, this disclosure is not limited thereto, and compared with the molding portion 120, the covering portion 110 may have a lower resin R content and a higher filling rate of magnetic metal particles.

[0044] Magnetic metal particles 11 and 12 may include at least one selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, magnetic metal particles 11 and 12 may be at least one selected from the group consisting of pure iron particles, Fe-Si based alloy particles, Fe-Si-Al based alloy particles, Fe-Ni based alloy particles, Fe-Ni-Mo based alloy particles, Fe-Ni-Mo-Cu based alloy particles, Fe-Co based alloy particles, Fe-Ni-Co based alloy particles, Fe-Cr based alloy particles, Fe-Cr-Si based alloy particles, Fe-Si-Cu-Nb based alloy particles, Fe-Ni-Cr based alloy particles, and Fe-Cr-Al based alloy particles.

[0045] The magnetic metal particles 11 and 12 can be amorphous or crystalline. For example, the magnetic metal particles 11 and 12 can be Fe-Si-B-Cr based amorphous alloy particles, but are not limited to this.

[0046] The diameter of the second magnetic metal particle 12 can be from 10 μm to 50 μm, and the diameter of the first magnetic metal particle 11 can be from 0.1 μm to 6 μm. However, it is not limited to this, and the average diameter of the second magnetic metal particle 12 can be greater than the average diameter of the first magnetic metal particle 11.

[0047] The surface of each of the magnetic metal particles 11 and 12 may be covered with an insulating material. The insulating material may be an organic insulating material, alone or in combination, including but not limited to epoxy resin, polyimide, liquid crystal polymer, etc., or it may be an oxide insulating film (including the metallic components of the magnetic metal particles 11 and 12) or an inorganic insulating material (such as SiO₂). x SiN x Or phosphate).

[0048] Resin R may include, but is not limited to, epoxy resin, polyimide, liquid crystal polymer, etc., alone or in combination.

[0049] The coil 300 exhibits the characteristics of a coil assembly. For example, when the coil assembly 1000 of this embodiment is used as a power inductor, the coil 300 can store an electric field as a magnetic field to maintain the output voltage, thereby stabilizing the power of the electronic device.

[0050] The coil 300 is disposed inside the molding portion 120 of the main body 100, and two leads 331 and 332 extend to the surface of the main body 100. Specifically, the coil 300 may include: a winding portion 310, forming at least one turn with the core C of the molding portion 120 as an axis; and a first lead 331 and a second lead 332, connected to the winding portion 310 and extending to the first side surface 103 and the second side surface 104 of the main body 100, respectively.

[0051] The coil 300 can be formed by winding a metal wire (such as copper wire (Cu wire)) comprising a metal conductor and an insulating film IF covering the surface of the metal conductor. Therefore, the entire surface of each turn in the multiple turns of the coil 300 is covered by the insulating film IF. Furthermore, the metal wire can be a flat wire, but is not limited to this. As an example, such as... Figure 2 As shown, when coil 300 is formed using flat wire, coil 300 may have a shape with a rectangular cross-section per turn.

[0052] The winding portion 310 may form an innermost turn, at least one intermediate turn, and an outermost turn from the core C toward the body 100 in the Y direction (second direction) or Z direction (third direction). The winding portion 310 may have an upper and lower surface similar to an integral ring shape, as well as an inner and outer surface connecting the upper and lower surfaces, such that the winding portion 310 may have a cylindrical shape with a cylindrical hollow portion formed in the center. The winding portion 310 is an air-core coil, and the core C may be disposed in the hollow core of the winding portion 310.

[0053] The first lead-out portion 331 and the second lead-out portion 332 can extend as the two ends of the coil 300 to opposite sides in the second direction (Y direction). Specifically, the first lead-out portion 331 can extend to the first side surface 103 of the body 100, and the second lead-out portion 332 can extend to the second side surface 104 of the body 100. The first lead-out portion 331 and the second lead-out portion 332 can be the remaining portion of the metal wire (such as copper wire whose surface is covered by an insulating film IF) after the winding portion 310 is formed. As a result, no boundary can be formed between the first lead-out portion 331 and the winding portion 310, and between the second lead-out portion 332 and the winding portion 310. Furthermore, similar to the winding portion 310, an insulating film IF can be formed on the surface of the first lead-out portion 331 and the surface of the second lead-out portion 332.

[0054] The insulating film IF may include, but is not limited to, epoxy resin, polyimide, liquid crystal polymer, etc., alone or in combination.

[0055] The first external electrode 400 and the second external electrode 500 may be arranged on the body 100 to be spaced apart from each other in the second direction (Y direction) and may be connected to both ends of the coil 300.

[0056] Specifically, in this embodiment, the first external electrode 400 may be disposed on the first side surface 103 of the body 100 and connected to the first lead-out portion 331 extending to the first side surface 103 of the body 100. Additionally, the first external electrode 400 may extend from the first side surface 103 of the body 100 to a portion of each of the first surface 101, second surface 102, third side surface 105, and fourth side surface 106 of the body 100. The second external electrode 500 may be disposed on the second side surface 104 of the body 100 and connected to the second lead-out portion 332 extending to the second side surface 104 of the body 100. Additionally, the second external electrode 500 may extend from the second side surface 104 of the body 100 to a portion of each of the first surface 101, second surface 102, third side surface 105, and fourth side surface 106 of the body 100.

[0057] The first external electrode 400 and the second external electrode 500 may be formed using conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), chromium (Cr), titanium (Ti), or alloys thereof, but are not limited thereto.

[0058] The first external electrode 400 and the second external electrode 500 can be formed as a single-layer structure or a multi-layer structure. For example, the first external electrode 400 may include a first layer containing copper (Cu), a second layer disposed on the first layer and containing nickel (Ni), and a third layer disposed on the second layer and containing tin (Sn). Each of the first to third layers can be formed by electroplating, but is not limited thereto. Each of the first external electrode 400 and the second external electrode 500 may include a conductive resin layer and an electroplated layer. The conductive resin layer can be formed by coating a conductive paste comprising conductive particles containing silver (Ag) and / or copper (Cu) and an insulating resin (such as epoxy resin) and then curing it.

[0059] Furthermore, although not shown, surface insulating layers may be formed on the first surface 101, second surface 102, and first side surfaces 103, second side surfaces 104, third side surfaces 105, and fourth side surfaces 106 of the body 100, excluding the areas where the external electrodes 400 and 500 are disposed. The surface insulating layers may be formed by printing insulating paste, coating insulating resin, or stacking insulating films comprising insulating resin on the first surface 101, second surface 102, and first side surfaces 103, second side surfaces 104, third side surfaces 105, and fourth side surfaces 106 of the body 100. The insulating resin may be, alone or in combination, including but not limited to, epoxy resin, polyimide, liquid crystal polymer, etc.

[0060] (Second Embodiment) Figure 8 This is a schematic perspective view of a coil assembly according to another embodiment of the present disclosure. Figure 9 It is along Figure 8 The cross-sectional view taken from line II-II'. Figure 10 It is along Figure 8 A diagram showing the view from the X direction.

[0061] In the following text, reference will be made to Figures 8 to 10 A coil assembly 2000 according to a second embodiment of the present disclosure is described.

[0062] The coil assembly 2000 according to the second embodiment of this disclosure differs from the first embodiment in the shape of the cover portion 110 and the positions of the two ends of the coil 300, etc. The differences compared to the first embodiment will be described below.

[0063] The cover portion 110 can cover multiple side surfaces of the molding portion 120. For example... Figure 9 and Figure 10As shown, the cover portion 110 may be formed to surround the molding portion 120 by covering a plurality of side surfaces of the molding portion 120. Therefore, the plurality of side surfaces of the cover portion 110 may form a plurality of side surfaces 103, 104, 105 and 106 of the body 100, and the plurality of side surfaces of the molding portion 120 may not extend to the outer surface of the body 100.

[0064] The raised pattern 111 may be spaced apart from the multiple side surfaces 103, 104, 105 and 106 of the main body 100. That is, when the shape of the cover 110 changes, the raised pattern 111 may not extend to the multiple side surfaces 103, 104, 105 and 106 of the main body 100.

[0065] The two ends of the coil 300 can extend to the first surface 101 of the body 100, but not to the first side surface 103 and the second side surface 104. That is, when the shape of the cover 110 changes, the two ends of the coil 300 can extend to the lower surface of the body 100 instead of the side surface.

[0066] The first external electrode 400 and the second external electrode 500 may be positioned on the first surface 101 of the body 100, spaced apart from each other in the second direction (Y direction). However, this is not a limitation; the first external electrode 400 may extend to at least a portion of the first side surface 103 of the body 100 and a portion of each of the third side surface 105, the fourth side surface 106, and the second surface 102. Similarly, the second external electrode 500 may extend to at least a portion of the second side surface 104 of the body 100 and a portion of each of the third side surface 105, the fourth side surface 106, and the second surface 102 of the body 100.

[0067] The description of other components is the same as that of the first embodiment, and therefore is omitted.

[0068] According to embodiments of this disclosure, coil assemblies with improved reliability can be provided by controlling the occurrence of cracks within the magnetic body.

[0069] While exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A coil assembly, comprising: The body includes a first surface and a second surface opposite to each other in a first direction, and a plurality of side surfaces connecting the first surface and the second surface, and the body includes a magnetic material; A coil is disposed within the main body; as well as The first and second external electrodes are arranged on the main body, spaced apart from each other in a second direction, and respectively connected to the two ends of the coil. The main body includes a molding portion and a covering portion. The coil is disposed in the molding portion. The covering portion includes a surface that contacts the molding portion. A raised pattern protrudes from the surface of the covering portion, and at least a portion of the raised pattern overlaps with the coil when viewed along the first direction.

2. The coil assembly according to claim 1, wherein, When viewed along the first direction, the embossed pattern has a radial shape radiating outward from the center of one surface of the cover.

3. The coil assembly according to claim 1, wherein, The molding portion includes a core that extends through the coil.

4. The coil assembly according to claim 3, wherein, When viewed along the first direction, the embossed pattern overlaps with the core.

5. The coil assembly according to claim 1, further comprising: An insulating film covers the coil. The raised pattern is in contact with the insulating film.

6. The coil assembly according to claim 1, wherein, The raised pattern does not extend through the coil.

7. The coil assembly according to claim 1, wherein, The covering portion further includes another surface opposite to the first surface in the first direction and a plurality of side surfaces connecting the one surface and the other surface, wherein the other surface of the covering portion forms the second surface of the body, and the plurality of side surfaces of the covering portion form the plurality of side surfaces of the body.

8. The coil assembly according to claim 1, wherein, The covering portion includes first magnetic metal particles. The molding section includes second magnetic metal particles, and The first magnetic metal particles included in the covering portion and the second magnetic metal particles included in the molding portion have different particle size distributions.

9. The coil assembly according to claim 1, wherein, The two ends of the coil extend to the two sides of the body facing each other in the second direction.

10. The coil assembly according to claim 1, wherein, The molding portion includes a surface forming the first surface of the body, another surface facing the first surface and contacting the covering portion in the first direction, and a plurality of side surfaces connecting the one surface and the other surface, and the covering portion covers the plurality of side surfaces of the molding portion.

11. The coil assembly according to claim 1, wherein, The raised pattern is spaced apart from the plurality of side surfaces of the body.

12. The coil assembly according to claim 1, wherein, The two ends of the coil extend to the first surface of the body.

13. A coil assembly, comprising: The body includes a first surface and a second surface opposite to each other in a first direction, and a plurality of side surfaces connecting the first surface and the second surface, and the body includes a magnetic material; A coil is disposed within the body and forms at least one turn; as well as The first and second external electrodes are positioned on the main body, spaced apart from each other in a second direction, and connected to the two ends of the coil. The main body includes a molding portion and a cover portion. The coil is disposed in the molding portion. The cover portion includes a surface that contacts the molding portion. A raised pattern protrudes from the surface of the cover portion and, when viewed along the first direction, the raised pattern is spaced apart from the plurality of side surfaces of the main body.

14. The coil assembly of claim 13, wherein, The molding portion includes a surface forming the first surface of the body, another surface facing the first surface and contacting the covering portion in the first direction, and a plurality of side surfaces connecting the one surface and the other surface, and the covering portion covers the plurality of side surfaces of the molding portion.

15. The coil assembly of claim 13, wherein, The two ends of the coil extend to the first surface of the body.

16. The coil assembly of claim 13, wherein, The raised pattern includes a beam-shaped raised structure disposed on one surface of the cover.

Citation Information

Patent Citations

  • semiconductor devices

    KR1020240154648A