Audio circuit, loudspeaker module and electronic equipment
By introducing a speaker attachment into the speaker module and using its connection status to identify the speaker module, the problem of identifying differences in audio performance among speaker modules is solved, reducing costs and space occupation, and improving audio performance consistency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HONOR DEVICE CO LTD
- Filing Date
- 2024-11-08
- Publication Date
- 2026-05-08
AI Technical Summary
In the prior art, when electronic devices need to be configured with multiple speaker modules, it is difficult to effectively identify and eliminate the differences in audio performance between speaker modules, resulting in high costs and large space occupation.
By introducing a speaker sub-board into the speaker module, the different connection states of the sub-board can be used to identify the speaker module. The processor can distinguish speaker modules with different audio performance by detecting the connection state of the speaker sub-board. Multiple speaker modules can be identified with only one or more ports.
It reduces the cost and space required for speaker modules, while improving the consistency of audio performance and simplifying the processor's recognition process.
Smart Images
Figure CN122002192A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of terminal technology, and in particular to an audio circuit, a speaker module, and an electronic device. Background Technology
[0002] Electronic devices such as mobile phones, tablets, and laptops typically have audio circuitry. This audio circuitry includes a processor and a speaker module. When the electronic device is operating, the processor can transmit audio signals to the speaker components in the speaker module to drive the speaker module to produce sound.
[0003] In related technologies, an electronic device needs to be configured with multiple speaker modules, and the audio performance of these speaker modules may differ. Therefore, in order to ensure the consistency of audio performance among multiple speaker modules in an electronic device, the processor needs to first identify the speaker modules and then compensate the audio signals for speaker modules with different audio performance to eliminate the differences in audio performance.
[0004] Therefore, there is an urgent need for a speaker module and audio circuit that are easy for processors to recognize. Summary of the Invention
[0005] This application provides a speaker module, an audio circuit, and an electronic device. The speaker module further includes a speaker sub-board. For speaker modules with different audio performance, the connection state of the third terminal of the speaker sub-board differs. Thus, the processor can identify the speaker module by detecting the connection state of the third terminal of the speaker sub-board. The technical solution is as follows:
[0006] In a first aspect, a loudspeaker module is provided. The loudspeaker module includes a loudspeaker assembly and a loudspeaker sub-plate. The loudspeaker assembly has a first signal terminal and a second signal terminal. The loudspeaker sub-plate has a first terminal, a second terminal, and a third terminal.
[0007] The first signal terminal of the speaker assembly is connected to the first terminal of the speaker sub-board, and the first terminal of the speaker sub-board is used to connect to the first terminal of the processor. The second signal terminal of the speaker assembly is connected to the second terminal of the speaker sub-board, and the second terminal of the speaker sub-board is used to connect to the second terminal of the processor. When the speaker module is working, the first signal terminal of the speaker assembly is used to input an audio signal or a ground signal; the second signal terminal of the speaker assembly is used to input an audio signal, so that the speaker assembly emits sound under the drive of the audio signal.
[0008] The third terminal of the speaker sub-board is used to connect to the third terminal of the processor, so that the processor can detect the connection status of the third terminal of the speaker sub-board. Here, the connection status of the third terminal of the speaker sub-board includes a first connection status or a second connection status. The first connection status corresponds to a first type of speaker module. The first connection status is: the third terminal of the speaker sub-board is connected to the second terminal of the speaker sub-board and the second signal terminal of the speaker assembly. The second connection status corresponds to a second type of speaker module. The second connection status is: the third terminal of the speaker sub-board is not connected to the second terminal of the speaker sub-board and the second signal terminal of the speaker assembly.
[0009] In this embodiment, the first speaker module and the second speaker module are two speaker modules with different audio performance. That is, the connection status of the third terminal of the speaker attachment differs for the two speaker modules with different audio performance. Based on this, the processor can identify the two speaker modules by detecting the connection status of the third terminal of the speaker attachment. Therefore, this speaker module only requires one port to achieve the identification of the two speaker modules.
[0010] In some embodiments, the speaker sub-plate further has a fourth terminal. The fourth terminal of the speaker sub-plate is used to connect to a fourth terminal of the processor, so that the processor can detect the connection state of the fourth terminal of the speaker sub-plate. Here, the connection state of the fourth terminal of the speaker sub-plate includes a third connection state or a fourth connection state. The third connection state corresponds to a third type of speaker module. The third connection state is: the fourth terminal of the speaker sub-plate is connected to the second terminal of the speaker sub-plate and the second signal terminal of the speaker assembly. The fourth connection state corresponds to a fourth type of speaker module, and the fourth connection state is: the fourth terminal of the speaker sub-plate is not connected to the second terminal of the speaker sub-plate and the second signal terminal of the speaker assembly.
[0011] In this embodiment, the third and fourth speaker modules can be two different speaker modules with different audio performances, in addition to the first and second speaker modules. Similarly, the connection states of the fourth terminal of the speaker attachment board differ between the third and fourth speaker modules. Based on this, the processor can identify these two speaker modules by detecting the connection state of the fourth terminal of the speaker attachment board. Therefore, this speaker module only requires two ports to identify four types of speaker modules.
[0012] Secondly, an audio circuit is also provided, including a processor and a speaker module as described in any embodiment of the first aspect. A first end of the processor is connected to a first end of a speaker sub-board. Alternatively, the first end of the processor is connected to a first signal end of the speaker assembly via the first end of the speaker sub-board. A second end of the processor is connected to a second end of the speaker sub-board. Alternatively, the second end of the processor is connected to a second signal end of the speaker assembly via the second end of the speaker sub-board. When the processor is operating, the first end of the processor is used to transmit an audio signal or a ground signal to the first signal end of the speaker assembly, and the second end of the processor is used to transmit an audio signal to the second signal end of the speaker assembly.
[0013] In some embodiments, the processor can identify different speaker modules by performing the following steps:
[0014] The processor transmits an audio signal to the second signal terminal of the speaker assembly; if a preset signal is detected at the third terminal of the processor, the processor determines that the speaker module is a first type of speaker module; if no preset signal is detected at the third terminal of the processor, the processor determines that the speaker module is a second type of speaker module.
[0015] The audio circuit provided in the embodiments of this application will be further explained below from three possible implementation methods.
[0016] In a first possible implementation, the audio circuit further includes a voltage divider unit. A first terminal of the voltage divider unit is connected to a third terminal of the speaker sub-board. A second terminal of the voltage divider unit is connected to a third terminal of the processor. The third terminal of the voltage divider unit is connected to ground. The voltage at the second terminal of the voltage divider unit is less than the voltage at the first terminal, and the voltage at the second terminal is positively correlated with the voltage at the first terminal.
[0017] Specifically, the voltage divider unit may include a first resistor and a second resistor. The first terminal of the first resistor is connected to the third terminal of the speaker mounting plate. The second terminal of the first resistor is connected to the first terminal of the second resistor and the third terminal of the processor. The second terminal of the second resistor is connected to ground.
[0018] In this possible implementation, the audio signal can be a Class D audio signal. In this case, the first terminal of the processor is used to transmit the audio signal to the first signal terminal of the speaker assembly. The audio signals received by the first and second signal terminals of the speaker assembly, i.e., the audio signals output by the first and second terminals of the processor, are differential pulse signals. Based on this, the preset signal can be a square wave signal.
[0019] The audio signal can be either a Class A or Class B audio signal. In this case, the first terminal of the processor is used to transmit a ground signal to the first signal terminal of the speaker assembly. The audio signal is an analog signal. Based on this, the preset signal can be an analog signal, such as an analog signal with a sine wave waveform.
[0020] In a second possible implementation, the audio circuit further includes a filtering unit. A first terminal of the filtering unit is connected to a third terminal of the speaker sub-board. A second terminal of the filtering unit is connected to a third terminal of the processor.
[0021] Specifically, the filtering unit may include a third resistor and a first capacitor. The first terminal of the third resistor is connected to the third terminal of the speaker mounting plate. The second terminal of the third resistor is connected to the first plate of the first capacitor and the third terminal of the filter. The second plate of the first capacitor is connected to ground.
[0022] In this possible implementation, the audio signal can be a Class D audio signal. In this case, the first terminal of the processor is used to transmit the audio signal to the first signal terminal of the speaker assembly. The audio signals received by the first and second signal terminals of the speaker assembly, i.e., the audio signals output by the first and second terminals of the processor, are differential pulse signals. Based on this, the preset signal is a high-level signal.
[0023] The audio signal can also be a Class A or Class B audio signal. In this case, the first terminal of the processor is used to transmit a ground signal to the first signal terminal of the speaker assembly. The audio signal is an analog signal. The preset signal can be set by someone skilled in the art.
[0024] In a third possible implementation, the audio circuit further includes a comparator unit. The first input terminal of the comparator unit is connected to the third terminal of the speaker sub-board. The second input terminal of the comparator unit is connected to ground. The output terminal of the comparator unit is connected to the third terminal of the processor. When the voltage at the first input terminal of the comparator unit is greater than the voltage at the second input terminal, the output terminal of the comparator unit outputs a high level.
[0025] Specifically, the comparison unit may include a comparator. The non-inverting input of the comparator is connected to the third terminal of the speaker sub-board. The inverting input of the comparator is connected to ground. The output of the comparator is connected to the third terminal of the processor.
[0026] In this possible implementation, the audio signal can be a Class D audio signal. In this case, the first terminal of the processor is used to transmit the audio signal to the first signal terminal of the speaker assembly. The audio signals received by the first and second signal terminals of the speaker assembly, i.e., the audio signals output by the first and second terminals of the processor, are differential pulse signals. The preset signal is a high-level signal.
[0027] The audio signal can be either a Class A or Class B audio signal. In this case, the first terminal of the processor is used to transmit a ground signal to the first signal terminal of the speaker assembly. The audio signal is an analog signal. The preset signal is a high-level signal.
[0028] The three different implementation methods described above can be combined with each other.
[0029] Thirdly, an electronic device is also provided. The electronic device includes a processor and a speaker module as described in any embodiment of the first aspect, or the electronic device includes audio circuitry as described in any embodiment of the second aspect.
[0030] The technical effects achieved by the second and third aspects mentioned above are similar to those achieved by the corresponding technical means in the first aspect mentioned above, and will not be repeated here. Attached Figure Description
[0031] Figure 1 This is a schematic diagram of the appearance of the first electronic device in the related technology;
[0032] Figure 2 This is a schematic diagram of the appearance of a second type of electronic device in the related technology;
[0033] Figure 3 This is the circuit structure diagram of the first audio circuit in the related technology;
[0034] Figure 4 This is the circuit structure diagram of the first speaker module in the related technology;
[0035] Figure 5 This is a circuit structure diagram of the second type of audio circuit in related technologies;
[0036] Figure 6 This is a circuit diagram of the second type of speaker module in the related technology;
[0037] Figure 7 This is a circuit structure diagram of the third type of audio circuit in related technologies;
[0038] Figure 8 This is a circuit structure diagram of the first type of speaker module provided in the embodiments of this application;
[0039] Figure 9 This is a circuit structure diagram of the first audio circuit provided in the embodiments of this application;
[0040] Figure 10 This is a circuit structure diagram of the second type of speaker module provided in the embodiments of this application;
[0041] Figure 11 This is a circuit structure diagram of the second type of audio circuit provided in the embodiments of this application;
[0042] Figure 12 This is a circuit structure diagram of the third type of speaker module provided in the embodiments of this application;
[0043] Figure 13 This is a circuit structure diagram of the third type of audio circuit provided in the embodiments of this application;
[0044] Figure 14 This is a circuit structure diagram of the fourth type of speaker module provided in the embodiments of this application;
[0045] Figure 15 This is a circuit structure diagram of the fourth type of audio circuit provided in the embodiments of this application;
[0046] Figure 16 This is a circuit structure diagram of the fifth audio circuit provided in the embodiments of this application;
[0047] Figure 17 This is a circuit structure diagram of the sixth audio circuit provided in the embodiments of this application;
[0048] Figure 18 This is a circuit structure diagram of the seventh audio circuit provided in the embodiments of this application;
[0049] Figure 19 This is a circuit structure diagram of the eighth audio circuit provided in the embodiments of this application;
[0050] Figure 20 This is a circuit structure diagram of the ninth audio circuit provided in the embodiments of this application;
[0051] Figure 21 This is a circuit structure diagram of the tenth audio circuit provided in the embodiments of this application;
[0052] Figure 22 This is a circuit structure diagram of the eleventh audio circuit provided in the embodiments of this application;
[0053] Figure 23 This is a circuit structure diagram of the twelfth audio circuit provided in the embodiments of this application;
[0054] Figure 24 This is a circuit structure diagram of the thirteenth audio circuit provided in the embodiments of this application;
[0055] Figure 25 This is a circuit structure diagram of the fourteenth audio circuit provided in the embodiments of this application;
[0056] Figure 26 This is a circuit structure diagram of the fifteenth audio circuit provided in the embodiments of this application;
[0057] Figure 27 This is a circuit structure diagram of the sixteenth audio circuit provided in the embodiments of this application;
[0058] Figure 28 This is a circuit structure diagram of the seventeenth audio circuit provided in the embodiments of this application;
[0059] Figure 29 This is a circuit structure diagram of the eighteenth type of audio circuit provided in the embodiments of this application;
[0060] Figure 30 This is a circuit structure diagram of the nineteenth audio circuit provided in the embodiments of this application;
[0061] Figure 31 This is a circuit structure diagram of the twentieth audio circuit provided in the embodiments of this application;
[0062] Figure 32 This is a circuit structure diagram of the twenty-first audio circuit provided in the embodiments of this application;
[0063] Figure 33 This is a circuit structure diagram of the twenty-second type of audio circuit provided in this application embodiment;
[0064] Figure 34 This is a circuit structure diagram of the twenty-third type of audio circuit provided in the embodiments of this application.
[0065] The meanings of the various symbols in the attached icons are as follows:
[0066] 10. Electronic equipment; 20. Audio circuit; 210. Processor; 220. Speaker module; 222. Speaker assembly; 224. Speaker sub-board; 232. First voltage divider unit; 234. Second voltage divider unit; 242. First filter unit; 244. Second filter unit; 252. First comparator unit; 254. Second comparator unit. Detailed Implementation
[0067] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.
[0068] It should be understood that "multiple" as mentioned in this application refers to two or more. In the description of this application, unless otherwise stated, " / " indicates "or," for example, A / B can mean A or B; "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist, for example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Furthermore, to facilitate a clear description of the technical solutions of this application, the terms "first," "second," etc., are used to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first," "second," etc., do not limit the quantity or execution order, and that "first," "second," etc., do not necessarily imply differences.
[0069] Before providing a detailed explanation of the speaker module provided in the embodiments of this application, the application scenarios and related technologies of the speaker module will be explained first.
[0070] Electronic devices 10 include mobile phones, tablets, laptops, etc. Figure 1 and Figure 2 These are schematic diagrams of the appearance of two different electronic devices 10 in related technologies. Figure 1 The electronic device 10 shown is a mobile phone. Figure 2 The electronic device 10 shown is a laptop computer.
[0071] The electronic device 10 has an audio circuit 20. Figure 3 This is a circuit structure diagram of an audio circuit 20 in related technologies, such as... Figure 3 As shown, the audio circuit 20 includes a processor 210 and a speaker module 220. The speaker module 220 includes a speaker mounting plate 224 and a speaker assembly 222 fixed to the speaker mounting plate 224. The speaker mounting plate 224 is a circuit board. The first signal terminal 1 of the speaker assembly 222 is connected to the first terminal 1 of the processor 210 through the first terminal 1 of the speaker mounting plate 224, and the second signal terminal 2 of the speaker assembly 222 is connected to the second terminal 2 of the processor 210 through the second terminal 2 of the speaker mounting plate 224. Thus, when the electronic device 10 is working, the processor 210 can transmit audio signals to the speaker assembly 222 to drive the speaker assembly 222 to emit sound.
[0072] In related technologies, an electronic device 10 needs to be configured with multiple speaker modules 220. However, the multiple speaker modules 220 in an electronic device 10 may be provided by different manufacturers. Due to the differences in technical specifications and manufacturing processes among different manufacturers, the audio performance of speaker modules 220 provided by different manufacturers may differ, and even different models of speaker modules 220 provided by the same manufacturer may have different audio performance. Based on this, in order to ensure the consistency of audio performance of multiple speaker modules 220 in an electronic device 10, the processor 210 needs to first identify the speaker modules 220 during operation, and then perform audio signal compensation for speaker modules 220 with different audio performance, thereby eliminating the differences in audio performance.
[0073] Figure 4 This is a circuit diagram of a speaker module 220 in related technologies. Figure 5 This is a circuit structure diagram of an audio circuit 20 in related technologies, and Figure 5 The speaker module 220 in the audio circuit 20 shown is Figure 4 The speaker module 220 shown. Figure 6 This is a circuit diagram of another speaker module 220 in the related technology. Figure 7 This is a circuit structure diagram of another audio circuit 20 in related technologies, and Figure 7 The speaker module 220 in the audio circuit 20 shown is Figure 6 The speaker module 220 is shown. (As shown) Figures 4 to 7 As shown, in the related technology, in order for the processor 210 to identify the speaker module 220 before operation, the speaker attachment 224 also has a third terminal 3 and a fourth terminal 4. The fourth terminal 4 of the speaker attachment 224 is a ground terminal, used to connect to the ground wire GND. The third terminal 3 of the speaker attachment 224 is used to connect to the third terminal 3 of the processor 210, so that the processor 210 can detect the connection status of the third terminal 3 of the speaker attachment 224.
[0074] Here, the connection state of the third terminal 3 of the speaker sub-plate 224 includes either a first connection state or a second connection state. For example... Figure 4 and Figure 5 As shown, the first connection state corresponds to the first type of speaker module 220, and the first connection state is: the third end 3 of the speaker attachment 224 is connected to the fourth end 4 of the speaker attachment 224. Figure 6 and Figure 7 As shown, the second connection state corresponds to the second type of speaker module 220. The second connection state is that the third end 3 of the speaker attachment 224 is not connected to the fourth end 4 of the speaker attachment 224. That is to say, the second connection state is that the third end 3 of the speaker attachment 224 is suspended.
[0075] Based on this, the identification process of the speaker module 220 by the processor 210 is as follows: the processor 210 detects the connection status of the third terminal 3 of the speaker attachment 224 through its third terminal 3; if it detects that the third terminal 3 of the speaker attachment 224 is connected to the ground wire GND, the processor 210 determines that the speaker module 220 is the first type of speaker module 220; if it detects that the third terminal 3 of the speaker attachment 224 is suspended, the processor 210 determines that the speaker module 220 is the second type of speaker module 220.
[0076] However, Figure 4 , Figure 6 The speaker module 220 shown requires two ports (i.e., the third port 3 and the fourth port 4 of the speaker sub-board 224) for the processor 210 to recognize the speaker module 220. This results in a high cost for the speaker module 220 and a large area and space occupied in the electronic device 10.
[0077] To address this, this application provides a speaker module, an audio circuit, and an electronic device. The speaker module includes a speaker sub-board, and the connection state of the third terminal of the speaker sub-board differs for speaker modules with different audio performance. Thus, the processor can identify the speaker module by detecting the connection state of the third terminal of the speaker sub-board. Furthermore, this speaker module requires only one port for the processor to identify it, thereby reducing the cost of the speaker module and its footprint and space occupation in the electronic device.
[0078] The speaker module and audio circuit provided in the embodiments of this application will be explained in detail below. In the embodiments of this application, the connection between the two electronic devices is an electrical connection. Here, an electrical connection means that the two electronic devices can transmit electrical signals through the connection. The electrical connection between the two electronic devices can be a direct connection through a wire or an indirect connection through other electronic devices.
[0079] Figure 8 This is a circuit diagram of a speaker module 220 provided in an embodiment of this application. Figure 9 This is a circuit structure diagram of an audio circuit 20 provided in an embodiment of this application, and Figure 9 The speaker module 220 in the audio circuit 20 shown is Figure 8 The speaker module 220 shown. Figure 10 This is a circuit diagram of another speaker module 220 provided in an embodiment of this application. Figure 11 This is a circuit structure diagram of another audio circuit 20 provided in the embodiments of this application, and Figure 11 The speaker module 220 in the audio circuit 20 shown is Figure 10The speaker module 220 is shown. (As shown) Figure 8 and Figure 10 As shown, the speaker module 220 includes a speaker assembly 222 and a speaker attachment 224.
[0080] Speaker assembly 222 is the component in speaker module 220 used to emit sound. Speaker assembly 222 typically includes a magnet for generating a magnetic field and a coil located within the magnetic field. When speaker module 220 is operating, the coil is used to input an audio signal, causing it to vibrate in the magnetic field and emit sound under the drive of the audio signal. Here, speaker assembly 222 has a first signal terminal 1 and a second signal terminal 2. When the audio signal is a Class A or Class B audio signal, the first signal terminal 1 of speaker assembly 222 is used to input a ground signal, and the second signal terminal 2 of speaker assembly 222 is used to input an audio signal, which is an analog signal. When the audio signal is a Class D audio signal, both the first signal terminal 1 and the second signal terminal 2 of speaker assembly 222 are used to input audio signals, and the audio signals input to the first signal terminal 1 and the second signal terminal 2 of speaker assembly 222 are differential pulse signals.
[0081] The speaker mounting plate 224 is a circuit board for mounting the speaker assembly 222; for example, the speaker mounting plate 224 can be a flexible printed circuit (FPC). The speaker mounting plate 224 has a first terminal 1, a second terminal 2, and a third terminal 3. When the speaker assembly 222 is mounted on the speaker mounting plate 224, the first signal terminal 1 of the speaker assembly 222 is connected to the first terminal 1 of the speaker mounting plate 224, and the second signal terminal 2 of the speaker assembly 222 is connected to the second terminal 2 of the speaker mounting plate 224. Figure 9 and Figure 11 As shown, in the audio circuit 20, the first terminal 1 of the speaker attachment 224 is connected to the first terminal 1 of the processor 210, so that the ground signal or audio signal output from the first terminal 1 of the processor 210 can be transmitted to the first signal terminal 1 of the speaker assembly 222 through the first terminal 1 of the speaker attachment 224. The second terminal 2 of the speaker attachment 224 is connected to the second terminal 2 of the processor 210, so that the audio signal output from the second terminal 2 of the processor 210 can be transmitted to the second signal terminal 2 of the speaker assembly 222 through the second terminal 2 of the speaker attachment 224. The third terminal 3 of the speaker attachment 224 is connected to the third terminal 3 of the processor 210, so that the processor 210 can detect the connection status of the third terminal 3 of the speaker attachment 224.
[0082] Here, the connection state of the third end 3 of the speaker attachment 224 includes a first connection state or a second connection state. The first connection state corresponds to the first type of speaker module 220. The first connection state is: the third end 3 of the speaker attachment 224 is connected to the second end 2 of the speaker attachment 224 and the second signal end 2 of the speaker assembly 222. The second connection state corresponds to the second type of speaker module 220. The second connection state is: the third end 3 of the speaker attachment 224 is not connected to the second end 2 of the speaker attachment 224 and the second signal end 2 of the speaker assembly 222. That is, the second connection state is: the third end 3 of the speaker attachment 224 is unconnected.
[0083] In this embodiment, the first speaker module 220 and the second speaker module 220 are two speaker modules 220 with different audio performance. That is, the connection state of the third terminal 3 of the speaker attachment 224 is different for the two speaker modules 220 with different audio performance. Based on this, the processor 210 can identify the two speaker modules 220 by detecting the connection state of the third terminal 3 of the speaker attachment 224. Thus, compared with related technologies, this speaker module 220 only needs one port to realize the identification of the two speaker modules 220.
[0084] Based on the same principle, the speaker auxiliary board 224 can also have more ports to enable the processor 210 to identify more types of speaker modules 220. For example, in some embodiments, the circuit structure of the third speaker module 220 can be as follows: Figure 12 As shown, in this case, the circuit structure of the audio circuit 20 can be as follows: Figure 13 As shown; the circuit structure of the fourth speaker module 220 can be as follows Figure 14 As shown, in this case, the circuit structure of the audio circuit 20 can be as follows: Figure 15 As shown.
[0085] Specifically, such as Figure 12 , Figure 14 As shown, in this embodiment, the speaker attachment 224 also has a fourth terminal 4. The fourth terminal 4 of the speaker attachment 224 is used to connect to the fourth terminal 4 of the processor 210 so that the processor 210 can detect the connection status of the fourth terminal 4 of the speaker attachment 224.
[0086] Here, the connection state of the fourth end 4 of the speaker attachment 224 includes either a third connection state or a fourth connection state. The third connection state corresponds to the third type of speaker module 220. In the third connection state, the fourth end 4 of the speaker attachment 224 is connected to the second end 2 of the speaker attachment 224 and the second signal end 2 of the speaker assembly 222. The fourth connection state corresponds to the fourth type of speaker module 220. In the fourth connection state, the fourth end 4 of the speaker attachment 224 is not connected to the second end 2 of the speaker attachment 224 and the second signal end 2 of the speaker assembly 222. That is, in the fourth connection state, the fourth end 4 of the speaker attachment 224 is unconnected.
[0087] In this embodiment, the third and fourth speaker modules 220 can be two different speaker modules 220 with different audio performances, in addition to the first and second speaker modules 220. Similarly, the connection states of the fourth terminal 4 of the speaker attachment 224 are different for the third and fourth speaker modules 220. Based on this, the processor 210 can identify these two speaker modules 220 by detecting the connection state of the fourth terminal 4 of the speaker attachment 224. Therefore, this speaker module 220 only requires two ports to identify four types of speaker modules 220.
[0088] It is readily understood that in the above embodiments, the processor 210 identifies the first type of speaker module 220 and the second type of speaker module 220 only by detecting the connection status of the third terminal 3 of the speaker attachment 224, and identifies the third type of speaker module 220 and the fourth type of speaker module 220 only by detecting the connection status of the fourth terminal 4 of the speaker attachment 224. In some other embodiments, the processor 210 may also identify more speaker modules 220 by simultaneously detecting the connection status of the third terminal 3 and the fourth terminal 4 of the speaker attachment 224. For example, when the processor 210 detects that the third terminal 3 of the speaker attachment 224 is connected to the second terminal 2 of the speaker attachment 224 and the second signal terminal 2 of the speaker assembly 222, and detects that the fourth terminal 4 of the speaker attachment 224 is connected to the second terminal 2 of the speaker attachment 224 and the second signal terminal 2 of the speaker assembly 222, it determines that the speaker module 220 is the fifth type of speaker module 220, which will not be elaborated further.
[0089] It should be noted that, in the above embodiments, for ease of understanding, a processor 210 is introduced to describe the circuit structure of the speaker module 220 provided in this application embodiment. In fact, the speaker module 220 provided in this application embodiment does not include the processor 210. That is, the processor 210 exists as an environmental element relative to the speaker module 220, and its existence should not be construed as a limitation on the speaker module 220 provided in this application embodiment.
[0090] This application embodiment also provides an audio circuit 20, including a processor 210 and a speaker module 220 as described in any of the above embodiments. That is, the circuit structure of the audio circuit 20 can be as follows: Figure 9 , Figure 11 , Figure 13 , Figure 15 As shown. The first terminal 1 of processor 210 is connected to the first terminal 1 of speaker attachment 224. Alternatively, the first terminal 1 of processor 210 is connected to the first signal terminal 1 of speaker assembly 222 via the first terminal 1 of speaker attachment 224. The second terminal 2 of processor 210 is connected to the second terminal 2 of speaker attachment 224. Alternatively, the second terminal 2 of processor 210 is connected to the second signal terminal 2 of speaker assembly 222 via the second terminal 2 of speaker attachment 224. Processor 210 can be a device with data processing capabilities in electronic device 10. For example, processor 210 can be a central processing unit (CPU), system-on-chip (SOC), or other micro control unit (MCU). When processor 210 is operating, the first terminal 1 of processor 210 is used to transmit audio signals or ground signals to the first signal terminal 1 of speaker assembly 222, and the second terminal 2 of processor 210 is used to transmit audio signals to the second signal terminal 2 of speaker assembly 222.
[0091] In some embodiments, based on Figure 9 and Figure 11 The audio circuit 20 shown can identify the first speaker module 220 and the second speaker module 220 by executing the following steps S110 to S130.
[0092] S110, the processor 210 transmits an audio signal to the second signal terminal 2 of the speaker assembly 222.
[0093] The processor 210 outputs an audio signal at its second terminal 2, which is transmitted to the second signal terminal 2 of the speaker assembly 222 via the second terminal 2 of the speaker attachment 224. This audio signal can be a Class A, Class B, or Class D audio signal. It can also be a signal that drives the speaker assembly 222 to emit any sound or silence.
[0094] S120, if a preset signal is detected at the third terminal 3 of the processor 210, the processor 210 determines that the speaker module 220 is the first type of speaker module 220.
[0095] S130, if no preset signal is detected at the third terminal 3 of the processor 210, the processor 210 determines that the speaker module 220 is the second type of speaker module 220.
[0096] Steps S120 and S130 are two parallel steps, and the processor 210 needs to execute either step S120 or step S130 while executing step S110. The preset signal can be an electrical signal with a preset waveform set by those skilled in the art based on the waveform of the audio signal. The preset signal needs to be obtained directly or by transformation from the audio signal. Therefore, when executing step S110, if the third terminal 3 of the processor 210 detects the preset signal, it indicates that the third terminal 3 of the speaker attachment 224 is connected to the second terminal 2 of the speaker attachment 224 and the second signal terminal 2 of the speaker assembly 222. In this case, the processor 210 can determine that the speaker module 220 is a first type of speaker module 220. Conversely, when executing step S110, if the third terminal 3 of the processor 210 does not detect the preset signal, it indicates that the third terminal 3 of the speaker attachment 224 is not connected to the second terminal 2 of the speaker attachment 224 and the second signal terminal 2 of the speaker assembly 222. In this case, the processor 210 can determine that the speaker module 220 is a second type of speaker module 220.
[0097] Similarly, based on Figure 13 and Figure 15 The audio circuit 20 shown, when executing step S110, the processor 210 can also identify the third speaker module 220 and the fourth speaker module 220 by executing the following steps S140 and S150.
[0098] S140, if a preset signal is detected at the fourth terminal 4 of the processor 210, the processor 210 determines that the speaker module 220 is a third type of speaker module 220.
[0099] S150, if no preset signal is detected at the fourth terminal 4 of the processor 210, the processor 210 determines that the speaker module 220 is the fourth type of speaker module 220.
[0100] When executing step S110, if the fourth terminal 4 of the processor 210 detects a preset signal, it indicates that the fourth terminal 4 of the speaker attachment 224 is connected to the second terminal 2 of the speaker attachment 224 and the second signal terminal 2 of the speaker assembly 222. In this case, the processor 210 can determine that the speaker module 220 is a third type of speaker module 220. Conversely, when executing step S110, if the fourth terminal 4 of the processor 210 does not detect the preset signal, it indicates that the fourth terminal 4 of the speaker attachment 224 is not connected to the second terminal 2 of the speaker attachment 224 and the second signal terminal 2 of the speaker assembly 222. In this case, the processor 210 can determine that the speaker module 220 is a fourth type of speaker module 220.
[0101] The audio circuit 20 provided in the embodiments of this application will be further explained below with reference to the accompanying drawings, from three possible implementation methods.
[0102] I. The first possible implementation method.
[0103] Figure 16 This is a circuit structure diagram of another audio circuit 20 provided in the embodiments of this application. For example... Figure 16 As shown, in some embodiments, the audio circuit 20 further includes a first voltage divider unit 232. The first voltage divider unit 232 is connected between the third terminal 3 of the speaker sub-plate 224 and the third terminal 3 of the processor 210.
[0104] Specifically, the first voltage divider unit 232 has a first terminal 1, a second terminal 2, and a third terminal 3. The first terminal 1 of the first voltage divider unit 232 is connected to the third terminal 3 of the speaker sub-plate 224. The second terminal 2 of the first voltage divider unit 232 is connected to the third terminal 3 of the processor 210. The third terminal 3 of the first voltage divider unit 232 is connected to ground GND. The voltage at the second terminal 2 of the first voltage divider unit 232 is less than the voltage at the first terminal 1 of the first voltage divider unit 232, and the voltage at the second terminal 2 of the first voltage divider unit 232 is greater than the voltage at the third terminal 3 of the first voltage divider unit 232. Furthermore, the voltage at the second terminal 2 of the first voltage divider unit 232 is positively correlated with the voltage at the first terminal 1 of the first voltage divider unit 232.
[0105] For example, the circuit structure of audio circuit 20 can be as follows: Figure 17 As shown. In this case, the first voltage divider unit 232 includes a first resistor R1 and a second resistor R2. Both the first resistor R1 and the second resistor R2 are voltage divider resistors. The first end of the first resistor R1 is connected to the third end 3 of the speaker sub-plate 224. The second end of the first resistor R1 is connected to the first end of the second resistor R2 and the third end 3 of the processor 210. The second end of the second resistor R2 is connected to ground GND. It is readily understood that in some other embodiments, the first voltage divider unit 232 may also include more resistors connected in series or in parallel.
[0106] In this embodiment, when the audio signal voltage is relatively high, and the third terminal 3 of the speaker sub-plate 224 is connected to the second terminal 2 of the speaker sub-plate 224 and the second signal terminal 2 of the speaker assembly 222, the first voltage divider unit 232 can divide the audio signal voltage to a range suitable for the input voltage of the third terminal 3 of the processor 210, thereby protecting the processor 210. For example, in some specific embodiments, if the audio signal voltage is approximately 10V, and the maximum input voltage of the third terminal 3 of the processor 210 is approximately 1.8V, then the ratio of the resistance of the first resistor R1 to the resistance of the second resistor R2 can be five to one. For example, the resistance of the first resistor R1 can be 10KΩ, and the resistance of the second resistor R2 can be 2KΩ. In this case, when the audio signal voltage is 10V, the voltage input to the third terminal 3 of the processor 210 is approximately 1.67V.
[0107] In this possible implementation, the audio signal can be a Class D audio signal. In this case, the first terminal 1 of the processor 210 is also used to transmit the audio signal to the first signal terminal 1 of the speaker assembly 222, and the audio signal output from the first terminal 1 and the second terminal 2 of the processor 210 is a differential pulse signal. Based on this, when the second terminal 2 of the processor 210 transmits the audio signal to the second signal terminal 2 of the speaker assembly 222, and as... Figure 17 As shown, when the third terminal 3 of the speaker attachment 224 is connected to the second terminal 2 of the speaker attachment 224 and the second signal terminal 2 of the speaker assembly 222, the third terminal 3 of the processor 210 can detect as follows: Figure 18 The square wave signal shown is used here. The preset signal is... Figure 18 The square wave signal shown. At this time, the processor 210 determines that the speaker module 220 is the first type of speaker module 220. Conversely, when the second terminal 2 of the processor 210 transmits an audio signal to the second signal terminal 2 of the speaker assembly 222, and as shown... Figure 19 As shown, when the third terminal 3 of the speaker attachment 224 is not connected to the second terminal 2 of the speaker attachment 224 or the second signal terminal 2 of the speaker assembly 222, the third terminal 3 of the processor 210 is only connected to the ground line GND through the second resistor R2. In this case, the third terminal 3 of the processor 210 will detect a stable low-level signal (no preset signal detected). At this time, the processor 210 determines that the speaker module 220 is the second type of speaker module 220.
[0108] In this possible implementation, the audio signal can also be a Class A audio signal or a Class B audio signal. In this case, the first terminal 1 of the processor 210 is used to transmit a ground signal to the first signal terminal 1 of the speaker assembly 222, and the second terminal 2 of the processor 210 is used to transmit an audio signal, which is an analog signal, to the second signal terminal 2 of the speaker assembly 222. Based on this, when the second terminal 2 of the processor 210 transmits an audio signal to the second signal terminal 2 of the speaker assembly 222, and as... Figure 17 As shown, when the third terminal 3 of the speaker attachment 224 is connected to the second terminal 2 of the speaker attachment 224 and the second signal terminal 2 of the speaker assembly 222, the third terminal 3 of the processor 210 can detect a continuous analog signal, such as a sine wave analog signal. Here, the preset signal is a continuous analog signal. At this time, the processor 210 determines that the speaker module 220 is a first type of speaker module 220. Conversely, when the second terminal 2 of the processor 210 transmits an audio signal to the second signal terminal 2 of the speaker assembly 222, and as shown... Figure 19 As shown, when the third terminal 3 of the speaker attachment 224 is not connected to the second terminal 2 of the speaker attachment 224 or the second signal terminal 2 of the speaker assembly 222, the third terminal 3 of the processor 210 is connected to ground GND through the second resistor R2. In this case, the third terminal 3 of the processor 210 will detect a stable low-level signal (no preset signal detected). At this time, the processor 210 determines that the speaker module 220 is the second type of speaker module 220.
[0109] In some embodiments, when the speaker sub-plate 224 also has a fourth terminal 4, and the processor 210 has a fourth terminal 4, such as Figure 20 and Figure 21 As shown, a second voltage divider unit 234 can also be connected between the fourth terminal 4 of the speaker auxiliary plate 224 and the fourth terminal 4 of the processor 210. The second voltage divider unit 234 may include a fourth resistor R4 and a fifth resistor R5, which will not be described in detail here. In this case, corresponding to the third type of speaker module 220, the circuit structure of the audio circuit 20 can be as follows: Figure 20 As shown; corresponding to the fourth type of speaker module 220, the circuit structure of the audio circuit 20 can be as follows: Figure 21 As shown.
[0110] II. The second possible implementation method.
[0111] Figure 22 This is a circuit structure diagram of another audio circuit 20 provided in the embodiments of this application. For example... Figure 22 As shown, in some embodiments, the audio circuit 20 further includes a first filtering unit 242. The first filtering unit 242 is connected between the third terminal 3 of the speaker sub-plate 224 and the third terminal 3 of the processor 210.
[0112] Specifically, the first filtering unit 242 has a first terminal 1 and a second terminal 2. The first terminal 1 of the first filtering unit 242 is connected to the third terminal 3 of the speaker sub-plate 224. The second terminal 2 of the first filtering unit 242 is connected to the third terminal 3 of the processor 210. The first filtering unit 242 is used to filter the electrical signal transmitted from the third terminal 3 of the speaker sub-plate 224 to the third terminal 3 of the processor 210, so that when the third terminal 3 of the speaker sub-plate 224 has a fluctuating electrical signal, the third terminal 3 of the processor 210 can detect a smooth level signal.
[0113] For example, the circuit structure of audio circuit 20 can be as follows: Figure 23 As shown. In this case, the first filter unit 242 includes a third resistor R3 and a first capacitor C1. The first end of the third resistor R3 is connected to the third terminal 3 of the speaker mounting plate 224. The second end of the third resistor R3 is connected to the first plate of the first capacitor C1 and the third terminal 3 of the processor 210. The second plate of the first capacitor C1 is connected to ground GND. It is readily understood that in some other embodiments, the first filter unit 242 may also include more resistors and capacitors connected in series or in parallel.
[0114] In this embodiment, the third resistor R3 is a current-limiting resistor, used to prevent excessive waste of audio signals transmitted between the second terminal 2 of the processor 210 and the second signal terminal 2 of the speaker assembly 222 when the third terminal 3 of the speaker sub-board 224 is connected to the second terminal 2 of the speaker sub-board 224 and the second signal terminal 2 of the speaker assembly 222, through the third resistor R3 and the first capacitor C1 to ground GND. Therefore, the third resistor R3 can be a resistor with a relatively large resistance. For example, the resistance of the third resistor R3 can be 10KΩ. The first capacitor C1 is a filter capacitor, used to filter fluctuating electrical signals into smooth level signals.
[0115] In this possible implementation, the audio signal can be a Class D audio signal. In this case, the first terminal 1 of the processor 210 is also used to transmit the audio signal to the first signal terminal 1 of the speaker assembly 222, and the audio signal output from the first terminal 1 and the second terminal 2 of the processor 210 is a differential pulse signal. Based on this, when the second terminal 2 of the processor 210 transmits the audio signal to the second signal terminal 2 of the speaker assembly 222, and as... Figure 23 As shown, when the third terminal 3 of the speaker sub-plate 224 is connected to the second terminal 2 of the speaker sub-plate 224 and the second signal terminal 2 of the speaker assembly 222, the third terminal 3 of the processor 210 can detect a high-level signal, which is obtained after filtering the audio signal. Here, the preset signal is the high-level signal. At this time, the processor 210 determines that the speaker module 220 is the first type of speaker module 220. Conversely, when the second terminal 2 of the processor 210 transmits an audio signal to the second signal terminal 2 of the speaker assembly 222, and as shown... Figure 24 As shown, when the third terminal 3 of the speaker attachment 224 is not connected to the second terminal 2 of the speaker attachment 224 or the second signal terminal 2 of the speaker assembly 222, the third terminal 3 of the processor 210 is only connected to the ground line GND through the first capacitor C1. In this case, the third terminal 3 of the processor 210 will detect a stable low-level signal (no preset signal detected). At this time, the processor 210 determines that the speaker module 220 is the second type of speaker module 220.
[0116] In this possible implementation, the audio signal can also be a Class A audio signal or a Class B audio signal. In this case, the first terminal 1 of the processor 210 is used to transmit a ground signal to the first signal terminal 1 of the speaker assembly 222, and the second terminal 2 of the processor 210 is used to transmit an audio signal, which is an analog signal, to the second signal terminal 2 of the speaker assembly 222. Based on this, when the second terminal 2 of the processor 210 transmits an audio signal to the second signal terminal 2 of the speaker assembly 222, and as... Figure 23 As shown, when the third terminal 3 of the speaker sub-plate 224 is connected to the second terminal 2 of the speaker sub-plate 224 and the second signal terminal 2 of the speaker assembly 222, the third terminal 3 of the processor 210 can detect a high-level signal, which is obtained after filtering the audio signal. Here, the preset signal is the high-level signal. At this time, the processor 210 determines that the speaker module 220 is the first type of speaker module 220. Conversely, when the second terminal 2 of the processor 210 transmits an audio signal to the second signal terminal 2 of the speaker assembly 222, and as shown... Figure 24 As shown, when the third terminal 3 of the speaker attachment 224 is not connected to the second terminal 2 of the speaker attachment 224 or the second signal terminal 2 of the speaker assembly 222, the third terminal 3 of the processor 210 is only connected to the ground line GND through the first capacitor C1. In this case, the third terminal 3 of the processor 210 will detect a stable low-level signal (no preset signal detected). At this time, the processor 210 determines that the speaker module 220 is the second type of speaker module 220.
[0117] In some embodiments, when the speaker sub-plate 224 also has a fourth terminal 4, and the processor 210 has a fourth terminal 4, such as Figure 25 and Figure 26 As shown, a second filter unit 244 can also be connected between the fourth terminal 4 of the speaker auxiliary board 224 and the fourth terminal 4 of the processor 210. The second filter unit 244 may include a sixth resistor R6 and a second capacitor C2, which will not be described in detail here. In this case, corresponding to the third type of speaker module 220, the circuit structure of the audio circuit 20 can be as follows: Figure 25 As shown; corresponding to the fourth type of speaker module 220, the circuit structure of the audio circuit 20 can be as follows: Figure 26 As shown.
[0118] III. The third possible implementation method.
[0119] Figure 27 This is a circuit structure diagram of another audio circuit 20 provided in the embodiments of this application. For example... Figure 27 As shown, in some embodiments, the audio circuit 20 further includes a first comparison unit 252. The first comparison unit 252 is connected between the third terminal 3 of the speaker sub-plate 224 and the third terminal 3 of the processor 210.
[0120] Specifically, the first comparison unit 252 has a first input terminal 1, a second input terminal 2, and an output terminal 3. The first input terminal 1 of the first comparison unit 252 is connected to the third terminal 3 of the speaker auxiliary plate 224. The second input terminal 2 of the first comparison unit 252 is connected to ground (GND). The output terminal 3 of the first comparison unit 252 is connected to the third terminal 3 of the processor 210. The first comparison unit 252 is used to compare the voltage of its first input terminal 1 with the voltage of its second input terminal 2. When the voltage of the first input terminal 1 of the first comparison unit 252 is greater than the voltage of the second input terminal 2, the output terminal 3 of the first comparison unit 252 outputs a high-level signal; when the voltage of the first input terminal 1 of the first comparison unit 252 is less than or equal to the voltage of the second input terminal 2, the output terminal 3 of the first comparison unit 252 outputs a low-level signal.
[0121] For example, the circuit structure of audio circuit 20 can be as follows: Figure 28 As shown. In this case, the first comparison unit 252 includes a first comparator U1. The non-inverting input terminal of the first comparator U1 (represented by the symbol "+" in the figure) is connected to the third terminal 3 of the speaker auxiliary plate 224. The inverting input terminal of the first comparator U1 (represented by the symbol "-" in the figure) is connected to ground GND. The output terminal of the first comparator U1 is connected to the third terminal 3 of the processor 210. It is readily understood that in some other embodiments, the first comparison unit 252 may also include resistors connected to the non-inverting input terminal, the inverting input terminal, and the output terminal of the first comparator U1, etc., which will not be described in detail here.
[0122] In this possible implementation, the audio signal can be a Class D audio signal. In this case, the first terminal 1 of the processor 210 is also used to transmit the audio signal to the first signal terminal 1 of the speaker assembly 222, and the audio signal output from the first terminal 1 and the second terminal 2 of the processor 210 is a differential pulse signal. The voltage of this pulse signal is always greater than the voltage of the ground line GND. Based on this, when the second terminal 2 of the processor 210 transmits the audio signal to the second signal terminal 2 of the speaker assembly 222, and as... Figure 28As shown, when the third terminal 3 of the speaker sub-plate 224 is connected to the second terminal 2 of the speaker sub-plate 224 and the second signal terminal 2 of the speaker assembly 222, the third terminal 3 of the processor 210 can detect a high-level signal, which is obtained by comparing the audio signal with the ground voltage. Here, the preset signal is the high-level signal. At this time, the processor 210 determines that the speaker module 220 is the first type of speaker module 220. Conversely, when the second terminal 2 of the processor 210 transmits an audio signal to the second signal terminal 2 of the speaker assembly 222, and as shown... Figure 29 As shown, when the third terminal 3 of the speaker attachment 224 is not connected to the second terminal 2 of the speaker attachment 224 or the second signal terminal 2 of the speaker assembly 222, the third terminal 3 of the processor 210 will detect a stable low-level signal (no preset signal detected). At this time, the processor 210 determines that the speaker module 220 is the second type of speaker module 220.
[0123] In this possible implementation, the audio signal can also be a Class A audio signal or a Class B audio signal. In this case, the first terminal 1 of the processor 210 is used to transmit a ground signal to the first signal terminal 1 of the speaker assembly 222; the second terminal 2 of the processor 210 is used to transmit an audio signal to the second signal terminal 2 of the speaker assembly 222. This audio signal is an analog signal, and the voltage of this audio signal is always greater than the voltage of the ground line GND. Based on this, when the second terminal 2 of the processor 210 transmits an audio signal to the second signal terminal 2 of the speaker assembly 222, and as... Figure 28 As shown, when the third terminal 3 of the speaker sub-plate 224 is connected to the second terminal 2 of the speaker sub-plate 224 and the second signal terminal 2 of the speaker assembly 222, the third terminal 3 of the processor 210 can detect a high-level signal, which is obtained by comparing the audio signal with the ground voltage. Here, the preset signal is the high-level signal. At this time, the processor 210 determines that the speaker module 220 is the first type of speaker module 220. Conversely, when the second terminal 2 of the processor 210 transmits an audio signal to the second signal terminal 2 of the speaker assembly 222, and as shown... Figure 29 As shown, when the third terminal 3 of the speaker attachment 224 is not connected to the second terminal 2 of the speaker attachment 224 or the second signal terminal 2 of the speaker assembly 222, the third terminal 3 of the processor 210 will detect a stable low-level signal (no preset signal detected). At this time, the processor 210 determines that the speaker module 220 is the second type of speaker module 220.
[0124] In some embodiments, when the speaker sub-plate 224 also has a fourth terminal 4, and the processor 210 has a fourth terminal 4, such as Figure 30 and Figure 31As shown, a second comparison unit 254 can also be connected between the fourth terminal 4 of the speaker auxiliary plate 224 and the fourth terminal 4 of the processor 210. The second comparison unit 254 may include a second comparator U2, which will not be described in detail here. In this case, corresponding to the third type of speaker module 220, the circuit structure of the audio circuit 20 can be as follows: Figure 30 As shown; corresponding to the fourth type of speaker module 220, the circuit structure of the audio circuit 20 can be as follows: Figure 31 As shown.
[0125] It is readily understood that the three different implementation methods described above can be combined to obtain more implementation methods. For example, in some embodiments, such as Figure 32 As shown, the third terminal 3 of the speaker auxiliary plate 224 can be connected to the third terminal 3 of the processor 210 via the first voltage divider unit 232 and the first comparison unit 252; or, as shown... Figure 33 As shown, the third terminal 3 of the speaker auxiliary plate 224 can be connected to the third terminal 3 of the processor 210 via the first filter unit 242 and the first comparison unit 252. In some other embodiments, such as Figure 34 As shown, the third terminal 3 of the speaker sub-plate 224 can also be connected to the third terminal 3 of the processor 210 via the first voltage divider unit 232 and the first filter unit 242. Those skilled in the art can devise various possible embodiments based on the above-described embodiments, all of which should be understood as falling within the protection scope of the embodiments of this application.
[0126] The speaker module 220 and audio circuit 20 provided in this application embodiment have at least the following beneficial effects: (1) For two speaker modules 220 with different audio performance, the connection state of the third terminal 3 of the speaker attachment 224 is different. Based on this, the processor 210 can identify the two speaker modules 220 by detecting the connection state of the third terminal 3 of the speaker attachment 224. (2) Compared with related technologies, the speaker module 220 only needs one port (the third terminal 3 of the speaker attachment 224) to realize the identification of the two speaker modules 220, which can save one port on the speaker module 220. (3) The speaker module 220 and the processor 210 usually need to be installed on a printed circuit board (PCB) to achieve the connection between the two through the wires in the PCB. Among them, the port on the speaker module 220 needs to be connected to the PCB through a connector (such as a spring). Therefore, in the case of saving one port on the speaker module 220, one connector can also be saved. (4) By saving one port on the speaker module 220, the area occupied by the speaker module 220 on the printed circuit board can be reduced. (5) By saving one port on the speaker module 220, the cavity volume of the speaker module 220 occupied by the port can be reduced, and the saved cavity volume can be used to increase the acoustic cavity volume of the speaker module 220, which is beneficial to improving the low frequency performance of the speaker module 220.
[0127] This application also provides an electronic device 10, including a processor 210 and a speaker module 220 as described in any of the above embodiments. The electronic device 10 may further include a printed circuit board, on which both the processor 210 and the speaker module 220 are mounted, and the processor 210 is connected to the speaker module 220 through traces in the printed circuit board.
[0128] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.
Claims
1. An audio circuit, characterized in that, The audio circuit includes a processor and a speaker module; The speaker module includes a speaker assembly and a speaker sub-plate; The first end of the speaker sub-plate is connected to the first end of the processor and the first signal end of the speaker assembly; the second end of the speaker sub-plate is connected to the second end of the processor and the second signal end of the speaker assembly, wherein the second end of the processor is used to transmit audio signals to the second signal end of the speaker assembly; the third end of the processor is connected to the third end of the speaker sub-plate. The connection state of the third end of the speaker sub-plate includes either a first connection state or a second connection state. The first connection state corresponds to the first type of speaker module, and the first connection state is: the third end of the speaker attachment is connected to the second end of the speaker attachment; The second connection state corresponds to the second type of speaker module, and the second connection state is: the third end of the speaker attachment is not connected to the second end of the speaker attachment.
2. The audio circuit as described in claim 1, characterized in that, The processor is used for: Transmit audio signals to the second signal terminal of the speaker assembly; If a preset signal is detected at the third terminal of the processor, the speaker module is determined to be the first type of speaker module. If no preset signal is detected at the third terminal of the processor, the speaker module is determined to be the second type of speaker module.
3. The audio circuit as described in claim 2, characterized in that, The audio circuit also includes: a voltage divider unit; The first end of the voltage divider unit is connected to the third end of the speaker sub-plate, the second end of the voltage divider unit is connected to the third end of the processor, and the third end of the voltage divider unit is connected to the ground wire; the voltage at the second end of the voltage divider unit is less than the voltage at the first end of the voltage divider unit, and the voltage at the second end of the voltage divider unit is positively correlated with the voltage at the first end of the voltage divider unit.
4. The audio circuit as described in claim 3, characterized in that, The voltage divider unit includes: a first resistor and a second resistor; The first end of the first resistor is connected to the third end of the speaker sub-plate, the second end of the first resistor is connected to the first end of the second resistor and the third end of the processor, and the second end of the second resistor is connected to the ground wire.
5. The audio circuit as described in claim 3 or 4, characterized in that, The audio signal is a pulse signal, and the preset signal is a square wave signal.
6. The audio circuit as described in any one of claims 2 to 4, characterized in that, The audio circuit also includes: a filtering unit; The first end of the filtering unit is connected to the third end of the speaker sub-board, and the second end of the filtering unit is connected to the third end of the processor.
7. The audio circuit as described in claim 6, characterized in that, The filtering unit includes: a third resistor and a first capacitor; The first end of the third resistor is connected to the third end of the speaker plate, the second end of the third resistor is connected to the first plate of the first capacitor and the third end of the processor, and the second plate of the first capacitor is connected to the ground wire.
8. The audio circuit as described in claim 6 or 7, characterized in that, The audio signal is a pulse signal, and the preset signal is a high-level signal.
9. The audio circuit as described in any one of claims 2 to 4, 6 to 7, characterized in that, The audio circuit further includes: a comparison unit; The first input terminal of the comparison unit is connected to the third terminal of the speaker sub-board, the second input terminal of the comparison unit is connected to the ground wire, and the output terminal of the comparison unit is connected to the third terminal of the processor; when the voltage of the first input terminal of the comparison unit is greater than the voltage of the second input terminal of the comparison unit, the output terminal of the comparison unit outputs a high-level signal.
10. The audio circuit as described in claim 9, characterized in that, The comparison unit includes: a comparator; The non-inverting input of the comparator is connected to the third terminal of the speaker sub-board, the inverting input of the comparator is connected to the ground wire, and the output of the comparator is connected to the third terminal of the processor.
11. The audio circuit as described in claim 10, characterized in that, The audio signal is a pulse signal or an analog signal, and the preset signal is a high-level signal.
12. The audio circuit as described in any one of claims 1 to 11, characterized in that, The fourth terminal of the processor is connected to the fourth terminal of the speaker sub-plate; The connection state of the fourth end of the speaker sub-plate includes either the third connection state or the fourth connection state. The third connection state corresponds to the third type of speaker module, and the third connection state is: the fourth end of the speaker attachment is connected to the second end of the speaker attachment; The fourth connection state corresponds to the fourth type of speaker module. The fourth connection state is that the fourth end of the speaker attachment is not connected to the second end of the speaker attachment.
13. A loudspeaker module, characterized in that, The speaker module includes a speaker assembly and a speaker sub-plate; The first signal terminal of the speaker assembly is connected to the first end of the speaker sub-plate, and the second signal terminal of the speaker assembly is connected to the second end of the speaker sub-plate. The second signal terminal of the speaker assembly is used to input audio signals. The third end of the speaker sub-plate is used to connect to the third end of the processor; The connection state of the third end of the speaker sub-plate includes either a first connection state or a second connection state. The first connection state corresponds to the first type of speaker module, and the first connection state is: the third end of the speaker attachment is connected to the second end of the speaker attachment; The second connection state corresponds to the second type of speaker module, and the second connection state is: the third end of the speaker attachment is not connected to the second end of the speaker attachment.
14. The speaker module as described in claim 13, characterized in that, The fourth end of the speaker sub-plate is used to connect to the fourth end of the processor; The connection state of the fourth end of the speaker sub-plate includes either the third connection state or the fourth connection state. The third connection state corresponds to the third type of speaker module, and the third connection state is: the fourth end of the speaker attachment is connected to the second end of the speaker attachment; The fourth connection state corresponds to the fourth type of speaker module. The fourth connection state is that the fourth end of the speaker attachment is not connected to the second end of the speaker attachment.
15. An electronic device, characterized in that, The electronic device includes the audio circuitry as described in any one of claims 1 to 12, or the electronic device includes a processor and a speaker module as described in claim 13 or 14.