Integrated pretreatment equipment for wafers before warehousing

Abstract

The invention discloses integrated wafer pre-processing equipment before warehousing, which comprises a rack, a dust removal mechanism, a defect detection device and a conveying mechanism, and is characterized in that the rack is internally provided with an upper layer, a middle layer and a lower layer from top to bottom; the dust removal mechanism, the defect detection device and the conveying mechanism are arranged on the upper layer, the middle layer and the lower layer correspondingly, traditional planar or scattered arrangement is replaced, the horizontal and vertical occupied space of equipment is greatly reduced, and the integration degree of the equipment is improved; meanwhile, the defect detection device adopts a reflective imaging system in which a reflector is matched with a camera, and the camera does not need to be arranged over against the wafer, so that the space utilization rate is further optimized; besides, by means of the dust removal mechanism with the upper layer arranged downwards, dust and impurities on the surfaces of the wafers can be synchronously blown in the process that the conveying mechanism receives and transfers the wafers, and linkage operation of transferring and cleaning is achieved. And the wafer is prevented from carrying pollutants to enter the subsequent processing equipment, so that the processing precision of the subsequent process can be ensured, and the processing yield of the wafer is improved.

Description

Technical Field

[0001] This application relates to the field of wafer preprocessing technology, and in particular to an integrated wafer preprocessing device before it enters the wafer warehouse. Background Technology

[0002] Before processing steps such as etching and coating, wafers need to undergo dust removal and defect detection. If untreated wafers are directly fed into the processing equipment, the dust and impurities attached to their surfaces will not only affect the processing accuracy of subsequent processes, but also easily cause contamination of the equipment chamber. At the same time, dust obstruction can lead to misjudgment of defects, thereby reducing the yield of wafer processing.

[0003] In existing technologies, there is often a lack of dedicated integrated pre-processing equipment before wafers enter the process warehouse. Dust removal and defect detection are mostly decentralized operations without synchronous linkage pre-processing steps, making it difficult to complete cleaning during wafer transfer and resulting in low pre-processing efficiency. Even if a simple pre-processing structure is set up, it is mostly a planar layout, with dust removal, detection and conveying mechanisms stacked on the same plane, occupying a large amount of horizontal and vertical space. The equipment integration is low and cannot adapt to the compact layout requirements of wafer processing production lines.

[0004] In addition, traditional wafer defect inspection often uses a camera to take pictures of the wafer directly, which requires a lot of vertical installation space, further exacerbating the problem of low equipment space utilization. Moreover, without real-time dust removal before inspection, dust on the wafer surface can easily cause blurry inspection images, ultimately affecting the accuracy of inspection. Summary of the Invention

[0005] The purpose of this application is to overcome the shortcomings of the existing technology and provide an integrated pre-processing device for wafers before they enter the warehouse.

[0006] This application provides an integrated wafer pre-processing equipment, comprising: a rack with a three-layer structure, consisting of an upper layer, a middle layer, and a lower layer from top to bottom; a dust removal mechanism located on the upper layer, with its air outlet facing downwards to blow airflow to the middle and lower layers; a defect detection device located on the middle layer, comprising a reflector and a camera, the reflector being tilted to reflect the image of the wafer at the inspection station into the camera's field of view; and a conveying mechanism located on the lower layer, which connects to the feeding device. The conveying mechanism can pick up wafers from the feeding device and transfer them to the inspection station. During the process of the conveying mechanism picking up and transferring wafers, the dust removal mechanism operates to blow away dust and impurities adhering to the wafer surface, thereby improving the accuracy of defect detection.

[0007] Furthermore, the conveying mechanism delivers the wafer along a first horizontal direction, and the dust removal mechanism includes multiple air nozzles arranged in one or more rows along a second horizontal direction. The first horizontal direction, the second horizontal direction, and the vertical direction are perpendicular to each other. The distribution length of one row of air nozzles in the second horizontal direction is not less than the diameter of the wafer, so as to achieve comprehensive cleaning of the wafer surface during wafer movement. And / or, the dust removal mechanism includes a first set of nozzles and a second set of nozzles. The air blowing direction of the first set of nozzles is inclined toward the material feeding direction of the conveying mechanism delivering the wafer, so as to form a reverse airflow against the wafer movement direction. The air blowing direction of the second set of nozzles is inclined toward the direction of the conveying mechanism delivering the wafer, so as to form a forward airflow along the wafer movement direction. And / or, the air outlet angle of the air nozzles of the dust removal mechanism is adjustable. And / or, the air nozzles of the dust removal mechanism are flat wide-angle nozzles or wide-angle circular nozzles.

[0008] Furthermore, the middle layer is equipped with a dust isolation hood, and the defect detection device is located inside the dust isolation hood; the top of the dust isolation hood is open to allow the blowing airflow of the dust removal mechanism to enter the hood; the bottom or lower part of the side wall of the dust isolation hood is equipped with an air extraction port, which is connected to an external negative pressure system; the side wall of the dust isolation hood is equipped with a wafer passage port, and the inner wall of the wafer passage port is equipped with air holes, which are connected to an air source. By blowing air through the air holes, an air curtain can be formed at the wafer passage port, which can both target the cleaning of the wafer and prevent the exchange of dust between the inside and outside of the hood.

[0009] Furthermore, the transfer mechanism includes a receiving element for supporting the wafer; the surface of the receiving element is recessed downward to form a step that can limit the wafer, and the limiting wall of the step is provided with a first auxiliary vent, which is connected to a negative pressure system to extract air from the wafer nearby, thereby ensuring the surface of the wafer is clean.

[0010] Furthermore, the transfer mechanism also includes a circumferential blowing mechanism, which includes: an air blowing module rotatably mounted on the receiving component; and a rotation drive module for driving the air blowing module to make circumferential motion around the receiving component. During the process of the receiving component picking up and transferring the wafer, the air blowing module blows air toward the wafer, and the rotation drive module drives the air blowing module to rotate around the wafer at least once to thoroughly clean the wafer, thereby ensuring the surface of the wafer is clean.

[0011] Furthermore, the transfer mechanism integrates an auxiliary preprocessing module, which includes an alignment and calibration component and / or a weight sensor, for physically aligning and / or weighing the wafer after the transfer mechanism acquires the wafer.

[0012] Furthermore, the defect detection device also includes a light source assembly, which is arranged around the detection station or placed beside the reflector to provide a uniform illumination path. The optical axis of the illumination path is angled to the acquisition optical axis of the camera to prevent the reflected light from directly entering the camera. And / or, the reflector is equipped with a heating element to maintain the temperature of the reflector above the ambient dew point, thereby preventing fogging on the surface of the reflector. And / or, the reflector is covered with an anti-fog coating, which can change the wetting characteristics of the mirror surface to prevent fog formation. And / or, micro-positive pressure air curtain nozzles connected to an air source are arranged around the mirror surface to form an air curtain on the mirror surface, thereby preventing dust adhesion and fog condensation.

[0013] Furthermore, the defect detection device also includes: a reflector adjustment mechanism, which includes a rotation adjustment component, a telescopic adjustment component, and a lifting adjustment component. The rotation adjustment component is used to adjust the tilt angle of the reflector, and the telescopic adjustment component and the lifting adjustment component are used to adjust the relative position of the reflector and the inspection station. By adjusting the position of the reflector through the reflector adjustment mechanism, it can be ensured that the reflector completely reflects the wafer image; and / or a camera adjustment structure, which adjusts the position of the camera to ensure that the camera completely acquires the reflected image from the reflector.

[0014] Furthermore, the defect detection device is equipped with a qualified wafer channel and a defective wafer channel. Wafers that pass the inspection are output through the qualified wafer channel, and wafers that fail are output through the defective wafer channel. A lifting pin is installed at the inspection station to support the wafer. A waste wafer conveying mechanism is installed at the defective wafer channel. When the defect detection device determines that a wafer is defective, the lifting pin carries the defective wafer down until it falls onto the waste wafer conveying mechanism. The waste wafer conveying mechanism can transfer the defective wafer downstream, and the lifting pin resets to support the next wafer to be inspected.

[0015] Furthermore, the middle layer also integrates an auxiliary process module located after the defect detection device. The auxiliary process module is used to perform further auxiliary processing on the wafers that pass the inspection. The auxiliary process module includes at least one of a preheating platform, a wafer edge polishing component, and a wafer identification reading and verification component; and / or, the transfer mechanism includes a first transfer component and a second transfer component. The first transfer component is used to transfer the wafers from the feeding device to the defect detection device, and the second transfer component is used to transfer the wafers that pass the inspection from the defect detection device to the downstream.

[0016] This application provides an integrated pre-processing equipment for wafers before they enter the warehouse, including a rack, a dust removal mechanism, a defect detection device, and a conveying mechanism. The rack has upper, middle, and lower layers arranged from top to bottom. The dust removal mechanism is located on the upper layer and blows airflow to the middle and lower layers. The defect detection device is located on the middle layer and includes a reflector and a camera. The reflector is tilted to reflect the image of the wafer at the inspection station into the camera's field of view. The conveying mechanism is located on the lower layer and receives wafers from the feeding device and transfers them to the inspection station. The three-layer vertical rack structure, with the dust removal mechanism, defect detection device, and conveying mechanism located on the upper, middle, and lower layers respectively, replaces the traditional planar or scattered arrangement, thus significantly reducing the horizontal and vertical requirements of the equipment. This design reduces space requirements and increases equipment integration, better adapting to the compact layout needs of wafer fabrication lines. Simultaneously, the defect detection device employs a reflective imaging system using a mirror and camera, eliminating the need for the camera to be directly facing the wafer, significantly saving vertical space and further optimizing space utilization. Furthermore, the downward-facing dust removal mechanism simultaneously blows away dust and impurities from the wafer surface during the wafer pick-up and transfer process, enabling integrated transport and cleaning operations. This thoroughly removes contaminants from the wafer surface, preventing image blurring and misjudgments caused by their obstruction, thereby improving defect detection accuracy. By preventing contaminants from entering downstream processing equipment, it also ensures the processing precision of subsequent processes and improves wafer yield. Attached Figure Description

[0017] Figure 1 A schematic diagram of an integrated wafer pre-processing device provided in this application; Figure 2 A schematic diagram of a dust removal mechanism and a conveying mechanism provided in this application; Figure 3 A schematic diagram of a dust isolation hood, a conveying mechanism and a defect detection device provided in this application; Figure 4 A schematic diagram of the structure of a defect detection device provided in this application; Figure 5 for Figure 4 The structural cross-sectional view of the defect detection device shown; Figure 6 This is a structural schematic diagram of a lifting pin and waste sheet conveying mechanism provided in this application. Detailed Implementation

[0018] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0019] This application provides an integrated pre-processing equipment for wafers before they enter the warehouse, comprising: a rack with a three-layer structure, comprising an upper layer 11, a middle layer 12, and a lower layer 13 from top to bottom; a dust removal mechanism 20 disposed on the upper layer 11, with its air outlet facing downwards to blow airflow into the middle layer 12 and the lower layer 13; and a defect detection device 30 disposed on the middle layer 12, comprising a reflector 31 and a camera 32, the reflector 31 being tilted to detect wafers at the inspection station. The image is reflected into the shooting range of the camera 32; the conveying mechanism 40, arranged in the lower layer 13, is used to receive the wafer and has a multi-degree-of-freedom displacement capability at the execution end; the middle layer 12 is connected to the feeding device 50, and the conveying mechanism 40 can pick up the wafer from the feeding device 50 and transfer the wafer to the inspection station; during the process of the conveying mechanism 40 picking up and transferring the wafer, the dust removal mechanism 20 works to blow away the dust and impurities attached to the wafer surface, thereby improving the accuracy of defect detection.

[0020] For details, please refer to Figure 1 In the illustrated embodiment, the rack serves as the overall mounting carrier for the preprocessing equipment. It adopts a vertical three-layer structure, with an upper layer 11, a middle layer 12, and a lower layer 13 arranged from top to bottom. The three layers are compactly arranged vertically. The upper layer 11 is the cleaning function installation area, the middle layer 12 is the wafer transfer and preprocessing operation area, and the lower layer 13 is the conveying drive and motion execution area. Each layer is spatially independent yet functionally collaborative, maximizing the use of vertical space to adapt to the compact layout requirements of the production line.

[0021] Continue to refer to Figure 1 The upper layer 11 is equipped with a dust removal mechanism 20, and the air outlet of the dust removal mechanism 20 is set towards the middle layer 12 and the lower layer 13. The dust removal mechanism 20 can be a fan or an air nozzle, and this application does not limit the specific configuration of the dust removal mechanism 20.

[0022] Continue to refer to Figure 1 The middle layer 12 serves as the core working layer, with an opening on one side that connects to the feeding device 50, which provides wafers to be preprocessed. The feeding device 50 can be a platform for conveniently placing wafer racks, or a conveyor belt, robotic arm, or other active mechanism for conveniently delivering wafers into the rack. This application does not limit the specific configuration of the feeding device 50.

[0023] Continue to refer to Figure 1 Inside the middle layer 12, a defect detection device 30 is arranged at the inspection station corresponding to the wafer transport path. The reflector 31 of the defect detection device 30 is in a fixed tilted position and located next to the inspection station. The camera 32 is arranged in the reflected light path corresponding to the reflector 31. The reflector 31 can accurately reflect the complete image of the wafer at the inspection station to the shooting area of ​​the camera 32, realizing non-direct wafer image acquisition.

[0024] Continue to refer to Figure 1 The lower layer 13 houses a conveying mechanism 40, which can be a robot, robotic arm, or other active mechanism for conveniently picking up and transferring wafers. The conveying mechanism 40, used to receive wafers, has multi-degree-of-freedom displacement capabilities in both horizontal and vertical directions. The movement range of the receiving end covers the feeding device 50 and the inspection station, ensuring precise wafer pickup and transfer. This application does not limit the specific configuration of the conveying mechanism 40.

[0025] In one specific embodiment, during operation, the conveying mechanism 40 picks up the wafer at the feeding device 50 and then moves the wafer towards the inspection station. During this process, the dust removal mechanism 20 continuously outputs a blowing airflow downwards. The airflow acts on the wafer surface, effectively removing dust and impurities adhering to the wafer. After the conveying mechanism 40 delivers the wafer to the inspection station, the tilted reflector 31 reflects the complete image of the wafer to the camera 32, allowing the camera 32 to acquire the wafer image and perform defect detection. By simultaneously carrying out wafer transfer and dust removal operations, dust and impurities can be prevented from obscuring or interfering with the inspection image from the source, thereby improving the accuracy of defect detection.

[0026] The integrated pre-processing equipment for wafers provided in this application uses a three-layer vertical rack structure to separate the dust removal mechanism 20, defect detection device 30, and conveying mechanism 40 into the upper, middle, and lower layers, replacing the traditional planar or scattered arrangement. This significantly reduces the horizontal and vertical space occupied by the equipment, improves the integration of the equipment, and better adapts to the compact layout requirements of wafer processing production lines. At the same time, the defect detection device 30 adopts a reflective imaging system with a mirror 31 and a camera 32, eliminating the need for the camera 32 to be directly facing the wafer, which can significantly save the vertical space required for camera 32 installation and further optimize space utilization. In addition, the dust removal mechanism 20, which is set downwards on the upper layer 11, can simultaneously blow away dust and impurities on the wafer surface during the process of the conveying mechanism 40 picking up and transferring the wafer, realizing the linkage operation of transfer and cleaning, thoroughly removing contaminants on the wafer surface, avoiding blurring and misjudgment of detection images caused by them, thereby improving the accuracy of defect detection. By preventing the wafer from carrying contaminants into the subsequent processing equipment, it can also ensure the processing accuracy of subsequent processes and improve the wafer processing yield.

[0027] Optionally, the middle layer 12 or the lower layer 13 is also provided with a dust collection port connected to the negative pressure system. The airflow direction inside the frame is set to flow from top to bottom so that the dust blown by the dust removal mechanism 20 can be discharged through the dust collection port.

[0028] Specifically, the dust collection port can be located on the middle layer 12 side wall, the lower layer 13 side wall, or the bottom. Its configuration can be a long strip slit, a multi-hole array, or a circular through hole. A flow guiding dust collection structure (such as an annular groove, a flared mouth, etc.) can also be set around the dust collection port.

[0029] The dust collection port is sealed and connected to an external negative pressure system. During operation, the dust removal mechanism 20 blows from top to bottom, creating a directional flow field inside the frame, guiding the blown-up pollutants towards the dust collection port. The negative pressure system generates directional suction through the dust collection port, continuously drawing in and expelling the blown-off dust and impurities from the frame. This effectively prevents secondary dust re-entrainment and pollution within the frame.

[0030] Optionally, a partition is provided between the upper layer 11 and the middle layer 12, and the partition is provided with fine sieve holes.

[0031] For details, please refer to Figure 1 In the illustrated embodiment, the partition is a flat plate structure, fixedly assembled between the upper layer 11 and the middle layer 12. The partition is uniformly provided with fine sieve holes, arranged in an array with consistent hole diameter, completely covering the airflow passage area between the upper layer 11 and the middle layer 12.

[0032] In use, the downward-output airflow from the dust removal mechanism 20 flows evenly through the sieve holes into the middle layer 12 and the lower layer 13, forming a stable downward airflow. The baffle not only ensures the smooth passage of the dust removal airflow to complete the cleaning of the wafer surface, but also blocks large particles of impurities from falling from the upper area through the fine sieve holes, preventing foreign objects from damaging the wafer or interfering with defect detection. By designing the distribution of the sieve holes and the orientation of the channels as needed, the airflow direction can be regulated, improving the uniformity and stability of the cleaning airflow.

[0033] In one embodiment, the conveying mechanism 40 delivers the wafer along a first horizontal direction, and the dust removal mechanism 20 includes a plurality of air nozzles. The plurality of air nozzles are arranged in one or more rows along a second horizontal direction. The first horizontal direction, the second horizontal direction, and the vertical direction are perpendicular to each other. The distribution length of a row of air nozzles in the second horizontal direction is not less than the diameter of the wafer, so as to achieve comprehensive cleaning of the wafer surface during the wafer movement.

[0034] Specifically, when the conveying mechanism 40 delivers the wafer along the first horizontal direction (X-axis), the air-blowing nozzles are arranged in a single row or multiple rows along a second horizontal direction (Y-axis) perpendicular to the X-axis. In a single-row arrangement, multiple air-blowing nozzles are arranged in a column along the Y-axis, directly above the wafer's movement path; the total length of this column of nozzles along the Y-axis is not less than the diameter of the wafer. For example, the width of a row of nozzles corresponding to a 300mm wafer can be set to 320-350mm. In a double-row or multiple-row arrangement, two or more rows of nozzles are spaced apart along the X-axis. A division of labor can be adopted, with the front row for coarse blowing and the rear row for fine blowing, or different rows of nozzles can be arranged forward, backward, or at different angles to meet more diverse purging needs.

[0035] This configuration allows a single row of nozzles to perform a scanning purging as the wafer moves along the X-axis, completely covering the entire width of the wafer's Y-axis to eliminate cleaning dead zones. Double or multiple rows can ensure dust removal through multiple purging passes or multi-angle airflow. Nozzles with different tilt angles can also form composite airflows to enhance the impurity removal effect, ultimately achieving full-process, comprehensive, and efficient surface purging during wafer movement.

[0036] In another embodiment, the dust removal mechanism 20 includes a first set of nozzles 21a and a second set of nozzles 21b. The blowing direction of the first set of nozzles 21a is inclined toward the material feeding direction of the conveying mechanism 40 to form a reverse airflow against the wafer movement direction. The blowing direction of the second set of nozzles 21b is inclined toward the wafer feeding direction of the conveying mechanism 40 to form a forward airflow along the wafer movement direction.

[0037] For details, please refer to Figure 2 In the illustrated embodiment, the first set of nozzles 21a and the second set of nozzles 21b are distributed back and forth along the wafer movement direction (i.e., the first horizontal direction). The first set of nozzles 21a is located on the right, and its air outlet is tilted from top to bottom to the left, so that the air outlet direction is opposite to the wafer movement direction, forming a reverse airflow. The reverse airflow allows the airflow to form a greater relative velocity with the wafer surface, thereby increasing the airflow impact force, so as to efficiently remove large particles and strongly adhering impurities from the wafer surface (the reverse airflow group is retained when only one set of nozzles is provided). The second set of nozzles 21b is located on the left, and its air outlet is tilted from top to bottom to the right, so that the air outlet direction is along the wafer delivery direction, forming a forward airflow.

[0038] When the two sets of nozzles work together, they converge on the wafer surface, forming a turbulent zone. This turbulence further weakens the dust adsorption force, thus thoroughly removing fine impurities. Furthermore, during wafer transfer, as it moves away from one set of nozzles, it also moves closer to the other. This effectively ensures the airflow force acting on the wafer surface, allowing the dust removal mechanism 20 to coordinate with the wafer movement throughout the process, achieving dynamic and efficient dust removal.

[0039] Optionally, the air outlet angle of the air nozzle of the dust removal mechanism 20 is adjustable.

[0040] By setting the air outlet angle of the blowing nozzle to be adjustable, the blowing angle and blowing coverage of the airflow can be flexibly adjusted according to the wafer size, dust and impurity adhesion characteristics and wafer moving speed during actual use. This optimizes the impact force of the airflow on the wafer surface and the cleaning efficiency, so as to adapt to different cleaning conditions and avoid cleaning dead corners or wasted airflow.

[0041] In one embodiment, the air nozzle is mounted on a ball joint or universal joint. The direction of the air nozzle can be adjusted within a three-dimensional angle range by using the ball joint or universal joint. After adjustment, the position is fixed by tightening the lock nut, thus completing the angle adjustment of the air nozzle.

[0042] In another embodiment, the entire row of air nozzles is uniformly mounted on a common mounting beam that can rotate around a horizontal axis. By rotating the mounting beam to change its tilt angle, the air outlet angle of the entire row of air nozzles relative to the vertical direction can be adjusted synchronously. In this way, the adjustment structure is simplified while ensuring that the air outlet angle of the same row of air nozzles is consistent.

[0043] Optionally, the blowing nozzle of the dust removal mechanism 20 is a flat wide-angle nozzle or a wide-angle circular nozzle.

[0044] Specifically, the flat wide-angle nozzle adopts a flat fan-shaped configuration design, and the ejected airflow is a straight fan-shaped surface. When multiple such nozzles are installed side by side with matching fan angles, the spray areas can slightly overlap to form a uniform air knife. In this way, the airflow is concentrated and the sweeping surface is regular, which can perform uniform tangential sweeping on the moving wafer surface, so as to efficiently remove particles with weak adhesion, achieve uniform cleaning coverage, and have high airflow utilization.

[0045] The wide-angle circular nozzle has a wide-angle circular configuration, and the ejected airflow has a conical diffusion shape. The airflow has a wider diffusion range and can easily form multi-directional turbulence on the wafer surface. With the impact force of the multi-angle converging airflow, it can effectively impact and peel off the tiny particles with strong adhesion on the wafer surface, and the cleaning effect on stubborn fine impurities is more outstanding.

[0046] In one embodiment, the middle layer 12 is further provided with a dust isolation hood 14, and the defect detection device 30 is disposed inside the dust isolation hood 14; the top of the dust isolation hood 14 is open to allow the blowing airflow of the dust removal mechanism 20 to enter the hood; the bottom or lower part of the side wall of the dust isolation hood 14 is provided with an air extraction port 15, which is connected to an external negative pressure system.

[0047] For details, please refer to Figure 1In the illustrated embodiment, the dust isolation hood 14 is located inside the middle layer 12, enclosing the defect detection device 30 and the detection station. The top of the dust isolation hood 14 remains open to allow the blowing airflow of the dust removal mechanism 20 to enter the hood. At the same time, an exhaust port 15 is provided at the bottom or lower side wall of the dust isolation hood 14, and the exhaust port 15 is connected to an external negative pressure system.

[0048] The dust isolation hood 14 can separate the defect detection work area from other spaces in the rack, preventing dust raised during wafer transfer from drifting to the inspection station, contaminating the reflector 31 and camera 32. At the same time, with top air intake and bottom air extraction, a top-down directional airflow can be formed inside the hood to quickly remove any dust that may be present inside the hood through the air extraction port 15, thereby keeping the inspection work area clean and ensuring that defect detection imaging is clear and unaffected by dust.

[0049] Optionally, the side wall of the dust isolation hood 14 is provided with a wafer passage 16, and the inner wall of the wafer passage 16 is provided with an air hole 17. The air hole 17 is connected to an air source. By blowing air through the air hole 17, an air curtain can be formed at the wafer passage 16, which can not only target the wafer but also prevent dust from flowing between the inside and outside of the hood.

[0050] For details, please refer to Figure 3 In the illustrated embodiment, wafer passage openings 16 are provided on both the left and right sides of the dust isolation cover 14. During operation, the wafer to be tested enters through the left opening, and the wafer that has completed testing leaves through the right opening.

[0051] Continue to refer to Figure 3 At least one vent 17 is provided at the top of the wafer passage 16, which can blow air from top to bottom onto the front side of the wafer to ensure that the front side of the wafer to be inspected is clean and dust-free. If necessary, multiple vents 17 can also be provided in the wafer passage 16 to ensure that the air curtain covers the entire opening while also blowing air on all sides and multiple angles of the wafer.

[0052] By continuously blowing air through the vent 17, an air curtain can be formed at the opening. This can not only target and clean the wafer along its path to enhance the cleaning effect, but also effectively block dust, prevent dust from circulating between the inside and outside of the enclosure, and ensure the cleanliness of the testing area.

[0053] Optionally, the dust isolation cover 14 is made of a transparent antistatic material, which facilitates observation of the inside of the cover and prevents static electricity from adsorbing dust.

[0054] Specifically, transparent antistatic materials are polymeric materials that combine high light transmittance with antistatic properties. Typical examples include polycarbonate and acrylic. These materials can suppress the generation and accumulation of static electricity while maintaining good visibility.

[0055] When the dust isolation hood 14 is made of this type of transparent antistatic material, the transparency of the material allows workers to directly observe the working status of the defect detection device 30 inside the hood, the passage of wafers, and the purging effect of the airflow, thus facilitating equipment debugging and on-site monitoring. The antistatic properties of the material also prevent static electricity from being generated on the inner wall of the hood due to friction, preventing dust from being electrostatically attracted and adhering to the hood, thereby preventing dust from obstructing the detection optical path or contaminating the detection elements.

[0056] Optionally, the top of the dust enclosure 14 is provided with a grid or honeycomb panel, which allows airflow while preventing large particles from falling.

[0057] Specifically, the grid or honeycomb panel is fixedly installed at the opening at the top of the dust isolation cover 14. The panel has evenly distributed grid gaps or honeycomb through holes, allowing the blowing airflow of the dust removal mechanism 20 to pass smoothly through the grid or honeycomb panel into the cover. At the same time, the panel structure can effectively block large particles of foreign matter falling from the upper area, preventing foreign matter from damaging the wafer or interfering with the operation of the defect detection device 30.

[0058] Optionally, a ring-shaped air extraction groove is provided around the bottom of the dust isolation hood 14, and multiple small holes or continuous slits are opened in the ring-shaped air extraction groove to achieve uniform air extraction.

[0059] Specifically, the annular suction trough is continuously arranged in a closed loop around the bottom of the dust isolation hood 14, forming an annular trough surrounding the testing station. Multiple small holes or continuous slits are evenly distributed around the circumference of the trough (serving as suction ports 15, connected to an external negative pressure system). This structure allows the suction force to be evenly distributed around the bottom of the dust isolation hood 14, preventing uneven local suction from causing dust deposition or secondary re-entrainment.

[0060] In one embodiment, the transfer mechanism 40 includes a receiving member 41 for supporting the wafer; the surface of the receiving member 41 is recessed downward to form a step that can limit the wafer.

[0061] The receiving element 41 is the execution end of the conveying mechanism 40. See details for further information. Figure 2 In the illustrated embodiment, the receiving component 41 is a finger-shaped receiving plate. The portion of the receiving component used to support the wafer consists of at least two spaced finger-like structures. The supporting surfaces of each finger-like structure are relatively concave, forming a limiting step between them and the common connecting portion. In use, the conveying mechanism 40 drives the receiving component 41 to move to the feeding device 50. The finger-like structures support the wafer and position it through the limiting step, and then the conveying mechanism 40 completes the transfer of the wafer.

[0062] The finger-shaped receiving plate is used because this structure significantly reduces the contact area between the receiving component 41 and the back of the wafer, thereby reducing the probability of contamination or scratches on the back of the wafer. The limiting steps on the finger-shaped receiving plate also prevent the wafer from shifting during transport, ensuring the accuracy of wafer transport and inspection positioning. In addition, the intervals between the finger-shaped structures can serve as entry points for receiving structures such as the rising ejector pin 91, facilitating the transfer of wafer positions between different receiving structures.

[0063] Optionally, the limiting wall of the step is provided with a first auxiliary air hole 42, which is connected to a negative pressure system and can draw air from the wafer nearby to ensure the surface of the wafer is clean.

[0064] For details, please refer to Figure 2 In the illustrated embodiment, the surface on the right side of the receiving component 41 is recessed, and a raised limiting wall is provided on the left side of the recessed plane. When the conveying mechanism 40 receives the wafer, the wafer falls on the recessed plane, ensuring that the left end of the wafer abuts against the limiting wall, thus ensuring that the wafer is confined to a preset position.

[0065] Continue to refer to Figure 2 The limiting wall is provided with a first auxiliary vent 42, which faces the sunken area and is connected to the external negative pressure system. During the process of the receiving component 41 supporting and transferring the wafer, the negative pressure system evacuates the wafer through the first auxiliary vent 42, which can promptly remove dust and impurities from the wafer surface and the gaps in the limiting steps, preventing dust from accumulating in the limiting area or adhering to the wafer surface again.

[0066] As is easily understood, the first auxiliary vent 42 is close to the wafer and can move along with the wafer. In this way, not only can the dust removal effect be improved by close-range suction, but the surface cleanliness of the wafer can also be continuously ensured, providing a reliable clean basis for subsequent defect detection.

[0067] Optionally, the limiting wall of the step is also provided with a second auxiliary air hole, which is connected to an air source and can blow air onto the wafer surface nearby to ensure the wafer surface is clean.

[0068] The second auxiliary vent is preferably positioned opposite the first auxiliary vent 42 along the diameter of the wafer. For example, the receiving member 41 is annular with a recessed central section forming a cylindrical groove capable of accommodating the wafer. The first auxiliary vent 42 is located on the left side of the cylindrical groove, and the second auxiliary vent is located on the right side. The second auxiliary vent is connected to an external air supply source. During the process of the receiving member 41 supporting and transporting the wafer, the second auxiliary vent can blow clean airflow toward the wafer, blowing up dust and impurities attached to the wafer and the cylindrical groove. This, in conjunction with the first auxiliary vent 42, efficiently and continuously removes dust and impurities.

[0069] Optionally, the conveying mechanism 40 further includes a circumferential blowing mechanism 43, which includes: an air blowing module rotatably mounted on the receiving member 41; and a rotation drive module for driving the air blowing module to perform circumferential motion around the receiving member 41. During the process of the receiving member 41 receiving and transferring the wafer, the air blowing module blows air toward the wafer, and the rotation drive module drives the air blowing module to rotate around the wafer at least once to thoroughly clean the wafer, thereby ensuring the surface of the wafer is clean.

[0070] For details, please refer to Figure 2 In the illustrated embodiment, the circumferential blowing mechanism 43 is integrated on the conveying mechanism 40 and consists of a blowing module rotatably mounted on the receiving component 41 and a rotary drive module connected thereto. The blowing module has a built-in airflow channel, one end of which is connected to an air source and the other end is directly opposite the wafer surface supported by the receiving component 41. The rotary drive module can be a rotary cylinder, motor or other rotary drive component (a small drive can be used to adapt to the space inside the rack), or it can be a transmission structure such as a gear and rack to realize the circumferential motion of the blowing module around the wafer while the conveying mechanism 40 delivers the wafer (for example, the rack is provided with a rack extending along the first horizontal direction, the receiving component 41 is provided with a gear on the lower side, the blowing module is mounted on the gear, the gear meshes with the rack, during operation, the receiving component 41 carries the wafer and moves it along the first horizontal direction toward the detection station, and the gear drives the blowing module to make a circumferential motion under the meshing transmission action).

[0071] More specifically, during the wafer pick-up and transfer process of the receiving component 41, the air blowing module continuously blows clean airflow onto the wafer surface. Simultaneously, the rotation drive module drives the air blowing module to rotate around the wafer at least once, performing a full-area cleaning of the wafer surface in a circumferential scanning manner. Through dynamic rotational blowing, cleaning dead corners can be effectively eliminated. Combined with the vertical airflow of the dust removal mechanism 20, dust and impurities attached to various locations on the wafer surface can be thoroughly removed, further improving the cleanliness of the wafer surface and providing a more reliable clean foundation for subsequent defect detection.

[0072] Optionally, the receiving unit 41 integrates an auxiliary preprocessing module, which includes an alignment calibration component and / or a weight sensor, for physically aligning and / or weighing the wafer after the receiving unit 41 acquires the wafer.

[0073] Specifically, the alignment and calibration components are integrated into the limiting area of ​​the receiving component 41, employing symmetrically distributed telescopic pushers or pneumatic alignment claws. After the receiving component 41 acquires the wafer, the symmetrically arranged pushers or alignment claws move synchronously towards the center of the wafer, pushing the misaligned wafer to the center reference position of the receiving component, completing the physical alignment of the wafer, ensuring accurate positioning of the wafer during transport and inspection, and avoiding misjudgment of defects or transport obstruction due to positional misalignment.

[0074] The weight sensor is embedded inside the finger-like structure of the receiving component 41, employing a miniature pressure sensing element that fits against the support surface. After the receiving component 41 acquires the wafer, the sensor can collect the pressure signal of the wafer in real time and convert it into a weight value. The weight data can be used to quickly and preliminarily determine whether the wafer has problems such as breakage, missing corners, or abnormal thickness, thereby screening out obviously unqualified wafers in advance, reducing subsequent invalid detection and processing steps, and improving the overall preprocessing efficiency.

[0075] Optionally, the defect detection device 30 also includes a light source assembly, which is arranged around the detection station or placed beside the reflector 31 to provide a uniform illumination path; the optical axis of the illumination path is set at an angle to the acquisition optical axis of the camera 32 to avoid the mirror reflection light from directly entering the camera 32.

[0076] Specifically, the light source assembly adopts a ring-shaped uniform light distribution or a side-mounted strip light output configuration, which can either be arranged around the detection station to form ring illumination or be fixedly installed next to the reflector 31. This application does not limit the specific configuration of the light source assembly.

[0077] During the inspection operation, the light source components are started synchronously, and the light is evenly irradiated on the wafer surface. The optical axis of the illumination optical path is set at a non-coaxial angle with the acquisition optical axis of the camera, which can prevent the mirror reflection light from the wafer and the mirror 31 from directly entering the camera 32.

[0078] The light-emitting end of the light source component faces the wafer at the inspection station, which can output a uniform illumination path, thereby enhancing the imaging clarity and contrast of wafer surface defects. By preventing overexposure and glare of the camera 32 image caused by specular reflection, it can ensure that the wafer image obtained by the camera 32 through the reflector 31 is real and clear, effectively improving the accuracy and reliability of defect detection.

[0079] Optionally, the reflector 31 is provided with a heating element, which is used to maintain the temperature of the reflector 31 above the ambient dew point, thereby preventing fogging on the surface of the reflector 31.

[0080] Specifically, the heating element is positioned close to the non-reflective surface (back side) of the reflector 31. It can be a flexible polyimide heating element, a transparent ITO conductive film, or a small ceramic heating element that adheres to the back of the mirror. Alternatively, heating wires can be embedded around the frame of the reflector 31, along with a PT100 resistance temperature detector (RTD) or thermocouple temperature sensor, connected to a temperature controller to form a closed-loop temperature control system. During use, the heating element heats up evenly after being powered on, causing the entire mirror surface to heat up. The temperature control system monitors and adjusts the temperature in real time, ensuring that the mirror surface temperature is accurately maintained at 3-5°C above the ambient dew point. This application does not limit the specific configuration of the heating element.

[0081] The heating element can actively raise and stabilize the mirror temperature, preventing the high-speed airflow output by the dust removal mechanism 20 from cooling the mirror and causing the mirror temperature to drop below the dew point, resulting in condensation and fogging. This eliminates the obstruction and interference of fog on the reflected light path, and can also quickly evaporate slight fog to restore the mirror's clarity, ensuring that the reflector 31 can image clearly and providing a stable and reliable optical basis for defect detection.

[0082] Optionally, the reflector 31 is covered with an anti-fog coating, which can change the wetting properties of the mirror surface and prevent fog formation.

[0083] Specifically, the anti-fog coating can be uniformly applied to the outermost protective layer of the reflective surface of the mirror 31 through spraying, dipping, spin coating, or vacuum deposition processes. It will not damage the internal metal reflective layer or its optical performance. Suitable coating materials such as silicone-based or polyurethane-based coatings can be used. If the mirror 31 also has a light-transmitting observation function, it can also be coated simultaneously on the back. With the anti-fog coating in place, no additional electrical control is required during equipment operation; the coating passively takes effect based on its modified surface wetting properties.

[0084] Anti-fog coatings can alter the wetting properties of mirrors, allowing tiny water vapors condensed on the mirror surface to quickly spread into a uniform, transparent water film, preventing scattered water droplets from scattering light and forming fog. Compared to hydrophobic coatings, they are more suitable for tilted mirror working environments. They can provide passive anti-fog protection in case of heating element failure or start-up delay, and can also be combined with heating elements to form a dual anti-fog guarantee of active heating plus passive coating. High-quality coatings also have a long service life, reducing the frequency of equipment maintenance and continuously maintaining a clear and stable optical path for reflector 31, ensuring the imaging quality and accuracy of wafer defect detection.

[0085] Optionally, a micro-positive pressure air curtain nozzle connected to an air source is provided around the mirror surface of the reflector 31 to form an air curtain on the mirror surface, thereby preventing dust adhesion and fog condensation.

[0086] Specifically, multiple micro-positive pressure air curtain nozzles are arranged around the periphery of the mirror surface of the reflector 31 (if the reflector 31 has a frame around it, the mirror surface is recessed relative to the frame, and the micro-positive pressure air curtain nozzles can be distributed on the inner periphery of the frame; if no frame is provided, the micro-positive pressure air curtain nozzles can be set on the outer periphery of the reflector 31 and fixed on the dust isolation cover 14 or the frame), and are uniformly connected to an external air supply source. During the operation of the equipment, the air source continuously delivers dry and clean airflow, and the micro-positive pressure air curtain nozzles can evenly spray airflow to form a micro-positive pressure surrounding air curtain on the outer side of the mirror surface of the reflector 31. Without interfering with the reflective light collection path of the reflector, the air curtain can prevent floating dust from approaching the mirror surface, preventing dust from adhering and contaminating the reflective optical surface and blocking the imaging light path. At the same time, the flowing dry gas can replace the humid air around the mirror surface, reduce the local water vapor concentration, and help suppress the condensation of fog on the mirror surface.

[0087] Optionally, the defect detection device 30 also includes a reflector adjustment mechanism, which includes a rotation adjustment component 71, a telescopic adjustment component 72, and a lifting adjustment component 73. The rotation adjustment component 71 is used to adjust the tilt angle of the reflector 31, and the telescopic adjustment component 72 and the lifting adjustment component 73 are used to adjust the relative position of the reflector 31 and the detection station. By adjusting the position of the reflector 31 through the reflector adjustment mechanism, it can be ensured that the reflector 31 completely reflects the wafer image.

[0088] For details, please refer to Figure 4 and Figure 5 In the illustrated embodiment, the reflector adjustment mechanism is integrated and assembled inside the dust isolation cover 14, and is a symmetrically arranged matching form (including two sets of rotation adjustment components 71, two sets of telescopic adjustment components 72 and two sets of lifting adjustment components 73, with the two sets of adjustment components supporting the reflector 31 on the left and right respectively).

[0089] The rotating adjustment component 71 is an angle fine-tuning seat with a precision hinged rotating shaft and a locking limit structure. The reflector 31 is mounted on the rotating adjustment component 71. In use, the tilt angle of the reflector 31 can be finely adjusted by rotating the rotating shaft to match the tilt angle requirements of the optical incident light path. After the adjustment is completed, the locking and fixing limit structure is tightened to keep the reflector 31 at the preset angle.

[0090] The telescopic adjustment component 72 uses a horizontal guide rail in conjunction with a telescopic sliding structure (such as a cylinder, slide table, micrometer, etc.). The rotary adjustment component 71 is slidably mounted on the horizontal guide rail. The telescopic sliding structure is used to drive the rotary adjustment component 71 to move along the horizontal guide rail. In use, the horizontal relative spacing of the 31 detection stations of the reflector can be adjusted by changing the position of the rotary adjustment component 71 on the horizontal guide rail through the telescopic sliding structure.

[0091] The lifting adjustment component 73 adopts a vertical guide rail combined with a lifting and sliding structure (a cylinder, slide table, micrometer, etc. can also be used). The vertical guide rail is fixedly installed on the dust isolation cover 14 or the frame. The telescopic adjustment component 72 is slidably installed on the vertical guide rail. The lifting and sliding structure is used to drive the telescopic adjustment component 72 and the rotary adjustment component 71 to move along the vertical rail. In use, the vertical height difference between the reflector 31 and the detection station can be adjusted by changing the position of the rotary adjustment component 71 on the vertical guide rail through the lifting and sliding structure.

[0092] The rotation adjustment component 71, the telescopic adjustment component 72, and the lifting adjustment component 73 work together to precisely adjust the attitude and relative position of the reflector 31 from multiple dimensions such as tilt angle, horizontal position, and vertical height, thereby optimizing the optical reflection path and ensuring that the reflector 31 can completely reflect the full-area image of the wafer, adapting to different working conditions and inspection framing needs, and ensuring complete and effective defect image acquisition.

[0093] Optionally, the defect detection device 30 also includes a camera adjustment structure 80, which adjusts the position of the camera 32 to ensure that the camera 32 can completely acquire the reflected image of the mirror 31.

[0094] For details, please refer to Figure 4 and Figure 5 In the illustrated embodiment, the camera adjustment structure 80 is assembled inside the dust isolation cover 14. Its configuration is similar to that of the reflector adjustment mechanism. It also integrates a precision transmission and locking structure for horizontal sliding, vertical lifting and lowering, and angle fine adjustment. It is adapted to the optical layout space inside the equipment, with a compact structure and high adjustment accuracy.

[0095] In use, the horizontal spacing, vertical height and shooting tilt angle of the camera 32 can be finely adjusted by adjusting each adjustment module. The framing position can be gradually calibrated by referring to the reflected light path of the reflector 31. After the adjustment is in place, the fixing structure can be locked and the attitude of the camera 32 can be locked.

[0096] The camera adjustment structure 80 can adapt to the optical reflection path of the mirror 31 in multiple dimensions, correct the problems of imaging field of view shift and incomplete framing, ensure that the camera 32 can obtain the wafer image reflected by the mirror 31 completely and clearly, and improve the image acquisition quality.

[0097] Optionally, the middle layer 12 also integrates an auxiliary process module located after the defect detection device 30. The auxiliary process module is used to perform further auxiliary processing on the wafers that pass the inspection. The auxiliary process module includes at least one of a preheating platform, a wafer edge polishing component, or a wafer identification reading and verification component.

[0098] In one embodiment, the preheating platform is located downstream of the defect detection device 30. It is a constant-temperature, heat-conducting platform adapted to the wafer's external dimensions. The platform contains uniformly arranged heating elements and temperature sensors, along with a closed-loop temperature control module and a wafer positioning structure. In use, the conveying mechanism 40 transfers qualified wafers to the platform, and the temperature control system precisely controls the temperature, enabling uniform preheating of the entire wafer through heat conduction.

[0099] By reducing the temperature difference between the wafer and subsequent semiconductor deep processing, processing efficiency can be improved, and thermal stress deformation or surface condensation and impurity adhesion caused by temperature difference can be avoided. This provides a basis for adapting the temperature conditions for back-end precision processes and ensures the stability and controllability of subsequent processing.

[0100] In another embodiment, the conveying mechanism 40 includes a first conveying component and a second conveying component (detailed below), and the preheating platform is integrated on the second conveying component; if the second conveying component is a robotic arm, the end effector of the robotic arm is equipped with a heating element, so that after the qualified wafer is picked up by the robotic arm with the preheating temperature, the robotic arm can transfer and preheat the wafer at the same time.

[0101] In one embodiment, the wafer edge polishing assembly is located downstream of the defect detection device 30 and consists of a symmetrical flexible polishing wheel assembly with precisely adjustable feed, a wafer positioning and clamping structure, and a debris collection and dust removal structure. The contour of the polishing wheel is designed to conform to the edge curvature of the wafer. In use, a qualified wafer is transferred to the wafer positioning and clamping structure. The wafer positioning and clamping structure first clamps and fixes the wafer, and then drives the polishing wheel to gently conform to the edge of the wafer to perform polishing operations. At the same time, the debris collection and dust removal structure (such as the first auxiliary air hole 42 provided on the receiving part 41) collects the fine debris generated during polishing.

[0102] The wafer edge polishing component can repair minor chips, burrs, and stubborn impurities attached to the edges of the wafer, further optimizing the edge smoothness and cleanliness of the wafer and preventing problems such as edge powdering and uneven coating in subsequent processes.

[0103] In other embodiments, the wafer edge polishing component can also be integrated onto the second conveying component, such as in the form of an air-blowing module that can circle the wafer once during the conveying process.

[0104] In one embodiment, the wafer identification reading and verification component is located downstream of the defect detection device 30 and consists of a barcode scanner and a data verification terminal linked to the production line. In use, qualified wafers are transferred to the barcode scanner, which collects and decodes the wafer's identification information. The verification terminal then compares the read data with the wafer batch and category parameters in the system's backend for verification, thereby achieving accurate traceability of individual wafers, avoiding mixing or incorrect materials during production, and enhancing the precision of production line process control and the traceability capability of the entire wafer process.

[0105] In one embodiment, the transfer mechanism 40 includes: a first transfer component for transferring wafers from the feeding device 50 to the defect detection device 30; and a second transfer component for transferring wafers that have passed the defect detection device 30 to downstream applications (such as transferring wafers that have passed the defect detection device 30 to an auxiliary process module, or transferring wafers processed by the auxiliary process module out of the rack).

[0106] Both sets of conveying components can be equipped with multi-axis precision robotic arms or linear precision conveying arms that are adapted to semiconductor cleanroom conditions and equipped with finger-type pick-up parts, featuring low pollution and high-precision alignment and transfer.

[0107] By setting up two independent conveyor components, the wafer feeding and inspection process can be separated from the subsequent processing / unloading of qualified wafers. This avoids the cycle time waste and workstation cross-interference caused by the reciprocating back and forth of a single conveyor mechanism, thereby improving the overall wafer turnover efficiency and operational continuity.

[0108] In one embodiment, the defect detection device 30 is equipped with a qualified wafer channel and a defective wafer channel. Wafers that are detected as qualified are output through the qualified wafer channel, and wafers that are detected as defective are output through the defective wafer channel.

[0109] Separating qualified wafers into qualified and unqualified wafers allows for the sorting of inspected wafers according to their quality level, thus preventing the mixing of good and defective products. It also facilitates the smooth entry of qualified wafers into subsequent auxiliary processes, while unqualified wafers are collected and processed separately, standardizing the wafer quality control process and improving the overall sorting efficiency and production control accuracy.

[0110] In one embodiment, the conveying mechanism 40 includes a first conveying component, a second conveying component, and a third set of conveying components. The first conveying component is responsible for feeding wafers, the second conveying component is used to transfer wafers that have passed inspection downstream along the qualified wafer channel, and the third set of conveying components is used to transfer wafers that have failed inspection downstream along the unqualified wafer channel. The qualified wafer channel and the unqualified wafer channel are independently arranged after the defect detection device 30 and do not interfere with each other. The qualified wafer channel is connected to the auxiliary process module behind it to ensure the continuous flow and processing of qualified products. A bypass discharge structure is separately arranged on the side of the unqualified wafer channel. The second conveying component and the third set of conveying components are respectively connected to the two channels to complete directional unloading.

[0111] Since defective products do not require further processing, to simplify the flow and collection of defective products, in one embodiment, a flip-up or openable wafer carrier platform is provided at the inspection station; a defective product collection channel is provided below the inspection station, with the entrance of the defective product collection channel facing the wafer carrier platform; when the defect detection device 30 determines that the wafer is defective, the wafer carrier platform moves to make the defective wafer fall into the defective product collection channel; when the defect detection device 30 determines that the wafer is qualified, the wafer carrier platform remains in a carrying state so that the conveying mechanism 40 can take away the wafer.

[0112] Specifically, the flip-able or openable wafer carrier platform consists of a dust-free precision carrier base adapted to the wafer size, a wafer limiting and positioning structure, and a matching flip-up or open-down drive module. The entire platform is located at the inspection station, directly opposite the entrance to the defective product channel. During inspection, the carrier platform initially maintains a stable, horizontally closed bearing state to allow the defect detection device 30 to determine defects. When a defective wafer is detected, the drive module rapidly flips or opens / closes the carrier platform, creating space for the wafer to fall. The defective wafer then falls directly into the defective product channel below under its own weight. If the wafer is determined to be a qualified product, the carrier platform maintains its original bearing posture, and the conveyor mechanism 40 picks up and outputs the qualified wafer.

[0113] The flip-out or openable wafer carrier platform integrates wafer carrier positioning, inspection support, and automatic unloading and collection of defective products. It eliminates the need for additional sorting and handling components, features a compact structure and high sorting response, ensures the positional stability of wafers during inspection, and automatically distinguishes between good and defective products, preventing mixing.

[0114] In another embodiment, a lifting pin 91 is provided at the inspection station to support the wafer; a waste wafer conveying mechanism 92 is provided at the defective wafer channel; when the defect inspection device 30 determines that the wafer is defective, the lifting pin 91 carries the defective wafer down until the defective wafer falls onto the waste wafer conveying mechanism 92, the waste wafer conveying mechanism 92 can transfer the defective wafer downstream, the lifting pin 91 resets, and can support the next wafer to be inspected.

[0115] For details, please refer to Figure 6 In the illustrated embodiment, the lifting pin 91 consists of three pins arranged in an equilateral triangle and a vertical lifting drive module (which can be a cylinder, electric cylinder, etc.). The lifting pin 91 is positioned below the inspection station, with its top forming a stable wafer support point, allowing for precise and controllable lifting movements.

[0116] During normal testing, the lifting pin 91 rises to the working height to support the wafer, ensuring that the defect detection device 30 can stably acquire images and complete quality judgment. When the wafer is judged to be unqualified, the lifting drive module drives the pin to descend along with the unqualified wafer, allowing the wafer to fall onto the waste wafer conveying mechanism 92 below (which can be a conveying roller, conveying platform, robot, etc.) so that the waste wafer conveying mechanism 92 can transfer the wafer. After the unqualified wafer is removed, the lifting pin 91 resets, and can then support the next wafer to be tested.

[0117] The lifting pin 91 can not only lift and position the wafers at the inspection station, but also automatically unload defective wafers through lifting action, simplifying the sorting operation.

[0118] The waste wafer conveying mechanism 92 is located inside the defective wafer channel, directly opposite the falling position of the lifting pin 91. The specific configuration of the waste wafer conveying mechanism 92 is similar to that of the conveying mechanism 40; both can employ a finger-type structure at their execution ends. The spacing between the fingers adapts to the movement of the lifting pin 91, ultimately achieving wafer placement and retrieval. After the defective wafer is lowered to the execution end surface by the lifting pin 91, the waste wafer conveying mechanism 92 can directionally convey the defective wafer to the downstream collection area. The waste wafer conveying mechanism 92 is specifically designed to receive and transport defective wafers, achieving physical separation and diversion of good and defective products, eliminating material mixing problems, and simultaneously automating the collection and transfer of defective products, ensuring the continuous and efficient operation of the entire machine's inspection and sorting process.

[0119] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An integrated pre-processing equipment for wafers before they enter the wafer warehouse, characterized in that, include: The rack is configured in a three-layer structure, with an upper layer (11), a middle layer (12) and a lower layer (13) from top to bottom. A dust removal mechanism (20) is arranged in the upper layer (11), with the air outlet of the dust removal mechanism (20) facing downward, for blowing airflow to the middle layer (12) and the lower layer (13); A defect detection device (30) is arranged in the middle layer (12). The defect detection device (30) includes a reflector (31) and a camera (32). The reflector (31) is tilted so that it can reflect the image of the wafer at the inspection station into the shooting range of the camera (32). A conveying mechanism (40) is arranged in the lower layer (13), and the middle layer (12) is connected to the feeding device (50). The conveying mechanism (40) can pick up the wafer from the feeding device (50) and transfer the wafer to the inspection station. During the process of the conveying mechanism (40) receiving and transferring the wafer, the dust removal mechanism (20) works to blow away the dust and impurities attached to the surface of the wafer, thereby improving the accuracy of defect detection.

2. The integrated wafer pre-processing equipment according to claim 1, characterized in that, The conveying mechanism (40) delivers the wafer along a first horizontal direction. The dust removal mechanism (20) includes a plurality of air nozzles. The plurality of air nozzles are arranged in one or more rows along a second horizontal direction. The first horizontal direction, the second horizontal direction, and the vertical direction are perpendicular to each other. The distribution length of a row of air nozzles in the second horizontal direction is not less than the diameter of the wafer, so as to achieve comprehensive cleaning of the wafer surface during the wafer movement. And / or, the dust removal mechanism (20) includes a first set of nozzles (21a) and a second set of nozzles (21b). The blowing direction of the first set of nozzles (21a) is inclined toward the material feeding direction of the wafer delivered by the conveying mechanism (40) so as to form a reverse airflow against the wafer movement direction. The blowing direction of the second set of nozzles (21b) is inclined toward the direction of the wafer delivered by the conveying mechanism (40) so as to form a forward airflow along the wafer movement direction. And / or, the air outlet angle of the air nozzle of the dust removal mechanism (20) is adjustable; And / or, the blowing nozzle of the dust removal mechanism (20) is a flat wide-angle nozzle or a wide-angle circular nozzle.

3. The integrated wafer pre-processing equipment according to claim 1, characterized in that, The middle layer (12) is also provided with a dust isolation cover (14), and the defect detection device (30) is located inside the dust isolation cover (14); The top of the dust isolation hood (14) is open to allow the blowing airflow of the dust removal mechanism (20) to enter the hood; The dust isolation hood (14) is provided with an air extraction port (15) at the bottom or lower side wall, and the air extraction port (15) is connected to an external negative pressure system. The side wall of the dust isolation cover (14) is provided with a wafer passage port (16), and the inner wall of the wafer passage port (16) is provided with an air hole (17). The air hole (17) is connected to an air source. By blowing air through the air hole (17), an air curtain can be formed at the wafer passage port (16), which can not only target the wafer but also prevent dust from flowing between the inside and outside of the cover.

4. The integrated wafer pre-processing equipment according to claim 1, characterized in that, The transfer mechanism (40) includes a receiving element (41) for supporting the wafer; The surface of the receiving component (41) is recessed downward to form a step that can limit the wafer. The limiting wall of the step is provided with a first auxiliary air hole (42). The first auxiliary air hole (42) is connected to a negative pressure system, which can extract air from the wafer nearby, thereby ensuring the surface of the wafer is clean.

5. The integrated wafer pre-processing equipment according to claim 4, characterized in that, The conveying mechanism (40) further includes a circumferential blowing mechanism (43), which includes: The air blowing module is rotatably mounted on the receiving part (41); A rotary drive module is used to drive the air blowing module to make a circular motion around the receiving member (41); During the process of receiving and transferring the wafer by the receiving component (41), the blowing module blows air toward the wafer, and the rotation drive module drives the blowing module to rotate around the wafer at least once to thoroughly clean the wafer, thereby ensuring that the surface of the wafer is clean.

6. The integrated wafer pre-processing equipment according to claim 1, characterized in that, The transfer mechanism (40) is equipped with an auxiliary preprocessing module, which includes an alignment calibration component and / or a weight sensor for physically aligning and / or weighing the wafer after the transfer mechanism (40) acquires the wafer.

7. The integrated wafer pre-processing equipment according to claim 1, characterized in that, The defect detection device (30) also includes a light source assembly, which is arranged around the detection station or placed on the side of the reflector (31) to provide a uniform illumination path. The optical axis of the illumination path is set at an angle to the acquisition optical axis of the camera (32) to avoid the mirror reflection light from directly entering the camera (32). And / or, the reflector (31) is provided with a heating element, which is used to maintain the temperature of the reflector (31) above the ambient dew point, thereby preventing fogging on the surface of the reflector (31); And / or, the reflector (31) is covered with an anti-fog coating, which can change the wetting properties of the mirror surface and prevent fog formation; And / or, the reflector (31) is provided with a micro-positive pressure air curtain nozzle connected to an air source around the mirror surface to form an air curtain on the mirror surface, thereby preventing dust adhesion and fog condensation.

8. The integrated wafer pre-processing equipment according to claim 1, characterized in that, The defect detection device (30) further includes: The reflector adjustment mechanism includes a rotation adjustment component (71), a telescopic adjustment component (72), and a lifting adjustment component (73). The rotation adjustment component (71) is used to adjust the tilt angle of the reflector (31), and the telescopic adjustment component (72) and the lifting adjustment component (73) are used to adjust the relative position of the reflector (31) and the inspection station. By adjusting the position of the reflector (31) through the reflector adjustment mechanism, it can be ensured that the reflector (31) completely reflects the wafer image. And / or, the camera adjustment structure (80) adjusts the position of the camera (32) to ensure that the camera (32) can completely acquire the reflected image of the mirror (31).

9. The integrated wafer pre-processing equipment according to claim 1, characterized in that, The defect detection device (30) is equipped with a qualified wafer channel and a defective wafer channel. Wafers that are detected as qualified are output through the qualified wafer channel, and wafers that are detected as defective are output through the defective wafer channel. The testing station is equipped with a lifting pin (91), which is used to support the wafer; The defective film channel is equipped with a waste film conveying mechanism (92). When the defect detection device (30) determines that the wafer is unqualified, the lifting pin (91) carries the unqualified wafer down until the unqualified wafer falls onto the waste wafer conveying mechanism (92). The waste wafer conveying mechanism (92) can transfer the unqualified wafer downstream, and the lifting pin (91) resets to support the next wafer to be inspected.

10. The integrated wafer pre-processing equipment according to any one of claims 1-9, characterized in that, The middle layer (12) also integrates an auxiliary process module located after the defect detection device (30). The auxiliary process module is used to perform further auxiliary processing on the wafers that have passed the inspection. The auxiliary process module includes at least one of a preheating platform, a wafer edge polishing component, and a wafer identification reading and verification component. And / or, the transfer mechanism (40) includes a first transfer component and a second transfer component, the first transfer component being used to transfer wafers from the feed device (50) to the defect detection device (30), and the second transfer component being used to transfer wafers that have been detected as qualified from the defect detection device (30) to the downstream.

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