Wafer transfer equipment

Abstract

The invention relates to wafer transfer equipment, and relates to the field of wafer processing equipment. The supporting platform is mounted at the movable end of the linear motor; the driving mechanism is mounted on the supporting platform; the rotating mechanism is installed on the supporting platform, the rotating mechanism is connected with the driving mechanism, and the driving mechanism is used for driving the rotating mechanism to move; the lifting mechanism is installed on the supporting platform, the lifting mechanism is connected with the driving mechanism, the lifting mechanism is connected with the rotating mechanism, and the rotating mechanism is used for driving the lifting mechanism to rotate; and the vacuum suction cup is mounted on the lifting mechanism. The method has the effects of improving the processing quality of the wafer and improving the transfer efficiency of the wafer.

Description

Technical Field

[0001] This application relates to the field of wafer processing equipment, and more particularly to a wafer transfer device. Background Technology

[0002] Wafers are an important raw material for semiconductor products. Their main component is silicon, and their outer contour is a thin sheet structure, often referred to as silicon wafers. Various circuit element structures can be formed on wafers, ultimately forming chips to realize the functional control of circuits, which is of indispensable significance in high-end manufacturing.

[0003] Currently, each step in the wafer fabrication process requires different equipment. During wafer transfer, manual handling is necessary, which inevitably leads to dust adhering to the wafer, affecting the quality of subsequent processing. The cumbersome manual transfer process also impacts wafer transfer efficiency.

[0004] The aforementioned technologies suffer from low wafer transfer efficiency and poor wafer processing quality. Summary of the Invention

[0005] In order to improve the processing quality of wafers and increase wafer transfer efficiency, this application provides a wafer transfer device.

[0006] This application provides a wafer transfer device, which adopts the following technical solution: A wafer transfer device, comprising a linear motor; A support platform is mounted on the movable end of the linear motor; A drive mechanism, which is mounted on the support platform; A rotating mechanism is mounted on the support platform and connected to the driving mechanism, which drives the rotating mechanism to move. A lifting mechanism is installed on the support platform, the lifting mechanism is connected to the drive mechanism, the elevator is connected to the rotating mechanism, and the rotating mechanism is used to drive the lifting mechanism to rotate. A vacuum suction cup is mounted on the lifting mechanism.

[0007] By adopting the above technical solution, the linear motor drives the support platform to move, the drive mechanism drives the rotating mechanism and the lifting mechanism to move, the rotating mechanism drives the lifting mechanism to rotate, the lifting mechanism drives the vacuum chuck to move, and the vacuum chuck picks up and puts down the wafer, thereby improving the wafer processing quality and increasing the wafer transfer efficiency.

[0008] Optionally, the rotating mechanism includes; The support frame is fixedly connected to the support platform. A rotating assembly is mounted on the support frame, connected to the drive mechanism, and connected to the lifting mechanism. The rotating assembly is used to drive the lifting mechanism to move. The first telescopic rod, one end of the fixed end of the first telescopic rod is hinged to the support frame; An auxiliary sleeve is rotatably connected to the movable end of the first telescopic rod and is connected to the lifting mechanism.

[0009] By adopting the above technical solution, the drive mechanism moves to drive the rotating component, the rotating component moves to drive the lifting mechanism, the lifting mechanism moves to drive the auxiliary sleeve, and the auxiliary sleeve moves to drive the first telescopic rod. The auxiliary sleeve and the first telescopic rod provide auxiliary support for the lifting mechanism, thereby improving the operational stability of the wafer transfer equipment.

[0010] Optionally, the rotating assembly includes: A rotating drum, with both ends of which are inserted through and rotatably connected to the support frame, is connected to the lifting mechanism. Two sliding grooves are symmetrically opened on the outer side wall of the rotating drum, and the two sliding grooves intersect. Two limiting grooves are symmetrically and through the top wall of the rotating drum. Two steering rods are mounted on the drive mechanism, and the two steering rods are slidably connected in the two sliding grooves respectively; Two fixed rods, one end of each of the two fixed rods being mounted on the drive mechanism; Two arc-shaped plates are mounted on the end of the fixed rod away from the driving mechanism, and the two arc-shaped plates are slidably connected in the two limiting grooves respectively.

[0011] By adopting the above technical solution, the drive mechanism drives the steering rod and the fixed rod to move. The movement of the fixed rod drives the arc plate to move. When the steering rod slides in the slide groove, it causes the drum to rotate. The rotation of the drum drives the lifting mechanism to rotate. The rotation of the lifting mechanism drives the vacuum suction cup to move. This reduces the number of wafer transfer steps and improves the efficiency of wafer transfer. When the arc plate slides in the limiting groove, it ensures the stability of the drum, thereby improving the stability of the wafer transfer equipment.

[0012] Optionally, the drive mechanism includes: A fixed column, one end of which is fixedly connected to the support platform; The motor has its fixed end fixedly connected to the fixed column, and its output end passing through and rotatably connected to the fixed column. A fixed ring is coaxially sleeved and fixedly connected to the output shaft of the motor. Two steering rods are evenly arranged and fixedly connected to the peripheral sidewall of the fixed ring. Two fixed rods are evenly arranged and fixedly connected to the peripheral sidewall of the fixed ring. The axis of the steering rod and the axis of the fixed rod are in the same plane. Two cams are symmetrically arranged on the output shaft of the motor. Both cams are coaxially sleeved and fixedly connected to the output shaft of the motor. The cams are connected to the lifting mechanism.

[0013] By adopting the above technical solution, the rotation of the motor drives the cam and the fixed ring to rotate, the rotation of the cam drives the lifting mechanism to move, and the rotation of the fixed ring drives the steering rod and the fixed rod to rotate, providing driving force for the lifting mechanism, the steering rod and the fixed rod, and increasing the mechanical linkage of the wafer transfer equipment.

[0014] Optionally, the lifting mechanism includes: The second telescopic rod, the fixed end of the second telescopic rod is fixedly connected to the support platform; A sliding rod, which passes through and is slidably connected to the rotating drum. A push plate, one end of which is fixedly connected to the movable end of the second telescopic rod, and the other end of which is rotatably connected to one end of the sliding rod; the end of the push plate near the second telescopic rod abuts against the cam. A spring is sleeved on the second telescopic rod, one end of the spring is fixedly connected to the support platform, and the other end of the spring is fixedly connected to the push plate; The first electric telescopic rod has its fixed end fixedly connected to the side wall of the sliding rod away from the push plate, and the axis of the first electric telescopic rod is perpendicular to the axis of the sliding rod. A mounting rod is provided, with one end of which is inserted through and fixedly connected to the movable end of the first electric telescopic rod, and the other end of which is connected to a vacuum suction cup. The axis of the mounting rod is perpendicular to the axis of the first electric telescopic rod, and the mounting rod is inserted through and slidably connected to the auxiliary sleeve.

[0015] By adopting the above technical solution, the rotation of the drum drives the sliding rod to rotate. When the sliding rod rotates to a limited position, the controller controls the first electric telescopic rod to extend or retract, which improves the applicability of the wafer transfer equipment. The rotation of the cam drives the second telescopic rod to retract, and the retraction of the second telescopic rod drives the push plate to move downward. The movement of the push plate drives the sliding rod to slide, and the sliding rod drives the first electric telescopic rod to move downward. The downward movement of the first electric telescopic rod drives the placement rod to move downward, and the movement of the placement rod drives the vacuum chuck to move. The movement of the vacuum chuck picks up the wafer, reducing the number of wafer transfer steps and improving the wafer transfer efficiency.

[0016] Optionally, a guide rod is fixedly connected to the bottom wall of the push plate near the sliding rod. The guide rod is slidably connected to the support platform, and the axis of the guide rod is perpendicular to the plane of the top wall of the support platform.

[0017] By adopting the above technical solution, the guide rod ensures the stability of the sliding rod's up-and-down movement, thereby improving the service life of the wafer transfer equipment.

[0018] Optionally, the support platform is further equipped with a locking mechanism, the locking mechanism comprising: A ratchet, which is coaxially sleeved and fixedly connected to the output shaft of the motor; A pawl, which is rotatably connected to the fixed post and engages with the ratchet. The second electric telescopic rod has its fixed end fixedly connected to the support platform, and its movable end abutting against the pawl. The second electric telescopic rod is electrically connected to a controller, which is electrically connected to the first electric telescopic rod.

[0019] By adopting the above technical solution, the controller controls the extension and retraction of the first electric telescopic rod, causing the second electric telescopic rod to extend. The extension of the second telescopic rod drives the pawl to move. The pawl engages with the ratchet, causing the motor to stop rotating. When the first electric telescopic rod stops moving, the second electric telescopic rod retracts, causing the pawl and ratchet to disengage, thus improving the adsorption stability of the vacuum suction cup.

[0020] Optionally, the line connecting the cam axis and the farthest point of the cam is parallel to the axis of the steering rod.

[0021] By adopting the above technical solution, it is ensured that after the rotating drum is completed, when the arc plate slides in the limiting groove, the cam drives the push plate to move during the process of fixing the rotating drum, thereby improving the stability of wafer transfer.

[0022] In summary, this application includes at least one of the following beneficial technical effects: 1. The drive mechanism moves the steering rod and the fixed rod, which in turn moves the arc plate. When the steering rod slides in the groove, the drum rotates. The rotation of the drum drives the lifting mechanism to rotate, which in turn drives the vacuum chuck to move. This reduces the number of wafer transfer steps and improves the efficiency of wafer transfer. When the arc plate slides in the limiting groove, it ensures the stability of the drum, thereby improving the stability of the wafer transfer equipment. 2. The rotating drum drives the sliding rod to rotate. When the sliding rod rotates to a limited position, the controller controls the first electric telescopic rod to extend or retract, which improves the applicability of the wafer transfer equipment. The cam rotates to retract the second telescopic rod. The retraction of the second telescopic rod causes the push plate to move downward. The movement of the push plate causes the sliding rod to slide. The sliding rod causes the first electric telescopic rod to move downward. The downward movement of the first electric telescopic rod causes the placement rod to move downward. The movement of the placement rod causes the vacuum chuck to move. The movement of the vacuum chuck picks up the wafer, reducing the wafer transfer steps and improving the wafer transfer efficiency. 3. When the arc-shaped plate slides within the limiting groove, the cam drives the push plate to move during the process of fixing the rotating cylinder, thereby improving the stability of wafer transfer. Attached Figure Description

[0023] Figure 1 This is a structural schematic diagram of an embodiment of this application; Figure 2 This is a structural schematic diagram from another perspective of an embodiment of this application; Figure 3 This is a schematic diagram illustrating the structure of the locking mechanism in this embodiment.

[0024] Explanation of reference numerals in the attached figures: 1. Linear motor; 2. Support platform; 3. Drive mechanism; 31. Fixed column; 32. Motor; 33. Cam; 34. Fixed ring; 4. Rotating mechanism; 41. Support frame; 42. Rotating assembly; 421. Rotating drum; 4211. Slide groove; 4212. Limiting groove; 422. Steering rod; 423. Fixed rod; 424. Arc plate; 43. First telescopic rod; 44. Auxiliary sleeve; 5. Lifting mechanism; 51. Push plate; 52. Second telescopic rod; 53. Spring; 54. Sliding rod; 55. First electric telescopic rod; 56. Placement rod; 57. Guide rod; 6. Locking mechanism; 61. Ratchet; 62. Pawl; 63. Second electric telescopic rod; 7. Vacuum suction cup. Detailed Implementation

[0025] The following is in conjunction with the appendix Figure 1-3 This application will be described in further detail.

[0026] This application discloses a wafer transfer device.

[0027] Reference Figure 1 The wafer transfer equipment includes a linear motor 1, a support platform 2 fixedly connected to the movable end of the linear motor 1, a drive mechanism 3 mounted on the support platform 2, a rotating mechanism 4 connected to the drive mechanism 3, and a locking mechanism 6. The locking mechanism 6 is mounted on the support platform 2 and connected to a lifting mechanism 5. The rotating mechanism 4 is mounted on the support platform 2, and the lifting mechanism 5 is mounted on the rotating mechanism 4 and connected to the support platform 2. A vacuum suction cup 7 is mounted on the lifting mechanism 5.

[0028] The linear motor 1 moves, driving the support platform 2 to move, which increases the application range of the wafer transfer equipment. The drive mechanism 3 moves, driving the rotating mechanism 4 and the lifting mechanism 5 to move. The rotating mechanism 4 moves, driving the lifting mechanism 5 to rotate. The rotating mechanism 4 moves, driving the vacuum chuck 7 to move. The vacuum chuck 7 clamps the wafer and transfers it, preventing manual wafer transfer, improving wafer processing quality, and increasing wafer transfer efficiency.

[0029] Reference Figure 2 and Figure 3 The transfer mechanism includes a support frame 41, which is fixedly installed on the support platform 2. A rotating component is installed on the support frame 41 and connected to the lifting mechanism 5. The fixed end of the first telescopic rod 43 is hinged to the top wall of the support frame 41, and the movable end of the first telescopic rod 43 is connected to an auxiliary sleeve 44, which is connected to the lifting mechanism 5.

[0030] Reference Figure 2 and Figure 3 The rotating assembly includes a rotating drum 421, which is rotatably connected to a support frame 41 at both ends. The rotating drum 421 has two symmetrically arranged grooves 4211 on its sidewall, which intersect. The top wall of the rotating drum 421 also has two symmetrically arranged limiting grooves 4212. The length directions of the two limiting grooves 4212 form right angles with the two planes of the drum's axis. The ends of the two limiting grooves 4212 near the top of the rotating drum 421 are respectively connected to the ends of the two grooves 4211 near the bottom of the rotating drum 421. The two limiting grooves 4212 are connected at one end near the bottom of the rotating drum 421 and at one end near the bottom of the two sliding grooves 4211 respectively. One end of two steering rods 422 is fixedly connected to the drive mechanism 3, and the other end of the two steering rods 422 is slidably connected in the two sliding grooves 4211 respectively. One end of two fixed rods 423 is connected to the drive mechanism 3, and the other end of the two fixed rods 423 is fixedly connected to arc plates 424 respectively. The two arc plates 424 are slidably connected in the limiting grooves 4212 respectively.

[0031] Reference Figure 1 and Figure 2The drive mechanism 3 includes a fixed column 31, one end of which is fixedly connected to the support platform 2. The fixed end of the fixed column 31 away from the support platform 2 is fixedly connected to the fixed end of the motor 32. The output end of the motor 32 passes through and is rotatably connected to the side wall of the fixed column 31. The output shaft of the motor 32 is connected to the locking mechanism 6. Two cams 33 are symmetrically arranged on the output shaft of the motor 32. The two cams 33 are coaxially sleeved and fixedly connected to the output shaft of the motor 32. The cams 33 are connected to the lifting mechanism 5. The line connecting the axis of the cam 33 and the farthest point of the cam 33 is parallel to the axis of the steering rod 422. A fixed ring 34 is coaxially sleeved and fixedly connected to the output shaft of the motor 32. Two steering rods 422 are symmetrically arranged and fixedly connected to the peripheral side wall of the fixed ring 34. Two fixed rods 423 are symmetrically arranged and fixedly connected to the peripheral side wall of the fixed ring 34. The axis of the steering rod 422 and the axis of the fixed rod 423 are in the same plane.

[0032] The motor 32 drives the fixed ring 34 to rotate, which in turn drives the two steering rods 422 to move. The steering rods 422 slide within the slide groove 4211, causing the rotating drum 421 to rotate. The rotation of the rotating drum 421 drives the lifting mechanism 5 to rotate, which in turn drives the auxiliary sleeve 44 to move. The movement of the auxiliary sleeve 44 drives the first telescopic rod 43 to move. The auxiliary sleeve 44 and the first telescopic rod 43 make the movement of the lifting mechanism 5 more stable. The movement of the fixed ring 34 drives the fixed rod 423 to move, which in turn drives the arc plate 424 to move. The arc plate 424 slides within the limiting groove 4212, making the lifting mechanism 5 more stable after the rotating drum 421 drives it to rotate. This improves the stability of wafer transportation and increases the transfer efficiency of the wafer.

[0033] Reference Figure 1 and Figure 2 The lifting mechanism 5 includes a second telescopic rod 52. The fixed end of the second telescopic rod 52 is fixedly connected to the support platform 2. The movable end of the second telescopic rod 52 is fixedly connected to one end with a push plate 51. The other end of the push plate 51 is rotatably connected to one end of a sliding rod 54. A guide rod 57 is fixedly connected to the bottom wall of the end of the push plate 51 near the sliding rod 54. The guide rod 57 is slidably connected to the top wall of the support platform 2. A spring 53 is sleeved on the second telescopic rod 52. One end of the spring 53 is fixedly connected to the top of the support platform 2. The other end of the spring 53 is fixedly connected to the bottom end of the push plate 51. The sliding rod 54 passes through and slides on the rotating drum 421. The end of the sliding rod 54 away from the push plate 51 is fixedly connected to a first electric telescopic rod 55. The movable end of the first electric telescopic rod 55 passes through and is fixedly connected to a placement rod 56. The other end of the placement rod 56 is fixedly connected to a vacuum suction cup 7. The axis of the placement rod 56 is perpendicular to the axis of the first electric telescopic rod 55. The first electric telescopic rod 55 is connected to a locking mechanism 6.

[0034] The motor 32 drives the cam 33 to rotate. When the drum 421 rotates, the cam 33 rotates and drives the push plate 51 to move downward. The downward movement of the push plate 51 causes the second telescopic rod 52 to retract, the spring 53 to retract, the push plate 51 drives the sliding rod 54 to move downward, the sliding rod 54 drives the first electric telescopic rod 55 to move, the first electric telescopic rod 55 drives the placement rod 56 to move, the placement rod 56 drives the vacuum suction cup 7 to move, the vacuum suction cup 7 picks up the wafer, reducing contact between people and the wafer, improving the wafer processing quality, and increasing the wafer transfer efficiency. The guide rod 57 ensures the sliding stability of the sliding rod 54 and improves the service life of the wafer transfer equipment.

[0035] Reference Figure 1 and Figure 2 The locking mechanism 6 includes a ratchet 61, which is coaxially sleeved and fixedly connected to the output shaft of the motor 32. The ratchet 61 is engaged with a pawl 62, which is hinged to the side wall of the fixed column 31. The pawl 62 abuts against the movable end of the second electric telescopic rod 63. The fixed end of the second electric telescopic rod 63 is fixedly connected to the support platform 2. The second electric telescopic rod 63 is electrically connected to a controller, which is electrically connected to the first electric telescopic rod 55.

[0036] During the extension and retraction of the first electric telescopic rod 55, the controller causes the second electric telescopic rod 63 to extend. The extension of the second telescopic rod 52 drives the pawl 62 to move. The pawl 62 engages with the ratchet 61, causing the motor 32 to stop rotating. When the first electric telescopic rod 55 stops moving, the second electric telescopic rod 63 retracts, causing the pawl 62 and the ratchet 61 to disengage, thus improving the adsorption stability of the vacuum suction cup 7.

[0037] The implementation principle of a wafer transfer device according to an embodiment of this application is as follows: the linear motor 1 moves to drive the support platform 2, which improves the application range of the wafer transfer device; the drive mechanism 3 moves to drive the rotating mechanism 4 and rotates; the rotating mechanism 4 moves to drive the lifting mechanism 5 to rotate; the rotating mechanism 4 moves to drive the vacuum chuck 7 to move; the vacuum chuck 7 clamps the wafer; the rotating mechanism 4 drives the vacuum chuck 7 to rotate, which prevents manual transfer of the wafer, improves the wafer processing quality, and increases the wafer transfer efficiency.

[0038] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A wafer transfer device, characterized in that, include: Linear motor (1); Support platform (2), which is mounted on the movable end of the linear motor (1); A drive mechanism (3) is mounted on the support platform (2); A rotating mechanism (4) is mounted on the support platform (2). The rotating mechanism (4) is connected to the driving mechanism (3). The driving mechanism (3) is used to drive the rotating mechanism (4) to move. The lifting mechanism (5) is installed on the support platform (2), the lifting mechanism (5) is connected to the drive mechanism (3), the elevator is connected to the rotating mechanism (4), and the rotating mechanism (4) is used to drive the lifting mechanism (5) to rotate. Vacuum suction cup (7) is mounted on the lifting mechanism (5).

2. The wafer transfer equipment according to claim 1, characterized in that, The rotating mechanism (4) includes; A support frame (41) is fixedly connected to the support platform (2). A rotating assembly is mounted on the support frame (41), the rotating assembly is connected to the drive mechanism (3), the rotating assembly is connected to the lifting mechanism (5), and the rotating assembly is used to drive the lifting mechanism (5) to move; The first telescopic rod (43) has one end of its fixed end hinged to the support frame (41); An auxiliary sleeve (44) is rotatably connected to the movable end of the first telescopic rod (43) and is connected to the lifting mechanism (5).

3. The wafer transfer equipment according to claim 2, characterized in that, The rotating assembly includes: A rotating cylinder (421) is inserted through and rotatably connected to the support frame (41) at both ends. The rotating cylinder (421) is connected to the lifting mechanism (5). Two sliding grooves (4211) are symmetrically opened on the outer side wall of the rotating cylinder (421). The two sliding grooves (4211) intersect. Two limiting grooves (4212) are symmetrically and through the top wall of the rotating cylinder (421). Two steering rods (422) are mounted on the drive mechanism (3), and the two steering rods (422) are slidably connected in the two slide grooves (4211); Two fixed rods (423), one end of each of the two fixed rods (423) is mounted on the drive mechanism (3); Two arc-shaped plates (424) are mounted on the end of the fixed rod (423) away from the driving mechanism (3), and the two arc-shaped plates (424) are slidably connected in the two limiting grooves (4212).

4. The wafer transfer apparatus according to claim 3, characterized in that, The drive mechanism (3) includes: A fixed column (31) is fixedly connected at one end to the support platform (2); The motor (32) has its fixed end fixedly connected to the fixed column (31), and its output end is inserted through and rotatably connected to the fixed column (31). A fixed ring (34) is coaxially sleeved and fixedly connected to the output shaft of the motor (32). Two steering rods (422) are evenly arranged and fixedly connected to the peripheral sidewall of the fixed ring (34). Two fixed rods (423) are evenly arranged and fixedly connected to the peripheral sidewall of the fixed ring (34). The axis of the steering rod (422) and the axis of the fixed rod (423) are in the same plane. Two cams (33) are symmetrically arranged on the output shaft of the motor (32). Both cams (33) are coaxially sleeved and fixedly connected to the output shaft of the motor (32). The cams (33) are connected to the lifting mechanism (5).

5. The wafer transfer apparatus according to claim 4, characterized in that, The lifting mechanism (5) includes: The second telescopic rod (52) has its fixed end fixedly connected to the support platform (2); A sliding rod (54) passes through and is slidably connected to the rotating cylinder (421). Push plate (51), one end of push plate (51) is fixedly connected to the movable end of the second telescopic rod (52), the other end of push plate (51) is rotatably connected to one end of sliding rod (54), and the end of push plate (51) near the second telescopic rod (52) abuts against the cam (33); Spring (53), the spring (53) is sleeved on the second telescopic rod (52), one end of the spring (53) is fixedly connected to the support platform (2), and the other end of the spring (53) is fixedly connected to the push plate (51); The first electric telescopic rod (55) has its fixed end fixedly connected to the side wall of the sliding rod (54) away from the push plate (51), and the axis of the first electric telescopic rod (55) is perpendicular to the axis of the sliding rod (54). A placement rod (56) is provided, with one end of which is inserted through and fixedly connected to the movable end of the first electric telescopic rod (55). The other end of the placement rod (56) is connected to a vacuum suction cup (7). The axis of the placement rod (56) is perpendicular to the axis of the first electric telescopic rod (55). The placement rod (56) is inserted through and slidably connected to the auxiliary sleeve (44).

6. The wafer transfer apparatus according to claim 5, characterized in that: A guide rod (57) is fixedly connected to the bottom wall of one end of the push plate (51) near the sliding rod (54). The guide rod (57) is slidably connected to the support platform (2), and the axis of the guide rod (57) is perpendicular to the plane of the top wall of the support platform (2).

7. The wafer transfer apparatus according to claim 5, characterized in that, The support platform (2) is also equipped with a locking mechanism (6), which includes: Ratchet (61), the ratchet (61) is coaxially sleeved and fixedly connected to the output shaft of the motor (32); A pawl (62) is rotatably connected to the fixed post (31), and the pawl (62) is engaged with the ratchet (61); The second electric telescopic rod (63) has its fixed end fixedly connected to the support platform (2), and its movable end abuts against the pawl (62). The second electric telescopic rod (63) is electrically connected to a controller, which is electrically connected to the first electric telescopic rod (55).

8. The wafer transfer apparatus according to claim 4, characterized in that: The line connecting the axis of the cam (33) and the farthest point of the cam (33) is parallel to the axis of the steering rod (422).

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