Secondary separation film tearing method and equipment for wafer for satellite solar cell

Abstract

The invention discloses a secondary separation film tearing method and equipment of a wafer for a satellite solar cell. The method aims at a rigid silicon wafer and a flexible chip which are bonded by a pyrolysis film and a photolysis film, and comprises the following steps: S1, performing pyrolysis treatment on an original wafer to layer the original wafer; s2, judging the residual position of the pyrolysis film through an identification camera, carrying out shunting treatment, directly stripping and recycling if the film is left at the bottom of the chip, and transferring the film to a material throwing mechanism by a second carrying mechanism if the film is left at the top of the silicon wafer; s3, carrying out ultraviolet photolysis treatment on the chip; s4, carrying out secondary stripping and recycling the photolysis film; and S5, collecting a finished product. The equipment is matched with a pyrolysis system, a photolysis system, a camera and a carrying system composed of a plurality of precise lead screw modules. According to the invention, the working procedure problem caused by the uncertainty of the residual position of the pyrolysis film is solved through visual identification, the ultrathin flexible chip is stripped and protected by utilizing vertical micro stress, the full-process automatic lossless film tearing is realized, and the production efficiency and the yield are remarkably improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor wafer processing and automation equipment technology, specifically to a precision stripping technology for satellite solar cell wafers, and particularly to a secondary separation and film-removing method and equipment that can be compatible with both thermal and photolytic bonding logic and achieve non-destructive separation of flexible chips and rigid silicon wafers. Background Technology

[0002] In the manufacturing process of satellite solar cell wafers, to ensure that the ultra-thin, highly brittle flexible chips do not break during complex process flows, thermally dissolving films (thermal peeling films) and photolyzing films (ultraviolet light peeling films) are typically used to bond the flexible chips to the rigid silicon wafer (supporting substrate). This double-layer film structure not only provides extremely high bonding strength but also serves as physical protection.

[0003] However, existing film-peeling technologies have significant drawbacks: Excessive peeling stress: Traditional roller tearing or mechanical force pulling generates huge instantaneous shear force at the moment of peeling, causing micro-cracks or even shattering of the extremely thin flexible chip.

[0004] Lack of secondary separation capability: Most existing equipment can only process single-layer membranes and cannot complete the continuous and differentiated stripping of pyrolysis membranes and photolysis membranes in the same process.

[0005] Uncertainty in residual location: After pyrolysis, the pyrolysis film may be randomly left on the bottom of the chip or the top of the silicon wafer due to slight differences in physical viscosity. Existing automated production lines lack intelligent identification and handling mechanisms for this random state, which can easily lead to process blockage or secondary contamination. Summary of the Invention

[0006] In order to overcome the shortcomings of the prior art, the present invention aims to provide a technical solution that can solve the above problems.

[0007] This invention provides a secondary separation and film-removal method for wafers used in satellite solar cells. The wafer comprises a rigid silicon wafer and a flexible chip bonded together by a thermally dissolving film and a photolyzing film. The method includes the following steps: Pyrolysis treatment: The original wafer is moved to a pyrolysis mechanism for pyrolysis treatment to separate the rigid silicon wafer from the flexible chip; Position determination and current splitting: Visual recognition is performed on the bottom of the pyrolyzed flexible chip, and the following branch steps are executed based on the determination result: If the pyrolysis film remains on the bottom of the flexible chip, the flexible chip is moved to the discharge position, the pyrolysis film on the bottom of the flexible chip is peeled off and recycled, and then step S3 is performed; If the pyrolysis film is not left on the bottom of the flexible chip, the pyrolysis film left on the top of the silicon wafer at the pyrolysis mechanism is peeled off and recycled, and the flexible chip is then subjected to step S3. Photolysis: The flexible chip without the pyrolysis film is moved to the photolysis mechanism for ultraviolet photolysis. Secondary film peeling: peeling off and recycling the photolytic film that has undergone photolytic treatment on the bottom of the flexible chip; Finished product collection: The flexible chip after the film is peeled off is moved to the discharge mechanism for collection.

[0008] Furthermore: The process preceding step S1 also includes: The first conveying mechanism picks up the original film from the feeding mechanism and sends it to the centering mechanism for centering processing; Step S5 is followed by: recycling the silicon wafers remaining at the pyrolysis mechanism to the feeding mechanism via the first conveying mechanism.

[0009] Further: The process of peeling off the pyrolysis film in step S2.1 includes: the third conveying mechanism drives the third suction cup with the flexible chip adsorbed to descend, placing the flexible chip on the throwing suction cup of the throwing mechanism, so that the throwing suction cup adsorbs the pyrolysis film; the third suction cup holds the adsorbed flexible chip and rises, realizing the separation of the pyrolysis film from the flexible chip.

[0010] Further: The process of recovering the pyrolysis film in step S2.2 includes: the pyrolysis mechanism adsorbs and fixes the silicon wafer, the second suction cup of the second transport mechanism adsorbs and peels off the pyrolysis film on the top of the silicon wafer; the second transport mechanism transfers the pyrolysis film to the discharge suction cup of the discharge mechanism for subsequent recovery.

[0011] Furthermore, the action of the throwing mechanism to recover the membrane includes: after the throwing suction cup adsorbs the membrane, it rotates the actuator to flip it at a preset angle so that the membrane faces the suction port of the waste membrane recovery device; the adsorption force is released, and the membrane is sucked in by the negative pressure generated by the waste membrane recovery device.

[0012] The present invention also provides a secondary separation and film-tearing device for implementing the above method, comprising: The pyrolysis mechanism and the photolysis mechanism are used to pyrolyze and photolyze the original film, respectively; A recognition camera is used to determine the location of residual pyrolysis film; The material throwing mechanism, including a material throwing suction cup and a waste film recycling device, is used to peel off and collect waste film; The transport system includes a second transport mechanism and a third transport mechanism, wherein the third transport mechanism is used to transfer flexible chips between pyrolysis, detection, photolysis and unloading processes.

[0013] Furthermore: the pyrolysis mechanism includes a heating plate, and the top of the heating plate is provided with a limiting guide block for limiting the original sheet; The heating plate has adsorption holes on its surface, and the adsorption holes are connected to a negative pressure tube to fix the rigid silicon wafer during the peeling process.

[0014] Furthermore, the throwing mechanism also includes a throwing longitudinal movement actuator and a rotation actuator, used to drive the throwing suction cup to switch between longitudinal movement and flipping action.

[0015] Furthermore: the pyrolysis mechanism and the recognition camera are arranged in a straight line in the longitudinal direction; The identification camera, photolysis mechanism, and waste film recycling device are arranged in a straight line in the horizontal direction.

[0016] Furthermore, the conveying system drives the suction cup to move linearly along the longitudinal or transverse direction via a single-axis actuator to achieve seamless conveying between adjacent processes.

[0017] Compared with the prior art, the beneficial effects of the present invention are: 1. Significantly reduce the damage rate of ultra-thin chips: Through pyrolysis / photolysis physical modification-assisted peeling and vertical displacement peeling, the mechanical stress on the chip is reduced by more than 90%, solving the industry problem of flexible chips being extremely prone to edge breakage.

[0018] 2. Intelligent handling of residual uncertainty: The pioneering "detection-diversion-parallel cleaning" mechanism based on visual judgment achieves 100% coverage of the residual state of the pyrolysis film, avoiding damage to downstream modules caused by film residue.

[0019] 3. Ultimate optimization of spatial and temporal rhythm: The "straight line" mechanism layout greatly shortens the transportation path. Combined with the parallel operation mode of the second and third transportation mechanisms, the single-sheet tearing cycle is shortened by more than 40%.

[0020] 4. Resource recycling and environmental protection closed loop: A dedicated silicon wafer recycling path has been set up to enable the high-value rigid silicon wafers to be recycled; at the same time, the waste membrane recycling device ensures the cleanliness of the production environment.

[0021] 5. High equipment reliability: The fully enclosed screw module and magnetically coupled rodless cylinder reduce dust generation and mechanical wear, meeting the precision and high cleanliness requirements of satellite component manufacturing.

[0022] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is the overall process flow diagram of the present invention; Figure 2 This is the S2 core branch discrimination logic diagram of the present invention; Figure 3 This is a schematic diagram of the feeding mechanism and the discharging mechanism of the present invention; Figure 4 This is a schematic diagram of the second and third suction cups of the present invention in their initial state; Figure 5 This is a schematic diagram of the structure of the third suction cup of the present invention positioned above the pyrolysis mechanism; Figure 6 This is a schematic diagram of the structure of the second suction cup and the material throwing suction cup of the present invention in a matched state; Figure 7 This is a schematic diagram showing the positions of the various mechanisms in the same straight line state according to the present invention; Figure 8 This is a schematic diagram of the structure of the heating plate and the limiting guide block of the present invention; Figure 9 This is a schematic diagram of the heating plate and negative pressure tube of the present invention.

[0025] The reference numerals and names in the figure are as follows: 10 Feeding mechanism; 11 Casing box; 12 Discharge mechanism; 13 Pallet; 14 First handling mechanism; 20 Centering mechanism; 21 Photolysis mechanism; 22 Identification camera; 30 Pyrolysis mechanism; 31 Heating plate; 32 Limiting guide block; 33 Adsorption hole; 34 Negative pressure tube; 35 Temperature sensor; 36 Over-temperature protector; 40 Throwing mechanism; 41 Throwing longitudinal movement actuator; 42 Rotary actuator; 43 Throwing suction cup; 44 Waste film recycling device; 50 Second handling mechanism; 51 Second suction cup; 52 Second transverse movement actuator; 53 Second vertical movement actuator; 60 Third handling mechanism; 61 Third suction cup; 62 Third vertical movement actuator; 63 Third longitudinal movement actuator; 64 Third transverse movement actuator. Detailed Implementation

[0026] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] Please see Figures 1 to 9 This invention solves the problem of non-destructive separation of ultrathin chips from a physical mechanism perspective by constructing an automated system that integrates pyrolysis, visual discrimination, precise film tearing, and photolysis.

[0028] 1. Thermodynamic stripping mechanism and precise positioning (S1 step): This scheme uses a pyrolysis mechanism (30) as the first processing unit. Its core physical principle is to use the heat energy generated by the heating wire to transfer to the heating plate (31), so that the chemical bonds in the pyrolysis film will expand or decompose due to heat, thereby reducing its interfacial shear strength.

[0029] In addition, to achieve precise closed-loop control and safety protection of the heat treatment process, a temperature sensor (35) and an over-temperature protector (36) are also embedded in the heating plate (31). The temperature sensor (35) (preferably a PT100 resistance thermometer or a K-type thermocouple) is closely attached to the surface of the heating plate (31) below the substrate. It is used to collect the current temperature signal of the heating plate (31) in real time and feed it back to the external control system so as to adjust the output power of the heating wire through the PID algorithm to ensure that the pyrolysis temperature is constant in the optimal decomposition range of the pyrolysis film (e.g., 90℃-120℃). The over-temperature protector (36) (preferably a bimetallic strip temperature control switch or a thermal fuse) is connected in series with the power supply circuit of the heating wire. Its temperature sensing end senses the extreme temperature of the heating plate (31). When the temperature exceeds the safety threshold (e.g., 150℃) due to controller failure, the over-temperature protector (36) can physically cut off the heating circuit to prevent high temperature damage to the flexible chip or mechanical deformation.

[0030] Structural logic: The structure is equipped with a limiting guide block (32), which uses its inclined surface to guide the original sheet to fall accurately into the preset position, ensuring the uniformity of heat conduction.

[0031] Adsorption protection: The rigid silicon wafer is physically locked during the peeling process by the stable adsorption force provided by the adsorption hole (33) and the negative pressure tube (34) to prevent mechanical disturbances caused by its movement from damaging the chip.

[0032] 2. Visual intelligent diversion logic (S2 step): To address the uncertainty of the residual position of the film after pyrolysis, a recognition camera (22) and a visual recognition module of the automated control system are introduced.

[0033] Physical function: By detecting the difference in reflectivity at the bottom of the flexible chip under different spectral illuminations (in conjunction with a ring lamp), the presence and state of the semi-transparent pyrolysis film can be determined.

[0034] S2.1 / S2.2 Diversion Logic: If the diaphragm is on the bottom of the chip, a precise connection stripping is performed by the third transport mechanism (60); if the diaphragm is on the silicon wafer, it is cleaned independently by the second transport mechanism (50). This decoupling of physical processes greatly improves the system's fault tolerance and production cycle time.

[0035] 3. Precision film tearing and waste film recycling principle (S2.1 / S4 steps): This solution abandons the traditional pull-type peeling and adopts a micro-stress peeling method based on "active adsorption-vertical lifting".

[0036] Collaboration process: The material ejector (43) and the third suction cup (61) form a vertical top-to-top adsorption. The third vertical movement actuator (62) rises smoothly at the sub-millimeter level, so that the diaphragm is subjected to force in the vertical direction. The diaphragm itself is used to achieve gradual desorption.

[0037] High-efficiency recycling: The rotating actuator (42) drives the material suction cup to rotate 180°, so that the waste film is facing the negative pressure port of the waste film recycling device (44), and is instantly extracted using the principle of fluid mechanics, avoiding secondary pollution caused by the drift of the waste film inside the equipment.

[0038] 4. Photolysis Modification and Secondary Separation (S3 / S4 Steps): For photolyzable films with extremely high adhesion strength, this scheme uses ultraviolet photochemical reaction in the photolysis mechanism (21) to destroy its polymer chains, causing it to completely lose its adhesion. At this time, when the peeling action is performed, the stress on the chip is almost zero, thereby achieving the physical goal of "non-destructive processing".

[0039] 5. Motion path optimization and efficient integration: In order to reduce the impact of mechanical vibration on brittle parts, the equipment adopts a "same straight line" layout.

[0040] Physical advantages: Multiple mechanisms are aligned longitudinally or laterally, so that the second handling mechanism (50) and the third handling mechanism (60) only need to perform single-axis (X-axis or Y-axis) movement most of the time, avoiding the cumulative tolerance and vibration energy generated by multi-axis linkage, and ensuring extremely high repeatability of handling.

[0041] like Figures 2 to 5 As shown, the preferred recycling operation of the throwing mechanism (40) includes the following steps: using the throwing suction cup (43) of the throwing mechanism (40) to adsorb the membrane, moving the throwing suction cup (43) to the suction port above the waste membrane recycling device (44), flipping the throwing suction cup (43) so that the adsorbed membrane faces the suction port, and then releasing the adsorption force of the throwing suction cup (43) so that the membrane is sucked into the waste membrane recycling device (44).

[0042] Specifically, in order to recycle pyrolytic and photolytic membranes, a material ejector (43) and a waste membrane recycling device (44) are preferably provided. The material ejector (43) can adsorb the membrane, and then move upward through the vertical actuator of the second transport mechanism (50) or the third transport mechanism (60) to peel off the corresponding membrane. The waste membrane recycling device (44) can be configured using a negative pressure recycling device. The material ejector (40) also needs to be equipped with a rotating actuator (42) to rotate the material ejector (43) 180°, so that the adsorbed membrane is rotated synchronously and faces the suction port of the waste membrane recycling device (44), so that after the membrane is released, it can be accurately sucked into the waste membrane recycling device (44).

[0043] like Figures 2 to 3 As shown, preferably, in step S2.1, the material throwing mechanism (40) peels off and recycles the pyrolysis film, specifically including: the third transport mechanism (60) drives the third suction cup (61) to move laterally a preset distance only through the third lateral movement actuator (64), moving the flexible chip adsorbed by the third suction cup (61) from above the recognition camera (22) to above the waste film recycling device (44); the material throwing suction cup (43) of the material throwing mechanism (40) moves to above the waste film recycling device (44) and below the third suction cup (61); the third transport mechanism (60) drives the third suction cup (61) downward through the third vertical movement actuator (62). The flexible chip is lowered to a preset height and placed on the ejector suction cup (43). The ejector suction cup (43) then adsorbs and fixes the pyrolysis film on the bottom of the flexible chip. Subsequently, the third vertical movement actuator (62) of the third conveying mechanism (60) drives the third suction cup (61) to rise to a preset height, and the third suction cup (61) maintains the adsorption effect on the flexible chip, thereby peeling the pyrolysis film off onto the ejector suction cup (43). The ejector suction cup (43) flips the adsorbed and peeled pyrolysis film so that the pyrolysis film faces the suction port of the waste film recycling device (44). Then, the adsorption force of the ejector suction cup (43) is released, and the pyrolysis film is sucked into the waste film recycling device (44).

[0044] Specifically, since the waste film recycling device (44) and the identification camera (22) are on the same straight line in the horizontal direction, the third transport mechanism (60) can move the third suction cup (61) and the flexible chip to the waste film recycling device (44) simply by using the third lateral movement actuator (64), thereby simplifying the movement path, reducing the difficulty of the third transport mechanism (60) in adjusting, and improving the movement accuracy. The material throwing mechanism (40)'s material throwing suction cup (43) is also located directly above the waste film recycling device (44), so that after it peels off the pyrolysis film, it does not need to move longitudinally. It can directly flip the material throwing suction cup (43) to release and recycle the pyrolysis film.

[0045] like Figures 4 to 5As shown, preferably, in step S2.2, the material throwing mechanism (40) peels off and recycles the pyrolysis film, specifically including: the pyrolysis mechanism (30) adsorbs and fixes the silicon wafer; the second suction cup (51) of the second transport mechanism (50) adsorbs the pyrolysis film left on the top of the silicon wafer; the second vertical movement actuator (53) of the second transport mechanism (50) moves upward to peel the pyrolysis film off the silicon wafer; the material throwing suction cup (43) of the material throwing mechanism (40) moves longitudinally to a position on the same line as the pyrolysis mechanism (30) in the lateral direction and waits; the second transport mechanism (50) drives the second suction cup (51) to move laterally a preset distance only through the second lateral movement actuator (52) to move the pyrolysis film adsorbed by the second suction cup (51) from above the pyrolysis mechanism (30) to the material throwing suction cup. Above (43), the second transport mechanism (50) drives the second suction cup (51) to descend a preset height through the second vertical movement actuator (53), placing the pyrolysis film on the material throwing suction cup (43), so that the material throwing suction cup (43) adsorbs and fixes the pyrolysis film. Then the second suction cup (51) releases the adsorption force on the pyrolysis film, and the second vertical movement actuator (53) of the second transport mechanism (50) drives the second suction cup (51) to rise a preset height, so that the pyrolysis film is peeled off on the material throwing suction cup (43). The material throwing suction cup (43) moves longitudinally to above the waste film recycling device (44), and then flips the pyrolysis film so that the pyrolysis film faces the suction port of the waste film recycling device (44). Then the adsorption force of the material throwing suction cup (43) is released, so that the pyrolysis film is sucked into the waste film recycling device (44).

[0046] Specifically, in order to further simplify the structure of the second conveying mechanism (50) so that it does not need to be equipped with a second longitudinal movement actuator, preferably, a longitudinal movement actuator (41) is provided on the throwing mechanism (40). Since the rotating actuator (42) and the throwing suction cup (43) of the throwing mechanism (40) are relatively light, the size and power of the longitudinal movement actuator (41) can be set to be small, thereby saving costs. Similarly, the centering mechanism (20) and the pyrolysis mechanism (30) are both on the same straight line in the transverse direction, and the throwing suction cup (43) of the throwing mechanism (40) can also move longitudinally to the same straight line under the drive of the longitudinal movement actuator (41), thereby simplifying the assembly complexity of the second conveying mechanism (50) and enabling the second suction cup (51) to move laterally between the centering mechanism (20), the pyrolysis mechanism (30) and the throwing suction cup (43) by means of the second transverse movement actuator (52).

[0047] like Figure 3 and Figure 5As shown, preferably, in step S2, the third transport mechanism (60) drives the third suction cup (61) to move longitudinally only through the third longitudinal actuator (63), moving the flexible chip from the pyrolysis mechanism (30) to the recognition camera (22) which is in the same longitudinal line as the pyrolysis mechanism (30).

[0048] Specifically, similarly, the installation positions of the pyrolysis mechanism (30) and the recognition camera (22) can be configured to be on the same straight line in the longitudinal direction, thereby simplifying the motion logic of the third conveying mechanism (60) so that the third suction cup (61) can be driven to move back and forth between the pyrolysis mechanism (30) and the recognition camera (22) simply by using the third longitudinal actuator (63).

[0049] like Figures 2 to 5 As shown, preferably, in steps S3 and S4, the third transport mechanism (60) drives the third suction cup (61) to move laterally only by the third lateral movement actuator (64), thereby driving the flexible chip to move back and forth between the recognition camera (22), the photolysis mechanism (21), and the waste film recycling device (44), and the recognition camera (22), the photolysis mechanism (21), and the waste film recycling device (44) are in the same straight line laterally.

[0050] Specifically, similarly, the installation positions of the identification camera (22), the photolysis mechanism (21), and the waste film recycling device (44) can be configured to be on the same straight line in the lateral direction, thereby simplifying the movement complexity of the third transport mechanism (60) and allowing it to be easily driven by the third lateral movement actuator (64) to move the third suction cup (61) back and forth between the identification camera (22), the photolysis mechanism (21), and the waste film recycling device (44). For example, in step S3, the third lateral movement actuator (64) can directly drive the third suction cup (61) from the identification camera (22) to the photolysis mechanism (21) for photolysis. In step S4, the third lateral movement actuator (64) can directly drive the third suction cup (61) from the photolysis mechanism (21) to the waste film recycling device (44) to perform the tearing and recycling operation of the photolyzed film.

[0051] Specific embodiments of the present invention are described below: I. Static Mechanical Structure and Assembly Logic The present invention provides a secondary separation and film-removing device for satellite solar cell wafers, which mainly consists of a material flow system, a precision positioning system, a physical modification system, a vision decision system, and a differential film-removing and recycling system.

[0052] 1. Material flow and supporting structure The equipment is equipped with a feeding mechanism (10) and a discharging mechanism (12). The feeding mechanism (10) is equipped with a feeding cassette (11) for carrying the wafer wafer formed by sequentially stacking and bonding rigid silicon wafers, thermally dissolving films, photolyzing films and flexible chips. The discharging mechanism (12) is equipped with a discharging tray (13) for collecting the finished flexible chips after peeling with high purity.

[0053] The first handling mechanism (14) preferably adopts a single-arm robot in the prior art, with a dedicated wafer finger connected to the flange at the end of the arm. The structure of the finger is designed to adapt to the size of the original wafer and the rigid silicon wafer after stripping, and is responsible for large-stroke material scheduling between the feeding, centering, pyrolysis and finished product collection processes.

[0054] 2. Precision processing and modification unit Centering mechanism (20): Receives the original film sent by the first transport mechanism (14), and uses the mechanical centering principle to perform precise physical positioning of the original film to achieve centering and edge flattening processing.

[0055] The pyrolysis mechanism (30) is the key heat treatment unit of this equipment, including the heating plate (31). The heating plate (31) has a resistive heating wire embedded inside, which is adjusted to the critical decomposition temperature of the pyrolysis film by an external temperature control module. The top surface of the heating plate (31) is fixed with a limit guide block (32) by screws. The limit guide block (32) has a guide slope on the side facing the center to compensate for the slight positional deviation during the handling process. The surface of the heating plate (31) is provided with an array of adsorption holes (33). After the adsorption holes (33) are gathered inside the plate, they are connected to an external vacuum pump through a negative pressure pipe (34) to provide an adsorption force greater than the peel stress for the rigid silicon wafer.

[0056] Photolysis mechanism (21): It is equipped with an ultraviolet light source (UV lamp) inside, which causes photochemical lysis of the photolysis film by irradiation with a specific wavelength, thereby eliminating stickiness.

[0057] Identification camera (22): installed at the junction of the pyrolysis and photolysis stations, with its optical axis pointing vertically upward, used to capture the micro-morphology of the back of the flexible chip, that is, to acquire images of the back of the chip after pyrolysis and determine the physical position of the pyrolysis film.

[0058] 3. Precision film tearing and actuator model The throwing mechanism (40) includes a throwing longitudinal movement actuator (41), which preferably uses a magnetically coupled rodless cylinder (model: RMH20X200S) to achieve long-stroke reciprocating motion in a compact space; the rotary actuator (42) preferably uses an HRQ series rotary cylinder to drive the throwing suction cup (43) to switch between the horizontal adsorption position and the flipping throwing position. The matching waste membrane recycling device (44) generates a negative pressure vortex through a funnel-shaped suction port to achieve physical peeling and negative pressure extraction of the membrane.

[0059] The second conveying mechanism (50) drives the second suction cup (51) to move. Its second lateral movement actuator (53) preferably adopts a fully enclosed screw module (model: GCH10-L10-300), which is responsible for lateral movement across workstations to ensure smooth movement; the second vertical movement actuator (52) preferably adopts a cylinder with a guide rod (model: TCL16X100S), which is not only responsible for vertical gripping, but also undertakes the instantaneous lifting action of peeling the film. And the guide rod structure is used to resist lateral force and maintain axial rigidity when peeling the pyrolytic film.

[0060] The third transport mechanism (60) drives the third suction cup (61) to move. Its third longitudinal actuator (63) and third transverse actuator (64) are preferably fully enclosed screw modules (models GCH10-L10-400 and GCH14A-L20-1050, respectively), forming an XY plane motion platform to create a high-precision Cartesian coordinate robot. The third vertical actuator (62) drives the third suction cup (61) to rise and fall, and also has the precise displacement control function for peeling action.

[0061] II. Dynamic Process Methods and Logical Closed Loop The secondary separation and film-tearing method of this scheme is implemented through the following logical steps based on the above mechanical structure: S1: Pyrolysis Pretreatment and Bottom Layer Locking The first transport mechanism (14) picks up the wafer from the loading cassette (11) and sends it to the centering mechanism (20). After centering, the second transport mechanism (50) picks up the wafer through the second suction cup (51) and moves it along a straight trajectory to the pyrolysis mechanism (30). The wafer falls onto the heating plate (31) along the limiting guide block (32). At this time, the negative pressure tube (34) is purged with vacuum, and the adsorption hole (33) firmly adsorbs the rigid silicon wafer at the bottom. The heating plate (31) releases heat, causing the interfacial energy level transition of the pyrolysis film layer, and the viscosity decreases significantly.

[0062] During the pyrolysis process in S1, the system monitors the temperature rise curve of the heating plate (31) in real time through the temperature sensor (35). When the monitored temperature reaches the preset pyrolysis trigger point, the system issues a ready signal, at which point the second conveying mechanism (50) performs the action of placing the original wafer. Throughout the pyrolysis dwell time, the temperature sensor (35) continuously feeds back data to maintain the uniformity of the thermal field. At the same time, the over-temperature protector (36) monitors the entire process as the underlying hardware protection logic. Once a temperature control imbalance occurs, it immediately forces the heating to stop and triggers an equipment alarm, thereby ensuring the thermal safety of the ultra-thin satellite battery wafer in the pyrolysis process from a physical perspective.

[0063] S2: Visual Recognition Decision and Differential Processing Path The third transport mechanism (60) descends via the third suction cup (61), adsorbs the flexible chip on the top layer, and performs a vertical lifting action. At this time, the flexible chip is physically separated from the silicon wafer. The third transport mechanism (60) moves the flexible chip above the recognition camera (22) for visual recognition. Due to the fluctuation of the physical properties of the pyrolysis film, the film may exist in two states after separation: S2.1: The membrane moves with the chip. The recognition camera (22) determines that the flexible chip has a pyrolytic membrane on its bottom. The third transport mechanism (60) moves the chip above the throwing mechanism (40). The third vertical movement actuator (62) drives the chip down, so that the pyrolytic membrane on the bottom of the chip is pressed onto the throwing suction cup (43), so that the pyrolytic membrane adheres to the throwing suction cup (43), and the throwing suction cup (43) opens a strong negative pressure to adsorb the membrane. Subsequently, the third vertical movement actuator (62) drives the chip to move upward slightly and pull it in the opposite direction. The vertical tensile force overcomes the residual adhesion, and the reverse stress realizes the separation of "chip-membrane", leaving the pyrolytic membrane on the throwing suction cup (43).

[0064] S2.2: Film remains on the silicon wafer surface. The identification camera (22) determines that there is no film on the bottom of the flexible chip, so the pyrolysis film remains on the silicon wafer of the heating plate (31). The third transport mechanism (60) directly carries the flexible chip into the S3 station. At the same time, the second transport mechanism (50) moves to the pyrolysis mechanism (30), uses the second suction cup (51) to adsorb the pyrolysis film on the silicon wafer, and transports it to the discharge suction cup (43) in the same straight line for release.

[0065] S3: Photolysis Modification Treatment The third transport mechanism (60) moves the flexible chip with only the photolysis film above the photolysis mechanism (21) for ultraviolet irradiation. The ultraviolet light acts on the photolysis film. Through the chemical reaction of the photoinitiator, the cross-linking network of the photolysis film breaks down, which macroscopically manifests as the adhesion force dropping to near zero, and the photolysis film loses its adhesiveness.

[0066] S4: Secondary membrane tearing and closed-loop recycling of waste membrane The third transport mechanism (60) moves the chip to the ejector mechanism (40) again. A similar action to S2.1 is repeated: the third vertical actuator (62) descends to make pressure contact, the ejector suction cup (43) adsorbs the photolytic film, and then pulls it upwards. The final peeling of the photolytic film is completed using the adsorption force of the ejector suction cup (43) and the upward pulling force of the third suction cup (61). Since the photolytic film is completely degraded, this process does not cause any tensile damage to the ultra-thin flexible chip.

[0067] After receiving the waste membrane, the material throwing mechanism (40) rotates the actuator (42) to drive the material throwing suction cup (43) to flip. When rotated to 180 degrees or a preset angle, the material throwing suction cup (43) switches to positive pressure blowing mode, which, together with the negative pressure suction of the waste membrane recycling device (44), efficiently collects the membrane.

[0068] S5: Finished Product Collection and Substrate Recycling The third transport mechanism (60) places the flexible chip that has completed the second film peeling into the discharge tray (13). At the same time, the first transport mechanism (14) returns to the pyrolysis mechanism (30). At this time, the negative pressure tube (34) closes the adsorption. The first transport mechanism (14) grabs the rigid silicon wafer that has lost the negative pressure constraint and recycles it into the empty card box in the relevant area of ​​the feeding mechanism (10), completing the entire process cycle.

[0069] III. Analysis of the Mechanical Force Logic and Necessity of the Scheme 1. Necessity of vertical peeling: In this solution, the second vertical movement actuator (52) and the third vertical movement actuator (62) are both implemented in conjunction with guide rod cylinders or precision modules. The purpose is to ensure that the peeling stress vector direction is always perpendicular to the wafer plane. Compared with oblique tearing, vertical peeling can make the stress evenly distributed on the entire surface of the chip, avoiding edge chipping or cracks caused by local stress concentration.

[0070] 2. The necessity of the ball screw module (GCH series): The thickness of flexible chips used in satellites is typically in the micrometer range, and any vibration during handling can lead to material fatigue. Using a fully enclosed ball screw module provides an extremely smooth acceleration and deceleration curve, which is impossible with ordinary cylinders. This provides extremely high motion smoothness and avoids the vibration that traditional cylinders exhibit during the peeling process.

[0071] 3. Regarding the coordination logic of limiting and adsorption: The limiting guide block (32) solves the problem of "accurate placement", while the adsorption hole (33) solves the problem of "stable adsorption". At the moment of peeling off the pyrolysis film, if there is no reverse pulling force provided by the negative pressure tube (34), the underlying silicon wafer will jump accordingly. This physical collision is fatal to the flexible chip.

[0072] 4. The camera (22) and the pyrolysis mechanism (30) are aligned in the longitudinal direction, and the camera, the photolysis mechanism (21) and the waste film recycling device (44) are aligned in the transverse direction, forming an "L" or "cross" type efficient path, which greatly reduces the ineffective idle stroke of the actuator and ensures the safety and efficiency of the ultrathin wafer in the complex processing flow.

[0073] 5. Regarding the accuracy and safety of the temperature control system: Because flexible chips used in satellites are extremely sensitive to thermal stress, excessive temperature fluctuations can cause chip warping. Closed-loop control achieved through temperature sensors (35) ensures the consistency of the process, while the introduction of over-temperature protectors (36) solves the risk of catastrophic loss of control in unattended operation of precision automated production lines. This is an essential physical barrier for the production of high-value satellite components.

[0074] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within the present invention.

Claims

1. A secondary separation and film-removal method for wafers used in satellite solar cells, characterized in that, The wafer comprises a rigid silicon wafer and a flexible chip bonded together by a thermally dissolving film and a photolyzing film. The method includes the following steps: S1, pyrolysis treatment: The original wafer is moved to the pyrolysis mechanism (30) for pyrolysis treatment to separate the rigid silicon wafer from the flexible chip; S2, Position Determination and Diversion Processing: Visually identify the bottom of the pyrolyzed flexible chip and execute the following branch steps based on the determination result: S2.1 If the pyrolysis film remains on the bottom of the flexible chip, the flexible chip is moved to the discharge position, the pyrolysis film on the bottom of the flexible chip is peeled off and recycled, and then step S3 is executed. S2.2 If the pyrolysis film is not left on the bottom of the flexible chip, the pyrolysis film left on the top of the silicon wafer at the pyrolysis mechanism (30) is peeled off and recycled, and the flexible chip is then subjected to step S3. S3, Photolysis: The flexible chip without the pyrolysis film is moved to the photolysis mechanism (21) for ultraviolet photolysis. S4, Secondary film peeling: Peel off and recycle the photolytic film that has undergone photolytic treatment on the bottom of the flexible chip; S5, Finished product collection: The flexible chip after the film is peeled off is moved to the discharge mechanism (12) for collection.

2. The method according to claim 1, characterized in that, Step S1 is preceded by: The first conveying mechanism (14) grabs the original film from the feeding mechanism (10) and sends it to the centering mechanism (20) for centering processing; Step S5 is followed by: recycling the silicon wafers remaining at the pyrolysis mechanism (30) to the feeding mechanism (10) via the first transport mechanism (14).

3. The method according to claim 1, characterized in that, The process of peeling off the pyrolysis film in step S2.1 includes: the third transport mechanism (60) drives the third suction cup (61) with the flexible chip adsorbed to descend, and places the flexible chip on the throwing suction cup (43) of the throwing mechanism (40), so that the throwing suction cup (43) adsorbs the pyrolysis film; the third suction cup (61) holds the adsorbed flexible chip and rises, thereby realizing the separation of the pyrolysis film from the flexible chip.

4. The method according to claim 1, characterized in that, The process of recovering the pyrolysis film in step S2.2 includes: the pyrolysis mechanism (30) adsorbs and fixes the silicon wafer, the second suction cup (51) of the second transport mechanism (50) adsorbs and peels off the pyrolysis film on the top of the silicon wafer; the second transport mechanism (50) transfers the pyrolysis film to the discharge suction cup (43) of the discharge mechanism (40) for subsequent recovery.

5. The method according to claim 3 or 4, characterized in that, The action of the material throwing mechanism (40) to recover the membrane includes: after the material throwing suction cup (43) adsorbs the membrane, it rotates the actuator (42) to flip the membrane at a preset angle so that the membrane faces the suction port of the waste membrane recovery device (44); releases the adsorption force, and uses the negative pressure generated by the waste membrane recovery device (44) to suck the membrane in.

6. A secondary separation and film-tearing device for implementing the method of any one of claims 1-5, characterized in that, include: The pyrolysis mechanism (30) and the photolysis mechanism (21) are used to perform pyrolysis and photolysis treatment on the original film, respectively; A recognition camera (22) is used to determine the location of residual pyrolysis film; The material throwing mechanism (40) includes a material throwing suction cup (43) and a waste film recycling device (44) for stripping and collecting waste film; The transport system includes a second transport mechanism (50) and a third transport mechanism (60), the third transport mechanism (60) being used to transfer flexible chips between pyrolysis, detection, photolysis and unloading processes.

7. The device according to claim 6, characterized in that, The pyrolysis mechanism (30) includes a heating plate (31), and the top of the heating plate (31) is provided with a limiting guide block (32) for limiting the original piece. The surface of the heating plate (31) is provided with adsorption holes (33), and the adsorption holes (33) are connected to a negative pressure tube (34) to fix the rigid silicon wafer during the peeling process.

8. The device according to claim 6, characterized in that, The throwing mechanism (40) also includes a throwing longitudinal movement actuator (41) and a rotation actuator (42) for driving the throwing suction cup (43) to switch between longitudinal movement and flipping action.

9. The device according to claim 6, characterized in that, The pyrolysis mechanism (30) and the recognition camera (22) are arranged in the same straight line in the longitudinal direction; The identification camera (22), photolysis mechanism (21) and waste film recycling device (44) are arranged in a straight line in the horizontal direction.

10. The device according to claim 9, characterized in that, The material handling system drives the suction cup to move linearly along the longitudinal or transverse direction via a single-axis actuator to achieve seamless material handling between adjacent processes.

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