Cooling device and thermal management system

Abstract

The invention provides a cooling device and the like which can cope with complexity of a flow path of a heat medium and can realize compactness. A cooling device is provided with: a case (1) in which flow paths (C1-C5) through which a heat medium flows are formed; a four-way valve (70) and an eight-way valve (71) which are multi-way valves, are provided in the case (1), and switch the flow path of the heat medium in the flow paths (C1-C5) by the rotation of the valve rotation shaft of the four-way valve and the eight-way valve; and a first pump (3a), a second pump (3b), and a third pump (3c), which are provided in the case (1) and pressure-feed the heat medium in the flow paths (C1-C5), the first pump (3a) being provided on a first case side surface (1a) facing one side in the width direction (D1) intersecting the rotational axis of the multi-way valves (70, 71), the second pump (3b) being provided on a second case side surface (1b) facing the other side in the width direction (D1), and the third pump (3c) being provided on the case (1) and pressure-feeding the heat medium in the flow paths (C1-C5). The third pump (3c) is provided in parallel with the first pump (3a) in a height direction (D3) intersecting the width direction (D1) in the first case side surface (1a).

Description

Technical Field

[0001] The present invention relates to a cooling device mounted on a vehicle and a thermal management system having the cooling device. Background Technology

[0002] Typically, thermal management systems are known to comprehensively regulate the temperature of onboard equipment such as batteries and motors, as well as the air conditioning inside vehicles, such as automobiles. Such thermal management systems have a thermal medium circuit for the flow of a heat transfer medium, and the multi-way valves and pumps constituting this thermal medium circuit are modular cooling devices housed in a single enclosure (e.g., Patent Document 1). Existing technical documents Patent documents

[0003] Patent Document 1: U.S. Patent Application Publication No. 2023 / 0065082 Summary of the Invention The problem that the invention aims to solve

[0004] However, with the current popularity of hybrid and electric vehicles, not only is it impossible to use the engine's exhaust heat for air conditioning, but the number of on-board devices that are subject to temperature regulation has also increased. As a result, problems have arisen such as the increased complexity of the heat transfer path, the larger size of multi-way valves, the increased number of pumps, and the overall larger size of the cooling system.

[0005] Therefore, the present invention provides a cooling device and thermal management system that can cope with the complexity of the flow path of the heat medium and achieve a compact design. Methods for solving problems

[0006] According to one aspect of the present invention, a cooling device is installed in a vehicle for regulating the temperature of on-board equipment and / or the air inside the vehicle. The cooling device comprises: a housing forming a flow path for a first heat medium to flow through; a multi-way valve disposed in the housing, which switches the flow path of the first heat medium in the flow path by rotating its own valve rotation shaft; and a first pump, a second pump, and a third pump disposed in the housing to pressurize the first heat medium in the flow path. The first pump is disposed on a first housing side facing the width direction (housing width direction) of the housing, which intersects the rotation axis of the valve rotation shaft. The second pump is disposed on a second housing side facing the other side of the housing width direction. The third pump is disposed parallel to the first pump in the first housing side in the housing height direction, which intersects the housing width direction.

[0007] In the aforementioned cooling device, the multi-way valve may also be positioned on a surface facing a direction intersecting the width direction of the housing.

[0008] In the aforementioned cooling device, the multi-port valve may also be a valve having five or more ports for the first heat medium to flow into or out of relative to itself.

[0009] In the above-mentioned cooling device, the multi-way valve may be provided with a valve having fewer than five valve ports for the first heat medium to flow into or out of it (hereinafter, a first multi-way valve) and a valve having more than five valve ports for the first heat medium to flow into or out of it (hereinafter, a second multi-way valve). The rotation axis of one of the first multi-way valve and the second multi-way valve extends along the height direction of the housing, and the rotation axis of the other of the first multi-way valve and the second multi-way valve extends along the depth direction of the housing, which intersects the width direction and the height direction of the housing.

[0010] In the above-mentioned cooling device, one of the first multi-way valve and the second multi-way valve may be disposed on the surface facing the height direction of the housing, and the other of the first multi-way valve and the second multi-way valve may be disposed on the surface facing the depth direction of the housing.

[0011] One aspect of the thermal management system of the present invention includes: a heat medium circuit, comprising the aforementioned cooling device, for regulating the temperature of the vehicle-mounted equipment; and a refrigerant circuit, connected to the heat medium circuit, comprising a compressor, a condenser, a pressure reducing device, and an evaporator, for circulating a second heat medium. The heat medium circuit includes: a high-temperature side heat medium circuit section for the flow of the first heat medium that exchanges heat with the second heat medium in the condenser; a low-temperature side heat medium circuit section for the flow of the first heat medium that exchanges heat with the second heat medium in the evaporator; and a vehicle-mounted equipment temperature regulating heat medium circuit section for the flow of the first heat medium after heat exchange with the vehicle-mounted equipment. The high-temperature side heat medium circuit section has a first pump, the low-temperature side heat medium circuit section has a second pump, and the vehicle-mounted equipment temperature regulating heat medium circuit section has the third pump.

[0012] In the above-mentioned thermal management system, the heat medium circuit may also include: a motor-through circuit section, through the motor; and a radiator circuit section, through the vehicle's radiator, a pair of pipes connected to the low-temperature side heat medium circuit section, a pair of pipes of the vehicle-mounted equipment temperature regulating heat medium circuit section, a pair of pipes of the motor-through circuit section, and a pair of pipes of the radiator circuit section. Invention Effects

[0013] The aforementioned cooling device and thermal management system can both cope with the increasing complexity of the heat medium's flow path and achieve a compact design. Attached Figure Description

[0014] Figure 1 This is a circuit diagram of the thermal management system according to an embodiment of the present invention. Figure 2 The above is a three-dimensional view of the overall thermal management system. (a) is a view viewed from the front side of the system in the depth direction, and (b) is a view viewed from the inside side of the system in the depth direction. Figure 3 This is a perspective view of the cooling module of the aforementioned thermal management system, viewed from the rear side of the enclosure. Figure 4 This is a three-dimensional view of the cooling module as seen from the front side of the housing. Figure 5 This is a perspective view of the cooling module from the back of the housing, and an exploded view showing the multi-way valve and pump disassembled from the housing. Figure 6 This is a three-dimensional view of the refrigerant module of the aforementioned thermal management system, viewed from the inside of the system's depth direction. Figure 7 These are overall perspective views of the thermal management system of a modified embodiment described above. (a) is a view viewed from the front side in the depth direction of the system, and (b) is a view viewed from the inside side in the depth direction of the system. Figure 8 This is a perspective view of the refrigerant module of the thermal management system of the above-mentioned modified example, viewed from the top side in the height direction of the system. Detailed Implementation

[0015] The thermal management system 200 according to an embodiment of the present invention will be described below. like Figure 1 As shown, the thermal management system 200 of this embodiment is installed in a vehicle, such as an automobile, and is a device for regulating the temperature of on-board equipment K that may generate heat and / or for regulating the air inside the vehicle.

[0016] Specifically, the thermal management system 200 has a refrigerant circuit 50 and a heat transfer medium circuit 60 connected to the refrigerant circuit 50. The refrigerant circuit 50 is contained in the refrigerant module 150, which will be described in detail later, and the heat transfer medium circuit 60 is contained in the cooling module (cooling device) 100, which will be described in detail later.

[0017] (Refrigerant circuit) The refrigerant circuit 50 includes a compressor 51, a condenser 52, a pressure reducing device 53, an evaporator 54, a liquid receiver 55, and a flow path C6 connecting these compressors 51, condensers 52, pressure reducing device 53, evaporators 54 and liquid receiver 55, forming a heat pump for the refrigerant (second heat medium) R1 to circulate.

[0018] (Heat medium circuit) The heat medium circuit 60 is a circuit for the circulation (recirculation) of the heat supply medium (first heat medium) R2, and includes: a four-way valve (first multi-way valve) 70 and an eight-way valve (second multi-way valve) 71, which switch the flow path of the heat medium R2; a radiator circuit section 61, which is connected to the vehicle's radiator 300 between the four-way valve 70 and the eight-way valve 71; a high-temperature side heat medium circuit section 62, which is connected to the four-way valve 70 and passes through the condenser 52 in the refrigerant circuit 50; a low-temperature side heat medium circuit section 63, which is connected to the eight-way valve 71 and passes through the evaporator 52 in the refrigerant circuit 50; and an on-board equipment temperature regulating heat medium circuit section 64, which is connected to the eight-way valve 71 and passes through the on-board equipment K.

[0019] The four-way valve 70 has four connection ports 70x relative to itself for the inflow or outflow of the hot medium R2. That is, the four-way valve 70 is a valve with fewer than five connection ports 70x. The eight-way valve 71 has eight connection ports 71x relative to itself for the inflow or outflow of the hot medium R2. That is, the eight-way valve 71 is a valve with more than five connection ports 71x.

[0020] The radiator circuit section 61 has a flow path C1 connecting the four-way valve 70 and the eight-way valve 71 and passing through the radiator 300. The heat medium R2 flowing in the flow path C1 can exchange heat with the outside air in the radiator 300. Therefore, a pair of pipes forming the flow path C1 of the radiator circuit section 61 are connected to the two connection ports 71x of the eight-way valve 71, and a pair of pipes forming the flow path C1 are connected to the two connection ports 70x of the four-way valve 70.

[0021] The high-temperature side heat medium circuit 62 has a flow path C2 connecting the four-way valve 70, the condenser 52, and the heater core 311 in the vehicle's HVAC (Heating, Ventilation and Air-Conditioning) 310. The heat medium R2 flowing in the flow path C2 can exchange heat with the refrigerant R1 in the refrigerant circuit 50 in the condenser 52. The high-temperature side heat medium circuit 62 also has a first pump 3a, described in detail later, downstream of the four-way valve 70 and upstream of the condenser 52. Furthermore, the high-temperature side heat medium circuit 62 has a first reservoir 4a adjacent to the first pump 3a, which stores the heat medium R2 upstream of the first pump 3a. A pair of pipes forming the flow path C2 are connected to the two connection ports 70x of the four-way valve 70.

[0022] The low-temperature side heat medium circuit 63 has a flow path C3 connecting the eight-way valve 71, the evaporator 54, and the cooler core 312 in the HVAC 310. The heat medium R2 flowing through the flow path C3 can exchange heat with the refrigerant R1 in the refrigerant circuit 50 in the evaporator 54. The low-temperature side heat medium circuit 63 also has a second pump 3b, described in detail later, downstream of the cooler core 312 and upstream of the evaporator 54. Furthermore, the low-temperature side heat medium circuit 63 has a second liquid reservoir 4b adjacent to the second pump 3b, storing the heat medium R2 upstream of the second pump 3b. The low-temperature side heat medium circuit 63 also has a three-way valve 72, which functions as a multi-way valve and switches the flow path of the heat medium R2 within itself. A pair of pipes forming the flow path C3 of the low-temperature side heat medium circuit 63 are connected to the two connection ports 71x of the eight-way valve 71.

[0023] The vehicle-mounted device temperature regulating heat medium circuit 64 has a flow path C4 connecting the eight-way valve 71 and the vehicle-mounted device K. The heat medium R2 flowing through the flow path C4 can exchange heat with the vehicle-mounted device K. Examples of the vehicle-mounted device K include the battery 320 and an ECH (Electric Coolant Heater) 330, also known as a water heater. In this embodiment, the heat medium R2 flows through the flow path C4 in the order of the eight-way valve 71, ECH 330, and battery 320. The vehicle-mounted device temperature regulating heat medium circuit 64 also has a third pump 3c, described in detail later, downstream of the eight-way valve 71 and upstream of the ECH 330. Furthermore, the vehicle-mounted device temperature regulating heat medium circuit 64 has a third reservoir 4c adjacent to the third pump 3c, which stores the heat medium R2 upstream of the third pump 3c. A pair of pipes are connected to the two connection ports 71x of the eight-way valve 71, which form the flow path C4 of the on-board equipment temperature regulation heat medium circuit section 64.

[0024] In addition, in this embodiment, besides the vehicle-mounted equipment temperature regulating heat medium circuit 64, a motor passage circuit 65 is connected to an eight-way valve 71 via a flow path C5 of the motor 340, which is the vehicle-mounted equipment K. That is, a pair of pipes forming the flow path C5 of the motor passage circuit 65 are connected to the two connection ports 71x of the eight-way valve 71.

[0025] Next, the cooling module 100 constituting the heat medium circuit 60 and the refrigerant module 150 constituting the refrigerant circuit 50 will be described in detail. Figure 2 (a) and Figure 2 As shown in (b), the cooling module 100 and the refrigerant module 150 are integrated to form the thermal management system 200.

[0026] (Cooling module) like Figure 3 and Figure 4 As shown, the cooling module 100 includes a housing (cooling module housing) 1, the aforementioned multi-way valves (four-way valve 70, eight-way valve 71, three-way valve 72) installed in the housing 1, multiple pumps 3a, 3b, 3c, and multiple liquid storage tanks 4a, 4b, 4c (in... Figure 3 and Figure 4 (not shown in the figure), and a portion of the aforementioned flow paths C1 to C5 formed in the housing 1.

[0027] The box 1 is roughly rectangular in shape and has: a first box side 1a facing its own width direction (box width direction) D1; a second box side 1b facing the other side facing the width direction D1; a box back 1c facing its own depth direction (box depth direction) D2, which intersects (orthogonally) the width direction D1 (inner side); a box front surface 1d facing the other side facing the depth direction D2 (near the front side); a box top surface 1e facing its own height direction (box height direction) D3, which intersects (orthogonally) the width direction D1 and the depth direction D2 (upper side); and a box bottom surface 1f facing the other side facing the height direction D3 (lower side).

[0028] Furthermore, the front surface 1d of the housing 1 is the opposing side housing surface, which is opposite to the refrigerant module 150 described in detail later. The other surfaces 1a, 1b, 1c, 1e, and 1f of the housing 1 are the non-opposing side housing surfaces, which are not opposite to the refrigerant module 150. A pair of condenser connection ports Cy are formed on the front surface 1d, which is the opposing side housing surface. These two condenser connection ports Cy are respectively connected to the inlet 52a and outlet 52b of the heat medium R2 in the condenser 52 of the refrigerant module 150, which is described in detail later. A pair of evaporator connection ports Cz are also formed on the front surface 1d. These two evaporator connection ports Cz are respectively connected to the inlet 54a and outlet 54b of the heat medium R2 in the evaporator 54. A pair of evaporator connection ports Cz are spaced apart from each other in the height direction D3, are arranged in approximately the same position in the width direction D1, and are arranged on the side 1b of the second housing in the width direction D1 relative to a pair of condenser connection ports Cy.

[0029] Return here Figure 2 (a) and Figure 2(b) In the thermal management system 200, the cooling module 100 is configured such that its depth direction D2 is aligned with the overall depth direction (system depth direction Dy) of the thermal management system 200, and its height direction D3 is aligned with the overall height direction (system height direction Dz) of the thermal management system 200. That is, the cooling module 100 is connected to the refrigerant module 150, which will be described in detail later, from the inside of the system depth direction Dy.

[0030] like Figure 5 As shown, the eight-way valve 71 includes: a valve rotation shaft 71a; a valve drive unit 71b that rotates the valve rotation shaft 71a; and a valve core 71c that actuates via the rotation of the valve rotation shaft 71a to switch the flow path of the hot medium R2 in the hot medium circuit 60. The valve rotation shaft 71a rotates about a rotation axis O1 extending along the depth direction D2. That is, the valve rotation shaft 71a extends along the depth direction D2. In addition, the valve core 71c has the aforementioned eight connection ports 71x for the hot medium R2 to flow (in or out) relative to itself. The eight-way valve 71 is provided on the back side 1c of the housing 1, which is the non-opposite side of the housing 1 (see reference). Figure 3 ).

[0031] The four-way valve 70 is similar to the eight-way valve 71, and includes: a valve rotation shaft 70a; a valve drive unit 70b that rotates the valve rotation shaft 70a; and a valve core 70c that switches the flow path of the hot medium R2 in the hot medium circuit 60 by rotating the valve rotation shaft 70a. The valve rotation shaft 70a rotates about a rotation axis O2 extending along the height direction D3. That is, the valve rotation shaft 70a extends along the height direction D3. In addition, the valve core 70c has the aforementioned four connection ports 70x for the hot medium R2 to flow (in or out) relative to itself. The four-way valve 70 is provided on the upper surface 1e of the housing, which is the non-opposite side of the housing 1 (see reference). Figure 3 ).

[0032] Therefore, in the four-way valve 70 and eight-way valve 71 of this embodiment, which are multi-way valves, the rotation axes O1 and O2 of the valve rotation shafts 70a and 71a extend along a direction that intersects the width direction D1.

[0033] return Figure 3 In this embodiment, a first pump 3a, a second pump 3b, and a third pump 3c are provided as multiple pumps. These pumps 3a, 3b, and 3c pressurize and deliver heat medium R2 at different temperature ranges in the heat medium circuit 60. That is, the first pump 3a pressurizes and delivers the highest temperature heat medium R2, the second pump 3b pressurizes and delivers the lowest temperature heat medium R2, and the third pump 3c pressurizes and delivers heat medium R2 at any temperature ranging from the temperature of the heat medium R2 pressurized by the first pump 3a to the temperature of the heat medium R2 pressurized by the second pump 3b.

[0034] Moreover, such as Figure 5As shown, the first pump 3a includes: a pump rotating shaft 30a that rotates about a rotation axis O3a extending along the width direction D1; a pump drive unit 31a that rotates the pump rotating shaft 30a; and an impeller 32a that actuates by the rotation of the pump rotating shaft 30a, thereby pressurizing the hot medium R2. The first pump 3a is arranged in such a way that its own pump rotating shaft 30a extends along the width direction D1 in the aforementioned non-opposite side housing surface, forming a first housing side surface 1a facing the width direction D1 that intersects the depth direction D2 (see reference). Figure 8 ).

[0035] Similarly, the second pump 3b includes: a pump rotating shaft 30b that rotates about a rotation axis O3b extending along the width direction D1; a pump drive unit 31b that rotates the pump rotating shaft 30b; and an impeller 32b that actuates via the rotation of the pump rotating shaft 30b, thereby pressurizing the hot medium R2. The second pump 3b is positioned on the second housing side surface 1b of the non-opposite housing surface, facing the width direction D1 which intersects the depth direction D2, in such a manner that its own pump rotating shaft 30b extends along the width direction D1 (see reference). Figure 7 Here, the three-way valve 72, which is a multi-way valve, is located on the side 1b of the second housing, parallel to the second pump 3b in the height direction D3, and is positioned on the other side (lower side) of the height direction D3 relative to the second pump 3b.

[0036] Similarly, the third pump 3c includes: a pump rotating shaft 30c that rotates about a rotation axis O3c extending along the width direction D1; a pump drive unit 31c that rotates the pump rotating shaft 30c; and an impeller 32c that actuates by the rotation of the pump rotating shaft 30c, thereby pressurizing the hot medium R2. The third pump 3c is arranged on the first housing side surface 1a of the non-opposite side housing surface, such that its own pump rotating shaft 30a extends along the width direction D1, facing the width direction D1 that intersects the depth direction D2. Furthermore, the third pump 3c is parallel to the first pump 3a on the first housing side surface 1a in the height direction D3, and is arranged on the other side (lower side) of the height direction D3 relative to the first pump 3a.

[0037] Multiple storage tanks 4a, 4b, 4c (refer to) Figure 1 It is integrally disposed on a tank body (not shown), for example on the upper surface 1e of the tank body, above the four-way valve 70, and connected to the tank heat medium inlet / outlet Ct formed on the upper surface 1e of the tank body.

[0038] (Refrigerant Module) Next, the refrigerant module 150 constituting the above-mentioned refrigerant circuit 50 will be described in detail. return Figure 2 (a) and Figure 2(b) The refrigerant module 150 includes a housing (housing for refrigerant modules) 5, and the aforementioned compressor 51, condenser 52, and pressure reducing device 53 disposed in the housing 5 (see reference). Figure 1 ), evaporator 54 and liquid receiver 55, and the aforementioned flow path C6 formed in housing 5 (see reference) Figure 1 ).

[0039] like Figure 6 As shown, the housing 5, like the housing 1 of the cooling module 100, is approximately cuboid in shape. It has the aforementioned flow path C6 on its inner side. This flow path C6, together with the compressor 51, condenser 52, pressure reducing device 53, evaporator 54, and receiver 55, forms a refrigerant circuit for the flow of refrigerant R1. The housing 5 has: a first housing side 5a facing the width direction D1; a second housing side 5b facing the width direction D1 on the other side; a housing upper surface 5c facing the upper side in the system height direction Dz; a housing lower surface 5d facing the lower side in the system height direction Dz; a housing front surface 5e facing the system depth direction Dy (near the front); and a housing back surface 5f facing the other side (inner side) in the system depth direction Dy. The housing back surface 5f is positioned opposite the housing front surface 1d of the housing 1 in the cooling module 100 in the system depth direction Dy.

[0040] That is, the back surface 5f of the housing 5 becomes the refrigerant module side facing the front surface 1d of the cooling module 100, and the other surfaces 5a, 5b, 5c, 5d, and 5e of the housing 5 become the refrigerant module side non-facing housing surfaces that are not facing the cooling module 100.

[0041] The compressor 51 compresses the refrigerant R1, bringing it to a high temperature and high pressure state. The compressor 51 is located on the front surface 5e of the housing 5, which is the non-opposite side of the housing surface on the refrigerant module side.

[0042] The condenser 52 dissipates heat from the refrigerant R1, which has been compressed to a high temperature and high pressure state by the compressor 51, causing the refrigerant R1 to condense to a low temperature and high pressure state. The condenser 52 is located on the back side 5f of the housing 5, opposite the refrigerant module side (near the back side 5f), with a portion protruding from the back side 5f. The condenser 52 also includes an inlet 52a for the hot medium R2 from the cooling module 100 to flow into the condenser 52, and an outlet 52b for the hot medium R2 to flow out from the condenser 52 toward the cooling module 100. The inlet 52a and outlet 52b are connected to the condenser on the front surface 1d of the cooling module 100 housing via a connection port Cy. In this embodiment, the inlet 52a is located on the lower surface 5d side of the housing, and the outlet 52b is located on the upper surface 5c side of the housing.

[0043] In this embodiment, the pressure reducing device 53 is an expansion valve that reduces the pressure of the refrigerant R1, which is in a low-temperature, high-pressure state in the condenser 52, to a low-temperature, low-pressure state. The pressure reducing device 53 is located on the upper surface 5c of the housing, which is the non-opposite side of the housing surface that serves as the refrigerant module side.

[0044] The evaporator 54 causes the refrigerant R1, which is in a low-temperature, low-pressure state in the pressure reducing device 53, to absorb heat, causing the refrigerant R1 to evaporate and become in a high-temperature, low-pressure state. The evaporator 54 is located in the housing 5 on the back side 5f of the housing, opposite the refrigerant module side (positioned near the back side 5f), with a portion protruding from the back side 5f. Furthermore, the evaporator 54 is positioned side-by-side with respect to the condenser 52 in the width direction (first transverse) D1, intersecting the system depth direction Dy (D2), on the second housing side side 5b. The evaporator 54 also has an inlet 54a for allowing the hot medium R2 from the cooling module 100 to flow into the evaporator 54, and an outlet 54b for allowing the hot medium R2 to flow out from the evaporator 54 to the cooling module 100. The inlet 54a and outlet 54b are connected to the evaporator formed on the front surface 1d of the cooling module 100 housing via a connection port Cz. In this embodiment, the inlet 54a is located on the upper surface 5c side of the housing, and the outlet 54b is located on the lower surface 5d side of the housing.

[0045] The receiver 55 performs gas-liquid separation of the heat medium R2 on the upstream side of the compressor 51. In this embodiment, the receiver 55 is disposed on the second housing side 5b side, which is the non-opposite side of the housing surface of the refrigerant module side. That is, it is disposed on the second housing side 5b side in the width direction D1 relative to the condenser 52 and the evaporator 54, and is disposed in the system depth direction Dy, which is forward of the housing back 5f.

[0046] Therefore, relative to the evaporator 54 and the condenser 52, the compressor 51 described above is positioned on the side opposite to the cooling module 100 in the system depth direction Dy. Furthermore, when the inlet 52a and outlet 52b are connected to the condenser connection port Cy, and the inlet 54a and outlet 54b are connected to the evaporator connection port Cz, at least a portion of the front surface 1d and the back surface 5f of the housing are in contact, and the refrigerant module housing 5 and the cooling module housing 1 are integrated.

[0047] (Effects) According to the thermal management system 200 of this embodiment described above, the condenser 52 and evaporator 54 of the refrigerant module 150 are arranged close to or opposite to the front surface 1d of the housing of the cooling module 100. A condenser connection port Cy is formed on the front surface 1d of the housing, which is connected to the condenser 52. The heat transfer medium R2 flows between the condenser connection port Cy and the condenser 52. An evaporator connection port Cz is formed on the front surface 1d of the housing, which is connected to the evaporator 54. The heat transfer medium R2 flows between the evaporator connection port Cz and the evaporator 54. Therefore, when connecting the cooling module 100 and the refrigerant module 150, the components of the cooling module 100 and the refrigerant module 150 do not obstruct each other, allowing the cooling module 100 and the refrigerant module 150 to be close together and connected, thus facilitating the integration of modules 100 and 150. As a result, the overall compactness of the thermal management system 200 can be achieved.

[0048] In this embodiment, in particular, the eight-way valve 71, which is a multi-way valve, is located on the back side 1c of the housing opposite to the front surface 1d of the housing in the depth direction D2. In particular, in this embodiment, the rotation axis O2 of the eight-way valve 71 extends along the depth direction D2, which intersects the front surface 1d of the housing. Therefore, when connecting the cooling module 100 and the refrigerant module 150, the eight-way valve 71 will not cause obstruction, allowing the cooling module 100 and the refrigerant module 150 to be arranged close together. Furthermore, sufficient space can be ensured for the installation of the eight-way valve 71, whose diameter is easily increased due to having multiple connection ports 71x, and the complexity of the flow path of the heat medium R2 in the heat medium circuit 60 can be coped with.

[0049] Furthermore, pumps 3a and 3c are located on the first housing side 1a facing the width direction D1, which intersects the depth direction D2, and pump 3b is located on the second housing side 1b. Therefore, pumps 3a and 3c are located on a surface other than the front surface 1d of the housing 1, and on a surface different from the four-way valve 70 and eight-way valve 71, which are multi-way valves. Thus, when connecting the cooling module 100 and the refrigerant module 150, pumps 3a and 3c do not obstruct the connection, allowing the cooling module 100 and the refrigerant module 150 to be positioned close together, and also ensuring sufficient space for the four-way valve 70 and eight-way valve 71, which are multi-way valves.

[0050] Furthermore, in the refrigerant module 150, the condenser 52 and evaporator 54 are disposed on the rear side 5f of the housing, while the compressor 51 and pressure reducing device 53 are disposed on the front side of the housing 5 other than the rear side 5f. Therefore, the compressor 51 and pressure reducing device 53 are positioned in a position that does not oppose the front surface 1d of the housing in the cooling module 100, and these compressors 51 and pressure reducing devices 53 will not obstruct the connection between the cooling module 100 and the refrigerant module 150.

[0051] Furthermore, by connecting modules 10 and 150 opposite each other in the system depth direction Dy, the size of the thermal management system 200 in the system height direction Dz can be suppressed.

[0052] Furthermore, the first pump 3a and the third pump 3c are disposed on the first side 1a of the housing 1, and the second pump 3b is disposed on the second side 1b of the housing 1, which is opposite to the first side 1a in the width direction D1. The rotation axes O1 and O2 of the multi-way valves (four-way valve 70 and eight-way valve 71) are arranged to intersect the width direction D1. In particular, in this embodiment, the eight-way valve 71, which is a multi-way valve, is disposed on the back 1c of the housing. Therefore, compared to the case where the pumps 3a to 3c are disposed on a surface facing the same direction as the extension direction of the rotation axes O1 and O2 of the multi-way valves, the dimensions of the extension direction of the rotation axes O1 and O2 of the multi-way valves in the housing 1 can be suppressed, and the cooling module 100 can be made more compact.

[0053] Furthermore, by configuring the eight-way valve 71 such that the extension direction of the rotation axis O2 of the eight-way valve 71 intersects the width direction D1, even if the eight-way valve 71, which has a relatively large diameter due to having eight connection ports 71x, is set as a multi-way valve, interference between the multi-way valve and the pumps 3a~3c can be avoided. This allows for more settings of the switching mode of the flow path of the heat medium R2, and also helps to cope with the complexity of the flow path.

[0054] Furthermore, by placing the first pump 3a and the third pump 3c on the first side 1a of the housing 1, and placing the second pump 3b on the second side 1b of the housing 1 which is opposite to the first side 1a in the width direction D1, the weight balance of the cooling module 100 in the width direction D1 can be maintained.

[0055] Furthermore, the first pump 3a and the second pump 3b, which pressurize heat media R2 at different temperature zones, are positioned on different sides of the housing 1, and the second pump 3b and the third pump 3c are positioned on different sides of the housing 1. This avoids thermal interference between the first pump 3a and the second pump 3b, and between the second pump 3b and the third pump 3c, of the heat media R2 at different temperature zones.

[0056] In this embodiment, the high-temperature side heat medium circuit section 62 of the heat medium circuit 60 constituting the thermal management system 200 has a first pump 3a, whereby the first pump 3a, one of the plurality of pumps 3a to 3c, pressurizes the highest temperature heat medium R2. On the other hand, the low-temperature side heat medium circuit section 63 of the heat medium circuit 60 constituting the thermal management system 200 has a second pump 3b, whereby the second pump 3b, one of the plurality of pumps 3a to 3c, pressurizes the lowest temperature heat medium R2. In this regard, in this embodiment, by arranging the first pump 3a, which supplies the high-temperature heat medium R2, and the second pump 3b, which supplies the low-temperature heat medium R2, on opposite sides of each other in the width direction D1 within the housing 1, the thermal impact can be minimized.

[0057] Furthermore, in this embodiment, an eight-way valve 71, which serves as a multi-way valve, is disposed on the front surface 1c of the housing facing the depth direction D2, which intersects the width direction D1, and a four-way valve 70, which also serves as a multi-way valve, is disposed on the upper surface 1e of the housing facing the height direction D3, which intersects the width direction D1. That is, by arranging the pumps 3a~3c, the four-way valve 70, and the eight-way valve 71 on different surfaces of the housing 1, the size of each surface of the housing 1 can be reduced, thereby achieving further compactness of the cooling module 100 as a whole.

[0058] This invention is not limited to the embodiments described above, and various modifications can be made without departing from the spirit of the invention. For example, the relative positions of the cooling module 100 and the refrigerant module 150 are not limited to the situation described above. Specifically, as... Figure 7 of (a) Figure 7 As shown in (b), the upper surface 5c of the refrigerant module 150 housing can also be arranged opposite to the front surface 1d of the cooling module 100 housing. That is, modules 100 and 150 can also be arranged opposite each other in the system height direction Dz. Moreover, in this case, the compressor 51 is arranged on the side opposite to the cooling module 100 in the system depth direction (second lateral direction) Dy, relative to the condenser 52 and the evaporator 54. Furthermore, in this case, as Figure 8 As shown, an inlet 52a for the heat medium R2 from the cooling module 100 flowing into the condenser 52 and an outlet 52b for the heat medium R2 flowing from the condenser 52 into the cooling module 100 are formed on the upper surface 5c of the housing. Similarly, an inlet 54a for the heat medium R2 from the cooling module 100 flowing into the evaporator 54 and an outlet 54b for the heat medium R2 flowing from the evaporator 54 into the cooling module 100 are also formed on the upper surface 5c of the housing. The inlet 52a is located on the inner side in the system depth direction Dy, and the outlet 52b is located near the front side. The inlet 54a is located near the front side in the system depth direction Dy, and the outlet 54b is located on the inner side. Thus, in... Figure 7 of (a) Figure 7 (b) and Figure 8 The thermal management system 200 shown can suppress the dimension in the depth direction Dy of the system.

[0059] In addition, the third pump 3c may be disposed on the side of the second housing 1b instead of the side of the first housing 1a, as long as at least the first pump 3a and the second pump 3b are disposed on opposite sides of the housing 1.

[0060] Furthermore, the positions of the four-way valve 70 and the eight-way valve 71 can be reversed from the above, as can the positions of the three-way valve 72 and the four-way valve 70.

[0061] Furthermore, the structure of the heat medium circuit 60 is not limited to the above-described case, as long as the flow path of the heat medium R2 can be switched to perform temperature regulation and / or air conditioning of the on-board equipment K. Industrial applicability

[0062] The cooling device and thermal management system according to the present invention can both cope with the complexity of the flow path of the heat medium and achieve compactness. Explanation of reference numerals in the attached figures:

[0063] 1: Cooling module housing; 1a: Side of the first housing; 1b: Side of the second housing; 1c: Back of the housing; 1d: Front surface of the housing; 1e: Top surface of the housing; 1f: Bottom surface of the housing; 3a: First pump; 3b: Second pump; 3c: Third pump; 5: Refrigerant module housing; 5a: Side of the first housing; 5b: Side of the second housing; 5c: Top surface of the housing; 5d: Bottom surface of the housing; 5e: Front surface of the housing; 5f: Back of the housing; 30a, 30b, 30c: Pump rotating shaft; 31a, 31b, 31c: Pump drive unit; 32a, 32b, 32c: Impeller; 50: Refrigerant circuit; 51: Compressor; 52: Condenser; 52: Evaporator; 52a: Inlet; 52b: Outlet; 53: Pressure reducing device; 54: Evaporator; 54a 54b: Inlet; 55: Outlet; 60: Receiver; 61: Heat medium circuit; 62: Radiator circuit; 63: High-temperature side heat medium circuit; 64: Low-temperature side heat medium circuit; 65: On-board equipment temperature regulation heat medium circuit; 70: Motor through circuit; 70a: Four-way valve; 71a: Eight-way valve; 100: Cooling module; 150: Refrigerant module; 200: Thermal management system; C1~C6: Flow path; Cy: Condenser connection port; Cz: Evaporator connection port; D1: Width direction; D2: Depth direction; D3: Height direction; Dy: System depth direction; Dz: System height direction; K: On-board equipment; R1: Refrigerant (second heat medium); R2: Heat medium (first heat medium).

Claims

1. A cooling device, installed in a vehicle, for regulating the temperature of onboard equipment and / or the air inside the vehicle, wherein, The cooling device includes: The casing forms a flow path for the first heat medium to circulate; A multi-way valve, disposed in the housing, switches the flow path of the first heat medium in the flow path by rotating its own valve shaft; and The first, second, and third pumps are installed in the housing and pressurize the first heat medium in the flow path. The first pump is disposed on a side of the housing facing the width direction (hereinafter, the housing width direction) of the housing, which intersects the rotation axis of the valve rotation axis. The second pump is disposed on the side of the second housing facing the opposite side in the width direction of the housing. The third pump is arranged side-by-side with the first pump on the side of the first housing in the height direction of the housing, which intersects with the width direction of the housing.

2. The cooling device according to claim 1, wherein, The multi-way valve is disposed on a face facing a direction that intersects with the width direction of the housing.

3. The cooling device according to claim 1 or 2, wherein, The multi-port valve is a valve having five or more ports relative to itself for the inflow or outflow of the first hot medium.

4. The cooling device according to claim 2, wherein, As the multi-way valve, there are valves having fewer than five valve ports that allow the first heat medium to flow into or out of them (hereinafter, first multi-way valve) and valves having more than five valve ports that allow the first heat medium to flow into or out of them (hereinafter, second multi-way valve). The rotation axis of one of the first multi-way valves and the second multi-way valve extends along the height direction of the housing, and the rotation axis of the other of the first multi-way valves and the second multi-way valve extends along the depth direction of the housing, which intersects the width direction and the height direction of the housing.

5. The cooling device according to claim 4, wherein, One of the first multi-way valve and the second multi-way valve is disposed on the face facing the height direction of the housing, and the other of the first multi-way valve and the second multi-way valve is disposed on the face facing the depth direction of the housing.

6. A thermal management system, wherein, The thermal management system includes: A heat transfer circuit, comprising the cooling device as described in claim 1 or 2, is used to regulate the temperature of the on-board equipment; and The refrigerant circuit, connected to the heat medium circuit, consists of a compressor, condenser, pressure reducing device, and evaporator, and supplies circulation for the second heat medium. The heat medium circuit has: The high-temperature side heat medium circuit section is for the first heat medium, which exchanges heat with the second heat medium in the condenser, to flow through. A low-temperature side heat medium circuit section, through which the first heat medium, which exchanges heat with the second heat medium in the evaporator, flows; and The on-board equipment temperature regulation heat medium circuit section supplies the first heat medium after heat exchange with the on-board equipment. The high-temperature side heat medium circuit section includes the first pump. The low-temperature side heat medium circuit section includes the second pump. The on-board equipment temperature regulation heat medium circuit includes the third pump.

7. The thermal management system according to claim 6, wherein, The heat medium circuit also has: The motor passes through the circuit section, and through the motor; and The radiator circuit section, passing through the vehicle's radiator, The multi-way valve is connected to a pair of pipes for the low-temperature side heat medium circuit section, a pair of pipes for the vehicle-mounted equipment temperature regulating heat medium circuit section, a pair of pipes for the motor through circuit section, and a pair of pipes for the radiator circuit section.

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