Intelligent transfer device for AI chip and transfer method thereof
By eliminating static electricity with an anti-static aluminum alloy transfer platform and an ion fan, combined with a negative pressure Bernoulli non-contact suction cup and a visual positioning camera, the problems of static damage and inaccurate positioning in chip transfer are solved, achieving high-precision and automated chip transfer.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- FOSHAN YUNSHU INTERNET TECHNOLOGY CO LTD
- Filing Date
- 2026-03-17
- Publication Date
- 2026-05-12
AI Technical Summary
Existing chip transfer devices lack anti-static measures, which can lead to electrostatic damage to the chips. Furthermore, they cannot achieve vertical and spatial forward and backward displacement, resulting in inaccurate positioning and potential chip damage.
It adopts an anti-static aluminum alloy transfer platform, combined with an ion fan to eliminate static electricity, and uses a negative pressure Bernoulli non-contact suction cup for non-contact transfer. It also uses a visual positioning camera and a linear motor to achieve precise positioning and path adjustment.
It effectively eliminates the risk of static electricity, improves the accuracy and flexibility of transfer, avoids chip damage, and achieves automated, continuous, and efficient transfer.
Smart Images
Figure CN122009818A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of chip transfer technology, and in particular to an intelligent transfer device and method for AI chips. Background Technology
[0002] As a core component of artificial intelligence devices, AI chips are characterized by high integration, dense pins, weak anti-static capability, and low mechanical strength. The requirements for precision, anti-static properties, and clamping protection in the transfer process during their production are far higher than those for ordinary chips.
[0003] Patent CN210527846U discloses a chip transfer machine, including a frame, a worktable, a pressing device, a suction nozzle device, a first feeding device, and a second feeding device. The first feeding device and the second feeding device are spaced apart. The output end of the first feeding device is connected to a test board, and the output end of the second feeding device is connected to a tray. The first feeding device drives the test board to move intermittently for feeding. The pressing device is located above the first feeding device and includes a pressing plate, a buffer structure, and a driver. The buffer structure is located below the pressing plate, and the pressing plate is connected to the output end of the driver. The suction nozzle device is selectively located above either the first or second feeding device. The suction nozzle device includes at least two suction nozzles, a driving mechanism, and a traversing mechanism. The suction nozzles are mounted on the output end of the driving mechanism, and the driving mechanism is mounted on the output end of the traversing mechanism. Therefore, this chip transfer machine has the advantages of effectively improving working efficiency and reducing damage to the test socket.
[0004] However, this patent also has the following drawbacks: First, the patent does not have an anti-static device during the chip transfer process, which will generate some static electricity during the frequent adsorption and transfer of chips, thereby damaging the chips themselves; Second, the transfer device can only achieve lateral transfer and cannot perform vertical or spatial forward and backward displacement, which will lead to inaccurate positioning and inaccurate chip clamping when transferring and positioning chips, and more serious inaccurate positioning will damage the chips. Summary of the Invention
[0005] In view of the above technical problems, the present invention provides an intelligent transfer device and transfer method for AI chips that can eliminate static electricity and improve the transfer quality of AI chips.
[0006] This invention provides an intelligent transfer device and method for AI chips, characterized by including a transfer platform, with columns bolted to the left and right sides of the platform, and a top plate welded to the top of the two columns. Multiple ion fans are installed in the center of the top plate. Each column has a sliding groove on its side wall, and a telescopic cylinder is installed at the top of the groove. A sliding plate is fixedly connected to the telescopic end of the telescopic cylinder. The side wall of the sliding plate is slidably connected to a crossbeam guide rail via a sliding assembly. A linear motor B is slidably connected to the crossbeam guide rail, and the linear motor B can slide laterally along the length of the crossbeam guide rail, improving the flexibility and accuracy of chip transfer.
[0007] The linear motor B is connected to a negative pressure adsorption mechanism. A visual positioning camera is fixedly connected to the bottom of the slide plate on one side of the transfer table. The camera uses a high-definition industrial lens and, together with an external supplementary lighting component (not shown), can clearly capture the position and posture of the chip on the surface of the workbench. A workbench is fixedly installed on the top wall of the transfer table.
[0008] An isolation plate is provided in the middle of the workbench, dividing the workbench into two working areas. The air outlet of the ion fan faces the workbench of the transfer table and is used to continuously blow ion wind into the chip transfer area to neutralize the static charge on the surface of the chip, the workbench and the adsorption mechanism, thereby avoiding the risk of electrostatic discharge of the chip from the source.
[0009] The sliding assembly includes a guide rail and a linear motor A. The guide rail is fixedly connected to the side wall of the slide plate. One side of the linear motor A is slidably connected to the guide rail, and the other side of the linear motor A is fixedly connected to the crossbeam. By sliding the linear motor A along the guide rail, the crossbeam guide rail can be moved in the front-back direction, thereby adjusting the horizontal position of the negative pressure adsorption mechanism and realizing the front-back position adjustment of the chip between the two working areas.
[0010] A hanging rod is provided next to the ion fan to suspend components such as air pipes and wiring, avoiding messy wiring that could affect chip transfer accuracy, and improving the overall neatness and safety of the device. A grating ruler is provided on the rear side of the crossbeam, and the grating ruler is set parallel to the crossbeam guide rail. The grating ruler is used to detect the displacement of the linear motor B in real time and feed the displacement signal back to the control system to achieve precise positioning of the linear motor B, thereby improving the positioning accuracy of the Bernoulli non-contact suction cup adsorbing the chip and ensuring that the chip does not deviate or fall off during the transfer process.
[0011] The negative pressure adsorption mechanism includes an air tube, a Bernoulli non-contact suction cup, and a negative pressure generator. The negative pressure generator is installed on the transfer platform and is connected to the Bernoulli non-contact suction cup through the air tube. It has an air inlet at its center and an annular air groove around its perimeter. During operation, the negative pressure generator provides a high-speed airflow, which is ejected along the tangent of the annular air groove of the Bernoulli non-contact suction cup to form a local low-pressure zone. The chip is adsorbed by suspending it in an air film, realizing non-contact transfer of the chip. This avoids scratches and damage to the chip surface caused by mechanical contact and is suitable for the transfer needs of ultra-thin and fragile chips.
[0012] The transfer platform is a horizontally arranged rectangular platform made of anti-static aluminum alloy, which ensures structural strength and avoids static electricity accumulation during transfer, thus protecting the chip from static damage.
[0013] A smart transfer device for AI chips, characterized in that the transfer platform is a horizontally arranged rectangular platform, and its material is anti-static aluminum alloy.
[0014] 7. A smart transfer device for AI chips according to any one of claims 1-6, characterized in that the method for transferring AI chips using the device includes the following specific steps: S1. Check the status of each component of the chip transfer device to ensure that each component is working properly; place the AI chip to be transferred neatly on one side of the workbench in the material picking area to ensure that the AI chip is undamaged and free of static electricity, and clean the dust and impurities on the material picking area, material dispensing area and Bernoulli non-contact chuck surface to avoid affecting the transfer accuracy and AI chip quality. S2. Start multiple ion fans on the top plate to continuously blow ion air into the material picking area, material discharging area, Bernoulli non-contact chuck, and chip transfer path; S3. Activate the visual positioning camera. The visual positioning camera takes high-definition pictures of the AI chip in the material picking area and transmits the captured AI chip image signal to the control system. The control system analyzes the image through visual algorithms, accurately identifies the position offset, rotation angle and placement posture of the AI chip, generates positioning adjustment commands and sends them to the telescopic cylinder, linear motor A and linear motor B. S4. According to the positioning adjustment command issued by the control system, the telescopic cylinder drives the slide plate to descend vertically along the slide groove of the column to the preset height, so that the Bernoulli non-contact suction cup and the surface of the AI chip in the picking area maintain a preset distance; at the same time, the linear motor A slides horizontally along the guide rail on the side wall of the slide plate, driving the crossbeam guide rail to move directly above the picking area, and the linear motor B slides along the crossbeam guide rail. With the displacement signal detected in real time by the grating ruler, the control system makes fine adjustments to the position of the linear motor B to ensure that the Bernoulli non-contact suction cup is accurately aligned with the center position of the AI chip to be transferred. S5. Start the negative pressure generator on the transfer platform. The negative pressure generator provides a stable high-speed airflow to the Bernoulli non-contact suction cup through the anti-static air tube. The airflow is ejected along the tangent of the annular air groove of the Bernoulli non-contact suction cup, forming a uniform local low-pressure area between the suction cup and the AI chip. The AI chip is adsorbed by relying on the air film suspension effect, and the preset air film gap is maintained during the adsorption process. S6. After adsorption is completed, the telescopic cylinder drives the slide plate to rise vertically to the preset transfer height to avoid collision between the AI chip and other components of the device during the transfer process. Then, linear motors A and B work together to move the Bernoulli non-contact suction cup and the adsorbed AI chip horizontally along the preset transfer path and transfer it to the top of the unloading area of the workbench. During the transfer process, the adsorption stability is maintained. The grating ruler continuously detects the displacement of linear motor B and feeds it back to the control system to ensure that the transfer path is accurate and without deviation. S7. The visual positioning camera takes a second picture of the unloading area and transmits the image signal of the unloading area position to the control system. The control system performs a second positioning calibration. After confirming that the unloading position is accurate, the telescopic cylinder drives the slide plate to descend vertically, so that the AI chip is close to the preset placement position of the unloading area. The negative pressure generator is turned off, the vacuum is broken to release the adsorption of the Bernoulli non-contact suction cup on the AI chip, so that the AI chip is placed stably in the unloading area, completing a single AI chip transfer. S8. After a single transfer is completed, the telescopic cylinder, linear motor A, and linear motor B work together to drive the Bernoulli non-contact suction cup to reset to the preset position above the material picking area. Repeat steps S2-S7 above to achieve continuous and automated transfer of multiple AI chips; after all transfers are completed, shut down all components of the device, clean the material picking area, material discharging area and Bernoulli non-contact suction cup, tidy up the air pipes and wiring and hang them on the hanging rod to complete the transfer operation.
[0015] The beneficial effects of this invention are as follows: 1. By setting multiple ion fans in the middle of the top plate, ion air can be continuously blown into the chip transfer area to neutralize the static charge on the surface of the chip, worktable and negative pressure adsorption mechanism, solving the problem of electrostatic breakdown during chip transfer from the source and adapting to the ESD-sensitive characteristics of the chip; at the same time, key components such as the transfer table, slide plate and air pipe are all made of anti-static materials to further improve the anti-static effect and reduce the chip damage rate, which is especially suitable for the transfer of AI chips. 2. The device uses an external control system to link components such as telescopic cylinders, linear motors, negative pressure generators, and vision positioning cameras to achieve automatic chip picking, positioning, transfer, and unloading without manual intervention, effectively reducing errors and inefficiencies caused by manual operation. The workbench is divided into two independent working areas by a partition plate, which can realize simultaneous picking and unloading, effectively undertaking intermediate transfer work at both ends, and further improving the continuity and efficiency of chip transfer. 3. The columns and top plate on both sides of the transfer platform form a stable support structure. The sliding plate is connected to the telescopic cylinder through the sliding groove, and the sliding component cooperates with the crossbeam guide rail, resulting in a compact structure and strong stability. Hanging rods are set next to the ion fan to organize the air pipes and lines, avoiding messy lines that may affect the transfer accuracy and operational safety. The isolation plate is made of transparent anti-static material, which can not only separate the working area and avoid interference, but also facilitate the operator to observe the working status. The overall device has a reasonable structural design, is easy to install and debug, has low subsequent maintenance costs, and has good safety and practicality. 4. The telescopic cylinder can drive the slide plate to move up and down, adjusting the height of the adsorption mechanism to adapt to chips of different thicknesses and different heights for transport. Linear motors A and B work together to achieve omnidirectional movement of the adsorption mechanism on the horizontal plane, and the transport path can be flexibly adjusted. The number of ion fans and the specifications of the suction cups can be adjusted according to actual needs, further improving the flexibility and adaptability of the device and meeting the transport needs of chips of different specifications and in different batches. Attached Figure Description
[0016] Figure 1 This is a side-view top view of the overall structure of the present invention; Figure 2 This is a side view of the structure of the present invention; Figure 3 This is a side-top view of the present invention; Figure 4 This is a partial structural schematic diagram of the Bernoulli non-contact suction cup of the present invention.
[0017] Attached reference numerals: 1-Transfer platform; 2-Column; 3-Top plate; 31-Ionizing fan; 32-Hanging rod; 4-Slide plate; 41-Guide rail; 42-Linear motor A; 5-Workbench; 6-Telescopic cylinder; 7-Crossbeam guide rail; 8-Linear motor B; 9-Air pipe; 10-Bernoulli non-contact suction cup; 11-Visual positioning camera; 12-Grating ruler; 13-Negative pressure generator; 101-Annular groove. Detailed Implementation
[0018] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0019] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0020] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. Furthermore, the technical features involved in the different embodiments of this invention described below can be combined with each other as long as they do not conflict with each other. Example 1
[0021] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings.
[0022] like Figure 1 As shown, the present invention provides an intelligent transfer device for AI chips, characterized by including a transfer platform 1, with columns 2 bolted to the left and right sides of the transfer platform 1, and a top plate 3 welded to the top of the two columns 2. Multiple ion fans 31 are arranged in the middle of the top plate 3. Each column 2 has a sliding groove on its side wall, and a telescopic cylinder 6 is installed on the top of the sliding groove. The telescopic end of the telescopic cylinder 6 is fixedly connected to a sliding plate 4. The side wall of the sliding plate 4 is slidably connected to a crossbeam guide rail 7 through a sliding component. A linear motor B8 is slidably connected to the crossbeam guide rail 7. The linear motor B8 can slide laterally along the length direction of the crossbeam guide rail 7, improving the flexibility and accuracy of chip transfer.
[0023] A negative pressure adsorption mechanism is connected to the linear motor B8. A visual positioning camera 11 is fixedly connected to the bottom of the slide plate 4 located on one side of the transfer table 1. Its lens is a high-definition industrial lens. With the help of a supplementary lighting component (not shown), it can clearly capture the position and posture of the chip on the surface of the workbench. A workbench 5 is fixedly installed on the top wall of the transfer table 1.
[0024] An isolation plate is set in the middle of the workbench 5 to divide the workbench 5 into two working areas. The air outlet of the ion fan 31 faces the workbench 5 of the transfer table 1 and is used to continuously blow ion wind into the chip transfer area to neutralize the static charge on the surface of the chip, the workbench and the adsorption mechanism, thereby avoiding the risk of electrostatic breakdown of the chip from the source.
[0025] The sliding assembly includes a guide rail 41 and a linear motor A42. The guide rail 41 is fixedly connected to the side wall of the slide plate 4. One side of the linear motor A42 is slidably connected to the guide rail 41, and the other side of the linear motor A42 is fixedly connected to the crossbeam guide rail 7. By sliding the linear motor A42 along the guide rail 41, the crossbeam guide rail 7 can be moved in the front-back direction, thereby adjusting the horizontal position of the negative pressure adsorption mechanism and realizing the adjustment of the front-back position of the chip between the two working areas.
[0026] A hanging rod 32 is provided on the side of the ion fan 31 to hang components such as the air pipe 9 and wiring, so as to avoid the messy wiring affecting the chip transfer accuracy and improve the overall neatness and safety of the device. A grating ruler 12 is provided on the rear side of the crossbeam guide rail 7. The grating ruler 12 is set parallel to the crossbeam guide rail 7. The grating ruler 12 is used to detect the displacement of the linear motor B8 in real time and feed the displacement signal back to the control system to achieve precise positioning of the linear motor B8, thereby improving the positioning accuracy of the Bernoulli non-contact suction cup adsorbing the chip and ensuring that the chip does not deviate or fall off during the transfer process.
[0027] The negative pressure adsorption mechanism includes an air tube 9, a Bernoulli non-contact suction cup 10, and a negative pressure generator 13. The negative pressure generator 13 is installed on the transfer platform 1 and is connected to the Bernoulli non-contact suction cup 10 through the air tube. It has an air inlet at its center and an annular air groove 101 around its perimeter. During operation, the negative pressure generator 13 provides a high-speed airflow, which is sprayed out along the tangent of the annular air groove of the Bernoulli non-contact suction cup to form a local low-pressure area. The chip is adsorbed by air film suspension, realizing non-contact transfer of the chip. This avoids scratches and damage to the chip surface caused by mechanical contact and is suitable for the transfer needs of ultra-thin and fragile chips.
[0028] The transfer platform 1 is a horizontally set rectangular platform made of anti-static aluminum alloy, which ensures structural strength and avoids static electricity accumulation during the transfer process, thus protecting the chip from static damage. Example 2
[0029] The operators first conduct a comprehensive inspection of each core component of the chip transfer device, confirming the working status of the ion fan 31, visual positioning camera 11, negative pressure generator 13, linear motor A42, linear motor B8, telescopic cylinder 6, and grating ruler 12 one by one, to ensure that each component is fault-free and reliably connected. The focus is on checking whether the air pipe 9 is damaged or leaking, whether the annular air groove of the Bernoulli non-contact suction cup 10 is unobstructed, and whether the detection accuracy of the grating ruler 12 meets the preset standard. Subsequently, the AI chips to be transferred are neatly placed in the picking area of workbench 5. During the placement process, anti-static gloves are worn to prevent static electricity from the human body from being transferred to the AI chips. At the same time, the surface of each AI chip is visually inspected to ensure that there is no damage, scratches, or static electricity residue. Finally, the surfaces of the picking area, the unloading area, and the Bernoulli non-contact suction cup 10 are cleaned with an anti-static brush to remove dust, debris, and other impurities, to prevent impurities from affecting the transfer accuracy and to avoid scratching the precision circuits on the surface of the AI chips or affecting the adsorption effect of the Bernoulli non-contact suction cup 10.
[0030] Next, start the ion fan 31 on the top plate 3 and adjust the wind speed of the ion fan 31 to the preset level so that the air outlet of the ion fan 31 continuously blows ion wind to the material picking area, the material discharging area, the Bernoulli non-contact suction cup 10 and the entire chip transfer path. The ion wind neutralizes the static charge on the surface of the AI chip, the workbench 5, the negative pressure adsorption mechanism (air pipe 9, Bernoulli non-contact suction cup 10) and the surface of each key component of the device. The blowing continues for a preset time (preferably 30-60 seconds) to ensure that the static charge on the surface of the above-mentioned areas and components is completely neutralized, thereby avoiding the risk of electrostatic discharge damaging the precision circuit of the AI chip from the source and adapting to the high ESD sensitivity of the AI chip.
[0031] Subsequently, the visual positioning camera 11 is activated, and the supplementary lighting component is turned on, enabling the visual positioning camera 11 to capture high-definition images of the AI chips in the material handling area. The visual positioning camera 11 transmits the image signals of each AI chip captured to the control system in real time. The visual algorithm built into the control system performs grayscale processing and feature extraction on the images, accurately identifying the geometric center position, position offset relative to the preset benchmark, and placement posture of the AI chip, eliminating abnormal situations such as tilting or inverting the AI chip. For the normally placed AI chip, the corresponding positioning adjustment command is generated and sent to the telescopic cylinder 6, linear motor A42, and linear motor B8 simultaneously, providing a precise basis for subsequent suction cup alignment.
[0032] After receiving the positioning adjustment command from the control system, the telescopic cylinder 6 drives the slide plate 4 to descend vertically along the slide groove of the column 2 to a preset height. This preset height is set according to the thickness of the AI chip to ensure that the Bernoulli non-contact suction cup 10 maintains a preset distance from the surface of the AI chip in the picking area, which ensures the subsequent adsorption effect and avoids contact between the suction cup and the chip surface. At the same time, the linear motor A42 slides horizontally along the guide rail 41 on the side wall of the slide plate 4, driving the crossbeam guide rail 7 to move smoothly to the top of the picking area. The linear motor B8 slides along the crossbeam guide rail 7. During this process, the grating ruler 12 detects the displacement signal of the linear motor B8 in real time and feeds the displacement data back to the control system. The control system makes fine adjustments to the position of the linear motor B8 according to the feedback signal until the center of the Bernoulli non-contact suction cup 10 is precisely aligned with the geometric center of the AI chip to be transferred. The alignment accuracy is controlled within ±0.1mm to ensure uniform force during adsorption and avoid AI chip displacement.
[0033] After the suction cup is aligned, the negative pressure generator 13 on one side of the transfer table 1 is activated. The output pressure of the negative pressure generator 13 is adjusted to a preset value, so that the negative pressure generator 13 provides a stable high-speed airflow to the Bernoulli non-contact suction cup 10 through the anti-static air pipe 9. The airflow is evenly sprayed out along the tangent of the annular air groove of the Bernoulli non-contact suction cup 10, forming a uniform local low-pressure area between the suction cup and the AI chip. The air film suspension effect generated by the Bernoulli principle is used to adsorb the AI chip. During the adsorption process, the thickness of the air film is monitored in real time by the control system to ensure that the Bernoulli non-contact suction cup 10 and the surface of the AI chip maintain a preset air film gap, realizing the complete non-contact adsorption of the AI chip. This effectively avoids scratches and damage to the precision circuits and packaging structure of the AI chip surface caused by mechanical contact, ensuring the integrity of the AI chip.
[0034] After adsorption stabilizes, the telescopic cylinder 6 actuates again, driving the slide plate 4 to rise vertically to the preset transfer height. This height is higher than the height of the isolation plate and other protruding parts of the device, preventing the AI chip from colliding with the isolation plate, column 2, and other components during transfer. Subsequently, linear motors A42 and B8 work together according to the transfer path preset by the control system. Linear motor A42 drives the crossbeam guide rail 7 to move horizontally along the guide rail 41 towards the unloading area, while linear motor B8 finely adjusts its position along the crossbeam guide rail 7, driving the Bernoulli non-contact suction cup 10 and the adsorbed AI chip to move smoothly. During the transfer, the grating ruler 12 continuously detects the displacement of linear motor B8 and feeds it back to the control system. The control system adjusts the running speed and position of linear motor B8 in real time to ensure that the transfer path is accurate and without deviation, and that the adsorption stability meets the requirements, preventing the AI chip from falling off or shifting during the transfer process.
[0035] The visual positioning camera 11 turns to the unloading area and takes a second picture of the preset placement position in the unloading area. The image signal of the unloading area position is transmitted to the control system. The control system performs a second positioning calibration through a visual algorithm to confirm that the unloading position is free of impurities and offset, and matches the size and placement requirements of the AI chip. After calibration, the telescopic cylinder 6 drives the slide plate 4 to descend vertically, so that the AI chip slowly approaches the preset placement position in the unloading area. When the AI chip is a preset distance away from the unloading area table, the negative pressure generator 13 is turned off, the vacuum is broken and the Bernoulli non-contact suction cup 10 is released from adsorption of the AI chip. The AI chip is placed stably in the unloading area under its own gravity, completing a single AI chip transfer. After placement, the visual positioning camera 11 takes another picture to confirm that the AI chip is placed flat and without offset.
[0036] After a single transfer is completed, the telescopic cylinder 6, linear motor A42, and linear motor B8 work together to drive the Bernoulli non-contact suction cup 10 back to the preset standby position above the material picking area, waiting for the next adsorption command; then repeat the above steps S2-S7 to continuously and automatically transfer multiple AI chips in the material picking area; when all AI chips have been transferred, turn off the negative pressure generator 13, visual positioning camera 11, ion fan 31, and each linear motor and telescopic cylinder in sequence, clean the material picking area, the material dispensing area table and the Bernoulli non-contact suction cup 10 again with an anti-static brush, turn off the main power of the device, and complete the entire AI chip transfer operation.
[0037] It should be noted that the number of ion fans, the specifications of the Bernoulli non-contact suction cups, the model of the linear motor, and the preset parameters of each step in this embodiment can all be adjusted according to the actual size, thickness, batch size, and transfer efficiency requirements of the AI chip. As long as the function of this device can be realized and the safe and accurate transfer of the AI chip can be completed, it falls within the protection scope of this invention.
[0038] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. The various components mentioned in this invention are common technologies in the existing field. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.
Claims
1. An intelligent transfer device for AI chips, characterized in that... The system includes a transfer platform, with columns bolted to its left and right sides. A top plate is welded to the top of each column, and multiple ion fans are installed in the center of the top plate. Each column has a sliding groove on its side wall, and a telescopic cylinder is installed at the top of the groove. A sliding plate is fixedly connected to the telescopic end of the telescopic cylinder. The side wall of the sliding plate is slidably connected to a crossbeam guide rail via a sliding assembly. A linear motor B is slidably connected to the crossbeam guide rail, and a negative pressure adsorption mechanism is connected to the linear motor B. A visual positioning camera is fixedly connected to the bottom of the sliding plate on one side of the transfer platform, and a workbench is fixedly installed on the top wall of the transfer platform.
2. The intelligent transfer device for AI chips according to claim 1, characterized in that... A partition plate is provided in the middle of the workbench to divide the workbench into two working areas, and the air outlet of the ion fan faces the workbench of the transfer table.
3. The intelligent transfer device for AI chips according to claim 1, characterized in that... The sliding assembly includes a guide rail and a linear motor A. The guide rail is fixedly connected to the side wall of the slide plate, one side of the linear motor is slidably connected to the guide rail, and the other side of the linear motor A is fixedly connected to the crossbeam.
4. The intelligent transfer device for AI chips according to claim 1, characterized in that... A hanging rod is provided on the side of the ion fan, and a grating ruler is provided on the rear side of the crossbeam. The grating ruler is arranged parallel to the crossbeam guide rail.
5. The intelligent transfer device for AI chips according to claim 1, characterized in that... The negative pressure adsorption mechanism includes an air tube, a Bernoulli non-contact suction cup, and a negative pressure generator. The negative pressure generator is installed on the transfer platform and is connected to the Bernoulli non-contact suction cup through the air tube. It has an air inlet at its center and an annular air groove around its perimeter.
6. The intelligent transfer device for AI chips according to claim 1, characterized in that... The transfer platform is a horizontally arranged rectangular platform made of anti-static aluminum alloy.
7. A smart transfer device for AI chips according to any one of claims 1-6, characterized in that... The method for transferring AI chips using this device includes the following specific steps: S1. Check the status of each component of the chip transfer device to ensure that each component is working properly; place the AI chip to be transferred neatly on one side of the workbench in the material picking area to ensure that the AI chip is undamaged and free of static electricity, and clean the dust and impurities on the material picking area, material dispensing area and Bernoulli non-contact chuck surface to avoid affecting the transfer accuracy and AI chip quality. S2. Start multiple ion fans on the top plate to continuously blow ion air into the material picking area, material discharging area, Bernoulli non-contact chuck, and chip transfer path; S3. Activate the visual positioning camera. The visual positioning camera takes high-definition pictures of the AI chip in the material picking area and transmits the captured AI chip image signal to the control system. The control system analyzes the image through visual algorithms, accurately identifies the position offset, rotation angle and placement posture of the AI chip, generates positioning adjustment commands and sends them to the telescopic cylinder, linear motor A and linear motor B. S4. According to the positioning adjustment command issued by the control system, the telescopic cylinder drives the slide plate to descend vertically along the slide groove of the column to the preset height, so that the Bernoulli non-contact suction cup and the surface of the AI chip in the picking area maintain a preset distance; at the same time, the linear motor A slides horizontally along the guide rail on the side wall of the slide plate, driving the crossbeam guide rail to move directly above the picking area, and the linear motor B slides along the crossbeam guide rail. With the displacement signal detected in real time by the grating ruler, the control system makes fine adjustments to the position of the linear motor B to ensure that the Bernoulli non-contact suction cup is accurately aligned with the center position of the AI chip to be transferred. S5. Start the negative pressure generator on the transfer platform. The negative pressure generator provides a stable high-speed airflow to the Bernoulli non-contact suction cup through the anti-static air tube. The airflow is ejected along the tangent of the annular air groove of the Bernoulli non-contact suction cup, forming a uniform local low-pressure area between the suction cup and the AI chip. The AI chip is adsorbed by relying on the air film suspension effect, and the preset air film gap is maintained during the adsorption process. S6. After adsorption is completed, the telescopic cylinder drives the slide plate to rise vertically to the preset transfer height to avoid collision between the AI chip and other components of the device during the transfer process. Then, linear motors A and B work together to move the Bernoulli non-contact suction cup and the adsorbed AI chip horizontally along the preset transfer path and transfer it to the top of the unloading area of the workbench. During the transfer process, the adsorption stability is maintained. The grating ruler continuously detects the displacement of linear motor B and feeds it back to the control system to ensure that the transfer path is accurate and without deviation. S7. The visual positioning camera takes a second picture of the unloading area and transmits the image signal of the unloading area position to the control system. The control system performs a second positioning calibration. After confirming that the unloading position is accurate, the telescopic cylinder drives the slide plate to descend vertically, so that the AI chip is close to the preset placement position of the unloading area. The negative pressure generator is turned off, the vacuum is broken to release the adsorption of the Bernoulli non-contact suction cup on the AI chip, so that the AI chip is placed stably in the unloading area, completing a single AI chip transfer. S8. After a single transfer is completed, the telescopic cylinder, linear motor A, and linear motor B work together to drive the Bernoulli non-contact suction cup to reset to the preset position above the material picking area. Repeat steps S2-S7 above to achieve continuous and automated transfer of multiple AI chips; after all transfers are completed, shut down all components of the device, clean the material picking area, material discharging area and Bernoulli non-contact suction cup, tidy up the air pipes and wiring and hang them on the hanging rod to complete the transfer operation.