Film forming equipment, air inlet device of film forming equipment and spraying plate of film forming equipment

Abstract

The invention discloses film forming equipment, an air inlet device of the film forming equipment and a spraying plate of the film forming equipment, and the spraying plate is applied to the air inlet device of the film forming equipment. The spraying plate is provided with a center plate section and an edge plate section, and the projection of the center plate section can cover the projection of an air inlet hole of the air inlet device in the normal direction of the spraying plate; spraying holes are formed in the central plate section and the edge plate sections; each spraying hole is a multi-section hole and comprises a throat section and an outlet section, the outlet section is located on the downstream side of the throat section, the flow area of the throat section is smaller than that of the outlet section, and the depth of the outlet section of the spraying hole of the center plate section is smaller than that of the outlet section of the spraying hole of the edge plate section. The spraying plate can improve the film thickness uniformity of the substrate so as to improve the product yield.

Description

Technical Field

[0001] This application relates to the field of photovoltaic equipment technology, specifically to a film-forming device, an air inlet device for the film-forming device, and a spray plate for the film-forming device. Background Technology

[0002] As production capacity increases, the size of spray plates in film deposition equipment such as plasma-enhanced chemical vapor deposition (PECVD) machines is also constantly increasing. For example, the side dimensions of a square spray plate can exceed 2 meters. In this case, regardless of the gas feeding scheme used, the gas flow rate at each spray hole of the spray plate will vary significantly, especially at some corners of the spray plate, where the process gas flow rate will drop significantly. This results in large differences in the uniformity of film thickness on the substrate surface, making it difficult to meet application requirements.

[0003] Therefore, how to provide a solution to overcome or alleviate the above-mentioned defects remains a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0004] The purpose of this application is to provide a film forming device, an air inlet device for the film forming device, and a spray plate for the film forming device, which can improve the film thickness uniformity of the substrate and thus improve the product yield.

[0005] To solve the above-mentioned technical problems, in a first aspect, this application provides a spray plate for a film-forming device, wherein the spray plate is applied to the air inlet device of the film-forming device; the spray plate has a central plate segment and an edge plate segment, and along the normal direction of the spray plate, the projection of the central plate segment can cover the projection of the air inlet hole of the air inlet device; both the central plate segment and the edge plate segment are provided with spray holes; the spray holes are multi-segment holes, including a throat segment and an outlet segment, the outlet segment is located downstream of the throat segment, the flow area of ​​the throat segment is smaller than the flow area of ​​the outlet segment, and the depth of the outlet segment of the spray hole in the central plate segment is smaller than the depth of the outlet segment of the spray hole in the edge plate segment.

[0006] In this embodiment, the spray plate includes a central plate segment and an edge plate segment. The depth of the outlet section of the spray holes in the central plate segment is less than the depth of the outlet section of the spray holes in the edge plate segment. This results in a stronger hollow cathode effect at the outlet section of the edge plate segment compared to the central plate segment. This allows for better plasma enrichment at the edge plate segment, offsetting the adverse effects of the relatively low flow rate of process gas at the edge plate segment. Consequently, the uniformity of plasma distribution at various locations on the spray plate is improved, leading to better film thickness uniformity on the substrate surface and increased product yield.

[0007] In some embodiments, along a direction away from the central plate segment, the edge plate segment includes at least two sub-plate segments, each of which is provided with the spray hole; and, in each sub-plate segment, the depth of the outlet segment of the spray hole of the sub-plate segment closer to the central plate segment is less than the depth of the outlet segment of the spray hole of the sub-plate segment farther from the central plate segment.

[0008] In some embodiments, the depth H0 of the outlet section of the spray hole of the segment farthest from the central segment and the thickness T of the spray plate satisfy the following relationship: H0 = 0.5T ~ 0.8T.

[0009] In some embodiments, the depth H0 of the outlet section of the spray hole of the segment farthest from the central segment and the thickness T of the spray plate satisfy the following relationship: H0 = 0.55T ~ 0.76T.

[0010] In some embodiments, the depth H0 of the outlet section of the spray hole of the segment farthest from the central segment and the thickness T of the spray plate satisfy the following relationship: H0 = 0.6T ~ 0.7T.

[0011] In some embodiments, the depth H0 of the outlet section of the spray hole in the central plate segment ′ The following relationship exists between H0 and the thickness T of the spray plate: ′ =0.4T~0.6T.

[0012] In some embodiments, the spray hole is a two-section hole; the outlet section is a constant diameter hole section; or, at least a portion of the outlet section is gradually widened in the direction away from the throat section.

[0013] In some embodiments, the number of spray holes is greater than or equal to 3, and the spray holes further include an inlet section located upstream of the throat section, and the flow area of ​​the inlet section is greater than the flow area of ​​the throat section.

[0014] In some embodiments, the outlet section includes at least two branch sections; in each branch section, the flow area of ​​the branch section relatively closer to the throat section is smaller than the flow area of ​​the branch section relatively farther away from the throat section.

[0015] In some embodiments, at least one of the segmented holes is a hole of equal diameter.

[0016] In some embodiments, at least one of the segmented segments is at least partially widened in the direction away from the throat segment.

[0017] Secondly, this application also provides an air inlet device for a film-forming apparatus, including the spray plate of the aforementioned film-forming apparatus.

[0018] In some embodiments, the air intake device further includes an air intake plate with an air intake hole, and the air intake plate and the spray plate are joined together along the normal direction of the spray plate.

[0019] Thirdly, this application also provides a film-forming apparatus, including the air inlet device of the aforementioned film-forming apparatus.

[0020] In some embodiments, the film-forming equipment further includes a housing and a carrier device. A reaction chamber is formed inside the housing. The carrier device and the air inlet device are both disposed inside the reaction chamber. The carrier device and the air inlet device are disposed opposite each other along the normal direction of the spray plate. The carrier device is used to support the substrate. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of a film-forming device, in which the spray plate has no holes; Figure 2 This is a schematic diagram of a film-forming device, in which the spray plate has spray holes; Figure 3 This is a schematic diagram of the structure of a film-forming device provided in an embodiment of this application; Figure 4 for Figure 3 Schematic diagram of the structure of the central spray plate; Figure 5 for Figure 4 A schematic diagram of the spray holes in the middle edge plate section; Figure 6 for Figure 4 A schematic diagram of the spray holes in the central plate section; Figure 7 This is a schematic diagram showing the distribution of the central and edge sections of a spray plate; Figure 8 This is a schematic diagram showing the distribution of the center and edge sections of another type of spray plate; Figure 9 A schematic diagram showing the distribution of an edge plate segment comprising at least two sub-plate segments; Figure 10 This is a schematic diagram illustrating another distribution of an edge plate segment, comprising at least two sub-plate segments. Figure 11 This is a schematic diagram of a two-stage spray nozzle structure. Figure 12 This is a schematic diagram of another type of two-stage spray nozzle. Figure 13 This is a schematic diagram of a spray nozzle with a four-segment orifice design. Figure 14 This is a schematic diagram of another type of four-segment spray nozzle.

[0022] The annotations in the attached figures are explained as follows: 1000 chassis; 1100 enclosure; 1200 top cover; 1300 reaction chamber; 2000 bearing device; 2100 stage; 2200 temperature control station; 3000 Intake device; 3100 Spray plate; 3110 Center plate section; 3120 Edge plate section; 3121 Dividing plate section; 3130 Spray hole; 3131 Throat section; 3132 Outlet section; 3132A Dividing hole section; 3133 Inlet section; 3200 Intake plate; 3210 Intake hole; 3300 Intake chamber; 4000 drive unit; 5000 gas source; S-plasma. Detailed Implementation

[0023] To enable those skilled in the art to better understand the technical solutions of this application, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0024] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation", "connection" and "linking" should be interpreted broadly. For example, "linking" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0025] The directional terms mentioned in the embodiments of this application, such as "inner" and "outer", are only for reference to the direction of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0026] In the description of embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0027] Please refer to Figure 1 and Figure 2 , Figure 1This is a schematic diagram of a film-forming device, in which the spray plate has no holes; Figure 2 This is a schematic diagram of a film-forming device, in which the spray plate has spray holes.

[0028] like Figure 1 and Figure 2 As shown, this application embodiment relates to a film forming apparatus, such as a plasma enhanced chemical vapor deposition (PECVD) apparatus, including a chassis 1000, a support device 2000, an air inlet device 3000, a drive device 4000, and an air source 5000.

[0029] The chassis 1000 is a main structure of the film-forming equipment, and a reaction chamber 1300 is formed inside it. The aforementioned support device 2000, air intake device 3000, etc., can all be disposed within the reaction chamber 1300. Here, the embodiments of this application do not limit the specific structural form of the chassis 1000. In practical applications, those skilled in the art can configure it according to specific needs, as long as it meets the requirements of use. For example, see... Figure 1 and Figure 2 The chassis 1000 may include a housing 1100 and a top cover 1200. The top cover 1200 may be installed on the housing 1100, and the top cover 1200 and the housing 1100 may enclose the aforementioned reaction chamber 1300.

[0030] The support device 2000 includes a stage 2100, which is used to support substrates such as silicon wafers. Figure 1 and Figure 2 In this implementation, the carrier device 2000 may further include a temperature control station 2200, on which a stage 2100 may be mounted, enabling heating or cooling of the stage 2100, thereby regulating the temperature of the substrate to meet the film deposition process requirements. The heating or cooling method of the temperature control station 2200 is not limited here; in practical applications, those skilled in the art can select the appropriate method according to specific needs, as long as it meets the requirements.

[0031] The air intake device 3000 and the support device 2000 are arranged opposite each other along the normal direction of the spray plate 3100. The air intake device 3000 includes a spray plate 3100 and an air intake plate 3200. The spray plate 3100 and the air intake plate 3200 can be arranged opposite each other along the normal direction of the spray plate 3100 and connected to each other. The spray plate 3100 and the air intake plate 3200 can be enclosed to form an air intake chamber 3300.

[0032] The air intake plate 3200 is provided with an air intake hole 3210, which can be connected to a gas source 5000 to introduce process gas from the gas source 5000 into the air intake chamber 3300. This process gas can be, for example, a reaction gas, a purging gas, or a cleaning gas. The number of air intake holes 3210 can be one or more, and is not limited herein. Furthermore, the embodiments of this application do not limit the location of the air intake hole 3210; in practical applications, those skilled in the art can set it according to specific usage needs. For example, the air intake hole 3210 can be located in the central region of the air intake plate 3200. Figure 2 As shown, the spray plate 3100 is provided with spray holes 3130, through which the process gas in the air inlet chamber 3300 can be sprayed out. There are multiple spray holes 3130, which are distributed in different areas of the spray plate 3100.

[0033] The air intake device 3000 can also be connected to a power source (not shown in the figure). In this embodiment, the air intake device 3000 is equivalent to a cathode. The air intake device 3000 and the chassis 1000 are insulated to prevent the chassis 1000 from becoming energized.

[0034] At least a portion of the drive device 4000 may be located within the reaction chamber 1300, and the drive device 4000 may be connected to the support device 2000 for driving the support device 2000 to move up and down, thereby adjusting the distance between the platform 2100 and the spray plate 3100. The specific structural form of the drive device 4000 is not limited here; in practical applications, those skilled in the art can select one according to specific needs, as long as it meets the requirements of use.

[0035] Generally, the number of air inlets is less than the number of air outlets, which facilitates the connection between the air intake device and the air source. The process gas supplied by the air source first enters the air intake chamber through the air inlets, then diffuses within the chamber, and is subsequently ejected through the spray holes. With this structural design, the gas flow rate at each spray hole will inevitably vary significantly, especially at some corners of the spray plate, where the process gas flow rate will drop significantly. This results in large differences in film thickness uniformity on the substrate surface, severely affecting film quality. Furthermore, this defect is particularly noticeable when the spray plate is relatively large.

[0036] In response to this, some related technologies involve adjusting the density of the spray nozzles. By increasing the number of spray nozzles at the corners of the spray plate, the flow rate of the process gas in that area can be increased, thereby improving the uniformity of the process gas distribution. However, this structural design can often only cope with specific process conditions. Once the process conditions change, such as changes in the distance between the gas inlet device and the stage, or changes in the density of the process gas, it will lead to situations where it cannot be applied or the application effect is poor. If a separate spray plate is manufactured for each process condition, it will result in too many types of spray plates and excessively high costs.

[0037] Therefore, the applicant hopes to develop an alternative solution to better address the issue of poor film thickness uniformity on the substrate surface caused by uneven distribution of process gases, while also possessing relatively better versatility. Returning to the technical problem of poor film thickness uniformity, the cause is uneven distribution of process gases. This uneven distribution ultimately results in uneven plasma density between the gas inlet device and the carrier device, thus leading to poor film thickness uniformity. In related technologies, it is generally understood by those skilled in the art that the uniformity of process gas distribution is equivalent to the uniformity of plasma distribution. Consequently, the research approach of those skilled in the art has remained focused on improving the uniformity of process gas distribution, without exploring other directions.

[0038] However, the applicant's research revealed that while there is a significant technical correlation between the uniformity of plasma distribution and the uniformity of process gas distribution, this does not mean that the uniformity of plasma distribution can only be improved by adjusting the uniformity of process gas distribution. Specifically, such as... Figure 1 As shown, assuming the spray plate 3100 has no spray holes, the plasma S between the spray plate 3100 and the stage 2100 is relatively uniform. Then, referring to... Figure 2 When the spray plate 3100 is provided with spray holes 3130, the plasma S will be enriched in the region where the spray hole 3130 is located due to the hollow cathode effect, thereby increasing the plasma distribution density in that region.

[0039] Based on this, the applicant chose not to focus on the uniformity of process gas distribution in related technologies, but instead to improve the distribution density of plasma S at different positions of the spray plate 3100 by adjusting the strength of the hollow cathode effect, thereby adjusting the uniformity of film thickness on the substrate surface, in order to embark on a completely new technological innovation route.

[0040] For detailed instructions, please refer to [link / reference]. Figures 3-6 , Figure 3 This is a schematic diagram of the structure of a film-forming device provided in an embodiment of this application; Figure 4 for Figure 3Schematic diagram of the structure of the central spray plate; Figure 5 for Figure 4 A schematic diagram of the spray holes in the middle edge plate section; Figure 6 for Figure 4 A schematic diagram of the spray holes in the central plate section.

[0041] like Figure 3 As shown, the embodiments of this application relate to a film-forming device. The specific structure of the film-forming device is similar to that described above. The following embodiments of this application mainly describe the specific structural design of the spray plate 3100.

[0042] Combination Figures 4-6 The spray plate 3100 has a central plate segment 3110 and an edge plate segment 3120. Along the normal of the spray plate 3100, the projection of the central plate segment 3110 can cover the projection of the air inlet 3210 of the air inlet device 3000.

[0043] Both the central plate segment 3110 and the edge plate segment 3120 are provided with spray holes 3130. The spray holes 3130 are multi-segment holes.

[0044] In the embodiment shown in the attached figure, the spray orifice 3130 is a three-section orifice, comprising an inlet section 3133, a throat section 3131, and an outlet section 3132 connected in sequence. The inlet section 3133 is directly connected to the intake chamber 3300. The throat section 3131 is located downstream of the inlet section 3133, and the outlet section 3132 is located downstream of the throat section 3131. The process gas in the intake chamber 3300 can flow sequentially through the inlet section 3133, the throat section 3131, and the outlet section 3132. The inlet section 3133 can be a constant-diameter orifice; or, at least a portion of the inlet section 3133 can be gradually widening along the direction near the throat section 3131. Similarly, the throat section 3131 can be a constant-diameter orifice; or, at least a portion of the throat section 3131 can be gradually widening along the direction away from the inlet section 3133. Similarly, the outlet section 3132 can be a constant diameter section; or, at least a portion of the outlet section 3132 can be gradually widened in the direction away from the throat section 3131.

[0045] The flow area of ​​the inlet section 3133 can be larger than that of the throat section 3131, meaning the opening size of the inlet section 3133 can be relatively large. This facilitates the flow of process gas from the inlet chamber 3300 to the spray hole 3130. The flow area of ​​the throat section 3131 can be smaller than that of the outlet section 3132. This allows the spray plate 3100 to form a stepped surface between the throat section 3131 and the outlet section 3132, specifically allowing the hollow cathode effect to occur in the outlet section 3132.

[0046] In the embodiments of this application, such as Figure 5 and Figure 6As shown, the depth H0 of the outlet section 3132 of the spray hole 3130 of the center plate section 3110 is... ′ The depth H0 of the outlet section 3132 of the spray hole 3130 of the edge plate section 3120 is smaller than that of the outlet section 3132 of the center plate section 3110. In this way, the hollow cathode effect at the outlet section 3132 of the edge plate section 3120 is stronger than that at the outlet section 3132 of the center plate section 3110, which allows the plasma S to be better enriched at the edge plate section 3120. This offsets the adverse effects of the relatively low flow rate of process gas at the edge plate section 3120, thereby improving the uniformity of plasma distribution at various locations of the spray plate 3100, improving the film thickness uniformity on the substrate surface, and thus improving product yield.

[0047] Please refer to Figures 7-10 , Figure 7 This is a schematic diagram showing the distribution of the central and edge sections of a spray plate; Figure 8 This is a schematic diagram showing the distribution of the center and edge sections of another type of spray plate; Figure 9 A schematic diagram showing the distribution of an edge plate segment comprising at least two sub-plate segments; Figure 10 This is another schematic diagram showing the distribution of an edge plate segment, which includes at least two sub-plate segments.

[0048] In some implementations, such as Figure 7 and Figure 8 As shown, the interior of the edge plate segment 3120 can be further distinguished, that is, the depth H0 of the outlet segment 3132 of each spray hole 3130 inside the edge plate segment 3120 can be the same.

[0049] In this implementation, the spray plate 3100 is equivalent to having only two plate segments, namely the central plate segment 3110 and the edge plate segment 3120. The outlet segment 3132 of the spray hole 3130 also has only two depths, which simplifies the structure of the spray plate 3100 and makes it easier to process and manufacture the spray plate 3100.

[0050] The dividing line between the center plate segment 3110 and the edge plate segment 3120 can be circular, square or other irregular shapes, etc., and is not limited here. In practical applications, those skilled in the art can choose according to specific needs.

[0051] In some implementations, such as Figure 9 and Figure 10 As shown, along the direction away from the central plate segment 3110, the edge plate segment 3120 may further include at least two sub-plate segments 3121, each of which is provided with a spray hole 3130. In this implementation, each sub-plate segment 3121 can be a separate plate segment, so the spray plate 3100 is equivalent to having at least 3 plate segments.

[0052] In each segment 3121, the depth H0 of the outlet section 3132 of the spray hole 3130 in the segment 3121 that is relatively closer to the center segment 3110 is less than the depth H0 of the outlet section 3132 of the spray hole 3130 in the segment 3121 that is relatively farther away from the center segment 3110. That is, along the direction away from the center segment 3110, the depth H0 of the outlet section 3132 of each segment 3121 can gradually increase.

[0053] With this configuration, the hollow cathode effect at the outlet section 3132 of each sub-plate segment 3121 can be gradually enhanced in the direction away from the central plate segment 3110. This can offset the adverse effects caused by the lower process gas flow rate at the sub-plate segment 3121 further away from the central plate segment 3110, thereby enabling a targeted increase in plasma density at each sub-plate segment 3121 and more effectively improving the film thickness uniformity on the substrate surface.

[0054] Here, the embodiments of this application do not limit the specific number of the segment 3121 or the shape of the dividing line between each segment 3121. In practical applications, those skilled in the art can select according to specific needs, as long as the requirements of use are met. For example, see [link to relevant documentation]. Figure 9 The central plate segment 3110 is plate segment ①, and there are six sub-plate segments 3121, namely plate segments ②, ③, ④, ⑤, ⑥, and ⑦. The depth H0 of the outlet segment 3132 of the spray hole 3130 of each sub-plate segment 3121 satisfies the following relationship: plate segment ② < plate segment ③ < plate segment ④ < plate segment ⑤ < plate segment ⑥ < plate segment ⑦; the dividing line between each sub-plate segment 3121 is a square; each sub-plate segment 3121 can be a square annulus. For example, see [reference needed]. Figure 10 The central plate segment 3110 is plate segment ①, and there are nine sub-plate segments 3121, namely plate segments ②, ③, ④, ⑤, ⑥, ⑦, ⑧, and ⑨. The depth H0 of the outlet segment 3132 of the spray hole 3130 of each sub-plate segment 3121 satisfies the following relationship: plate segment ② < plate segment ③ < plate segment ④ < plate segment ⑤ < plate segment ⑥ < plate segment ⑦ < plate segment ⑧ < plate segment ⑨. The dividing line between each sub-plate segment 3121 can be circular or arc-shaped, which is related to the setting position of each sub-plate segment 3121. Each sub-plate segment 3121 can be annular or some irregular shape.

[0055] Studies have shown that the hollow cathode effect is enhanced as the depth of the outlet section 3132 increases. However, this positive correlation is not constant. Once the depth of the outlet section 3132 reaches a certain point, further increases in depth do not significantly enhance the hollow cathode effect. In other words, there is an optimal depth for the outlet section 3132, where the depth is not too deep, yet the hollow cathode effect is relatively strong. This avoids excessively deep processing of the outlet section 3132, which would complicate the processing of the spray plate 3100 and weaken its strength.

[0056] Specifically, in this embodiment, among the various plate segments 3121, the segment 3121 furthest from the central plate segment 3110 has the strongest demand for the hollow cathode effect. Therefore, the depth H0 of the outlet segment 3132 of the spray hole 3130 of this segment 3121 can be designed to the aforementioned preferred value. As for the depth H0 of the outlet segment 3132 of the remaining plate segments 3121, it can be gradually decreased in the direction closer to the central plate segment 3110.

[0057] In a specific design, the depth H0 of the outlet section 3132 of the spray hole 3130 of the segment 3121 furthest from the central segment 3110 and the thickness T of the spray plate 3100 can satisfy the following relationship: H0 = 0.5T ~ 0.8T. This ensures a relatively strong hollow cathode effect to increase the plasma density at the location of the segment 3121, while avoiding excessively deep processing of the outlet section 3132, which would lead to overly complex processing and weakened strength of the spray plate 3100.

[0058] Furthermore, among the various plate segments 3121, the depth H0 of the outlet segment 3132 of the spray hole 3130 of the plate segment 3121 that is furthest from the central plate segment 3110 and the thickness T of the spray plate 3100 can satisfy the following relationship: H0 = 0.55T ~ 0.76T. This can further enhance the hollow cathode effect and avoid excessively deep processing of the outlet segment 3132.

[0059] Furthermore, among the various plate segments 3121, the depth H0 of the outlet segment 3132 of the spray hole 3130 of the plate segment 3121 that is furthest from the central plate segment 3110 satisfies the following relationship with the thickness T of the spray plate 3100: H0 = 0.6T~0.7T. This maximizes the hollow cathode effect and avoids excessively deep machining of the outlet segment 3132.

[0060] In some implementations, the depth H0 of the outlet section 3132 of the spray hole 3130 of the center plate section 3110 is... ′The following relationship exists between H0 and the thickness T of the spray plate 3100: ′ =0.4T~0.6T, so that the outlet section 3132 of the central plate section 3110 can also have a relatively strong hollow cathode effect, thereby ensuring the plasma density at the central plate section 3110.

[0061] It can be seen that when the edge segment 3120 is not partitioned, that is, when the edge segment is used... Figure 7 and Figure 8 In the implementation method, the depth H0 of the outlet section 3132 of the spray hole 3130 in the entire edge plate section 3120 can be designed according to the aforementioned formula.

[0062] Please refer to Figures 11-14 , Figure 11 This is a schematic diagram of a two-stage spray nozzle structure. Figure 12 This is a schematic diagram of another type of two-stage spray nozzle. Figure 13 This is a schematic diagram of a spray nozzle with a four-segment orifice design. Figure 14 This is a schematic diagram of another type of four-segment spray nozzle.

[0063] In some implementations, such as Figure 11 and Figure 12 As shown, the spray hole 3130 can also be a two-stage hole. In this case, the spray hole 3130 can only include the throat section 3131 and the outlet section 3132, and the structure of the spray hole 3130 can be simpler.

[0064] In this implementation, the outlet section 3132 can be a constant diameter orifice section. Alternatively, at least a portion of the outlet section 3132 can be gradually widened along the direction away from the throat section 3131.

[0065] In some implementations, the number of segments of the spray nozzle 3130 can be greater than or equal to 3. For example, Figure 5 and Figure 6 The three-section hole is shown. For example, Figure 13 and Figure 14 The four holes shown are shown.

[0066] When the number of spray orifice 3130 segments is greater than 3, the outlet section 3132 may include at least two branch orifice segments 3132A; among the branch orifice segments 3132A, the flow area of ​​the branch orifice segment 3132A relatively closer to the throat section 3131 is smaller than the flow area of ​​the branch orifice segment 3132A relatively farther away from the throat section 3131. In this way, the flow area of ​​each branch orifice segment 3132A is increased in the direction away from the throat section 3131, which is conducive to the convergence and accumulation of plasma S into the outlet section 3132.

[0067] The orifice section 3132A can be a constant diameter orifice section. Alternatively, at least a portion of the orifice section 3132A can be gradually widened in the direction away from the throat section 3131, which is also beneficial for the plasma S to converge and accumulate in the outlet section 3132A.

[0068] To better illustrate the technical effects of the embodiments of this application, the following embodiments of this application will be further illustrated with two specific cases.

[0069] Option 1: The spray plate 3100 has dimensions of 2250mm × 2250mm and a thickness of 30mm. The spray holes 3130 in all areas of the spray plate 3100 have the same shape and size, and are all three-section holes. The diameter of the outlet section 3132 is 2.5mm, and the depth of the outlet section 3132 is 20mm. The film thickness data at different points on the substrate in this option are shown in Table 1 below.

[0070] Table 1. Film thickness data at different locations on the substrate in Scheme 1

[0071] Option 2: The spray plate 3100 has dimensions of 2250mm × 2250mm and a thickness of 30mm. The center section 3110 and edge section 3120 of the spray plate 3100 adopt... Figure 8 In the central layout, the spray nozzle 3130 still adopts a three-section hole design. Specifically, the outlet section 3132 of the spray nozzle 3130 in the central plate section 3110 has a depth of 15mm, while the outlet section 3132 of the spray nozzle 3130 in the edge plate section 3120 has a depth of 20mm. The film thickness data at different points on the substrate in this design are shown in Table 2 below.

[0072] Table 2. Film thickness data at different locations on the substrate in Scheme 2.

[0073] Comparing Scheme 1 and Scheme 2 above, it can be seen that, under the condition that the process state, equipment size and other conditions remain unchanged, by using the spray plate 3100 provided in the embodiment of this application, the film thickness uniformity of the product can be improved from 13.82% to 4.67%, which can effectively improve the film thickness uniformity and thus improve the product yield.

[0074] The above are merely preferred embodiments of this application. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A spray plate for a film-forming device, characterized in that, The spray plate (3100) is applied to the air inlet device (3000) of the film forming equipment; the spray plate (3100) has a central plate segment (3110) and an edge plate segment (3120), and along the normal of the spray plate (3100), the projection of the central plate segment (3110) can cover the projection of the air inlet hole (3210) of the air inlet device (3000); Both the central plate segment (3110) and the edge plate segment (3120) are provided with spray holes (3130); the spray hole (3130) is a multi-segment hole, including a throat segment (3131) and an outlet segment (3132). The outlet segment (3132) is located downstream of the throat segment (3131). The flow area of ​​the throat segment (3131) is smaller than the flow area of ​​the outlet segment (3132). The depth of the outlet segment (3132) of the spray hole (3130) of the central plate segment (3110) is smaller than the depth of the outlet segment (3132) of the spray hole (3130) of the edge plate segment (3120).

2. The spray plate of the film-forming equipment according to claim 1, characterized in that, Along a direction away from the central plate segment (3110), the edge plate segment (3120) includes at least two sub-plate segments (3121), each of which is provided with the spray hole (3130). Furthermore, in each of the sub-plate segments (3121), the depth of the outlet segment (3132) of the spray hole (3130) of the sub-plate segment (3121) that is relatively closer to the center plate segment (3110) is less than the depth of the outlet segment (3132) of the spray hole (3130) of the sub-plate segment (3121) that is relatively farther away from the center plate segment (3110).

3. The spray plate of the film-forming equipment according to claim 2, characterized in that, In each of the segment sections (3121), the depth H0 of the outlet section (3132) of the spray hole (3130) of the segment section (3121) that is furthest from the central segment section (3110) satisfies the following relationship with the thickness T of the spray plate (3100): H0 = 0.5T ~ 0.8T.

4. The spray plate of the film-forming equipment according to claim 3, characterized in that, In each of the segment sections (3121), the depth H0 of the outlet section (3132) of the spray hole (3130) of the segment section (3121) that is furthest from the central segment section (3110) satisfies the following relationship with the thickness T of the spray plate (3100): H0 = 0.55T ~ 0.76T.

5. The spray plate of the film-forming equipment according to claim 4, characterized in that, In each of the segment sections (3121), the depth H0 of the outlet section (3132) of the spray hole (3130) of the segment section (3121) that is furthest from the central segment section (3110) satisfies the following relationship with the thickness T of the spray plate (3100): H0 = 0.6T ~ 0.7T.

6. The spray plate of the film-forming equipment according to claim 1, characterized in that, The depth H0 of the outlet section (3132) of the spray hole (3130) of the central plate section (3110) ′ The following relationship exists between the thickness T of the spray plate (3100) and the thickness T of the spray plate: H0 ′ =0.4T~0.6T.

7. The spray plate of the film-forming equipment according to any one of claims 1-6, characterized in that, The spray hole (3130) is a two-section hole; The outlet section (3132) is a constant diameter orifice section; or, at least a portion of the outlet section (3132) is gradually widened in the direction away from the throat section (3131).

8. The spray plate of the film-forming equipment according to any one of claims 1-6, characterized in that, The number of segments of the spray hole (3130) is greater than or equal to 3. The spray hole (3130) also includes an inlet segment (3133). The inlet segment (3133) is located upstream of the throat segment (3131), and the flow area of ​​the inlet segment (3133) is greater than the flow area of ​​the throat segment (3131).

9. The spray plate of the film-forming equipment according to claim 8, characterized in that, The outlet section (3132) includes at least two branch sections (3132A); In each of the orifice segments (3132A), the flow area of ​​the orifice segment (3132A) that is relatively closer to the throat segment (3131) is smaller than the flow area that is relatively farther away from the orifice segment (3132A).

10. The spray plate of the film-forming equipment according to claim 9, characterized in that, Among the various hole segments (3132A), at least one of the hole segments (3132A) is a hole segment with equal diameter.

11. The spray plate of the film-forming equipment according to claim 9, characterized in that, In each of the aforementioned perforation segments (3132A), at least one of the perforation segments (3132A) is at least partially widened in the direction away from the throat segment (3131).

12. An air inlet device for a film-forming apparatus, characterized in that, Includes the spray plate (3100) of the film-forming apparatus as described in any one of claims 1-11.

13. The air inlet device of the film-forming equipment according to claim 12, characterized in that, The air intake device (3000) further includes an air intake plate (3200), which is provided with an air intake hole (3210). The air intake plate (3200) and the spray plate (3100) are connected along the normal direction of the spray plate (3100).

14. A film-forming apparatus, characterized in that, Includes the air inlet device (3000) of the film-forming equipment as described in claim 12 or 13.

15. The film-forming apparatus according to claim 14, characterized in that, The film forming equipment also includes a housing (1000) and a support device (2000). A reaction chamber (1300) is formed inside the housing (1000). The support device (2000) and the air inlet device (3000) are both disposed in the reaction chamber (1300). The support device (2000) and the air inlet device (3000) are arranged opposite each other along the normal direction of the spray plate (3100). The support device (2000) is used to support the substrate.

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