Circuit board detection device and method

Abstract

The invention discloses a circuit board detection device and method. The device comprises a machine frame, a motion platform, a carrier platform, a detection system, a moving system and a control system. The detection system is used for acquiring a front circuit picture, a side circuit picture and a back circuit picture of the circuit board; the control system is used for receiving the front circuit picture, the side circuit picture and the back circuit picture of the circuit board acquired by the detection system, and sequentially splicing the front circuit picture, the side circuit picture and the back circuit picture of the circuit board in the same plane to form circuit board picture information; and comparing the picture information of the circuit board with set picture information of the circuit board to judge whether the circuit board is qualified or not. According to the invention, the pictures detected by the detection system are spliced, so that the circuit state at the junction of the front circuit and the side circuit and the circuit state at the junction of the side circuit and the back circuit can be detected, and comprehensive inspection of the circuit board is realized.

Description

Technical Field

[0001] This invention relates to the field of circuit board testing technology, and specifically to a circuit board testing device and method. Background Technology

[0002] This section provides only background information relevant to this disclosure and does not necessarily constitute prior art.

[0003] Currently, side-side circuit fabrication uses a full-surface titanium plating layer followed by laser etching to create the circuitry. This process suffers from material waste, high maintenance costs, complex procedures, low yield, and environmental pollution from wastewater generated by electroplating and waste generated by etching. To address these issues and enhance competitiveness, the applicant has developed a side-side circuit printing solution. This solution utilizes 3D printing to fabricate circuit boards on both sides of a glass substrate via direct-write printing, creating metal circuit layers on the sides of the substrate. These side-side metal circuits connect the circuit boards on both sides. However, the substrate cost for side-side circuitry is relatively high, and in actual printing, there is no device to inspect the side-side circuitry; the product is often directly cured, resulting in losses if any defective products are found. Summary of the Invention

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defect that the current testing devices cannot test the side circuits, thereby providing a circuit board testing device and method.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0006] A circuit board testing device, comprising:

[0007] Machine frame;

[0008] A motion platform, which is mounted on the machine frame;

[0009] A carrier platform, which is mounted on a motion platform, is used to hold circuit boards;

[0010] The detection system is used to acquire front circuit images, side circuit images, and back circuit images of a circuit board.

[0011] A mobile system is provided, which is mounted on a machine frame. The detection system and / or carrier platform are mounted on the mobile system, so that the detection system and / or carrier platform can move under the drive of the mobile system, thereby performing mobile detection on the circuit board.

[0012] The control system is used to receive the front circuit image, side circuit image, and back circuit image of the circuit board obtained by the detection system, and sequentially splice the front circuit image, side circuit image, and back circuit image of the circuit board in the same plane to form circuit board image information. Then, the circuit board image information is compared with the set circuit board image information to determine whether the circuit board is qualified.

[0013] The mobile system further optimizes the technical solution and includes:

[0014] The moving frame is set on the motion platform;

[0015] A Y-direction movement system is provided, with a motion platform on which the vehicle platform is mounted and moves along the Y-direction under the drive of the Y-direction movement system.

[0016] An X-direction movement system is mounted on a moving frame and is used to drive the detection system to move along the X-direction.

[0017] A Z-direction moving system is provided on top of an X-direction moving system, and a detection system is provided on top of the Z-direction moving system. The Z-direction moving system is used to drive the detection system to move along the Z-direction.

[0018] The technical solution is further optimized, and the Z-direction movement system includes a first Z-direction movement component and a second Z-direction movement component that operate relatively independently;

[0019] The detection system includes a front circuit detection mechanism, a back circuit detection mechanism, a first rhombus edge detection mechanism, a side edge detection mechanism, and a second rhombus edge detection mechanism. The front circuit detection mechanism and the back circuit detection mechanism are mounted on a first Z-axis moving component and can be adjusted independently. The first rhombus edge detection mechanism, the side edge detection mechanism, and the second rhombus edge detection mechanism are mounted on a second Z-axis moving component and can be adjusted independently. The first rhombus edge detection mechanism and the second rhombus edge detection mechanism are respectively arranged obliquely, and the side edge detection mechanism is arranged along the X-direction.

[0020] To further optimize the technical solution, a light source is also provided on the second Z-axis moving component, and the light-emitting surface of the light source is used to focus the light onto the side centerline position of the circuit board.

[0021] To further optimize the technical solution, the light source is configured as an arc shape, and the light-emitting surface of the light source is disposed on the inner wall surface of the arc shape of the light source;

[0022] And / or, the light source is provided in two parts, and the detection end of the first rhombus edge detection mechanism, the detection end of the side detection mechanism, and the detection end of the second rhombus edge detection mechanism all pass between the two light sources.

[0023] To further optimize the technical solution, a drive component is provided below the vehicle platform. The drive component is used to drive the vehicle platform to rotate in order to adjust the placement position of the circuit board.

[0024] To further optimize the technical solution, the detection system is also used to detect the placement information of the circuit boards on the vehicle platform and feed the placement information of the circuit boards back to the control system. The control system calculates the required deflection angle of the circuit boards based on the placement information of the circuit boards and controls the rotation of the vehicle platform.

[0025] To further optimize the technical solution, a suction hole is provided on the vehicle platform, and the suction hole is connected to the suction component.

[0026] A method for inspecting a circuit board, the circuit board comprising a substrate, and a front circuit, a side circuit, and a back circuit disposed on the substrate and connected thereto; the method for inspecting the circuit board includes the following steps:

[0027] S1. Place the circuit board onto the vehicle platform;

[0028] S2. Control the moving system through the control system to move the detection system and / or the vehicle platform, so that the detection system reaches the designated position;

[0029] S3. Obtain front circuit images, side circuit images, and back circuit images of the circuit board through the detection system;

[0030] S4. The obtained front circuit image, side circuit image, and back circuit image of the circuit board are sequentially stitched together on the same plane to form circuit board image information;

[0031] S5. Compare the circuit board image information with the set circuit board image information to determine whether the circuit board is qualified.

[0032] To further optimize the technical solution, step S3 also includes: acquiring an image of the first edge or first chamfer at the junction of the back circuit and the side circuit of the circuit board; and acquiring an image of the second edge or second chamfer at the junction of the front circuit and the side circuit of the circuit board.

[0033] In step S4, the obtained front circuit image, first edge or first chamfer image, side circuit image, first edge or first chamfer image, and back circuit image of the circuit board are spliced ​​together on the same plane to form circuit board image information.

[0034] To further optimize the technical solution, in step S3, the front circuit image, side circuit image, and back circuit image of the circuit board are obtained through the detection system. This is achieved by taking pictures or by sampling through a multi-angle reflector.

[0035] To further optimize the technical solution, in step S4, the obtained front circuit image, side circuit image, and back circuit image of the circuit board are sequentially stitched together on the same plane, including the following steps:

[0036] Rotate the obtained front circuit image of the circuit board by 180°, and stitch the back circuit image, side circuit image, and front circuit image of the circuit board in the same plane in sequence along the X direction.

[0037] Alternatively, rotate the obtained back circuit image of the circuit board by 180°, and stitch the front circuit image, side circuit image, and back circuit image of the circuit board in the same plane in sequence along the X direction.

[0038] To further optimize the technical solution, in step S1, after the circuit board is placed on the carrier platform, the deflection angle of the circuit board is calculated using the edge finding method or the Mark positioning method, and the circuit board is angularly corrected based on the deflection angle.

[0039] To further optimize the technical solution, in step S5, the circuit board image information is compared with the set circuit board image information to determine whether the circuit board is qualified, including:

[0040] Define the silver line boundary by dividing the circuit board edge lines;

[0041] Based on the silver lines on the boundary segmentation image, the width of the silver lines is measured, and holes and / or foreign objects are detected.

[0042] After the inspection is completed, the circuit board is judged to be qualified based on the set width requirement information and / or hole requirement information.

[0043] The technical solution of this invention has the following beneficial effects:

[0044] 1. This invention provides a circuit board inspection device. The inspection system is configured to inspect the front, side, and back circuits of a circuit board. A control system stitches together the images detected by the inspection system, and the circuit board status is detected based on the stitched images, thereby achieving accurate inspection of "C"-shaped circuits on the circuit board. Because this device stitches together the images detected by the inspection system, the circuit status at the junction of the front and side circuits, as well as the junction of the side and back circuits, can be detected, covering the entire circuit board and ensuring that all areas are inspected, achieving comprehensive inspection of the circuit board. Image stitching can obtain high-resolution complete circuit board images, meeting the requirements of high-precision, high-efficiency, and timely inspection of the side circuits of the circuit board, improving product yield. Based on the detection data of the device, timely alarms are provided, and process parameters are adjusted accordingly.

[0045] Meanwhile, this invention can detect defective products in a timely manner, saving costs through rework, solving product testing problems on production lines with new processes, and improving product yield.

[0046] 2. The circuit board inspection device provided by this invention includes a drive component positioned below a carrier platform. The drive component drives the carrier platform to rotate, thereby adjusting the placement position of the circuit board. The inspection system also detects the placement information of the circuit board on the carrier platform and feeds this information back to the control system. The control system calculates the required deflection angle of the circuit board based on the placement information and controls the rotation of the carrier platform, thus automatically detecting and adjusting the placement position of the circuit board, ensuring the accuracy of subsequent circuit board inspection.

[0047] 3. The circuit board testing device provided by the present invention allows the suction component to perform a suction action after the circuit board is placed on the carrier platform, thereby adsorbing the circuit board onto the carrier platform and preventing the circuit board from moving during testing, thus ensuring the accuracy of the testing.

[0048] 4. The circuit board inspection device provided by the present invention includes a light source on the second Z-axis moving component. The light-emitting surface of the light source is used to focus the light onto the side centerline of the circuit board, so that the first edge detection mechanism, the side detection mechanism and the second edge detection mechanism can more clearly capture the first edge, the side circuit and the second edge of the circuit board, respectively, thus ensuring the accuracy of the inspection.

[0049] The light source is designed in an arc shape, with its luminous surface positioned on the inner wall of the arc. The circuit board is located at the central axis of the arc-shaped light source, causing the light to be focused onto the side of the circuit board.

[0050] There are two light sources: the detection ends of the first rhombus edge detection mechanism, the side detection mechanism, and the second rhombus edge detection mechanism all pass between the two light sources. These two light sources allow light to be focused into the vertical plane containing the detection ends of these mechanisms, ensuring that they can better capture images of the side circuitry and guaranteeing the accuracy of the detection.

[0051] 5. The present invention provides a circuit board inspection method, which uses a control system to stitch together front circuit images, side circuit images, and back circuit images detected by the inspection system, and performs circuit board status inspection based on the stitched images, thereby achieving accurate inspection of "C"-shaped circuits on the circuit board.

[0052] The aforementioned circuit board inspection method can comprehensively inspect the front, sides, and back of the circuit board, ensuring its overall quality. By acquiring and stitching together circuit images from each side of the circuit board, the integrity and connectivity of the board can be more accurately assessed, helping to detect subtle defects or anomalies and thus improving inspection precision.

[0053] The aforementioned circuit board inspection method utilizes omnidirectional photography of the circuit board to read the product's external dimensions, precision, and appearance, trace the side circuit printing process, and query the actual product appearance corresponding to the side circuit printing process parameters, enabling real-time monitoring and risk management. Attached Figure Description

[0054] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0055] Figure 1 A three-dimensional structural schematic diagram of the circuit board testing device provided by the present invention;

[0056] Figure 2 A front view of the overall architecture of the circuit board testing device provided by the present invention;

[0057] Figure 3 A top view of the overall architecture of the circuit board testing device provided by the present invention;

[0058] Figure 4 This is a schematic diagram of the detection system in the circuit board detection device provided by the present invention.

[0059] Figure 5 The image shows the imaging effect of the camera after the front circuit detection mechanism in the circuit board detection device provided by the present invention detects the circuit board.

[0060] Figure 6 The image shows the imaging effect of the camera after the first edge detection mechanism in the circuit board inspection device provided by the present invention inspects the circuit board.

[0061] Figure 7 The image shows the imaging effect of the camera after the side inspection mechanism in the circuit board inspection device provided by the present invention inspects the circuit board.

[0062] Figure 8 The image shows the imaging effect of the camera after the second edge detection mechanism in the circuit board inspection device provided by the present invention inspects the circuit board.

[0063] Figure 9 The image shows the imaging effect of the camera after the back circuit detection mechanism in the circuit board detection device provided by the present invention detects the circuit board.

[0064] Figure label:

[0065] 1. Machine frame; 2. Motion platform; 3. Carrier platform; 31. Drive assembly; 4. Front circuit detection mechanism; 5. Back circuit detection mechanism; 6. First diamond edge detection mechanism; 7. Side detection mechanism; 8. Second diamond edge detection mechanism; 9. Light source; 10. Moving system; 101. Moving frame; 102. Y-direction moving system; 103. X-direction moving system; 104. Z-direction moving system. Detailed Implementation

[0066] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the disclosure to those skilled in the art. It should be noted that the present invention, by describing the circuit board testing device in the form of a testing system for detecting the front, side, and back circuits of a circuit board, is merely a preferred embodiment and is not intended to limit the scope of protection of the circuit board testing device.

[0067] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "a," "an," and "comprising" as used herein may also mean including the plural forms. The terms "comprising," "including," and "having" are inclusive and therefore indicate the presence of the stated features, elements, and / or components, but do not exclude the presence or addition of one or more other features, elements, components, and / or combinations thereof.

[0068] Although terms such as "first," "second," etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Furthermore, in the description of this invention, unless otherwise expressly specified and limited, the terms "set up" and "connected" should be interpreted broadly; for example, they may refer to a fixed connection, a detachable connection, or an integral connection; they may refer to a direct connection or an indirect connection via an intermediate medium. Those skilled in the art will understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0069] For ease of description, spatial relative terms may be used in the text to describe the relationship of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "front," "rear," "center," "inner," "longitudinal," "lateral," "side," "vertical," "outer," etc. Such spatial relative terms are intended to include different orientations of the mechanism in use or operation, in addition to those depicted in the figure. For example, if the mechanism in the figure is flipped, then an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The mechanism may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0070] Currently, side-side circuit fabrication uses a full-surface titanium plating layer followed by laser etching to create the circuitry. This process suffers from material waste, high maintenance costs, complex procedures, low yield, and environmental pollution from wastewater generated during electroplating and waste generated during etching. To address these issues and enhance competitiveness, the applicant has developed a side-side circuit printing solution. This solution utilizes 3D printing to fabricate circuit boards on both sides of a glass substrate via direct-write printing. Since the circuit boards on the front and back cannot be connected by lines passing through the glass substrate, a metal circuit layer is fabricated on the side of the glass substrate. This metal circuit on the side is shaped like a "C" and connects the circuit boards on the front and back sides.

[0071] The new process is accompanied by a new production line layout. To ensure the yield rate of products, it is necessary to develop a circuit board inspection device and method to control the products in terms of appearance and precision, and to conduct full inspection of products on the production line to control product quality in a timely manner.

[0072] The cost of the substrate for the side circuit is relatively high. In actual printing, there is no device to test the side circuit. The product is often directly cured. If there are NG products (non-conforming products), it will cause losses.

[0073] To address the aforementioned technical problems, this invention proposes a novel circuit board testing device and method, streamlining the production process as follows: side circuit printing—side circuit testing—side circuit curing. This invention effectively manages the product, allows for the wiping and reuse of printed materials, reducing production costs; and provides timely intervention to adjust printing parameters during the front-end side circuit printing process.

[0074] The specific embodiments of the present invention will now be described in detail with reference to the circuit board testing device of the first aspect of the present invention and the circuit board testing method of the second aspect of the present invention.

[0075] Example 1

[0076] It should be noted that the circuit board testing device of the first aspect of the present invention is only a preferred embodiment of the present invention. The circuit board testing device of the present invention can adopt the circuit board testing device of the first aspect of the present invention or other structures. For ease of explanation, the circuit board testing device of the first aspect of the present invention will be used for explanation below.

[0077] like Figures 1 to 4 As shown, this embodiment discloses a circuit board inspection device, including a machine frame 1, a motion platform 2, a carrier platform 3, an inspection system, a movement system 10, and a control system. This embodiment can perform multi-angle inspection of the front circuit, back circuit, and side circuit of a circuit board.

[0078] The machine frame 1 is welded from high-quality steel and equipped with shock-absorbing pads to ensure the structural strength and stability of the machine.

[0079] The motion platform 2 is mounted on the machine frame 1.

[0080] The carrier platform 3 is mounted on the motion platform 2 and is used to hold the circuit boards. The carrier platform 3 can be a transparent platform or an aluminum platform, or other types of carrier platforms may also be used.

[0081] The inspection system is used to acquire images of the front, side, and back circuits of a circuit board, enabling multi-angle inspection of the front, back, and side circuits.

[0082] The moving system 10 is mounted on the machine frame 1. The moving system 10 has high-precision motion axes such as the X, Y, Z1, and Z2 axes. The Z1 and Z2 axes are mounted on the X axis and can be adjusted independently. The detection system and / or the carrier platform 3 is mounted on the moving system 10 so that the detection system and / or the carrier platform 3 can move under the drive of the moving system 10, thereby performing moving detection on the circuit board.

[0083] The controlled end of the mobile system 10 is connected to the output end of the control system, and the output end of the detection system is connected to the input end of the control system. The control system receives the front, side, and back circuit images of the circuit board acquired by the detection system, and sequentially stitches these images together in the same plane to form circuit board image information. This information is then compared with pre-defined circuit board image information to determine if the circuit board is qualified. To ensure motion accuracy and speed, the control system uses a high-order motion controller, giving the motion platform high precision, high response, and high stability.

[0084] The aforementioned circuit board inspection device is configured to inspect the front, side, and back circuits of a circuit board. A control system stitches together the images detected by the inspection system, and the circuit board status is then detected based on the stitched images, thus achieving accurate inspection of "C"-shaped circuits on the circuit board. Because this device stitches together the images detected by the inspection system, the circuit status at the junction of the front and side circuits, as well as the junction of the side and back circuits, can be detected, covering the entire circuit board and ensuring that all areas are inspected, achieving comprehensive inspection of the circuit board. Image stitching provides high-resolution, complete circuit board images, enabling high-precision, high-efficiency, and timely inspection of the side circuits of the circuit board, improving product yield. Based on the device's inspection data, timely alarms are provided, and process parameters are adjusted promptly. Simultaneously, timely detection of defective products allows for rework, saving costs.

[0085] In some embodiments, the mobile system 10 includes a mobile frame 101, a Y-direction mobile system 102, an X-direction mobile system 103, and a Z-direction mobile system 104. The mobile frame 101 is mounted on a motion platform 2, which is mounted on a machine frame 1. The Y-direction mobile system 102 is mounted on the motion platform 2, and the carrier platform 3 is mounted on the Y-direction mobile system 102 and moves along the Y-direction under the drive of the Y-direction mobile system 102. The X-direction mobile system 103 is mounted on the mobile frame 101 and is used to drive the detection system to move along the X-direction. The Z-direction mobile system 104 is mounted on the X-direction mobile system 103, and the detection system is mounted on the Z-direction mobile system 104, which is used to drive the detection system to move along the Z-direction.

[0086] More specifically, the Y-direction movement system 102, X-direction movement system 103, and Z-direction movement system 104 can be a screw movement system, a belt movement system, a cylinder movement system, etc., or other movement structures can be used; their specific structures are not limited here. Taking the Y-direction movement system 102, X-direction movement system 103, and Z-direction movement system 104 as a screw movement system as an example, the screw of the X-direction movement system 103 is arranged along the X-direction, the screw of the Y-direction movement system 102 is arranged along the Y-direction, and the screw of the Z-direction movement system 104 is arranged along the Z-direction. The screw of the X-direction movement system 103 is transversely mounted on the machine frame 1, and the Z-direction movement system 104 is threadedly fitted with the screw of the X-direction movement system 103 through a screw thread plate.

[0087] The Z-direction movement system 104 includes a first Z-direction movement component and a second Z-direction movement component that operate relatively independently. The detection system includes a front circuit detection mechanism 4, a back circuit detection mechanism 5, a first edge detection mechanism 6, a side detection mechanism 7, and a second edge detection mechanism 8. The front circuit detection mechanism 4, back circuit detection mechanism 5, first edge detection mechanism 6, side detection mechanism 7, and second edge detection mechanism 8 are all cameras, used to photograph or video-record the circuit board. As an alternative implementation, the front circuit detection mechanism 4, back circuit detection mechanism 5, first edge detection mechanism 6, side detection mechanism 7, and second edge detection mechanism 8 can employ a multi-angle reflector sampling method to detect the circuit board. The multi-angle reflector sampling method refers to using multiple reflectors and / or refractors to ensure that the captured image is reflected and / or refracted at least once, thus displaying the front, side, and back circuits on a certain plane.

[0088] The front circuit inspection mechanism 4 is used to inspect the front circuit of the circuit board. The front circuit inspection mechanism is mounted on the Z2 axis, and the object distance is adjusted according to the Z2 axis. The positional relationship of the inspection is confirmed by the X and Y axes. The image image of the camera after inspection is shown below. Figure 5 As shown. It should be noted that the front of the circuit board is attached to the vehicle platform 3, therefore the front circuit detection mechanism 4 is located below the vehicle platform 3.

[0089] The back circuit detection mechanism 5 is used to detect the back circuit of the circuit board. The back circuit detection mechanism is mounted on the Z2 axis. After the object distance is confirmed by the front circuit detection mechanism, the X-axis and Z2-axis positions of the back circuit detection system are manually / automatically adjusted to establish a relative X-axis and Z-axis relationship. The detection positional relationship is confirmed by the X-axis and Y-axis. The image image from the camera after detection is shown below. Figure 9 As shown. It should be noted that when the circuit board is on the carrier platform 3, the back of the circuit board faces upward, so the back circuit detection mechanism 5 is located above the carrier platform 3.

[0090] The first edge detection mechanism 6 is used to detect the first edge of the circuit board. It is mounted on the Z1 axis, and the object distance is adjusted according to the Z1 axis. The detection position is confirmed by the X and Y axes. The resulting image from the camera is shown below. Figure 6 As shown. In a preferred embodiment, the junction between the back circuit and the side circuit of the circuit board is provided with a first chamfer, which makes the connection between the back circuit and the side circuit smoother. The first chamfer detection mechanism 6 is used to detect the first chamfer of the circuit board and take a picture of the first chamfer.

[0091] The side inspection mechanism 7 is used to inspect the side circuits of the circuit board. The side inspection mechanism is mounted on the Z1 axis. After the object distance is confirmed by the edge inspection system, the X and Z1 axis positions of the side inspection system are manually / automatically adjusted to establish a relative X and Z axis relationship. The positional relationship of the inspection is confirmed by the X and Y axes. The image image from the camera after inspection is shown below. Figure 7 As shown.

[0092] The second edge detection mechanism 8 is used to detect the second edge of the circuit board. The second edge detection mechanism is mounted on the Z1 axis. After the object distance is confirmed by the edge detection system, the X-axis and Z1 axis positions of the side detection system are manually / automatically adjusted to establish a relative X-axis and Z-axis relationship. The positional relationship of the detection is confirmed by the X-axis and Y-axis. The resulting image from the camera after detection is shown in the image below. Figure 8As shown. In a preferred embodiment, the junction between the front circuit and the side circuit of the circuit board is provided with a second chamfer, which makes the connection between the front circuit and the side circuit smoother. The second chamfer detection mechanism 8 is used to detect the second chamfer of the circuit board and take a picture of the second chamfer.

[0093] The front circuit detection mechanism 4 and the back circuit detection mechanism 5 are mounted on the first Z-axis moving component and can be adjusted independently. The first rhombus edge detection mechanism 6, the side edge detection mechanism 7, and the second rhombus edge detection mechanism 8 are mounted on the second Z-axis moving component and can be adjusted independently. In this embodiment, the Z-axis moving system 104 is configured as two moving components, and the two moving components operate independently, thereby enabling the front circuit detection mechanism 4, the back circuit detection mechanism 5, the first rhombus edge detection mechanism 6, the side edge detection mechanism 7, and the second rhombus edge detection mechanism 8 to be arranged in an orderly manner on the moving component.

[0094] The first rhombus edge detection mechanism 6 and the second rhombus edge detection mechanism 8 are respectively set at an angle, and the side edge detection mechanism 7 is set along the X direction.

[0095] In some embodiments, the second Z-axis moving component is further provided with a light source 9. The light-emitting surface of the light source 9 is used to focus the light onto the side centerline of the circuit board, so that the first edge detection mechanism 6, the side detection mechanism 7 and the second edge detection mechanism 8 can more clearly capture the first edge, the side circuit and the second edge of the circuit board, respectively, thus ensuring the accuracy of the detection.

[0096] In some embodiments, the light source 9 is configured in an arc shape, and the light-emitting surface of the light source 9 is disposed on the inner wall surface of the arc shape. The circuit board is located at the central axis of the arc-shaped light source, and the light is concentrated on the side of the circuit board by the arc-shaped light source.

[0097] In some embodiments, two light sources 9 are provided. The detection ends of the first rhombus edge detection mechanism 6, the side detection mechanism 7, and the second rhombus edge detection mechanism 8 all pass between the two light sources 9. More specifically, the two light sources 9 are arranged symmetrically about the detection end of the side detection mechanism 7. In this embodiment, the two light sources 9 enable light to be focused into the vertical plane where the detection ends of the first rhombus edge detection mechanism 6, the side detection mechanism 7, and the second rhombus edge detection mechanism 8 are located. This ensures that the detection ends of the first rhombus edge detection mechanism 6, the side detection mechanism 7, and the second rhombus edge detection mechanism 8 can better capture images of the side circuit, thus ensuring the accuracy of the detection.

[0098] In some embodiments, the carrier platform 3 is mounted on the Y-direction moving system 102, and the carrier platform 3 loads and unloads materials at designated positions. If the edge of the circuit board is not aligned with either the X or Y direction after being loaded onto the carrier platform 3, direct visual inspection of the circuit board will affect the inspection results, leading to inaccurate results. Therefore, this embodiment improves the carrier platform 3 by placing a drive component 31 below the carrier platform 3. The drive component 31 is used to drive the carrier to rotate, thereby adjusting the placement position of the circuit board. In this embodiment, the drive component 31 can adjust the placement position of the circuit board, ensuring that the circuit board is not tilted when placed on the carrier platform 3.

[0099] The detection system is also used to detect the placement information of the circuit boards on the vehicle platform 3 and feed the placement information of the circuit boards back to the control system. The control system calculates the required deflection angle of the circuit boards based on the placement information and controls the vehicle platform 3 to rotate, thereby automatically detecting and adjusting the placement position of the circuit boards to ensure the accuracy of subsequent circuit board detection.

[0100] The carrier platform 3 has a suction port that communicates with a suction assembly. The suction assembly can be a suction pump or other structures with suction functionality. When the circuit board is placed on the carrier platform 3, the suction assembly performs a suction action to adhere the circuit board to the carrier platform 3, thus preventing the circuit board from moving during testing and ensuring the accuracy of the test.

[0101] Example 2

[0102] It should be noted that the circuit board testing method of the second aspect of the present invention is only a preferred embodiment of the present invention. The circuit board testing method of the present invention can be the circuit board testing method of the second aspect of the present invention or other methods. For ease of explanation, the circuit board testing method of the second aspect of the present invention will be used for explanation below.

[0103] A circuit board inspection method, based on the circuit board inspection device of Embodiment 1, includes the following steps:

[0104] S10. The circuit board is loaded at the designated location.

[0105] S20. Place the circuit board onto the vehicle platform. Activate the suction to position the circuit board on the vehicle platform 3 under the action of suction force.

[0106] S30. Move the Z-axis to a suitable height range (perpendicular to the camera's focusing plane).

[0107] S40. After placing the circuit board on the carrier platform, calculate the deflection angle of the circuit board using the edge finding method or the Mark positioning method, and perform angle correction on the circuit board based on the deflection angle.

[0108] When calculating the deflection angle of the circuit board using the edge-finding method, a vision system is used to capture images of the circuit board's edge position. The detected edge position is compared with a preset standard position to calculate the positional deviation. An algorithm determines the direction and magnitude of the deviation. Based on the calculated deviation, the drive shaft of the drive component 31 is used for angle correction to ensure the consistency of the product detection position.

[0109] When calculating the deflection angle of a circuit board using the Mark positioning method, Mark points are pre-set on the circuit board, for example, at the four corners or specific functional areas. A vision system captures images of the circuit board, and an image processing algorithm identifies the positions of the Mark points. The actual detected Mark point positions are compared with standard positions to calculate the positional deviation. Based on the calculated deviation, the angle is corrected via the drive shaft of drive component 31 to ensure the consistency of the product detection position.

[0110] Another method to correct the circuit board's angle is to compare the photograph taken with the set image. Specifically, take a picture of the circuit board and check if the photograph information matches the set information. If they match, the circuit board's position does not need adjustment; if they do not match and there is an angle, calculate the angle and control the rotating component to straighten the circuit board.

[0111] S50. The control system controls the movement system to move the detection system and / or the carrier platform, so that the front circuit detection mechanism 4, the back circuit detection mechanism 5, the first diamond edge detection mechanism 6, the side edge detection mechanism 7, and the second diamond edge detection mechanism 8 simultaneously reach the designated position. After the detection system reaches the designated position, the object distance and / or the positional relationship of the detection system are adjusted.

[0112] S60. Trigger 5 detection agencies.

[0113] S70. Obtain front circuit images, side circuit images, and back circuit images of the circuit board through the detection system.

[0114] S80. The acquired front, side, and back circuit images of the circuit board are sequentially stitched together on the same plane to form circuit board image information. In this step, the inspection system can acquire high-resolution circuit board images and stitch these images together using image processing technology to form complete circuit board image information. This high-precision image processing technology helps to detect subtle defects or anomalies, thereby improving the accuracy of inspection.

[0115] Before splicing, the following steps are included: rotating the obtained front circuit image of the circuit board by 180°, and then sequentially splicing the back circuit image, side circuit image, and front circuit image of the circuit board in the same plane along the X direction; or, rotating the obtained back circuit image of the circuit board by 180°, and then sequentially splicing the front circuit image, side circuit image, and back circuit image of the circuit board in the same plane along the X direction. In this step, by rotating the obtained front or back circuit image of the circuit board by 180°, the directional consistency of each side of the circuit board during splicing can be ensured, avoiding splicing errors caused by inconsistent orientation, improving splicing consistency, and improving the accuracy of detection.

[0116] One implementation of the specific image stitching method is as follows: 1) Feature point extraction: Extract feature points from each image using image processing algorithms (such as SIFT, SURF, etc.). 2) Feature matching: Match feature points in different images to find the correspondence between them. 3) Image registration: Calculate the transformation matrix between each image using the matched feature points. 4) Stitching and synthesis: Use the transformation matrix to stitch multiple images into a complete circuit board image.

[0117] S90. Compare the circuit board image information with the set circuit board image information to determine whether the circuit board is qualified. In this step, the obtained circuit board image information is compared with the set standard circuit board image information, which can quickly determine whether the circuit board is qualified. This method is not only fast, but also can adapt to different types of circuit boards by setting different comparison standards, thus improving flexibility and applicability.

[0118] Step S90 specifically includes the following steps:

[0119] S901. Divide the circuit board edge lines to confirm the silver line boundaries. Specific steps can be as follows:

[0120] The acquired circuit board images are preprocessed, including noise reduction and contrast enhancement. Edge detection algorithms (such as Canny edge detection) are used to identify the circuit board's edge lines. The circuit board's outline is extracted from the edge detection results. The circuit board's boundaries are confirmed based on the extracted outline, and the approximate location of the silver lines is determined.

[0121] S902. Segment the silver lines on the image according to the boundaries, and measure the width of the silver lines, and detect holes and / or foreign objects. Specific steps may include:

[0122] Region segmentation: Based on the confirmed boundaries, the silver line region in the image is segmented out.

[0123] Width measurement: Use the threshold segmentation method to separate the silver wire from other backgrounds. Extract the center line of the silver wire. Take points at regular intervals on the center line and calculate the width at that point.

[0124] Hole detection: Binarize the silver wire area, set the silver wire to white and the background to black. Use the connected component analysis algorithm to find all hole areas. Extract features such as the area and shape of each hole.

[0125] Foreign object detection: Detect foreign objects through template matching or other feature extraction methods.

[0126] S903. The detection system completes the detection, gives data, and discriminates whether it is a qualified product or a non - qualified product according to the width requirement information and / or hole requirement information, etc. The specific steps can be as follows:

[0127] Compare the actually measured width with the set standard width range. Check whether the area and quantity of the holes meet the set standards. Check whether there are foreign objects and their positions and sizes. If all detection results are within the set standard range, it is determined as a qualified product. If any detection result exceeds the standard range, it is determined as a non - qualified product.

[0128] S100. All detection mechanisms move, and the carrier moves out of the detection area.

[0129] S110. The circuit board is unloaded at the specified position.

[0130] In the above circuit board detection method, the pictures detected by the detection system are stitched through the control system, and the circuit board status is detected based on the stitched pictures, thereby realizing the accurate detection of the "C" - shaped circuits on the circuit board.

[0131] In the above circuit board detection method, by using the method of taking pictures of the circuit board in all directions, the external dimensions, precision, and appearance of the product can be read, the side - circuit printing process can be traced, and the actual product morphology corresponding to the side - circuit printing process parameters can be queried, for real - time monitoring and risk control.

[0132] Obviously, the above embodiments are only examples clearly described and not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all implementation manners here. And the obvious changes or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A circuit board testing device, characterized in that, include: Machine frame (1); Motion platform (2), which is mounted on machine frame (1); A carrier platform (3) is mounted on a motion platform (2) and is used to hold circuit boards. The detection system is used to acquire front circuit images, side circuit images, and back circuit images of a circuit board. A mobile system (10) is set on a machine frame (1), and a detection system and / or a carrier platform (3) is set on the mobile system (10) so that the detection system and / or the carrier platform (3) can move under the drive of the mobile system (10) to perform mobile detection on the circuit board; The control system is used to receive the front circuit image, side circuit image, and back circuit image of the circuit board obtained by the detection system, and sequentially splice the front circuit image, side circuit image, and back circuit image of the circuit board in the same plane to form circuit board image information. Then, the circuit board image information is compared with the set circuit board image information to determine whether the circuit board is qualified.

2. The circuit board testing device according to claim 1, characterized in that, The mobile system (10) includes: A movable frame (101) is mounted on a motion platform (2); The Y-direction movement system (102) is set on the motion platform (2), and the vehicle platform (3) is set on the Y-direction movement system (102) and moves along the Y direction under the drive of the Y-direction movement system (102); An X-direction moving system (103) is provided on a moving frame (101) and is used to drive the detection system to move along the X direction. A Z-direction moving system (104) is provided on an X-direction moving system (103), and a detection system is provided on the Z-direction moving system (104). The Z-direction moving system (104) is used to drive the detection system to move along the Z-direction.

3. The circuit board testing device according to claim 2, characterized in that, The Z-direction movement system (104) includes a first Z-direction movement component and a second Z-direction movement component that operate relatively independently; The detection system includes a front circuit detection mechanism (4), a back circuit detection mechanism (5), a first rhombus edge detection mechanism (6), a side edge detection mechanism (7), and a second rhombus edge detection mechanism (8). The front circuit detection mechanism (4) and the back circuit detection mechanism (5) are mounted on a first Z-axis moving component and can be adjusted independently. The first rhombus edge detection mechanism (6), the side edge detection mechanism (7), and the second rhombus edge detection mechanism (8) are mounted on a second Z-axis moving component and can be adjusted independently. The first rhombus edge detection mechanism (6) and the second rhombus edge detection mechanism (8) are respectively obliquely arranged, and the side edge detection mechanism (7) is arranged along the X direction.

4. The circuit board testing device according to claim 3, characterized in that, The second Z-axis moving component is also provided with a light source (9), the light-emitting surface of which is used to focus the light onto the side center axis of the circuit board.

5. The circuit board testing device according to claim 4, characterized in that, The light source (9) is configured in an arc shape, and the light-emitting surface of the light source (9) is disposed on the arc-shaped inner wall surface of the light source (9); And / or, the light source (9) is provided in two, and the detection end of the first rhombus edge detection mechanism (6), the detection end of the side detection mechanism (7), and the detection end of the second rhombus edge detection mechanism (8) all pass between the two light sources (9).

6. The circuit board testing device according to any one of claims 1-5, characterized in that, A drive assembly (31) is provided below the vehicle platform (3). The drive assembly (31) is used to drive the vehicle platform (3) to rotate so as to adjust the placement position of the circuit board.

7. The circuit board testing device according to claim 6, characterized in that, The detection system is also used to detect the placement information of the circuit board on the vehicle platform (3) and feed the placement information of the circuit board back to the control system. The control system calculates the required deflection angle of the circuit board based on the placement information of the circuit board and controls the vehicle platform (3) to rotate.

8. The circuit board testing device according to any one of claims 1-5, characterized in that, The vehicle platform (3) is provided with a suction hole, which is connected to the suction assembly.

9. A circuit board testing method, characterized in that, The method is based on the circuit board testing apparatus according to any one of claims 1-8, wherein the circuit board includes a substrate, and a front circuit, a side circuit, and a back circuit disposed on the substrate and connected thereto; the circuit board testing method includes the following steps: S1. Place the circuit board onto the vehicle platform; S2. Control the moving system through the control system to move the detection system and / or the vehicle platform, so that the detection system reaches the designated position; S3. Obtain front circuit images, side circuit images, and back circuit images of the circuit board through the detection system; S4. The obtained front circuit image, side circuit image, and back circuit image of the circuit board are sequentially stitched together on the same plane to form circuit board image information; S5. Compare the circuit board image information with the set circuit board image information to determine whether the circuit board is qualified.

10. The circuit board testing method according to claim 9, characterized in that, Step S3 further includes: acquiring an image of the first edge or first chamfer at the junction of the back circuit and the side circuit of the circuit board; acquiring an image of the second edge or second chamfer at the junction of the front circuit and the side circuit of the circuit board; In step S4, the obtained front circuit image, first edge or first chamfer image, side circuit image, first edge or first chamfer image, and back circuit image of the circuit board are spliced ​​together on the same plane to form circuit board image information.

11. The circuit board testing method according to claim 9, characterized in that, In step S3, the front circuit image, side circuit image, and back circuit image of the circuit board are obtained by the detection system. This is achieved by taking pictures or by sampling with a multi-angle reflector.

12. The circuit board testing method according to claim 9, characterized in that, In step S4, the obtained front circuit image, side circuit image, and back circuit image of the circuit board are sequentially stitched together on the same plane, including the following steps: Rotate the obtained front circuit image of the circuit board by 180°, and stitch the back circuit image, side circuit image, and front circuit image of the circuit board in the same plane in sequence along the X direction. Alternatively, rotate the obtained back circuit image of the circuit board by 180°, and stitch the front circuit image, side circuit image, and back circuit image of the circuit board in the same plane in sequence along the X direction.

13. The circuit board testing method according to claim 9, characterized in that, In step S1, after the circuit board is placed on the carrier platform, the deflection angle of the circuit board is calculated using the edge finding method or the Mark positioning method. Based on the deflection angle, the circuit board is angularly corrected.

14. The circuit board testing method according to any one of claims 9-13, characterized in that, In step S5, the circuit board image information is compared with the set circuit board image information to determine whether the circuit board is qualified, including: Define the silver line boundary by dividing the circuit board edge lines; Based on the silver lines on the boundary segmentation image, the width of the silver lines is measured, and holes and / or foreign objects are detected. After the inspection is completed, the circuit board is judged to be qualified based on the set width requirement information and / or hole requirement information.

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