Hard disk module and server

Abstract

The invention relates to a hard disk module and a server. The hard disk module comprises a hard disk bracket, a hard disk and a heat conduction module. The hard disk bracket is provided with an accommodating space. The hard disk comprises a hard disk body and a hard disk electric connector. The hard disk body is arranged in the accommodating space. The hard disk electric connector is connected to the hard disk body. The heat conduction module comprises a first plate body and a second plate body. The first plate body is connected to the second plate body. The first plate body and the second plate body are respectively thermally coupled to two different sides of the hard disk body. The first plate body and the hard disk electric connector are located on the same side of the hard disk body. A server comprises a case, a cold plate and a hard disk module.

Description

Technical Field

[0001] This application relates to the field of computing device technology, and in particular to a hard disk module and server. Background Technology

[0002] With the technological advancements in high-density servers, hard drives, as core data storage devices, are experiencing increasingly faster read and write speeds, leading to a corresponding increase in the heat generated during high-speed operation. Failure to dissipate this heat effectively and in a timely manner will result in excessively high hard drive operating temperatures, leading to decreased data read and write performance, accelerated aging of electronic components, and even risks such as data loss or system instability.

[0003] Currently, common hard drive cooling methods mainly include air cooling and liquid cooling. Taking cold plate liquid-cooled servers as an example, if there is no effective and stable heat conduction path between the hard drive and the cold plate, the heat generated by the hard drive will be difficult to be conducted to the cold plate, thus affecting the heat dissipation performance of the liquid cooling system.

[0004] Therefore, designing a hard drive module that can efficiently conduct the heat generated by the hard drive to the cold plate and quickly dissipate the heat to the external environment is one of the problems that researchers should solve. Summary of the Invention

[0005] Therefore, it is necessary to provide a hard disk module and server to address the above problems.

[0006] This invention provides a hard disk module, comprising:

[0007] Hard drive tray, with storage space;

[0008] A hard disk includes a hard disk body and a hard disk electrical connector, wherein the hard disk body is installed in the accommodating space and the hard disk electrical connector is connected to the hard disk body;

[0009] The system includes a heat-conducting module, comprising a first plate and a second plate, wherein the first plate is connected to the second plate, and the first plate and the second plate are thermally coupled to opposite sides of the hard disk body, and the first plate and the hard disk electrical connector are located on the same side of the hard disk body.

[0010] In one embodiment, the hard drive bracket further includes a connecting plate and two sets of mounting plates, with the opposite sides of the connecting plate respectively connected to the two sets of mounting plates, and the connecting plate and the two sets of mounting plates together surround the accommodating space.

[0011] In one embodiment, the heat-conducting module further includes a first thermally conductive pad, a second thermally conductive pad, and a third thermally conductive pad. The first thermally conductive pad and the second thermally conductive pad are respectively thermally coupled to opposite sides of the first plate body. The first thermally conductive pad is thermally coupled to one side of the hard disk body, and the opposite sides of the third thermally conductive pad are respectively thermally coupled to the other side of the second plate body and the hard disk body.

[0012] In one embodiment, the hard drive further includes hard drive gold fingers, which are located on the same side of the hard drive body as the hard drive electrical connector. The heat conduction module further includes an insulating sheet for electrically insulating the first board body from the hard drive gold fingers. The insulating sheet is disposed on the side of the first board body facing the hard drive body, and the insulating sheet is farther away from the second board body than the first thermal pad.

[0013] In one embodiment, the heat-conducting module further includes a cutout portion, and the cutout portion is located on the side of the second plate away from the first plate.

[0014] In one embodiment, the heat-conducting module further includes a third plate connected to the first plate, the hard disk body being located between the second plate and the third plate, and the third plate being thermally coupled to the hard disk body.

[0015] In one embodiment, the heat-conducting module further includes a fourth heat-conducting pad, and the opposite sides of the fourth heat-conducting pad are thermally coupled to the third plate and the hard disk body, respectively.

[0016] In one embodiment, the thermal conductivity of the first thermal pad, the second thermal pad, the third thermal pad, and the fourth thermal pad all fall between 6 and 10 watts / hour.

[0017] In one embodiment, the heat-conducting module further includes a first engaging portion and at least one third engaging portion. The first engaging portion protrudes from the first plate body, and at least one of the third engaging portions protrudes from the second plate body. The third engaging portion is located between the hard disk body and one of the two sets of mounting plates. The hard disk tray further includes a second engaging portion and at least one fourth engaging portion. The second engaging portion is located on the side of one of the two sets of mounting plates closer to the first plate body, and at least one of the fourth engaging portions protrudes from one of the two sets of mounting plates. The first engaging portion engages with the second engaging portion, and the third engaging portion engages with the fourth engaging portion, so that the heat-conducting module is assembled with the hard disk tray.

[0018] The present invention also provides a server, comprising:

[0019] The casing, including the base plate;

[0020] A cold plate is disposed on the base plate;

[0021] A hard disk module, disposed on the side of the cold plate away from the base plate, includes:

[0022] Hard drive tray, with storage space;

[0023] A hard disk includes a hard disk body and a hard disk electrical connector, wherein the hard disk body is installed in the accommodating space and the hard disk electrical connector is connected to the hard disk body;

[0024] The system includes a heat-conducting module, comprising a first plate and a second plate, wherein the first plate is connected to the second plate, and the first plate and the second plate are thermally coupled to opposite sides of the hard disk body, the first plate and the hard disk electrical connector are located on the same side of the hard disk body, and the first plate is thermally coupled to the cold plate and conducts the heat generated by the hard disk body to the cold plate.

[0025] The aforementioned hard drive module and server efficiently transfer the heat generated by the hard drive to the cold plate and quickly dissipate the heat to the external environment, thereby improving the lifespan of the hard drive and ensuring the stability and reliability of the server operation. Attached Figure Description

[0026] Figure 1 This is a perspective view of the hard disk module according to the first embodiment of the present invention.

[0027] Figure 2 for Figure 1 An exploded view of the hard disk module.

[0028] Figure 3 for Figure 1 A three-dimensional schematic diagram of the heat conduction module.

[0029] Figure 4 for Figure 1 An exploded view of the heat-conducting module.

[0030] Figure 5 This is a three-dimensional schematic diagram of the heat-conducting module according to the second embodiment of the present invention.

[0031] Figure 6 for Figure 5 A front view diagram of the heat dissipation module.

[0032] Figure 7 This is a perspective view of a hard disk module according to a third embodiment of the present invention.

[0033] Figure 8 for Figure 7 An exploded view of the heat dissipation module and the hard drive.

[0034] Figure 9 This is a partial schematic diagram of a server according to a fourth embodiment of the present invention.

[0035] Icon labels:

[0036] 1. Server;

[0037] 10, 10b, Hard disk module;

[0038] 100, 100b, hard drive tray; 110, 110b, connecting plate; 120, 120b, assembly plate; 130, 130b, handle; 131, 131b, pivot; 140, second engaging part; 150, 150b, fourth engaging part;

[0039] 200, 200b: Hard drive; 210, 210b: Hard drive body; 220, 220b: Hard drive electrical connector; 230, 230b: Hard drive gold fingers;

[0040] 300, 300a, 300b, thermal conductive modules; 310, 310a, 310b, first plate; 320, 320a, 320b, second plate; 325a, cutout portion; 330b, third plate; 335b, cutout portion; 340, 340a, 340b, first thermal conductive pad; 350, 350a, 350b, second thermal conductive pad; 360, 360a, 360b, third thermal conductive pad; 370b, fourth thermal conductive pad; 380, 380a, 380b, insulating sheets; 390, 390a, first engaging portion; 395, 395a, 395b, third engaging portion; 3951, 3951a, 3951b, third engaging holes;

[0041] 20. Cold-rolled steel plate;

[0042] S, Sb, accommodating space;

[0043] A, B, C, D, E, direction. Detailed Implementation

[0044] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0045] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0046] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0047] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0048] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0049] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0050] Please see Figures 1 to 4 . Figure 1 This is a perspective view of the hard disk module according to the first embodiment of the present invention. Figure 2 for Figure 1 An exploded view of the hard disk module. Figure 3 for Figure 1 A three-dimensional schematic diagram of the heat conduction module. Figure 4 for Figure 1 An exploded view of the heat-conducting module.

[0051] In this embodiment, the hard disk module 10 includes a hard disk tray 100, a hard disk 200, and a heat dissipation module 300. The hard disk 200 is mounted on the hard disk tray 100. The heat dissipation module 300 engages with the hard disk tray 100 and is thermally coupled to the hard disk 200.

[0052] Please see Figure 1 and Figure 2 The hard drive tray 100 includes a connecting plate 110, two assembly plates 120, and a handle 130. The two opposite sides of the connecting plate 110 are respectively connected to the two assembly plates 120. The connecting plate 110 and the two assembly plates 120 together form an accommodating space S for accommodating the hard drive 200. The handle 130 is pivotally connected to the connecting plate 110 via a pivot 131.

[0053] The hard drive 200 includes a hard drive body 210, a hard drive electrical connector 220, and hard drive gold fingers 230. The hard drive body 210 is installed in the accommodating space S. The hard drive electrical connector 220 is connected to the hard drive body 210 and is located on the side of the hard drive body 210 away from the connecting plate 110. The hard drive gold fingers 230 and the hard drive electrical connector 220 are located on the same side of the hard drive body 210.

[0054] The heat dissipation module 300 includes a first plate 310 and a second plate 320. The first plate 310 is connected to the second plate 320. The first plate 310 and the second plate 320 are thermally coupled to opposite sides of the hard disk body 210, respectively. The first plate 310 and the hard disk electrical connector 220 are located on the same side of the hard disk body 210.

[0055] In this embodiment, the first plate 310 and the second plate 320 may be integrally formed L-shaped plates, but the present invention is not limited thereto. The materials of the first plate 310 and the second plate 320 may be, for example, but not limited to, T2 copper with high thermal conductivity. In this way, by thermally coupling the first plate 310 and the second plate 320 to opposite sides of the hard disk body 210, a double-sided heat conduction path can be formed, thereby more efficiently conducting the heat generated by the hard disk body 210 during operation to the cold plate 20 located below the hard disk module 10 (please refer to the previous section). Figure 9 ).

[0056] Please see Figure 3 and Figure 4 In this embodiment, the heat-conducting module 300 further includes a first thermally conductive pad 340, a second thermally conductive pad 350, and a third thermally conductive pad 360, used to fill the gaps existing between the first plate 310 and the hard disk body 210, between the first plate 310 and the cold plate 20, and between the second plate 320 and the hard disk body 210. The first thermally conductive pad 340 and the second thermally conductive pad 350 are respectively thermally coupled to opposite sides of the first plate 310. The first thermally conductive pad 340 is thermally coupled to one side of the hard disk body 210. The opposite sides of the third thermally conductive pad 360 are respectively thermally coupled to the other side of the second plate 320 and the hard disk body 210.

[0057] In this embodiment, the thermal conductivity of the first thermal pad 340, the second thermal pad 350, and the third thermal pad 360 can all be between 3.5 and 10 W / mK, preferably between 6 and 10 W / mK. Specifically, when the thermal conductivity of the thermal pad is 3.5 W / mK, the temperature of the hard disk drive 210 is 50°C, while when the thermal conductivity of the thermal pad is between 6 and 10 W / mK, the temperature of the hard disk drive 210 is 48°C.

[0058] The materials of the first thermal pad 340, the second thermal pad 350, and the third thermal pad 360 may be, for example, but not limited to, elastic materials with high flexibility and high thermal conductivity, and may have low thermal resistance and extremely high deformation under low pressure. In this way, the thermal pads disposed between the contact interfaces of these components can effectively fill the gaps, further enhancing the thermal coupling between the contact interfaces, reducing contact thermal resistance, and providing cushioning and shock absorption effects, thereby significantly improving the heat dissipation performance of the thermal module and protecting the hard drive from damage caused by mechanical stress.

[0059] Please see Figures 1 to 4In this embodiment, the thermally conductive module 300 further includes an insulating sheet 380 for electrically insulating the first plate 310 from the hard disk gold fingers 230. The insulating sheet 380 is disposed on the side of the first plate 310 facing the hard disk body 210 and is further away from the second plate 320 than the first thermally conductive pad 340. The insulating sheet 380 may be, for example, but not limited to, an adhesive-backed Mylar sheet.

[0060] In this embodiment, the side of the first plate 310 facing away from the hard disk body 210 may be coated with a coating (not shown). This further enhances the thermal conductivity, oxidation resistance, and corrosion resistance of the coated first plate 310, resulting in a longer service life. Furthermore, when multiple hard disk modules are arranged side-by-side, the coating can also serve as an insulating layer to prevent short circuits caused by contact between the metal heat-conducting plates of adjacent hard disk modules.

[0061] In this embodiment, the heat-conducting module 300 may further include a first engaging portion 390. The first engaging portion 390 protrudes from the first plate 310. The first engaging portion 390 may be, for example, but not limited to, an engaging protrusion protruding from the first plate 310 toward the connecting plate 110. The hard disk tray 100 may further include a second engaging portion 140. The second engaging portion 140 may be located on the side of the assembly plate 120 near the first plate 310. The second engaging portion 140 may be, for example, but not limited to, an engaging recess formed by bending inward from the side of the assembly plate 120 near the first plate 310. The first engaging portion 390 and the second engaging portion 140 may be a matching concave-convex structure. The first engaging portion 390 and the second engaging portion 140 engage to assemble the heat-conducting module 300 with the hard disk tray 100.

[0062] In this embodiment, the heat-conducting module 300 may further include two sets of third engaging portions 395. The two sets of third engaging portions 395 protrude from the second plate 320 and are closer to the connecting plate 110 than the first engaging portion 390. The hard disk tray 100 may further include two sets of fourth engaging portions 150. The two sets of fourth engaging portions 150 respectively protrude from the assembly plate 120. The third engaging portions 395 and the fourth engaging portions 150 may be matching concave-convex structures. The third engaging portions 395 and the fourth engaging portions 150 engage to assemble the heat-conducting module 300 with the hard disk tray 100. In this embodiment, the two sets of third engaging portions 395 may, for example, but not limited to, each have a third engaging hole 3951. The fourth engaging portion 150 may, for example, but not limited to, an engaging protrusion, and is detachably located in the third engaging hole 3951.

[0063] The matching snap-fit ​​design between the heat dissipation module 300 and the hard drive tray 100 enables quick and stable assembly without the use of screws or other fasteners. This not only improves the convenience for operators when installing, removing, and maintaining the hard drive module 10, but also reduces the number of parts and assembly costs of the hard drive module 10.

[0064] Other embodiments will be listed below for illustration. It must be noted that the following embodiments use the component reference numerals and some content from the foregoing embodiments, employing the same or similar reference numerals to represent the same or similar components, and omitting descriptions of identical technical content. For explanations of the omitted parts, please refer to the foregoing embodiments; these will not be repeated in the following embodiments.

[0065] Please see Figure 5 and Figure 6 . Figure 5 This is a three-dimensional schematic diagram of the heat-conducting module according to the second embodiment of the present invention. Figure 6 for Figure 5 A front view schematic diagram of the heat-conducting module. The heat-conducting module 300a according to the second embodiment of the present invention is similar to the heat-conducting module 300 according to the first embodiment. Specifically, the components of the heat-conducting module 300a of this embodiment, similar to those of the heat-conducting module 300 of the first embodiment, include: a first plate 310a, a first thermally conductive pad 340a, a second thermally conductive pad 350a, a third thermally conductive pad 360a, an insulating sheet 380a, a first engaging portion 390a, a third engaging portion 395a, and a third engaging hole 3951a. The only difference between the heat-conducting module 300a of this embodiment and the heat-conducting module 300 of the first embodiment is that the heat-conducting module 300a of this embodiment also includes a hollow portion 325a. Specifically, the hollow portion 325a is located on the side of the second plate 320a away from the first plate 310a.

[0066] In this embodiment, the hollow portion 325a can be rectangular, but the present invention is not limited thereto. In other embodiments, the hollow portion 325a can be a regular geometric shape, such as a circle or a square. The area of ​​the hollow portion 325a accounts for 20% to 30% of the area of ​​the second plate 320a. As a result, compared to the weight of the heat-conducting module 300 in the first embodiment (212.78 grams), the weight of the heat-conducting module 300a in this embodiment is only 150.3 grams, a reduction of approximately 30%.

[0067] In this embodiment, the design of the hollow portion 325a included in the heat-conducting module 300a reduces the area of ​​thermal coupling between the second plate 320a and the hard disk body (not shown). However, experimental tests show that the heat conduction effect of the heat-conducting module 300a is not affected regardless of whether it includes the hollow portion 325a. Specifically, under the same test conditions such as the cold plate, the inlet temperature of the coolant, and the ambient temperature, the heat conduction performance of the hard disk modules using the heat-conducting module 300 and the heat-conducting module 300a were tested. In both heat conduction performance tests, the temperature of the hard disk body measured by the sensor was 48°C. In this way, without affecting the heat conduction performance and structural strength of the heat-conducting module 300a, the weight of the heat-conducting module 300a can be reduced by about 20% to 30% by means of the hollow portion 325a, thereby achieving the effect of reducing transportation, material, and processing costs.

[0068] Please see Figure 7 and Figure 8 . Figure 7 This is a perspective view of a hard disk module according to a third embodiment of the present invention. Figure 8 for Figure 7 An exploded view of the heat-conducting module and the hard drive. The hard drive module 10b according to the third embodiment of the present invention is similar to the hard drive module 10 according to the first embodiment. Specifically, the components of the hard drive module 10b of this embodiment that are similar to the hard drive module 10 of the first embodiment include: hard drive bracket 100b, connecting plate 110b, two assembly plates 120b, handle 130b, pivot 131b, fourth engaging part 150b, accommodating space Sb, hard drive 200b, hard drive body 210b, hard drive electrical connector 220b, hard drive gold finger 230b, first plate 310b, second plate 320b, first thermal pad 340b, second thermal pad 350b, third thermal pad 360b, insulating sheet 380b, third engaging part 395b and third engaging hole 3951b. The only difference between the hard disk module 10b in this embodiment and the hard disk module 10 in the first embodiment is that the heat conduction module 300b in this embodiment also includes a third plate 330b and a fourth heat conduction pad 370b.

[0069] In detail, the third plate 330b is connected to the first plate 310b. The hard disk body 210b is located between the second plate 320b and the third plate 330b. The third plate 330b is thermally coupled to the hard disk body 210b. The connection between the third plate 330b and the first plate 310b has a cutout 335b, corresponding to the hard disk electrical connector 220b, for electrical connection between the hard disk electrical connector 220b and other electronic components (not shown) in the server. The first plate 310b, the second plate 320b, and the third plate 330b may, for example, be an integrally formed U-shaped plate, but the present invention is not limited thereto. The material of the third plate 330b and the coating applied thereto can be referred to the description of the second plate 320 in the foregoing embodiments, and will not be repeated here.

[0070] The thermally conductive module 300b may further include a fourth thermally conductive pad 370b. The opposite sides of the fourth thermally conductive pad 370b are thermally coupled to the third plate 330b and the hard disk body 210b, respectively. The thermal conductivity and material of the fourth thermally conductive pad 370b can be found in the descriptions of the first thermally conductive pad 340, the second thermally conductive pad 350, and the third thermally conductive pad 360 in the foregoing embodiments, and will not be repeated here.

[0071] In this way, the heat conduction module 300b can form another heat conduction path through the third plate 330b and the fourth heat conduction pad 370b, thereby increasing the contact area between the heat conduction module 300b and the hard disk body 210b, and further improving the heat conduction performance of the hard disk module 10b.

[0072] In this embodiment, the heat-conducting module 300b may further include a first engaging portion (not shown). The first engaging portion may be, for example, but not limited to, an engaging protrusion protruding from the first plate body 310b toward the connecting plate 110b. The hard disk tray 100b may further include a second engaging portion (not shown). The second engaging portion may be located on the side of the assembly plate 120b near the first plate body 310b. The second engaging portion may be, for example, but not limited to, an engaging recess formed by bending inward from the side of the assembly plate 120b near the first plate body 310b. The first engaging portion and the second engaging portion may be a matching concave-convex structure. The first engaging portion and the second engaging portion engage to assemble the heat-conducting module 300b with the hard disk tray 100b.

[0073] Please see Figure 9 . Figure 9 This is a partial schematic diagram of a server according to a fourth embodiment of the present invention. In this embodiment, the server 1 includes a chassis (not shown), a hard disk module 10, and a cold plate 20. For ease of explanation, the hard disk module 10 described in the first embodiment is used as an example here.

[0074] In detail, the chassis includes a base plate (not shown). A cold plate 20 is disposed on the base plate. The hard disk module 10 is disposed on the side of the cold plate 20 away from the base plate. In other words, the hard disk module 10 is disposed on top of the cold plate 20. The first plate 310 of the heat dissipation module 300 is thermally coupled to the cold plate 20 through a second thermal pad 350.

[0075] In this embodiment, the heat generated during the operation of the hard disk drive 210 can be sequentially conducted from the first thermal pad 340 to the first plate 310 along direction A, then from the first plate 310 to the second thermal pad 350 along direction B, and then to the cold plate 20. The heat is then transferred to the external environment via coolant flowing through the internal channels of the cold plate 20. Alternatively, the heat generated during the operation of the hard disk drive 210 can also be sequentially conducted from the third thermal pad 360 to the second plate 320 along direction C, then from the second plate 320 to the first plate 310 along direction D, and then sequentially from the first plate 310 to the second thermal pad 350 along directions E and B, and then to the cold plate 20. The heat is then transferred to the external environment via coolant flowing through the internal channels of the cold plate 20. However, the direction of heat conduction during the operation of the hard disk drive 210 is not limited to these directions.

[0076] In other embodiments, the heat-conducting module may also be the heat-conducting module 300a described in the second embodiment (e.g., Figure 5 and Figure 6 (as shown) or the heat-conducting module 300b described in the third embodiment (e.g. Figure 7 and Figure 8 (as shown), but the present invention is not limited thereto.

[0077] According to the hard disk module and server of the above embodiments, the multi-plate structure design of the heat-conducting module ensures that at least two sides of the hard disk body have reliable heat conduction paths. Combined with thermal pads with a thermal conductivity of 6 to 10 W / mK, the contact thermal resistance between the heat-conducting plate and the hard disk body, as well as the contact thermal resistance between the heat-conducting module and the cold plate, can be effectively reduced. In this way, the heat generated by the hard disk during high-speed operation can be quickly and stably conducted to the cold plate, thereby effectively improving the heat dissipation performance of the hard disk module and enhancing the stability and lifespan of the server.

[0078] Furthermore, the snap-fit ​​design allows the heat dissipation module to be quickly and securely snapped into the hard drive tray without the use of screws or other fasteners. This not only improves the convenience for operators when installing, removing, and maintaining the hard drive module, but also reduces the number of parts and manufacturing costs of the hard drive module.

[0079] Furthermore, by utilizing the cutout design in the second plate, the weight of the heat dissipation module can be reduced by approximately 20% to 30% without affecting its thermal conductivity. This not only reduces the material and processing costs required to manufacture the plate but also lightens the overall weight of the server, thereby reducing transportation costs and improving energy efficiency.

[0080] Furthermore, the insulating sheet positioned between the board and the hard drive electrical connector, along with the selectively applied insulating and thermally conductive coating to the board surface, effectively prevents short circuits between the metal heat-conducting plate and the hard drive circuitry, and avoids interference between adjacent hard drive modules. As a result, in addition to improved thermal conductivity of the hard drive modules, the server also exhibits excellent stability and long-term reliability.

[0081] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0082] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A hard disk module, characterized in that, include: Hard drive tray, with storage space; A hard disk includes a hard disk body and a hard disk electrical connector, wherein the hard disk body is installed in the accommodating space and the hard disk electrical connector is connected to the hard disk body; as well as The heat-conducting module includes a first plate and a second plate, the first plate being connected to the second plate, the first plate and the second plate being thermally coupled to opposite sides of the hard disk body, and the first plate and the hard disk electrical connector being located on the same side of the hard disk body.

2. The hard disk module according to claim 1, characterized in that: The hard drive bracket also includes a connecting plate and two mounting plates. The two sides of the connecting plate are respectively connected to the two mounting plates, and the connecting plate and the two mounting plates together surround the accommodating space.

3. The hard disk module according to claim 1, characterized in that: The heat-conducting module further includes a first heat-conducting pad, a second heat-conducting pad, and a third heat-conducting pad. The first heat-conducting pad and the second heat-conducting pad are respectively thermally coupled to opposite sides of the first plate body. The first heat-conducting pad is thermally coupled to one side of the hard disk body, and the opposite sides of the third heat-conducting pad are respectively thermally coupled to the other side of the second plate body and the hard disk body.

4. The hard disk module according to claim 3, characterized in that: The hard drive also includes hard drive gold fingers, which are located on the same side of the hard drive body as the hard drive electrical connector. The heat conduction module also includes an insulating sheet, which is used to electrically insulate the first board body from the hard drive gold fingers. The insulating sheet is disposed on the side of the first board body facing the hard drive body, and the insulating sheet is farther away from the second board body than the first thermal pad.

5. The hard disk module according to claim 1, characterized in that: The heat-conducting module also includes a hollowed-out portion, which is located on the side of the second plate away from the first plate.

6. The hard disk module according to claim 3, characterized in that: The heat conduction module further includes a third plate, which is connected to the first plate. The hard disk body is located between the second plate and the third plate, and the third plate is thermally coupled to the hard disk body.

7. The hard disk module according to claim 6, characterized in that: The heat-conducting module also includes a fourth heat-conducting pad, and the opposite sides of the fourth heat-conducting pad are thermally coupled to the third plate and the hard disk body, respectively.

8. The hard disk module according to claim 7, characterized in that: The thermal conductivity of the first thermal pad, the second thermal pad, the third thermal pad, and the fourth thermal pad all fall between 6 and 10 W / (m·Kelvin).

9. The hard disk module according to claim 2, characterized in that: The heat-conducting module further includes a first engaging portion and at least one third engaging portion. The first engaging portion protrudes from the first plate body, and at least one of the third engaging portions protrudes from the second plate body. The third engaging portion is located between the hard disk body and one of the two sets of mounting plates. The hard disk tray further includes a second engaging portion and at least one fourth engaging portion. The second engaging portion is located on the side of one of the two sets of mounting plates closer to the first plate body, and at least one of the fourth engaging portions protrudes from one of the two sets of mounting plates. The first engaging portion engages with the second engaging portion, and the third engaging portion engages with the fourth engaging portion, so that the heat-conducting module and the hard disk tray can be assembled.

10. A server, characterized in that, include: The casing, including the base plate; A cold plate is disposed on the base plate; A hard disk module, disposed on the side of the cold plate away from the base plate, includes: Hard drive tray, with storage space; A hard disk includes a hard disk body and a hard disk electrical connector, wherein the hard disk body is installed in the accommodating space, and the hard disk electrical connector is connected to the hard disk body; and The heat-conducting module includes a first plate and a second plate. The first plate is connected to the second plate. The first plate and the second plate are thermally coupled to opposite sides of the hard disk body. The first plate and the hard disk electrical connector are located on the same side of the hard disk body. The first plate is thermally coupled to the cold plate and conducts the heat generated by the hard disk body to the cold plate.

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