Laminating method and mounter

Abstract

The invention discloses a pasting method and a pasting machine. The laminating method comprises the following steps that the conveying device unrolls and conveys a material belt loaded with a main part; the two feeding devices are used for unwinding and conveying a carrier tape loaded with sub-components; the main part on the material belt reaches a first station; the other main part on the material belt reaches a second station; the attaching device grabs the sub-part on the carrier tape conveyed by one of the feeding devices and attaches the sub-part to the main part on the first station; and the other laminating device grabs the sub-piece on the carrier tape conveyed by the other feeding device and laminates the sub-piece to the main piece on the second station. Wherein one attaching device picks up the sub-parts on one material receiving platform, moves the sub-parts to the position above the main part of the first station and then attaches the sub-parts to the main part of the first station, and the other attaching device picks up the sub-parts on the other material receiving platform, moves the sub-parts to the position above the main part of the second station and attaches the sub-parts to the main part of the second station. By means of the arrangement, the attaching efficiency can be improved, and therefore the production efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of assembly technology, and in particular to a mounting machine. Background Technology

[0002] In precision manufacturing fields such as consumer electronics, semiconductors, display panels, and medical devices, high-precision bonding of workpieces is one of the core processes, widely used in scenarios such as bonding touch screens to LCD screens, bonding optical adhesives to glass covers, and bonding flexible circuit boards to motherboards. These processes have stringent requirements for bonding accuracy, stability, and efficiency, directly determining product yield and performance.

[0003] In existing technologies, bonding processes mostly employ single-arm, single-head mounting machines. The workflow involves a robotic arm driving a pick-up head to pick up a sub-component, moving it above the main component, aligning it, and then pressing and bonding it. The limited cycle time of a single robotic arm severely restricts overall production efficiency, making it difficult to meet the industry's demands for large-scale, high-speed production, thus becoming a core bottleneck for capacity improvement. Summary of the Invention

[0004] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a bonding method that can simultaneously bond two sets of main components and sub-components, thereby improving production efficiency.

[0005] This application also proposes a mounting machine having the above-described bonding method.

[0006] The bonding method according to the first aspect of this application includes the following steps:

[0007] The conveyor unwinds and conveys the strip carrying the main component; Two feeding devices unwind and convey the carrier tape carrying the sub-components; The main component on the conveyor belt arrives at the first station; another main component on the conveyor belt arrives at the second station. The bonding device picks up a sub-component from the carrier belt conveyed by one of the feeding devices and bonds it to the main component at the first station; the other bonding device picks up a sub-component from the carrier belt conveyed by another feeding device and bonds it to the main component at the second station.

[0008] The bonding method according to the first aspect of this application has at least the following advantages: A conveyor belt carrying a main component sequentially passes through a first station and a second station. A feeding device unwinds a carrier belt carrying sub-components. A bonding device corresponds one-to-one with the feeding device; one bonding device picks up a sub-component from one of the receiving platforms and moves it above the main component at the first station, then bonds the sub-component to the main component at the first station; another bonding device picks up a sub-component from another receiving platform and moves it above the main component at the second station, then bonds the sub-component to the main component at the second station. This arrangement improves bonding efficiency, thereby increasing production efficiency.

[0009] According to some embodiments of this application, the feeding device includes a feeding roller, a stripping platform, a receiving platform, and a take-up roller. The stripping platform is disposed beside the receiving platform. The feeding roller is used to unwind a carrier belt carrying a sub-component around the stripping platform and near the receiving platform. The take-up roller is used to rewind the carrier belt around the stripping platform to peel the sub-component from the carrier belt to the receiving platform. The bonding device picks up the sub-component from the stripping platform.

[0010] According to some embodiments of this application, the following steps are also included: The first vision device acquires the first position information and the first posture information of the sub-component on the stripping platform; The bonding device grasps the sub-component on the stripping platform according to the first position information and the first posture information; The bonding device adjusts the posture of the grasped sub-part to make the sub-part reach a preset posture.

[0011] According to some embodiments of this application, the following steps are also included: The second vision device acquires the second posture information of the main component at the first workstation / second workstation; The adjustment value is obtained by comparing the first attitude information and the second attitude information; The bonding device adjusts the posture of the sub-component according to the adjustment value.

[0012] According to some embodiments of this application, the bonding device includes a lifting module, a first translation module, a second translation module, a rotating module, and a picking head. The lifting module, the first translation module, the second translation module, and the rotating module are respectively driven and connected to the picking head, and are used to drive the picking head to lift and lower in the height direction, translate in the first direction, translate in the second direction, and rotate, respectively. The picking head is used to pick up and place sub-components.

[0013] According to some embodiments of this application, two of the bonding devices simultaneously bond the sub-component to the main component.

[0014] According to some embodiments of this application, the conveying device further includes a material pulling assembly disposed on the conveying path of the material belt. The material pulling assembly includes a material pulling frame, a material pulling roller, a passive roller, a material pulling driver, and a clamping driver. The material pulling roller and the passive roller are rotatably disposed on the material pulling frame, and the material belt passes between the material pulling roller and the passive roller. The material pulling driver drives and connects to the material pulling roller to drive the material pulling roller to rotate. The clamping driver drives and connects to the passive roller to drive the passive roller to move closer to or away from the material pulling roller.

[0015] According to some embodiments of this application, the following steps are also included: Two second vision devices respectively acquire the second position information of the main component at the first workstation and the second workstation; The offset is obtained by comparing the second position information of the two second vision devices; The belt alignment device adjusts the conveying direction of the belt according to the offset.

[0016] According to the second aspect of the present application, the mounting machine attaches the sub-component to the main component using the bonding method of the first aspect.

[0017] The mounting machine according to the second aspect of this application has at least the following beneficial effects: including all the beneficial effects of the bonding method of the first aspect of the present application, which will not be repeated here.

[0018] According to some embodiments of this application, the mounting machine includes a conveying device, a supporting device, a feeding device, and a bonding device; A conveying device includes a feeding shaft and a take-up shaft, wherein the feeding shaft is used to feed a strip carrying the main component to the take-up shaft; A support device is disposed between the feeding shaft and the receiving shaft to support the material belt. The support device has a first station and a second station along the conveying direction of the conveying device. The feeding device includes a feeding roller, a stripping platform, a receiving platform, and a take-up roller. The stripping platform is located beside the receiving platform. The feeding roller is used to unwind a carrier belt carrying a component, which passes around the stripping platform and is close to the receiving platform. The take-up roller is used to rewind the carrier belt that has passed around the stripping platform, thereby stripping the component from the carrier belt to the receiving platform. Two feeding devices are provided. There are two bonding devices, one of which is located between one of the receiving platforms and the first station, and the other of which is located between the other receiving platform and the second station.

[0019] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0020] The present application will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a schematic diagram of the structure of the mounting machine according to the second aspect of this application; Figure 2 This is a schematic diagram of the mounting machine according to the second aspect of this application from another direction; Figure 3 This is a top view of the mounting machine according to the second aspect of this application; Figure 4 for Figure 2 Schematic diagram of the central feeding device; Figure 5 for Figure 4 Enlarged view of point A in the middle; Figure 6 for Figure 1 Schematic diagram of the structure of the medium-lift material assembly; Figure 7 for Figure 1 A schematic diagram of the structure of the medium-lift material assembly from another direction.

[0021] Figure label: Conveying device 10; feeding shaft 11; receiving shaft 12; pulling assembly 13; pulling frame 131; pulling roller 132; passive roller 133; pulling driver 134; clamping driver 135; swinging component 136; mounting end 136a; force-bearing end 136b; elastic component 137; Support device 20; support platform 21; first station 211; second station 212; limit block 22; Feeding device 30; Discharge roller 31; Stripping platform 32; Receiving platform 33; Receiving roller 34; Limiting assembly 35; Limiting platform 351; Limiting frame 352; Limiting plate 353; Limiting driver 354; Limiting sensor 355; Bonding device 40; lifting module 41; first translation module 42; second translation module 43; rotating module 44; material pick-up head 45; First visual device 50; Second visual device 60. Detailed Implementation

[0022] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0023] In the description of this application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0024] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0025] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0026] In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0027] Reference Figures 1 to 3 , Figure 1 This is a schematic diagram of the mounting machine according to an embodiment of this application; Figure 2 This is a schematic diagram of the mounting machine from another direction according to an embodiment of this application; Figure 3 This is a top view of a mounting machine according to an embodiment of this application; the bonding method according to a first aspect embodiment of this application includes the following steps: The conveyor 10 unwinds and conveys the strip carrying the main component; Two feeding devices 30 unwind and convey the carrier belt carrying the sub-components; The main component on the conveyor belt arrives at the first station 211; another main component on the conveyor belt arrives at the second station 212. The bonding device 40 picks up a sub-part from the carrier belt conveyed by one of the feeding devices 30 and bonds it to the main part at the first station 211; the other bonding device 40 picks up a sub-part from the carrier belt conveyed by the other feeding device 30 and bonds it to the main part at the second station 212.

[0028] Understandably, the conveyor belt carrying the main component passes sequentially through the first station 211 and the second station 212. The feeding device 30 unwinds the carrier belt carrying the sub-components. The bonding device 40 corresponds one-to-one with the feeding device 30. One bonding device 40 picks up the sub-component from one of the receiving platforms 33 and moves it above the main component at the first station 211, then bonds the sub-component to the main component at the first station 211. The other bonding device 40 picks up the sub-component from the other receiving platform 33 and moves it above the main component at the second station 212, then bonds the sub-component to the main component at the second station 212. This arrangement improves bonding efficiency, thereby increasing production efficiency.

[0029] Reference Figure 4 , Figure 4 for Figure 2 A schematic diagram of the structure of the feeding device 30; Regarding the specific structure of the feeding device 30, according to some embodiments of this application, the feeding device 30 includes a feeding roller 31, a stripping platform 32, a receiving platform 33, and a take-up roller 34. The stripping platform 32 is disposed beside the receiving platform 33. The feeding roller 31 is used to unwind the carrier belt carrying the sub-component around the stripping platform 32 and close to one end of the receiving platform 33. The take-up roller 34 is used to wind up the carrier belt around the stripping platform 32 to peel the sub-component from the carrier belt to the receiving platform 33. The bonding device 40 picks up the sub-component from the stripping platform 32.

[0030] Understandably, the unloading roller 31 unwinds the carrier belt carrying the sub-components to the stripping platform 32, the carrier belt is wound back downwards from the end of the stripping platform 32 near the receiving platform 33, and is wound up by the take-up roller 34, so that the sub-components on the carrier belt can be peeled off the carrier belt and fall onto the receiving platform 33.

[0031] Specifically, the horizontal height of the feeding roller 31 is higher than that of the stripping platform 32, and the horizontal height of the receiving roller 34 is lower than that of the stripping platform 32. The end of the stripping platform 32 near the receiving platform 33 is pointed. This arrangement can effectively peel off the sub-components from the carrier belt.

[0032] Reference Figure 1 and Figure 3Regarding the specific structure of the conveying device 10, according to some embodiments of this application, the conveying device 10 includes a feeding shaft 11 and a receiving shaft 12. The feeding shaft 11 is used to unwind the strip carrying the main component to the receiving shaft 12. According to some embodiments of this application, it also includes a support device 20, which is disposed between the feeding shaft 11 and the receiving shaft 12 to support the strip. The support device 20 has a first station 211 and a second station 212 along the conveying direction of the conveying device 10.

[0033] Understandably, the feeding shaft 11 unwinds the strip carrying the main component to the take-up shaft 12, and the strip passes sequentially through the first station 211 and the second station 212 at the support device 20. The support device 20 provides support for the bonding process, ensuring the bonding force of the bonding device 40 and making the sub-component and the main component bond more firmly.

[0034] Reference Figure 1 and Figure 3 In order to save equipment space, according to some embodiments of this application, the feeding shaft 11, the support device 20 and the receiving shaft 12 are distributed along the first direction; the feeding roller 31, the stripping platform 32 and the receiving platform 33 are distributed along the first direction.

[0035] Understandably, this arrangement allows the conveying device 10 and the feeding device 30 to be arranged side by side, reducing the space occupied in the second direction perpendicular to the first direction, thereby saving equipment space.

[0036] Reference Figure 2 and Figure 3 In order to further save equipment space, according to some embodiments of this application, the feeding roller 31, the stripping platform 32 and the receiving platform 33 of one feeding device 30 are distributed in the forward direction along the first direction; the feeding roller 31, the stripping platform 32 and the receiving platform 33 of the other feeding device 30 are distributed in the reverse direction along the first direction; and one receiving platform 33 is located on one side of the other receiving platform 33 in the first direction.

[0037] It is understandable that the distribution length of the conveying device 10 in the first direction is longer than the distribution length of the feeding device 30. The distribution directions of the two feeding devices 30 are opposite, and the two receiving platforms 33 are adjacent. This arrangement allows the two feeding devices 30 to be arranged side by side on the same side of the feeding device 30, thereby further reducing the space occupied in the second direction and achieving the goal of further saving equipment space.

[0038] Reference Figure 3In order to facilitate the bonding device 40 to pick up and bond materials, according to some embodiments of this application, the first station 211 is located on one side of one of the receiving platforms 33 in the second direction, and the second station 212 is located on one side of the other second receiving platform 33 in the second direction, wherein the first direction is perpendicular to the second direction.

[0039] It is understandable that the two receiving platforms 33 are located on one side of the second direction of the first station 211 and the second station 212, respectively. This arrangement can reduce the moving distance of the bonding device 40, so as to facilitate material picking and bonding.

[0040] Reference Figure 1 To improve the fitting accuracy, according to some embodiments of this application, the support device 20 includes a support platform 21 and a plurality of limiting blocks 22. A first station 211 and a second station 212 are formed on the support platform 21. The plurality of limiting blocks 22 are disposed on both sides of the first station 211 and the second station 212 in a second direction, wherein the first direction is perpendicular to the second direction.

[0041] Understandably, at least two limiting blocks 22 are located on both sides of the first station 211 in the second direction. This arrangement can limit the portion of the material strip corresponding to the first station 211 in the second direction to ensure the bonding accuracy of the main component at the first station 211. At least two limiting blocks 22 are located on both sides of the second station 212 in the second direction. This arrangement can limit the portion of the material strip corresponding to the second station 212 in the second direction to ensure the bonding accuracy of the main component at the second station 212.

[0042] Specifically, the limiting block 22 is adjustablely connected to the support platform 21 in the second direction, so as to be able to accommodate material strips of different widths.

[0043] Specifically, the support platform 21 has adsorption holes corresponding to the first station 211 and the second station 212. The adsorption holes are used to connect to the negative pressure equipment. This setting can hold the material strip before the bonding device 40 bonding, so that the material strip is tightly attached to the support platform 21, which can limit the material strip and further improve the bonding accuracy.

[0044] Reference Figure 1 and Figure 3 To improve the bonding accuracy, according to some embodiments of this application, the following steps are also included: The first vision device 50 acquires the first position information and the first posture information of the sub-component on the stripping platform 32; The bonding device 40 grips the sub-component on the stripping platform 32 according to the first position information and the first posture information; The bonding device 40 adjusts the posture of the gripped sub-part to make the sub-part reach the preset posture.

[0045] It is understandable that by setting the first vision device 50 to obtain the first position information and the first posture information of the sub-component, the bonding device 40 can pick up the material according to the first position information and the first posture information, which can improve the material picking accuracy of the bonding device 40 relative to the receiving platform 33. Moreover, the bonding device 40 can adjust the posture of the sub-component according to the first posture information so that the posture of the sub-component reaches the preset posture, so that the posture of the sub-component matches that of the main component, and makes the bonding of the sub-component and the main component stable.

[0046] Reference Figure 1 and Figure 3 To improve the bonding accuracy, according to some embodiments of this application, the following steps are also included: The second vision device 60 acquires the second posture information of the main component on the first station 211 / second station 212; The adjustment value is obtained by comparing the first attitude information and the second attitude information; The bonding device 40 adjusts the posture of the sub-component according to the adjustment value.

[0047] It is understandable that the posture of the sub-component is adjusted according to the posture of the main component at the first station 211 / second station 212, so that the posture of the sub-component matches that of the main component.

[0048] Specifically, the second vision device 60 can also acquire the second position information of the main component on the first station 211 / second station 212, and the bonding device 40 bonding the sub-component to the main component according to the second position information, thereby improving the bonding accuracy.

[0049] Specifically, the adjustment values ​​include the angle difference, that is, by comparing the first posture information of the sub-component and the gradually changing second posture information, the angle difference between the two postures is calculated, and the bonding device 40 rotates the sub-component according to the angle difference.

[0050] Specifically, the mounting machine also includes two first vision devices 50 and two second vision devices 60. The two first vision devices 50 are respectively disposed above the two receiving platforms 33, and the two second vision devices 60 are respectively disposed above the first station 211 and the second station 212. The first vision devices 50 and the second vision devices 60 are electrically connected to the bonding device 40.

[0051] Reference Figure 2 Regarding the specific structure of the bonding device 40, according to some embodiments of this application, the bonding device 40 includes a lifting module 41, a first translation module 42, a second translation module 43, a rotating module 44, and a picking head 45. The lifting module 41, the first translation module 42, the second translation module 43, and the rotating module 44 are respectively driven and connected to the picking head 45, and are used to drive the picking head 45 to lift and lower in the height direction, translate in the first direction, translate in the second direction, and rotate, respectively. The picking head 45 is used to pick up and put down sub-parts.

[0052] Understandably, the lifting module 41 can drive the picking head 45 to rise and fall, thereby moving the picking head 45 closer to or further away from the receiving platform 33 and the support device 20. The first translation module 42 can drive the picking head 45 to translate along a first direction, and the second translation module 43 can drive the picking head 45 to translate along a second direction, thereby moving the picking head 45 above the sub-components on the receiving platform 33 and above the main component on the support device 20, enabling the picking head 45 to accurately pick up the sub-components and attach them to the main component. The rotation module 44 can drive the picking head 45 to rotate, thereby adjusting the sub-components picked up by the picking head 45 and rotating the sub-components to a preset posture.

[0053] Specifically, the picking head 45 picks up the sub-component by adsorption.

[0054] Reference Figure 2 and Figure 3 According to some embodiments of this application, two bonding devices 40 simultaneously bond the sub-component to the main component.

[0055] It is understandable that the two bonding devices 40 simultaneously bond the sub-components to the main components. That is, after the material strip has been transferred between the two stations, at least two main components to be bonded are moved to the first station 211 and the second station 212 respectively. The two bonding devices 40 simultaneously grab the sub-components at the two receiving platforms 33 and simultaneously bond the two sub-components to the main components at the first station 211 and the second station 212 respectively. With this setup, during the bonding process, the two bonding devices 40 can straighten the material strip, making it less likely for the material strip to deviate from its position, improving the bonding accuracy, and avoiding the material strip deviating due to single-point force on the material strip, which would affect the bonding accuracy.

[0056] Reference Figure 2 , Figure 4 and Figure 5 , Figure 5 for Figure 4 Enlarged view at point A; To facilitate material handling by the bonding device 40, according to some embodiments of this application, the feeding device 30 further includes a limiting component 35. The limiting component 35 is disposed on the conveying path of the carrier belt. The limiting component 35 includes a limiting platform 351, a limiting frame 352, a limiting plate 353, a limiting driver 354, and a limiting sensor 355. The limiting frame 352 is disposed on the limiting platform 351, the limiting driver 354 is disposed on the limiting frame 352, the limiting plate 353 is located above the limiting platform 351, and the carrier belt passes between the limiting plate 353 and the limiting platform 351. The limiting driver 354 drives the limiting plate 353 to move closer to or away from the limiting platform 351. The limiting sensor is disposed on the limiting frame 352 and is used to sense the conveying stroke of the carrier belt. The limiting sensor is electrically connected to the limiting driver 354, the feeding roller 31, and the receiving roller 34, respectively.

[0057] Understandably, the limit sensor 355 can sense the conveying stroke of the carrier belt. After the carrier belt reaches the predetermined stroke, the receiving platform 33 contains a component. Subsequently, the limit sensor sends a signal to the limit driver 354, the unwinding roller 31, and the take-up roller 34 (electrically connected). The unwinding roller 31 stops unwinding, the take-up roller 34 stops rewinding, and the limit driver 354 drives the limit plate 353 to descend. The limit plate 353 clamps the carrier belt with the limit table 351, stopping the carrier belt from being conveyed and thus stopping the stripping process. This occurs in the bonding device 40. After picking up the sub-piece from the receiving platform 33, the limit driver 354 drives the limit plate 353 to rise, the feeding roller 31 continues to feed the material, and the take-up roller 34 continues to rewind, so that the carrier belt continues to be conveyed for the next peeling. With this setting, each time the bonding device 40 picks up the material from the receiving platform 33, the receiving platform 33 has only one sub-piece, so that the bonding device 40 can pick up the material. Under the clamping action of the limit plate 353 and the limit table 351, the carrier belt will not bend, which can prevent the sub-piece from shifting relative to the carrier belt or peeling off prematurely.

[0058] Reference Figure 1 , Figure 6 and Figure 7 , Figure 6 for Figure 1 Schematic diagram of the structure of the middle-pull material assembly 13; Figure 7 for Figure 1 A schematic diagram of the structure of the material pulling assembly 13 from another direction; In order to improve the fitting accuracy, according to some embodiments of this application, the conveying device 10 further includes a material pulling assembly 13. The material pulling assembly 13 is disposed on the conveying path of the material belt. The material pulling assembly 13 includes a material pulling frame 131, a material pulling roller 132, a passive roller 133, a material pulling driver 134, and a clamping driver 135. The material pulling roller 132 and the passive roller 133 are rotatably disposed on the material pulling frame 131. The material belt passes between the material pulling roller 132 and the passive roller 133. The material pulling driver 134 drives the connected material pulling roller 132 to rotate. The clamping driver 135 drives the connected passive roller 133 to move the passive roller 133 closer to or away from the material pulling roller 132.

[0059] Understandably, when there are main components to be bonded at both the first station 211 and the second station 212 during a certain travel of the conveyor belt, the unwinding shaft 11 stops unwinding, the take-up shaft 12 stops taking up, the pulling driver 134 stops driving the pulling roller 132, and the clamping driver 135 drives the passive roller 133 to approach the pulling roller 132. The passive roller 133 clamps the conveyor belt with the pulling roller 132, stopping the conveyor belt and keeping it straight and flat. The main components are placed horizontally, which improves the bonding accuracy of the bonding device 40. After the bonding device 40 completes bonding, the clamping driver 135 drives the passive roller 133 away from the pulling roller 132, the unwinding shaft 11 continues unwinding, the pulling driver 134 drives the pulling roller 132 to rotate, and the pulling roller 132 pulls the conveyor belt to continue conveying.

[0060] According to some embodiments of this application, the conveying device 10 further includes a material pulling assembly 13, which is disposed on the conveying path of the material belt. The material pulling assembly 13 includes a material pulling frame 131, a material pulling roller 132, a passive roller 133, a material pulling driver 134, and a clamping driver 135. The material pulling roller 132 and the passive roller 133 are rotatably disposed on the material pulling frame 131, and the material belt passes between the material pulling roller 132 and the passive roller 133. The material pulling driver 134 drives the connected material pulling roller 132 to rotate, and the clamping driver 135 drives the connected passive roller 133 to move the passive roller 133 closer to or away from the material pulling roller 132.

[0061] Understandably, when the clamping driver 135 does not apply a pushing force to the force-bearing end 136b of the oscillating member 136, the elastic force of the elastic member 137 pushes the mounting end 136a of the oscillating member 136 downward, causing the passive roller 133 to abut against the pulling roller 132, thereby clamping the material strip. When the clamping driver 135 pushes the force-bearing end 136b of the oscillating member 136 downward, the middle part of the oscillating member 136 rotates relative to the pulling frame 131, the mounting end 136a of the oscillating member 136 moves upward, and the passive roller 133 moves away from the pulling roller 132, thus allowing the material strip to be conveyed normally.

[0062] Specifically, the material pulling assembly 13 also includes a limiting member, which is disposed on the material pulling frame 131 and located on the swing path of the mounting end 136a. Under the action of the elastic member 137, the mounting end 136a abuts against the limiting member to limit the swing range of the swinging member 136. The limiting member is rotatably disposed on the material pulling frame 131, and one side of the limiting member is provided with a plane, that is, the outer side of the limiting surface is non-circular. By rotating the limiting member, the abutment position between the outer side of the limiting member and the mounting end 136a can be adjusted, thereby adjusting the swing range of the swinging member 136.

[0063] Reference Figure 3 To improve the bonding accuracy, according to some embodiments of this application, the following steps are also included: Two second vision devices 60 respectively acquire the second position information of the main component on the first station 211 and the second station 212; The offset is obtained by comparing the second position information of the two second vision devices 60; The correction device adjusts the conveying direction of the belt according to the offset.

[0064] It is understandable that, since the material strip passes through the first station 211 and the second station 212 in sequence, when the material strip deviates, the second position information of the main component at the first station 211 and the sub-component at the second station 212 will be different. The two second vision devices 60 can respectively obtain the second position information of the main component at the first station 211 and the second position information of the main component at the second station 212, and calculate the offset by comparing the two second position information.

[0065] Specifically, regarding the second position information, a preset straight line along the first direction can be used as a reference to obtain the difference between the main component and the preset straight line in the second direction. The difference between the main component at the first station 211 and the main component at the second station 212 can be compared to obtain the offset.

[0066] Reference Figures 1 to 7 According to the second aspect of the present application, the mounting machine attaches the sub-component to the main component using the bonding method of the first aspect.

[0067] The mounting machine according to the second aspect of this application has at least the following beneficial effects: including all the beneficial effects of the bonding method of the first aspect of the present application, which will not be repeated here.

[0068] Reference Figures 1 to 7 Regarding the specific structure of the mounting machine, according to some embodiments of this application, the mounting machine includes a conveying device 10, a support device 20, a feeding device 30, and a bonding device 40; The conveying device 10 includes a feeding shaft 11 and a take-up shaft 12. The feeding shaft 11 is used to unload the strip carrying the main component to the take-up shaft 12. A support device 20 is disposed between the feeding shaft 11 and the take-up shaft 12 to support the strip. The support device 20 has a first station 211 and a second station 212 along the conveying direction of the conveying device 10. The feeding device 30 includes a feeding roller 31, a stripping platform 32, a receiving platform 33, and a take-up roller 34. The stripping platform 32 is disposed beside the receiving platform 33. The unloading roller 31 is used to unload the carrier belt carrying the sub-components around the stripping platform 32 and close to the receiving platform 33. The take-up roller 34 is used to take up the carrier belt around the stripping platform 32 to peel the sub-components from the carrier belt to the receiving platform 33. There are two feeding devices 30. There are two bonding devices 40. One bonding device 40 is located between one receiving platform 33 and the first station 211, and the other bonding device 40 is located between the other receiving platform 33 and the second station 212.

[0069] It is understood that the mounting machine of this application also includes the aforementioned first vision device 50, second vision device 60, material pulling assembly 13, limiting assembly 35 and other structures, which will not be described in detail here.

[0070] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

Claims

1. A bonding method, characterized in that, Includes the following steps: The conveyor unwinds and conveys the strip carrying the main component; Two feeding devices unwind and convey the carrier tape carrying the sub-components; The main component on the conveyor belt arrives at the first station; another main component on the conveyor belt arrives at the second station. The bonding device picks up a sub-component from the carrier belt conveyed by one of the feeding devices and bonds it to the main component at the first station; the other bonding device picks up a sub-component from the carrier belt conveyed by another feeding device and bonds it to the main component at the second station.

2. The bonding method according to claim 1, characterized in that, The feeding device includes a feeding roller, a stripping platform, a receiving platform, and a take-up roller. The stripping platform is located beside the receiving platform. The feeding roller is used to unwind a carrier belt carrying a sub-component around the stripping platform and near the receiving platform. The take-up roller is used to rewind the carrier belt around the stripping platform to peel the sub-component off the carrier belt to the receiving platform. The bonding device picks up the sub-component from the stripping platform.

3. The bonding method according to claim 2, characterized in that, It also includes the following steps: The first vision device acquires the first position information and the first posture information of the sub-component on the stripping platform; The bonding device grasps the sub-component on the stripping platform according to the first position information and the first posture information; The bonding device adjusts the posture of the grasped sub-part to make the sub-part reach a preset posture.

4. The bonding method according to claim 3, characterized in that, It also includes the following steps: The second vision device acquires the second posture information of the main component at the first workstation / second workstation; The adjustment value is obtained by comparing the first attitude information and the second attitude information; The bonding device adjusts the posture of the sub-component according to the adjustment value.

5. The bonding method according to claim 4, characterized in that, The bonding device includes a lifting module, a first translation module, a second translation module, a rotating module, and a picking head. The lifting module, the first translation module, the second translation module, and the rotating module are respectively connected to the picking head and drive it to lift, move, and rotate along the height direction, a first direction, a second direction, and a second direction, respectively. The picking head is used to pick up and place sub-components.

6. The bonding method according to claim 1, characterized in that, The two bonding devices simultaneously bond the sub-component to the main component.

7. The bonding method according to claim 1, characterized in that, The conveying device further includes a material pulling assembly, which is disposed on the conveying path of the material belt. The material pulling assembly includes a material pulling frame, a material pulling roller, a passive roller, a material pulling driver, and a clamping driver. The material pulling roller and the passive roller are rotatably disposed on the material pulling frame, and the material belt passes between the material pulling roller and the passive roller. The material pulling driver drives and connects to the material pulling roller to drive the material pulling roller to rotate. The clamping driver drives and connects to the passive roller to drive the passive roller to move closer to or away from the material pulling roller.

8. The bonding method according to claim 1, characterized in that, It also includes the following steps: Two second vision devices respectively acquire the second position information of the main component at the first workstation and the second workstation; The offset is obtained by comparing the second position information of the two second vision devices; The correction device adjusts the conveying direction of the belt according to the offset.

9. A placement machine, characterized in that, The sub-component is bonded to the main component using the bonding method described in any one of claims 1 to 8.

10. The placement machine according to claim 9, characterized in that, The mounting machine includes a conveying device, a supporting device, a feeding device, and a bonding device; A conveying device includes a feeding shaft and a take-up shaft, wherein the feeding shaft is used to feed a strip carrying the main component to the take-up shaft; A support device is disposed between the feeding shaft and the receiving shaft to support the material belt. The support device has a first station and a second station along the conveying direction of the conveying device. The feeding device includes a feeding roller, a stripping platform, a receiving platform, and a take-up roller. The stripping platform is located beside the receiving platform. The feeding roller is used to unwind a carrier belt carrying a component, which passes around the stripping platform and is close to the receiving platform. The take-up roller is used to rewind the carrier belt that has passed around the stripping platform, thereby stripping the component from the carrier belt to the receiving platform. Two feeding devices are provided. There are two bonding devices, one of which is located between one of the receiving platforms and the first station, and the other of which is located between the other receiving platform and the second station.

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