Electronic device

Abstract

The invention provides electronic equipment. The electronic equipment comprises a middle frame, a vapor chamber and a battery. A mounting hole is formed in the middle frame and penetrates through the middle frame in the thickness direction of the middle frame. The vapor chamber is arranged in the middle frame and covers at least part of the mounting holes. The battery is at least partially arranged in the mounting hole and arranged on the surface, facing the battery, of the vapor chamber. In the electronic equipment, the vapor chamber is used as the middle plate of the battery compartment to bear the battery, the space occupation of the middle plate of the battery compartment in the electronic equipment can be reduced, the vapor chamber can use the thickness space of the middle plate of the original battery compartment, and equivalently, the space occupation of the vapor chamber in the electronic equipment is reduced; and the light and thin design of the electronic equipment can be realized.

Description

electronic devices Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] With the continuous development of science and technology, electronic devices such as mobile phones are widely used in people's daily lives and work, and have become indispensable daily necessities. Currently, electronic devices often use heat dissipation components such as heat sinks and heat dissipation layers to dissipate heat. The presence of heat sinks and heat dissipation layers occupies a large amount of internal space in electronic devices, which is not conducive to the lightweight and thin design of electronic devices.

[0003] Summary of the Invention

[0004] The present application provides an electronic device for reducing the space occupied by heat dissipation components inside the electronic device, thereby helping to achieve a lightweight and thin design of the electronic device.

[0005] An electronic device includes a middle frame, a vapor chamber, and a battery. The middle frame is provided with a mounting hole extending through the middle frame along its thickness. The vapor chamber is disposed within the middle frame and covers at least a portion of the mounting hole. The battery is at least partially disposed within the mounting hole and on the surface of the vapor chamber facing the battery.

[0006] In the electronic device shown in this application, a heat spreader is used as the middle plate of the battery compartment to carry the battery, which can reduce the space occupied by the middle plate of the battery compartment inside the electronic device. The heat spreader can use the thickness of the original middle plate of the battery compartment, which is equivalent to reducing the space occupied by the heat spreader inside the electronic device, helping to achieve a lightweight and thin design of the electronic device. In addition, since the middle plate of the battery compartment is reduced, not only can the preparation cost of the middle plate of the battery compartment be saved, but the heat generated by the battery during operation does not need to pass through the middle plate of the battery compartment to be transferred to the heat spreader. The heat generated by the battery during operation can be quickly transferred to the heat spreader for equalization, which can achieve rapid heat dissipation of the battery and help to increase the service life of the battery.

[0007] It should be noted that the heat spreader is arranged on the middle frame, which means that the heat spreader can be arranged on one side of the middle frame, or the heat spreader can be at least partially embedded in the middle frame. In this case, the heat spreader can be at least partially located in the mounting hole.

[0008] It should be noted that the battery is arranged on the surface of the heat spreader facing the battery, which includes two situations: "direct arrangement" and "indirect arrangement". "Direct arrangement" means that the battery is directly arranged on the surface of the heat spreader facing the battery, that is, there is no other intermediate layer structure between the battery and the heat spreader. "Indirect arrangement" means that the battery is arranged on the surface of the heat spreader facing the battery through an intermediate layer structure such as an adhesive layer or a buffer layer, that is, there is an intermediate layer structure such as an adhesive layer or a buffer layer between the battery and the heat spreader.

[0009] In one embodiment, the middle frame includes a middle plate and a frame, the middle plate is provided with a mounting hole, the frame is connected to the middle plate and is arranged around the middle plate, and the heat spreader is arranged on the frame.

[0010] In the electronic device shown in the present application, the heat spreader extends to the edge position of the middle frame, and there is no need to design steps or other structures on the middle plate for assembly with the heat spreader. This can avoid the assembly position between the heat spreader and the middle plate becoming a bottleneck for thinning the thickness of the electronic device, and help to achieve a lightweight and thin design of the electronic device.

[0011] In one embodiment, the middle plate is further provided with an avoidance hole, which passes through the middle plate along the thickness direction of the middle plate and is spaced apart from the mounting hole.

[0012] The vapor chamber also covers at least a portion of the avoidance hole.

[0013] The electronic device also includes a circuit board and a heating element. The circuit board is located on the side of the middle plate facing away from the vapor chamber. The heating element is located on the side of the circuit board facing the vapor chamber, passing through the avoidance hole and contacting the vapor chamber. Heat generated by the heating element during operation is directly transferred to the vapor chamber for equalization, thereby achieving rapid heat dissipation from the heating element and helping to extend its service life.

[0014] In one embodiment, the electronic device further includes a power distribution network, which is disposed on a side of the circuit board facing away from the vapor chamber and is electrically connected to the battery.

[0015] In one embodiment, the heat spreader includes a first heat spreader, a second heat spreader, and a third heat spreader. The first heat spreader at least partially covers the mounting hole and has a first heat spreader surface facing the battery. Along the length of the heat spreader, the second heat spreader is arranged on one side of the first heat spreader and covers at least part of the avoidance hole. The second heat spreader has a second heat spreader surface facing the battery, and the second heat spreader surface is located on the side of the first heat spreader facing away from the battery. The third heat spreader is connected between the first heat spreader and the second heat spreader.

[0016] The battery is arranged on the first heat-distributing surface, and the heating element contacts the second heat-distributing surface. In this case, along the thickness direction of the electronic device, the heating element and the first heat-distributing portion at least partially overlap.

[0017] In the electronic device shown in this application, the heat spreader is designed with a step difference, and the first heat spreader at least partially reuses the thickness space of the heating device, which can reduce the space occupied by the heat spreader inside the electronic device to match the thinning demand of the electronic device and help achieve a lightweight and thin design of the electronic device.

[0018] In one embodiment, the electronic device further includes a display panel and a connecting circuit board, the display panel is arranged on the side of the heat spreader facing away from the middle plate, the connecting circuit board electrically connects the display panel and the circuit board, the connecting circuit board includes a first part and a second part, the first part is arranged between the display panel and the first heat spreader, the first part has a first surface facing away from the display panel, the second part is connected to one side of the first part and is arranged between the display panel and the second heat spreader, the second part has a second surface facing away from the display panel, and the second surface is located on the side of the first surface facing the display panel.

[0019] The first heat equalizing portion has a third heat equalizing surface disposed opposite to the first heat equalizing surface, and the second heat equalizing portion has a fourth heat equalizing surface disposed opposite to the second heat equalizing surface. The fourth heat equalizing surface is located on the side of the third heat equalizing surface facing the second portion.

[0020] In the electronic device shown in this application, the connecting circuit board of the display screen is locally thinned so that the structure of the connecting circuit board matches the step design of the heat spreader. A larger thickness space can be reserved on the side of the second part away from the display panel to arrange the internal components of the electronic device, which helps to achieve a lightweight and thin design of the electronic device.

[0021] In one embodiment, the electronic device further includes a display driver, which is disposed on the display panel or the connecting circuit board and electrically connected to the connecting circuit board. Along the thickness of the electronic device, the display driver and the vapor chamber at least partially overlap. In other words, the vapor chamber can at least partially reuse the thickness space of the display driver, reducing the space occupied by the vapor chamber within the electronic device, thereby meeting the demand for thinner electronic devices and contributing to the realization of a thinner and lighter design for the electronic device.

[0022] In one embodiment, the heat spreader is further provided with a groove, the opening of the groove is located on the surface of the heat spreader facing the display driver, and the projection of the display driver on the heat spreader is located within the groove, so as to further increase the thickness space of the heat spreader for multiplexing the display driver, reduce the space occupied by the heat spreader inside the electronic device, so as to match the thinning demand of the electronic device and help to achieve a lightweight design of the electronic device.

[0023] In one embodiment, the vapor chamber is provided with a liquid injection port, which is offset from both the battery and the circuit board along the thickness of the electronic device. In other words, the injection port avoids overlapping areas between the vapor chamber, the battery, and the circuit board, helping to reduce the space occupied by the vapor chamber within the electronic device and achieving a thinner and lighter design.

[0024] In one embodiment, the electronic device is further provided with a sealant layer, which is connected between the heat spreader and the middle frame and seals the liquid filling port to ensure the waterproof performance of the electronic device.

[0025] In one embodiment, the heat spreader includes a first cover plate, a second cover plate and an intermediate connecting layer. The first cover plate is arranged on the frame and at least partially covers the mounting hole. The second cover plate is arranged on the side of the first cover plate away from the frame and is spaced apart from the first cover plate. The intermediate connecting layer is connected between the first cover plate and the second cover plate, and is enclosed with the first cover plate and the second cover plate to form a heat spreader cavity.

[0026] The battery is arranged on a surface of the first cover plate facing away from the second cover plate.

[0027] In the electronic device shown in the present application, the first cover plate of the heat spreader is used as the middle plate of the battery compartment to carry the battery, which can reduce the space occupied by the middle plate of the battery compartment inside the electronic device. The heat spreader can occupy the space of the middle plate of the battery compartment, which is equivalent to reducing the space occupied by the heat spreader inside the electronic device, and helps to achieve a lightweight and thin design of the electronic device.

[0028] In one embodiment, the first cover plate includes a skirt, which is arranged around the heat dissipation cavity and is arranged on the frame.

[0029] The electronic device further includes a first connection layer, which is connected between the skirt and the frame to achieve assembly between the first cover plate and the frame, and further achieve assembly between the heat spreader and the middle frame.

[0030] In one embodiment, the width of the skirt is between 1.5 mm and 2.5 mm, so as to ensure that the skirt has sufficient assembly width to be assembled with the frame, thereby ensuring assembly stability between the first cover plate and the frame.

[0031] In one embodiment, the skirt includes a first sub-skirt and a second sub-skirt. The distance between the first sub-skirt and the heat dissipation cavity is smaller than the distance between the second sub-skirt and the heat dissipation cavity. In other words, the first sub-skirt may belong to the core heat dissipation area of ​​the heat spreader, and the second sub-skirt may belong to the cold area of ​​the heat spreader. The width of the first sub-skirt is smaller than the width of the second sub-skirt, which not only ensures that the core heat dissipation area of ​​the heat spreader has a larger heat dissipation area, which helps to improve the heat spreader's heat dissipation capacity, but also allows other areas of the heat spreader to have a larger assembly area with the frame, which helps to improve the assembly stability between the heat spreader and the frame.

[0032] In one embodiment, the frame is provided with a retaining groove. The first cover plate includes a buckle, which is disposed in the retaining groove and retains the buckle in the retaining groove to achieve assembly between the first cover plate and the frame, and further achieve assembly between the heat spreader and the middle frame.

[0033] In one embodiment, the frame is provided with a first fixing hole.

[0034] The first cover plate is provided with a second fixing hole, which passes through the first cover plate along the thickness direction of the first cover plate and is communicated with the first fixing hole.

[0035] The electronic device also includes a fastener, which is passed through the first fixing hole and the second fixing hole and connected to the first cover plate and the frame to achieve assembly between the first cover plate and the frame, and further achieve assembly between the heat spreader and the middle frame.

[0036] In the electronic device shown in the present application, the first connection layer, the cooperation of the clips and the retaining grooves, and the fasteners are used to realize the assembly between the first cover plate and the frame, which can improve the consistency of the movement, electrical connection and sealing of the heat spreader and the middle frame, match the rigidity requirements of the electronic device, and meet the electrical connection grounding requirements and waterproof requirements of the electronic device.

[0037] In one embodiment, the electronic device further includes a heat dissipation layer, which is disposed on a side of the heat spreader facing away from the battery. The heat dissipation layer can transfer the heat of the heat spreader to the external environment to dissipate heat for components such as the battery and heating devices.

[0038] In one embodiment, the electronic device includes a first body, a second body, and a foldable mechanism. The first body includes a middle frame, a heat sink, and a battery. The foldable mechanism is connected between the first and second bodies. In other words, the electronic device is a foldable terminal.

[0039] In the electronic device described in this application, a heat spreader is used as the middle plate of the battery compartment to carry the battery, which can reduce the space occupied by the middle plate of the battery compartment within the electronic device. The heat spreader can occupy the space of the middle plate of the battery compartment, which is equivalent to reducing the space occupied by the heat spreader within the electronic device, helping to achieve a lightweight and thin design of the electronic device. In addition, since the middle plate of the battery compartment is reduced, not only can the preparation cost of the middle plate of the battery compartment be saved, but the heat generated by the battery during operation does not need to pass through the middle plate of the battery compartment to be transferred to the heat spreader. The heat generated by the battery during operation can be quickly transferred to the heat spreader for equalization, which can achieve rapid heat dissipation of the battery and help to increase the service life of the battery. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be described below.

[0041] FIG1 is a schematic structural diagram of an electronic device in one state provided by an embodiment of the present application;

[0042] FIG2 is a schematic structural diagram of the electronic device shown in FIG1 in a second state;

[0043] FIG3 is a schematic structural diagram of the electronic device shown in FIG1 in a third state;

[0044] FIG4 is a schematic diagram of a partial structure of the electronic device shown in FIG3 cut along II in the first embodiment;

[0045] FIG5 a is a schematic diagram of a partial structure of the electronic device shown in FIG3 after being cut along II-II;

[0046] FIG5b is a simplified structural diagram of the electronic device shown in FIG5a;

[0047] FIG6 is a schematic diagram of a partial structure of the first body of the electronic device shown in FIG3 under a first embodiment;

[0048] FIG7 is a schematic diagram of the exploded structure of the first body shown in FIG6 ;

[0049] FIG8 is a schematic diagram of the exploded structure of the vapor chamber in the first body shown in FIG7 ;

[0050] FIG9 is a schematic cross-sectional view of the heat sink in the first body shown in FIG7 ;

[0051] FIG10 is a schematic diagram of a partial structure of the first body shown in FIG6 after being cut along III-III;

[0052] FIG11 is a schematic diagram of a partial structure of the first cover plate of the vapor chamber shown in FIG8 ;

[0053] FIG12 is a schematic diagram of a partial structure of the first body shown in FIG6 after being cut along IV-IV;

[0054] FIG13 is a schematic diagram of a partial structure of the first body shown in FIG6;

[0055] FIG14 is a schematic diagram of a partial structure of the first body shown in FIG6 after being cut away along VV;

[0056] FIG15 is a schematic diagram of a partial structure of the electronic device shown in FIG3 cut away along II in a second embodiment;

[0057] FIG. 16 is a schematic diagram of a partial structure of a vapor chamber of the first body of the electronic device shown in FIG. 3 under a second embodiment. DETAILED DESCRIPTION

[0058] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application.

[0059] Please refer to Figures 1 and 2. Figure 1 is a structural diagram of the electronic device 1000 provided in an embodiment of the present application in one state, Figure 2 is a structural diagram of the electronic device 1000 shown in Figure 1 in a second state, and Figure 3 is a structural diagram of the electronic device 1000 shown in Figure 1 in a third state.

[0060] The electronic device 1000 may be an electronic product such as a mobile phone, tablet computer, personal computer, multimedia player, e-book reader, laptop computer, vehicle-mounted device, or wearable device. In this embodiment, the electronic device 1000 may be a foldable terminal. That is, the electronic device 1000 is a terminal that can switch between a folded state and an unfolded state.

[0061] For ease of description, the length direction of the electronic device 1000 shown in FIG3 is defined as the X-axis direction, the length direction of the electronic device 1000 is defined as the Y-axis direction, and the thickness direction of the electronic device 1000 is defined as the Z-axis direction. The X-axis direction, the Y-axis direction, and the Z-axis direction are mutually perpendicular. For example, the extension direction of the rotation axis of the electronic device 1000 is parallel to the Y-axis direction. That is, the electronic device 1000 can be relatively unfolded or folded about the Y-axis direction.

[0062] It should be noted that the qualifiers such as parallel and perpendicular mentioned in the embodiments of the present application regarding relative positional relationships are all based on the current state of the art, rather than being absolutely strict definitions in a mathematical sense. A small amount of deviation is allowed, and both approximately parallel and approximately perpendicular are acceptable. For example, A and B are parallel, which means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0 degrees and 10 degrees. For example, A and B are perpendicular, which means that A and B are perpendicular or approximately perpendicular, and the angle between A and B can be between 80 degrees and 100 degrees.

[0063] Among them, the electronic device 1000 shown in Figure 1 is in a folded state, the size of the electronic device 1000 along the X-axis direction is small, and the electronic device 1000 is easy to carry. The electronic devices 1000 shown in Figures 2 and 3 are both in an unfolded state. For example, the unfolding angle α of the electronic device 1000 shown in Figure 2 can be 90 degrees. The unfolding angle β of the electronic device 1000 shown in Figure 3 can be 180 degrees. In other words, the electronic device 1000 shown in Figure 3 is in a flattened state. At this time, the size of the electronic device 1000 along the X-axis direction is large, and the electronic device 1000 has a large display area.

[0064] It should be noted that the angles illustrated in the embodiments of the present application are allowed to have slight deviations. For example, the deployment angle α of the electronic device 1000 shown in Figure 2 can be 90 degrees, which means that α can be 90 degrees, or approximately 90 degrees, such as 80 degrees, 85 degrees, 95 degrees, and 100 degrees. Similarly, the deployment angle β of the electronic device 1000 shown in Figure 3 can be 180 degrees, which means that β can be 180 degrees, or approximately 180 degrees, such as 170 degrees, 175 degrees, 185 degrees, and 190 degrees. The angles illustrated in the following text can be understood in the same way.

[0065] It should be understood that the electronic device 1000 shown in the embodiment of the present application is a terminal that can be folded once. In other embodiments, the electronic device 1000 can also be a terminal that can be folded multiple times (more than twice). In this case, the electronic device 1000 can include multiple parts, and two adjacent parts can be folded relatively close to each other until the electronic device 1000 is in a folded state, and the two adjacent parts can also be unfolded relatively away from each other until the electronic device 1000 is in an unfolded state.

[0066] Electronic device 1000 may include a foldable device 100 and a display screen 200, with the display screen 200 mounted on the foldable device 100. The display screen 200 may include a display surface (not shown) facing away from the foldable device 100, which is used to display information such as text, images, or videos. In this embodiment, the display screen 200 may include a first display portion 210, a second display portion 220, and a foldable portion 230, which is connected between the first display portion 210 and the second display portion 220. The foldable portion 230 is bendable about the Y-axis.

[0067] It should be noted that Figures 2 and 3 exemplarily show the dividing lines between the first display part 210, the second display part 220 and the foldable part 230 (the dotted lines shown in Figures 2 and 3). This does not indicate or imply that the first display part 210, the second display part 220 and the foldable part 230 must be divided by the dotted lines shown in the figure, and therefore cannot be understood as a limitation on the present application.

[0068] As shown in Figure 1, when electronic device 1000 is in a folded state, both foldable device 100 and display screen 200 are folded, first display portion 210 and second display portion 220 are positioned opposite each other, and foldable portion 230 is bent. In this state, the exposed area of ​​display screen 200 is relatively small, significantly reducing the risk of damage to display screen 200 and effectively protecting it.

[0069] As shown in Figure 2, when the electronic device 1000 is in the unfolded state, the foldable device 100 and the display screen 200 are both in the unfolded state, the first display portion 210 and the second display portion 220 are relatively unfolded, and the foldable portion 230 is bent. At this time, the angle between the first display portion 210 and the second display portion 220 can be α.

[0070] As shown in Figure 3, when electronic device 1000 is in a flattened state, both the foldable device 100 and the display screen 200 are flattened. The first display portion 210 and the second display portion 220 are relatively flat, and the foldable portion 230 is flat without bending. In this case, the angles between the first display portion 210, the second display portion 220, and the foldable portion 230 can all be β. The display screen 200 has a large display area, enabling a large-screen display for electronic device 1000 and improving the user experience.

[0071] It should be understood that the electronic device 1000 shown in the embodiment of the present application is folded in an inward folding manner, and when the electronic device 1000 is in the folded state, the display screen 200 is located on the inner side of the foldable device 100. In other embodiments, the electronic device 1000 can also be folded in an outward folding manner, and when the electronic device 1000 is in the folded state, the display screen 200 is located on the outer side of the foldable device 100.

[0072] The foldable device 100 may include a first body 300, a second body 400, and a folding mechanism 500. The folding mechanism 500 may be connected between the first body 300 and the second body 400 to achieve a rotational connection between the first body 300 and the second body 400. Specifically, the first body 300 may support the first display portion 210, and the second body 400 may support the second display portion 220. In other words, the first display portion 210 is mounted on the first body 300, and the second display portion 220 is mounted on the second body 400. The folding mechanism 500 may be positioned opposite the foldable portion 230.

[0073] The first body 300 and the second body 400 can rotate relative to each other via the folding mechanism 500, allowing the foldable device 100 to switch between a folded state and an unfolded state. Specifically, the first body 300 and the second body 400 can rotate relative to each other until they are positioned opposite each other, so that the foldable device 100 is in the folded state, as shown in Figure 1. In this case, the folding mechanism 500 is in the folded state. The first body 300 and the second body 400 can also rotate relative to each other until they are positioned opposite each other, so that the foldable device 100 is in a semi-expanded state, as shown in Figure 2. In this case, the folding mechanism 500 is in the semi-expanded state. For example, the angle between the first body 300 and the second body 400 can be α. The first body 300 and the second body 400 can also rotate relative to each other until they are relatively flat, so that the electronic device 1000 is in the flattened state, as shown in Figure 3. For example, the angle between the first body 300 and the second body 400 can be β. In this case, the folding mechanism 500 is in the flattened state.

[0074] Please refer to Figures 4, 5a, and 5b. Figure 4 is a schematic diagram of the partial structure of the electronic device 1000 shown in Figure 3, taken along line II, under the first embodiment. Figure 5a is a schematic diagram of the partial structure of the electronic device 1000 shown in Figure 3, taken along line II-II. Figure 5b is a simplified schematic diagram of the electronic device 1000 shown in Figure 5a. "Taking "line II" refers to taking "line II" along the plane. Other similar descriptions herein shall be understood in the same manner.

[0075] The display screen 200 may include a display panel 240, a connection circuit board 250, and a display driver 260. The display panel 240 may include a first display portion 210, a second display portion 220, and a foldable portion 230. The connection circuit board 250 may be electrically connected to the display panel 240 and may be foldable relative to the display panel 240. For example, the connection circuit board 250 may be a flexible printed circuit (FPC), or a rigid-flex board.

[0076] The connection circuit board 250 may include a first portion 251 and a second portion 252. The first portion 251 and the second portion 252 may both be disposed on the side of the first display portion 210 facing the first body 300. The first portion 251 has a first surface 253 facing away from the first display portion 210. The second portion 252 is connected to a side of the first portion 251. For example, the second portion 252 may be connected to a side of the first portion 251 along the positive Y-axis. The second portion 252 has a second surface 254 facing away from the first display portion 210. The second surface 254 may be located on the side of the first surface 253 facing the first display portion 210.

[0077] For example, the surface of the second portion 252 facing the first display portion 210 may be flush with the surface of the first portion 251 facing the first display portion 210. In this case, the thickness H1 of the first portion 251 may be greater than the thickness H2 of the second portion 252. In other embodiments, the surface of the second portion 252 facing the first display portion 210 may not be flush with the surface of the first portion 251 facing the first display portion 210.

[0078] In this embodiment, the connecting circuit board 250 is partially thinned and designed to have an unequal thickness structure. The thickness of the second part 252 is less than the thickness of the first part 251. This can reduce the space occupied by the connecting circuit board 250 inside the electronic device 1000. Sufficient thickness space can be reserved on the side of the second part 252 away from the first display part 210 for arranging internal components of the electronic device 1000, which helps to achieve a lightweight and thin design of the electronic device 1000.

[0079] The display driver 260 can be disposed on the first display portion 210. Specifically, the display driver 260 can be disposed on a side of the first display portion 210 facing the first body 300 and can be electrically connected to the connection circuit board 250. The display driver 260 can be a display driver IC (DDIC). In other embodiments, the display driver 260 can also be disposed on the connection circuit board 250. This application does not impose any specific restrictions on the location of the display driver 260.

[0080] The first body 300 can support the first display portion 210. In this embodiment, the electronic device 1000 can also include a second connection layer 600. The second connection layer 600 can be disposed between the first display portion 210 and the first body 300, and can be connected between the first display portion 210 and the first body 300 to achieve assembly between the first display portion 210 and the first body 300. The second connection layer 600 can be an adhesive layer such as adhesive or foam adhesive.

[0081] The first body 300 may include a housing 310, a vapor chamber 320, a first connection layer 330, a battery 340, a third connection layer 350, a circuit board 360, a heating element 370, a power distribution network (PDN) 380, and a heat dissipation layer 390. The housing 310 may support the first display portion 210. The vapor chamber 320, the battery 340, the third connection layer 350, the circuit board 360, the heating element 370, the power distribution network 380, and the heat dissipation layer 390 may all be disposed within the housing 310.

[0082] The vapor chamber 320 can be disposed on the side of the housing 310 facing the first display portion 210, and can be located between the housing 310 and the first display portion 210, and can be spaced apart from the first display portion 210. The first connection layer 330 can be disposed between the housing 310 and the vapor chamber 320, and can be connected between the housing 310 and the vapor chamber 320 to facilitate assembly between the housing 310 and the vapor chamber 320. The first connection layer 330 is provided with a first air avoidance hole 331, which is located in the middle of the first connection layer 330 and penetrates the first connection layer 330 along the thickness direction of the first connection layer 330. In other words, the first connection layer 330 is annular in shape. The battery 340 can be disposed on the side of the housing 310 facing away from the first display portion 210, and can be located at the bottom of the first body 300, and disposed on the surface of the vapor chamber 320 facing the battery 340. The third connection layer 350 can be arranged between the heat spreader 320 and the battery 340, and can be connected between the heat spreader 320 and the battery 340 to achieve assembly between the heat spreader 320 and the battery 340. The circuit board 360 can be arranged on the side of the housing 310 away from the first display portion 210, and can be located on the top of the first body 300, and can be electrically connected to the battery 340 and the connection circuit board 250. Among them, the circuit board 360 can be the mainboard of the electronic device 1000. The heating device 370 can be arranged on the side of the circuit board 360 facing the first display portion 210, and can be electrically connected to the circuit board 360, and can be in contact with the heat spreader 320. Among them, the heating device 370 can be the central processing unit (CPU) of the electronic device 1000, for example, the heating device 370 can be a system on chip (SoC). The power distribution network 380 may be disposed on a side of the circuit board 360 facing away from the first display portion 210 and may be electrically connected to the circuit board 360 to achieve electrical connection with the battery 340 through the circuit board 360. The heat dissipation layer 390 may be disposed on a side of the vapor chamber 320 facing the first display portion 210 and may be located between the vapor chamber 320 and the first display portion 210, and may be spaced apart from the first display portion 210.

[0083] It should be noted that the directional terms such as "top" and "bottom" involved in this application are described with reference to the orientation shown in Figure 3, with the direction facing the positive direction of the Y-axis as "top" and the direction facing the negative direction of the Y-axis as "bottom". They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0084] In other embodiments, the electronic device 1000 may be a non-foldable terminal, for example, a candy bar device. In this case, the electronic device 1000 may include a main body and a display screen, the display screen being disposed within the main body. The main body may include a housing, a circuit board, a processor, a battery, a power distribution network, a heat spreader, and a heat dissipation layer, the circuit board, processor, battery, power distribution network, heat spreader, and heat dissipation layer being disposed within the housing. The basic structure of the main body, the basic structure of the display screen, and the coordination between the main body and the display screen may refer to the design of the first main body 300 and the first display portion 210 in this embodiment, and will not be further described below.

[0085] Currently, electronic devices, both foldable and non-foldable, often utilize heat dissipation components such as vapor chambers and heat sinks. However, these components occupy a significant amount of internal space within the electronic device, hindering its lightweight and thin design. In particular, since foldable devices can be folded, they often require higher stacking space utilization, making the presence of vapor chambers and heat sinks detrimental to achieving lighter and thinner designs.

[0086] Please refer to Figures 6 and 7 together. Figure 6 is a schematic diagram of the partial structure of the first body 300 in the electronic device 1000 shown in Figure 3 under the first embodiment, and Figure 7 is a schematic diagram of the exploded structure of the first body 300 shown in Figure 6. Figure 6 only shows the middle frame 311 and the vapor chamber 320 of the first body 300, while Figure 7 only shows the middle frame 311, the vapor chamber 320, and the first connection layer 330 of the first body 300.

[0087] The housing 310 may include a middle frame 311 and a back cover 312. The middle frame 311 may carry the first display portion 210. The back cover 312 and the fourth connection layer 313 may be provided on the middle frame 311. The middle frame 311 may be provided with a retaining groove 316, a mounting hole 317, an avoidance hole 318 and a first fixing hole (not shown). The opening of the retaining groove 316 may be provided on the upper surface of the middle frame 311 (not shown). The retaining groove 316 may be recessed in a direction (in the positive direction of the Z axis shown in the figure) from the upper surface to the lower surface (not shown) of the middle frame 311. There are a plurality of retaining grooves 316, and the plurality of retaining grooves 316 may be provided on the edge of the middle frame 311 and may be provided at intervals along the circumference of the middle frame 311.

[0088] It should be noted that the directional terms such as "up", "down", "left" and "right" involved in this application are described with reference to the directions shown in Figure 3, with the direction towards the positive direction of the Z axis being "up", the direction towards the negative direction of the Z axis being "down", the direction towards the negative direction of the X axis being "left", and the direction towards the positive direction of the X axis being "right". They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on this application.

[0089] Both the mounting hole 317 and the avoidance hole 318 can penetrate the middle frame 311 along the thickness direction of the middle frame 311 (Z-axis direction in the figure). Specifically, the openings of the mounting hole 317 and the avoidance hole 318 can be located on the lower surface of the middle frame 311. Both the mounting hole 317 and the avoidance hole 318 can be recessed from the lower surface of the middle frame 311 toward the upper surface (Z-axis positive direction in the figure), and can be on the upper surface of the middle frame 311. Among them, the mounting hole 317 can be located at the bottom of the middle frame 311, and the avoidance hole 318 can be located at the top of the middle frame 311, and spaced apart from the mounting hole 317. Exemplarily, the mounting hole 317 and the avoidance hole 318 can be roughly square holes.

[0090] The opening of the first fixing hole can be located on the upper surface of the middle frame 311. The first fixing hole is recessed from the upper surface toward the lower surface of the middle frame 311 and is spaced apart from the retaining groove 316. There can be multiple first fixing holes, each of which can be located on the edge of the middle frame 311 and spaced apart along the circumference of the middle frame 311. For example, the first fixing hole can be a circular hole.

[0091] In this embodiment, the middle frame 311 may include a middle plate 314 and a frame 315. The middle plate 314 may be provided with a mounting hole 317 and an escape hole 318. The frame 315 may be connected to the middle plate 314 and may be disposed around the middle plate 314. The frame 315 may be provided with a retaining groove 316 and a first fixing hole. The middle plate 314 and the frame 315 may be integrally formed. For example, the middle plate 314 may be made of an insulating material such as plastic, and the frame 315 may be made of a metal material such as aluminum.

[0092] The back cover 312 can be disposed on the lower side of the middle frame 311 and can cover the mounting hole 317 and the avoidance hole 318. Specifically, the back cover 312 can be disposed on the lower side of the frame 315. The back cover 312 can serve as the battery cover of the first body 300. For example, the back cover 312 can be removably disposed on the middle frame 311 to facilitate maintenance and replacement of components or modules within the first body 300.

[0093] In this embodiment, the housing 310 may further include a fourth connection layer 313. The fourth connection layer 313 may be disposed between the middle frame 311 and the back cover 312, and may be connected between the middle frame 311 and the back cover 312 to facilitate assembly between the middle frame 311 and the back cover 312. The fourth connection layer 313 may be an adhesive layer such as adhesive backing or foam adhesive. In other embodiments, the back cover 312 and the middle frame 311 may be integrally formed, or the back cover 312 and the middle frame 311 may be assembled to form an integrated assembly to ensure the overall strength of the housing 310.

[0094] The first display portion 210 can be disposed on the upper side of the frame 3111 in the middle frame 311. Specifically, the first display portion 210 can be disposed on the side of the frame 3111 facing away from the back cover 312. In other words, the back cover 312 and the first display portion 210 can be disposed on opposite sides of the frame 3111. When the user uses the electronic device 1000, the first display portion 210 is placed toward the user, and the back cover 312 is placed away from the user. The first display portion 210 can cover the retaining slot 316 and the first fixing hole.

[0095] Please refer to FIG8 and FIG9 together. FIG8 is an exploded structural diagram of the vapor chamber 320 in the first body 300 shown in FIG7 , and FIG9 is a cross-sectional structural diagram of the vapor chamber 320 in the first body 300 shown in FIG7 .

[0096] The heat spreader 320 can be set in the middle frame 311 and cover at least part of the mounting hole 317 and at least part of the avoidance hole 318. Specifically, the heat spreader 320 can be set in the frame 315 in the middle frame 311 and cover the mounting hole 317 and the avoidance hole 318. It should be noted that the heat spreader 320 is set in the middle frame 311, which means that the heat spreader 320 can be set on one side of the middle frame 311, or the heat spreader 320 can be at least partially embedded in the middle frame 311. In this case, at least part of the heat spreader 320 can be located in the mounting hole 317.

[0097] In this embodiment, the heat spreader 320 includes a first cover plate 321, a second cover plate 322 and an intermediate connecting layer 323. The first cover plate 321 can be set on the frame 315 in the middle frame 311 and cover the mounting hole 317 and the avoidance hole 318. The second cover plate 322 can be set on the side of the first cover plate 321 away from the middle frame 311 and can be spaced apart from the first cover plate 321. The intermediate connecting layer 323 can be set between the first cover plate 321 and the second cover plate 322, and can be connected between the first cover plate 321 and the second cover plate 322, and can be enclosed with the first cover plate 321 and the second cover plate 322 to form a heat spreader chamber 324.

[0098] In this embodiment, the first cover plate 321 can be made of a metal material with a relatively high yield modulus. It should be understood that a metal material with a relatively high yield modulus refers to a metal material with a yield modulus greater than or equal to ≥320 MPa. Metal materials with a relatively high yield modulus include but are not limited to stainless steel or titanium alloys. The first cover plate 321 can be formed using an etching process to ensure the thickness of the welded edge between the first cover plate 321 and the second cover plate 322, thereby ensuring the rigidity of the heat spreader 320. For example, the thickness of the welded edge of the first cover plate 321 can be 0.1 mm.

[0099] The first cover plate 321 may include a main body 325 and a fixing portion 326. The fixing portion 326 may be connected to the outside of the main body 325 and may be disposed around the main body 325. The main body 325 and the fixing portion 326 may be integrally formed. Specifically, the main body 325 may cover the mounting hole 317 and the avoidance hole 318, and the fixing portion 326 may be disposed on the frame 315 of the middle frame 311.

[0100] The main body 325 may include a first lower cover 3251, a second lower cover 3252, and a third lower cover 3253. The first lower cover 3251 may be located at the bottom of the main body 325, may cover the mounting hole 317, and may be spaced apart from and opposite to the first portion 251 of the connection circuit board 250. The second lower cover 3252 may be located above the first lower cover 3251 and spaced apart from the first lower cover 3251. The second lower cover 3252 may be located at the top of the main body 325 and may cover the avoidance hole 318. The third lower cover 3253 may be connected between the first lower cover 3251 and the second lower cover 3252. The third lower cover 3253 and the second lower cover 3252 may be spaced apart from and opposite to the second portion 252 of the connection circuit board 250. Exemplarily, the third lower cover 3253 may be in the shape of a flat plate and inclined relative to the first lower cover 3251 and the second lower cover 3252 .

[0101] In this embodiment, the first cover plate 321 is designed to be a step-difference structure, and the second lower cover body 3252 and the third lower cover body 3253 are moved upward relative to the first lower cover body 3251, which helps the heat spreader 320 to reuse the height space between the first lower cover body 3251 and the first display part 210, and enough height space can be reserved on the lower side of the second lower cover body 3252 and the third lower cover body 3253 for assembling the internal components of the electronic device 1000, thereby helping to achieve a lightweight design of the electronic device 1000.

[0102] Please refer to FIG. 10 , which is a schematic diagram of a partial structure of the first body 300 shown in FIG. 6 after being cut along line III-III.

[0103] The fixing portion 326 may include a skirt 3261, a bent edge 3262 and a buckle 3263. The skirt 3261 may be arranged on the outside of the main body 325, and may be spaced apart from the main body 325, and may be arranged around the heat-sinking chamber 324. Specifically, the skirt 3261 may be arranged on the frame 315. Among them, the first connecting layer 330 may be arranged between the skirt 3261 and the frame 315, and may be connected between the skirt 3261 and the frame 315 to realize the assembly between the first cover plate 321 and the frame 315, and then realize the assembly between the heat-sinking plate 320 and the middle frame 311. Exemplarily, the first connecting layer 330 may be an adhesive layer such as adhesive or foam adhesive.

[0104] Please also refer to FIG. 11 , which is a schematic diagram of a partial structure of the vapor chamber 320 shown in FIG. 8 .

[0105] Exemplarily, the width of the skirt 3261 can be greater than or equal to 1.5 mm and less than or equal to 2.5 mm to ensure that the skirt 3261 has sufficient assembly width to achieve assembly with the frame 315, thereby ensuring assembly stability between the first cover plate 321 and the frame 315 and meeting the bonding width and sealing requirements between the heat sink 320 and the middle frame 311. The skirt 3261 can include a first sub-skirt 3264, a second sub-skirt 3265, and a third sub-skirt 3266. The first sub-skirt 3264, the second sub-skirt 3265, and the third sub-skirt 3266 can be spaced around the heat sink chamber 324. Specifically, the distance between the first sub-skirt 3264 and the soaking chamber 324 is a first distance D1, the distance between the second sub-skirt 3265 and the soaking chamber 324 is a second distance D2, and the distance between the third sub-skirt 3266 and the soaking chamber 324 is a third distance D3. The first distance D1 may be smaller than the second distance D2 and the third distance D3. In other words, the first sub-skirt 3264 may belong to the core heat dissipation area of ​​the soaking chamber 320, while the second sub-skirt 3265 and the third sub-skirt 3266 may belong to the cold zone of the soaking chamber 320. The width W1 of the first sub-skirt 3264 can be smaller than the width W1 of the second sub-skirt 3265 and the width W3 of the third sub-skirt 3266. This not only ensures that the core heat dissipation zone of the vapor chamber 320 has a larger heat dissipation area, thereby improving the heat dissipation capability of the vapor chamber 320, but also ensures that the cold zone of the vapor chamber 320 has sufficient assembly width for assembly with the frame 315, thereby ensuring the assembly reliability between the vapor chamber 320 and the frame 315. In other embodiments, the skirt 3261 may not include the third sub-skirt 3266, or the skirt 3261 may include a fourth sub-skirt. This application does not impose any specific limitation on the number of sub-skirts that the skirt 3261 may include.

[0106] In addition, the skirt 3261 may be provided with a second fixing hole 3267, which may extend through the skirt 3261 along its thickness direction (Z-axis direction in the figure). Specifically, the second fixing hole 3267 may be located outside the first connection layer 330 and spaced apart from the first connection layer 330. There may be multiple second fixing holes 3267, spaced apart around the main body 325. Each second fixing hole 3267 communicates with a first fixing hole in the middle frame 311.

[0107] Please refer to FIG. 10 and FIG. 12 . FIG. 12 is a schematic diagram of a partial structure of the first body 300 shown in FIG. 6 after being cut along IV-IV.

[0108] The first main body 300 may also include a plurality of fasteners 410, each fastener 410 is passed through a second fixing hole 3267 and a first fixing hole 319, and is connected to the skirt 3261 and the middle frame 311 to achieve assembly between the first cover plate 321 and the middle frame 311, and further achieve assembly between the heat spreader 320 and the middle frame 311.

[0109] The bent edge 3262 can be connected between the main body 325 and the skirt 3261 to adapt to the edge structure of the middle frame 311 and prevent interference between the first cover plate 321 and the middle frame 311. The clip 3263 can be connected to the side of the skirt 3261 facing away from the bent edge 3262. There can be multiple clips 3263, and the multiple clips 3263 can be spaced apart. Each clip 3263 can be installed in a retaining groove 316 of the middle frame 311 and retain the retaining groove 316.

[0110] In this embodiment, the first cover plate 321 of the heat spreader 320 is designed with a bent edge 3262 to achieve assembly with the middle frame 311. The connection between the first cover plate 321 and the middle frame 311 is achieved by utilizing the cooperation between the fastener 410 and the first fixing hole 319 and the second fixing hole 3267, the cooperation between the retaining groove 316 and the buckle 3263, and the cooperation between the first connection layer 330, the skirt 3261, and the middle frame 311. This improves the movement, electrical connection, and sealing consistency between the middle frame 311 and the first cover plate 321, and can match the rigidity requirements of the electronic device 1000, meet the electrical connection and grounding requirements of the electronic device 1000, and meet the waterproof requirements of the electronic device 1000. In some other embodiments, the first cover plate 321 and the middle frame 311 can also be assembled by welding, and this application does not impose specific restrictions on this.

[0111] Referring to Figures 5a, 5b, and 8, the second cover plate 322 can be disposed on the upper side of the main body 325 and can be spaced apart from the main body 325 along the thickness direction of the first body 300 (the Z-axis direction in the figure). It can also be spaced apart from the display driver 260 along the width direction of the first body 300 (the X-axis direction in the figure). Specifically, the projection of the second cover plate 322 on the main body 325 is located within the main body 325 and is spaced apart from the circumference of the main body 325. The second cover plate 322 can be located in the core heat dissipation area of ​​the vapor chamber 320. The distance between the projection of the second cover plate 322 on the main body 325 and the first sub-skirt 3264 is a first distance, the distance between the projection of the second cover plate 322 on the main body 325 and the second sub-skirt 3265 is a second distance, and the distance between the projection of the second cover plate 322 on the main body 325 and the third sub-skirt 3266 is a third distance. The first distance can be smaller than both the second and third distances.

[0112] In this embodiment, the second cover plate 322 can be made of a metal material with a relatively high yield modulus. It should be understood that a metal material with a relatively high yield modulus refers to a metal material with a yield modulus greater than or equal to ≥320 MPa. Metal materials with a relatively high yield modulus include, but are not limited to, stainless steel or titanium alloys. The second cover plate 322 can be formed using an etching process to ensure the thickness of the welded edge between the second cover plate 322 and the first cover plate 321, thereby ensuring the rigidity of the heat spreader 320. For example, the thickness of the welded edge of the second cover plate 322 can be 0.23 mm or 0.33 mm.

[0113] The second cover 322 includes a first upper cover 3221, a second upper cover 3222, and a third upper cover 3223. The first upper cover 3221 can be positioned between the first lower cover 3251 and the first portion 251 of the connection circuit board 250, and can be spaced apart from and opposite to both the first lower cover 3251 and the connection circuit board 250. The first upper cover 3221 can be located at the bottom of the second cover 322. The second upper cover 3222 can be positioned above the first upper cover 3221, spaced apart from the first upper cover 3221, and spaced apart from and opposite to the second lower cover 3252. The second upper cover 3222 can be located on top of the second cover 322. The third upper cover 3223 is connected between the first upper cover 3221 and the second upper cover 3222, and can be spaced apart from and opposite to the third lower cover 3253. The third upper cover 3223 and the second upper cover 3222 may be spaced apart from and disposed opposite to the second portion 252 of the connection circuit board 250. For example, the third upper cover 3223 may be in the shape of a flat plate and tilted relative to the first upper cover 3221 and the second upper cover 3222.

[0114] In this embodiment, the second cover plate 322 is designed to be a step-difference structure, and the second upper cover body 3222 and the third upper cover body 3223 are moved upward relative to the first upper cover body 3221, which helps the heat spreader 320 to reuse the height space between the first upper cover body 3221 and the first display part 210, and enough height space can be reserved on the lower side of the second upper cover body 3222 and the third upper cover body 3223 for assembling the internal components of the electronic device 1000, thereby helping to achieve a lightweight design of the electronic device 1000.

[0115] In this embodiment, the intermediate connecting layer 323 may be a welding layer made of solder. Specifically, the intermediate connecting layer 323 is provided with a second air avoidance hole 3231, which is provided in the middle of the intermediate connecting layer 323 and penetrates the intermediate connecting layer 323 along the thickness direction of the intermediate connecting layer 323. In other words, the intermediate connecting layer 323 is annular. The intermediate connecting layer 323 includes a first connecting layer portion (not shown), a second connecting layer portion (not shown) and a third connecting layer portion (not shown). The first connecting layer portion can be provided between the first upper cover 3221 and the first upper cover 3221, and can be connected between the first upper cover 3221 and the first upper cover 3221, and enclosed with the first upper cover 3221 and the first upper cover 3221 to form a first heat-averaging chamber 3241. The second connecting layer is located between and connected to the second upper cover 3222 and the second upper cover 3222, and together with the second upper cover 3222 and the second upper cover 3222, forms a second heat-averaging chamber 3242. The third connecting layer is located between and connected to the third upper cover 3223 and the third upper cover 3223, and together with the third upper cover 3223 and the third upper cover 3223, forms a third heat-averaging chamber 3243. The third heat-averaging chamber 3243 communicates with the first heat-averaging chamber 3241 and the second heat-averaging chamber 3242.

[0116] In this embodiment, the heat spreader 320 includes a first heat spreader 320a, a second heat spreader 320b, and a third heat spreader 320c. The first heat spreader 320a can be arranged between the first part 251 and the middle plate 314, and can cover at least part of the mounting hole 317. The first heat spreader 320a can have a first heat spreader surface 321a and a third heat spreader surface 322a. The first heat spreader surface 321a can be the surface of the first heat spreader 320a facing the battery 340. Along the thickness direction of the first heat spreader 320a, the third heat spreader surface 322a and the first heat spreader surface 321a can be arranged opposite to each other. That is, the third heat spreader surface 322a can be the surface of the first heat spreader 320a facing the first part 251. Among them, the first heat spreader 320a includes a first lower cover 3251, a first upper cover 3221, and a first connecting layer portion, and a first heat spreader cavity 3241 is provided in the first heat spreader 320a.

[0117] Along the length of the heat spreader 320, the second heat spreader 320b can be disposed on one side of the first heat spreader 320a, and can be spaced apart from the first heat spreader 320a, and can cover at least a portion of the avoidance hole 318. Specifically, the second heat spreader 320b can be disposed between the second portion 252 and the middle plate 314. The second heat spreader 320b can have a second heat spreader surface 321b and a fourth heat spreader surface 322b. The second heat spreader surface 321b can be the surface of the second heat spreader 320b facing the battery 340. The second heat spreader surface 321b can be located on the side of the first heat spreader surface 321a facing away from the battery 340. Along the thickness direction of the second heat spreader 320b, the fourth heat spreader surface 322b can be disposed opposite the second heat spreader surface 321b. That is, the fourth heat spreader surface 322b can be the surface of the second heat spreader 320b facing the second portion 252. The fourth heat-distributing surface 322b can be located on the side of the third heat-distributing surface 322a facing the display panel 240. In other words, the second heat-distributing portion 320b is positioned upward relative to the first heat-distributing portion 320a. The second heat-distributing portion 320b includes a second lower cover 3252, a second upper cover 3222, and a second connecting layer. A second heat-distributing cavity 3242 is defined within the second heat-distributing portion 320b.

[0118] Along the length of the heat spreader 320, the third heat spreader 320c is connected between the first heat spreader 320a and the second heat spreader 320b, and can be disposed between the second portion 252 and the middle frame 311. The third heat spreader 320c includes a third lower cover 3253, a third upper cover 3223, and a third connecting layer. A third heat spreader cavity 3243 is disposed within the third heat spreader 320c. For example, the third heat spreader 320c can be planar and inclined relative to the first heat spreader 320a and the second heat spreader 320b.

[0119] In the electronic device 1000 shown in the present application, the heat spreader 320 is designed with a step difference, and the second heat spreader part 320b is moved upward relative to the first heat spreader part 320a, so that the structure of the heat spreader 320 matches the structure of the connecting circuit board 250. A larger thickness space can be reserved on the side of the second heat spreader part 320b away from the second part 252 to arrange the internal components of the electronic device 1000, which helps to achieve a lightweight and thin design of the electronic device.

[0120] 9 , the heat soaking chamber 324 includes an upper heat soaking wall 3244 and a lower heat soaking wall 3245. The upper heat soaking wall 3244 and the lower heat soaking wall 3245 are spaced apart and disposed opposite each other along the thickness direction (Z-axis direction in the figure) of the heat soaking chamber 324. For example, the thickness of the upper heat soaking wall 3244 may be 0.05 mm, and the thickness of the lower heat soaking wall 3245 may be 0.08 mm.

[0121] The heat spreader 320 may include a support column 327 and a capillary structure 328. There may be multiple support columns 327, and the multiple support columns 327 may be arranged in the heat spreader chamber 324, and may be supported between the heat spreader upper wall 3244 and the heat spreader lower wall 3245, and may be spaced apart from each other to ensure the structural stability of the heat spreader chamber 324. Among them, the support column 327 may be integrally formed with the second cover plate 322. Exemplarily, the height of the support column 327 may be 0.14 mm. The capillary structure 328 may be arranged in the heat spreader chamber 324, and may be arranged on the heat spreader lower wall 3245. Exemplarily, the thickness of the capillary structure 328 may be 0.06 mm.

[0122] Please refer to Figures 4, 5a and 5b. The battery 340 is at least partially arranged in the mounting hole 317, and can be arranged on the surface of the heat spreader 320 facing the battery 340. It should be noted that the battery 340 is arranged on the surface of the heat spreader 320 facing the battery 340, including two situations of "direct arrangement" and "indirect arrangement". "Direct arrangement" means that the battery 340 is directly arranged on the surface of the heat spreader 320 facing the battery 340, and is in direct contact with the heat spreader 320, that is, there is no other intermediate layer structure between the battery 340 and the heat spreader 320. "Indirect arrangement" means that the battery 340 can be arranged on the surface of the heat spreader 320 facing the battery 340 through an intermediate layer structure such as an adhesive layer or a buffer layer, and is in spaced contact with the heat spreader 320, that is, there is an intermediate layer structure such as an adhesive layer or a buffer layer between the battery 340 and the heat spreader 320.

[0123] Specifically, the battery 340 can be completely accommodated in the mounting hole 317 and can be arranged on the surface of the first cover plate 321 facing away from the second cover plate 322. Among them, the battery 340 can be arranged on the first heat-distributing surface 321a. In this embodiment, the projection of the battery 340 on the first cover plate 321 can be located within the main body 325 of the first cover plate 321. Among them, the main body 325 of the first cover plate 321 can support the battery 340. The third connecting layer 350 can be arranged between the battery 340 and the first cover plate 321, and connected between the battery 340 and the first cover plate 321 to achieve assembly between the battery 340 and the first cover plate 321. Exemplarily, the third connecting layer 350 can be an adhesive layer such as adhesive or foam adhesive.

[0124] In the electronic device 1000 shown in this embodiment, the first cover plate 321 of the heat spreader 320 is used as the middle plate of the battery compartment to support the battery 340. This not only saves the cost of the middle plate of the battery compartment, but also reduces the space occupied by the middle plate of the battery compartment within the electronic device 1000. The heat spreader 320 can use the thickness of the original middle plate of the battery compartment, which is equivalent to reducing the space occupied by the heat spreader 320 within the electronic device 1000, improving the space utilization rate within the electronic device 1000, and helping to achieve a lightweight design of the electronic device 1000. Moreover, since the middle plate of the battery compartment is reduced, the heat generated by the battery 340 during operation does not need to pass through the middle plate of the battery compartment to be transferred to the heat spreader 320. The heat generated by the battery 340 during operation can be directly transferred to the heat spreader 320 through the third connecting layer 350, which can achieve rapid heat dissipation of the battery 340, help to increase the service life of the battery 340, and thus improve the reliability of the electronic device 1000.

[0125] Moreover, the first cover plate 321 of the heat spreader 320 is designed with a fixing portion 326 that extends directly to the frame 315. The fixing portion 326 can be directly assembled with the frame 315, and there is no need to design steps or other structures on the middle plate 314 for assembly with the heat spreader 320. This can save the space occupied by the middle plate 314 inside the electronic device 1000, avoid the assembly position between the heat spreader 320 and the middle plate 314 from becoming a bottleneck position for thinning the thickness of the electronic device 1000, and help to achieve a lightweight design of the electronic device 1000.

[0126] The circuit board 360 can be arranged on the side of the middle frame 311 facing away from the heat spreader 320, and can at least partially cover the avoidance hole 318, and can be spaced apart from and arranged opposite to the second lower cover 3252 of the first cover 321 and the back cover 312. The heating device 370 can be arranged on the side of the circuit board 360 facing the first cover 321 of the heat spreader 320, and can be passed through the avoidance hole 318, and can contact the second heat spreader surface 321b of the second heat spreader 320b in the heat spreader 320. In the thickness direction of the first body 300, the heating device 370 at least partially overlaps with the first heat spreader 320a. That is, along the direction from the second heat spreader 320b to the first heat spreader 320a, the projection of the heating device 370 on the heat spreader 320 at least partially overlaps with the first heat spreader 320a. In other words, the first heat spreader 320a at least partially reuses the thickness space of the heating element 370, which can reduce the space occupied by the heat spreader 320 inside the electronic device 1000 to match the thinning demand of the electronic device 1000 and help achieve a lightweight design of the electronic device 1000.

[0127] The power distribution network 380 can be disposed on the side of the circuit board 360 facing away from the vapor chamber 320 and can be spaced apart from the back cover 312. A heat dissipation layer 390 can be disposed on the side of the vapor chamber 320 facing away from the battery 340, covering at least a portion of the surface of the first cover plate 321 facing the first display portion 210 and at least a portion of the surface of the second cover plate 322 facing away from the first cover plate 321. The heat dissipation layer 390 can transfer heat from the vapor chamber 320 to the external environment, dissipating heat from components such as the battery 340 and the heat generating device 370, thereby ensuring the reliability of the electronic device 1000. The heat dissipation layer 390 can be a graphite layer or a graphene layer.

[0128] When the heating device 370 shown in this embodiment is working, the heat generated by the heating device 370 can be first transferred to the heat spreader 320. After the heat spreader 320 evens out the heat, part of the heat can be transferred to the display screen 200 through the heat dissipation layer 390 and the space between the heat dissipation layer 390 and the display screen 200, and then transferred to the external environment through the display screen 200. Another part of the heat can be transferred to the middle plate 314 through the heat spreader 320, and then transferred to the frame 315 and the display screen 200 through the middle plate 314, and finally transferred to the external environment through the frame 315 and the display screen 200, thereby realizing heat dissipation of the heating device 370.

[0129] In this embodiment, the first cover plate 321 and the second cover plate 322 of the heat spreader 320 are designed to be a step structure, and the first part 251 and the second part 252 of the connecting circuit board 250 are designed to be structures of unequal thickness, so that the circuit board 360, the heating device 370 and the power distribution network 380 can be moved upward as a whole to at least partially reuse the space between the first lower cover body 3251 and the second part 252 of the connecting circuit board 250, which helps to achieve a lightweight design of the electronic device 1000.

[0130] Please refer to Figures 7, 13 and 14. Figure 13 is a schematic diagram of the partial structure of the first body 300 shown in Figure 6. Figure 14 is a schematic diagram of the partial structure of the first body 300 shown in Figure 6 after being cut along VV.

[0131] In addition, the vapor chamber 320 may be provided with a liquid injection port 3201. The liquid injection port 3201 may be located at the edge of the vapor chamber 320, offset from the battery 340 and the circuit board 360, and communicate with the vapor chamber 324. The liquid injection port 3201 may be spaced apart from the projections of the battery 340 and the circuit board 360 on the vapor chamber 320. In other words, the liquid injection port 3201 is offset from the core heat dissipation area of ​​the vapor chamber 320.

[0132] In this embodiment, the liquid injection port 3201 of the heat spreader 320 is designed at a position offset from the battery 340 and the circuit board 360. The liquid injection port 3201 can avoid the stacking area of ​​the heat spreader 320, the battery 340 and the circuit board 360, which helps to reduce the space occupied by the heat spreader 320 inside the electronic device 1000 and helps to achieve a lightweight and thin design of the electronic device 1000.

[0133] In addition, the electronic device 1000 may further include a sealant layer 420. The sealant layer 420 may be disposed between the vapor chamber 320 and the middle frame 311, and may be connected between the vapor chamber 320 and the middle frame 311. The sealant layer 420 may also seal the liquid injection port 3201, thereby preventing the coolant in the vapor chamber 324 from flowing out of the liquid injection port 3201, thereby ensuring the heat dissipation capability of the vapor chamber 320, and ensuring that the waterproof performance of the electronic device 1000 meets the requirements. For example, the sealant layer 420 may be integrally formed with the first connecting layer 330.

[0134] Please refer to Figures 15 and 16. Figure 15 is a schematic diagram of the partial structure of the electronic device 1000 shown in Figure 3 after being cut along II under the second embodiment. Figure 16 is a schematic diagram of the partial structure of the heat sink 320 of the first body 300 in the electronic device 1000 shown in Figure 3 under the second embodiment.

[0135] The difference between the heat spreader 320 shown in this embodiment and the heat spreader 320 shown in the first embodiment mentioned above is that the heat spreader 320 is provided with a groove 329, and the opening of the groove 329 is located on the surface of the heat spreader 320 facing the display driver 260. In this embodiment, the groove 329 is provided on the first cover plate 321, and the opening of the groove 329 is located on the upper surface of the first cover plate 321 (not shown in the figure). The groove 329 is recessed in the direction (negative direction of the Z axis in the figure) from the upper surface of the first cover plate 321 toward the lower surface (not shown). Specifically, the groove 329 can be provided on the main body 325 of the first cover plate 321, and can be spaced apart from the second cover plate 322, and corresponding to the display driver 260. At this time, the projection of the display driver 260 on the heat spreader 320 is located in the groove 329. Among them, the thickness of the groove 329 can be between 0.04mm and 0.1mm, and the area of ​​the groove 329 can be between 200mm 2 Up to 400mm 2 For example, the groove 329 may be formed by a stamping process, and a convex bump may be formed on the side of the first cover plate 321 facing away from the second cover plate 322 while the groove 329 is being formed.

[0136] In this embodiment, a groove 329 is designed in the first cover plate 321 to avoid the display driver 260, thereby improving the spatial reuse rate of components between the first display portion 210 and the heat spreader 320, which helps to achieve a lightweight design of the electronic device 1000.

[0137] In the electronic device 1000 shown in the present application, the first cover plate 321 of the heat spreader 320 is used as the middle plate of the battery compartment to carry the battery 340, eliminating the middle plate of the battery compartment. This not only saves the production cost of the middle plate of the battery compartment, but also saves the space occupied by the middle plate of the battery compartment inside the electronic device 1000, which helps to achieve a lightweight design of the electronic device 1000. Moreover, the fixing portion 326 of the first cover plate 321 of the heat spreader 320 can be fixedly assembled with the frame of the middle frame 311 to meet the rigidity, waterproof and electrical connection requirements of the electronic device 1000. In addition, the left side of the heat spreader 320 can be used as an effective heat dissipation area of ​​the heat spreader 320, and other electronic components of the electronic device 1000 can be arranged on the right side of the heat spreader 320, ensuring the maximum space utilization inside the electronic device 1000, which helps to achieve a lightweight design of the electronic device 1000.

[0138] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. An electronic device, characterized in that, The invention comprises a middle frame, a heat spreader and a battery, wherein the middle frame is provided with a mounting hole, and the mounting hole penetrates the middle frame along the thickness direction of the middle frame, the heat spreader is arranged in the middle frame and covers at least part of the mounting hole, and the battery is at least partly arranged in the mounting hole and arranged on the surface of the heat spreader facing the battery.

2. The electronic device according to claim 1, characterized in that, The middle frame includes a middle plate and a frame, the middle plate is provided with the mounting hole, the frame is connected to the middle plate and arranged around the middle plate, and the heat spreader is arranged on the frame.

3. The electronic device according to claim 2, wherein The middle plate is also provided with an avoidance hole, which penetrates the middle plate along the thickness direction of the middle plate and is spaced apart from the mounting hole; The heat spreader also covers at least a portion of the avoidance hole; The electronic device also includes a circuit board and a heating device. The circuit board is arranged on a side of the middle plate away from the heat spreader, and the heating device is arranged on a side of the circuit board facing the heat spreader, and is passed through the avoidance hole and in contact with the heat spreader.

4. The electronic device according to claim 3, characterized in that, The heat spreader includes a first heat spreader, a second heat spreader, and a third heat spreader, wherein the first heat spreader covers at least a portion of the mounting hole, the first heat spreader has a first heat spreader surface facing the battery, along the length direction of the heat spreader, the second heat spreader is disposed on one side of the first heat spreader and covers at least a portion of the avoidance hole, the second heat spreader has a second heat spreader surface facing the battery, the second heat spreader surface is located on a side of the first heat spreader surface away from the battery, and the third heat spreader is connected between the first heat spreader and the second heat spreader; The battery is arranged on the first heat-distributing surface, and the heating device is in contact with the second heat-distributing surface.

5. The electronic device according to claim 4, wherein The electronic device further comprises a display panel and a connection circuit board, wherein the display panel is arranged on a side of the heat spreader away from the middle plate, the connection circuit board electrically connects the display panel and the circuit board, and the connection circuit board comprises a first part and a second part, wherein the first part is arranged between the display panel and the first heat spreader, the first part has a first surface away from the display panel, the second part is connected to a side of the first part and is arranged between the display panel and the second heat spreader, the second part has a second surface away from the display panel, and the second surface is located on a side of the first surface facing the display panel; The first heat equalizing portion has a third heat equalizing surface disposed opposite to the first heat equalizing surface, and the second heat equalizing portion has a fourth heat equalizing surface disposed opposite to the first heat equalizing surface, and the fourth heat equalizing surface is located on a side of the third heat equalizing surface facing the second portion.

6. The electronic device according to claim 5, wherein The electronic device further includes a display driver, which is disposed on the display panel or the connecting circuit board and is electrically connected to the connecting circuit board. Along the thickness direction of the electronic device, the display driver at least partially overlaps with the heat spreader.

7. The electronic device according to claim 6, wherein The vapor chamber is provided with a groove, the opening of the groove is located on the surface of the vapor chamber facing the display driver, and the projection of the display driver on the vapor chamber is located in the groove.

8. The electronic device according to any one of claims 3 to 7, characterized in that The vapor chamber is provided with a liquid injection port, and along the thickness direction of the electronic device, the liquid injection port is staggered with the battery and the circuit board.

9. The electronic device according to claim 8, wherein The electronic device is further provided with a sealing glue layer, which is connected between the heat spreader and the middle frame and seals the liquid injection port.

10. The electronic device according to any one of claims 1 to 9, characterized in that, The heat soaking plate includes a first cover plate, a second cover plate and an intermediate connecting layer, wherein the first cover plate is arranged on the frame and at least partially covers the mounting hole, the second cover plate is arranged on a side of the first cover plate away from the frame, and the intermediate connecting layer is connected between the first cover plate and the second cover plate, and encloses the first cover plate and the second cover plate to form a heat soaking chamber; The battery is arranged on a surface of the first cover plate facing away from the second cover plate.

11. The electronic device according to claim 10, wherein The first cover plate includes a skirt, which is arranged around the heat dissipation cavity and is arranged on the frame; The electronic device further comprises a first connection layer connected between the skirt and the frame.

12. The electronic device according to claim 11, wherein The skirt includes a first sub-skirt and a second sub-skirt, the distance between the first sub-skirt and the heat-averaging chamber is smaller than the distance between the second sub-skirt and the heat-averaging chamber, and the width of the first sub-skirt is smaller than the width of the second sub-skirt.

13. The electronic device according to any one of claims 10 to 12, characterized in that, The frame is provided with a clamping groove; The first cover plate includes a buckle, and the buckle is arranged in the clamping groove and is clamped with the clamping groove.

14. The electronic device according to any one of claims 10 to 13, characterized in that, The frame is provided with a first fixing hole; The first cover plate is provided with a second fixing hole, the second fixing hole penetrates the first cover plate along the thickness direction of the first cover plate and is communicated with the first fixing hole; The electronic device further includes a fastener, which is inserted through the first fixing hole and the second fixing hole and connected to the first cover plate and the frame.

15. The electronic device according to any one of claims 1 to 14, characterized in that, The electronic device further comprises a heat dissipation layer, and the heat dissipation layer is arranged on a side of the heat spreader away from the battery.

16. The electronic device according to any one of claims 1 to 15, characterized in that, The electronic device comprises a first body, a second body and a foldable mechanism, the first body comprises the middle frame, the heat spreader and the battery, and the foldable mechanism is connected between the first body and the second body.

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