Composite insulation shielding method and system based on electronic auxiliary material and adhesive material

Abstract

The invention relates to the field of insulating materials, and discloses a composite insulation shielding method and system based on an electronic auxiliary material and an adhesive material, and the method comprises the steps: carrying out the compounding and matching of an electronic auxiliary material base material and an adhesive material raw material, and obtaining a qualified base material and a compliant adhesive material; extracting microstructure features from the qualified base material, and measuring a withstand voltage threshold value corresponding to the microstructure features to generate a base material insulation reference corresponding to the qualified base material; carrying out viscosity gradient test on the compliant sizing material to obtain a test viscosity curve, and calculating a temperature sensitivity coefficient corresponding to the test viscosity curve; generating a basic composite mode corresponding to the composite insulation shielding of the qualified base material and the compliant rubber material, extracting composite process elements corresponding to the basic composite mode, and analyzing the composite compatibility between the composite process elements; and carrying out composite processing treatment on the qualified base material and the compliant rubber material to obtain the composite material. According to the invention, the reliability of composite insulation shielding based on the electronic auxiliary material and the adhesive material can be improved.

Description

Technical Field

[0001] This invention relates to a composite insulation and shielding method and system based on electronic accessories and adhesive materials, belonging to the field of insulation materials. Background Technology

[0002] In the fields of electronic equipment manufacturing and new energy, the composite insulating shielding structure formed by electronic auxiliary material substrates and adhesive materials is a key component to ensure the insulation safety of electronic components and resist electromagnetic interference. Its insulation withstand voltage value and interface bonding strength are the core indicators for measuring shielding performance. Therefore, the regulation of these two is the core link in the design and preparation of composite insulating shielding structures.

[0003] Existing composite insulation shielding fabrication methods often employ single-material performance testing or empirical process proportioning. For example, insulation capacity is assessed solely by evaluating the macroscopic insulation resistance of the substrate, or coating parameters are determined based on the room-temperature viscosity of the adhesive. However, this approach cannot address the coupling relationship between the substrate's microstructure and the adhesive's rheological properties. In actual production, factors such as ambient temperature fluctuations and differences in substrate surface conditions can lead to deviations between theoretical design and actual composite effects, thereby reducing the reliability of the composite insulation shielding structure. Summary of the Invention

[0004] This invention provides a composite insulation shielding method and system based on electronic accessories and adhesive materials, the main purpose of which is to improve the reliability of composite insulation shielding based on electronic accessories and adhesive materials.

[0005] To achieve the above objectives, the present invention provides a composite insulation and shielding method based on electronic auxiliary materials and adhesive materials, comprising: Obtain the electronic auxiliary material substrate and adhesive material raw material to be processed, and perform a compounding treatment on the electronic auxiliary material substrate and the adhesive material raw material to obtain qualified substrate and compliant adhesive. The substrate insulation factor corresponding to the qualified substrate is detected, and the microstructure features are extracted from the qualified substrate in combination with the preset insulation performance parameter standard. The withstand voltage threshold corresponding to the microstructure features is measured to generate the substrate insulation benchmark corresponding to the qualified substrate. The compliant adhesive was subjected to a viscosity gradient test to obtain a test viscosity curve, and the temperature sensitivity coefficient corresponding to the test viscosity curve was calculated. Combining the substrate insulation reference and the temperature sensitivity coefficient, a basic composite pattern is generated between the qualified substrate and the compliant adhesive regarding composite insulation and shielding. The composite process elements corresponding to the basic composite pattern are extracted, and the composite compatibility between the composite process elements is analyzed. Based on the composite compatibility and the basic composite mode, a composite processing procedure is performed between the qualified substrate and the compliant adhesive to obtain a composite material.

[0006] Optionally, the step of compounding the electronic auxiliary material substrate and the adhesive material raw material to obtain a qualified substrate and a compliant adhesive includes: The electronic auxiliary material substrate to be processed is pretreated to obtain a pretreated substrate; The basic properties of the adhesive material raw materials are verified to obtain the verified adhesive compound; The pretreated substrate and the verified adhesive are initially compounded to obtain a preliminary composite sample. The initial composite sample was subjected to compatibility testing, and a performance test report was obtained. Based on the performance test report, the electronic auxiliary material substrate and the adhesive material raw material are compounded and matched to obtain qualified substrate and compliant adhesive.

[0007] Optionally, the step of initially laminating the pretreated substrate with the verified adhesive to obtain a preliminary composite sample includes: Determine the coating area and coating amount of the pretreated substrate; Based on the coating area and the coating amount, the verified adhesive is coated onto the surface of the pretreated substrate to obtain a coated substrate; The adhesive-coated substrate is subjected to preliminary curing treatment to obtain a semi-cured composite substrate; The semi-cured composite substrate is pressed together to obtain a preliminary composite substrate; The initial composite substrate is subjected to deviation correction processing to obtain a compliant initial composite substrate; The compliant initial composite substrate is cut to obtain an initial composite sample.

[0008] Optionally, the step of extracting microstructural features from the qualified substrate by combining the preset insulation performance parameter standard and the substrate insulation factor includes: The preset insulation performance parameter standards are analyzed in a structured manner to obtain an insulation performance hierarchy system; The insulation factor of the substrate is quantified to obtain a numerical sequence of insulation factors; Identify the key performance nodes in the insulation performance hierarchy and analyze the coupling degree between the insulation factor numerical sequence and the key performance nodes; Based on the coupling degree, the core performance nodes corresponding to the substrate insulation factor are selected from the key performance nodes; Based on the core performance nodes, the performance association path information corresponding to the substrate insulation factor is extracted from the insulation performance hierarchy system; The intrinsic material information of the qualified substrate is extracted, and the intrinsic material information and the performance correlation path information are subjected to feature fusion processing to obtain the microstructure features.

[0009] Optionally, calculating the temperature sensitivity coefficient corresponding to the test viscosity curve includes: Feature points are extracted from the tested viscosity curve to obtain a set of feature points; Based on the set of feature points, analyze the rheological transformation characteristics corresponding to the test viscosity curve; Based on the rheological transformation characteristics, the test viscosity curve is divided into regions to obtain linear and nonlinear regions; Count the number of data points corresponding to the linear region and the nonlinear region to obtain the number of linear points and the number of nonlinear points; The temperature sensitivity coefficient corresponding to the test viscosity curve is calculated by combining the linear points, the rheological transformation characteristics, and the nonlinear points.

[0010] Optionally, by combining the linear point count, the rheological transformation characteristics, and the nonlinear point count, the temperature sensitivity coefficient corresponding to the test viscosity curve is calculated, including: Based on the rheological transformation characteristics, the viscosity change rate corresponding to each temperature range in the test viscosity curve is calculated; Calculate the average value corresponding to the viscosity change rate to obtain the mean change rate; By combining the number of linear points and the number of nonlinear points, the regional stability index corresponding to the test viscosity curve is calculated; Based on the aforementioned regional stability index, the regional equilibrium coefficient corresponding to the test viscosity curve is set. Combining the regional equilibrium coefficient, the viscosity change rate, the average change rate, the number of linear points, and the number of nonlinear points, the temperature sensitivity coefficient corresponding to the test viscosity curve is calculated using the following formula: ; Where B represents the temperature sensitivity coefficient corresponding to the measured viscosity curve. Represents the regional balance coefficient. This represents the rate of viscosity change corresponding to the j-th temperature range of the viscosity test curve. denoted as the mean rate of change, j represents the sequence number of the temperature range of the viscosity curve, m represents the number of linear points, n represents the number of nonlinear points, and tanh(.) is the hyperbolic tangent function.

[0011] Optionally, calculating the viscosity change rate corresponding to each temperature range in the test viscosity curve based on the rheological transformation characteristics includes: Temperature-viscosity correlation construction is performed on the rheological transformation characteristics to obtain a temperature-viscosity correlation diagram; The temperature-viscosity correlation graph is smoothed to obtain a smoothed correlation curve; The derivative of the smoothed correlation curve is calculated to obtain the rate of change curve; The rate of change curve is normalized to obtain the standard rate of change; Analyze the distribution characteristics of the standard rate of change and calculate the confidence level corresponding to the distribution characteristics; Based on the confidence level and the standard rate of change, the viscosity change rate corresponding to each temperature range in the test viscosity curve is calculated.

[0012] Optionally, the analysis of the composite compatibility between the composite process elements includes: Calculate the process compatibility between the composite process elements and determine the process influence value corresponding to the composite process elements; Based on the process compatibility and the process influence value, calculate the composite coupling degree between the composite process elements; Based on the composite coupling degree, the composite compatibility among the composite process elements is analyzed.

[0013] Optionally, calculating the process compatibility between the composite process elements includes: Key attributes are extracted from the composite process elements to obtain an attribute set; Based on the set of attribute elements, construct the adaptation analysis dimensions among the composite process elements; Based on the aforementioned adaptation analysis dimensions, the dimension adaptation scores of the composite process elements are determined. Based on the dimensional adaptation score, the process compatibility between the composite process elements is calculated.

[0014] To address the above problems, the present invention also provides a composite insulation and shielding system based on electronic auxiliary materials and adhesive materials, the system comprising: The substrate and adhesive matching module is used to acquire the electronic auxiliary material substrate and adhesive material raw material to be processed, and to perform a matching process on the electronic auxiliary material substrate and the adhesive material raw material to obtain qualified substrate and compliant adhesive. The substrate insulation reference module is used to detect the substrate insulation factor corresponding to the qualified substrate, and extract the microstructure features from the qualified substrate in combination with the preset insulation performance parameter standard, and determine the withstand voltage threshold corresponding to the microstructure features to generate the substrate insulation reference corresponding to the qualified substrate. The temperature-sensitive testing module for the rubber compound is used to perform viscosity gradient testing on the compliant rubber compound, obtain the test viscosity curve, and calculate the temperature sensitivity coefficient corresponding to the test viscosity curve. The composite compatibility analysis module is used to combine the substrate insulation reference and the temperature sensitivity coefficient to generate a basic composite pattern of the qualified substrate and the compliant adhesive with respect to composite insulation shielding, extract the composite process elements corresponding to the basic composite pattern, and analyze the composite compatibility between the composite process elements. A composite processing and molding module is used to perform composite processing between the qualified substrate and the compliant adhesive based on the composite compatibility and the basic composite mode to obtain a composite material.

[0015] Compared to the problems described in the background art, this invention, by performing a compounding process on the electronic auxiliary material substrate and adhesive material raw materials, can clarify the compatibility of the two in terms of performance and form, eliminating defects in subsequent electronic auxiliary material products caused by incompatibility between the substrate and the adhesive, and providing qualified basic materials for the mass production of electronic auxiliary materials. This invention, by detecting the substrate insulation factor corresponding to the qualified substrate, can transform the insulation performance of the material into a quantifiable and analyzable key indicator, making insulation performance evaluation more systematic and operable, facilitating a deeper understanding of the inherent laws of material insulation characteristics. Furthermore, this invention, by conducting viscosity gradient tests on compliant adhesives to obtain test viscosity curves, can systematically characterize the changes in the flow characteristics of the adhesive under different conditions, providing data support for subsequent performance analysis. Calculating the temperature sensitivity coefficient corresponding to the test viscosity curve can quantify the degree of response of the adhesive viscosity to temperature changes, thereby evaluating… To assess the environmental adaptability of the adhesive, this invention, by combining the substrate insulation benchmark and the temperature sensitivity coefficient, generates a basic composite pattern corresponding to the composite insulation shielding of the qualified substrate and the compliant adhesive. This allows for the integration of material performance characteristics with process requirements, forming a scientifically sound composite solution. By extracting the composite process elements corresponding to the basic composite pattern, key process parameters affecting the composite effect can be obtained, providing a foundation for subsequent analysis and processing of the composite compatibility between the composite process elements. Finally, based on the composite compatibility and the basic composite pattern, this invention performs composite processing on the qualified substrate and the compliant adhesive. This systematically executes the composite processing of the qualified substrate and the compliant adhesive, ensuring that the processing meets insulation shielding requirements and avoids performance defects caused by process conflicts, ultimately obtaining a composite material with both structural stability and insulation reliability. Therefore, the composite insulation shielding method and system based on electronic auxiliary materials and adhesives provided in this invention can improve the reliability of composite insulation shielding based on electronic auxiliary materials and adhesives. Attached Figure Description

[0016] Figure 1 This is a schematic flowchart of a composite insulation and shielding method based on electronic auxiliary materials and adhesive materials provided in an embodiment of the present invention; Figure 2This is a schematic diagram of the composite processing flow of a composite insulation and shielding method based on electronic auxiliary materials and adhesive materials according to an embodiment of the present invention. Figure 3 This is a schematic diagram of a module for implementing the composite insulation and shielding system based on electronic auxiliary materials and adhesive materials according to an embodiment of the present invention.

[0017] The objectives, features, and advantages of this invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0018] It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0019] This application provides a composite insulation and shielding method based on electronic auxiliary materials and adhesive materials. The executing entity of this method includes, but is not limited to, at least one electronic device that can be configured to execute the method provided in this application, such as a server or a terminal. In other words, the composite insulation and shielding method based on electronic auxiliary materials and adhesive materials can be executed by software or hardware installed on a terminal device or a server device. The server includes, but is not limited to, a single server, a server cluster, a cloud server, or a cloud server cluster.

[0020] Reference Figure 1 The diagram shown is a schematic flowchart of a composite insulation shielding method based on electronic auxiliary materials and adhesive materials according to an embodiment of the present invention. In this embodiment, the composite insulation shielding method based on electronic auxiliary materials and adhesive materials includes: S1. Obtain the electronic auxiliary material substrate and adhesive material raw material to be processed, and perform compounding treatment on the electronic auxiliary material substrate and the adhesive material raw material to obtain qualified substrate and compliant adhesive.

[0021] This invention, by performing a compounding process on the electronic auxiliary material substrate and the adhesive material raw material, can clarify the compatibility of the two in terms of performance and form, eliminate defects in the subsequent electronic auxiliary material products caused by incompatibility between the substrate and the adhesive, and provide qualified basic materials for the mass production of electronic auxiliary materials.

[0022] The electronic auxiliary material substrate to be processed refers to the basic carrier used to prepare auxiliary materials for electronic components, such as polyester film substrate, polyimide tape substrate, glass fiber cloth substrate, etc.; the adhesive material raw material refers to the adhesive raw material used to achieve bonding between electronic auxiliary material substrates or fixation of electronic auxiliary materials and components, such as acrylate adhesive raw materials, silicone adhesive raw materials, epoxy resin adhesive raw materials, etc.; the compliant adhesive refers to the adhesive material raw material that, after adaptation, matches the substrate in terms of bonding performance, environmental resistance, and other indicators and meets the application standards for electronic auxiliary materials.

[0023] As an embodiment of the present invention, the step of compounding and matching the electronic auxiliary material substrate and the adhesive material raw material to obtain a qualified substrate and a compliant adhesive includes: The electronic auxiliary material substrate to be processed is pretreated to obtain a pretreated substrate; The basic properties of the adhesive material raw materials are verified to obtain the verified adhesive compound; The pretreated substrate and the verified adhesive are initially compounded to obtain a preliminary composite sample. The initial composite sample was subjected to compatibility testing, and a performance test report was obtained. Based on the performance test report, the electronic auxiliary material substrate and the adhesive material raw material are compounded and matched to obtain qualified substrate and compliant adhesive.

[0024] The pretreated substrate refers to an electronic auxiliary material substrate that, after pretreatment, meets the initial composite requirements in terms of surface cleanliness, flatness, and physical stability. For example, the surface oil residue content is ≤0.1mg / m³. 2 The following are the specifications for the adhesive materials: 1) a polyester film substrate with a flatness deviation ≤ 0.5 mm / m; 2) the verified adhesive material refers to adhesive raw materials whose basic performance verification results meet industry-standard standards, such as acrylic adhesive raw materials with an initial viscosity of 5000-15000 mPa・s and a solid content ≥ 95%; 3) the initial composite sample refers to a small sample formed after preliminary composite for performance testing, such as a substrate-adhesive composite sheet with a size of 50 mm × 100 mm; 4) the performance test report refers to the specific data record obtained after the adaptation performance test, such as "180° peel strength is 8 N / 25 mm, and the adhesion retention rate after 85℃ / 168 h is 90%".

[0025] Furthermore, the surface cleaning treatment can be performed through a multi-step cleaning combination, such as first using compressed air (pressure 0.5MPa) to blow away floating dust from the substrate surface, then performing ultrasonic cleaning (time 15 minutes), and finally drying with hot air (temperature 60℃); the basic performance verification can be completed through conventional testing methods for the core properties of the adhesive, such as using a Brookfield cone plate consistency meter to test the consistency of the adhesive at 25℃, and using the toluene distillation method (distillation time 1.5h, condensation rate 5mL / min) to determine the content of volatile components in the adhesive to estimate the effective solid phase ratio; the preliminary lamination can be performed through standardized lamination equipment, such as using a doctor blade applicator to apply the verified adhesive to a preset thickness (e.g., 8... A μm coating is applied to the surface of the pretreated substrate, and then pressed together using a roller press (pressure 0.3MPa, speed 1m / min). The compatibility performance can be tested using mechanical and environmental testing equipment, such as using a tensile testing machine (test speed 300mm / min) to determine the peel strength, and placing the initial composite sample in a constant temperature chamber (temperature 85℃, humidity 85%RH) for damp heat resistance testing to evaluate the adhesion performance. The screening can be performed using result comparison tables, such as developing a "Qualified Substrate Judgment Table" (surface cleanliness, flatness, peel strength compatibility value) and a "Compliant Adhesive Judgment Table" (viscosity, solid content, adhesion retention rate), and checking the test data one by one to determine the final qualified substrate and compliant adhesive.

[0026] Furthermore, as another embodiment of the present invention, the preliminary lamination of the pretreated substrate with the verified adhesive to obtain a preliminary composite sample includes: Determine the coating area and coating amount of the pretreated substrate; Based on the coating area and the coating amount, the verified adhesive is coated onto the surface of the pretreated substrate to obtain a coated substrate; The adhesive-coated substrate is subjected to preliminary curing treatment to obtain a semi-cured composite substrate; The semi-cured composite substrate is pressed together to obtain a preliminary composite substrate; The initial composite substrate is subjected to deviation correction processing to obtain a compliant initial composite substrate; The compliant initial composite substrate is cut to obtain an initial composite sample.

[0027] The adhesive application area and amount are determined based on the subsequent bonding requirements between the electronic auxiliary materials and electronic components. This includes the required adhesive application range of the substrate (such as a local circuit connection area or the entire surface) and the amount of adhesive per unit area (calculated by combining the preset adhesive layer thickness and adhesive density, such as a preset adhesive layer thickness of 10μm and an adhesive density of 1.2g / cm³). 3 At that time, the amount of adhesive applied per unit area was 12g / m². 2The adhesive-coated substrate is an intermediate carrier formed by uniformly covering the surface of the pretreated substrate with the verified adhesive according to the determined coating area and amount (e.g., coating a rectangular circuit bonding area of ​​the polyimide pretreated substrate with a 10μm thick silicone material); the semi-cured composite substrate is a substrate in which the adhesive-coated substrate is heated at a low temperature for a short time (e.g., heated at 60-75℃ for 12-18 minutes) to allow the adhesive to reach a partially cured state (curing degree 30%-40%, neither flowing nor retaining tack); the initial composite substrate is a semi-cured composite substrate bonded under pressure (e.g., 0.3-0.5MPa pressure, 50-60℃ temperature for 8-1 minutes). The product is obtained by eliminating air bubbles between the adhesive layer and the substrate within 2 minutes, achieving a tight bond. The deviation correction process involves adjusting the adhesive layer by adding adhesive to thin areas and re-pressing areas with air bubbles after detecting the adhesive layer thickness (using a thickness gauge) and interface air bubbles (visual inspection + microscope) of the initial composite substrate. The compliant initial composite substrate is a qualified initial composite substrate with an adhesive layer thickness deviation ≤ ±0.5μm and no air bubbles with a diameter ≥0.3mm after deviation correction. The initial composite sample is a sample used for adapting performance testing by cutting the compliant initial composite substrate according to performance testing standards (such as 50mm×100mm or 100mm×25mm).

[0028] Furthermore, the coating area and amount of adhesive on the pre-treated substrate can be determined by combining electronic auxiliary material design drawings with CAD software (e.g., marking the circular area on the substrate that needs to be bonded to the chip in the software and calculating the amount of adhesive corresponding to that area). A scraper-type adhesive applicator (adjusting the scraper gap to match the adhesive layer thickness) can be used to apply the verified adhesive to the surface of the pre-treated substrate based on the determined coating area and amount, resulting in a coated substrate (e.g., for fiberglass cloth substrates, setting the scraper gap to 10μm ensures uniform coating). The coated substrate can be pre-cured using a constant temperature oven (temperature control accuracy ±1℃) to obtain a semi-cured composite substrate (e.g., placing the coated polyester film substrate in a 68℃ oven for 15 minutes, controlling the degree of curing to around 35%). A vacuum press (vacuum degree ≤ -0.095MPa) can be used to further cure the substrate. The semi-cured composite substrate is press-fitted to obtain a preliminary composite substrate (pressure is monitored in real time during pressing to avoid poor interfacial bonding caused by sudden pressure changes). The preliminary composite substrate can be inspected using an adhesive layer thickness gauge (accuracy 0.1μm) and a metallographic microscope (50x magnification). For thin areas of adhesive layer, a micro-application pen is used to reapply the verified adhesive, and areas with air bubbles are re-vacuum-pressed to complete the deviation correction of the preliminary composite substrate. The corrected preliminary composite substrate can be inspected piece by piece to ensure that the adhesive layer thickness and air bubble index meet the standards, resulting in a compliant preliminary composite substrate (if 10 pieces are sampled from each batch for inspection, and all meet the standards, the batch is considered a compliant preliminary composite substrate). A CNC laser cutting machine (cutting accuracy ±0.1mm) can be used to cut the compliant preliminary composite substrate to obtain a preliminary composite sample (avoiding the rough edge area of ​​the substrate during cutting to ensure that the sample edge is flat).

[0029] S2. Detect the substrate insulation factor corresponding to the qualified substrate, and extract the microstructure features from the qualified substrate in combination with the preset insulation performance parameter standard, and determine the withstand voltage threshold corresponding to the microstructure features to generate the substrate insulation benchmark corresponding to the qualified substrate.

[0030] This invention, by detecting the substrate insulation factor corresponding to the qualified substrate, can transform the insulation performance of the material into a quantifiable and analyzable key indicator, making the insulation performance evaluation more systematic and operable, and facilitating a deeper understanding of the inherent laws of the material's insulation characteristics.

[0031] The substrate insulation factor refers to key characteristic indicators reflecting the insulation performance of the substrate, such as dielectric constant, volume resistivity, and surface resistivity. The preset insulation performance parameter standard refers to the set of specified values ​​for the performance requirements of insulating materials in the industry or application scenario. For example, the power industry requires the dielectric strength of insulating boards to be no less than 20kV / mm. The microstructure characteristics refer to the structural characteristics that affect the insulation performance observed from the microscopic level of the substrate, such as the degree of order of molecular chain arrangement, grain boundary distribution, and microporous structure morphology. Optionally, the detection of the substrate insulation factor corresponding to the qualified substrate can be achieved by electrical performance testing methods, such as using a high-resistivity meter to measure the volume resistivity and surface resistivity of the material and calculating the resistivity value.

[0032] This invention extracts microstructural features from qualified substrates by combining the preset insulation performance parameter standards and the substrate insulation factor. It can perform correlation analysis between macroscopic insulation performance and microstructural morphology, and construct a structured feature representation that reflects the intrinsic causes of the material's insulation performance, thereby providing a basis for performance optimization. The microstructural features are the key microscopic morphology and structural information in the qualified substrate that determines its insulation performance, reflecting the intrinsic nature of the material's insulation properties.

[0033] As an embodiment of the present invention, the step of extracting microstructural features from the qualified substrate by combining the preset insulation performance parameter standard and the substrate insulation factor includes: The preset insulation performance parameter standards are analyzed in a structured manner to obtain an insulation performance hierarchy system; The insulation factor of the substrate is quantified to obtain a numerical sequence of insulation factors; Identify the key performance nodes in the insulation performance hierarchy and analyze the coupling degree between the insulation factor numerical sequence and the key performance nodes; Based on the coupling degree, the core performance nodes corresponding to the substrate insulation factor are selected from the key performance nodes; Based on the core performance nodes, the performance association path information corresponding to the substrate insulation factor is extracted from the insulation performance hierarchy system; The intrinsic material information of the qualified substrate is extracted, and the intrinsic material information and the performance correlation path information are subjected to feature fusion processing to obtain the microstructure features.

[0034] The insulation performance hierarchy is a hierarchical representation of the preset insulation performance parameter standards formed through structured analysis technology, such as displaying insulation performance requirements in layers according to major categories such as dielectric properties, heat resistance properties, and mechanical properties. The insulation factor numerical sequence is an ordered arrangement of the numerical values ​​of the substrate insulation factors obtained after quantification, such as arranging the dielectric constant and dielectric loss factor at different test frequencies into a sequence. The key performance nodes are important performance indicators in the insulation performance hierarchy, corresponding to specific performance requirements, such as the "breakdown voltage" node in the hierarchy. The coupling fit is a measure of the conformity between the insulation factor numerical sequence and the key performance nodes, such as determining the conformity between the measured value and the standard value through difference calculation or percentage comparison, such as the coupling fit. =1 - (|Measured value - Standard value| / Standard value); The core performance node is the node with the highest matching degree with the insulation factor of the substrate selected from the key performance nodes, such as the "volume resistivity" and "dielectric loss" nodes that have the greatest impact on the insulation performance of the material; Based on the core performance node, the performance correlation path information corresponding to the insulation factor of the substrate is extracted from the insulation performance hierarchy system, that is, the correlation and influence path of these nodes in the hierarchy system, such as the "performance influence transmission path from the 'dielectric constant' node to the 'voltage withstand threshold' node, that is, dielectric constant↑→material polarization loss↓→voltage withstand threshold↑"; The intrinsic material information is the inherent material characteristic data of the qualified substrate that affects its performance, such as molecular weight distribution, crystallinity, filler distribution, etc.

[0035] Furthermore, the preset insulation performance parameter standards can be structurally analyzed using the analytic hierarchy process (AHP) to obtain an insulation performance hierarchy system; the substrate insulation factor can be quantified using standardized measurement procedures to obtain an insulation factor numerical sequence, such as measuring and recording the dielectric constant according to international standards (e.g., IEC 60250); key performance nodes in the insulation performance hierarchy system can be identified using key index identification methods; the coupling and embedding degree between the insulation factor numerical sequence and the key performance nodes can be analyzed using similarity calculation algorithms, such as Euclidean distance or Pearson correlation coefficient calculation; based on the coupling and embedding degree, a threshold is set to filter out the core performance nodes corresponding to the substrate insulation factor from the key performance nodes; according to the core performance nodes, the performance association path information corresponding to the substrate insulation factor can be extracted from the insulation performance hierarchy system using path tracing algorithms; the intrinsic material information in the qualified substrate can be extracted using material analysis techniques (e.g., X-ray diffraction, scanning electron microscopy); and the intrinsic material information and the performance association path information can be fused using multi-source information fusion technology to obtain microstructural features.

[0036] This invention generates a substrate insulation benchmark for the qualified substrate by measuring the withstand voltage threshold corresponding to the microstructural features. This transforms the structural characteristics of the material into specific performance boundary values, providing a clear basis for material selection and quality control. The withstand voltage threshold refers to the highest voltage value that the material can withstand without breakdown under specific conditions, and the substrate insulation benchmark is a standard basis for comprehensively evaluating and classifying the insulation performance of the material.

[0037] This invention generates a substrate insulation benchmark for the qualified substrate by measuring the withstand voltage threshold corresponding to the microstructural features. This transforms the structural characteristics of the material into specific performance boundary values, providing a clear basis for material selection and quality control. The withstand voltage threshold refers to the highest voltage value that the material can withstand without breakdown under specific conditions, and the substrate insulation benchmark is a standard basis for comprehensively evaluating and classifying the insulation performance of the material.

[0038] Furthermore, the withstand voltage threshold corresponding to the microstructural characteristics can be determined by a stepwise voltage increase method, i.e., applying a gradually increasing voltage to the sample until breakdown occurs and recording the breakdown voltage value; by statistically analyzing multiple measurement results, the average withstand voltage value and standard deviation can be calculated to determine a reliable withstand voltage threshold range; based on the measured withstand voltage threshold, combined with other substrate insulation factors, a comprehensive rating method can be used to generate the substrate insulation benchmark corresponding to the qualified substrate, such as classifying materials into different grades such as Grade A (excellent insulation), Grade B (good insulation), and Grade C (qualified insulation), providing clear guidance for subsequent material selection and application.

[0039] S3. Perform a viscosity gradient test on the compliant adhesive to obtain a test viscosity curve, and calculate the temperature sensitivity coefficient corresponding to the test viscosity curve.

[0040] This invention obtains a test viscosity curve by conducting viscosity gradient tests on compliant rubber compounds. This systematically characterizes the changes in the flow characteristics of the rubber compound under different conditions, providing data support for subsequent performance analysis. Calculating the temperature sensitivity coefficient corresponding to the test viscosity curve can quantify the degree of response of the rubber compound's viscosity to temperature changes, thereby assessing the environmental adaptability of the rubber compound. The test viscosity curve is a continuous curve plotted with the test temperature as the abscissa and the rubber compound viscosity at the corresponding temperature as the ordinate. The temperature sensitivity coefficient is an index that quantifies the magnitude of the change in rubber compound viscosity caused by a unit temperature change based on the test viscosity curve.

[0041] Furthermore, the viscosity gradient of the compliant adhesive can be tested using a rotational rheometer to obtain a test viscosity curve. The rotational rheometer is a precision instrument used to measure the viscosity change of a fluid under controlled shear rate or shear stress. It has multiple built-in test modes and a temperature control system, and the test conditions can be flexibly adjusted according to the material characteristics. For example, for epoxy resin adhesives, the rotational rheometer can be used to test at a constant shear rate under different temperature conditions (such as 25°C to 80°C), record the viscosity change data with temperature, and plot the curve. The rotational rheometer can be constructed based on the strain control or stress control principle driven by a servo motor.

[0042] As an embodiment of the present invention, calculating the temperature sensitivity coefficient corresponding to the test viscosity curve includes: Feature points are extracted from the tested viscosity curve to obtain a set of feature points; Based on the set of feature points, analyze the rheological transformation characteristics corresponding to the test viscosity curve; Based on the rheological transformation characteristics, the test viscosity curve is divided into regions to obtain linear and nonlinear regions; Count the number of data points corresponding to the linear region and the nonlinear region to obtain the number of linear points and the number of nonlinear points; The temperature sensitivity coefficient corresponding to the test viscosity curve is calculated by combining the linear points, the rheological transformation characteristics, and the nonlinear points.

[0043] The feature point set is the set of key data points obtained after feature point extraction from the test viscosity curve, such as viscosity abrupt change points, inflection points, and plateau region start points; the rheological transformation characteristics are the properties corresponding to the test viscosity curve that reflect changes in the rheological behavior of the adhesive, such as the transition from Newtonian fluid to non-Newtonian fluid and the initiation of gelation; the linear region and the nonlinear region are the temperature ranges in which the viscosity and temperature have an approximately linear or nonlinear relationship after the test viscosity curve is divided into regions based on the rheological transformation characteristics. For example, the viscosity changes slowly with temperature in the low temperature region (linear region), and the viscosity increases sharply near the curing temperature (nonlinear region).

[0044] Furthermore, feature points can be extracted from the test viscosity curve using derivative analysis to obtain a set of feature points. For example, the first derivative of the curve can be calculated to find inflection points, and the second derivative can be used to find abrupt change points. Based on the set of feature points, curve fitting and trend analysis algorithms can be used to analyze the rheological transformation characteristics corresponding to the test viscosity curve. For example, the trend of viscosity change with temperature can be fitted by an exponential function to determine the transformation characteristics. Based on the rheological transformation characteristics, the test viscosity curve can be divided into regions using a piecewise regression method to obtain linear and nonlinear regions.

[0045] Furthermore, as an optional embodiment of the present invention, the temperature sensitivity coefficient corresponding to the test viscosity curve is calculated by combining the linear point count, the rheological transformation characteristics, and the nonlinear point count, including: Based on the rheological transformation characteristics, the viscosity change rate corresponding to each temperature range in the test viscosity curve is calculated; Calculate the average value corresponding to the viscosity change rate to obtain the mean change rate; By combining the number of linear points and the number of nonlinear points, the regional stability index corresponding to the test viscosity curve is calculated; Based on the aforementioned regional stability index, the regional equilibrium coefficient corresponding to the test viscosity curve is set. The temperature sensitivity coefficient corresponding to the test viscosity curve is calculated by combining the regional equilibrium coefficient, the viscosity change rate, the mean change rate, the number of linear points, and the number of nonlinear points.

[0046] The regional stability index is a quantified value of the stability of data distribution in the linear and nonlinear regions corresponding to the test viscosity curve. It is calculated by the variance ratio of data points in the two types of regions to reflect the repeatability of the test results. The regional balance coefficient is an adjustment parameter dynamically set to balance the contribution of different regions corresponding to the test viscosity curve. Furthermore, based on the regional stability index, the basic weights can be mapped by the Sigmoid function to set the regional balance coefficient corresponding to the test viscosity curve.

[0047] Furthermore, as another embodiment of the present invention, the temperature sensitivity coefficient corresponding to the test viscosity curve is calculated using the following formula, combining the regional equilibrium coefficient, the viscosity change rate, the mean change rate, the number of linear points, and the number of nonlinear points: ; Where B represents the temperature sensitivity coefficient corresponding to the measured viscosity curve. Represents the regional balance coefficient. This represents the rate of viscosity change corresponding to the j-th temperature range of the viscosity test curve. denoted as the mean rate of change, j represents the sequence number of the temperature range of the viscosity curve, m represents the number of linear points, n represents the number of nonlinear points, and tanh(.) is the hyperbolic tangent function.

[0048] Furthermore, this formula employs an exponential decay term. To balance the effects of extreme values ​​in the linear region, the hyperbolic tangent function is used. The saturation characteristics of the constrained nonlinear region are determined by the square term. To enhance sensitivity to significant changes in nonlinear regions, two summation terms are used to handle linear and nonlinear regions respectively. The contribution of each region is balanced by a weighting adjustment factor γ, thereby accurately quantifying the sensitivity of the viscosity curve to temperature changes.

[0049] Furthermore, as an optional embodiment of the present invention, the step of calculating the viscosity change rate corresponding to each temperature range in the test viscosity curve based on the rheological transformation characteristics includes: Temperature-viscosity correlation construction is performed on the rheological transformation characteristics to obtain a temperature-viscosity correlation diagram; The temperature-viscosity correlation graph is smoothed to obtain a smoothed correlation curve; The derivative of the smoothed correlation curve is calculated to obtain the rate of change curve; The rate of change curve is normalized to obtain the standard rate of change; Analyze the distribution characteristics of the standard rate of change and calculate the confidence level corresponding to the distribution characteristics; Based on the confidence level and the standard rate of change, the viscosity change rate corresponding to each temperature range in the test viscosity curve is calculated.

[0050] Wherein, the temperature-viscosity correlation diagram is a graphical representation of the rheological transformation characteristics; the smoothed correlation curve is a continuous curve of the temperature-viscosity correlation diagram after smoothing; the rate of change curve is the derivative calculation result of the smoothed correlation curve; the standard rate of change is the dimensionless value of the rate of change curve after normalization; the distribution characteristic is the statistical distribution characteristic of the standard rate of change; and the confidence level represents the reliability metric parameter corresponding to the distribution characteristic.

[0051] Furthermore, the rheological transformation characteristics can be correlated with temperature using a data fitting method to obtain a temperature-viscosity correlation graph. This graph can then be smoothed using a moving average method or a Savitzky-Golay filter to obtain a smoothed correlation curve. The smoothed correlation curve can be further processed by numerical differentiation to calculate its derivative, resulting in a rate of change curve. This rate of change curve can be normalized using a minimum-maximum normalization method to obtain a standard rate of change. The distribution characteristics of the standard rate of change can be analyzed using a statistical analysis module, such as calculating the mean and standard deviation. The confidence level corresponding to the distribution characteristics can be calculated using a confidence interval calculation method, such as t-interval calculation. Finally, combining the confidence level and the standard rate of change, the viscosity rate of change corresponding to each temperature interval in the test viscosity curve can be calculated using a weighted average method.

[0052] Furthermore, the rheological transformation characteristics can be correlated with temperature using a data fitting method to obtain a temperature-viscosity correlation graph. This graph can then be smoothed using a moving average method or a Savitzky-Golay filter to obtain a smoothed correlation curve. The smoothed correlation curve can be further processed by numerical differentiation to calculate its derivative, resulting in a rate of change curve. This rate of change curve can be normalized using a minimum-maximum normalization method to obtain a standard rate of change. The distribution characteristics of the standard rate of change can be analyzed using a statistical analysis module, such as calculating the mean and standard deviation. The confidence level corresponding to the distribution characteristics can be calculated using a confidence interval calculation method, such as t-interval calculation. Finally, combining the confidence level and the standard rate of change, the viscosity rate of change corresponding to each temperature interval in the test viscosity curve can be calculated using a weighted average method.

[0053] S4. Combining the substrate insulation reference and the temperature sensitivity coefficient, generate a basic composite pattern corresponding to the composite insulation and shielding of the qualified substrate and the compliant adhesive, extract the composite process elements corresponding to the basic composite pattern, and analyze the composite compatibility between the composite process elements.

[0054] This invention, by combining the substrate insulation reference and the temperature sensitivity coefficient, generates a basic composite pattern corresponding to the composite insulation and shielding of the qualified substrate and the compliant adhesive. This allows for the combination of material performance characteristics and process requirements to form a scientifically sound composite solution. By extracting the composite process elements corresponding to the basic composite pattern, key process parameters affecting the composite effect can be obtained, providing a foundation for subsequent analysis and processing of the composite compatibility between the composite process elements.

[0055] The basic composite mode is a material composite scheme obtained by comprehensively evaluating the substrate insulation benchmark and the temperature sensitivity coefficient. The composite process elements are the key process parameters affecting the composite effect in the basic composite mode. Furthermore, combining the substrate insulation benchmark and the temperature sensitivity coefficient, a basic composite mode corresponding to the composite insulation shielding of the qualified substrate and the compliant adhesive can be generated through performance matching and process adaptation algorithms. If the substrate insulation benchmark shows an insulation level of Class A and a temperature sensitivity coefficient of 0.8, the basic composite mode "using a layered coating process, preheating the substrate to 60°C, adhesive coating thickness of 0.2mm, and curing temperature of 120°C" can be generated by comprehensively considering insulation performance and temperature adaptability through performance matching and process adaptation algorithms. The composite process elements corresponding to the basic composite mode can be extracted through a process parameter extraction method, which is achieved through feature extraction technology.

[0056] This invention analyzes the compatibility between the composite process elements to understand the degree of coordination between them, providing a basis for subsequent process optimization. The composite compatibility refers to the degree of matching and coordination of the composite process elements under the insulating material composite process and the level of process rationality.

[0057] As an embodiment of the present invention, the analysis of the composite compatibility between the composite process elements includes: Calculate the process compatibility between the composite process elements and determine the process influence value corresponding to the composite process elements; Based on the process compatibility and the process influence value, calculate the composite coupling degree between the composite process elements; Based on the composite coupling degree, the composite compatibility among the composite process elements is analyzed.

[0058] The process compatibility refers to the quantified value (0-10) of the matching degree between two composite process elements in terms of operating conditions and execution logic. For example, the process compatibility of "spraying and applying adhesive (requiring adhesive viscosity of 3000-6000 mPa·s)" and "pre-curing at 55℃ (adhesive viscosity of 4800 mPa·s at this temperature)" is 9. The process influence value refers to the quantified value (0.1-1.0) of the importance of a single composite process element to the final composite insulation and shielding effect. For example, "pressing pressure" directly affects the tightness of the interface bonding between the substrate and the adhesive, with a process influence value of 0.8, while "cooling time" has a smaller impact, with a process influence value of 0.2. The composite coupling degree is a comprehensive index calculated by multiplying the process compatibility degree by the average of the process influence values ​​of the two elements. It reflects the degree of synergy between the adaptability and importance of the elements. For example, the composite coupling degree of the above-mentioned spraying and pre-curing elements = 9 × (0.8 + 0.2) / 2 = 4.5.

[0059] Furthermore, the process influence value corresponding to the composite process element can be determined by using historical composite pass rate data. For example, the influence value can be set by statistically analyzing the proportion of insulation failures caused by improper pressing pressure. The composite coupling degree between the composite process elements can be calculated using a fixed formula (composite coupling degree = process compatibility degree × (influence value of element A + influence value of element B) / 2). Based on the composite coupling degree, a threshold can be set (≥7 for high compatibility, 4-7 for medium compatibility, <4 for low compatibility) to analyze compatibility. For example, if the coupling degree of a certain element combination is 7.2, it is judged to be highly compatible. If the coupling degree is 3.8, the elements need to be adjusted (such as increasing the pre-curing temperature) to improve the coupling degree to medium compatibility or above.

[0060] Furthermore, as an optional embodiment of the present invention, calculating the process compatibility between the composite process elements includes: Key attributes are extracted from the composite process elements to obtain an attribute set; Based on the set of attribute elements, construct the adaptation analysis dimensions among the composite process elements; Based on the aforementioned adaptation analysis dimensions, the dimension adaptation scores of the composite process elements are determined. Based on the dimensional adaptation score, the process compatibility between the composite process elements is calculated.

[0061] The element attribute set refers to the set of core characteristics that affect the combination effect extracted from composite process elements, including attributes such as physical compatibility, chemical stability, temperature adaptability, and time synchronization. The adaptation analysis dimension refers to the evaluation aspect of the mutual combination effect between process elements based on element attributes, such as temperature matching degree, time coordination, and physical parameter compatibility. The dimension adaptation score refers to the quantitative value of the matching degree of composite process elements on each adaptation analysis dimension, which is calculated by the degree of fit between element attributes.

[0062] Furthermore, key attributes of the composite process elements can be extracted using feature engineering methods to obtain an attribute set. For example, attributes such as "temperature range," "heating rate," and "temperature stability" can be extracted from the "curing temperature" element. These attributes not only characterize the core features of the curing process but also provide a specific basis for matching and comparing with other process elements. Multidimensional scaling analysis can be used to construct the compatibility analysis dimensions between the composite process elements, establishing a multidimensional evaluation system including thermodynamic matching degree, kinetic coordination, and interfacial compatibility. These dimensions comprehensively cover the key judgment directions of element compatibility from the perspectives of material reaction characteristics and operational connection logic. Dimensional compatibility scores of the composite process elements can be determined using similarity calculation algorithms, such as using cosine similarity to calculate the similarity of attribute vectors of two process elements in a certain dimension. Based on the dimensional compatibility scores, the process compatibility between the composite process elements can be calculated using the arithmetic mean of the dimensional compatibility scores.

[0063] S5. Based on the composite compatibility and the basic composite mode, perform composite processing on the qualified substrate and the compliant adhesive to obtain a composite material.

[0064] This invention, based on the composite compatibility and the basic composite mode, performs composite processing between the qualified substrate and the compliant adhesive, which can systematically perform composite processing between the qualified substrate and the compliant adhesive, ensuring that the processing meets the insulation and shielding requirements and avoids performance defects caused by process conflicts, ultimately obtaining a composite material with both structural stability and insulation reliability.

[0065] Furthermore, the execution flow of the composite processing is as follows: First, based on the basic composite mode, the qualified substrate is surface activated (e.g., plasma treatment), and the compliant adhesive is homogenized (e.g., degassing treatment) to ensure that the initial state matches the mode requirements; then, the process is carried out step by step according to the "coating-composite-curing" sequence set in the mode, adjusting details according to the composite compatibility results during the process (e.g., high compatibility steps are executed at the conventional pace, and the interface bonding time is extended in medium compatibility steps); finally, the insulation performance of the molded product is initially inspected (e.g., dielectric strength test), and the processing is completed after passing the test. For a more intuitive demonstration of the composite processing flow, please refer to [reference needed]. Figure 2 As shown in the diagram (a schematic diagram of the composite processing flow provided by the present invention), this diagram presents the complete process from substrate pretreatment to composite material molding. It should be noted that... Figure 2 This is just a process example; in actual operation, details can be adjusted according to the characteristics of the substrate and adhesive.

[0066] like Figure 3 The diagram shown is a functional block diagram of the composite insulation and shielding system based on electronic auxiliary materials and adhesive materials of the present invention.

[0067] The composite insulation and shielding system 300 based on electronic auxiliary materials and adhesive materials described in this invention can be installed in electronic devices. Depending on the functions implemented, the composite insulation and shielding system based on electronic auxiliary materials and adhesive materials may include a substrate adhesive adaptation module 301, a substrate insulation reference module 302, an adhesive temperature-sensitive testing module 303, a composite compatibility analysis module 304, and a composite processing and molding module 305. The module described in this invention can also be called a unit, referring to a series of computer program segments that can be executed by the processor of an electronic device and perform a fixed function, stored in the memory of the electronic device.

[0068] In this embodiment of the invention, the functions of each module / unit are as follows: The substrate and adhesive matching module 301 is used to obtain the electronic auxiliary material substrate and adhesive material raw material to be processed, and to perform a matching process on the electronic auxiliary material substrate and the adhesive material raw material to obtain qualified substrate and compliant adhesive. The substrate insulation reference module 302 is used to detect the substrate insulation factor corresponding to the qualified substrate, and extract the microstructure features from the qualified substrate in combination with the preset insulation performance parameter standard, and determine the withstand voltage threshold corresponding to the microstructure features to generate the substrate insulation reference corresponding to the qualified substrate. The temperature-sensitive testing module 303 is used to perform viscosity gradient testing on the compliant adhesive, obtain a test viscosity curve, and calculate the temperature sensitivity coefficient corresponding to the test viscosity curve. The composite compatibility analysis module 304 is used to combine the substrate insulation reference and the temperature sensitivity coefficient to generate a basic composite pattern of the qualified substrate and the compliant adhesive with respect to composite insulation shielding, extract the composite process elements corresponding to the basic composite pattern, and analyze the composite compatibility between the composite process elements. The composite processing and molding module 305 is used to perform composite processing between the qualified substrate and the compliant adhesive based on the composite compatibility and the basic composite mode to obtain a composite material.

[0069] In detail, the modules in the composite insulation and shielding system 200 based on electronic auxiliary materials and adhesive materials described in this embodiment of the invention adopt the same characteristics as described above during use. Figure 1 The method described herein is the same as the composite insulation and shielding method based on electronic auxiliary materials and adhesive materials, and can produce the same technical effect, so it will not be repeated here.

[0070] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

[0071] Finally, it should be noted that in the above embodiments, each embodiment can be combined with each other or independent. Deleting any one of them will not affect the technical implementation of other embodiments. The above embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A composite insulation and shielding method based on electronic auxiliary materials and adhesive materials, characterized in that, The method includes: Obtain the electronic auxiliary material substrate and adhesive material raw material to be processed, and perform a compounding treatment on the electronic auxiliary material substrate and the adhesive material raw material to obtain qualified substrate and compliant adhesive. The substrate insulation factor corresponding to the qualified substrate is detected, and the microstructure features are extracted from the qualified substrate in combination with the preset insulation performance parameter standard. The withstand voltage threshold corresponding to the microstructure features is measured to generate the substrate insulation benchmark corresponding to the qualified substrate. The compliant adhesive was subjected to a viscosity gradient test to obtain a test viscosity curve, and the temperature sensitivity coefficient corresponding to the test viscosity curve was calculated. Combining the substrate insulation reference and the temperature sensitivity coefficient, a basic composite pattern is generated between the qualified substrate and the compliant adhesive regarding composite insulation and shielding. The composite process elements corresponding to the basic composite pattern are extracted, and the composite compatibility between the composite process elements is analyzed. Based on the composite compatibility and the basic composite mode, a composite processing is performed between the qualified substrate and the compliant adhesive to obtain a composite material.

2. The composite insulation and shielding method based on electronic auxiliary materials and adhesive materials as described in claim 1, characterized in that, The process of compounding and matching the electronic auxiliary material substrate and the adhesive material raw material to obtain qualified substrate and compliant adhesive includes: The electronic auxiliary material substrate to be processed is pretreated to obtain a pretreated substrate; The basic properties of the adhesive material raw materials are verified to obtain the verified adhesive compound; The pretreated substrate and the verified adhesive are initially compounded to obtain a preliminary composite sample. The initial composite sample was subjected to compatibility testing, and a performance test report was obtained. Based on the performance test report, the electronic auxiliary material substrate and the adhesive material raw material are compounded and matched to obtain qualified substrate and compliant adhesive.

3. The composite insulation and shielding method based on electronic auxiliary materials and adhesive materials as described in claim 2, characterized in that, The step of initially laminating the pretreated substrate with the verified adhesive to obtain a preliminary composite sample includes: Determine the coating area and coating amount of the pretreated substrate; Based on the coating area and the coating amount, the verified adhesive is coated onto the surface of the pretreated substrate to obtain a coated substrate; The adhesive-coated substrate is subjected to preliminary curing treatment to obtain a semi-cured composite substrate; The semi-cured composite substrate is pressed together to obtain a preliminary composite substrate; The initial composite substrate is subjected to deviation correction processing to obtain a compliant initial composite substrate; The compliant initial composite substrate is cut to obtain an initial composite sample.

4. The composite insulation and shielding method based on electronic auxiliary materials and adhesive materials as described in claim 1, characterized in that, The step of extracting microstructural features from the qualified substrate by combining the preset insulation performance parameter standard and the substrate insulation factor includes: The preset insulation performance parameter standards are analyzed in a structured manner to obtain an insulation performance hierarchy system; The insulation factor of the substrate is quantified to obtain a numerical sequence of insulation factors; Identify the key performance nodes in the insulation performance hierarchy and analyze the coupling degree between the insulation factor numerical sequence and the key performance nodes; Based on the coupling degree, the core performance nodes corresponding to the substrate insulation factor are selected from the key performance nodes; Based on the core performance nodes, the performance association path information corresponding to the substrate insulation factor is extracted from the insulation performance hierarchy system; The intrinsic material information of the qualified substrate is extracted, and the intrinsic material information and the performance correlation path information are subjected to feature fusion processing to obtain the microstructure features.

5. The composite insulation and shielding method based on electronic auxiliary materials and adhesive materials as described in claim 1, characterized in that, The calculation of the temperature sensitivity coefficient corresponding to the test viscosity curve includes: Feature points are extracted from the tested viscosity curve to obtain a set of feature points; Based on the set of feature points, analyze the rheological transformation characteristics corresponding to the test viscosity curve; Based on the rheological transformation characteristics, the test viscosity curve is divided into regions to obtain linear and nonlinear regions; Count the number of data points corresponding to the linear region and the nonlinear region to obtain the number of linear points and the number of nonlinear points; The temperature sensitivity coefficient corresponding to the test viscosity curve is calculated by combining the linear points, the rheological transformation characteristics, and the nonlinear points.

6. The composite insulation and shielding method based on electronic auxiliary materials and adhesive materials as described in claim 5, characterized in that, Combining the linear point count, the rheological transformation characteristics, and the nonlinear point count, the temperature sensitivity coefficient corresponding to the test viscosity curve is calculated, including: Based on the rheological transformation characteristics, the viscosity change rate corresponding to each temperature range in the test viscosity curve is calculated; Calculate the average value corresponding to the viscosity change rate to obtain the mean change rate; By combining the number of linear points and the number of nonlinear points, the regional stability index corresponding to the test viscosity curve is calculated; Based on the aforementioned regional stability index, the regional equilibrium coefficient corresponding to the test viscosity curve is set. Combining the regional equilibrium coefficient, the viscosity change rate, the average change rate, the number of linear points, and the number of nonlinear points, the temperature sensitivity coefficient corresponding to the test viscosity curve is calculated using the following formula: ； Where B represents the temperature sensitivity coefficient corresponding to the measured viscosity curve. Represents the regional balance coefficient. This represents the rate of viscosity change corresponding to the j-th temperature range of the viscosity test curve. denoted as the mean rate of change, j represents the sequence number of the temperature range of the viscosity curve, m represents the number of linear points, n represents the number of nonlinear points, and tanh(.) is the hyperbolic tangent function.

7. The composite insulation and shielding method based on electronic auxiliary materials and adhesive materials as described in claim 6, characterized in that, The calculation of the viscosity change rate corresponding to each temperature range in the test viscosity curve based on the rheological transformation characteristics includes: Temperature-viscosity correlation construction is performed on the rheological transformation characteristics to obtain a temperature-viscosity correlation diagram; The temperature-viscosity correlation graph is smoothed to obtain a smoothed correlation curve; The derivative of the smoothed correlation curve is calculated to obtain the rate of change curve; The rate of change curve is normalized to obtain the standard rate of change; Analyze the distribution characteristics of the standard rate of change and calculate the confidence level corresponding to the distribution characteristics; Based on the confidence level and the standard rate of change, the viscosity change rate corresponding to each temperature range in the test viscosity curve is calculated.

8. The composite insulation and shielding method based on electronic auxiliary materials and adhesive materials as described in claim 1, characterized in that, The analysis of the composite compatibility between the composite process elements includes: Calculate the process compatibility between the composite process elements and determine the process influence value corresponding to the composite process elements; Based on the process compatibility and the process influence value, calculate the composite coupling degree between the composite process elements; Based on the composite coupling degree, the composite compatibility among the composite process elements is analyzed.

9. The composite insulation and shielding method based on electronic auxiliary materials and adhesive materials as described in claim 8, characterized in that, The calculation of the process compatibility between the composite process elements includes: Key attributes are extracted from the composite process elements to obtain an attribute set; Based on the set of attribute elements, construct the adaptation analysis dimensions among the composite process elements; Based on the aforementioned adaptation analysis dimensions, the dimension adaptation scores of the composite process elements are determined. Based on the dimensional adaptation score, the process compatibility between the composite process elements is calculated.

10. A composite insulation and shielding system based on electronic auxiliary materials and adhesive materials, characterized in that, The system includes: The substrate and adhesive matching module is used to acquire the electronic auxiliary material substrate and adhesive material raw material to be processed, and to perform a matching process on the electronic auxiliary material substrate and the adhesive material raw material to obtain qualified substrate and compliant adhesive. The substrate insulation reference module is used to detect the substrate insulation factor corresponding to the qualified substrate, and extract the microstructure features from the qualified substrate in combination with the preset insulation performance parameter standard, and determine the withstand voltage threshold corresponding to the microstructure features to generate the substrate insulation reference corresponding to the qualified substrate. The temperature-sensitive testing module for the rubber compound is used to perform viscosity gradient testing on the compliant rubber compound, obtain the test viscosity curve, and calculate the temperature sensitivity coefficient corresponding to the test viscosity curve. The composite compatibility analysis module is used to combine the substrate insulation reference and the temperature sensitivity coefficient to generate a basic composite pattern of the qualified substrate and the compliant adhesive with respect to composite insulation shielding, extract the composite process elements corresponding to the basic composite pattern, and analyze the composite compatibility between the composite process elements. A composite processing and molding module is used to perform composite processing between the qualified substrate and the compliant adhesive based on the composite compatibility and the basic composite mode to obtain a composite material.

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