Liquid cooling assembly, liquid cooling device and electronic equipment

Abstract

The invention discloses a liquid cooling assembly, a liquid cooling device and electronic equipment. The liquid cooling assembly comprises at least one cold plate, the cold plate is arranged in a tiled mode, and the upper surface of the cold plate is a heat exchange face used for being matched with a component to be subjected to heat dissipation in a heat exchange mode; and the pipeline assembly is arranged in the cold plate in a penetrating mode, the pipeline assembly is used for conveying a cooling medium, the cooling medium is in heat exchange fit with the cold plate, and the end of the pipeline assembly is provided with a first quick connection structure used for external quick connection fit. According to the invention, the problem of low heat dissipation effect of components in the prior art is solved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation device technology, and more particularly to a liquid cooling component, liquid cooling device, and electronic device. Background Technology

[0002] During the use of servers and other equipment, a large number of mechanical hard drives and other components are deployed inside. Taking mechanical hard drives as an example, high-density deployment of mechanical hard drives will generate a lot of heat when running under high load for a long time. Traditional air cooling methods are limited by the low heat conduction efficiency of air and are unable to meet the heat dissipation requirements, which may lead to a decrease in hard drive performance, a shortened lifespan, or even data loss.

[0003] While liquid cooling technology can effectively improve heat dissipation efficiency, existing liquid cooling solutions still have the following problems in actual use: high thermal resistance at the interface between the cold plate and the hard drive, insufficient heat conduction efficiency, scattered liquid cooling pipeline layout, occupying internal server space, affecting hard drive installation and replacement, lack of coordinated heat dissipation design with other server components, low overall heat dissipation system efficiency, resulting in poor heat dissipation effect on components such as mechanical hard drives. Summary of the Invention

[0004] This application provides a liquid cooling component, a liquid cooling device, and an electronic device to at least solve the problem of low heat dissipation performance of components in the related art.

[0005] This application provides a liquid cooling assembly, comprising: at least one cold plate, the cold plate being laid flat, the upper surface of the cold plate being a heat exchange surface for heat exchange with the component to be cooled; and a pipe assembly, the pipe assembly being inserted into the cold plate, the pipe assembly being used to transport a cooling medium, the cooling medium being in heat exchange with the cold plate, and the end of the pipe assembly having a first quick-connect structure for external quick-connection.

[0006] This application also provides a liquid cooling device, including: a base, which is movably connected to the chassis of an electronic device and can extend or retract from the chassis; a liquid supply assembly, at least a portion of which is disposed within the chassis, the base being movably disposed relative to the liquid supply assembly, and the liquid supply assembly having a second quick-connect structure; the aforementioned liquid cooling assembly, wherein the cold plate of the liquid cooling assembly is laid on the inner bottom surface of the base, the piping assembly of the liquid cooling assembly moves synchronously with the base, and when the base retracts into the chassis, the first quick-connect structure and the second quick-connect structure of the liquid cooling assembly engage and cooperate, and the liquid supply assembly supplies liquid to the piping assembly.

[0007] This application also provides an electronic device, including a chassis, components to be cooled, and the aforementioned liquid cooling device. The liquid cooling device is movably disposed inside the chassis and can extend or retract from the chassis. The components to be cooled are mounted on the liquid cooling device and cooperate with the cold plate of the liquid cooling device for heat exchange.

[0008] This application allows for the flat laying of cold plates, enabling the upper surface of the cold plates to contact the components to be cooled, thus achieving heat exchange. The upper surface of the cold plates can directly contact the components for heat exchange, or, as needed, components with better thermal conductivity can be added. There are no other spacers with high thermal resistance between them, improving the heat transfer efficiency of the cold plates and reducing the thermal resistance at the contact interface between the cold plates and the components, thereby enhancing the heat dissipation performance of the liquid cooling assembly. Piping assemblies are run between the cold plates and transport the cooling medium. The piping assembly has simple wiring, reducing maintenance difficulty. Heat exchange can be achieved between the cooling medium and the cold plates, allowing the piping assembly to remove heat from the cold plates. The ends of the piping assembly have a first quick-connect structure for external quick-connection, enabling the piping assembly to connect with external components, facilitating the flow and renewal of the cooling medium within the piping assembly, and allowing for rapid installation and connection between the piping assembly and external components. The cold plate efficiently exchanges heat with the components to be cooled through its upper surface, removing heat from the components. The cold plate also exchanges heat with the cooling medium, allowing the cooling medium to remove heat from the cold plate. The piping assembly interacts with the external environment, replacing the high-temperature cooling medium after heat exchange with a new low-temperature cooling medium to continue the above heat exchange process. This achieves heat exchange for the components to be cooled, enabling efficient heat dissipation even with a high density of components, significantly improving the heat dissipation effect. At the same time, it realizes the construction of an integrated liquid cooling assembly for collaborative heat dissipation, improving the overall heat dissipation performance of the equipment. Attached Figure Description

[0009] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 This is a schematic diagram of the structure of the liquid cooling assembly provided in the embodiments of this application;

[0011] Figure 2 for Figure 1 A schematic diagram of the structure of the cold plate fixture in the middle;

[0012] Figure 3 This is a schematic diagram of the structure of the liquid cooling device and hard disk provided in the embodiments of this application;

[0013] Figure 4 for Figure 3 A schematic diagram of the liquid cooling device in the diagram;

[0014] Figure 5 for Figure 4 Exploded view of the backplate of the liquid cooling unit in the middle;

[0015] Figure 6 for Figure 4 A schematic diagram of the liquid cooling device with the backplate concealed.

[0016] Figure 7 for Figure 4 A partial structural diagram of the base of the liquid cooling device in the diagram;

[0017] Figure 8 for Figure 4 A schematic diagram of the structure in which the liquid cooling components are installed into the base via a cold plate fixture;

[0018] Figure 9 This is a schematic diagram of a portion of the structure of the electronic device provided in the embodiments of this application;

[0019] Figure 10 for Figure 9 A schematic diagram of the structure of an electronic device when the hard drive is hidden;

[0020] Figure 11 for Figure 9 A schematic diagram of the liquid supply assembly in the middle;

[0021] Figure 12 This is a schematic diagram of the structure of the hard drive and the mounting bracket.

[0022] The above figures include the following reference numerals:

[0023] 10. Base; 11. Base body; 111. Mounting part; 112. Receiving part; 12. Partition; 13. Back plate; 14. Guide rail structure; 20. Cold plate; 30. Piping assembly; 31. Secondary pipeline; 32. First manifold; 33. Primary pipeline; 34. First quick-connect structure; 40. Liquid supply assembly; 41. Second manifold; 42. Liquid supply pipeline; 43. Connecting structure; 44. Second quick-connect structure; 50. Cold plate fixture; 51. First crossbeam; 511. Connecting section; 52. Second crossbeam; 53. Handle; 60. Mounting bracket; 61. Bracket body; 62. Heat-conducting layer; 63. Handle; 70. Chassis; 80. Components to be cooled. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0025] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0026] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0027] To address the issue of low heat dissipation performance of components in related technologies, this application provides a liquid cooling component, a liquid cooling device, and an electronic device.

[0028] like Figure 1 , Figure 2 The liquid cooling assembly shown includes: at least one cold plate 20 and a piping assembly 30. The cold plate 20 is laid flat, and its upper surface is a heat exchange surface for heat exchange with the component 80 to be cooled. The piping assembly 30 passes through the cold plate 20 and is used to transport the cooling medium. The cooling medium and the cold plate 20 exchange heat. The end of the piping assembly 30 has a first quick-connect structure 34 for quick external connection.

[0029] In this embodiment, the cold plate 20 is laid flat, allowing its upper surface to contact the component 80 to be cooled, thus achieving heat exchange. The upper surface of the cold plate 20 and the component 80 can directly contact each other for heat exchange, or components with better thermal conductivity can be added as needed. There are no other spacers with high thermal resistance between them, improving the heat conduction efficiency of the cold plate 20 and reducing the thermal resistance at the contact interface between the cold plate 20 and the component 80, thereby improving the heat dissipation performance of the liquid cooling assembly. The piping assembly 30 passes between the cold plates 20 and transports the cooling medium. The piping assembly 30 has simple wiring, reducing the difficulty of maintenance. The cooling medium and the cold plate 20 can exchange heat, allowing the piping assembly 30 to remove heat from the cold plate 20. The end of the piping assembly 30 has a first quick-connect structure 34 for external quick-connection, enabling the piping assembly 30 to connect with the outside environment. This allows for the flow and renewal of the cooling medium within the piping assembly 30, and the first quick-connect structure 34 facilitates quick installation and connection between the piping assembly 30 and the outside environment. The cold plate 20 efficiently exchanges heat with the component 80 to be cooled via its upper surface, removing heat from the component 80. The cold plate 20 also exchanges heat with the cooling medium, allowing the cooling medium to remove heat from the cold plate 20. The piping assembly 30 connects with the outside environment, replacing the higher-temperature cooling medium with a new, lower-temperature cooling medium to continue the heat exchange process. This achieves efficient heat dissipation even with a high density of components 80, significantly improving the heat dissipation effect. Simultaneously, it creates an integrated liquid cooling assembly for coordinated heat dissipation, enhancing the overall heat dissipation performance of the equipment.

[0030] This embodiment uses a mechanical hard drive (HDD) as the component to be cooled, 80. Since this is for high-density HDD deployment, at least two cooling plates 20 are preferably provided, allowing each cooling plate 20 to correspond to one HDD, achieving efficient heat dissipation for each HDD. Of course, the component to be cooled, 80, can be other types of hard drives such as solid-state drives (SSDs), chips (i.e., processors), or memory. Furthermore, the electronic device in this embodiment can be a server, a router, or other devices.

[0031] like Figure 1As shown, the piping assembly 30 in this embodiment includes: a primary piping 33, a first manifold 32, and at least one secondary piping 31. The primary piping 33 and the secondary piping 31 can be made of materials with good thermal conductivity and a certain degree of support, such as copper pipes. One end of the primary piping 33 has a first quick-connect structure 34, allowing the primary piping 33 to connect with external components to provide cooling medium. The other end of the primary piping 33 is connected to the first manifold 32. Each secondary piping 31 is respectively installed within at least one cold plate 20 and is connected to the first manifold 32. Preferably, at least two secondary piping 31s are provided, and each secondary piping 31 is installed within at least two cold plates 20. This eliminates the need for a one-to-one correspondence between the secondary piping 31 and each cold plate 20, and avoids the need to connect each secondary piping 31 to each cold plate 20 individually. This allows the primary piping 33 to provide cooling medium to each cold plate 20 through the first manifold 32. The secondary pipeline 31 provides the cooling medium, enabling the cold plate 20 to exchange heat with the cooling medium. It also ensures that new, low-temperature cooling medium that has not undergone heat exchange can flow into the secondary pipeline 31 through the primary pipeline 33 and the first manifold 32 to replace the cooling medium with a higher temperature after heat exchange. Furthermore, the first manifold 32 provides the cooling medium to each secondary pipeline 31, ensuring the stable flow of the cooling medium. This ensures that the cooling medium in the secondary pipeline 31 can be updated in a timely manner and flows stably, thereby improving the heat exchange performance of the pipeline assembly 30.

[0032] like Figure 1 As shown, in this embodiment, the cold plates 20 are grouped together. The cold plates 20 in the same group are arranged along the first direction, and the cold plates 20 in each group are spaced apart along the second direction perpendicular to the first direction. At least two cold plates 20 are in efficient heat exchange cooperation with the heat-dissipating components 80 through their upper surfaces, which can improve the overall heat exchange performance of the liquid cooling assembly. The secondary pipes 31 are inserted into each cold plate 20 in the same group, so that a secondary pipe 31 only needs to be connected to the cold plates 20 in the same group, without having to connect to each cold plate 20 one by one. This can also achieve heat exchange cooperation between the secondary pipes 31 and the cold plates 20, and there is no need to arrange the wiring separately for the secondary pipes 31. The wiring of the secondary pipes 31 is simple, which reduces the maintenance difficulty of the secondary pipes 31.

[0033] like Figure 1As shown, the cold plate 20 in this embodiment has a through-channel, and the secondary pipe 31 passes through the through-channel to pass through the cold plate 20, realizing the heat exchange cooperation between the secondary pipe 31 and the cold plate 20. At the same time, in this embodiment, the through-channel on the cold plate 20 farthest from the first manifold 32 in the same group of cold plates 20 has a U-shaped structure, so that the secondary pipe 31 also has a U-shaped structure in the through-channel on the cold plate 20. This allows the secondary pipe 31 to pass through all the cold plates 20 in the same group in the first direction, and then turn at the farthest cold plate 20 due to the U-shaped structure. The secondary pipe 31 changes direction by about 180 degrees and extends in the opposite direction, thus passing through each cold plate 20 again and returning to the first manifold 32. This ensures that both ends of the secondary pipe 31 can be connected to the first manifold 32, realizing the circulation of the cooling medium. This ensures that the cooling medium in the secondary pipe 31 can be renewed in a timely manner and flows stably, improving the heat exchange performance of the pipe assembly 30. Meanwhile, the U-shaped structure ensures that the cooling medium in the secondary pipeline 31 will not form turbulence due to excessive resistance, allowing the cooling medium to flow stably within the secondary pipeline 31. By setting a through-channel to accommodate the secondary pipeline 31 and connecting the secondary pipeline 31 in parallel to the first manifold 32, the layout of the pipeline assembly 30 is optimized, reducing the maintenance difficulty of the liquid cooling assembly.

[0034] This embodiment takes a configuration of four groups of cold plates 20 as an example. Each group of cold plates 20 has three cold plates 20 arranged along a first direction, for a total of twelve cold plates 20. Four secondary pipes 31 are correspondingly provided. Each secondary pipe 31 first connects the three cold plates 20 of the same group together, then connects them in parallel to the first manifold 32. The passageway on the cold plate 20 furthest from the first manifold 32 in each group of cold plates has a U-shaped structure. One end of the secondary pipe 31 is connected to the first manifold 32, passes through the passageway of the three cold plates 20 in sequence, then changes direction at the U-shaped structure, and then passes through the three cold plates 20 in reverse order. The other end of the secondary pipe 31 is also connected to the first manifold 32. This configuration allows the liquid cooling assembly to achieve efficient heat dissipation for the hard drive while simplifying its overall structure and making installation, maintenance, and use more convenient. Of course, the specific arrangement of the cold plates 20 is not limited to the rectangular array form described in this embodiment. Other arrangements, such as triangular arrangements, can also be used, as long as they can be compatible with the installation of the hard drive. At the same time, the structural form of the cold plates 20 themselves is not limited to the rectangular block structure of this embodiment. They can also be rhomboid, triangular, or other shapes.

[0035] The cold plate 20 in this embodiment is also provided with cold plate screw holes, so that the cold plate 20 can be fixed to the base with screws through the cold plate screw holes.

[0036] like Figure 2As shown, the liquid cooling assembly in this embodiment also includes a cold plate fixture 50, which is detachably connected to the cold plate 20 and / or the piping assembly 30, and can drive the cold plate 20 and the piping assembly 30 to be disassembled and installed. Since the piping assembly 30 passes through the through-channel of the cold plate 20 and is connected to the cold plate 20, and the piping assembly 30 is a copper pipe with a certain supporting force, whether the cold plate fixture 50 is connected to the cold plate 20, the cold plate fixture 50 is connected to the piping assembly 30, or the cold plate fixture 50 is connected to both the cold plate 20 and the piping assembly 30, the cold plate 20 and the piping assembly 30 can be disassembled and installed by lifting and placing the cold plate fixture 50, thereby improving the disassembly and assembly efficiency and convenience of the cold plate 20 and the piping assembly 30, and facilitating the maintenance and cleaning of the liquid cooling assembly. In this embodiment, the cold plate fixture 50 is detachably connected to the cold plate 20. Since the cold plate 20 has a large area and the pipeline assembly 30 passes through the cold plate 20, the cold plate 20 and the pipeline assembly 30 can be stably disassembled by applying force to the cold plate 20 through the cold plate fixture 50.

[0037] like Figure 2 As shown, the cold plate fixture 50 of this embodiment includes at least one crossbeam and a handle 53. The crossbeam is disposed above the cold plate 20 and spaced vertically from it. The crossbeam is the main body and serves to bear load. This embodiment has at least two crossbeams, which are intersecting and connected to form a cross-shaped structure, thereby improving the load-bearing capacity of the cold plate fixture 50. The crossbeam is also a component connected to the cold plate 20. The side of the crossbeam has a downwardly extending connecting section 511 that extends to the upper surface of the cold plate 20, thus connecting with it. This allows the crossbeam to form a stable structure and connect with the cold plate 20. The handle 53 is connected to the crossbeam and is used for operation. Operators can lift the crossbeam and the cold plate 20 using the handle 53 to place and lift the cold plate 20, facilitating maintenance and cleaning of the cold plate 20 and the piping assembly 30.

[0038] like Figure 2As shown, the crossbeams in this embodiment include a first crossbeam 51 and a second crossbeam 52. The first crossbeam 51 extends in a third transverse direction, and the second crossbeam 52 extends in a fourth transverse direction, with the third transverse direction and the fourth transverse direction at an angle. The first crossbeams 51 are spaced apart, and the second crossbeams 52 are spaced apart. The first crossbeams 51 and the second crossbeams 52 are intersecting and connected, and the intersection is fixedly connected by components such as screws and nuts, so that the first crossbeams 51 and the second crossbeams 52 can be connected into a stable structure. This allows the crossbeams to stably move the cold plate 20 when it is placed and lifted by the handle 53, ensuring that the cold plate 20 will not tilt or fall due to the instability of the crossbeams during installation and disassembly, thus ensuring the reliability of the installation and disassembly of the cold plate 20. Specifically, the connecting segments 511 extending downward from the side of the first crossbeam 51 or the second crossbeam 52 are correspondingly provided with and connected to the cold plate 20, so that all the cold plates 20 can be stably installed and disassembled at the same time, further ensuring the reliability of the installation and disassembly of the cold plate 20.

[0039] It should be noted that the specific relationship between the aforementioned third and fourth directions and the first and second directions can be set as needed, and there is no mandatory matching method between them. In this embodiment, it is preferred that the third direction is the same as the first direction and the fourth direction is the same as the second direction, so that one first crossbeam 51 can simultaneously cover the top of the cold plate 20 in the same group, realizing the connection between the cold plates 20 in the same group, while the second crossbeam 52 serves to connect all the first crossbeams 51, so that the crossbeams of the cold plate fixture 50 form a whole. Since the first crossbeam 51 is located above the cold plate 20, in this embodiment, it is preferred that a connecting section 511 is provided on the first crossbeam 51, and the connecting section 511 may not be provided on the second crossbeam 52.

[0040] Taking the setting of four longitudinal first crossbeams 51 and two transverse second crossbeams 52 as an example, the four longitudinal first crossbeams 51 are arranged at intervals, and the two transverse second crossbeams 52 are also arranged at intervals. The four longitudinal first crossbeams 51 are perpendicularly connected to the two transverse second crossbeams 52 respectively. The handle 53 is roughly parallel to the first crossbeams 51, set at the central axis and intersecting with the two transverse second crossbeams 52. Setting two longitudinal first crossbeams 51 and two transverse second crossbeams 52 to make the crossbeams form a "#" shape can also achieve the above effect. Of course, two first crossbeams 51 and four second crossbeams 52 can also be set, with the two first crossbeams 51 intersecting each other in an "X" shape, and the four second crossbeams 52 connecting the four ends of the first crossbeams 51 in sequence, so that the crossbeams can form a stable structure. The handle 53 is overlapped with one of the first crossbeams 51 and set at the center of gravity of the first crossbeam 51. Alternatively, three first crossbeams 51 can be set, forming a triangle, with a second crossbeam 52 set at the diagonal position, which can form a stable structure. Alternatively, four first crossbeams 51 can be set, forming a quadrilateral, with a second crossbeam 52 set at the diagonal position, which can form a stable structure. The handle 53 can be set at the center of gravity of the crossbeams to achieve the purpose of lifting and placing the crossbeams. In addition, a triangular pyramid or tetrahedral structure can be formed by the cooperation of the first crossbeam 51 and the second crossbeam 52, which can also form a stable structure. Since the crossbeam itself is a three-dimensional structure, the crossbeam can be lifted and placed directly through the three-dimensional structure. The handle 53 can be omitted, or the handle 53 can be set at the center of gravity on the upper surface of the three-dimensional structure, and the crossbeam can be lifted and placed through the handle 53.

[0041] In this embodiment, the bottom end of the connecting section 511 is provided with spring screws, each of which is fixed to the cold plate 20. This allows the cold plate fixture 50 to be fixed to the cold plate 20, ensuring that the crossbeam can stably move the cold plate 20 when it is placed and lifted by the handle 53, thus guaranteeing the reliability of the installation and removal of the cold plate 20. When the cold plate 20 is installed in place using the cold plate fixture 50, the cold plate fixture 50 can be removed from the cold plate 20 by unscrewing the spring screws, preventing the cold plate fixture 50 from interfering with the heat exchange between the cold plate 20 and the heat-dissipating component 80. When it is necessary to remove the cold plate 20, the cold plate fixture 50 can be reinstalled on the cold plate 20 using the spring screws. Of course, if the cold plate fixture 50 does not interfere with the installation of the cold plate 20 and the heat-dissipating component 80, the cold plate fixture 50 can remain installed on the cold plate 20. The handle 53 is also equipped with a handle silkscreen marking to remind the operator to lift the handle 53 to complete the installation and removal of the cold plate 20.

[0042] like Figures 3 to 12As shown, this embodiment also provides a liquid cooling device, including: a base 10, a liquid supply assembly 40, and the aforementioned liquid cooling assembly. The base 10 is movably connected to the chassis 70 of the electronic device and can extend or retract from the chassis 70. At least a portion of the liquid supply assembly 40 is disposed within the chassis 70. The base 10 is movably disposed relative to the liquid supply assembly 40, and the liquid supply assembly 40 has a second quick-connect structure 44. The cold plate 20 of the liquid cooling assembly is laid on the inner bottom surface of the base 10, and the piping assembly 30 of the liquid cooling assembly moves synchronously with the base 10, thereby ensuring that the entire liquid cooling assembly is mounted on the base 10 and moves synchronously with the base 10. This design allows for easy access and maintenance of the liquid cooling components. When maintenance is required on the liquid cooling system or hard drive, simply extending the base 10 out of the chassis 70 enables inspection, cleaning, and repair. The first quick-connect structure 34 and the second quick-connect structure 44 can be easily disassembled and reassembled as the base 10 extends and retracts, eliminating the need to pre-disassemble the liquid cooling components and the liquid supply assembly 40, or to install and connect them separately. Only the base 10 needs to be moved; no other components need to be disassembled, enabling quick plug-and-play installation of the liquid cooling components and reducing the maintenance difficulty of the liquid cooling system. After maintenance, retracting the base 10 into the chassis 70 allows the first quick-connect structure 34 and the second quick-connect structure 44 to re-engage, enabling the liquid supply assembly 40 to supply liquid to the piping assembly 30 again, allowing the liquid cooling system to resume its liquid cooling function.

[0043] like Figure 4 As shown, the base 10 in this embodiment has a front end and a rear end. The front end extends out of the chassis 70 before the rear end. The piping assembly 30 is located at the rear end, and the cold plate 20 is closer to the front end than the piping assembly 30. This makes the piping assembly 30 and the liquid supply assembly 40 closer to each other, making their docking and cooperation simpler and more stable. This ensures that the piping assembly 30 can be properly connected and cooperated with the liquid supply assembly 40 inside the chassis 70, so that when the base 10 is retracted into the chassis 70, the liquid supply assembly 40 can supply liquid to the piping assembly 30 in a timely manner. On the other hand, when the base 10 extends, the cold plate 20 at the front end will extend first, so it is not necessary to pull out the entire base 10, which makes it more convenient to inspect the cold plate 20 and the hard drive. It is also more convenient when retracting and repositioning.

[0044] like Figure 7 , Figure 9As shown, the base 10 of this embodiment includes: a base body 11, at least one partition 12, and at least one back plate 13. The base body 11 of this embodiment has an opening at the top and at least one side, and its middle part forms a U-shaped structure, thereby forming a mounting part 111 that can accommodate components such as liquid cooling components and hard drives. The partition 12 is disposed in the mounting part 111 and connected to the base body 11. The partition 12 divides the mounting part 111 into at least two mounting areas. The cold plate 20 is disposed in the mounting area to achieve a reasonable layout and stable installation of the cold plate 20. The back plate 13 is disposed in the mounting area and connected to the base body 11. The back plate 13 is located on the back of the component 80 to be cooled. The back plate 13 is used to mount the circuit board. The component 80 to be cooled can be electrically connected to the circuit board, thereby realizing the electrical connection and cooperation between the component 80 to be cooled and the motherboard and other components to achieve the functions of power supply and data transmission.

[0045] In this embodiment, the base 10 is provided with studs, which can be used to fix components such as the cold plate 20 and the partition 12 by screw fastening. The base 10 is also provided with base screw holes, and back plate studs are provided on both sides of the back plate 13. After the back plate studs are aligned with the base screw holes, the two are fastened together with screws, which can fix the back plate 13 to the base 10.

[0046] like Figure 4 , Figure 7 and Figure 9 As shown, based on the grouping arrangement of the cold plates 20 in the above embodiment, the cold plates 20 in the same group are arranged along the front-back direction of the base 10, and the cold plates 20 in each group are arranged at intervals in the left-right direction perpendicular to the front-back direction and the up-down direction. That is to say, the front-back direction of the base 10 is the first direction mentioned above, and the left-right direction is the second direction mentioned above. Both are horizontal directions, and both are set approximately perpendicular to the up-down direction. The partition 12 is disposed between two adjacent sets of cold plates 20, thereby separating the cold plates 20 in the left-right direction. The back plate 13 is disposed between two cold plates 20 in the same set, thereby separating the cold plates 20 in the front-back direction. The partition 12 and the back plate 13 can divide the mounting part 111 into at least two mounting areas. The mounting areas can be used to install the cold plates 20 and the heat dissipation components 80. Preferably, one cold plate 20 and one heat dissipation component 80 are installed in each mounting area, so that the cold plates 20 and the heat dissipation components 80 are set in a one-to-one correspondence and simultaneously contact each other for heat exchange, thus ensuring the heat exchange performance of the liquid cooling device.

[0047] like Figure 4 , Figure 5As shown, in this embodiment, the partition 12 is arranged in a lengthwise manner, with an independent partition 12 set between two adjacent cold plates 20 on the left and right. Unlike the above-mentioned arrangement of the partition 12, in this embodiment, the back plate 13 is simultaneously inserted between multiple sets of cold plates 20 in the left-right direction. In this way, one back plate 13 can cooperate with at least two cold plates 20 and at least two heat dissipation components 80 at the same time, so that at least two heat dissipation components 80 aligned in the left-right direction can be electrically connected to one back plate 13 at the same time, thereby achieving external connection through one back plate 13.

[0048] This embodiment uses fifteen partitions 12 and three back plates 13 as an example. The fifteen partitions 12 and three back plates 13 divide the mounting section 111 into twelve mounting areas. Twelve heat-dissipating components 80 can be arranged in these twelve mounting areas. Twelve cold plates 20 are correspondingly arranged in each of the twelve mounting areas, located at the bottom of each heat-dissipating component 80, achieving efficient heat dissipation for each component 80. Four heat-dissipating components 80 in the left and right directions are connected to the same back plate 13, enabling external connectivity for the heat-dissipating components 80. During installation, the cold plate 20 can be mounted on the base 10 using a cold plate fixture 50, then the cold plate fixture 50 can be removed from the cold plate 20, and then the back plate 13 and partitions 12 can be installed to obtain the twelve mounting areas. The twelve heat-dissipating components 80 can then be arranged in these twelve mounting areas. Of course, other installation sequences can also be used as needed, such as installing the partitions 12 first, then installing the cold plates 20 and the piping assembly 30 as a whole, and then installing the back plate 13.

[0049] like Figure 4 , Figure 7 As shown, the base body 11 of this embodiment also includes a receiving part 112. The receiving part 112 is closer to the rear end of the base 10 than the mounting part 111. That is, the mounting part 111 and the receiving part 112 are arranged in the front-to-back direction. The mounting part 111 is mainly used to install the cold plate 20. Therefore, the partition plate 12 and the back plate 13 mentioned above are both set in the mounting part 111. The receiving part 112 is only used to install the pipeline assembly 30. That is, the pipeline assembly 30 is installed and supported on the receiving part 112. The receiving part 112 does not need to be provided with a structure similar to the partition plate 12. It can adopt the form of a large area of ​​empty space to facilitate the installation of components such as the first water distribution manifold 32 and the primary pipeline 33 of the pipeline assembly 30. Moreover, the pipeline assembly 30 is close to the rear end of the base 10, which makes it convenient for the pipeline assembly 30 to dock with the liquid supply assembly 40 in time when the base 10 is retracted into the chassis 70.

[0050] Specifically, in this embodiment, the receiving part 112 is mainly used to fix and support the first water distribution manifold 32 and the first quick-connect structure 34. The first water distribution manifold 32 is provided with a water collector screw hole, and the first quick-connect structure 34 is provided with a quick connector screw hole. The receiving part 112 is provided with a water collector stud and a quick connector stud respectively. After aligning the water collector screw hole and the water collector stud, and the quick connector screw hole and the quick connector stud, the first water distribution manifold 32, the first quick-connect structure 34 and the receiving part 112 are fixed together by screws and studs. The first water distribution manifold 32 and the first quick-connect structure 34 are connected by a primary pipeline 33.

[0051] like Figure 4 As shown, in this embodiment, a guide rail structure 14 is provided between the base body 11 and the chassis 70. The base body 11 is retractable relative to the chassis 70 via the guide rail structure 14, allowing the base 10 to extend and retract. This facilitates maintenance of the cold plate 20 on the base 10 and the piping assembly 30 that moves synchronously with the base 10, reducing the maintenance difficulty of the liquid cooling assembly. In this embodiment, the guide rail structure 14 is located on the longitudinal sides of both sides of the base body 11. It can cover the entire length of the longitudinal side or only a portion of the length, ensuring that the base body 11 and the chassis 70 form a retractable arrangement. During maintenance, personnel only need to pull the base body 11 out from the front window of the chassis 70.

[0052] like Figure 10As shown, the liquid supply assembly 40 in this embodiment includes: a second manifold 41 located at the rear window of the chassis 70, a liquid supply pipeline 42, and a docking structure 43. The liquid supply assembly 40 is a fixed component relative to the chassis 70 during normal use and liquid cooling assembly maintenance. The second manifold 41 is docked and connected to the pipeline assembly 30. The second manifold 41 is provided with a second quick-connect structure 44. The second manifold 41 can dock and cooperate with the primary pipeline 33 through the cooperation between the second quick-connect structure 44 and the first quick-connect structure 34, and supply liquid to the pipeline assembly 30. The liquid supply line 42 passes through the rear window. One end of the liquid supply line 42 is connected to the second manifold 41. The liquid supply line 42 is connected to the first quick-connect structure 34 via a second quick-connect structure 44 to supply liquid to the pipe assembly 30. The second manifold 41 can make the liquid supply line 42 to the pipe assembly 30 more stable, and can supply liquid to at least two liquid cooling components when there are at least two liquid cooling components. The other end of the liquid supply line 42 extends from the rear window to the outside of the chassis 70. The end of the liquid supply line 42 extending out of the chassis 70 has a docking structure 43. The liquid supply line 42 is connected to external equipment through the docking structure 43. The external equipment provides cooling medium to the liquid supply line 42 to ensure sufficient low-temperature cooling medium, so that the cooling medium in the pipe assembly 30 can be replenished in time, ensuring the heat dissipation performance of the liquid cooling device. The docking structure 43 can also be a quick-connect structure.

[0053] like Figure 12 As shown, the liquid cooling device in this embodiment also includes a mounting bracket 60. The mounting bracket 60 is installed above the cold plate 20 and connected to the base 10. The mounting bracket 60 is used to install and accommodate the component 80 to be cooled, so that the component 80 to be cooled can achieve efficient heat exchange with the cold plate 20. The connection between the mounting bracket 60 and the base 10 can ensure the reliability of the contact between the component 80 to be cooled and the cold plate 20, and ensure the heat dissipation performance of the liquid cooling device.

[0054] like Figure 12As shown, the mounting bracket 60 in this embodiment includes a bracket body 61 and a handle 63. The component 80 to be cooled is mounted on the bracket body 61, which is connected to the base 10. The bottom and / or sides of the bracket body 61 have a hollow structure, allowing the component 80 to achieve efficient heat exchange with the cold plate 20, thus ensuring the heat dissipation performance of the liquid cooling device. The handle 63 is movably connected to the bracket body 61 and can extend or retract into the bracket body 61. In this embodiment, the handle 63 is rotatable from the bracket body 61. When the handle 63 is rotated upwards, it extends above the bracket body 61, allowing for lifting, placement, and other operations. After the operation is completed, the handle 63 is rotated downwards to the side of the bracket body 61, thus retracting the handle 63, reducing the space occupied by the mounting bracket 60, and ensuring the miniaturization of the liquid cooling device. When in use, pulling up and lowering the handle 63 can move the heat-dissipating component 80 and the bracket body 61, making it convenient to install and remove the heat-dissipating component 80.

[0055] In this embodiment, the support body 61 includes two elongated sheet-like structures arranged opposite each other. These structures can be mounted on the two opposite side surfaces of the component 80 to be cooled. The handle 63 can be an inverted U-shaped structure, and its two sides can be rotatably connected to the two elongated sheet-like structures of the support body 61. The connection point is approximately located at the center of the elongated sheet-like structure. Thus, the bottom surface and part of the side surface of the support body 61 in this embodiment are hollow structures. Of course, the support body 61 can also be configured as a rectangular frame structure that can be fitted onto the component 80 to be cooled, ensuring that the mounting bracket 60 can be stably and reliably lifted and placed on the component 80 to be cooled.

[0056] In this embodiment, the mounting bracket 60 has hard drive screw holes and hard drive positioning pins on both elongated sheet-like structures. The component 80 to be cooled is first positioned by the hard drive positioning pins, and then screws are used to fix the mounting bracket 60 and the component 80 together through the hard drive screw holes. The hard drive screw holes and hard drive positioning pins are located on the side of the bracket body 61. Both opposite sides of the bracket body 61 need to have hard drive screw holes and hard drive positioning pins to ensure the accuracy of the positioning of the component 80 to be cooled and the reliability of the fixed connection between the mounting bracket 60 and the component 80 to be cooled. Optionally, each side of the bracket body 61 can be provided with hard drive screw holes and hard drive positioning pins, and multiple sets of hard drive screw holes and hard drive positioning pins can also be symmetrically provided on one side of the bracket body 61 to further ensure the accuracy of the positioning of the component 80 to be cooled and the reliability of the fixed connection between the mounting bracket 60 and the component 80 to be cooled.

[0057] like Figure 12As shown, the liquid cooling device in this embodiment also includes a heat-conducting layer 62. The heat-conducting layer 62 is disposed on the bottom surface and / or side surface of the support body 61. The heat-conducting layer 62 is located between the heat-dissipating component 80 and the cold plate 20 and / or between the heat-dissipating component 80 and the base 10. The heat-conducting layer 62 can prevent the heat-dissipating component 80 from colliding with the cold plate 20 and the base 10, thus protecting the heat-dissipating component 80. In addition, it can make the cold plate 20 fit more closely to the heat-dissipating component 80, and the heat-conducting layer 62 itself can conduct heat, which is beneficial for the heat-dissipating component 80 to dissipate heat better. In this embodiment, the heat-conducting layer 62 is preferably disposed on the bottom surface of the support body 61, so that the heat-conducting layer 62 is located between the heat-dissipating component 80 and the cold plate 20, and the high thermal conductivity of the heat-conducting layer 62 is used to realize heat exchange between the heat-dissipating component 80 and the cold plate 20. Of course, the heat-conducting layer 62 can be omitted, in which case the cold plate 20 and the component 80 to be cooled can transfer heat through direct contact.

[0058] like Figures 9 to 11 As shown, this embodiment also provides an electronic device, including a chassis 70, a component 80 to be cooled, and the aforementioned liquid cooling device. The liquid cooling device is movably disposed within the chassis 70 and can extend or retract from the chassis 70. During maintenance, the base 10 of the liquid cooling device can be pulled out to clean, inspect, and repair the component 80 to be cooled and the liquid cooling device without disassembling other components, reducing the difficulty of overall equipment maintenance and disassembly, and facilitating the maintenance of the component 80 to be cooled and the liquid cooling device. The component 80 to be cooled is mounted on the liquid cooling device and cooperates with the cold plate 20 of the liquid cooling device for heat exchange.

[0059] The chassis 70 in this embodiment has a front window and a rear window arranged in a front-to-back manner. According to the direction of the personnel facing the server, the end of the chassis 70 closer to the personnel is the front window, and the end farther away from the personnel is the rear window. The front window and the rear window of the chassis 70 correspond one-to-one with the front end and the rear end of the base 10, and the direction of the line connecting the front window and the rear window is the front-to-back direction.

[0060] Optionally, the chassis 70 can be made of sheet metal through bending and stamping, which has high strength and ensures that the heat-dissipating components 80 and liquid cooling devices installed in the chassis 70 will not be crushed, thus protecting the heat-dissipating components 80 and liquid cooling devices. The rear window of the chassis 70 also has at least two spaces formed by riveting sheet metal parts for the routing of the second manifold 41 and the liquid supply line 42. The second manifold 41 can be fixed to the chassis 70 by screws. At the same time, the rear window of the chassis 70 can also be equipped with a fan for cooling, further improving the heat dissipation performance of electronic equipment.

[0061] In this embodiment, the base 10 of the liquid cooling device is removably mounted at the front window, allowing the chassis 70 to be pulled out from the front window. The liquid supply assembly 40 of the liquid cooling device is located at the rear window, facilitating communication between the liquid supply assembly 40 and external equipment via the docking structure 43 through the rear window of the chassis 70, ensuring that the external equipment can provide cooling medium to the liquid supply assembly 40 in a timely manner. When the base 10 is pulled out, the liquid cooling assembly extends simultaneously, and the second quick-connect structure 44 and the first quick-connect structure 34 also separate simultaneously, while the liquid supply assembly 40 remains stationary at the rear window without changing its position. When the base 10 is pushed back, the liquid cooling assembly retracts simultaneously, and the second quick-connect structure 44 and the first quick-connect structure 34 also connect simultaneously. At this time, the liquid cooling assembly and the liquid supply assembly 40 at the rear window are reconnected and engaged, and the liquid supply assembly 40 can supply liquid to the liquid cooling assembly normally.

[0062] In this embodiment, the cold plate 20 and the component 80 to be cooled work together efficiently to reduce the temperature of the component 80. The pipe assembly 30 passing through the cold plate 20 can work together with the cold plate 20 to remove the heat from the cold plate 20. Of course, the pipe assembly 30 can also work together with the component 80 to reduce the temperature of the component 80. The liquid supply assembly 40 can provide new low-temperature cooling medium to the pipe assembly 30 in cooperation with external equipment, and refresh the cooling medium in the pipe assembly 30 in a timely manner. The rear window of the chassis 70 can also be equipped with a fan for heat dissipation, which improves the heat dissipation performance of the liquid cooling assembly and brings a better heat dissipation effect to the component 80. This constructs an integrated liquid cooling system with multiple heat sources working together to improve the overall heat dissipation efficiency.

[0063] In this embodiment, there is at least one liquid cooling device. When there are at least two liquid cooling devices, they are stacked longitudinally and the pull-out of each liquid cooling device is relatively independent. This improves the heat dissipation performance of the electronic device while ensuring that each liquid cooling device is easy to maintain and can work independently. It prevents situations where the device cannot dissipate heat due to simultaneous malfunctions. When at least two liquid cooling devices are provided, the liquid supply component 40 can share one, meaning one liquid supply component 40 cooperates with at least two liquid cooling components to supply liquid to at least two liquid cooling components. In this case, at least two second quick-connect structures 44 of the liquid supply component 40 are provided to cooperate with at least two liquid cooling components.

[0064] As can be seen from the above description, the embodiments of this application achieve the following technical effects:

[0065] The cold plate 20 is laid flat so that its upper surface can contact the component 80 to be cooled, achieving heat exchange. The upper surface of the cold plate 20 and the component 80 can directly contact each other for heat exchange, or components with better thermal conductivity can be added as needed. There are no other spacers with high thermal resistance between them, improving the heat conduction efficiency of the cold plate 20 and reducing the thermal resistance at the contact interface between the cold plate 20 and the component 80, thereby improving the heat dissipation performance of the liquid cooling assembly. The piping assembly 30 passes between the cold plates 20 and transports the cooling medium. The piping assembly 30 has simple wiring, reducing maintenance difficulty. Heat exchange can be achieved between the cooling medium and the cold plate 20, allowing the piping assembly 30 to remove heat from the cold plate 20. The end of the piping assembly 30 has a first quick-connect structure 34 for external quick-connection, allowing the piping assembly 30 to connect with external components, enabling the flow and renewal of the cooling medium within the piping assembly 30, and facilitating quick installation and connection between the piping assembly 30 and external components. The cold plate 20 directly contacts the component 80 to be cooled through its upper surface, carrying away the heat from the component 80. The cold plate 20 works in conjunction with the cooling medium to remove the heat from the cold plate 20. The piping assembly 30 works with the outside environment to replace the high-temperature cooling medium after heat exchange with a new low-temperature cooling medium to continue the above heat exchange process, thus achieving heat exchange for the component 80 to be cooled. Even with a high density of components 80 to be cooled, efficient heat dissipation can be achieved, greatly improving the heat dissipation effect. At the same time, it realizes the construction of an integrated liquid cooling assembly for collaborative heat dissipation, improving the overall heat dissipation performance of the equipment.

[0066] The liquid cooling component, liquid cooling device, and electronic device provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A liquid cooling assembly, characterized in that, include: At least one cold plate (20) is laid flat, and the upper surface of the cold plate (20) is a heat exchange surface for heat exchange with the heat exchange component (80) to be cooled; Piping assembly (30), which is installed inside the cold plate (20), is used to transport cooling medium, and the cooling medium and the cold plate (20) are heat exchanged together. The end of the piping assembly (30) has a first quick-connect structure (34) for external quick connection.

2. The liquid cooling assembly according to claim 1, characterized in that, The piping assembly (30) includes: A primary pipeline (33), one end of which has the first quick-connect structure (34); The first water distribution manifold (32) is connected to the first water distribution manifold (32) at the other end of the primary pipeline (33); At least one secondary pipeline (31) is provided, each of the secondary pipelines (31) is installed in at least one of the cold plates (20), and each is connected to the first water distribution manifold (32).

3. The liquid cooling assembly according to claim 2, characterized in that, The cold plates (20) are arranged in groups, and the cold plates (20) in the same group are arranged along the first direction. The cold plates (20) in each group are arranged at intervals along the second direction perpendicular to the first direction. The secondary pipeline (31) passes through each of the cold plates (20) in the same group.

4. The liquid cooling assembly according to claim 3, characterized in that, The cold plate (20) has a through channel, and the secondary pipeline (31) passes through the through channel to pass through the cold plate (20). Among the cold plates (20) in the same group, the through channel on the cold plate (20) farthest from the first water distributor (32) has a U-shaped structure.

5. The liquid cooling assembly according to claim 1, characterized in that, The liquid cooling assembly also includes a cold plate fixture (50), which is detachably connected to the cold plate (20) and / or the piping assembly (30) and can drive the cold plate (20) and the piping assembly (30) to be disassembled and assembled.

6. The liquid cooling assembly according to claim 5, characterized in that, The cold plate fixture (50) includes: At least one crossbeam is disposed above the cold plate (20) and spaced vertically from the cold plate (20). At least two crossbeams are intersecting and connected. The side of the crossbeam has a downwardly extending connecting section (511) that is connected to the cold plate (20) and / or the piping assembly (30). A handle (53) is connected to the crossbeam and is used for operation.

7. The liquid cooling assembly according to claim 6, characterized in that, The crossbeam includes a first crossbeam (51) and a second crossbeam (52). The first crossbeam (51) extends in a third transverse direction, and the second crossbeam (52) extends in a fourth transverse direction. The third transverse direction is set at an angle to the fourth direction. The first crossbeams (51) are spaced apart, and the second crossbeams (52) are spaced apart. The first crossbeams (51) and the second crossbeams (52) are intersecting and connected.

8. A liquid cooling device, characterized in that, include: The base (10) is movably connected to the chassis (70) of the electronic device and can extend or retract from the chassis (70). Liquid supply assembly (40), at least a portion of which is disposed within the chassis (70), the base (10) being movably disposed relative to the liquid supply assembly (40), the liquid supply assembly (40) having a second quick-connect structure (44). The liquid cooling assembly according to any one of claims 1 to 7, wherein the cold plate (20) of the liquid cooling assembly is laid on the inner bottom surface of the base (10), the pipeline assembly (30) of the liquid cooling assembly moves synchronously with the base (10), and when the base (10) retracts into the chassis (70), the first quick-connect structure (34) of the liquid cooling assembly and the second quick-connect structure (44) are connected and engaged, and the liquid supply assembly (40) supplies liquid to the pipeline assembly (30).

9. The liquid cooling device according to claim 8, characterized in that, The base (10) has a front end and a rear end, the front end extending out of the chassis (70) before the rear end, the piping assembly (30) being located at the rear end, and the cold plate (20) being closer to the front end than the piping assembly (30).

10. The liquid cooling device according to claim 8, characterized in that, The base (10) includes: The base body (11) has a mounting part (111). At least one partition (12) is disposed in the mounting portion (111) and connected to the base body (11), the partition (12) dividing the mounting portion (111) into at least two mounting areas, and the cold plate (20) is disposed in the mounting area; At least one backplate (13) is disposed in the mounting area and connected to the base body (11). The backplate (13) is located on the back of the heat-dissipating component (80) and is used to mount the circuit board.

11. The liquid cooling device according to claim 10, characterized in that, The cold plates (20) are arranged in groups. The cold plates (20) in the same group are arranged along the front and back direction of the base (10). The cold plates (20) in each group are arranged at intervals in the left and right directions perpendicular to the front and back direction and the up and down direction. The partition (12) is arranged between two adjacent groups of cold plates (20). The back plate (13) is arranged between two cold plates (20) in the same group.

12. The liquid cooling device according to claim 11, characterized in that, The back plate (13) is simultaneously inserted between multiple sets of cold plates (20) along the left and right directions.

13. The liquid cooling device according to claim 10, characterized in that, The base body (11) also includes a receiving part (112), which is closer to the rear end of the base (10) than the mounting part (111), and the pipeline assembly (30) is mounted and supported on the receiving part (112).

14. The liquid cooling device according to claim 10, characterized in that, A guide rail structure (14) is provided between the base body (11) and the chassis (70), and the base body (11) can be pulled out relative to the chassis (70) through the guide rail structure (14).

15. The liquid cooling device according to claim 8, characterized in that, The liquid supply assembly (40) includes: The second water distribution manifold (41) is located at the rear window of the chassis (70). The second water distribution manifold (41) is connected to the pipeline assembly (30). The second water distribution manifold (41) is provided with the second quick-connect structure (44). Liquid supply line (42) is installed through the rear window. One end of the liquid supply line (42) is connected to the second water distribution manifold (41), and the other end of the liquid supply line (42) extends out of the rear window to the outside of the chassis (70). The docking structure (43) is provided at one end of the liquid supply pipeline (42) extending out of the chassis (70), and the liquid supply pipeline (42) is connected to external equipment through the docking structure (43).

16. The liquid cooling device according to claim 8, characterized in that, The liquid cooling device also includes a mounting bracket (60), which is mounted above the cold plate (20) and connected to the base (10). The mounting bracket (60) is used to mount and accommodate components (80) to be cooled.

17. The liquid cooling device according to claim 16, characterized in that, The mounting bracket (60) includes: The bracket body (61) is on which the heat dissipation component (80) is mounted. The bracket body (61) is connected to the base (10). The bottom and / or side surfaces of the bracket body (61) are hollow structures. A handle (63) is movably connected to the support body (61) and can extend or retract into the support body (61).

18. The liquid cooling device according to claim 17, characterized in that, The liquid cooling device further includes a heat-conducting layer (62), which is disposed on the bottom surface and / or side surface of the support body (61). The heat-conducting layer (62) is located between the heat-dissipating component (80) and the cold plate (20) and / or between the heat-dissipating component (80) and the base (10).

19. An electronic device, characterized in that, The device includes a chassis (70), heat-dissipating components (80), and a liquid cooling device according to any one of claims 8 to 18. The liquid cooling device is movably disposed within the chassis (70) and can extend or retract from the chassis (70). The heat-dissipating components (80) are mounted on the liquid cooling device and cooperate with the cold plate (20) of the liquid cooling device for heat exchange.

20. The electronic device according to claim 19, characterized in that, The chassis (70) has a front window and a rear window arranged in a front-to-back manner. The base (10) of the liquid cooling device is detachably mounted at the front window and the chassis (70) can be pulled out from the front window. The liquid supply assembly (40) of the liquid cooling device is located at the rear window.

21. The electronic device according to claim 20, characterized in that, The liquid cooling device is at least one. When there are at least two liquid cooling devices, they are stacked longitudinally in sequence, and the pulling and unpulling of each liquid cooling device is relatively independent.

22. The electronic device according to claim 20, characterized in that, The heat-dissipating component (80) includes at least one of a hard disk, a chip, and memory.

Images