Embedded core circuit board conveying device and circuit board sintering equipment thereof

Abstract

The application discloses an embedded core-in-circuit board conveying device and a circuit board sintering equipment thereof and belongs to the technical field of circuit board sintering equipment. The embedded core-in-circuit board conveying device comprises a rack, a rotating mechanism and a plurality of bearing mechanisms, and the rotating mechanism is vertically arranged. The bearing mechanism can reciprocate along the rotating path of the rotating mechanism and is used for conveying the embedded core-in-circuit board into the sintering device. By adopting the vertically arranged rotating mechanism, the sliding direction of the bearing mechanism is changed to vertical direction rotation sliding, and the problem that the existing serial operation equipment occupies a large area can be solved. In addition, the vertical direction rotation sliding increases the sliding distance, provides more sufficient time for the heating or cooling process, and can ensure that the circuit board fully reaches the required temperature in the heating process.

Description

Technical Field

[0001] This invention relates to the field of circuit board sintering equipment technology, and in particular to an embedded core circuit board conveying device and its circuit board sintering equipment. Background Technology

[0002] In the semiconductor packaging field, the chip sintering process in integrated circuit manufacturing is crucial, placing extremely high demands on connection reliability and production efficiency. As a critical step, chip sintering directly affects the performance and quality of integrated circuits. Stable and reliable connections are the foundation for normal chip operation, while efficient production is key to meeting large-scale market demands and reducing costs.

[0003] However, traditional sintering equipment operates in a serial mode, which results in a long average sintering cycle, typically taking several minutes to tens of minutes to complete one sintering process. This not only limits the number of chips that can be processed per unit time but also leads to a slow overall production pace, making it difficult to meet the high-capacity demands of large-scale production. Furthermore, in addition to the long cycle time, traditional equipment also suffers from significant shortcomings in temperature control. Limited heating and cooling rates mean that slower heating further prolongs the sintering cycle, while slow cooling can affect chip performance and stability. Moreover, the serial operation mode also results in a large footprint. This large footprint not only occupies factory space but also increases factory construction and maintenance costs. Summary of the Invention

[0004] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes an embedded core circuit board conveying device, which can reduce the footprint of the device while increasing the heating and cooling rates, thereby improving production efficiency and meeting the needs of large-scale production.

[0005] The present invention also proposes an embedded core circuit board sintering device having the above-mentioned embedded core circuit board conveying device.

[0006] An embedded embedded circuit board conveying device according to a first aspect of the present invention is used for conveying embedded embedded circuit boards, the embedded embedded circuit board conveying device comprising: frame; A slewing mechanism, wherein the slewing mechanism is mounted on the frame and is vertically arranged; and Multiple support mechanisms are provided, which are movably mounted on the rotary mechanism and can reciprocate along the rotary path of the rotary mechanism. The support mechanisms are used to transport the embedded core circuit board to the sintering device. The supporting mechanism includes a first receiving component, a temperature control plate, and a second receiving component. The first receiving component, the temperature control plate, and the second receiving component are sequentially connected in the front-to-back direction. The first receiving component, the temperature control plate, and the second receiving component gradually tilt downwards in the front direction. The first receiving component is used to receive the embedded core circuit board. During the reciprocating movement of the supporting mechanism, the embedded core circuit board on the first receiving component slides down onto the temperature control plate in the tilt direction under its own gravity. The temperature control plate is used to support and heat or cool the embedded core circuit board. The second receiving component is used to receive the embedded core circuit board on the temperature control plate and transfer the embedded core circuit board to the sintering device.

[0007] The embedded core circuit board conveying device according to a first aspect embodiment of the present invention has at least the following beneficial effects: First, by adopting a vertically arranged rotary mechanism, the sliding direction of the carrying mechanism is changed to vertical rotary sliding, which solves the problem of large footprint of existing serial operation equipment. Second, the vertical rotary path increases the sliding distance, providing more time for the heating or cooling process of the temperature control board, ensuring that the circuit board reaches the required temperature during the heating process. Furthermore, the carrying mechanism includes a first receiving component, a temperature control board, and a second receiving component, which are arranged sequentially at intervals along the front-back direction and gradually offset along the vertically downward direction; that is, the first receiving component, the temperature control board, and the second receiving component slowly tilt downward along the front-back direction. This design allows the circuit board to transition smoothly during transport. Under its own weight, the embedded core circuit board slides smoothly from the first receiving component to the temperature control plate for heating or cooling, and then slides from the temperature control plate to the second receiving component. Finally, it is transferred to the sintering device through the second receiving component. This not only reduces the shaking and collision of the circuit board during transport, lowering the risk of product damage, but also allows the circuit board to be constantly heated or cooled on the temperature control plate during the sliding process, thereby further improving production efficiency and product quality.

[0008] According to some embodiments of the present invention, the first receiving component and the second receiving component are both conveying rollers arranged at intervals. The carrying mechanism further includes a first mounting rod and a second mounting rod. The first mounting rod is connected to the rotary mechanism. The first mounting rod is used to install the first receiving component and one side of the temperature control plate. The second mounting rod is disposed on the other side of the temperature control plate. The second mounting rod is used to install the second receiving component. The first receiving component is arranged at intervals with the second receiving components of other carrying mechanisms.

[0009] According to some embodiments of the present invention, the bearing mechanism further includes a first limiting component, which is disposed on the temperature control plate and located on the side close to the second receiving component. The first limiting component is used to limit the embedded core circuit board on the temperature control plate.

[0010] According to some embodiments of the present invention, the first limiting component includes a magnetic element, a reset elastic element, and a magnetic member. The magnetic element is telescopically disposed on the upper end surface of the temperature control plate. The reset elastic element is disposed between the magnetic element and the magnetic member. The magnetic member is disposed on the lower end surface of the temperature control plate. The magnetic member and the magnetic element can generate a mutual attractive force.

[0011] According to some embodiments of the present invention, the rotary mechanism includes a rotary component and a second limiting component. The rotary component is disposed on the frame, and the bearing mechanism is connected to the rotary component. The second limiting component is disposed on the frame and located on one side of the rotary component. The bearing mechanism is hinged to the second limiting component through the rotary component, and the bearing mechanism is limited by the second limiting component so that the bearing mechanism maintains a horizontal sliding state when the rotary component reciprocates.

[0012] According to some embodiments of the present invention, the rotary assembly includes two first sprockets and a first chain. The two first sprockets are disposed on the frame and spaced apart along the vertical direction of the frame. The first chain is capable of being wound around the two first sprockets. The bearing mechanism is rotatably connected to the first chain. The first sprockets are configured to drive the first chain to rotate, so that the first chain drives the bearing mechanism to rotate and move in the vertical direction of the frame.

[0013] According to some embodiments of the present invention, the second limiting assembly includes a connecting rod assembly, two second sprockets, and a second chain. The two second sprockets are disposed on the frame and located on one side of the two first sprockets. The two second sprockets are spaced apart along the vertical direction of the frame. The second chain can be wound around the two second sprockets. The first chain and the second chain are connected by the connecting rod assembly. The bearing mechanism is hinged to the rotating assembly by the connecting rod assembly.

[0014] According to some embodiments of the present invention, the connecting rod assembly includes: A first hinge seat, hinged to the first chain, and the load-bearing mechanism hinged to the first hinge seat; and The second hinge seat is hinged to the second chain, and the first hinge seat and the second hinge seat are fixedly connected by a connecting rod.

[0015] According to a second aspect of the present invention, an embedded core circuit board sintering apparatus includes a feeding device, a sintering device, and an embedded core circuit board conveying device as described in the first aspect of the present invention. The feeding device, the embedded core circuit board conveying device, and the sintering device are sequentially connected. The feeding device is used to provide the embedded core circuit board. The embedded core circuit board conveying device is used to convey the embedded core circuit board to the sintering device and heat the embedded core circuit board. The sintering device is used to sinter the embedded core circuit board.

[0016] The embedded core circuit board sintering equipment according to the second aspect of the present invention has at least the following beneficial effects: the embedded core circuit board sintering equipment has all the beneficial effects brought about by the above-mentioned embedded core circuit board conveying device, which will not be repeated here.

[0017] According to some embodiments of the present invention, the embedded core circuit board sintering equipment further includes a feeding device, which is disposed downstream of the sintering device. An embedded core circuit board conveying device is also disposed between the feeding device and the sintering device. The embedded core circuit board conveying device is used to convey the embedded core circuit board from the sintering device to the feeding device and cool the embedded core circuit board.

[0018] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a schematic diagram of the structure of the embedded core circuit board sintering equipment according to the first aspect of the present invention; Figure 2 for Figure 1 The diagram shows a front view of the embedded core circuit board sintering equipment. Figure 3 for Figure 1 The diagram shows the structure of the embedded core circuit board conveying device in the embedded core circuit board sintering equipment. Figure 4 for Figure 3 The front view of the embedded core circuit board delivery device is shown.

[0020] Icon labels: 1. Embedded embedded core circuit board; 2. Feeding device; 3. Embedded embedded core circuit board conveying device; 4. Sintering device; 5. Unloading device; Rack 10; Rotating mechanism 20; Rotating assembly 21; First sprocket 211; First chain 212; Second limiting assembly 22; Connecting rod assembly 221; First hinge seat 2211; Second hinge seat 2212; Connecting rod 2213; Second sprocket 222; Second chain 223; The supporting mechanism 30; the first receiving component 31; the temperature control plate 32; the second receiving component 33; the first mounting rod 34; the second mounting rod 35; and the first limiting component 36. Detailed Implementation

[0021] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0022] In the description of this invention, the use of "first" and "second" is for the purpose of distinguishing technical features only, and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the order of the technical features indicated.

[0023] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0024] Reference Figures 1 to 4According to a first aspect embodiment of the present invention, an embedded embedded circuit board conveying device 3 is used for conveying an embedded embedded circuit board 1. The embedded embedded circuit board conveying device 3 includes a frame 10, a rotary mechanism 20, and a plurality of carrying mechanisms 30. The rotary mechanism 20 is disposed on the frame 10 and is vertically arranged. The carrying mechanisms 30 are movably disposed on the rotary mechanism 20 and can reciprocate along the rotary path of the rotary mechanism 20. The carrying mechanisms 30 are used to convey the embedded embedded circuit board 1 to the sintering apparatus 4. The carrying mechanism 30 includes a first receiving component 31, a temperature control plate 32, and a second receiving component 33. The first receiving component 31, the temperature control plate 32, and the second receiving component 33 are arranged sequentially at intervals in the front-back direction. 31. The temperature control plate 32 and the second receiving component 33 gradually shift in the vertical downward direction. The first receiving component 31 is used to receive the embedded core circuit board 1. During the reciprocating movement of the bearing mechanism 30, the embedded core circuit board 1 on the first receiving component 31 slides down onto the temperature control plate 32 under its own gravity along the offset direction of the first receiving component 31. The temperature control plate 32 is used to support and heat or cool the embedded core circuit board 1. The second receiving component 33 is used to support the embedded core circuit board 1 on the temperature control plate 32 and transfer the embedded core circuit board 1 to the sintering device 4.

[0025] The embedded core circuit board conveying device 3 will be described in detail below with reference to the accompanying drawings.

[0026] Reference Figures 3 to 4 The embedded embedded circuit board conveying device 3 is mainly used for conveying the embedded embedded circuit board 1. Its overall structure includes a frame 10, a rotary mechanism 20 and multiple bearing mechanisms 30.

[0027] Reference Figures 3 to 4 The frame 10, serving as the supporting structure for the entire device, is made of high-strength metal to ensure the stability and reliability of the device. The frame 10 has a frame structure with adjustable feet at the bottom, allowing for height adjustment based on the flatness of the actual site to ensure the device is placed horizontally.

[0028] Reference Figures 3 to 4The rotary mechanism 20 is mounted on the frame 10 and is vertically positioned, thus having a vertically extending rotary path. In some embodiments, the rotary mechanism 20 may consist of a drive motor, a reducer, a rotary shaft, and a rotary disk. The drive motor is a high-performance servo motor, and the reducer is connected to the drive motor to reduce the motor speed and increase the torque to meet the operating requirements of the rotary mechanism 20. The rotary shaft is vertically mounted on the frame 10 and connected to the frame 10 via bearings to ensure smooth rotation. The rotary disk is fixedly mounted on the rotary shaft and rotates together with it. The rotary mechanism 20 can drive multiple bearing mechanisms 30 to continuously slide back and forth on the rotary disk, thereby continuously transporting the embedded core circuit board 1 from one side of the rotary mechanism 20 to the sintering device 4 on the other side of the rotary mechanism 20 through the bearing mechanisms 30.

[0029] Reference Figures 3 to 4 Multiple support mechanisms 30 are movably mounted on the rotary mechanism 20. Taking the above embodiment as an example, the support mechanism 30 is specifically mounted on the rotary table. The support mechanism 30 can reciprocate on the rotary mechanism 20 along the rotation direction of the rotary mechanism 20. Each support mechanism 30 includes a first receiving component 31, a temperature control plate 32, and a second receiving component 33. The first receiving component 31, the temperature control plate 32, and the second receiving component 33 are arranged sequentially in the front-back direction, and in the front-back direction, the first receiving component 31, the temperature control plate 32, and the second receiving component 33 gradually offset in the vertically downward direction; that is, the first receiving component 31, the temperature control plate 32, and the second receiving component 33 all gradually tilt downward in the front-back direction. Therefore, during the rotation of the support mechanism 30, the embedded core circuit board 1 on the support mechanism 30 slides from the first receiving component 31 to the temperature control plate 32; during the sliding process of the support mechanism 30, the embedded core circuit board 1 is continuously heated on the temperature control plate 32; when the support mechanism 30 moves to the feeding station of the sintering device 4, the embedded core circuit board 1 slides from the temperature control plate 32 along the inclined direction to the second receiving component 33, and falls from the second receiving component 33 to the feeding station of the sintering device 4, and then the embedded core circuit board 1 is sent into the sintering device 4 through the feeding station of the sintering device 4.

[0030] The first receiving component 31 is used to carry the embedded core circuit board 1 in the feeding device 2 and convey it to the temperature control plate 32. Specifically, in some embodiments, the first receiving component 31 adopts a flat plate structure with a smooth surface and is provided with positioning protrusions to accurately place the embedded core circuit board 1 and prevent the embedded core circuit board 1 from shifting during the conveying process. When the rotary mechanism 20 rotates, the first receiving component 31 moves in the tilting direction, conveying the embedded core circuit board 1 placed on it to the temperature control plate 32.

[0031] Reference Figure 3The temperature control plate 32 is used to support the embedded core circuit board 1 and to heat or cool it. Specifically, in some embodiments, the temperature control plate 32 is equipped with heating and cooling elements. The heating element is a resistance wire, and the heating time and power of the resistance wire are adjusted by the control system to heat the embedded core circuit board 1. The cooling element can be a semiconductor refrigeration or a cooling channel structure. During the rotation of the rotary mechanism 20, the embedded core circuit board 1 stays on the temperature control plate 32 for a certain period of time, and is heated or cooled according to process requirements. At the same time, the structure of the temperature control plate 32 is similar to that of the first receiving component 31, and it is also equipped with a positioning device (the first limiting component 36 mentioned below) to ensure that the embedded core circuit board 1 is accurately placed.

[0032] Reference Figures 3 to 4 The second receiving component 33 carries the embedded core circuit board 1 and conveys it to the sintering apparatus 4. The structure of the second receiving component 33 is similar to that of the first receiving component 31, and it also has a positioning device to ensure accurate placement of the embedded core circuit board 1. After the temperature control plate 32 completes its heating or cooling operation, the embedded core circuit board 1 is conveyed to the second receiving component 33. As the rotary mechanism 20 continues to rotate, the second receiving component 33 conveys the embedded core circuit board 1 to the feeding station of the sintering apparatus 4, completing the entire conveying process.

[0033] In actual production, parameters such as the rotation speed of the rotary mechanism 20 and the heating or cooling time on the temperature control plate 32 can be adjusted according to the different sintering process requirements of the embedded core circuit board 1 to achieve the best production results. For example, for some embedded core circuit boards 1 with high temperature requirements, the rotation speed of the rotary mechanism 20 can be appropriately reduced, and the heating or cooling time on the temperature control plate 32 can be extended to ensure that the embedded core circuit board 1 reaches the appropriate temperature. Through this flexible parameter adjustment, this conveying device can adapt to various types of embedded core circuit board 1 sintering processes, and has wide applicability and practicality.

[0034] Therefore, it is understandable that the embedded core circuit board conveying device 3 according to the first aspect of the present invention, firstly, by adopting a vertically arranged rotary mechanism 20, changes the sliding direction of the bearing mechanism 30 to vertical rotary sliding. This design can solve the problem of large footprint of existing serial operation equipment. In traditional equipment, due to the serial operation mode, the equipment needs to be arranged sequentially in the horizontal direction, resulting in a large amount of factory space being occupied. However, the vertical rotary design of this device significantly reduces the horizontal footprint of the equipment, effectively improving the utilization rate of factory space and reducing factory construction and maintenance costs.

[0035] Secondly, the vertical rotation path increases the sliding distance. In the sintering process of the embedded core circuit board 1, the heating and cooling processes are crucial to the quality and performance of the embedded core circuit board 1. Due to space and design limitations, existing equipment often has insufficient heating or cooling time, making it difficult to heat or cool the embedded core circuit board 1 to the appropriate temperature. However, this device, by increasing the rotation and sliding distance, provides more time for the temperature control board 32 to heat or cool, ensuring that the embedded core circuit board 1 reaches the required temperature during heating and slowly cools down to the appropriate temperature during cooling. This guarantees the sintering quality of the embedded core circuit board 1 and improves the reliability and stability of the product.

[0036] Furthermore, the supporting mechanism 30 includes a first receiving component 31, a temperature control plate 32, and a second receiving component 33, which are sequentially spaced along the rotation direction of the rotary mechanism 20 and gradually offset downwards. That is, the first receiving component 31, the temperature control plate 32, and the second receiving component 33 slowly tilt downwards along the rotation direction of the rotary mechanism 20. This design allows the embedded core circuit board 1 to transition smoothly during transport. Under its own weight, the embedded core circuit board 1 smoothly slides from the first receiving component 31 onto the temperature control plate 32 for heating or cooling, and then slides from the temperature control plate 32 onto the second receiving component 33, finally being transferred to the sintering device 4 via the second receiving component 33. This reduces the shaking and collision of the embedded core circuit board 1 during transport, lowering the risk of product damage. At the same time, it allows the embedded core circuit board 1 to be constantly heated or cooled on the temperature control plate 32 during sliding, thereby further improving production efficiency and product quality.

[0037] Reference Figures 1 to 4 In some embodiments of the present invention, the first receiving component 31 and the second receiving component 33 are both conveying rollers arranged at intervals. The bearing mechanism 30 also includes a first mounting rod 34 and a second mounting rod 35. The first mounting rod 34 is connected to the rotary mechanism 20. The first mounting rod 34 is used to install the first receiving component 31 and one side of the temperature control plate 32. The second mounting rod 35 is disposed on the other side of the temperature control plate 32. The second mounting rod 35 is used to install the second receiving component 33. The first receiving component 31 and the second receiving component 33 of other bearing mechanisms 30 are arranged at intervals.

[0038] In the specific implementation of the embedded core circuit board conveying device 3 in this embodiment, both the first receiving component 31 and the second receiving component 33 employ conveying rollers arranged at intervals. The carrying mechanism 30 is also provided with a first mounting rod 34 and a second mounting rod 35. The first mounting rod 34 is securely connected to the rotary mechanism 20, and the connection method is a hinged connection, ensuring that the first mounting rod 34 will not loosen during the operation of the rotary mechanism 20, and also ensuring that the first mounting rod 34 always maintains a slowly tilted state. The main function of the first mounting rod 34 is to install one side of the first receiving component 31 and the temperature control plate 32. During installation, a precise positioning device ensures the accuracy of the installation position of the first receiving component 31 and the temperature control plate 32, so that the embedded core circuit board 1 can be smoothly conveyed between the first receiving component 31 and the temperature control plate 32.

[0039] The second mounting rod 35 is located on the other side of the temperature control plate 32 and is also connected to the temperature control plate 32. The second mounting rod 35 is used to install the second receiving component 33. During installation, the relative positional relationship between the second receiving component 33 and the temperature control plate 32 is strictly controlled to ensure that the second receiving component 33 can accurately receive the embedded core circuit board 1 conveyed from the temperature control plate 32. In particular, the first receiving component 31 of each carrying mechanism 30 is arranged alternately with the second receiving components 33 of other carrying mechanisms 30. In actual operation, when two carrying mechanisms 30 meet during rotation, the first receiving component 31 of the conveyor roller arranged alternately with the second receiving component 33 of the conveyor roller arranged alternately due to this arrangement. Therefore, this arrangement can effectively shorten the horizontal distance between the two carrying mechanisms 30. For example, in traditional conveying devices, the horizontal arrangement of the carrying mechanisms 30 may be relatively loose, resulting in a large overall footprint of the equipment. This device, through its spaced arrangement, allows for a more compact distribution of the various supporting mechanisms 30 on the rotary mechanism 20. From an overall structural perspective, the horizontal space occupied by the rotary mechanism 20 is significantly reduced, thus achieving the goal of minimizing the equipment's footprint. This not only improves the utilization rate of factory space and reduces the company's site costs, but also makes the overall production layout more rational, providing more space for the arrangement of other production equipment and facilitating the optimized configuration of the production line.

[0040] Reference Figures 3 to 4 In some embodiments of the present invention, the bearing mechanism 30 further includes a first limiting component 36, which is disposed on the temperature control plate 32 and located on the side close to the second receiving component 33. The first limiting component 36 is used to limit the embedded core circuit board 1 on the temperature control plate 32.

[0041] In the embedded core circuit board conveying device 3 of this embodiment, the first limiting component 36 is disposed on the temperature control plate 32, specifically located near the second receiving component 33. When the embedded core circuit board 1 is placed on the temperature control plate 32 for heating or cooling, the first limiting component 36 functions as a limiting element. During the operation of the rotating mechanism 20 driving the carrying mechanism 30, since the first receiving component 31, the temperature control plate 32, and the second receiving component 33 of the carrying mechanism 30 are all inclined, the embedded core circuit board 1 tends to slide towards the second receiving component 33. At this time, the portion of the first limiting component 36 extending vertically along the temperature control plate 32 can block the sliding of the embedded core circuit board 1, ensuring that the embedded core circuit board 1 is always stably positioned in the designated heating or cooling area on the temperature control plate 32, thereby ensuring the smooth progress of the sintering process of the embedded core circuit board 1 and improving product quality and production efficiency. When the supporting mechanism 30 moves to the feeding station of the sintering device 4, the first limiting component 36 can be retracted to the vertically extended part of the temperature control plate 32 by the triggering device, so that the embedded core circuit board 1 can be smoothly slid onto the second receiving component 33, and the second receiving component 33 can place the embedded core circuit board 1 onto the feeding station of the sintering device 4.

[0042] Furthermore, referring to Figures 1 to 4 In some embodiments of the present invention, the first limiting component 36 may include a magnetic element, a reset elastic element and a magnetic element. The magnetic element is telescopically disposed on the upper end surface of the temperature control plate 32. A reset elastic element is disposed between the magnetic element and the magnetic element. The magnetic element is disposed on the lower end surface of the temperature control plate 32. The magnetic element and the magnetic element can generate a mutual attraction force.

[0043] In the support mechanism 30 of this device, the magnetic attraction element of the first limiting component 36 is a strong magnetic permanent magnet, which is telescopically mounted on the upper end face of the temperature control plate 32. The reset elastic element is a compression spring, which is disposed between the magnetic attraction element and the magnetic attracting component. When installing the compression spring, first install the magnetic attraction element into the mounting hole on the upper end face of the temperature control plate 32, then install the magnetic attracting component at the corresponding position on the lower end face of the temperature control plate 32, and then place the compression spring between the magnetic attraction element and the magnetic attracting component, so that one end of the compression spring contacts the bottom of the magnetic attraction element and the other end contacts the magnetic attracting component. The elastic coefficient of the compression spring must ensure that the magnetic attraction element can be quickly reset when the electromagnet is de-energized, and also provide sufficient elastic support force when the electromagnet is energized and attracts the magnetic attracting component. The magnetic attracting component can be an electromagnet that attracts the permanent magnet, which is disposed on the lower end face of the temperature control plate 32. The permanent magnet can be glued to the pre-designed position on the lower end face of the temperature control plate 32 using an adhesive, or it can be mechanically fixed, such as by processing a groove on the lower end face of the temperature control plate 32, embedding the permanent magnet into the groove and fixing it with a buckle.

[0044] In actual operation, when the embedded core circuit board 1 needs to be placed on the temperature control plate 32, the control system can control the electromagnetic switch to de-energize the magnetic attractor. At this time, under the action of the reset elastic element (compression spring), the magnetic attractor extends upwards from the surface of the temperature control plate 32, so that the embedded core circuit board 1 abuts against the magnetic attractor. When the carrying mechanism 30 transports the embedded core circuit board 1 to the feeding station of the sintering device 4, the control system can control the electromagnetic switch to energize the magnetic attractor. The magnetic attractor generates strong magnetism, and a mutual attraction force is generated between it and the permanent magnet (magnetic attractor) above. Under the action of this attraction force, the magnetic attractor retracts downwards, and at the same time the compression spring is compressed. After the magnetic attractor retracts, it releases the restriction on the embedded core circuit board 1, and the embedded core circuit board 1 on the upper surface of the temperature control plate 32 can slide along the inclined direction onto the second receiving component 33. When the supporting mechanism 30 slides past the feeding station of the sintering device 4, the control system can control the electromagnetic switch to de-energize the magnetic suction element. Under the elastic force of the reset elastic element, the magnetic suction element resets upward, facilitating the subsequent acceptance of new embedded core circuit boards 1 to be sintered. Through this design, the first limiting component 36 can reliably limit the embedded core circuit board 1, ensuring the stable progress of the sintering process. It should be noted that the electromagnetic switch can be set on the rotary mechanism 20 near the feeding station of the sintering device 4, or it can also be set at the feeding station of the sintering device 4. Therefore, whenever the supporting mechanism 30 moves to this position, the electromagnetic switch can automatically control the power supply to the magnetic suction element to control its extension and retraction.

[0045] Reference Figures 1 to 4 In some embodiments of the present invention, the rotary mechanism 20 includes a rotary component 21 and a second limiting component 22. The rotary component 21 is disposed on the frame 10, and the bearing mechanism 30 is connected to the rotary component 21. The second limiting component 22 is disposed on the frame 10 and located on one side of the rotary component 21. The bearing mechanism 30 is hinged to the second limiting component 22 through the rotary component 21. The bearing mechanism 30 is limited by the second limiting component 22 so that the bearing mechanism 30 maintains a horizontal sliding state when the rotary component 21 reciprocates.

[0046] In some embodiments, the rotary assembly 21 may employ a sprocket and chain drive system, with two sprockets mounted on the frame 10. One sprocket is the driving sprocket, driven by a motor, and the other is the driven sprocket, connected to the driving sprocket via a chain to form a closed transmission circuit. The second limiting assembly 22 is disposed on the frame 10 and located on one side of the rotary assembly 21. In some embodiments, it mainly includes a limiting rail and a limiting slider (not shown in the figure). The limiting rail is fixed to the frame 10, and its shape is designed according to the movement trajectory of the bearing mechanism 30, typically being straight or arc-shaped, to ensure that the bearing mechanism 30 can move along a predetermined path.

[0047] The limit slider is mounted on the support mechanism 30 and cooperates with the limit track. The limit slider is made of wear-resistant engineering plastic and has an embedded rolling bearing, which makes the limit slider slide more smoothly on the limit track and reduces energy loss. The support mechanism 30 is connected to the chain through a connector. At the same time, the limit slider is hinged to the support mechanism 30. This hinged method allows the support mechanism 30 to rotate slightly in the horizontal direction to accommodate minor deviations that may occur during the operation of the rotary assembly 21.

[0048] In actual operation, the motor drives the active sprocket to rotate, which in turn drives the driven sprocket to rotate via the chain, thus starting the entire rotary assembly 21. The carrying mechanism 30 moves with the chain, while the limiting slider slides on the limiting track. Due to the limiting effect of the second limiting component 22, the carrying mechanism 30 always maintains a horizontal sliding state when the rotary assembly 21 reciprocates, that is, the first receiving component 31, the temperature control plate 32, and the second receiving component 33 are always tilted. For example, when the chain drives the carrying mechanism 30 to move upward, the limiting slider slides upward along the limiting track, restricting the displacement of the carrying mechanism 30 in other directions and ensuring that it can only rise horizontally; when the chain drives the carrying mechanism 30 to move downward or rotate, the limiting slider also slides accordingly along the limiting track, ensuring that the carrying mechanism 30 always remains horizontal. This design allows the embedded core circuit board 1 to remain stably horizontal during transportation, avoiding the problem of the embedded core circuit board 1 falling off due to the rotation of the carrying mechanism 30, thereby improving the reliability and stability of the entire transportation device.

[0049] Furthermore, referring to Figures 3 to 4 In some embodiments of the present invention, the rotary assembly 21 includes two first sprockets 211 and a first chain 212. The two first sprockets 211 are disposed on the frame 10 and are spaced apart along the vertical direction of the frame 10. The first chain 212 can be wound around the two first sprockets 211. The bearing mechanism 30 is rotatably connected to the first chain 212. The first sprockets 211 are configured to drive the first chain 212 to rotate, so that the first chain 212 drives the bearing mechanism 30 to rotate and move in the vertical direction of the frame 10.

[0050] Specifically, in some embodiments, two first sprockets 211 are installed in the vertical direction of the frame 10. The first chain 212 is a standard roller chain that matches the first sprockets 211. Its pitch, roller diameter, and other parameters are precisely matched with the tooth profile and size of the first sprockets 211 to ensure good meshing transmission effect. The first chain 212 is wound around the two first sprockets 211 to form a closed transmission circuit. When installing the first chain 212, one end of the chain is first hung on one of the first sprockets 211, and then the sprocket is slowly rotated while the chain is gradually wound around the other first sprocket 211. Finally, the two ends of the chain are connected by a suitable connection method (such as a chain joint) to form a complete loop chain.

[0051] The bearing mechanism 30 is rotatably connected to the first chain 212 via a specific connector. The connector is a bearing-equipped shaft, with one end fixedly connected to the bearing mechanism 30 and the other end connected to a link of the first chain 212 via a bearing. This rotatable connection allows the bearing mechanism 30 to have a certain degree of rotational freedom as it moves with the first chain 212, thus better adapting to the movement trajectory of the rotary assembly 21 and reducing stress concentration and motion interference caused by rigid connections. Simultaneously, the second limiting component 22 connects to the connector, ensuring that the bearing mechanism 30 maintains a horizontal sliding state during the reciprocating rotation of the rotary assembly 21. This means that the first receiving component 31, the temperature control plate 32, and the second receiving component 33 are always in an inclined state.

[0052] In actual operation, one of the first sprockets 211 acts as the driving sprocket, driven by a motor. The motor is connected to the shaft of the driving sprocket via a coupling. When the driving sprocket rotates, the driven sprocket rotates through the meshing transmission between the first chain 212 and the sprocket, and the first chain 212 begins to circulate. Since the carrying mechanism 30 is connected to the first chain 212, the movement of the first chain 212 causes the carrying mechanism 30 to rotate vertically in the frame 10. For example, when the driving sprocket rotates clockwise, the first chain 212 drives the carrying mechanism 30 to move upward; when the driving sprocket rotates counterclockwise, the first chain 212 drives the carrying mechanism 30 to move downward. Through this rotary movement, the embedded core circuit board 1 is transported vertically, facilitating subsequent processing.

[0053] Furthermore, referring to Figures 3 to 4In some embodiments of the present invention, the second limiting component 22 includes a connecting rod assembly 221, two second sprockets 222 and a second chain 223. The two second sprockets 222 are disposed on the frame 10 and located on one side of the two first sprockets 211. The two second sprockets 222 are spaced apart along the vertical direction of the frame 10. The second chain 223 can be wound around the two second sprockets 222. The first chain 212 and the second chain 223 are connected by the connecting rod assembly 221. The bearing mechanism 30 is hinged to the rotating component 21 by the connecting rod assembly 221.

[0054] Specifically, on the frame 10, two second sprockets 222 are installed on one side of the two first sprockets 211. The second chain 223 is a standard roller chain that matches the second sprockets 222. Its specifications precisely correspond to the tooth profile and size of the second sprockets 222 to ensure good meshing. The second chain 223 is wound around the two second sprockets 222 to form a closed transmission circuit. The installation process is similar to that of the first chain 212. First, one end of the chain is hung on one of the second sprockets 222. The sprocket is slowly rotated to gradually wind the chain onto the other second sprocket 222. Finally, the two ends of the chain are connected into a loop using a chain connector.

[0055] The connecting rod assembly 221 is a key component connecting the first chain 212 and the second chain 223. In some embodiments, the connecting rod assembly 221 consists of a connecting rod and a hinge structure. The connecting rod is made of high-strength metal, such as stainless steel, to ensure sufficient strength and rigidity to bear the weight of the load-bearing mechanism 30 and the embedded core circuit board 1. The hinge structure is located at both ends of the connecting rod and is connected to the first chain 212 and the second chain 223 respectively. Specifically, a connecting seat with bearings is installed on the corresponding links of the first chain 212 and the second chain 223. The two ends of the connecting rod are connected to the connecting seat through hinge shafts. This hinge method allows the connecting rod assembly 221 to rotate freely within a certain angle range, thereby adapting to the angle changes generated during the movement of the rotating component 21.

[0056] The load-bearing mechanism 30 is hinged to the rotating assembly 21 via a connecting rod assembly 221. During actual operation, when the first sprocket 211 in the rotating assembly 21 drives the first chain 212 to rotate, the second chain 223 will also rotate synchronously because the first chain 212 is connected to the second chain 223 via the connecting rod assembly 221. The load-bearing mechanism 30 is connected to the first chain 212 and simultaneously establishes a connection with the second chain 223 via the connecting rod assembly 221. Under the combined action of the first chain 212 and the second chain 223, the connecting rod assembly 221 can effectively restrict the movement trajectory of the load-bearing mechanism 30, ensuring that it maintains a horizontal sliding state during vertical rotation of the frame 10. For example, when the first chain 212 drives the bearing mechanism 30 to move upward, the second chain 223 provides a horizontal constraint force to the bearing mechanism 30 through the connecting rod assembly 221 to prevent the bearing mechanism 30 from tilting or swaying; when the first chain 212 drives the bearing mechanism 30 to move downward or rotate, the connecting rod assembly 221 also plays a role in ensuring the horizontal stability of the bearing mechanism 30 and ensuring the safety and processing accuracy of the embedded core circuit board 1 during the transportation process.

[0057] Specifically, refer to Figures 3 to 4 In some embodiments of the present invention, the connecting rod assembly 221 includes a first hinge seat 2211 and a second hinge seat 2212. The first hinge seat 2211 is hinged to the first chain 212, and the bearing mechanism 30 is hinged to the first hinge seat 2211; the second hinge seat 2212 is hinged to the second chain 223, and the first hinge seat 2211 and the second hinge seat 2212 are fixedly connected by a connecting rod 2213. The first hinge seat 2211 is a key component connecting the first chain 212 and the bearing mechanism 30. The first hinge seat 2211 is typically designed to include a hinge hole for hinged to the first chain 212 and a connection structure for hinged to the bearing mechanism 30. When hinged with the first chain 212, a hinge shaft with a bearing is installed on the link of the first chain 212. The hinge hole of the first hinge seat 2211 is fitted onto the hinge shaft, allowing the first hinge seat 2211 to rotate freely around the hinge shaft, thereby adapting to the angle changes of the first chain 212 during movement. When hinged with the bearing mechanism 30, a corresponding connecting lug is provided on the bearing mechanism 30. The connecting structure of the first hinge seat 2211 is connected to the connecting lug of the bearing mechanism 30 by bolts or pins, realizing the hinge between the bearing mechanism 30 and the first hinge seat 2211. This hinge method allows the bearing mechanism 30 to have a certain degree of rotational freedom relative to the first hinge seat 2211, thereby reducing stress concentration during movement.

[0058] The structure and function of the second hinge seat 2212 are similar to those of the first hinge seat 2211. It also includes a hinge hole for hinged to the second chain 223 and a connection structure for connecting to the link 2213. When hinged to the second chain 223, the same hinge method as that used for the first hinge seat 2211 and the first chain 212 is adopted. A hinge shaft with a bearing is installed on the link of the second chain 223, and the hinge hole of the second hinge seat 2212 is fitted onto this hinge shaft, allowing the second hinge seat 2212 to rotate around the hinge shaft.

[0059] Link 2213 is a crucial component connecting the first hinge seat 2211 and the second hinge seat 2212. The length of link 2213 is precisely determined based on the design requirements of the entire conveying device and the distance between the first and second sprockets 222 to ensure effective restriction of the movement trajectory of the bearing mechanism 30 during the movement of the rotary assembly 21 and the second limiting assembly 22. Both ends of link 2213 are fixed to the first hinge seat 2211 and the second hinge seat 2212 via welding or bolts. In actual operation, when the first sprocket 211 in the rotary assembly 21 drives the first chain 212 to rotate, the first hinge seat 2211 moves along with the first chain 212. Simultaneously, since the second hinge seat 2212 is fixedly connected to the first hinge seat 2211 via link 2213, the second hinge seat 2212 also moves synchronously under the drive of the second chain 223. The bearing mechanism 30 is hinged to the first hinge seat 2211. Under the combined action of the first chain 212, the second chain 223, and the connecting rod assembly 221, the bearing mechanism 30 can maintain a horizontal sliding state when rotating in the vertical direction of the frame 10. For example, when the first chain 212 drives the first hinge seat 2211 to move upward, the second hinge seat 2212 will also move upward accordingly through the transmission action of the connecting rod 2213, while limiting the displacement of the bearing mechanism 30 in other directions to ensure its horizontal rise; when the first chain 212 drives the first hinge seat 2211 to move downward or rotate, the connecting rod assembly 221 also plays a role in ensuring the horizontal stability of the bearing mechanism 30, thereby ensuring the safety and processing accuracy of the embedded core circuit board 1 during the transportation process.

[0060] Reference Figures 1 to 2According to a second aspect embodiment of the embedded embedded circuit board sintering equipment of the present invention, the embedded embedded circuit board sintering equipment includes a feeding device 2, a sintering device 4, and an embedded embedded circuit board conveying device 3 as described in the first aspect embodiment. The feeding device 2, the embedded embedded circuit board conveying device 3, and the sintering device 4 are sequentially connected. The feeding device 2 is used to provide an embedded embedded circuit board 1, the embedded embedded circuit board conveying device 3 is used to convey the embedded embedded circuit board 1 to the sintering device 4 and heat the embedded embedded circuit board 1, and the sintering device 4 is used to sinter the embedded embedded circuit board 1. The embedded embedded circuit board sintering equipment includes a feeding device 2, a sintering device 4, and the embedded embedded circuit board conveying device 3 provided in the first aspect embodiment, and the feeding device 2, the embedded embedded circuit board conveying device 3, and the sintering device 4 are sequentially connected.

[0061] Specifically, the feeding device 2 is the starting point of the entire sintering process, used to stably and efficiently provide the embedded core circuit board 1. It is typically composed of a feeding mechanism and other structures. The feeding mechanism uses a servo motor-driven conveyor roller, which can smoothly transport the embedded core circuit board 1 one by one to the designated position. The embedded core circuit board conveying device 3 transports the embedded core circuit board 1 provided by the feeding device 2 to the sintering device 4. The sintering device 4 achieves precise sintering of the embedded core circuit board 1. In actual operation, the feeding device 2 first transports the embedded core circuit board 1 to the starting position of the embedded core circuit board conveying device 3. Under the coordinated action of the rotating component 21 and the second limiting component 22, the carrying mechanism 30 of the embedded core circuit board conveying device 3 smoothly transports the embedded core circuit board 1 upwards, while the carrying mechanism 30 preheats the embedded core circuit board 1. When the embedded core circuit board 1 is conveyed to the feeding station of the sintering device 4, it is fed into the sintering device 4, where it undergoes high-temperature sintering according to a preset sintering process. After sintering, the conveying device removes the embedded core circuit board 1 from the sintering device 4, completing the entire sintering process. Through the close cooperation and precise control of its components, the entire equipment achieves efficient and stable sintering of the embedded core circuit board 1.

[0062] Furthermore, referring to Figures 1 to 2 In some embodiments of the present invention, the embedded embedded circuit board sintering equipment further includes a feeding device 5, which is disposed downstream of the sintering device 4. An embedded embedded circuit board conveying device 3 is also disposed between the feeding device 5 and the sintering device 4. The embedded embedded circuit board conveying device 3 is used to convey the embedded embedded circuit board 1 from the sintering device 4 to the feeding device 5 and to cool the embedded embedded circuit board 1.

[0063] Based on the embedded core circuit board sintering equipment of the above embodiment, the added feeding device 5 is located downstream of the sintering device 4, and an additional embedded core circuit board conveying device 3 is configured between the sintering device 4 and the feeding device 5. The structure of the conveying device is the same as that provided in the aforementioned embodiment.

[0064] The unloading device 5 is used to stably and efficiently transport the embedded core circuit board 1. It is typically composed of a feeding mechanism and other structures. The feeding mechanism uses a servo motor-driven conveyor roller, which can smoothly transport the embedded core circuit boards 1 one by one from the embedded core circuit board conveying device 3 to the receiving bin or the next workstation. The newly added embedded core circuit board conveying device 3 transports the embedded core circuit boards 1 sintered by the sintering device 4 to the unloading device 5, and uses the carrying mechanism 30 to cool the embedded core circuit boards 1. In actual operation, after the sintering device 4 completes the sintering of the embedded core circuit boards 1, the newly added embedded core circuit board conveying device 3 starts immediately. Under the coordinated action of the rotating component 21 and the second limiting component 22, the carrying mechanism 30 smoothly removes and transports the sintered embedded core circuit boards 1 from the sintering device 4. During the conveying process, the temperature control plate 32 of the carrying mechanism 30 works simultaneously to rapidly cool the embedded core circuit board 1; when the embedded core circuit board 1 is conveyed to the position of the unloading device 5, it is unloaded by the feeding mechanism. Through the cooperation and control of various components, the entire equipment achieves efficient and stable operation of the embedded core circuit board 1 from sintering to cooling and unloading.

[0065] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0066] Of course, the present invention is not limited to the above-described embodiments. Those skilled in the art can make equivalent modifications or substitutions without departing from the spirit of the present invention. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. An embedded embedded circuit board conveying device for conveying embedded embedded circuit boards (1), characterized in that, include: Rack (10); A slewing mechanism (20), the slewing mechanism (20) being mounted on the frame (10), the slewing mechanism (20) being vertically arranged; and Multiple support mechanisms (30) are movably mounted on the rotary mechanism (20). The support mechanism (30) can reciprocate along the rotary path of the rotary mechanism (20). The support mechanism (30) is used to convey the embedded core circuit board (1) to the sintering device (4) or from the sintering device (4) to the unloading device (5). The supporting mechanism (30) includes a first receiving component (31), a temperature control plate (32), and a second receiving component (33). The first receiving component (31), the temperature control plate (32), and the second receiving component (33) are sequentially connected in the front-to-back direction. The first receiving component (31), the temperature control plate (32), and the second receiving component (33) gradually tilt downwards from the front. The first receiving component (31) is used to receive the embedded core circuit board (1), and in the supporting mechanism (30) During the reciprocating movement, the embedded core circuit board (1) on the first receiving component (31) slides down onto the temperature control plate (32) in an inclined direction under its own gravity. The temperature control plate (32) is used to support and heat or cool the embedded core circuit board (1). The second receiving component (33) is used to support the embedded core circuit board (1) on the temperature control plate (32) and transfer the embedded core circuit board (1) to the sintering device (4) or from the sintering device (4) to the unloading device (5).

2. The embedded core circuit board conveying device according to claim 1, characterized in that, The first receiving component (31) and the second receiving component (33) are both conveying rollers arranged at intervals. The bearing mechanism (30) also includes a first mounting rod (34) and a second mounting rod (35). The first mounting rod (34) is connected to the rotary mechanism (20). The first mounting rod (34) is used to install the first receiving component (31) and one side of the temperature control plate (32). The second mounting rod (35) is located on the other side of the temperature control plate (32). The second mounting rod (35) is used to install the second receiving component (33). The first receiving component (31) is arranged at intervals with the second receiving components (33) of the other bearing mechanisms (30).

3. The embedded core circuit board conveying device according to claim 1, characterized in that, The bearing mechanism (30) further includes a first limiting component (36), which is disposed on the temperature control plate (32) and located on the side close to the second receiving component (33). The first limiting component (36) is used to limit the embedded core circuit board (1) on the temperature control plate (32).

4. The embedded core circuit board conveying device according to claim 3, characterized in that, The first limiting component (36) includes a magnetic element, a reset elastic element and a magnetic element. The magnetic element is telescopically disposed on the upper surface of the temperature control plate (32). The reset elastic element is disposed between the magnetic element and the magnetic element. The magnetic element is disposed on the lower surface of the temperature control plate (32). The magnetic element and the magnetic element can generate a mutual attraction force.

5. The embedded core circuit board conveying device according to claim 1, characterized in that, The rotary mechanism (20) includes a rotary component (21) and a second limiting component (22). The rotary component (21) is disposed on the frame (10). The bearing mechanism (30) is connected to the rotary component (21). The second limiting component (22) is disposed on the frame (10) and located on one side of the rotary component (21). The bearing mechanism (30) is hinged to the second limiting component (22) through the rotary component (21). The bearing mechanism (30) is limited by the second limiting component (22) so that the bearing mechanism (30) maintains a horizontal sliding state when the rotary component (21) reciprocates.

6. The embedded core circuit board conveying device according to claim 5, characterized in that, The rotary assembly (21) includes two first sprockets (211) and a first chain (212). The two first sprockets (211) are disposed on the frame (10) and are spaced apart along the vertical direction of the frame (10). The first chain (212) can be wound around the two first sprockets (211). The bearing mechanism (30) is rotatably connected to the first chain (212). The first sprockets (211) are configured to drive the first chain (212) to rotate so that the first chain (212) drives the bearing mechanism (30) to rotate and move in the vertical direction of the frame (10).

7. The embedded core circuit board conveying device according to claim 6, characterized in that, The second limiting component (22) includes a connecting rod assembly (221), two second sprockets (222) and a second chain (223). The two second sprockets (222) are disposed on the frame (10) and located on one side of the two first sprockets (211). The two second sprockets (222) are spaced apart along the vertical direction of the frame (10). The second chain (223) can be wound around the two second sprockets (222). The first chain (212) and the second chain (223) are connected through the connecting rod assembly (221). The bearing mechanism (30) is hinged to the rotating component (21) through the connecting rod assembly (221).

8. The embedded core circuit board conveying device according to claim 7, characterized in that, The connecting rod assembly (221) includes: A first hinge seat (2211) is hinged to the first chain (212), and the bearing mechanism (30) is hinged to the first hinge seat (2211); and The second hinge seat (2212) is hinged to the second chain (223), and the first hinge seat (2211) and the second hinge seat (2212) are fixedly connected by a connecting rod (2213).

9. An embedded core circuit board sintering device, characterized in that, The device includes a feeding device (2), a sintering device (4), and an embedded core circuit board conveying device (3) as described in any one of claims 1 to 8. The feeding device (2), the embedded core circuit board conveying device (3), and the sintering device (4) are connected in sequence. The feeding device (2) is used to provide the embedded core circuit board (1). The embedded core circuit board conveying device (3) is used to convey the embedded core circuit board (1) to the sintering device (4) and heat the embedded core circuit board (1). The sintering device (4) is used to sinter the embedded core circuit board (1).

10. The embedded core circuit board sintering equipment according to claim 9, characterized in that, It also includes a feeding device (5), which is located downstream of the sintering device (4). An embedded core circuit board conveying device (3) is also provided between the feeding device (5) and the sintering device (4). The embedded core circuit board conveying device (3) is used to convey the embedded core circuit board (1) from the sintering device (4) to the feeding device (5) and cool the embedded core circuit board (1).

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