Embedded core circuit board conveying device and circuit board sintering equipment thereof

By using the vertical rotation design of the embedded core circuit board conveying device and the heating and cooling process of the temperature control board, the problems of large footprint and slow heating and cooling of traditional sintering equipment are solved, thus achieving high production efficiency and improved product quality.

CN122054557BActive Publication Date: 2026-08-04RAYTRONS ELECTRONIC (ZHUHAI) LTD
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Patent Information

Application Number
CN202610484354.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2026-04-14
Publication Date
2026-08-04
Estimated Expiration
2046-04-14

AI Technical Summary

Technical Problem

Traditional sintering equipment occupies a large area and has a slow heating and cooling rate, resulting in low production efficiency and making it difficult to meet the needs of large-scale production.

Method used

An embedded core circuit board conveying device is adopted, which utilizes a vertically set rotary mechanism and a bearing mechanism, including a first receiving component, a temperature control plate and a second receiving component, to realize the vertical rotation and sliding of the circuit board. Through the heating or cooling process of the temperature control plate, the equipment footprint is reduced and the heating and cooling rate is increased.

Benefits of technology

It effectively reduces equipment footprint, increases heating and cooling rates, reduces the risk of product damage, and improves production efficiency and product quality.

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Abstract

The application discloses an embedded core-in-circuit board conveying device and a circuit board sintering equipment thereof and belongs to the technical field of circuit board sintering equipment. The embedded core-in-circuit board conveying device comprises a rack, a rotating mechanism and a plurality of bearing mechanisms, and the rotating mechanism is vertically arranged. The bearing mechanism can reciprocate along the rotating path of the rotating mechanism and is used for conveying the embedded core-in-circuit board into the sintering device. By adopting the vertically arranged rotating mechanism, the sliding direction of the bearing mechanism is changed to vertical direction rotation sliding, and the problem that the existing serial operation equipment occupies a large area can be solved. In addition, the vertical direction rotation sliding increases the sliding distance, provides more sufficient time for the heating or cooling process, and can ensure that the circuit board fully reaches the required temperature in the heating process.
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