Photovoltaic module and manufacturing method and manufacturing equipment thereof

Abstract

The embodiment of the invention relates to the photovoltaic field, and provides a photovoltaic module and a manufacturing method and manufacturing equipment thereof, and the manufacturing method of the photovoltaic module comprises the steps: providing a solar cell which comprises a substrate and a main grid located on the substrate, and the main grid contains an organic matter; performing a laser process which adopts a laser beam to irradiate the main grid so as to activate the main grid; carrying out a series welding process, and electrically connecting the welding strip with the main grids of the at least two solar cells by the series welding process to form a cell string; forming a packaging adhesive film, wherein the packaging adhesive film is used for covering the surface of the battery string; the cover plate is used for covering the surface, away from the battery string, of the packaging adhesive film. And the reliability of the formed photovoltaic module can be improved.

Description

Technical Field

[0001] This disclosure relates to the photovoltaic field, and in particular to a photovoltaic module and its manufacturing method and equipment. Background Technology

[0002] Currently, with the gradual depletion of fossil fuels, solar cells are becoming increasingly widely used as a new energy alternative. Solar cells are devices that convert solar energy into electrical energy. They utilize the photovoltaic principle to generate charge carriers, which are then extracted using electrodes, thus facilitating the efficient use of electrical energy.

[0003] Photovoltaic modules are the core components of solar power generation systems. They convert light energy into electrical energy by connecting individual solar cells in series. Currently, the manufacturing process of photovoltaic modules typically includes the welding and lamination of solar cells.

[0004] It is currently necessary to improve the reliability of the photovoltaic modules being manufactured. Summary of the Invention

[0005] This disclosure provides a photovoltaic module and its manufacturing method and equipment, which can at least improve the reliability of the formed photovoltaic module.

[0006] This disclosure provides a method for manufacturing a photovoltaic module, comprising: providing a solar cell, the solar cell comprising: a substrate and a main grid located on the substrate, the main grid containing organic matter; performing a laser process, the laser process employing a laser beam to irradiate the main grid to activate the main grid; performing a string bonding process, the string bonding process electrically connecting solder strips to the main grids of at least two of the solar cells to form a cell string; forming an encapsulating film, the encapsulating film being used to cover the surface of the cell string; and forming a cover plate, the cover plate being used to cover the surface of the encapsulating film away from the cell string.

[0007] Optionally, the process parameters of the laser process include: laser wavelength of 10nm~340nm and irradiation time of 5s~60s.

[0008] Optionally, the laser process further includes: monitoring the surface temperature of the main gate irradiated by the laser beam, and stopping irradiation when the surface temperature of the main gate exceeds 300°C.

[0009] Optionally, the solar cell includes: two edge regions arranged along a first direction and a central region located between the edge regions, the main grid extending along the first direction, and the laser process irradiating the main grid located in the central region for a longer time than irradiating the main grid located in the edge regions.

[0010] Optionally, before electrically connecting the solder strip to the main gate, the method further includes forming a flux layer that covers the surface of the main gate.

[0011] This disclosure also provides a photovoltaic module formed using the photovoltaic module manufacturing method described above.

[0012] This disclosure also provides a photovoltaic module manufacturing apparatus, comprising: a support platform for supporting solar cells, the solar cells including: a substrate and a main grid located on the substrate; a laser emitter for providing a laser beam to the main grid to activate polar groups on the surface of the main grid; a stringing device for forming a cell string, the cell string including a plurality of the solar cells and solder ribbons electrically connected to the main grids of at least two of the solar cells; a first encapsulation device for forming an encapsulating film on the surface of the cell string; and a second encapsulation device for forming a cover plate on the surface of the encapsulating film away from the cell string.

[0013] Optionally, it also includes: a deflection device located in the illumination path of the laser beam, for receiving the laser beam emitted by the laser emitter and controlling the laser beam emission deflection to scan the main grid.

[0014] Optionally, the deflection device includes a galvanometer, which is configured to be rotatable, wherein the laser beam has a different angle with the surface of the galvanometer, and the deflected laser beam illuminates different positions of the main grid.

[0015] Optionally, the angular rate of rotation of the galvanometer is 1° / s to 20° / s.

[0016] Optionally, it also includes a scattering device located on the illumination path of the laser beam to disperse the laser beam, wherein the length of the dispersed laser beam is equal to the length of the main grid.

[0017] The technical solution provided in this disclosure has at least the following advantages: On the one hand, the main grid of the solar cell uses a material containing organic matter, thereby realizing a low-temperature main grid process. The low-temperature main grid process can reduce the cost of the main grid and avoid damage to the solar cell caused by high temperature, reducing problems such as microcracks or breakage of the solar cell. On the other hand, in conjunction with the low-temperature main grid process, before the main grid is connected to the solder ribbon, the main grid is activated by laser technology, thereby breaking the dangling bonds on the surface of the paste, which facilitates the subsequent welding process between the main grid and the solder ribbon, improves the wettability of the main grid, and facilitates the connection between the main grid and the solder ribbon. Attached Figure Description

[0018] One or more embodiments are illustrated by way of example with corresponding pictures in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Unless otherwise stated, the pictures in the accompanying drawings do not constitute a limitation on scale. In order to more clearly illustrate the technical solutions in the embodiments of this disclosure or the conventional technology, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figures 1 to 3 This is a schematic diagram of the structure corresponding to each step of a method for manufacturing a photovoltaic module according to an embodiment of the present disclosure; Figure 4 This is a schematic diagram of the structure of a photovoltaic module manufacturing equipment provided in one embodiment of the present disclosure. Detailed Implementation

[0020] Currently, pure metal materials are typically used to form the main grid on the surface of solar cells. Pure metal materials need to be welded at high temperatures, but high-temperature welding of the main grid increases the risk of microcracks in the solar cells and may also cause abnormalities in the inner film layer of the solar cells, as well as warping problems.

[0021] In this embodiment of the disclosure: on the one hand, the main grid of the solar cell uses a material containing organic matter to achieve a low-temperature main grid process. The low-temperature main grid process can reduce the cost of the main grid and avoid damage to the solar cell caused by high temperature, thereby reducing problems such as microcracks or breakage of the solar cell. On the other hand, in conjunction with the low-temperature main grid process, before the main grid is connected to the solder ribbon, the main grid is activated by laser technology to break the dangling bonds on the surface of the paste, thereby improving the wettability of the main grid during the subsequent welding process between the main grid and the solder ribbon, and facilitating the connection between the main grid and the solder ribbon.

[0022] In the description of the embodiments of this disclosure, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary or secondary relationship of the indicated technical features. In the description of the embodiments of this disclosure, "a plurality of" means two or more, unless otherwise explicitly defined.

[0023] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this disclosure. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0024] In the description of the embodiments of this disclosure, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0025] In the description of embodiments of this disclosure, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0026] In the description of the embodiments of this disclosure, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this disclosure.

[0027] In the description of the embodiments of this disclosure, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this disclosure according to the specific circumstances.

[0028] In the accompanying drawings, the thickness of layers, films, panels, regions, etc., is enlarged for clarity. Throughout the specification, the same reference numerals denote the same elements. It should be understood that when referring to an element (e.g., a layer, film, region, or substrate) as being "on" another element, it may be directly on that other element, or intermediate elements may be present. Conversely, when referring to an element as being "directly on" another element, it indicates that no intermediate elements are present.

[0029] In the description of embodiments of this disclosure, when a component "includes" another component, other components are not excluded unless otherwise stated, and may be further included. Furthermore, when a component such as a layer, film, region, or plate is referred to as being "on / located" on another component, it can be "directly" on the other component (i.e., located on the surface of the other component with no other components between them), or another component may be present therein. Additionally, when a component such as a layer, film, region, or plate is "directly located" on another component, or when a component such as a layer, film, region, or plate is located on the surface of another component, it indicates that no other components are located therein.

[0030] The terminology used in the description of the various embodiments herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used in the description and claims of the various embodiments described, the term "component" is also intended to include the plural form unless the context clearly indicates otherwise. Components include layers, films, regions, or plates, etc.

[0031] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the embodiments of this disclosure to facilitate a better understanding of the disclosure. However, the technical solutions claimed in this disclosure can be implemented even without these technical details and various variations and modifications based on the following embodiments.

[0032] refer to Figures 1 to 3 , Figures 1 to 3 This is a schematic diagram showing the structural steps corresponding to each step of a photovoltaic module manufacturing method according to an embodiment of the present disclosure, wherein... Figure 1 This is a schematic diagram of the structure of a solar cell according to an embodiment of the present disclosure. Figure 2 This is a schematic diagram of a structure for forming a battery string according to an embodiment of the present disclosure. Figure 3 This is a schematic diagram of the structure for forming a photovoltaic module according to an embodiment of the present disclosure.

[0033] In some embodiments, a method for manufacturing a photovoltaic module may include providing a solar cell 100, the solar cell 100 including a substrate 110 and a main grid 120 located on the substrate 110, the main grid 120 containing organic matter.

[0034] The manufacturing method of photovoltaic modules may also include: performing a laser process, in which a laser beam is used to irradiate the main grid 120 to activate the main grid 120.

[0035] The manufacturing method of photovoltaic modules may also include: performing a stringing process, in which the solder strip 200 is electrically connected to the main grid 120 of at least two solar cells 100 to form a cell string 20.

[0036] The method of manufacturing photovoltaic modules may also include: forming an encapsulating film 21, which is used to cover the surface of the cell string 20.

[0037] The method of manufacturing a photovoltaic module may also include: forming a cover plate 22, which is used to cover the surface of the encapsulating film 21 away from the cell string 20.

[0038] In this embodiment of the disclosure: On the one hand, the main grid 120 of the solar cell 100 uses a material containing organic matter to achieve a low-temperature main grid 120 process. The low-temperature main grid 120 process can reduce the cost of the main grid 120 and avoid damage to the solar cell 100 caused by high temperature, thereby reducing problems such as microcracks or breakage of the solar cell 100. On the other hand, in conjunction with the low-temperature main grid 120 process, before the main grid 120 is serially welded to the solder ribbon 200, the main grid 120 is activated by laser process to break the dangling bonds on the surface of the paste, thereby improving the wettability of the main grid 120 during the subsequent welding process between the main grid 120 and the solder ribbon 200, and facilitating the connection between the main grid 120 and the solder ribbon 200.

[0039] In some embodiments, the substrate 110 may be a structure in which the remaining film layers of the solar cell 100 are formed. Taking the solar cell 100 as a TOPcon (Tunnel Oxide Passivated Contact) cell as an example, the substrate 110 may include: a substrate, a tunneling layer, a doped conductive layer and a passivation layer located on one side of the substrate, an emitter and a passivation layer located on the other side of the substrate, and the main grid 120 is electrically connected to the doped conductive layer or the emitter.

[0040] It should be noted that the electrical connection here actually refers to the fact that both the main grid 120 and the doped conductive layer are made of conductive materials, and the main grid 120 and the doped conductive layer are in direct contact or connected through other conductive materials. Therefore, when the solar cell 100 is in the power generation state, there is an electrical connection between the main grid 120 and the doped conductive layer.

[0041] In some embodiments, the laser process may involve using a laser beam to irradiate the main gate 120, thereby breaking the dangling bonds on the surface of the main gate 120, thereby improving the wettability of the main gate 120 in a short time, facilitating the formation of a good connection between the solder ribbon 200 and the main gate 120, and thus improving the welding process.

[0042] Understandably, when the main gate 120 contains organic matter, the metal in the solder ribbon 200, after becoming molten, cannot spread and wet the main gate 120, leading to a decrease in the reliability of the connection between the main gate 120 and the solder ribbon 200. The connection between the solder ribbon 200 and the main gate 120 actually utilizes the strong wettability of liquid or molten metal to achieve mutual connection and alloy formation between the solder ribbon 200 and the main gate 120 through liquid phase penetration.

[0043] This embodiment improves the wettability of the main gate 120 in a short time, thereby facilitating the liquid phase penetration of the solder ribbon 200, which in turn facilitates the interconnection between the main gate 120 and the solder ribbon 200, and further improves the reliability of the connection between the main gate 120 and the solder ribbon 200.

[0044] In some embodiments, the process parameters of the laser process include: the laser wavelength can be 10nm~340nm, for example, the wavelength can be 315nm~340nm, 280nm~315nm, 100nm~280nm or 10nm~100nm, etc., and can also be 10nm, 30nm, 50nm, 100nm, 150nm, 200nm, 280nm or 340nm, etc.; the irradiation time can be 5s~60s, for example, 5s~10s, 10s~20s, 20s~30s, 30s~40s, 40s~50s or 50s~60s, etc., and can also be 5s, 10s, 20s, 30s, 40s, 50s or 60s, etc.

[0045] Regarding the laser wavelength, the laser wavelength is set to 10nm~340nm, that is, the laser is set to ultraviolet light. When the ultraviolet light irradiates the surface of the main gate 120, it will undergo a photosensitive oxidation reaction with organic matter to generate volatile substances (such as carbon dioxide or carbon monoxide, etc.), thereby activating the organic matter in the main gate 120 and activating the polar groups (hydroxyl or carbonyl, etc.) on the surface of the main gate 120, thereby increasing the hydrophilicity and adhesion strength of the surface of the main gate 120, and further improving the wettability of the main gate 120, which further facilitates the connection between the main gate 120 and the solder ribbon 200.

[0046] Regarding the irradiation time, the longer the irradiation time, the better the effect of activating the polar groups on the surface of the main grid 120, which can further improve the reliability of the connection between the main grid 120 and the solder ribbon 200. However, if the irradiation time is too long, the laser irradiation process will also generate heat on the main grid 120. When the irradiation time is too long, the heat accumulation on the main grid 120 will be serious, affecting the reliability of the solar cell 100. Therefore, the irradiation time is set to 5s~60s to improve the wettability of the main grid 120 while avoiding affecting the reliability of the solar cell 100.

[0047] In some embodiments, the laser process can also serve as a preheating process, thereby preventing a sudden temperature change on the surface of the main grid 120 during subsequent stringing processes, thus improving the reliability of the formed battery string 20.

[0048] In some embodiments, the laser process further includes: monitoring the surface temperature of the main grid 120 irradiated by the laser beam, and stopping the irradiation when the surface temperature of the main grid 120 exceeds 300°C. By detecting the surface temperature of the main grid 120, on the one hand, the irradiation effect of the laser process on the main grid 120 can be judged by the surface temperature of the main grid 120. If the temperature is too low, it indicates that the irradiation time of the laser process is too short, which may lead to poor activation of the organic components of the slurry. In this case, the activation effect on the main grid 120 can be improved by extending the irradiation time of the laser beam. On the other hand, if the surface temperature of the main grid 120 exceeds 300°C, it indicates that the irradiation time of the laser beam is too long, resulting in an excessively high surface temperature of the main grid 120. In order to avoid further negative impact on the solar cell 100, the laser process is stopped, thereby preventing damage to the solar cell 100.

[0049] In some embodiments, the scanning speed of the laser process can also be controlled according to the surface temperature of the main grid 120. For example, when the surface temperature of the main grid 120 is detected to be higher than 200°C, the scanning speed of the laser beam can be increased. The increase in scanning speed can reduce the process time of the laser process on the one hand, and reduce the accumulation of heat at the location with a temperature higher than 200°C on the other hand, thereby avoiding damage to the solar cell 100. When the surface temperature of the main grid 120 is detected to be lower than 100°C, the scanning speed of the laser beam can be reduced. The reduction in scanning speed can increase the time that the laser beam irradiates the same location, thereby facilitating the activation of the location with a temperature lower than 100°C.

[0050] In some embodiments, the solar cell 100 includes two edge regions arranged along a first direction and a central region located between the edge regions. A main grid 120 extends along the first direction, and the laser process irradiates the main grid 120 located in the central region for a longer period than the laser process irradiates the main grid 120 located in the edge regions. It is understood that increasing the irradiation time of the main grid 120 located in the central region can further improve the connection reliability between the main grid 120 located in the central region and the solder ribbon 200. The main grid 120 located in the central region plays a more crucial role in transporting charge carriers. Therefore, improving the connection reliability between the main grid 120 located in the central region and the solder ribbon 200 facilitates the transport of charge carriers after the formation of the cell string 20, further improving the reliability of the formation of the cell string 20.

[0051] In some embodiments, the division between the edge area and the center area can be directly based on the area of ​​the solar cell 100. For example, 10% to 20% of the area of ​​the solar cell 100 near the edge can be regarded as the edge area, and the remaining area can be regarded as the center area.

[0052] In some other embodiments, the solar cell 100 further includes sub-grids 130, which are arranged at intervals along a first direction. The main grid 120 is electrically connected to the multiple sub-grids 130 arranged at intervals along the first direction. The division between the edge region and the center region can also be based on the sub-grid 130 located at the outermost edge in the first direction as the dividing line, with the part outside the outermost sub-grid 130 being regarded as the edge region and the remaining area as the center region. Alternatively, the area where 1 to 5 sub-grids 130 are located near the edge of the solar cell 100 can be regarded as the edge region and the remaining area as the center region.

[0053] In some embodiments, before electrically connecting the solder ribbon 200 to the main grid 120, the method further includes forming a flux layer (not shown) that covers the surface of the main grid 120. Forming the flux layer can further improve the reliability of the connection between the solder ribbon 200 and the main grid 120, thereby further improving the reliability of the formed battery string 20.

[0054] In some embodiments, the laser process can be performed after the flux layer is formed, which can further improve the reliability of the connection layer between the flux layer and the main gate 120, and further improve the connection reliability between the main gate 120, the flux layer and the solder strip 200.

[0055] In some embodiments, the flux layer may be a tin layer.

[0056] In some embodiments, the encapsulating film 21 includes a first encapsulating layer and a second encapsulating layer. The first encapsulating layer covers one of the front or back sides of the solar cell, and the second encapsulating layer covers the other of the front or back sides of the solar cell. Specifically, at least one of the first encapsulating layer or the second encapsulating layer can be an organic encapsulating film such as polyvinyl butyral (PVB) film, ethylene-vinyl acetate copolymer (EVA) film, polyvinyl octene coelastomer (POE) film, or polyethylene terephthalate (PET) film.

[0057] It is worth noting that the first encapsulation layer and the second encapsulation layer still have a dividing line before lamination. After lamination, the photovoltaic module will no longer have the concept of a first encapsulation layer and a second encapsulation layer. That is, the first encapsulation layer and the second encapsulation layer have formed an integral encapsulation film 21.

[0058] In some embodiments, the cover plate 22 can be a glass cover plate, a plastic cover plate, or other cover plate with light-transmitting function. Specifically, the surface of the cover plate 22 facing the encapsulating film 21 can be an uneven surface, thereby increasing the utilization rate of incident light. The cover plate 22 includes a first cover plate and a second cover plate, the first cover plate being opposite to the first encapsulation layer and the second cover plate being opposite to the second encapsulation layer; or the first cover plate being opposite to one side of the solar cell 100 and the second cover plate being opposite to the other side of the solar cell 100.

[0059] In this embodiment of the disclosure: On the one hand, the main grid 120 of the solar cell 100 uses a material containing organic matter to achieve a low-temperature main grid 120 process. The low-temperature main grid 120 process can reduce the cost of the main grid 120 and avoid damage to the solar cell 100 caused by high temperature, thereby reducing problems such as microcracks or breakage of the solar cell 100. On the other hand, in conjunction with the low-temperature main grid 120 process, before the main grid 120 is serially welded to the solder ribbon 200, the main grid 120 is activated by laser process to break the dangling bonds on the surface of the paste, thereby improving the wettability of the main grid 120 during the subsequent welding process between the main grid 120 and the solder ribbon 200, and facilitating the connection between the main grid 120 and the solder ribbon 200.

[0060] This disclosure also provides a photovoltaic module that can be formed using the above-described photovoltaic module manufacturing method. The following will describe another photovoltaic module provided in this disclosure. It should be noted that the same or corresponding parts as those in the above embodiments can be referred to the above embodiments, and will not be repeated hereafter.

[0061] In some embodiments, the solar cell includes, but is not limited to, one or any combination of PERC (Passivated Emitter Rear Cell), IBC (Interdigitated Back Contact), TOPCon (Tunnel Oxide Passivated Contact), HIT / HJT (Heterojunction Technology), thin-film solar cells, and tandem solar cells. Thin-film solar cells include, but are not limited to, perovskite thin-film solar cells, copper indium selenide (CIGS) thin-film solar cells, gallium arsenide (GaAs) thin-film solar cells, and cadmium sulfide (CdS) thin-film solar cells. Tandem solar cells include, but are not limited to, perovskite cells stacked with crystalline silicon cells, perovskite cells stacked with perovskite cells, and perovskite cells stacked with thin-film cells.

[0062] Solar cells can be monocrystalline silicon solar cells, polycrystalline silicon solar cells, amorphous silicon solar cells, or multi-component compound solar cells. Specifically, multi-component compound solar cells can be cadmium sulfide solar cells, gallium arsenide solar cells, copper indium selenide solar cells, or perovskite solar cells. Furthermore, solar cells can be whole cells or sliced ​​cells; sliced ​​cells refer to cells formed from a single, complete cell through a cutting process.

[0063] Another embodiment of this disclosure also provides a photovoltaic module manufacturing equipment, which can be used in the above-described photovoltaic module manufacturing method, or for manufacturing the above-described photovoltaic module. The photovoltaic module manufacturing equipment provided in another embodiment of this disclosure will be described below. It should be noted that the same or corresponding parts as in the above embodiments can be referred to the above embodiments, and will not be repeated below.

[0064] refer to Figure 4 , Figure 4 This is a schematic diagram of the structure of a photovoltaic module manufacturing equipment provided in one embodiment of the present disclosure.

[0065] In some embodiments, the photovoltaic module manufacturing equipment may include: a support platform 300 for supporting solar cell 100, the solar cell 100 including: a substrate 110 and a main grid 120 located on the substrate 110.

[0066] The photovoltaic module manufacturing equipment may also include: a laser emitter 301, which provides a laser beam to the main grid 120 to activate polar groups on the surface of the main grid 120.

[0067] The photovoltaic module manufacturing equipment may also include: a stringing device 302 for forming a cell string, the cell string including a plurality of solar cells 100 and a solder strip 200 electrically connected to a main grid 120 of at least two solar cells 100.

[0068] The photovoltaic module manufacturing equipment may also include: a first encapsulation device 303, which forms an encapsulation film on the surface of the cell string.

[0069] The photovoltaic module manufacturing equipment may also include: a second encapsulation device 304, which forms a cover plate on the surface of the encapsulation film away from the cell string.

[0070] The support platform 300 has a support surface that can be used to place the solar cell 100. The support platform 300 can also have an adsorption capacity. When the solar cell 100 is placed on the support surface, it can be prevented from moving by adsorption, which facilitates the entire photovoltaic module manufacturing process and prevents the solar cell 100 from shifting during the formation of the photovoltaic module.

[0071] In some embodiments, the support platform 300 may have a temperature control function, which can adjust the surface temperature of the support surface as needed so that the solar cell 100 placed on the support surface has an initial temperature, which can facilitate subsequent laser irradiation and welding between the solder ribbon 200 and the main grid 120.

[0072] The laser emitter 301 can adjust the wavelength and time of the emitted laser according to requirements. For example, when a wavelength of 300nm is required, a laser with a wavelength of 300nm can be emitted directly to simultaneously irradiate the main gate 120, which can facilitate the activation of organic matter in the main gate 120 and improve the reliability of subsequent welding between the main gate 120 and the solder ribbon 200.

[0073] In some embodiments, the laser emitter 301 can be rotated and moved, thereby controlling the emitted laser to scan the main grid 120 along the extension direction of the main grid 120.

[0074] In some embodiments, the photovoltaic module manufacturing equipment may further include a deflection device 305, which is located on the irradiation path of the laser beam and is used to receive the laser beam emitted by the laser emitter 301 and control the laser beam emission deflection to scan the main grid 120. That is, the laser emitter 301 and the deflection device 305 cooperate to scan the entire main grid 120. By adjusting the irradiation path of the laser beam through the deflection device 305, the position of the laser beam irradiation is adjusted, thereby utilizing the cooperation between the laser emitter 301 and the deflection device 305 to irradiate the entire main grid 120, thereby improving the reliability of the connection between the entire main grid 120 and the solder ribbon 200.

[0075] In some embodiments, the deflection device 305 includes a galvanometer 315, which is rotatable, wherein the laser beam has different angles with the surface of the galvanometer 315, and the deflected laser beam illuminates different positions of the main grid 120. That is, when the angle between the laser beam and the galvanometer 315 is different, the laser beam illuminating the main grid 120 is at different positions, and the laser beam moves accordingly as the galvanometer 315 rotates to complete the scanning process of the entire main grid 120.

[0076] Compared to rotating the laser emitter 301, controlling the movement of the galvanometer 315 is easier and can reduce the cost of controlling the movement, as well as the possibility of damage to the laser emitter 301.

[0077] In some embodiments, the angular rate of rotation of the galvanometer 315 is 1° / s to 20° / s, for example, it can be 1° / s to 5° / s, 5° / s to 10° / s, 10° / s to 15° / s, or 15° / s to 20° / s, etc., or it can be 1° / s, 5° / s, 8° / s, 10° / s, 13° / s, 15° / s, or 20° / s, etc. The faster the angular rate of rotation of the galvanometer 315, the shorter the time required to scan the entire main grid 120, and the shorter the overall process time, which can reduce the overall manufacturing cost of the photovoltaic module. At the same time, if the angular rate of rotation of the galvanometer 315 is too fast, the laser scanning process will be completed before the main grid 120 is fully activated, resulting in poor activation effect of the main grid 120. Therefore, setting the angular rate of rotation of the galvanometer 315 to 1° / s to 20° / s controls the process time while considering the activation effect.

[0078] Understandably, if the angular rate of rotation of the galvanometer 315 is less than 1° / s, on the one hand, the laser will irradiate the same position for too long, resulting in heat accumulation, which may cause thermal damage to the solar cell 100. On the other hand, if the irradiation time at the same position is too long, the heat from the previously irradiated position will dissipate and cool down when other positions are irradiated later, resulting in a weakening of the activation effect of the previously irradiated position.

[0079] In some embodiments, the photovoltaic module manufacturing equipment may further include a scattering device located on the irradiation path of the laser beam to disperse the laser beam, wherein the length of the dispersed laser beam is equal to the length of the main grid 120. In other words, the scattering device changes the laser beam irradiation process from point irradiation to line irradiation, which can improve the efficiency of the laser irradiation process and make the laser received at various points of the main grid 120 relatively uniform.

[0080] Compared to the deflection device 305, the scattering device provides more uniform and faster illumination, while the deflection device 305 provides more concentrated energy and better activates the main grid 120.

[0081] In some embodiments, the solar cell 100 irradiated by the laser beam can be moved to the stringing device 302 by a moving device, and the stringing device 302 performs the welding.

[0082] In some embodiments, the string welding device 302 may include an infrared welding machine, a laser welding machine, or a thermal contact welding machine, etc.

[0083] In some embodiments, the formed battery string can be moved onto the first encapsulation device 303 by a moving device, and the first encapsulation device 303 forms an encapsulation film on the surface of the battery string.

[0084] The first encapsulation device 303 may include two parts: one part is an encapsulation film transfer device, which is used to form an encapsulation film on the surface of the battery string; the other part is a laminator, which is used to laminate the encapsulation film on the surface of the battery string so that the encapsulation films located on both sides of the battery string melt and bond together.

[0085] In some embodiments, the battery string with the encapsulating film formed can be moved to the second encapsulation device 304 by a moving device, and the second encapsulation device 304 forms a cover plate on the surface of the battery string.

[0086] The second encapsulation device 304 may include two parts: one part is an encapsulation film transfer device, which is used to cover the surface of the battery string with a cover plate; the other part is a laminator, which is used to laminate the cover plate on the surface of the encapsulation film so that the cover plate and the encapsulation film are bonded together.

[0087] Meanwhile, vacuuming can be performed during the lamination process to prevent residual air from remaining inside the photovoltaic module.

[0088] In some embodiments, the first packaging device 303 and the second packaging device 304 can be an integrated device, and the laminated cover plate and the laminated packaging glass can be processed in the same step.

[0089] Those skilled in the art will understand that the above embodiments are specific examples of implementing this disclosure, and in practical applications, various changes in form and detail may be made without departing from the spirit and scope of the embodiments of this disclosure. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the embodiments of this disclosure; therefore, the scope of protection of the embodiments of this disclosure should be determined by the scope defined in the claims.

Claims

1. A method for manufacturing a photovoltaic module, characterized in that, include: A solar cell is provided, the solar cell comprising: a substrate and a main grid located on the substrate, the main grid containing organic matter; A laser process is performed, wherein a laser beam is used to irradiate the main gate to activate the main gate; A stringing process is performed, wherein the solder strip is electrically connected to the main grid of at least two of the solar cells to form a cell string; An encapsulating film is formed to cover the surface of the battery string; A cover plate is formed to cover the surface of the encapsulating film away from the battery string.

2. The method for manufacturing a photovoltaic module according to claim 1, characterized in that, The process parameters of the laser process include: laser wavelength of 10nm~340nm and irradiation time of 5s~60s.

3. The method for manufacturing a photovoltaic module according to claim 1, characterized in that, The laser process also includes: monitoring the surface temperature of the main gate irradiated by the laser beam, and stopping irradiation when the surface temperature of the main gate exceeds 300°C.

4. The method for manufacturing a photovoltaic module according to claim 1, characterized in that, The solar cell includes two edge regions arranged along a first direction and a central region located between the edge regions. The main grid extends along the first direction, and the laser process irradiates the main grid located in the central region for a longer time than the laser process irradiates the main grid located in the edge regions.

5. The method for manufacturing a photovoltaic module according to claim 1, characterized in that, Before electrically connecting the solder strip to the main gate, the method further includes forming a flux layer that covers the surface of the main gate.

6. A photovoltaic module, characterized in that, include: It is formed using the photovoltaic module manufacturing method as described in any one of claims 1 to 5.

7. A photovoltaic module manufacturing equipment, characterized in that, include: A support platform for supporting solar cells, the solar cells comprising: a substrate and a main grid located on the substrate; A laser emitter for providing a laser beam to the main gate to activate polar groups on the surface of the main gate; A stringing apparatus for forming a battery string, the battery string including a plurality of said solar cells and solder strips electrically connected to the main grids of at least two said solar cells; A first encapsulation device forms an encapsulation film on the surface of the battery string; A second encapsulation device forms a cover plate on the surface of the encapsulation film away from the battery string.

8. The photovoltaic module manufacturing equipment according to claim 7, characterized in that, Also includes: A deflection device is located in the illumination path of the laser beam, used to receive the laser beam emitted by the laser emitter and control the laser beam emission deflection to scan the main grid.

9. The photovoltaic module manufacturing equipment according to claim 8, characterized in that, The deflection device includes a galvanometer, which is rotatable, wherein the laser beam has a different angle with the surface of the galvanometer, and the deflected laser beam illuminates different positions of the main grid.

10. The photovoltaic module manufacturing equipment according to claim 9, characterized in that, The angular rate of rotation of the galvanometer is 1° / s to 20° / s.

11. The photovoltaic module manufacturing equipment according to claim 7, characterized in that, Also includes: A scattering device is located on the irradiation path of the laser beam and is used to disperse the laser beam. The length of the dispersed laser beam is equal to the length of the main grid.

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