Packaging structure and manufacturing method thereof

Abstract

The invention discloses a packaging structure and a manufacturing method thereof, the packaging structure comprises a sunny side packaging layer, a nightside packaging layer, a first light receiving sub-battery, a second light receiving sub-battery and a light management module, the light management module is arranged between the sunny side packaging layer and the first light receiving sub-battery, the light management module can convert or absorb light, and the first light receiving sub-battery is connected with the second light receiving sub-battery. The light management module is used for managing the wavelength of lt; ultraviolet photons with the wavelength of 400 nm are converted into visible light photons with the wavelength of 450 nm to 1100 nm. By integrating the optical management module, the active conversion of ultraviolet light is realized instead of passive blocking, so that the efficiency and the stability of the four-terminal laminated assembly are cooperatively improved. The light management module is used for managing wavelength lt; harmful ultraviolet photons with the wavelength of 400 nm are converted into visible light photons with the wavelength of 450-1100 nm, and the conversion process is based on the down-conversion effect, so that high-energy ultraviolet rays are effectively utilized.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic cells, and in particular to a packaging structure and its manufacturing method. Background Technology

[0002] As is well known, perovskite / crystalline silicon tandem solar cells, as a next-generation photovoltaic technology, combine the broad-spectrum absorption characteristics of perovskite materials with the mature processes of crystalline silicon cells, and are expected to break through the Shockley-Quisser theoretical efficiency limit of single-junction cells, becoming a key to achieving high photoelectric conversion efficiency. Among these, the four-terminal tandem structure offers greater flexibility in process integration and spectral control because it avoids the stringent current matching requirements of two-terminal tandem structures. However, this structure faces the following challenges in synergistically improving efficiency and stability: perovskite materials are extremely sensitive to ultraviolet (UV) radiation, which induces lattice defect proliferation, accelerated ion migration, and interface degradation, leading to a significant decrease in open-circuit voltage and fill factor. While traditional encapsulation solutions provide basic physical isolation and bonding, they lack active spectral optimization capabilities and cannot effectively resolve the contradiction between UV protection and light energy utilization. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a packaging structure that can alleviate or resolve the contradiction between ultraviolet protection and light energy utilization.

[0004] The present invention also proposes a method for manufacturing a packaging structure as described above.

[0005] According to a first aspect of the present invention, a packaging structure includes: a positive-side packaging layer, a negative-side packaging layer, a first photodetector cell, a second photodetector cell, and a light management module. The positive-side packaging layer is transparent. The first photodetector cell is installed between the positive-side packaging layer and the negative-side packaging layer, and is used to absorb short-wavelength light. The second photodetector cell is installed between the first photodetector cell and the negative-side packaging layer, and is used to absorb long-wavelength light passing through the first photodetector cell. The light management module is disposed between the positive-side packaging layer and the first photodetector cell, and is capable of converting or absorbing light. The light management module is used to convert ultraviolet photons with wavelengths <400nm into visible light photons with wavelengths between 450nm and 1100nm.

[0006] The packaging structure according to embodiments of the present invention has at least the following beneficial effects: By integrating a light management module, active conversion of ultraviolet light is achieved instead of passive blocking, thereby synergistically improving the efficiency and stability of the four-terminal stacked module. The light management module converts harmful ultraviolet photons with wavelengths <400nm into visible light photons with wavelengths of 450-1100nm. This conversion process is based on the downconversion effect, enabling the effective utilization of high-energy ultraviolet light. The converted visible light photons can be efficiently absorbed in the blue-green light band by a first photodetector cell, such as a perovskite top cell with a bandgap of 1.5-1.8eV, or penetrate to a second photodetector cell, such as a crystalline silicon bottom cell, and captured in the red light band, thereby increasing the photocurrent density. At the same time, by eliminating the direct damage of ultraviolet light to the perovskite layer, this structure reduces the ultraviolet-accelerated aging degradation rate of the perovskite cell from the high degradation rate of traditional packaging to a low degradation rate, significantly extending the module life to more than 25 years. Compared to a simple UV cutoff solution, this design provides equivalent protection while additionally recovering UV energy, effectively improving the overall efficiency of the stacked module and resolving the contradiction between spectral utilization and UV protection.

[0007] According to some embodiments of the present invention, the light management module includes a functional adhesive film layer disposed under the sun-facing encapsulation layer, and the light management module covers the first photocell.

[0008] According to some embodiments of the present invention, the light management module is configured as an EVA film or a POE film, and the positive side encapsulation layer, the negative side encapsulation layer, the first photocell and the second photocell together form a distributed stacked assembly.

[0009] According to some embodiments of the present invention, the light management module includes a PVB film, and the positive side encapsulation layer, the negative side encapsulation layer, the first photocell and the second photocell together form a stacked assembly of BIPV.

[0010] According to some embodiments of the present invention, the light management module is configured as a light-converting adhesive film, and the excitation spectrum and emission spectrum of the light-converting adhesive film can match the external quantum efficiency of the first photonic cell and the second photonic cell.

[0011] According to some embodiments of the present invention, the light-converting film has a higher absorption rate in the ultraviolet band between 280nm and 400nm compared to other ultraviolet bands, and the light-converting film has a higher luminescence quantum yield and transmittance in the visible light band between 450nm and 1100nm compared to other visible light bands.

[0012] According to some embodiments of the present invention, the light management module is configured as an ultraviolet-blocking film and is used to block harmful ultraviolet rays.

[0013] According to some embodiments of the present invention, the ultraviolet cutoff film has an ultraviolet cutoff rate of more than 95% below the cutoff wavelength, and the visible light transmittance of the ultraviolet cutoff film above the cutoff wavelength is more than 90%.

[0014] A manufacturing method according to a second aspect embodiment of the present invention, used to manufacture a packaging structure according to the first aspect embodiment of the present invention, includes the following steps: S1, connect the crystalline silicon cells in series through a conductive circuit to obtain a second photonic cell; S2, a first carrier transport layer, a perovskite light-absorbing layer, a second carrier transport layer, a buffer layer, and a transparent electrode layer are sequentially prepared on a TCO conductive substrate, and edge cleaning is performed by laser etching. S3, sequentially lay butyl rubber, protective film, second photocell, protective film, and negative side encapsulation layer; S4, place the component made in S3 on the sun-facing encapsulation layer equipped with the light management module; S5, the components obtained in S4 are placed into a laminator for low-temperature lamination molding.

[0015] The manufacturing method according to embodiments of the present invention has at least the following beneficial effects: Through a systematic process flow design, this method achieves efficient integration of functional films and tandem solar cells, ensuring consistent and reliable component performance. The low-temperature lamination process effectively protects the thermosensitive perovskite material while guaranteeing encapsulation quality. Precise process control reduces manufacturing variation and improves product yield. This method also has good scalability, adapting to different production capacity requirements. Optimization of process parameters balances production efficiency and product quality, and standardized operations ensure batch-to-batch consistency. Furthermore, this method considers environmental friendliness, reducing environmental impact through material selection and process optimization. The design of the entire manufacturing system provides a complete solution for industrialization.

[0016] According to some embodiments of the present invention, in step S5, the encapsulation lamination temperature is set to 110℃-130℃, and the encapsulation lamination pressure is set to 30kPa-70kPa.

[0017] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of the packaging structure according to an embodiment of the present invention; Figure 2 for Figure 1A schematic diagram of the first photocell in the encapsulation structure is shown; Figure 3 for Figure 1 The diagram shows the efficiency trend of the encapsulation structure after UV aging under different irradiation levels. Reference numerals: Negative side encapsulation layer 100; Second photoelectric cell 300; Protective film 400; First photoelectric cell 500; TCO 510; First carrier transport layer 520; Perovskite absorber layer 530; Second carrier transport layer 540; Buffer layer 550; Transparent electrode layer 560; Light management module 600; Butyl adhesive 800; Positive side encapsulation layer 900; Detailed Implementation Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0019] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0020] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0021] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0022] Reference Figure 1An encapsulation structure includes: a positive encapsulation layer 900, a negative encapsulation layer 100, a first photodetector cell 500, a second photodetector cell 300, and a light management module 600. The positive encapsulation layer 900 is transparent. The first photodetector cell 500 is installed between the positive encapsulation layer 900 and the negative encapsulation layer 100, and is used to absorb short-wavelength light. The second photodetector cell 300 is installed between the first photodetector cell 500 and the negative encapsulation layer 100, and is used to absorb long-wavelength light passing through the first photodetector cell 500. The light management module 600 is disposed between the positive encapsulation layer 900 and the first photodetector cell 500, and is capable of converting or absorbing light. The light management module 600 is used to convert ultraviolet photons with wavelengths <400nm into visible light photons with wavelengths between 450nm and 1100nm. By integrating a light management module 600, active conversion of ultraviolet light, rather than passive blocking, is achieved, thereby synergistically improving the efficiency and stability of the four-terminal stacked module. The light management module 600 converts harmful ultraviolet photons with wavelengths <400nm into visible light photons in the 450-1100nm range. This conversion process is based on the downconversion effect, enabling the effective utilization of high-energy ultraviolet light. The converted visible light photons can be efficiently absorbed in the blue-green light band by the first photonic cell 500, such as a perovskite top cell with a bandgap of 1.5-1.8eV, or penetrate to the second photonic cell 300, such as a crystalline silicon bottom cell, and captured in the red light band, thereby increasing the photocurrent density. Simultaneously, by eliminating the direct damage of ultraviolet light to the perovskite layer, this structure reduces the ultraviolet-accelerated aging degradation rate of the perovskite cell from the high degradation rate of traditional packaging to a low degradation rate, significantly extending the module life to over 25 years. Compared to a simple UV cutoff solution, this design provides equivalent protection while additionally recovering UV energy, effectively improving the overall efficiency of the stacked module and resolving the contradiction between spectral utilization and UV protection.

[0023] In the specific implementation process, the sun-side encapsulation layer 900 can be made of high-transparency tempered glass with a specific thickness and coated with an anti-reflection coating to reduce optical loss; the shadow-side encapsulation layer 100 is a composite backsheet structure with excellent water vapor barrier performance. The first photonic cell 500 is a semi-transparent perovskite cell, whose structure includes multiple functional films, including a conductive substrate, an electron transport layer, a perovskite light-absorbing layer, a hole transport layer, and a transparent electrode layer 560. The second photonic cell 300 is a high-efficiency crystalline silicon cell, whose surface is specially treated to enhance light-harvesting capabilities. The light management module 600 is integrated onto the surface of the sun-side glass through a lamination process, made of specific functional materials, and its optical characteristics need to be precisely matched with the spectral response characteristics of the cell. The lamination process parameters need to be strictly controlled to ensure that the film achieves sufficient cross-linking degree and forms good interfacial bonding strength. The module edges are encapsulated with high-performance sealing materials to ensure that the overall structure passes rigorous reliability testing. The entire manufacturing process requires strict control of the process parameters of each step to ensure the consistency and reliability of the module performance.

[0024] In some embodiments, reference is made to Figure 1 The light management module 600 includes a functional adhesive film layer disposed beneath the sun-side encapsulation layer 900, covering the first photocell 500. By specifically configuring the light management module 600 as a functional adhesive film layer covering the first photocell 500, it ensures that incident sunlight undergoes functional processing before reaching the perovskite cell, achieving direct protection and spectral optimization of the cell's active layer. As a key interface between the sun-side encapsulation layer 900 and the cell, the functional adhesive film layer not only provides reliable physical isolation and mechanical bonding, ensuring the structural integrity of the module in harsh environments, but also reduces interface reflection loss and improves photon utilization efficiency through its special optical properties. The uniform coverage of the adhesive film layer avoids leakage and localized hot spots in edge areas, while its low-temperature cross-linking properties prevent thermal damage to the perovskite material during encapsulation. This design significantly enhances the module's environmental adaptability, enabling it to maintain stable performance output under harsh conditions such as high temperature and high humidity.

[0025] In practical implementation, the functional adhesive film layer can be made of polymeric adhesive film materials of specific thicknesses, such as ethylene-vinyl acetate copolymer or polyolefin elastomers, and pre-cured onto the lower surface of the sun-facing glass using a precision coating process. The thickness of the adhesive film layer needs to be precisely controlled to ensure consistent optical performance, and its surface can be plasma-treated to enhance adhesion to the substrate. The adhesive film material should have extremely low water vapor transmittance to prevent moisture penetration that could lead to cell performance degradation, while maintaining high visible light transmittance to maximize light energy utilization. The coverage area must completely shield the active area of ​​the perovskite cell, and the edge areas should be reinforced with high-performance sealing materials to ensure the overall hermeticity of the module.

[0026] In some embodiments, reference is made to Figure 1 The light management module 600 is configured with either EVA or POE encapsulation film. The positive-side encapsulation layer 900, negative-side encapsulation layer 100, first photocell 500, and second photocell 300 together form a distributed tandem module. Using a specific type of encapsulation film for the light management module 600 is particularly suitable for distributed photovoltaic power generation scenarios. Both materials have a mature industrial base and excellent environmental adaptability. One type of encapsulation film provides excellent light transmittance and flexibility, effectively transmitting visible light while protecting the cell structure; the other type exhibits better electrical insulation performance and resistance to potential-induced degradation, ensuring the stability of the module under high-voltage bias. Both materials provide reliable mechanical support and environmental protection for the tandem module, resisting external stresses such as wind pressure and snow load.

[0027] In practical implementation, the film can be made from copolymer materials with specific components, and its rheological properties can be adjusted by precisely controlling the molecular weight and distribution. The additive system needs to be optimized, including the ratio of crosslinking agents, UV absorbers, and antioxidants, to ensure the stability of the material during processing and use. The film thickness needs to be designed according to the component structure, and a multi-layer co-extrusion process can impart gradient functions to the material.

[0028] In some embodiments, reference is made to Figure 1 The light management module 600 comprises a PVB film, a positive-side encapsulation layer 900, a negative-side encapsulation layer 100, a first photocell 500, and a second photocell 300, forming a stacked BIPV module. Using a specific type of PVB film as the light management module 600 is particularly suitable for building-integrated photovoltaic applications, as the PVB film combines excellent optical performance with the mechanical properties required for building safety. Its high light transmittance and color tunability meet architectural aesthetic needs while maintaining good energy conversion efficiency. The adhesive strength of the film ensures reliable integration of the module with the building structure, and its impact resistance meets building safety codes. This design achieves a perfect fusion of photovoltaic functionality and architectural elements, providing an innovative solution for green buildings.

[0029] Furthermore, the PVB film uses a high molecular weight resin matrix, and its flexibility and processability are adjusted by plasticizers. The formulation needs to balance optical properties and mechanical strength, and the addition of nanofillers can improve multiple properties simultaneously.

[0030] In some embodiments, reference is made to Figure 1The light management module 600 is configured as a light-converting adhesive film, and the excitation and emission spectra of the film are matched with the external quantum efficiencies of the first photonic cell 500 and the second photonic cell 300. The spectral matching design of the light-converting adhesive film precisely controls its luminescence characteristics, ensuring that its emission spectrum optimally matches the quantum efficiency curve of the cells, guaranteeing efficient absorption of the converted photons. This precise optical matching maximizes light energy utilization while reducing energy loss due to ineffective conversion. Customized selection of fluorescent materials allows for targeted conversion in specific ultraviolet bands, enhancing the protective effect. The optical properties of the light-converting adhesive film are also angle-dependent, ensuring stable conversion efficiency at different incident angles. The lightfastness of the film ensures no performance degradation under long-term ultraviolet irradiation, and its mechanical strength guarantees integrity during the encapsulation process.

[0031] In practical implementation, the selection of the matrix material for the light-converting film must consider refractive index matching and weather resistance. The screening of fluorescent materials should be based on excitation and emission characteristics, with surface modification used to improve dispersibility and stability. The fabrication process requires precise control of temperature, pressure, and time parameters to ensure consistent material properties. The film thickness design must be optimized to balance optical path and mechanical strength.

[0032] In some embodiments, reference is made to Figure 3 The light-converting film exhibits higher absorption in the ultraviolet (UV) band (280nm-400nm) compared to other UV bands, and higher luminescence quantum yield and transmittance in the visible light band (450nm-1100nm) compared to other visible light bands. The high absorption in the UV band effectively blocks harmful light, while the efficient luminescence and transmittance in the visible light region ensure maximum energy utilization. This dual-function design significantly improves the initial performance of the component and extends its lifespan by reducing UV damage. The film's thermal stability ensures no performance degradation at high temperatures, and its mechanical toughness resists stress damage during the encapsulation process. The material's hydrolysis resistance prevents performance degradation in humid environments, and its chemical stability ensures compatibility with encapsulation materials. The film's adaptive properties allow it to automatically adjust conversion efficiency according to ambient light intensity, further improving energy efficiency. Furthermore, the material's recyclability meets the requirements of a circular economy.

[0033] During implementation, the selection of UV absorbers should be based on absorption coefficients and stability, with performance optimized through molecular design. The concentration of fluorescent materials needs precise control to avoid concentration quenching. High purity of the matrix material is required to minimize the impact of impurities on optical performance. Subsequent treatments such as annealing can improve material crystallinity and enhance performance.

[0034] In some embodiments, reference is made to Figure 1The light management module 600 is equipped with a UV-blocking film to block harmful ultraviolet rays. Through precise molecular-level design, the UV-blocking film selectively blocks harmful ultraviolet rays, providing targeted protection for the perovskite layer. The technological maturity of the UV-blocking film ensures the reliability of industrial implementation and significantly reduces performance degradation caused by UV aging. The long-term stability of the optical performance of the UV-blocking film guarantees high output throughout the module's lifespan, while its mechanical properties resist environmental stress. The UV-blocking film also offers good economic benefits, with costs controlled through mature production processes. The material's processability adapts to different module sizes and shapes, making it widely applicable. Furthermore, the film's environmental adaptability allows it to maintain stable performance under various climatic conditions.

[0035] In practical implementation, the selection of UV absorbers should consider absorption band and weather resistance, and the protection range can be expanded through compounding techniques. The molecular weight distribution of the matrix material needs to be controlled to ensure a balance between processing performance and final performance. The additive system needs to be optimized, including the synergistic effects of stabilizers, antioxidants, and light stabilizers. During application, parameters need to be adjusted according to the component design to ensure optimal protection.

[0036] In some embodiments, reference is made to Figure 3 The UV-blocking film exhibits a UV cutoff rate exceeding 95% below the cutoff wavelength and a visible light transmittance exceeding 90% above the cutoff wavelength. This ultra-high cutoff rate below specific wavelengths provides reliable UV protection, while the high transmittance in the visible light band minimizes energy loss. This precise balance of optical performance ensures that the module maximizes energy output while protecting the battery. The film's durability design resists performance degradation from long-term UV exposure, and its interfacial stability guarantees long-term compatibility with adjacent materials. This design also considers environmental adaptability, maintaining consistent performance under varying irradiation conditions.

[0037] During implementation, the cutoff wavelength can be precisely controlled through molecular design and process optimization. Multilayer structure design can further enhance optical performance, and the interfaces between layers need to be optimized to avoid reflection loss. The manufacturing process requires strict control of cleanliness to prevent impurities from affecting optical performance. Precise thickness control is essential, and an online monitoring system can be used to ensure consistency.

[0038] Reference Figure 2 The second aspect of the present invention provides an embodiment of a manufacturing method for producing the above-mentioned packaging structure, comprising the following steps: S1, connect the crystalline silicon cells in series through a conductive circuit to obtain the second photonic cell 300; S2, a first carrier transport layer 520, a perovskite light-absorbing layer, a second carrier transport layer 540, a buffer layer 550, and a transparent electrode layer 560 are sequentially prepared on a TCO510 conductive substrate, and edge cleaning is performed by laser etching. S3, sequentially lay 800 butyl rubber, 400 protective film, 300 second photocell, 400 protective film, and 100 negative side encapsulation layer; S4, place the component obtained in S3 on the sun-facing encapsulation layer 900 with the light management module 600; S5, the component obtained in S4 is placed into a laminator for lamination molding.

[0039] This manufacturing method achieves efficient integration of functional films and tandem cells through a systematic process design, ensuring consistent module performance and reliability. The low-temperature lamination process effectively protects the thermosensitive perovskite material while guaranteeing encapsulation quality. Precise process control reduces manufacturing variation and improves product yield. This method also offers good scalability, adapting to different production capacity requirements. Optimized process parameters balance production efficiency and product quality, and standardized operations ensure batch-to-batch consistency. Furthermore, the method considers environmental friendliness, reducing environmental impact through material selection and process optimization. The entire manufacturing system design provides a complete solution for industrial-scale implementation.

[0040] It is foreseeable that the implementation will involve multiple key processes, each requiring precise parameter control. The battery preparation stage must ensure surface cleanliness and structural integrity, and the series process must be optimized to reduce resistance loss. Thin film deposition requires control of thickness and uniformity, and laser processing demands precise control of energy and path. The lamination process requires optimization of temperature, pressure, and time to ensure interface quality. The selection of encapsulation materials must consider compatibility and durability, and the sealing process must guarantee airtightness. The testing process must be comprehensive, including visual inspection, electrical performance testing, and reliability verification. The production environment requires controlled temperature, humidity, and cleanliness, and equipment needs regular calibration and maintenance. Process documentation must detail and specify each step, and operators require professional training. A robust quality system must be established, including SPC (Statistical Process Control). A continuous improvement mechanism must be established to optimize processes based on production data.

[0041] In some embodiments, in step S5, the encapsulation lamination temperature is set to 110℃-130℃, and the encapsulation lamination pressure is set to 30kPa-70kPa. Precise control of lamination temperature and pressure ensures optimal cross-linking of the encapsulation film while avoiding damage to the battery structure. Optimization of temperature and pressure achieves the best balance between encapsulation quality and battery protection. Temperature uniformity control prevents localized overheating, and pressure stability ensures consistent interface contact. This precise process control improves product yield and reduces material waste. Standardization of process parameters facilitates large-scale production management, and automated control ensures operational consistency. Furthermore, this process scheme has good adaptability and can be adjusted according to material characteristics. Optimization of energy consumption also improves the economics and environmental friendliness of production.

[0042] Furthermore, the temperature control system needs to employ multi-zone independent temperature control to ensure thermal uniformity. Pressure application requires gradual control to avoid impact damage. Time parameters need to be optimized based on material properties to ensure sufficient cross-linking while improving efficiency. The equipment needs a high-precision sensing and control system to monitor process parameters in real time. Environmental conditions need to be controlled, including temperature, humidity, and cleanliness.

[0043] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0044] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A packaging structure, characterized in that, include: A positive-side encapsulation layer (900) and a negative-side encapsulation layer (100), wherein the positive-side encapsulation layer (900) is light-transmitting; A first photocell (500) is installed between the positive side encapsulation layer (900) and the negative side encapsulation layer (100), and the first photocell (500) is used to absorb short-wavelength light. The second photocell (300) is installed between the first photocell (500) and the negative encapsulation layer (100). The second photocell (300) is used to absorb long-wavelength light passing through the first photocell (500). A light management module (600) is disposed between the sun-facing encapsulation layer (900) and the first photonic cell (500). The light management module (600) is capable of converting or absorbing light. The light management module (600) is used to convert ultraviolet photons with wavelengths <400nm into visible light photons with wavelengths between 450nm and 1100nm.

2. The packaging structure as described in claim 1, characterized in that: The light management module (600) includes a functional adhesive film layer disposed under the sun-facing encapsulation layer (900), and the light management module (600) covers the first photocell (500).

3. The packaging structure as described in claim 2, characterized in that: The light management module (600) is configured as an EVA film or a POE film, and the positive side encapsulation layer (900), the negative side encapsulation layer (100), the first photocell (500) and the second photocell (300) together form a distributed stacked assembly.

4. The packaging structure as described in claim 2, characterized in that: The light management module (600) includes a PVB film, and the positive side encapsulation layer (900), the negative side encapsulation layer (100), the first photocell (500) and the second photocell (300) together form a stacked assembly of BIPV.

5. The packaging structure as described in claim 2, characterized in that: The light management module (600) is configured as a light-transfer adhesive film, and the excitation spectrum and emission spectrum of the light-transfer adhesive film can match the external quantum efficiency of the first photoelectric cell (500) and the second photoelectric cell (300).

6. The packaging structure as described in claim 5, characterized in that: The light-converting film has a higher absorption rate in the ultraviolet band between 280nm and 400nm compared to other ultraviolet bands, and the light-converting film has a higher luminescence quantum yield and transmittance in the visible light band between 450nm and 1100nm compared to other visible light bands.

7. The packaging structure as described in claim 2, characterized in that: The light management module (600) is configured as an ultraviolet-blocking film and is used to block harmful ultraviolet rays.

8. The packaging structure as described in claim 7, characterized in that: The UV-blocking film has a UV cutoff rate of over 95% below the cutoff wavelength and a visible light transmittance of over 90% above the cutoff wavelength.

9. A manufacturing method, characterized in that, For manufacturing the packaging structure according to any one of claims 1 to 8, the following steps are included: S1, the crystalline silicon cells are connected in series through a conductive circuit to obtain the second photonic cell (300). S2, a first carrier transport layer (520), a perovskite light-absorbing layer, a second carrier transport layer (540), a buffer layer (550), and a transparent electrode layer (560) are sequentially prepared on a TCO (510) conductive substrate, and the edges are cleaned by laser etching. S3, butyl rubber (800), protective film (400), second photocell (300), protective film (400), and negative side encapsulation layer (100) are laid in sequence. S4, the component obtained in S3 is placed in the sun-facing encapsulation layer (900) which has a light management module (600). S5, the components obtained in S4 are placed into a laminator for low-temperature lamination molding.

10. The packaging structure as described in claim 9, characterized in that: In step S5, the encapsulation lamination temperature is set to 110℃-130℃, and the encapsulation lamination pressure is set to 30kPa-70kPa.

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