Packaging method of perovskite crystalline silicon laminated cell

Abstract

The embodiment of the invention provides a packaging method of a perovskite crystal silicon laminated cell, which is applied to the technical field of semiconductor device packaging and integration, and comprises the following steps: constructing a molecular crystal layer with a directional interface dipole on the surface of perovskite, constraining ion migration in the plane direction of the cell by using a built-in electric field, and taking a controlled surface as a substrate to form a perovskite crystal silicon laminated cell; and a gradient buffer layer and a spectrum regulation and control layer with stress phase modulation capability are constructed in sequence. In the packaging and curing process, a programmed temperature load is coupled with a modulation light field, a dynamic physical field is generated under the cooperation of a buffer layer and a spectrum layer, and movable ion defects in the perovskite body are driven to directionally migrate to an interface and are captured and fixed, so that stable rearrangement of defect states is realized. Static physical isolation of packaging is converted into a dynamic material repairing process, so that the long-term stability of the battery is improved, and meanwhile, the photoelectric conversion efficiency of the battery is collaboratively optimized.

Description

Technical Field

[0001] This application relates to the field of semiconductor device packaging and integration technology, and in particular to a packaging method for a perovskite silicon tandem solar cell. Background Technology

[0002] Organic compound solar cells were once considered a promising development direction due to their wide availability of materials, solution-processability, and lightweight and flexible properties. To break through the efficiency and stability ceiling of organic compound solar cells, researchers have turned their attention to perovskite materials. The high efficiency of perovskite solar cells, comparable to that of monocrystalline silicon cells, combined with the solution-processability of organic compound solar cells, exhibits unique advantages. Combining perovskite cells with mature crystalline silicon cells to form perovskite-crystalline silicon tandem cells can break through the Shockley-Quisser theoretical efficiency limit of single-junction cells.

[0003] However, perovskite materials, especially the ion migration and inherent defects in their active layer, are prone to performance degradation under light, humidity and heat and electrical stress. In the existing technology, the encapsulation of perovskite cells, including perovskite crystalline silicon tandem cells, mostly follows or improves the physical barrier approach of traditional photovoltaic modules, that is, mainly focuses on using encapsulation films and covers with high water and gas resistance to create a passive and static physical isolation environment.

[0004] Traditional methods cannot proactively address the mechanical stress caused by thermal expansion mismatch inside the package, as well as the migration and defect proliferation of intrinsic perovskite ions stimulated by the optical, electrical, and thermal coupling effects when the packaged device is in operation. In other words, the dynamic instability of the perovskite material itself lacks effective intervention and control capabilities. Summary of the Invention

[0005] This application provides a packaging method for perovskite-silicon tandem solar cells, which improves the long-term stability and photoelectric conversion efficiency of the perovskite-silicon tandem solar cells. To achieve the above objectives, this application adopts the following technical solution: A method for packaging a perovskite-silicon tandem solar cell, the method comprising: After the perovskite-silicon tandem solar cell is stacked, the encapsulation side surface of the perovskite sub-cell is subjected to interface orientation treatment to form an interface functional molecular arrangement layer with consistent orientation, resulting in an interface treatment layer with a defined interface dipole orientation. A directional polarization process is applied to the interface processing layer to control the interface dipoles in the interface processing layer to align along a preset direction, thereby forming an ion migration confinement interface layer. Using the ion migration confinement interface layer as the encapsulation interface substrate, an encapsulation buffer layer precursor is laid on the outside of the perovskite sub-cell to obtain a buffer layer precursor structure covering the ion migration confinement interface layer. The buffer layer precursor structure is subjected to a staged molding process along the thickness direction, and the buffer layer precursor is controlled to form multiple buffer sub-layers with different mechanical responses in the thickness direction, so as to obtain a layered stress response encapsulated buffer layer structure. Using the encapsulation buffer layer structure as a deposition substrate, an encapsulation spectral modulation layer with a preset spectral transmission distribution is formed on the outside of the encapsulation buffer layer structure to obtain an encapsulation outer layer structure with spectral modulation capability. Under the condition that the encapsulation buffer layer structure and the encapsulation spectral modulation layer coexist, the encapsulation structure is subjected to a curing process to control the perovskite sub-cell functional layer to complete the structural rearrangement under the interface constraint conditions, forming a perovskite functional layer with a stable structural state. Using the structurally stable perovskite functional layer as the core, perovskite-silicon tandem solar cells are co-encapsulated.

[0006] In some possible implementations, the interface orientation treatment of the encapsulation side surface of the perovskite sub-cell to form an interface functional molecular arrangement layer with consistent orientation, resulting in an interface treatment layer with a defined interface dipole orientation, includes: The solution of interface functional molecules is spin-coated onto the encapsulation side surface of the perovskite sub-cell to form a uniform wet film covering the encapsulation side surface. An external magnetic field with a direction perpendicular to the encapsulation side surface is applied to the wet film; Under the influence of the external magnetic field, the amphiphilic molecules in the wet film align themselves in an oriented manner. The wet film with the completed orientation is heated to remove the solvent from the wet film, forming a solid interfacial functional molecular arrangement layer on the encapsulation side surface; The layer of functional molecules arranged in the interface constitutes the interface processing layer.

[0007] In some possible implementations, applying directional polarization treatment to the interface processing layer to control the interface dipoles in the interface processing layer to align along a preset direction and form an ion migration-confined interface layer includes: The battery assembly with the interface treatment layer formed thereon is placed into the electrode device; Adjust the position of the battery assembly so that the interface processing layer faces the negative electrode plate of the electrode device; A DC voltage is applied to the electrode device while the battery assembly is heated. Maintain the DC voltage and heating state for a set time, then stop applying the DC voltage and stop the heating process. The battery assembly is cooled to form a new functional layer on the interface treatment layer; The new functional layer is the ion migration constraint interface layer.

[0008] In some possible implementations, the step of using the ion migration confinement interface layer as the encapsulation interface substrate and depositing an encapsulation buffer layer precursor on the outside of the perovskite sub-cell to obtain a buffer layer precursor structure covering the ion migration confinement interface layer includes: Prepare a viscous encapsulation buffer layer precursor material and place the encapsulation buffer layer precursor material in a coating device; The coating equipment is started to coat the encapsulation buffer layer precursor material onto the ion migration confinement interface layer, and the coating process is controlled to form a uniform wet film layer. After coating, the battery is left to stand, allowing the wet film layer to naturally level out during the standing process, resulting in a smooth film layer that completely covers the ion migration constraint interface layer. The smooth film layer is the precursor structure of the buffer layer.

[0009] In some possible implementations, the step of performing a staged molding process on the buffer layer precursor structure along the thickness direction, controlling the buffer layer precursor to form multiple buffer sub-layers with different mechanical responses in the thickness direction, to obtain a layered stress-response encapsulated buffer layer structure, includes: The battery with the buffer layer precursor structure is placed in the first processing device, the first processing device is started, and the buffer layer precursor structure is subjected to the first stage of energy action, so that the part of the buffer layer precursor structure near the interface undergoes a physical state change to form a first solidified sublayer. The battery is transferred to the second processing device, and the second processing device is activated to apply energy to the buffer layer precursor structure in the second stage, causing the remaining part of the buffer layer precursor structure to undergo a physical state change and form a second solidified sublayer. This allows the first cured sublayer to bond with the second cured sublayer. The combined structure is the encapsulation buffer layer structure.

[0010] In some possible implementations, the step of using the encapsulation buffer layer structure as a deposition substrate and forming an encapsulation spectral modulation layer with a preset spectral transmission distribution on the outside of the encapsulation buffer layer structure includes: The battery with the aforementioned encapsulation buffer layer structure is moved into the deposition equipment chamber; The deposition equipment chamber is closed, and the outer surface of the encapsulation buffer layer structure is used as the deposition surface to introduce the first reactive substance into the chamber. Energy is applied to the chamber to deposit a first reactive substance, forming a first material layer on the deposition surface; Stop introducing the first reactant and introduce the second reactant into the chamber; Energy is applied to the chamber to deposit the second reactive material, forming a second material layer on the first material layer; By repeatedly performing the steps of introducing and depositing different reactive substances, a composite film structure consisting of alternating layers of multiple materials is formed; The composite film structure is the encapsulation spectral modulation layer.

[0011] In some possible implementations, the curing process on the packaging structure includes: The battery assembly integrating the encapsulation buffer layer structure and the encapsulation spectrum modulation layer is placed in a pressing device, pressure is applied to the battery assembly, and the battery assembly is heated at the same time to complete the first hot pressing process. The battery assembly is moved into a heat treatment device for a second heat treatment, the temperature of which is higher than that of the first hot pressing treatment. The structurally stable perovskite functional layer is obtained through the second heat treatment.

[0012] In some possible implementations, prior to the interface orientation treatment of the encapsulation-side surface of the perovskite sub-cell, the process further includes: The perovskite-silicon tandem solar cell is placed in the cleaning equipment chamber, and working gas is introduced into the chamber to generate plasma by applying energy to the chamber. The encapsulation side surface of the perovskite sub-cell is treated with plasma to remove contaminants from the encapsulation side surface, thereby obtaining a treated encapsulation side surface. The processed packaged side surface is used for subsequent interface orientation processing.

[0013] In some possible implementations, the interface functional molecule includes a first functional group, a second functional group, and a connecting segment: The first functional group is a phosphonate group or a carboxyl group; The second functional group is a fluorinated aryl or cyano group; The connecting segment is a straight-chain alkylene group.

[0014] In some possible implementations, the co-encapsulation of the perovskite-silicon tandem solar cell includes: The structurally stable perovskite functional layer is stacked and aligned with the crystalline silicon sub-cell. After the components are stacked and aligned, encapsulating films are laid on both sides of the components and protective covers are applied. The overall structure after the protective cover is covered is laminated and encapsulated, and the lamination and encapsulation includes vacuuming, heating to melt and flow the adhesive film, and cooling and curing.

[0015] As can be seen from the above technical solution, this application has the following beneficial effects: 1. The encapsulation system constructed by this method achieves a leap from passively bearing to actively managing thermal stress. In traditional encapsulation, the homogeneous film will uncontrollably transmit thermal stress. This solution, through the stress phase modulation buffer layer structure, can actively decompose and dissipate the uniform thermal stress caused by external temperature changes into dispersed stress waves that are staggered in time and space, avoiding the local accumulation of stress in the perovskite layer and causing damage. The encapsulation spectrum modulation layer actively trims the incident light energy distribution, reducing the intensity of photothermal shock from the source. This active management capability of thermal and optical stress solves the problem of internal dynamic instability in traditional encapsulation.

[0016] 2. This method revolutionizes the encapsulation process into a materials engineering process for in-situ defect repair and stabilization. By constructing a molecular crystalline layer with oriented interfacial dipoles on the perovskite surface, the built-in electric field generated by this layer forms a two-dimensional constraint on the direction of ion migration, transforming disordered escape into controlled in-plane migration. During the encapsulation curing stage, a program-controlled thermo-optical synergistic physical field is used to actively drive the migratable ion defects within the perovskite bulk phase to migrate directionally along a preset two-dimensional path to the encapsulation interface and be captured and fixed by preset passivation sites. This achieves active guidance and targeted passivation of intrinsic perovskite defects, transforming encapsulation from an external physical barrier into a decisive process step that enhances intrinsic stability from within the material. Attached Figure Description

[0017] The invention will now be further described with reference to the accompanying drawings.

[0018] Figure 1 A first flowchart illustrating a packaging method for a perovskite-silicon tandem solar cell provided in this application embodiment; Figure 2 A second flowchart illustrating a packaging method for a perovskite-silicon tandem solar cell provided in this application embodiment; Figure 3 This is a third flowchart illustrating a packaging method for a perovskite-silicon tandem solar cell provided in an embodiment of this application. Detailed Implementation

[0019] The terms "first," "second," and "third," etc., used in this application specification, claims, and drawings are for distinguishing different objects, not for specifying a particular order.

[0020] In the embodiments of this application, the words "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the words "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0021] Research has found that traditional encapsulation technology mainly focuses on using high-barrier films and glass covers to build a static physical barrier, which is a passive defense strategy. This strategy cannot suppress the cumulative mechanical stress caused by the mismatch of thermal expansion coefficients inside the encapsulated body, nor can it interfere with the perovskite intrinsic ion migration and defect proliferation dynamics process excited by the coupling of multiple fields of light, heat and electricity in the working state of the encapsulated battery.

[0022] To address the aforementioned problems, this application provides a method for packaging perovskite-silicon tandem solar cells: Example 1: To solve the above problems, such as Figure 1 - Figure 3 As shown, this embodiment is applied to the packaging and manufacturing of a high-efficiency perovskite-silicon tandem solar cell. The perovskite top cell of this tandem cell adopts a typical nip-type structure, which is deposited on a substrate that has been prepared with transparent conductive electrodes and electron transport layers. It is optically and electrically interconnected with the underlying crystalline silicon heterojunction bottom cell through a tunnel junction. The core of this packaging method is that after the cell stacking is completed, a series of active and functional interface and structural engineering processes are used to directly intervene in and optimize the intrinsic stability of the perovskite material during the packaging process.

[0023] Step S101: Plasma pretreatment of the perovskite encapsulation side surface.

[0024] The perovskite-silicon tandem solar cell module to be packaged is fixed in a vacuum chamber, ensuring that the packaging side of the perovskite sub-cell, i.e., the top layer, which is the surface in contact with the packaging material, faces upwards. Argon and oxygen mixed in a certain proportion are introduced into the chamber to form a low-pressure gas environment. The radio frequency power supply is activated to generate a stable glow discharge between the electrodes, forming plasma. High-energy argon ions physically bombard the perovskite surface. This process can effectively sputter away trace amounts of organic matter, dust, and physical contamination layers that may have formed in previous processes, achieving atomic-level cleaning. The active oxygen free radicals in the plasma react chemically with the atoms on the perovskite surface, which can moderately etch the perovskite grains with incomplete coordination and loose structure, and may introduce chemically active sites such as hydroxyl groups or oxygen vacancies on the lead-iodine framework. After the treatment, a perovskite substrate with significantly improved surface energy and activated chemical properties is obtained.

[0025] It creates an ideal foundation for the efficient and uniform anchoring of functional molecules in subsequent steps. A clean and activated surface can ensure that the passivation solution is fully spread, avoiding uneven coating or molecular aggregation caused by surface contamination. At the same time, the increased number of active sites provides more anchor points, enabling the ion migration-constrained interface layer formed later to grow on the perovskite surface with stronger chemical bonding and higher order, thus laying a solid and consistent interface foundation for the entire encapsulation system.

[0026] Step S102: Form an ion migration confinement interface layer with oriented interfacial dipoles.

[0027] A passivation solution was prepared by dissolving fluorinated phenylethylammonium iodide at a specific concentration in anhydrous isopropanol. One end of the salt molecule is a cation head containing an ammonium group, and the other end is a benzene ring substituted with a fluorine atom. A precision spraying process was used to uniformly coat the perovskite encapsulation surface, which had undergone plasma pretreatment. The sample was then placed on a programmable temperature-controlled hot plate and subjected to a step-by-step heating process. This process began by maintaining a relatively mild temperature for a period to allow the solvent to evaporate slowly, preventing rapid drying and disordered molecular accumulation. The temperature was then gradually increased to an intermediate range and maintained. During this stage, the ammonium salt cations in the passivation solution formed strong coordination bonds with unsaturated lead ions on the perovskite surface through their ammonium groups, thus chemically fixing them to the perovskite surface. Finally, the temperature was further increased to a higher temperature for a brief heat treatment. Driven by this final thermal process, due to the hydrophobic interactions between the fluorinated end groups and the tendency of molecular crystallization, the chemically anchored molecules are driven to align their fluorinated benzene ring ends uniformly towards the outer space away from the perovskite surface, achieving vertical orientation and further crystallizing to form a dense, highly ordered molecular crystalline layer. Because the polar orientation of all molecules is uniformly aligned outward from the positively charged ammonium groups to the negatively charged fluorinated ends, this crystalline layer generates a unified and strong net electric dipole moment in the direction perpendicular to the interface, i.e., an oriented interfacial dipole. This crystalline layer is the ion migration-constrained interfacial layer that subsequently plays a crucial role in confinement.

[0028] By precisely controlling the thermodynamics and kinetics of step-by-step heating, the entire process of functional molecules from adsorption and bonding to ordered crystallization was guided. The resulting monomolecular film is not randomly covered, but a crystalline thin film with long-range order. The built-in electric field generated is unidirectional and has significant intensity, providing a stable and reliable potential source for subsequent precise electromagnetic manipulation of ion migration direction. This is the physical basis for achieving confinement function.

[0029] Step S103: Forming a perovskite surface state with controlled ion migration.

[0030] The interface layer, constrained by ion migration and characterized by a uniform dipole arrangement, generates a built-in electric field at the interface, oriented consistently from the perovskite bulk phase towards the interface layer. This electric field is not limited to the interface; its influence penetrates to a depth of several lattice units near the perovskite surface, affecting the charge distribution in that region. Mobile halide ion vacancies, such as iodine ions, which are prevalent in the perovskite lattice and carry an effective positive charge, are located within the influence range of this electric field. These positively charged vacancies experience electrostatic forces acting outwards from the electric field. When they attempt to migrate towards the encapsulation interface (perpendicular to the interface), they experience strong electrostatic repulsion. This repulsion manifests as a steep energy barrier, causing... Vertical migration becomes extremely difficult. Under thermal activation, the migration direction of vacancies is deflected, and they instead seek to move along paths with less electric field influence in a two-dimensional plane parallel to the battery interface. The migration paths of these mobile ions are effectively restricted to a two-dimensional plane parallel to the battery interface. The directional migration of a large number of ions in this restricted two-dimensional plane will continuously interact with the perovskite lattice below, such as preferentially diffusing along specific crystal orientations and temporarily filling specific types of lattice defects. The surface physicochemical properties defined by this dynamic and constrained migration behavior constitute the perovskite surface state with controlled ion migration.

[0031] It reveals that the mechanism of the interface layer has evolved from static passivation to dynamic traffic control. It doesn't completely freeze ion movement, which is physically difficult to achieve, but rather forcibly changes the dimension of ion migration by establishing an energy barrier, reducing three-dimensional random migration to two-dimensional planar restricted migration. This fundamentally eliminates the vertical ion flow that leads to interfacial chemical decomposition and halogen segregation, guiding potentially destructive energy release paths to a relatively harmless planar direction, and creating conditions for subsequent defect engineering using in-planar ion movement.

[0032] Step S104: Lay out the encapsulation buffer layer precursor under controlled surface conditions.

[0033] Using styrene-butadiene block copolymer as the main matrix material, supplemented with appropriate amounts of photoinitiator and thermosetting agent, these components are dissolved in organic solvents such as toluene and thoroughly mixed to prepare a homogeneous, viscous encapsulation buffer layer precursor solution. A slot coater is then used to precisely coat this precursor solution onto a perovskite surface with controlled ion migration. The key role of the perovskite surface state is thus revealed: due to the anisotropic migration of ions within a plane, nanoscale, directional chemical potential gradients or microscopic topological undulations may form on the surface. This specific surface chemical and physical topological structure, like a template with a microscopic pattern, influences the wetting and spreading kinetics of the precursor solution on the surface. The block copolymer molecular chains in the solution adaptively arrange themselves according to the surface's chemical properties and microstructure, allowing the wetting and molecular arrangement of the precursor solution to be actively regulated. This results in a firmly adhered, defect-free, and uniformly thick uncured gel film on the perovskite surface, which is the encapsulation buffer layer precursor.

[0034] It emphasizes that the functional layers of the encapsulation system are not mechanically stacked, but rather an organic whole with inherited and adapted physicochemical properties. Using the controlled surface state of perovskite as an information template, the buffer layer material is guided to perform initial self-assembly at the interface through intermolecular interactions. This ensures that the buffer layer achieves close molecular-level contact and good compatibility with the perovskite surface from the beginning of its formation, avoiding initial stress or potential delamination risks caused by interface mismatch, and laying a solid foundation for constructing composite interfaces with excellent mechanical properties.

[0035] Step S105: Molding process to obtain stress phase modulation encapsulation buffer layer structure.

[0036] The sample covered with an uncured gel film was placed in an energy field integrating a UV light source and a precision temperature control stage. UV light of a specific wavelength was irradiated, while the temperature control stage began to heat up according to a preset program, creating an external energy field coupling UV light and a programmed temperature-controlled thermal field. The UV light penetrated the gel film, exciting the photoinitiator within it, preferentially initiating selective crosslinking reactions of the polymer chains in the illuminated area, forming preliminary crosslinking network nodes. The thermal energy provided by the programmed temperature rise drove controlled microphase separation in the block copolymer matrix; that is, the originally compatible styrene and butadiene segments separated upon heating, activating the thermosetting agent and initiating an overall thermal crosslinking reaction. Photocrosslinking and thermal crosslinking competed and cooperated in time and space. Due to the natural attenuation of UV light intensity along the film thickness direction and the possible temperature gradient, the microphase separation and thermal curing processes proceeded non-uniformly in the direction perpendicular to the film surface. The system self-assembled into a layered microstructure with a periodic crosslinking density gradient: high crosslinking density regions and low crosslinking density regions alternated along the thickness direction. These two regions naturally correspond to the high-modulus buffer sublayer and the low-modulus buffer sublayer, and their periodic combination constitutes the encapsulation buffer layer structure with stress phase modulation capability.

[0037] To endow the buffer layer with more complex and customized stress management capabilities, spatially selective energy application techniques can be employed. For example, patterned masks can be used to block ultraviolet light, or laser scanning can be used for point-to-point irradiation to apply differentiated energy inputs to different spatial locations of the uncured gel film, such as strong light at the center and weak light at the edges; or additional heating can be applied to specific areas. This difference in energy input leads to non-uniform phase separation and curing reaction rates and degrees within the gel film. The result is a pre-designed crosslinking density and modulus gradient distribution in the film's thickness and planar direction. For example, a modulus gradient that gradually decreases from the inside to the outside can be programmed in the four corner regions of the battery, where bending is likely, to maximize the absorption of bending stress. This gradient distribution is material programming to achieve specific stress phase modulation characteristics, such as optimal dissipation of stress waves at a certain frequency.

[0038] It utilizes a physicochemical process triggered by the synergistic interaction of photothermal and thermal energy fields to achieve one-step in-situ construction of the fine structure inside the buffer layer. The resulting periodic alternating hard and soft structure is a natural phonon crystal or mechanical waveguide, capable of filtering, scattering, and phase modulating the incoming broadband thermomechanical stress, preventing stress superposition that could cause fracture or delamination of the perovskite film.

[0039] It elevates the performance design of the buffer layer from homogeneous in the one-dimensional thickness direction to a three-dimensional programmable dimension. Through preset gradient design, it can customize the most suitable local mechanical properties for different areas of the stacked battery, such as the central active area, the edge constraint area, and the electrode lead, just like customizing insoles with different elasticity for different body parts. This achieves precise and intelligent stress buffering and management, greatly improving the adaptability and reliability of the package to complex actual working conditions.

[0040] Step S106: Form an encapsulated spectral modulation layer.

[0041] On the outer surface of the cured encapsulation buffer layer structure, a dense first optical functional layer, such as a silicon nitride thin film, is first grown using plasma-enhanced chemical vapor deposition (PECVD). This layer possesses excellent anti-reflection properties, and by adjusting its thickness, it achieves destructive interference at specific wavelengths and good water and gas barrier properties. On top of the silicon nitride layer, a second optical functional layer is prepared using a blade coating or spray coating process. This layer uses a transparent polymer, such as silicone resin, as the matrix, and uniformly disperses surface-modified fluorescent material nanoparticles of a specific particle size, such as phosphors or ultraviolet absorbers that can convert ultraviolet light into blue light. Combining these two layers constitutes the final encapsulation spectral modulation layer, which, as an integral stacked structure, is responsible for modulating the spectral energy distribution of incident sunlight.

[0042] It constructs a multifunctional integrated optical management interface with three main functions: first, filtering, which actively filters out or weakens high-energy ultraviolet photons in the solar spectrum that directly damage the perovskite lattice by using ultraviolet absorption components, thus reducing photo-induced damage at the source; second, conversion, which uses down-conversion fluorescent materials to convert some of the harmful ultraviolet light energy into visible light with higher absorption efficiency in perovskites, improving stability while achieving efficient utilization of spectral energy, potentially leading to an increase in short-circuit current; and third, protection, with the underlying silicon nitride providing a basic physical barrier. This integrated design achieves synergistic optimization of optical protection and light energy utilization.

[0043] Step S107: Construction and function of synergistic physical field during encapsulation and curing.

[0044] A complete battery module integrating a spectral modulation layer is placed in an integrated encapsulation, curing, or aging device capable of programmed temperature cycling and simulated light exposure. A programmed temperature load is applied to the module, for example, cycling multiple times at a specific rate between two temperature points (high and low). A simulated solar light source is activated, allowing light to uniformly penetrate the encapsulation spectral modulation layer and irradiate the battery. The temperature load causes repeated expansion and contraction of the battery's various material layers due to their different coefficients of thermal expansion. Because the encapsulation buffer layer structure has a periodic modulus difference, it does not expand and contract uniformly during deformation but instead generates specific frequencies. The periodic thermomechanical stress wave of the waveform is transmitted to the perovskite layer. The encapsulated spectral modulation layer modulates the incident broadband light, outputting a light field with controlled energy density. For example, the ultraviolet part is weakened, while the blue part may be enhanced. Inside the perovskite functional layer, the periodic mechanical stress field from the buffer layer meets and couples with the modulated photon energy field from the spectral layer in time and space. The stress field changes the lattice constant and defect energy level of the perovskite through strain; the light field provides activation kinetic energy for ions and electrons. The synergy of the two forms a synergistic physical field whose intensity and direction vary with time and space.

[0045] It creatively transforms the final curing stage of encapsulation into a material processing technology that actively optimizes the quality of the perovskite phase. This synergistic physical field is not destructive, but rather a well-designed driving field that simulates the main environmental stresses experienced by the battery in actual outdoor operation, but is applied in a reinforced, ordered, and controlled manner. Its purpose is not to accelerate aging tests, but to directionally drive the orderly migration and reorganization of unstable factors within the perovskite, providing the necessary power and environment for the next step of defect engineering.

[0046] Step S108: Drive defect state stabilization rearrangement.

[0047] Driven by the synergistic physical field, metastable or mobile ionic defects within the perovskite phase, such as iodine vacancies and interstitial ions, acquire sufficient energy and directional guidance to begin long-range bulk diffusion. Since the surface state blocks the vertical migration path, the diffusion of these defects is mainly confined to a plane parallel to the interface. The specific spatiotemporal coupling mode of the synergistic physical field, for example, the stress relaxation region at a certain moment happens to be a region with strong light intensity, will produce an effect similar to a potential energy ramp or migration channel, exerting a net directional guiding effect on the diffused defect group, causing them to gradually accumulate in the region where the ion migration constraint interface layer is located near the encapsulation side surface. When these defects migrate to the interface region, the passivation molecules that have been fixed to the perovskite surface by chemical bonds, such as the passivation sites provided by phenylethylammonium ions, for example, ammonium groups can fill lead vacancies and fluorinated end groups can stabilize halide ions, will capture these migrating defects and stabilize them through chemical action, so that they no longer have mobility or electrical activity. The originally dispersed and active defects in the perovskite bulk phase are largely swept away and concentrated and fixed in the passivation network near the interface, thereby obtaining a defect-state stable perovskite functional layer.

[0048] It achieves in-situ, holistic improvement and repair of the bulk quality of the perovskite active layer during the encapsulation process, which surpasses all surface passivation technologies. It not only protects the surface but also actively reduces the defect density inside the bulk phase. The direct result is a significant suppression of nonradiative recombination loss, which not only manifests as a leap in device stability but is also often accompanied by a simultaneous increase in open-circuit voltage and fill factor, achieving a win-win situation for stability and efficiency.

[0049] Step S109: Complete collaborative encapsulation.

[0050] After the above steps, a perovskite functional layer with defect-state stability has been obtained, along with a customized encapsulation functional structure that is deeply coupled with it in terms of physics, chemistry, and optics. On top of this composite functional structure, a conventional high-performance water- and gas-barrier encapsulation film, such as a polyolefin elastomer film, is covered, and a glass cover or a polymer backsheet is laminated to complete the final overall lamination encapsulation. The co-encapsulation of the perovskite-silicon tandem solar cell is now complete. After encapsulation, the perovskite layer of the cell has achieved intrinsic enhancement through the encapsulation process itself, while the external encapsulation structure provides continuous physical protection, stress management, and spectral optimization. The internal and external components work together to ensure the high performance and high reliability of the cell under long-term service in complex environments.

[0051] The foregoing has shown and described the basic principles, main features, and advantages of this application. Those skilled in the art should understand that this application is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this application. Various changes and modifications can be made to this application without departing from the spirit and scope thereof, and all such changes and modifications fall within the scope of this application as claimed. The scope of protection of this application is defined by the appended claims and their equivalents.

Claims

1. A method for packaging perovskite-silicon tandem solar cells, characterized in that, The method includes: After the perovskite-silicon tandem solar cell is stacked, the encapsulation side surface of the perovskite sub-cell is subjected to interface orientation treatment to form an interface functional molecular arrangement layer with consistent orientation, resulting in an interface treatment layer with a defined interface dipole orientation. A directional polarization process is applied to the interface processing layer to control the interface dipoles in the interface processing layer to align along a preset direction, thereby forming an ion migration confinement interface layer. Using the ion migration confinement interface layer as the encapsulation interface substrate, an encapsulation buffer layer precursor is laid on the outside of the perovskite sub-cell to obtain a buffer layer precursor structure covering the ion migration confinement interface layer. The buffer layer precursor structure is subjected to a staged molding process along the thickness direction, and the buffer layer precursor is controlled to form multiple buffer sub-layers with different mechanical responses in the thickness direction, so as to obtain a layered stress response encapsulated buffer layer structure. Using the encapsulation buffer layer structure as a deposition substrate, an encapsulation spectral modulation layer with a preset spectral transmission distribution is formed on the outside of the encapsulation buffer layer structure to obtain an encapsulation outer layer structure with spectral modulation capability. Under the condition that the encapsulation buffer layer structure and the encapsulation spectral modulation layer coexist, the encapsulation structure is subjected to a curing process to control the perovskite sub-cell functional layer to complete the structural rearrangement under the interface constraint conditions, forming a perovskite functional layer with a stable structural state. Using the structurally stable perovskite functional layer as the core, perovskite-silicon tandem solar cells are co-encapsulated.

2. The method according to claim 1, characterized in that, The process of performing interface orientation treatment on the encapsulation side surface of the perovskite sub-cell to form an interface functional molecular arrangement layer with consistent orientation, resulting in an interface treatment layer with a defined interface dipole orientation, includes: The solution of interface functional molecules is spin-coated onto the encapsulation side surface of the perovskite sub-cell to form a uniform wet film covering the encapsulation side surface. An external magnetic field with a direction perpendicular to the encapsulation side surface is applied to the wet film; Under the influence of the external magnetic field, the amphiphilic molecules in the wet film align themselves in an oriented manner. The wet film with the completed orientation is heated to remove the solvent from the wet film, forming a solid interfacial functional molecular arrangement layer on the encapsulation side surface; The layer of functional molecules arranged in the interface constitutes the interface processing layer.

3. The method according to claim 2, characterized in that, The step of applying directional polarization treatment to the interface processing layer to control the interface dipoles in the interface processing layer to align along a preset direction and form an ion migration confinement interface layer includes: The battery assembly with the interface treatment layer formed thereon is placed into the electrode device; Adjust the position of the battery assembly so that the interface processing layer faces the negative electrode plate of the electrode device; A DC voltage is applied to the electrode device while the battery assembly is heated. Maintain the DC voltage and heating state for a set time, then stop applying the DC voltage and stop the heating process. The battery assembly is cooled to form a new functional layer on the interface treatment layer; The new functional layer is the ion migration constraint interface layer.

4. The method according to claim 3, characterized in that, The method of using the ion migration confinement interface layer as the encapsulation interface substrate and depositing an encapsulation buffer layer precursor on the outside of the perovskite sub-cell to obtain a buffer layer precursor structure covering the ion migration confinement interface layer includes: Prepare a viscous encapsulation buffer layer precursor material and place the encapsulation buffer layer precursor material in a coating device; The coating equipment is started to coat the encapsulation buffer layer precursor material onto the ion migration confinement interface layer, and the coating process is controlled to form a uniform wet film layer. After coating, the battery is left to stand, allowing the wet film layer to naturally level out during the standing process, resulting in a smooth film layer that completely covers the ion migration constraint interface layer. The smooth film layer is the precursor structure of the buffer layer.

5. The method according to claim 4, characterized in that, The step of performing a staged molding process on the buffer layer precursor structure along the thickness direction, controlling the buffer layer precursor to form multiple buffer sub-layers with different mechanical responses in the thickness direction, to obtain a layered stress-response encapsulated buffer layer structure, includes: The battery with the buffer layer precursor structure is placed in the first processing device, the first processing device is started, and the buffer layer precursor structure is subjected to the first stage of energy action, so that the part of the buffer layer precursor structure near the interface undergoes a physical state change to form a first solidified sublayer. The battery is transferred to the second processing device, and the second processing device is activated to apply energy to the buffer layer precursor structure in the second stage, causing the remaining part of the buffer layer precursor structure to undergo a physical state change and form a second solidified sublayer. This allows the first cured sublayer to bond with the second cured sublayer. The combined structure is the encapsulation buffer layer structure.

6. The method according to claim 5, characterized in that, The step of using the encapsulation buffer layer structure as a deposition substrate and forming an encapsulation spectral modulation layer with a preset spectral transmission distribution on the outside of the encapsulation buffer layer structure includes: The battery with the aforementioned encapsulation buffer layer structure is moved into the deposition equipment chamber; The deposition equipment chamber is closed, and the outer surface of the encapsulation buffer layer structure is used as the deposition surface to introduce the first reactive substance into the chamber. Energy is applied to the chamber to deposit a first reactive substance, forming a first material layer on the deposition surface; Stop introducing the first reactant and introduce the second reactant into the chamber; Energy is applied to the chamber to deposit the second reactive material, forming a second material layer on the first material layer; By repeatedly performing the steps of introducing and depositing different reactive substances, a composite film structure consisting of alternating layers of multiple materials is formed; The composite film structure is the encapsulation spectral modulation layer.

7. The method according to claim 1, characterized in that, The curing process for the packaging structure includes: The battery assembly integrating the encapsulation buffer layer structure and the encapsulation spectrum modulation layer is placed in a pressing device, pressure is applied to the battery assembly, and the battery assembly is heated at the same time to complete the first hot pressing process. The battery assembly is moved into a heat treatment device for a second heat treatment, the temperature of which is higher than that of the first hot pressing treatment. The structurally stable perovskite functional layer is obtained through the second heat treatment.

8. The method according to claim 1, characterized in that, Before performing interface orientation treatment on the encapsulation side surface of the perovskite sub-cell, the process further includes: The perovskite-silicon tandem solar cell is placed in the cleaning equipment chamber, and working gas is introduced into the chamber to generate plasma by applying energy to the chamber. The encapsulation side surface of the perovskite sub-cell is treated with plasma to remove contaminants from the encapsulation side surface, thereby obtaining a treated encapsulation side surface. The processed packaged side surface is used for subsequent interface orientation processing.

9. The method according to claim 1, characterized in that, The interface functional molecule includes a first functional group, a second functional group, and a connecting segment: The first functional group is a phosphonate group or a carboxyl group; The second functional group is a fluorinated aryl or cyano group; The connecting segment is a straight-chain alkylene group.

10. The method according to claim 1, characterized in that, The co-encapsulation of the perovskite-silicon tandem solar cell includes: The structurally stable perovskite functional layer is stacked and aligned with the crystalline silicon sub-cell. After the components are stacked and aligned, encapsulating films are laid on both sides of the components and protective covers are applied. The overall structure after the protective cover is covered is laminated and encapsulated, and the lamination and encapsulation includes vacuuming, heating to melt and flow the adhesive film, and cooling and curing.

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