Chip patch type tin planting method and tin planting device

Abstract

The invention relates to a chip patch type tin planting method and a tin planting device. The tin planting device comprises a cleaning mechanism, a tin planting mechanism and a detection mechanism, the cleaning mechanism comprises a first conveying mechanism and a plurality of cleaning assemblies, and the first conveying mechanism is provided with a mounting seat relative to the cleaning assemblies; the tin planting mechanism comprises a second conveying mechanism, a net placing structure, a tin planting structure and a heating structure, a plurality of positioning seats are arranged on the second conveying mechanism, and a net collecting structure is arranged at the position, close to the second transferring structure, of the cooling discharging part; and the detection mechanism comprises a third transmission mechanism and a plurality of detection structures, and the chips sequentially pass through the plurality of detection structures under the action of the third transmission mechanism. The invention aims to rapidly and stably plant tin on chips of different models.

Description

Technical Field

[0001] This invention relates to the field of tin plating technology, and in particular to a chip-mount tin plating method and tin plating apparatus. Background Technology

[0002] As electronic devices evolve towards miniaturization and high integration, ball grid array (BGA) chips have become one of the mainstream packaging forms for integrated circuits due to their superior electrical performance and high density. During chip manufacturing, testing, and post-repair processes, it is often necessary to repair or remanufacture the solder ball array; this process is called solder patching. The quality of the solder patching directly determines the reliability of the chip's soldering and the performance of the final product.

[0003] Currently, the most common soldering method is the ball-mounting method. After the stencil mesh and the chip are aligned, the ball-mounting method uses multiple nozzles arranged in an array relative to the mesh positions to pick up individual solder balls from the solder ball tray. A moving module then places the solder ball into the mesh, achieving rapid soldering. However, chips come in various models, and the positions of the solder pads change for different models. The type of stencil also needs to be changed accordingly. The layout of the multiple nozzles is difficult to change quickly, making the entire soldering process inflexible for different chip models. Summary of the Invention

[0004] The main objective of this invention is to provide a chip-mount soldering method and a soldering device, which aims to quickly and stably solder different types of chips.

[0005] To achieve the above objectives, the present invention proposes a chip-mounting soldering device, comprising a cleaning mechanism for cleaning chips, a soldering mechanism for soldering, and an inspection mechanism for acceptance. The cleaning mechanism includes a first transmission mechanism and a plurality of cleaning components. The plurality of cleaning components surround the outer periphery of the first transmission mechanism and are disposed toward the first transmission mechanism. The first transmission mechanism is provided with a mounting base for connecting to the chip relative to the cleaning components. The tin-coating mechanism includes a second transmission mechanism and a wire-laying structure, a tin-coating structure, and a heating structure arranged sequentially around the second transmission mechanism along its transmission direction. The second transmission mechanism has multiple positioning seats, which sequentially form a feeding section, a tin-coating section, and a cooling unloading section along its transmission direction. A first transfer structure is provided between the feeding section and the first transmission mechanism. A second transfer structure is provided between the end of the cooling unloading section away from the tin-coating section and the tin-coating mechanism. The multiple positioning seats in the tin-coating section correspond one-to-one with the wire-laying structure, the tin-coating structure, and the heating structure. A wire-receiving structure is provided near the second transfer structure in the cooling unloading section. The detection mechanism includes a third transmission mechanism and multiple detection structures. The chip passes through the multiple detection structures sequentially under the action of the third transmission mechanism. The positioning base includes a magnetic base and a positioning structure. The positioning structure surrounds the magnetic base. When the chip is magnetically fixed on the magnetic base, the chip will be coaxially positioned with the magnetic base under the action of the positioning structure. The soldering structure includes a ball ejector tube and a moving module for driving the ball ejector tube to reciprocate along the surface of the chip. Multiple ball ejector tubes are arranged in an array along a direction perpendicular to the moving module. One end of the ball ejector tube faces the chip and has a solder ball outlet, while the other end has an air pump. A solder ball feeding tube is connected to the ball ejector tube near the solder ball outlet. The diameter of the solder ball outlet of the ball ejector tube is adapted to the solder ball. The mesh placement structure is used to place a stencil used to position solder dots on the chip. The stencil has multiple through holes relative to the solder dot array, each capable of accommodating only one solder ball. The distance between the solder ball outlet and the stencil is less than the radius of any solder ball.

[0006] In one embodiment of this application, a plurality of cleaning components are provided in sequence along the transmission direction of the first transmission mechanism, including a first cleaning structure, a solder absorbent structure, a second cleaning structure, a first detection component, and an upper flux structure, wherein the first transfer structure is connected to one side of the upper flux structure.

[0007] In one embodiment of this application, the first cleaning structure and the second cleaning structure have the same structure, both including a cleaning roller and a driving structure for driving the cleaning roller to rotate relative to the chip. The side of the cleaning roller away from the chip is provided with a liquid injection structure for injecting cleaning agent into the cleaning roller.

[0008] In one embodiment of this application, the desoldering liquid structure is provided with a take-up drum, an unwind drum, and a soldering iron in a vertically downward direction. A desoldering strip is provided between the unwind drum and the take-up drum, and the desoldering strip is wrapped around the soldering iron.

[0009] In one embodiment of this application, the mounting base has a mounting groove with a depth less than the height of the chip, and the bottom area of ​​the mounting groove is greater than or equal to the bottom area of ​​the chip. The mounting base has a magnetic attraction component relative to the chip.

[0010] In one embodiment of this application, multiple heating structures are spaced apart and arranged sequentially along the transmission direction of the second transmission mechanism, and each heating structure corresponds to a positioning seat; The cooling unloading section includes multiple positioning seats.

[0011] In one embodiment of this application, a plurality of detection structures are provided in sequence along the transmission direction of the third transmission mechanism, including a second detection component, an NG structure, and a third cleaning structure, and the third transmission structure has a feeding structure on the side of the third cleaning structure opposite to the NG structure.

[0012] The present invention also provides a chip-mount soldering method, including the chip-mount soldering apparatus described above, wherein the chip-mount soldering method includes; S1, the new or repairable chip is loaded onto the mounting base of the first transmission mechanism, and the chip passes through each cleaning structure in sequence under the action of the first transmission mechanism; S2, the first transfer structure will pick up the cleaned chip and transfer it to the positioning seat of the second transfer mechanism; S3, the magnetic base of the positioning seat attracts the chip, and after the chip is initially positioned, the positioning structure completely fixes the chip and makes the chip and the magnetic base coaxial. S4, the positioning seat, carrying the chip, reaches the mesh placement structure under the action of the second transmission mechanism. The mesh placement structure places the steel mesh on the chip, and the steel mesh itself is attracted to the chip by the magnetic seat. S5, the positioning seat carries the chip to the soldering structure. The ball tube and the stencil maintain a gap to prevent the solder balls from leaking out. The ball tube gradually passes through the surface of the stencil under the action of the moving module. When the solder balls encounter through holes, they can quickly fill the through holes. The air pump and the solder ball delivery tube work together to refill the space between the ball tube and the stencil. S6, the stencil, solder balls, and chip gradually pass through the heating structure under the action of the second transmission mechanism; S7, the positioning seat carries the chip and steel mesh for natural heat dissipation at the cooling unloading section, and the steel mesh is taken away by the net-collecting structure after cooling is completed; S8, the second transfer structure sends the chip with the tin plating completed to the third transfer mechanism, and under the drive of the third transfer mechanism, it passes through each detection structure in sequence.

[0013] In one embodiment of this application, S4 further includes: S41, the mesh placement structure adjusts the size of the steel mesh to be placed according to the chip model being processed; S42, when the steel mesh reaches the positioning seat under the action of the mesh-laying structure, the steel mesh, the magnetic seat, and the chip are coaxially arranged; S43, the stencil is brought close to the chip under the drive of the meshing structure, and is attracted to the chip surface by the magnetic holder, so that the through holes and solder pads are connected to each other.

[0014] In one embodiment of this application, S5 further includes: S51, after the soldering is completed, the air pump stops working, and the tube moves away from the chip where the soldering is completed under the action of the moving module.

[0015] By adopting the above technical solution, the present invention has the following advantages: This embodiment provides a chip-mount soldering device, the overall structure of which may include a cleaning mechanism for cleaning chips, a soldering mechanism for soldering, and an acceptance testing mechanism. This modular design enables the device to automate the chip soldering process.

[0016] Specifically, the cleaning mechanism is used to pre-process the chip. This mechanism may include a first transport mechanism, such as a linear guide or a rotary disk, for carrying and moving the chip. Multiple cleaning components may be arranged around the outer periphery of the first transport mechanism and facing it. These cleaning components can take various forms, such as brush heads for physical wiping, air nozzles for blowing away particles, or nozzles for spraying cleaning fluid. The first transport mechanism may be equipped with a mounting base for connecting to the chip. The mounting base may use mechanical clamps or vacuum suction cups to secure the chip.

[0017] The soldering mechanism is responsible for the soldering process of the chips. This mechanism may include a second transport mechanism, such as a stepper motor-driven conveyor belt or turntable, for moving chips between different workstations. Around the outer periphery of the second transport mechanism, a wire mesh placement structure, a soldering structure, and a heating structure can be sequentially arranged along its transport direction. The second transport mechanism may have multiple positioning seats, which can sequentially form a loading section, a soldering section, and a cooling unloading section along the transport direction. A first transfer structure, such as a robotic arm or a suction cup gripper, can be provided between the loading section and the first transport mechanism to transfer the chips from the cleaning mechanism to the soldering mechanism. A second transfer structure can be provided between the end of the cooling unloading section away from the soldering section and the detection mechanism to transfer the soldered chips to the detection mechanism. The positioning seats within the soldering section can correspond to the wire mesh placement structure, the soldering structure, and the heating structure. A wire mesh retraction structure, such as a device for clamping or winding the stencil, can be provided near the second transfer structure in the cooling unloading section.

[0018] The inspection mechanism is used to perform quality acceptance testing on the chips after soldering. This mechanism may include a third transport mechanism, such as a linear guide or conveyor belt, for carrying the chips. Multiple inspection structures can be sequentially arranged along the transport direction of the third transport mechanism, and the chips pass through these inspection structures in sequence under the drive of the third transport mechanism. The inspection structures may include a vision inspection unit or an electrical performance testing unit, etc.

[0019] A positioning base is used to precisely secure chips during the soldering process. The positioning base can include a magnetic base, such as a permanent magnet or electromagnet, for magnetically attracting the chip. A positioning structure can be arranged around the magnetic base. The positioning structure can take the form of a mechanical limiting block or a tapered guide groove. After the chip is attracted and secured by the magnetic base, the positioning structure can further act on the chip to achieve coaxial alignment with the magnetic base, thereby ensuring precise chip alignment.

[0020] The solder ball implantation structure is the core component for solder ball implantation. This structure can include an ejector tube, such as a metal or plastic tube with a specific inner diameter. A moving module, such as a linear motor or lead screw drive, can be connected to the ejector tube to drive its reciprocating movement along the chip surface. Multiple ejector tubes can be arrayed in a row along a direction perpendicular to the moving module's movement. One end of the ejector tube facing the chip can have a solder ball outlet, and the other end can be connected to an air pump, such as a miniature air pump to provide air pressure. A solder ball delivery tube, such as a conduit for replenishing solder balls, can be connected to the ejector tube near the solder ball outlet. The diameter of the solder ball outlet can be adapted to the size of the solder ball to ensure smooth ejection.

[0021] A stencil placement structure is used to place a stencil onto a chip for precise positioning of solder pads. The stencil can be made of a thin metal sheet with multiple vias relative to the solder pad array, each via sized to accommodate only one solder ball. The stencil placement structure can employ a robotic arm or pneumatic clamp to precisely place the stencil onto the chip surface. The distance between the solder ball exit and the stencil can be set to be less than the radius of any single solder ball to prevent leakage during placement.

[0022] This application effectively solves the problem of traditional soldering devices being unable to adapt to different chip models due to their fixed nozzle layout by integrating cleaning, soldering, and testing mechanisms, and employing a flexible stencil placement structure with replaceable steel mesh and an array-type moving ball tube soldering structure. This enables rapid switching and precise soldering of multiple chip models, improving the equipment's versatility and production efficiency. Simultaneously, precise chip positioning and soldering process control ensure soldering quality. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the chip-mount soldering device of the present invention; Figure 2 This is a schematic diagram of the first cleaning structure of the chip-mount soldering device of the present invention; Figure 3 This is a schematic diagram of the desoldering solution structure of the chip-mounting soldering device of the present invention; Figure 4 This is a schematic diagram of the soldering structure of the chip-mount soldering device of the present invention; Figure 5 This is a schematic diagram of the positioning base of the chip-mount soldering device of the present invention; Figure 6 This is a schematic diagram of the chip-mount soldering method of the present invention; Figure 7 This is a schematic diagram of the mesh placement structure of the chip mounting method of the present invention; Figure 8 This is a schematic diagram illustrating the completion of the soldering structure in the chip-mount soldering method of the present invention.

[0025] Explanation of icon numbers: 1. Cleaning mechanism; 11. First transfer mechanism; 12. Mounting base; 13. Mounting slot; 2. Cleaning assembly; 21. Second cleaning structure; 22. First detection assembly; 23. Flux application structure; 24. First transfer structure; 3. First cleaning structure; 31. Cleaning roller; 32. Flux injection structure; 4. Solder suction structure; 41. Rewind drum; 42. Unwind drum; 43. Soldering iron; 44. Solder suction bar; 5. Solder placement mechanism; 51. Second transfer mechanism; 52. 53. Positioning seat; 54. Magnetic suction seat; 55. Positioning structure; 56. Loading section; 57. Soldering section; 58. Cooling unloading section; 59. Second transfer structure; 60. Mesh placement structure; 61. Steel mesh; 72. Soldering structure; 73. Ball outlet tube; 74. Solder ball delivery tube; 75. Moving module; 8. Heating structure; 9. Mesh collection structure; 10. Detection mechanism; 101. Third transmission mechanism; 102. Second detection component; 103. NG structure; 104. Third cleaning structure.

[0026] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0028] Reference Figures 1 to 5 To achieve the above objectives, the present invention proposes a subject-specific method. To achieve the above objectives, the present invention proposes a chip-mounting soldering device, comprising a cleaning mechanism 1 for cleaning chips, a soldering mechanism 5 for soldering, and an inspection mechanism 10 for acceptance testing. The cleaning mechanism 1 includes a first transmission mechanism 11 and a plurality of cleaning components 2. The plurality of cleaning components 2 surround the outer periphery of the first transmission mechanism 11 and are disposed toward the first transmission mechanism 11. The first transmission mechanism 11 is provided with a mounting base 12 for connecting to the chip relative to the cleaning components 2. The tin-planting mechanism 5 includes a second transmission mechanism 51 and a mesh-laying structure 6, a tin-planting structure 7, and a heating structure 8 arranged sequentially around the second transmission mechanism 51 and along the transmission direction of the second transmission mechanism 51. The second transmission mechanism 51 is provided with multiple positioning seats 52. The multiple positioning seats 52 are sequentially formed into a feeding section 55, a tin-planting section 56, and a cooling unloading section 57 along the transmission direction of the second transmission mechanism 51. A first transfer structure 24 is provided between the feeding section 55 and the first transmission mechanism 11. A second transfer structure 58 is provided between the end of the cooling unloading section 57 away from the tin-planting section 56 and the tin-planting mechanism 5. The multiple positioning seats 52 in the tin-planting section 56 correspond one-to-one with the mesh-laying structure 6, the tin-planting structure 7, and the heating structure 8. A mesh-receiving structure 9 is provided near the second transfer structure 58 in the cooling unloading section 57. The detection mechanism 10 includes a third transmission mechanism 101 and multiple detection structures. The chip passes through the multiple detection structures sequentially under the action of the third transmission mechanism 101. The positioning base 52 includes a magnetic base 53 and a positioning structure 54. The positioning structure 54 surrounds the magnetic base 53. When the chip is magnetically fixed on the magnetic base 53, the chip will be coaxially set with the magnetic base 53 under the action of the positioning structure 54. The soldering structure 7 includes a ball ejector tube 71 and a moving module 73 for driving the ball ejector tube 71 to reciprocate along the surface of the chip. Multiple ball ejector tubes 71 are arranged in an array along a moving direction perpendicular to the moving module 73. One end of the ball ejector tube 71 faces the chip and has a solder ball outlet, and the other end has an air pump. The ball ejector tube 71 is connected to a solder ball delivery tube 72 near the solder ball outlet. The diameter of the solder ball outlet is adapted to the solder ball. The mesh structure 6 is used to place the stencil 61, which is used to position the solder dots, on the chip. The stencil 61 has multiple through holes that can only accommodate one solder ball at a time relative to the solder dot array. The distance between the solder ball outlet and the stencil 61 is less than the radius of any solder ball.

[0029] This embodiment provides a chip-mount soldering device, the overall structure of which may include a cleaning mechanism 1 for cleaning chips, a soldering mechanism 5 for soldering, and an inspection mechanism 10 for acceptance. This modular design enables the device to automate the chip soldering process.

[0030] Specifically, the cleaning mechanism 1 is used to pre-process the chip. This mechanism may include a first transfer mechanism 11, such as a linear guide or a rotary disk, for carrying and moving the chip. Multiple cleaning components 2 may be arranged around the outer periphery of the first transfer mechanism 11 and facing the transfer mechanism. These cleaning components 2 can take various forms, such as brush heads for physical wiping, air nozzles for blowing away particles, or nozzles for spraying cleaning fluid. The first transfer mechanism 11 may be provided with a mounting base 12 for connecting to the chip. The mounting base 12 may use mechanical clamps or vacuum suction cups to fix the chip.

[0031] The soldering mechanism 5 is responsible for the soldering process of the chip. This mechanism may include a second transfer mechanism 51, such as a stepper motor-driven conveyor belt or turntable, for moving the chip between different workstations. Around the outer periphery of the second transfer mechanism 51, a mesh placement structure 6, a soldering structure 7, and a heating structure 8 can be sequentially arranged along its transfer direction. The second transfer mechanism 51 may have multiple positioning seats 52, which can sequentially form a loading section 55, a soldering section 56, and a cooling unloading section 57 along the transfer direction. A first transfer structure 24, such as a robotic arm or a suction cup gripper, can be provided between the loading section 55 and the first transfer mechanism 11 to transfer the chip from the cleaning mechanism 1 to the soldering mechanism 5. A second transfer structure 58 can be provided between the end of the cooling unloading section 57 away from the soldering section 56 and the detection mechanism 10 to transfer the soldered chip to the detection mechanism 10. The positioning seats 52 within the soldering section 56 can correspond to the mesh placement structure 6, the soldering structure 7, and the heating structure 8. The cooling unloading section 57 may be provided with a wire mesh taking-up structure 9 near the second transfer structure 58, for example, it may be a device for clamping or winding the wire mesh 61.

[0032] The inspection mechanism 10 is used to perform quality acceptance testing on the chip after soldering. This mechanism may include a third transmission mechanism 101, such as a linear guide or conveyor belt, for carrying the chip. Multiple inspection structures can be sequentially arranged along the transmission direction of the third transmission mechanism 101, and the chip passes through these inspection structures sequentially under the drive of the third transmission mechanism 101. The inspection structures may include a vision inspection unit or an electrical performance testing unit, etc.

[0033] The positioning base 52 is used to precisely fix the chip during the soldering process. The positioning base 52 may include a magnetic base 53, such as a permanent magnet or electromagnet, for magnetically attracting the chip. The positioning structure 54 may be arranged around the magnetic base 53. The positioning structure 54 may take the form of a mechanical limiting block or a tapered guide groove. After the chip is attracted and fixed by the magnetic base 53, the positioning structure 54 can further act on the chip to make it coaxial with the magnetic base 53, thereby ensuring precise alignment of the chip.

[0034] The solder ball implantation structure 7 is the core component for solder ball implantation. This structure may include a ball ejector tube 71, which may be a metal or plastic tube with a specific inner diameter. A moving module 73, which drives the ball ejector tube 71 to reciprocate along the chip surface, may be connected to the ball ejector tube 71, and may be a linear motor or a lead screw drive mechanism. Multiple ball ejector tubes 71 may be arranged in an array along a direction perpendicular to the moving module 73, forming a row. One end of the ball ejector tube 71 facing the chip may have a solder ball outlet, and the other end may be connected to an air pump, such as a miniature air pump that provides air pressure. A solder ball delivery tube 72 may be connected to the ball ejector tube 71 near the solder ball outlet, such as a pipe for replenishing solder balls. The diameter of the solder ball outlet may be adapted to the size of the solder ball to ensure smooth discharge of the solder ball.

[0035] The stencil placement structure 6 is used to place the stencil 61 onto the chip for precise positioning of the solder pads. The stencil 61 can be made of a thin metal sheet with multiple through-holes relative to the solder pad array, each through-hole being sized to accommodate only one solder ball. The stencil placement structure 6 can use a robotic arm or pneumatic clamp to precisely place the stencil 61 onto the chip surface. The distance between the solder ball exit and the stencil 61 can be set to be less than the radius of any single solder ball to prevent leakage during the solder ball implantation process.

[0036] This application effectively solves the problem of traditional soldering devices being unable to adapt to different chip models due to the fixed nozzle layout by integrating cleaning, soldering, and testing mechanisms 10, and adopting a flexible replaceable stencil 61 mesh placement structure 6 and an array-type moving ball tube 71 soldering structure 7. This enables rapid switching and precise soldering of multiple chip models, improving the equipment's versatility and production efficiency. Simultaneously, precise chip positioning and soldering process control ensure soldering quality.

[0037] Through the above technical solution, this application arranges multiple cleaning components 2 of the cleaning mechanism 1 sequentially along the transmission direction of the first transmission mechanism 11, forming a systematic and streamlined cleaning process, including preliminary cleaning, solder absorbent treatment, secondary fine cleaning, cleaning effect detection, and flux coating. This sequential processing flow ensures that the chip surface can be thoroughly and effectively cleaned before entering the soldering mechanism 5, effectively avoiding the problems of incomplete or inefficient residue removal. Simultaneously, the first transfer structure 24 is connected to one side of the upper flux structure 23, allowing the chip to be immediately transferred to the soldering mechanism 5 after all cleaning and flux coating are completed, reducing the waiting time in intermediate steps and improving the overall equipment operating efficiency and production continuity. Given that the solution of this application involves implanting solder balls into the chip, the melting of the solder balls and the formation of stable solder joints require the assistance of flux. Therefore, the cleaned chip needs flux on its surface, and the upper flux structure 23 is designed for this purpose, thus providing a good foundation for the subsequent soldering process and significantly improving the success rate of soldering and the reliability of the solder balls.

[0038] In one embodiment of this application, a plurality of cleaning components 2 are sequentially provided along the transmission direction of the first transmission mechanism 11, including a first cleaning structure 3, a solder absorbent structure 4, a second cleaning structure 21, a first detection component 22, and an upper flux structure 23, and a first transfer structure 24 is connected to one side of the upper flux structure 23.

[0039] In one embodiment of this application, the first cleaning structure 3 and the second cleaning structure 21 have the same structure, both including a cleaning roller 31 and a driving structure for driving the cleaning roller 31 to rotate relative to the chip. The side of the cleaning roller 31 away from the chip is provided with a liquid injection structure 32 for injecting cleaning agent into the cleaning roller 31.

[0040] By designing the first cleaning structure 3 and the second cleaning structure 21 to have identical structures, the problem of high complexity in device manufacturing and maintenance and inconsistent cleaning processes caused by structural differences is effectively solved. Specifically, the unified structural design greatly simplifies the production process, reduces manufacturing costs, and makes spare parts management and maintenance operations more convenient and efficient. The cleaning roller 31 effectively removes impurities from the chip surface through physical contact, while the drive structure ensures that the cleaning roller 31 can continuously rotate relative to the chip, providing a dynamic wiping effect, thereby avoiding residues that may be caused by static cleaning and significantly improving the thoroughness of cleaning. At the same time, the liquid injection structure 32 injects cleaning agent into the cleaning roller 31, further enhancing the cleaning ability, helping to dissolve stubborn stains, and reducing potential damage to the chip surface. Given that the cleaning mechanism 1 includes the first cleaning structure 3, the solder absorber structure 4, the second cleaning structure 21, the first detection component 22, and the flux application structure 23, by ensuring that the first cleaning structure 3 and the second cleaning structure 21 have the same structure and working principle, this application can guarantee that the chip can obtain a highly consistent and reliable cleaning effect before and after entering the solder absorber treatment and subsequent flux application treatment. This consistent cleaning process is crucial for ensuring the accuracy of subsequent soldering processes and the soldering reliability of the final product, thereby improving the overall automation level and production efficiency of chip-mount soldering equipment.

[0041] In one embodiment of this application, the solder absorbent structure 4 is provided with a take-up drum 41, an unwind drum 42, and a soldering iron 43 in a vertically downward direction. A solder absorbent strip 44 is provided between the unwind drum 42 and the take-up drum 41, and the solder absorbent strip 44 is wrapped around the soldering iron 43.

[0042] Through the above technical solution, the solder suction structure 4 can achieve continuous and efficient solder removal. Specifically, the unwinding drum 42 continuously unfolds new solder suction bars 44, allowing them to pass over the area heated by the soldering iron 43. When the solder on the chip is heated and melted, the solder suction bars 44 contact and quickly absorb the molten solder during their movement. Subsequently, the solder suction bars 44, having absorbed the solder, are wound up by the rewinding drum 41, removing the waste solder from the cleaning area. Simultaneously, new solder suction bars 44 unfold from the unwinding drum 42, continuing the cleaning process. This design effectively solves the problem of inconvenient operation in traditional solder suction methods, realizing an automated solder cleaning process and reducing manual intervention. Furthermore, the design of the solder suction bars 44 wrapping around the soldering iron 43 allows heating and absorption to occur simultaneously. The solder is absorbed the instant it melts, preventing it from re-solidifying or spreading, ensuring thorough cleaning and significantly improving cleaning efficiency. In the overall process of the cleaning mechanism 1, the efficient and thorough solder removal capability of the solder suction structure 4 ensures that the chip surface is free of solder residue before subsequent treatment by the second cleaning structure 21, the first detection component 22, and the flux application structure 23. This provides a clean substrate for subsequent soldering steps, thereby improving the success rate and quality of soldering. This continuous and automated cleaning method is highly compatible with the overall automated process of the cleaning mechanism 1, enhancing the automation level and production efficiency of the entire chip mounting soldering device.

[0043] In one embodiment of this application, the mounting base 12 is provided with a mounting groove 13 with a depth less than the height of the chip, and the bottom area of ​​the mounting groove 13 is greater than or equal to the bottom area of ​​the chip. The mounting base 12 has a magnetic attachment for the chip.

[0044] Through the above technical solution, the mounting base 12, by setting a mounting groove 13 with a depth less than the chip height, provides initial physical restraint for the chip, allowing the chip to be partially exposed when fixed, facilitating effective operation of the cleaning mechanism 1. Simultaneously, the bottom area of ​​the mounting groove 13 is greater than or equal to the bottom area of ​​the chip, ensuring good compatibility of the device with different chip models and further reducing the risk of chip tilting or sliding during transport. More importantly, the magnetic attraction element within the mounting base 12 uses magnetic force to firmly attract the chip into the mounting groove 13, greatly enhancing the chip's fixation reliability and effectively preventing chip displacement or detachment during high-speed transport or cleaning operations. These improvements work synergistically to significantly enhance the chip's positioning stability within the cleaning mechanism 1, thereby ensuring the efficiency and quality of the cleaning process, and ultimately improving the overall production efficiency and product qualification rate of the soldering device.

[0045] In one embodiment of this application, multiple heating structures 8 are spaced apart and arranged sequentially along the transmission direction of the second transmission mechanism 51, and each heating structure 8 corresponds to a positioning seat 52; The cooling unloading section 57 includes multiple positioning seats 52.

[0046] Through the above technical solution, this application achieves parallel heating of multiple chips by arranging multiple heating structures 8 at intervals along the transmission direction of the second transmission mechanism 51, with each heating structure 8 corresponding to a positioning seat 52, thereby significantly improving heating efficiency and uniformity. Simultaneously, the cooling unloading section 57 is equipped with multiple positioning seats 52, allowing sufficient time for cooling after the chips have completed soldering and heating, without hindering the subsequent chip transmission and processing. This design effectively solves the problems of low heating efficiency and uneven heating that may result from a single heating structure 8, as well as the production bottleneck caused by long cooling times. The multiple heating structures 8 and the multiple positioning seats 52 of the cooling unloading section 57 can solve the problem that the heating and cooling time is longer than the soldering time at the soldering structure 7. With the above structure, the second transmission mechanism 51 can be put into operation immediately after the chip soldering is completed. The chip can be heated effectively after passing through the multiple heating structures 8, and the multiple positioning seats 52 in the cooling unloading section 57 can give the chip a longer cooling time. The above structure can make the whole machine highly integrated, maximize the use of the power of each mechanism, and minimize the downtime of some machines, thereby greatly improving the production efficiency and soldering quality of chip soldering.

[0047] In one embodiment of this application, a plurality of detection structures are provided in sequence along the transmission direction of the third transmission mechanism 101, including a second detection component 102, an NG structure 103, and a third cleaning structure 104. The third transmission structure has a feeding structure on the side of the third cleaning structure 104 that is away from the NG structure 103.

[0048] Through the above technical solution, multiple detection structures are sequentially arranged along the transmission direction of the third transmission mechanism 101, including the second detection component 102, the NG structure 103, and the third cleaning structure 104. This ensures that the chips are detected, defective products are processed, and cleaned in sequence during transmission, avoiding interference and delays between steps, thereby improving the continuity and overall efficiency of the detection. The second detection component 102 performs quality assessment on the chips after soldering, identifying qualified and unqualified products, providing accurate basis for subsequent operations. The NG structure 103 is used to process unqualified chips identified by the second detection component 102, preventing them from entering subsequent processes and causing resource waste or errors. The third cleaning structure 104 is used to clean the chip surface residue after processing by the NG structure 103, ensuring the cleanliness of the chips and preventing impurities from affecting the final performance. The third transmission structure has a feeding structure on the side of the third cleaning structure 104 opposite to the NG structure 103, allowing the cleaned qualified chips to directly enter the feeding stage, achieving seamless connection between detection and output. This sequential design, through the synergistic effect of various features, not only solves the problem of chaotic testing processes, but also optimizes resource utilization and improves the automation, stability, and efficiency of the tin-bonding process.

[0049] The following is in conjunction with the appendix Figures 6 to 8 The present invention will be further described below.

[0050] The present invention also proposes a chip-mount soldering method, including the chip-mount soldering device described above. The specific structure of the chip-mount soldering device is as described in the above embodiments. Since the chip-mount soldering method adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0051] S1, the new or repairable chip is loaded onto the mounting base 12 of the first transmission mechanism 11, and the chip passes through each cleaning structure in sequence under the action of the first transmission mechanism 11; S2, the first transfer structure 24 will pick up the cleaned chip and transfer it to the positioning seat 52 of the second transfer mechanism 51; S3, the magnetic base 53 of the positioning base 52 attracts the chip, and after the chip is initially positioned, the positioning structure 54 completely fixes the chip and makes the chip and the magnetic base 53 coaxially set. S4, the positioning seat 52, carrying the chip, reaches the mesh placement structure 6 under the action of the second transmission mechanism 51. The mesh placement structure 6 places the steel mesh 61 on the chip, and the steel mesh 61 itself is attracted to the chip by the magnetic seat 53. S5, the positioning seat 52 carries the chip to the soldering structure 7, the ball tube 71 and the stencil 61 maintain a distance to prevent the solder balls from leaking out, the ball tube 71 gradually passes through the surface of the stencil 61 under the action of the moving module 73, the solder balls can be quickly filled into the through holes when they encounter through holes, the air pump and the solder ball delivery tube 72 work together to make new solder balls refill between the ball tube 71 and the stencil 61; S6, the stencil 61, solder balls, and chips gradually pass through the heating structure 8 under the action of the second transmission mechanism 51; S7, the positioning seat 52 carries the chip and the steel mesh 61 to dissipate heat naturally at the cooling unloading section 57, and after cooling is completed, the steel mesh 61 is taken away by the net collecting structure 9; S8, the second transfer structure 58 sends the chip with the tin plating completed to the third transfer mechanism 101, and under the drive of the third transfer mechanism 101, it passes through each detection structure in sequence.

[0052] Through the above technical solution, this application proposes a chip-mounting soldering method. This method effectively solves problems such as inaccurate chip positioning, inaccurate placement of the stencil 61, low solder ball filling efficiency, and poor coordination of subsequent processing steps during the soldering process through a series of orderly and automated steps. Specifically, in step S1, the chip is thoroughly cleaned, ensuring the quality of soldering from the source. In step S2, the first transfer structure 24 achieves seamless connection between the cleaning mechanism 1 and the soldering mechanism 5, significantly improving production efficiency and reducing errors caused by manual operation. In step S3, the magnetic holder 53 and the positioning structure 54 work together to ensure the precise positioning and coaxial setting of the chip during the soldering process, providing a stable foundation for the subsequent placement of the stencil 61 and solder ball filling, greatly improving the accuracy of soldering. In step S4, the stencil placement structure 6 precisely places the stencil 61 and is attracted by the magnetic holder 53, ensuring close contact and accurate alignment between the stencil 61 and the chip, effectively adapting to the rapid switching requirements of different chip models. In step S5, the coordinated operation of the ball ejector tube 71, the moving module 73, the air pump, and the solder ball delivery tube 72 enables rapid, continuous, and precise filling of the solder balls. Simultaneously, the small gap between the ball ejector tube 71 and the stencil 61 is maintained, effectively preventing solder ball leakage and ensuring uniform and complete filling. Step S6 ensures uniform melting and reliable connection of the solder balls through controlled heating. Step S7's cooling and stencil collection process ensures stable solidification of the solder joints and enables the recycling of the stencil 61. Finally, step S8 uses the second transfer structure 58 to send the solder-planted chip to the inspection mechanism 10 for comprehensive quality inspection, thereby ensuring the reliability and pass rate of the final product. Overall, this method, through highly automated process design and close cooperation between various mechanisms, not only significantly improves the efficiency and accuracy of chip soldering and reduces production costs and defect rates, but also enhances adaptability to different chip models, providing an efficient and reliable solution for chip manufacturing and repair.

[0053] In one embodiment of this application, S4 further includes: S41, the mesh placement structure 6 adjusts the model of the steel mesh 61 to be placed according to the chip model being processed; S42, when the steel mesh 61 reaches the positioning seat 52 under the action of the mesh laying structure 6, the steel mesh 61, the magnetic seat 53, and the chip are coaxially arranged; S43, the stencil 61 is driven by the meshing structure 6 to approach the chip and is attracted to the surface of the chip by the magnetic holder 53, so that the through holes and soldering points are connected to each other.

[0054] Through the above technical solutions, this application effectively solves the problems of inflexible soldering processes, insufficient alignment accuracy between the stencil 61 and the chip, and unstable fixation in the prior art. Specifically, by adjusting the model of the stencil 61 to be placed according to the chip model through the placement structure 6, the device can dynamically adapt to chips of different specifications, significantly improving the flexibility and versatility of the soldering process and avoiding production interruptions or rework due to model mismatch. At the same time, by ensuring the coaxial arrangement of the stencil 61, the magnetic holder 53, and the chip, the alignment accuracy between the stencil 61 and the chip is greatly improved, laying the foundation for accurate filling of subsequent solder balls and effectively reducing the risk of solder ball misalignment or missed placement. In addition, driven by the placement structure 6, the stencil 61 is close to the chip and firmly attracted by the magnetic holder 53, ensuring that the stencil 61 will not shift during the soldering process, thereby ensuring that the solder balls can be accurately filled into the through-holes of the stencil 61 and tightly connected to the soldering points of the chip. Overall, these improvements work synergistically to significantly improve the automation, accuracy, and reliability of chip soldering, ultimately improving the success rate of soldering and the overall quality of the chip.

[0055] In one embodiment of this application, S5 further includes: S51, after the soldering is completed, the air pump stops working, and the ball tube 71 moves away from the chip where the soldering is completed under the action of the moving module 73.

[0056] By employing the aforementioned technical solution, the air pump is immediately stopped after soldering is completed, and the ejector tube 71 is moved away from the chip by the moving module 73. This effectively solves the problems of solder ball waste, chip contamination, and the ejector tube 71 obstructing subsequent operations after soldering. The cessation of the air pump allows for precise control of the solder ball supply, preventing unnecessary solder ball overflow, thus saving material costs and maintaining the cleanliness of the chip surface. Simultaneously, the timely removal of the ejector tube 71 provides clear operating space for subsequent heating, cooling, and transfer steps, eliminating the risk of physical interference and significantly improving the automation and operational efficiency of the entire soldering process. This optimization ensures a smooth soldering process, improves soldering quality, and enhances equipment reliability.

[0057] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0058] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A chip-mount soldering device, characterized in that, This includes cleaning mechanisms for cleaning chips, soldering mechanisms for soldering, and testing mechanisms for acceptance testing. The cleaning mechanism includes a first transmission mechanism and a plurality of cleaning components. The plurality of cleaning components surround the outer periphery of the first transmission mechanism and are disposed toward the first transmission mechanism. The first transmission mechanism is provided with a mounting base for connecting to the chip relative to the cleaning components. The tin-coating mechanism includes a second transmission mechanism and a wire-laying structure, a tin-coating structure, and a heating structure arranged sequentially around the second transmission mechanism along its transmission direction. The second transmission mechanism has multiple positioning seats, which sequentially form a feeding section, a tin-coating section, and a cooling unloading section along its transmission direction. A first transfer structure is provided between the feeding section and the first transmission mechanism. A second transfer structure is provided between the end of the cooling unloading section away from the tin-coating section and the tin-coating mechanism. The multiple positioning seats in the tin-coating section correspond one-to-one with the wire-laying structure, the tin-coating structure, and the heating structure. A wire-receiving structure is provided near the second transfer structure in the cooling unloading section. The detection mechanism includes a third transmission mechanism and multiple detection structures. The chip passes through the multiple detection structures sequentially under the action of the third transmission mechanism. The positioning base includes a magnetic base and a positioning structure. The positioning structure surrounds the magnetic base. When the chip is magnetically fixed on the magnetic base, the chip will be coaxially positioned with the magnetic base under the action of the positioning structure. The soldering structure includes a ball ejector tube and a moving module for driving the ball ejector tube to reciprocate along the surface of the chip. Multiple ball ejector tubes are arranged in an array along a direction perpendicular to the moving module. One end of the ball ejector tube faces the chip and has a solder ball outlet, while the other end has an air pump. A solder ball feeding tube is connected to the ball ejector tube near the solder ball outlet. The diameter of the solder ball outlet of the ball ejector tube is adapted to the solder ball. The mesh placement structure is used to place a stencil used to position solder dots on the chip. The stencil has multiple through holes relative to the solder dot array, each capable of accommodating only one solder ball. The distance between the solder ball outlet and the stencil is less than the radius of any solder ball.

2. The chip-mount soldering device according to claim 1, characterized in that, The multiple cleaning components are arranged sequentially along the transmission direction of the first transmission mechanism, including a first cleaning structure, a solder absorbent structure, a second cleaning structure, a first detection component, and an upper flux structure, with the first transfer structure connected to one side of the upper flux structure.

3. The chip-mount soldering device according to claim 2, characterized in that, The first cleaning structure and the second cleaning structure have the same structure, both including a cleaning roller and a driving structure for driving the cleaning roller to rotate relative to the chip. The cleaning roller is provided with a liquid injection structure for injecting cleaning agent into the cleaning roller on the side away from the chip.

4. The chip-mount soldering device according to claim 2, characterized in that, The desoldering liquid structure is provided with a take-up drum, an unwind drum, and a soldering iron in a vertically downward direction. A desoldering strip is provided between the unwind drum and the take-up drum, and the desoldering strip is wrapped around the soldering iron.

5. A chip-mount soldering device according to claim 1, characterized in that, The mounting base has a mounting groove with a depth less than the height of the chip, and the bottom area of ​​the mounting groove is greater than or equal to the bottom area of ​​the chip. The mounting base has a magnetic attraction component relative to the chip.

6. The chip-mount soldering device according to claim 1, characterized in that, The heating structures are spaced apart and arranged sequentially along the transmission direction of the second transmission mechanism, with each heating structure corresponding to a positioning seat; The cooling unloading section includes multiple positioning seats.

7. A chip-mount soldering device according to claim 1, characterized in that, The plurality of detection structures are arranged in sequence along the transmission direction of the third transmission mechanism, including a second detection component, an NG structure, and a third cleaning structure. The third transmission structure has a feeding structure on the side of the third cleaning structure opposite to the NG structure.

8. A chip-mount soldering method, characterized in that, The method includes a chip-mount soldering apparatus as described in claim 1, further comprising: S1, the new or repairable chip is loaded onto the mounting base of the first transmission mechanism, and the chip passes through each cleaning structure in sequence under the action of the first transmission mechanism; S2, the first transfer structure will pick up the cleaned chip and transfer it to the positioning seat of the second transfer mechanism; S3, the magnetic base of the positioning seat attracts the chip, and after the chip is initially positioned, the positioning structure completely fixes the chip and makes the chip and the magnetic base coaxial. S4, the positioning seat, carrying the chip, reaches the mesh placement structure under the action of the second transmission mechanism. The mesh placement structure places the steel mesh on the chip, and the steel mesh itself is attracted to the chip by the magnetic seat. S5, the positioning seat carries the chip to the soldering structure. The ball tube and the stencil maintain a gap to prevent the solder balls from leaking out. The ball tube gradually passes through the surface of the stencil under the action of the moving module. When the solder balls encounter through holes, they can quickly fill the through holes. The air pump and the solder ball delivery tube work together to refill the space between the ball tube and the stencil. S6, the stencil, solder balls, and chip gradually pass through the heating structure under the action of the second transmission mechanism; S7, the positioning seat carries the chip and steel mesh for natural heat dissipation at the cooling unloading section, and the steel mesh is taken away by the net-collecting structure after cooling is completed; S8, the second transfer structure sends the chip with the tin plating completed to the third transfer mechanism, and under the drive of the third transfer mechanism, it passes through each detection structure in sequence.

9. A chip-mount soldering method according to claim 8, characterized in that, S4 further includes: S41, the mesh placement structure adjusts the size of the steel mesh to be placed according to the chip model being processed; S42, when the steel mesh reaches the positioning seat under the action of the mesh-laying structure, the steel mesh, the magnetic seat, and the chip are coaxially arranged; S43, the stencil is brought close to the chip under the drive of the meshing structure, and is attracted to the chip surface by the magnetic holder, so that the through holes and solder pads are connected to each other.

10. A chip surface mount soldering method according to claim 8, characterized in that, The S5 also includes: S51, after the soldering is completed, the air pump stops working, and the tube moves away from the chip where the soldering is completed under the action of the moving module.

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