On-chip temperature sensing method for integrated circuit heat distribution monitoring
By embedding a multi-layered microstructure thermal response unit and data assimilation algorithm into an integrated circuit, the problems of insufficient spatiotemporal resolution and excessive system overhead in the prior art are solved, realizing real-time monitoring of temperature field with high spatiotemporal resolution and improving the accuracy and adaptability of heat distribution monitoring.
Patent Information
- Application Number
- CN202610542595.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-04-23
- Publication Date
- 2026-05-19
- Estimated Expiration
- 2046-04-23
AI Technical Summary
Existing on-chip temperature sensing methods face a dilemma in pursuing high spatial resolution and low system overhead. The mismatch between the sensing mechanism and the dynamic characteristics of the thermal field in the spatiotemporal dimension leads to insufficient spatiotemporal resolution, significant thermal blind zone and excessive system overhead.
A multi-layered on-chip temperature sensing method, including a basic sensing layer, a regional aggregation layer, and a global coordination layer, is adopted. The thermal time constant of the microstructure thermal response unit is used as a dynamic sensing parameter. Combined with pulse heating-cooling timing measurement and a data assimilation algorithm based on partial differential equations, high spatiotemporal resolution thermal distribution monitoring is achieved.
It achieves real-time monitoring of three-dimensional temperature fields with sub-millimeter spatial and microsecond temporal resolution, eliminating thermal blind spots, improving the accuracy and physical consistency of thermal field reconstruction, and controlling hardware resource consumption.