Communication base station with double-sided heat dissipation

Abstract

The invention discloses a double-sided heat dissipation communication base station which comprises a filter and a main radiator, a main board is arranged between the filter and the main radiator, and an auxiliary radiator is further arranged between the filter and the main board. Wherein the main board is embedded in the main radiator, the auxiliary radiator is connected with the main radiator and the filter, a first heat dissipation structure is arranged on the side, away from the main board, of the main radiator, the auxiliary radiator comprises a substrate, and a second heat dissipation structure is arranged on the side, close to the filter, of the substrate; one side, close to the mainboard, of the substrate is provided with a plurality of shielding separation ribs in contact with the mainboard, and the first heat dissipation structure and the second heat dissipation structure are exposed in the air. According to the base station, the heat dissipation channel is additionally arranged between the filter and the main heat dissipation device, efficient double-face heat dissipation is achieved for the main board in the base station, and compared with a traditional single-face heat dissipation base station, the tooth height of the main heat dissipation device is reduced, so that the overall size of the base station is reduced.

Description

Technical Field

[0001] This invention belongs to the field of communication base station technology, and particularly relates to a communication base station with double-sided heat dissipation. Background Technology

[0002] The RRU (Remote Radio Unit) is the core front-end equipment of a mobile communication distributed base station. It is deployed separately from the BBU (Base Band Unit) via optical fiber (CPRI / eCPRI protocol). It is responsible for the conversion, amplification, and transmission and reception of digital baseband signals and radio frequency signals. It is a key carrier for wireless signal coverage and capacity and is widely used in 4G / 5G macro base stations, micro base stations, and pico base stations. In the RRU system structure, it is generally composed of four major components: filter, heat sink, shielding cover plate and motherboard. In traditional base stations, the heat sink undertakes the heat dissipation function of heat-generating components such as power amplifier, digital chip, and power supply. The shielding cover plate is installed on the motherboard side inside the whole machine to provide shielding and isolation for electronic components. When the base station's transmission power is low, the traditional main heat sink can meet the temperature requirements for the normal operation of the components. However, with the imminent arrival of the 6G era, operators have increasingly higher demands for expanding the coverage distance and increasing the speed of base stations. The new generation of base stations faces the urgent need for continuous improvement in transmission power. In order to meet the heat dissipation requirements of high-power base stations, it is necessary to continuously increase the height of the heat sink teeth. For base stations that rely on natural heat dissipation, simply increasing the height of the teeth will reduce the heat dissipation efficiency of the main heat sink and will not yield corresponding heat dissipation benefits, while the size and weight of the base station will increase significantly. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a communication base station with double-sided heat dissipation. A heat dissipation channel is added between the filter and the main heat sink, which realizes efficient double-sided heat dissipation of the motherboard inside the base station. Compared with the traditional single-sided heat dissipation base station, the tooth height of the main heat sink is also reduced to reduce the overall size of the base station.

[0004] The objective of this invention is achieved through the following technical solution: A communication base station with double-sided heat dissipation includes a filter and a main heat sink, a motherboard is disposed between the filter and the main heat sink, and a secondary heat sink is also disposed between the filter and the motherboard. The motherboard is embedded in the main heat sink, and the secondary heat sink is connected to the main heat sink and the filter respectively. The main heat sink has a first heat dissipation structure on the side away from the motherboard. The secondary heat sink includes a substrate. The substrate has a second heat dissipation structure on the side near the filter. The substrate has a plurality of shielding ribs that contact the motherboard on the side near the motherboard. Both the first heat dissipation structure and the second heat dissipation structure are exposed to the air.

[0005] In one embodiment, the heat-generating components on the motherboard are in contact with the main heat sink and / or the secondary heat sink via a thermally conductive material.

[0006] In one embodiment, the substrate is further provided with a plurality of signal transmission channels connected to the filter on the side near the filter.

[0007] In one embodiment, the signal transmission channel has a cylindrical structure, and a waterproof sealing ring is provided between the signal transmission channel and the filter.

[0008] In one embodiment, both the first heat dissipation structure and the second heat dissipation structure include a plurality of heat dissipation fins arranged side by side.

[0009] In one embodiment, the secondary heat sink is connected to both the main heat sink and the filter via connectors.

[0010] In one embodiment, the connector is a screw, and the substrate of the secondary heat sink has a plurality of connecting posts that match the screw around its perimeter.

[0011] In one embodiment, the secondary heat sink is further provided with a sealing ring on the side near the motherboard that contacts the main heat sink.

[0012] In one embodiment, the height of the heat dissipation fins of the first heat dissipation structure is greater than the height of the heat dissipation fins of the second heat dissipation structure.

[0013] In one embodiment, a plurality of shielding ribs on the side of the substrate near the motherboard extend along a first direction and a second direction, respectively, with the shielding ribs extending along the first direction and the shielding ribs extending along the second direction being perpendicular to each other.

[0014] The beneficial effects of this invention are as follows: Abandoning the traditional approach of continuously increasing the height of the heat sink teeth to meet the heat dissipation requirements of high-power base stations, this invention places a secondary heat sink between the main heat sink and the filter. On the one hand, it allows for heat exchange with the outside air through convection, thus opening a new convection heat exchange channel. On the other hand, it also serves the function of a shielding cover in traditional base stations, shielding the motherboard. This means that the heat dissipation requirements of high-power base stations can be met without simply increasing the height of the main heat sink teeth. Compared with traditional base stations, the overall volume of the base station of this invention can be reduced by about 25% while meeting the same heat dissipation requirements. Attached Figure Description

[0015] The invention will now be described in more detail with reference to embodiments and the accompanying drawings. Figure 1 A schematic diagram of the structure of the present invention is shown; Figure 2 An exploded view of the structure of the present invention is shown. Figure 3 This shows a schematic diagram of the secondary heat sink of the present invention in one direction; Figure 4 This shows a schematic diagram of the secondary heat sink of the present invention in another direction; In the accompanying drawings, the same parts use the same reference numerals. The drawings are not to scale.

[0016] Figure label: 1-Filter, 2-Main heatsink, 3-Secondary heatsink, 4-Motherboard; 201 - First heat dissipation structure; 301-Substrate, 302-Shielding rib, 303-Second heat dissipation structure, 304-Connecting post, 305-Signal transmission channel; 401 - Heating components. Detailed Implementation

[0017] The invention will now be further described with reference to the accompanying drawings.

[0018] Example 1 This invention provides a communication base station with double-sided heat dissipation, such as... Figure 1 and Figure 2 As shown, it includes a filter 1 and a main heat sink 2. A motherboard 4 is disposed between the filter 1 and the main heat sink 2, and a secondary heat sink 3 is also disposed between the filter 1 and the motherboard 4. The motherboard 4 is embedded in the main heat sink 2, and the secondary heat sink 3 is connected to the main heat sink 2 and the filter 1 respectively. The main heat sink 2 is provided with a first heat dissipation structure 201 on the side away from the motherboard 4. The secondary heat sink 3 includes a substrate 301. The substrate 301 is provided with a second heat dissipation structure 303 on the side close to the filter 1. The substrate 301 is provided with a plurality of shielding ribs 302 that contact the motherboard 4 on the side close to the motherboard 4. The first heat dissipation structure 201 and the second heat dissipation structure 303 are both exposed to the air. It should be noted that in this embodiment, a heat dissipation channel is added between the filter 1 and the main heat sink 2, achieving efficient double-sided heat dissipation for the motherboard 4 inside the base station. That is, convective heat exchange is achieved by using the first heat dissipation structure 201 and the second heat dissipation structure 303 exposed to the air. This abandons the traditional design approach of continuously increasing the height of the heat sink teeth to meet the heat dissipation requirements of high-power base stations. The secondary heat sink 3 exchanges heat with the outside air through the second heat dissipation structure 303 on the one hand, and on the other hand, it shields the motherboard 4 through the shielding ribs 302, which also has the function of the shielding cover in the traditional base station. That is, it is not necessary to increase the height of the main heat sink 2 to meet the heat dissipation requirements of high-power base stations. Compared with traditional base stations, the overall volume of the base station of the present invention can be reduced by about 25% while meeting the same heat dissipation requirements. Furthermore, the heat-generating components 401 on the motherboard 4 are in contact with the main heat sink 2 and / or the secondary heat sink 3 through a thermally conductive material; In this embodiment, the heat from the power amplifier component with higher heat dissipation in the heat-generating component 401 is directed to the main heat sink 2 through the thermally conductive material, while the heat from the intermediate digital component with lower heat dissipation is directed to the secondary heat sink 3 through the thermally conductive material. It should be noted that the heat from the power amplifier components and intermediate digital devices can also be directed to the main heat sink 2 and the auxiliary heat sink 3 simultaneously using thermally conductive materials. The design can be adjusted according to the actual situation. In this embodiment, as Figure 2 and Figure 3 As shown, the substrate 301 is also provided with a plurality of signal transmission channels 305 connected to the filter 1 on the side near the filter 1; Specifically, the signal transmission channel 305 has a cylindrical structure, and a waterproof sealing ring is provided between the signal transmission channel 305 and the filter 1. It should be noted that the signal transmission channel 305 provided on the substrate 301 is used for signal transmission between the motherboard 4 and the filter 1. Since the first heat dissipation structure 201 is exposed to the air, the signal transmission channel 305 is protected by a waterproof sealing ring.

[0019] Example 2 This invention provides a communication base station with double-sided heat dissipation, such as... Figure 1 and Figure 2As shown, it includes a filter 1 and a main heat sink 2. A motherboard 4 is disposed between the filter 1 and the main heat sink 2, and a secondary heat sink 3 is also disposed between the filter 1 and the motherboard 4. The motherboard 4 is embedded in the main heat sink 2, and the secondary heat sink 3 is connected to the main heat sink 2 and the filter 1 respectively. The main heat sink 2 is provided with a first heat dissipation structure 201 on the side away from the motherboard 4. The secondary heat sink 3 includes a substrate 301. The substrate 301 is provided with a second heat dissipation structure 303 on the side close to the filter 1. The substrate 301 is provided with a plurality of shielding ribs 302 that contact the motherboard 4 on the side close to the motherboard 4. The first heat dissipation structure 201 and the second heat dissipation structure 303 are both exposed to the air. Specifically, the heat-generating components 401 on the motherboard 4 are in contact with the main heat sink 2 and / or the secondary heat sink 3 through a thermally conductive material. The substrate 301 is also provided with a plurality of signal transmission channels 305 connected to the filter 1 on the side near the filter 1. The signal transmission channels 305 are cylindrical in structure, and a waterproof sealing ring is provided between the signal transmission channels 305 and the filter 1. In this embodiment, as Figure 2 and Figure 3 As shown, both the first heat dissipation structure 201 and the second heat dissipation structure 303 include multiple heat dissipation fins arranged side by side, that is, heat exchange with the air is achieved through multiple heat dissipation fins exposed to the air side by side. It should be noted that the materials of the main heat sink 2 and the auxiliary heat sink 3 are not limited. They can be made of metal materials such as aluminum and copper, or composite heat sinks such as heat pipes and VC. In this embodiment, both the main heat sink 2 and the auxiliary heat sink 3 are made of aluminum alloy. Furthermore, in this embodiment, as Figure 2 As shown, the height of the heat dissipation fins of the first heat dissipation structure 201 is greater than the height of the heat dissipation fins of the second heat dissipation structure 303. That is, the auxiliary heat sink 3 bears part of the heat. Compared with traditional base stations, under the same conditions of meeting the heat dissipation requirements of high-power base stations, the tooth height of the main heat sink 2 of the present invention can be significantly reduced, while the tooth height of the auxiliary heat sink 3 is also controlled within a small range, and the overall volume can be reduced by about 25%. It should be noted that the height of the heat dissipation fins of the first heat dissipation structure 201 can also be set to be less than or equal to the height of the heat dissipation fins of the second heat dissipation structure 303, and can be reasonably designed according to the actual situation.

[0020] Example 3 This invention provides a communication base station with double-sided heat dissipation, such as... Figure 1 and Figure 2 As shown, it includes a filter 1 and a main heat sink 2. A motherboard 4 is disposed between the filter 1 and the main heat sink 2, and a secondary heat sink 3 is also disposed between the filter 1 and the motherboard 4. The motherboard 4 is embedded in the main heat sink 2, and the secondary heat sink 3 is connected to the main heat sink 2 and the filter 1 respectively. The main heat sink 2 is provided with a first heat dissipation structure 201 on the side away from the motherboard 4. The secondary heat sink 3 includes a substrate 301. The substrate 301 is provided with a second heat dissipation structure 303 on the side close to the filter 1. The substrate 301 is provided with a plurality of shielding ribs 302 that contact the motherboard 4 on the side close to the motherboard 4. The first heat dissipation structure 201 and the second heat dissipation structure 303 are both exposed to the air. Specifically, the heat-generating components 401 on the motherboard 4 are in contact with the main heat sink 2 and / or the secondary heat sink 3 through a thermally conductive material. The substrate 301 is also provided with a plurality of signal transmission channels 305 connected to the filter 1 on the side near the filter 1. The signal transmission channels 305 are cylindrical in structure, and a waterproof sealing ring is provided between the signal transmission channels 305 and the filter 1. Furthermore, both the first heat dissipation structure 201 and the second heat dissipation structure 303 include multiple heat dissipation fins arranged side by side, that is, heat exchange with the air through multiple heat dissipation fins exposed to the air side by side. Both the main heat sink 2 and the auxiliary heat sink 3 are made of aluminum alloy. Furthermore, such as Figure 2 As shown, the height of the heat dissipation fins of the first heat dissipation structure 201 is greater than the height of the heat dissipation fins of the second heat dissipation structure 303. That is, the auxiliary heat sink 3 bears part of the heat. Compared with traditional base stations, under the same conditions of meeting the heat dissipation requirements of high-power base stations, the tooth height of the main heat sink 2 of the present invention can be significantly reduced, while the tooth height of the auxiliary heat sink 3 is also controlled within a small range, and the overall volume can be reduced by about 25%. In this embodiment, the auxiliary heat sink 3 is connected to the main heat sink 2 and the filter 1 respectively via connectors; Specifically, such as Figure 2 As shown, the connector is a screw. The base plate 301 of the secondary heat sink 3 has multiple connecting posts 304 that match the screws around its perimeter. The filter 1, the secondary heat sink 3 and the main heat sink 2 are connected by the screws along the connecting posts 304, and the secondary heat sink 3 is fixed to the waterproof surface of the main heat sink 2 so that the motherboard 4 embedded in the main heat sink 2 is isolated from the external environment. The side of the secondary heat sink 3 close to the motherboard 4 is also provided with a sealing ring that contacts the main heat sink 2. The sealing ring further seals and protects the motherboard 4 embedded in the main heat sink 2. In this embodiment, a plurality of shielding ribs 302 on the side of the substrate 301 near the motherboard 4 extend along a first direction and a second direction, respectively. The shielding ribs 302 extending along the first direction and the shielding ribs 302 extending along the second direction are perpendicular to each other. That is, the shielding ribs 302 arranged perpendicularly to each other contact the motherboard 4 to provide electromagnetic isolation for the radio frequency components on the motherboard 4.

[0021] In the description of this invention, it should be understood that the terms "upper", "lower", "bottom", "top", "front", "rear", "inner", "outer", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0022] While the invention has been described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the invention. Therefore, it should be understood that many modifications can be made to the exemplary embodiments, and other arrangements can be designed without departing from the spirit and scope of the invention as defined by the appended claims. It should be understood that different dependent claims and features described herein can be combined in ways different from those described in the original claims. It is also understood that features described in conjunction with individual embodiments can be used in other described embodiments.

Claims

1. A communication base station with double-sided heat dissipation, characterized in that, It includes a filter and a main heat sink, with a motherboard disposed between the filter and the main heat sink, and an auxiliary heat sink disposed between the filter and the motherboard; The motherboard is embedded in the main heat sink, and the secondary heat sink is connected to the main heat sink and the filter respectively. The main heat sink has a first heat dissipation structure on the side away from the motherboard. The secondary heat sink includes a substrate. The substrate has a second heat dissipation structure on the side near the filter. The substrate has a plurality of shielding ribs that contact the motherboard on the side near the motherboard. Both the first heat dissipation structure and the second heat dissipation structure are exposed to the air.

2. A communication base station with double-sided heat dissipation according to claim 1, characterized in that, The heat-generating components on the motherboard are in contact with the main heat sink and / or the secondary heat sink through a thermally conductive material.

3. A communication base station with double-sided heat dissipation according to claim 1, characterized in that, The substrate is also provided with multiple signal transmission channels connected to the filter on the side closest to the filter.

4. A communication base station with double-sided heat dissipation according to claim 3, characterized in that, The signal transmission channel has a cylindrical structure, and a waterproof sealing ring is provided between the signal transmission channel and the filter.

5. A communication base station with double-sided heat dissipation according to claim 1, characterized in that, Both the first heat dissipation structure and the second heat dissipation structure include multiple heat dissipation fins arranged side by side.

6. A communication base station with double-sided heat dissipation according to claim 1, characterized in that, The secondary heat sink is connected to the main heat sink and the filter via connectors.

7. A communication base station with double-sided heat dissipation according to claim 6, characterized in that, The connector is a screw, and the substrate of the secondary heat sink has multiple connecting posts that match the screw around its perimeter.

8. A communication base station with double-sided heat dissipation according to claim 1, characterized in that, The secondary heat sink also has a sealing ring on the side closest to the motherboard that contacts the main heat sink.

9. A communication base station with double-sided heat dissipation according to claim 5, characterized in that, The height of the heat dissipation fins of the first heat dissipation structure is greater than the height of the heat dissipation fins of the second heat dissipation structure.

10. A communication base station with double-sided heat dissipation according to claim 1, characterized in that, The multiple shielding ribs on the side of the substrate near the motherboard extend along a first direction and a second direction, respectively, with the shielding ribs extending along the first direction and the shielding ribs extending along the second direction being perpendicular to each other.

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