Heat dissipation driver and electronic equipment

Abstract

The invention relates to the technical field of heat dissipation of electronic equipment, and discloses a heat dissipation driver and electronic equipment. The outer edge of the vibration system is connected with the frame, and a plurality of communicating holes are formed in the vibration system; the driving system is used for driving the vibration system to vibrate in the axial direction; the one-way valve comprises a fixing part and a plurality of cover plates opposite to the communicating holes, the fixing part is connected with the first side face of the vibration system and arranged on the peripheries of the communicating holes, one end of each cover plate is a connecting end connected with the inner edge of the fixing part, the other end of each cover plate is a free end, and the free ends of the cover plates are oppositely arranged and / or adjacently arranged; the area of each cover plate is larger than that of the corresponding communicating hole; when the vibration system moves towards the first side face, the cover plate covers the communication hole. When the vibration system moves towards the second side face opposite to the first side face, the cover plates are separated from the vibration system, and airflow channels communicated with the communicating holes are formed among the multiple cover plates. The heat dissipation driver has relatively high heat dissipation efficiency.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for electronic devices, and more specifically, to a heat dissipation driver and an electronic device including the heat dissipation driver. Background Technology

[0002] In recent years, with the rapid development of electronic devices such as smartphones and tablets, their processor performance has continuously improved, leading to a significant increase in user frequency in high-load application scenarios such as gaming and live streaming. Consequently, the heat generated by these electronic devices during operation has continued to increase. When a device is at a high temperature, the processor often triggers a frequency reduction protection mechanism, resulting in a decrease in device performance and subsequent issues such as frame drops in games and stuttering in live streams. Therefore, how to efficiently and stably dissipate heat from electronic devices has become a pressing technical problem that needs to be solved in this field.

[0003] For example, patent CN121335064A discloses a heat dissipation actuator that uses a one-way valve to allow hot airflow inside an electronic device to flow unidirectionally from the rear cavity to the front cavity, thereby achieving heat dissipation. The one-way valve mainly consists of a cover plate and a support leg. In actual heat dissipation, the cover plate needs to intermittently cover the connecting hole to prevent hot airflow from flowing back into the rear cavity. Because the support leg is a flexible structure, the cover plate cannot always move completely along the axial direction of the connecting hole during operation. To achieve the aforementioned unidirectional flow effect, the diameter of the connecting hole is usually designed to be much smaller than the diameter of the cover plate, so that even if the cover plate moves radially, it can still cover the connecting hole.

[0004] However, under the above structural configuration, the airflow velocity is high when passing through the connecting holes, but the total flow rate per unit time is relatively small. On the one hand, the high airflow velocity can easily cause the cover plate to deflect radially, thereby obstructing the airflow channel and even affecting the one-way sealing effect, reducing heat dissipation stability; on the other hand, the small total airflow per unit time also limits the overall heat dissipation efficiency, making it difficult to meet the heat dissipation requirements of electronic equipment under high load operation. Summary of the Invention

[0005] To address the aforementioned problems, this invention provides a heat dissipation driver and an electronic device, aiming to solve the technical problem of low heat dissipation efficiency of traditional heat dissipation drivers.

[0006] According to one embodiment of the present invention, a heat dissipation actuator is provided, comprising: a frame; a vibration system connected to the frame at its outer edge, the vibration system having a plurality of communicating holes; a driving system for driving the vibration system to vibrate axially along the communicating holes; and a one-way valve comprising a fixing part and a plurality of cover plates opposite to the communicating holes, the fixing part being connected to a first side of the vibration system and disposed on the outer periphery of the plurality of communicating holes, one end of each cover plate being a connecting end connected to the inner edge of the fixing part and the other end being a free end, the free ends of the plurality of cover plates being disposed opposite to each other and / or adjacent to each other, and the area of ​​each cover plate being larger than the area of ​​the corresponding communicating hole; wherein, when the vibration system moves toward the first side, the cover plate covers the communicating hole; when the vibration system moves toward a second side opposite to the first side, the cover plate separates from the vibration system, and an airflow channel communicating with the communicating hole is formed between the plurality of cover plates.

[0007] In one embodiment, the one-way valve is provided with four cover plates; the vibration system is provided with four connecting holes, and an "X"-shaped support is formed between the connecting holes. When the cover plate covers the connecting hole, the free end of the cover plate abuts against the support.

[0008] In one embodiment, the cover plate is shaped like an isosceles triangle, an isosceles trapezoid, or a semicircle.

[0009] In one embodiment, the ratio of the area of ​​the connecting hole to the area of ​​the cover plate opposite it is not less than 70%.

[0010] In one embodiment, the fixing part is annular, and the four cover plates are disposed in the middle of the fixing part, and the fixing part and the cover plates are an integral structure.

[0011] In one embodiment, the drive system includes a coil and a magnetic circuit assembly; the vibration system includes a diaphragm, the coil is connected to the diaphragm, and the coil is connected to the side of the diaphragm away from the cover plate; the magnetic circuit assembly is disposed on the frame, and the magnetic circuit assembly, the vibration system, and the frame form a cavity, and the one-way valve is located outside the cavity; the frame and / or the magnetic circuit assembly are provided with an airflow inlet communicating the cavity with the external environment.

[0012] In one embodiment, the diaphragm includes an interconnected diaphragm body and a reinforcing portion disposed in the middle of the diaphragm body, the connecting hole is formed on the reinforcing portion, and the fixing portion is fixed on the reinforcing portion.

[0013] In one embodiment, the diaphragm body includes an outer edge portion, a folded ring portion, and an inner edge portion arranged sequentially from the outside to the inside. The outer edge portion is connected to the frame, and the inner edge portion is connected to the reinforcing portion.

[0014] In one embodiment, the magnetic circuit assembly includes a U-shaped iron, a central magnet, and a central magnetic guide plate. The sidewall of the U-shaped iron is connected to the frame. One end of the central magnet is connected to the bottom wall of the U-shaped iron, and the other end is connected to the central magnetic guide plate. A magnetic gap is formed between the sidewall of the U-shaped iron, the central magnet, and the central magnetic guide plate. One end of the coil is disposed within the magnetic gap.

[0015] According to one embodiment of the present invention, an electronic device is provided, comprising: a housing with vent holes on the side walls; a heat dissipation driver as described above, wherein the frame is disposed within the housing, and the connecting hole communicates with the vent holes.

[0016] Based on the above description and practical application, it is evident that the vibration system in the heat dissipation actuator of this invention generates a pressure difference between the gas on both sides of the connecting holes during vibration. Combined with a one-way valve, this allows for unidirectional airflow control. The vibration system incorporates multiple connecting holes, and the one-way valve includes multiple cover plates, each fixed at one end and free at the other. These cover plates open and close at a central position during vibration, controlling the unidirectional gas flow. Furthermore, the free ends of the cover plates are positioned opposite each other. When airflow in one connecting hole flows upward, it diffuses outward under the obstruction of the inclined cover plates, assisting in pushing the free ends of opposing or adjacent cover plates upward, thereby expanding the airflow channel between the cover plates and improving heat dissipation efficiency. Attached Figure Description

[0017] Figure 1 and Figure 2 The following are schematic diagrams of the heat dissipation driver according to one embodiment of the present invention from two different perspectives. Figure 1 The image mainly shows the upper structure of the heat dissipation driver. Figure 2 The image primarily showcases the lower structure of the heat dissipation driver.

[0018] Figure 3 This is an exploded view of the heat dissipation driver according to one embodiment of the present invention.

[0019] Figure 4 This is a cross-sectional perspective view of a heat dissipation driver according to one embodiment of the present invention.

[0020] Figure 5 This is a cross-sectional view of the heat dissipation driver in one embodiment of the present invention when the cover plate does not cover the connecting hole.

[0021] Figure 6This is a schematic cross-sectional view of the heat dissipation driver in one embodiment of the present invention when the cover plate covers the connecting hole.

[0022] Figure 7 This is a schematic diagram of the structure of an electronic device according to one embodiment of the present invention.

[0023] The attached figures are labeled as follows: 1. Frame; 2. Vibration system; 3. One-way valve; 4. Magnetic circuit assembly; 5. Cavity; 21. Diaphragm body; 22. Reinforcing part; 23. Coil; 31. Cover plate; 32. Fixing part; 33. Airflow channel; 41. U-shaped iron; 42. Central magnet; 43. Central magnetic guide plate; 44. Magnetic gap; 100. Heat dissipation driver; 200. Electronic equipment; 201. Heat source area; 202. Outer shell; 203. Vent hole; 211. Outer edge; 212. Folded ring part; 213. Inner edge; 221. Connecting hole; 222. Support part; 311. Connecting end; 312. Free end; 411. Bottom wall; 412. Side wall; 413. Airflow inlet. Detailed Implementation

[0024] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be more comprehensive and complete, and will fully convey the concept of exemplary embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0025] Furthermore, the accompanying drawings are merely illustrative of this disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted. It should be noted that in this disclosure, the terms "comprising," "configured with," and "set in" are used to indicate an open-ended inclusion, meaning that additional elements / components / etc. may exist besides those listed; the terms "first," "second," etc., are used only as labels and are not intended to limit the number or order of objects; the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention.

[0026] Unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0027] like Figures 1 to 6 As shown in the figure, this embodiment discloses a heat dissipation actuator 100 with high heat dissipation efficiency. The heat dissipation actuator 100 mainly includes a frame 1, a vibration system 2, a one-way valve 3, and a drive system. The frame 1 is the basic support structure of the heat dissipation actuator 100, capable of fixing other components, such as ensuring the vibration system 2 and the one-way valve 3 are stably positioned within the frame 1. The outer edge of the vibration system 2 is connected to the frame 1, and the vibration system 2 has multiple connecting holes 221. The vibration system 2 can be driven by the drive system to vibrate axially along the connecting holes 221, i.e., along... Figure 5 It vibrates in the vertical direction.

[0028] The one-way valve 3 includes a fixing part 32 and multiple cover plates 31. The fixing part 32 is generally annular, and its inner edge is provided with multiple cover plates 31 opposite to the connecting holes 221. The fixing part 32 is sealed and connected, such as by bonding or welding, to the first side of the vibration system 2, and the fixing part 32 is located in the common outer peripheral area of ​​the multiple connecting holes 221. The first side is... Figure 3 The upper surface of the vibration system 2, and the corresponding second side opposite to the first side, i.e. Figure 3 The lower surface of the vibration system 2. One end of the cover plate 31 is a connecting end 311 connected to the inner edge of the fixing part 32, and the other end of the cover plate 31 is a free end 312, which can vibrate up and down under the push of airflow. The free ends 312 of multiple cover plates 31 are arranged opposite to each other and / or adjacent to each other, and the area of ​​the cover plate 31 is larger than the area of ​​the corresponding connecting hole 221.

[0029] The cover plate 31 is positioned directly opposite the connecting hole 221, and its size and shape are designed to cover the connecting hole 221. For example, in this embodiment, the connecting hole 221 is an isosceles trapezoidal opening, and the corresponding cover plate 31 is a plate with dimensions larger than the isosceles trapezoidal opening 221. When the cover plate 31 covers the connecting hole 221, it can prevent airflow from passing through the connecting hole 221.

[0030] When the vibration system 2 moves toward the first side, the cover plate 31 covers the connecting hole 221; when the vibration system 2 moves toward the second side opposite to the first side, the cover plate 31 separates from the vibration system 2, and an airflow channel 33 communicating with the connecting hole 221 is formed between the multiple cover plates 31.

[0031] The vibration system 2 in the heat dissipation driver 100 creates a pressure difference in the gas on both sides of the connecting hole 221 during vibration. Combined with the one-way valve 3, this allows for unidirectional airflow control. Specifically, please refer to... Figure 5 and Figure 6 When the vibration system 2 moves downward, the air pressure on the lower side of the vibration system 2 is greater than the air pressure on the upper side. Due to its own inertia and this pressure difference, the cover plate 31 separates from the vibration system 2. At this time, the connecting hole 221 is not blocked, and the gas on the lower side of the vibration system 2 flows rapidly into the upper side through the connecting hole 221. After passing through the connecting hole 221, the airflow rapidly diffuses outward along the lower surface of the cover plate 31. When the vibration system 2 moves upward, the air pressure on the upper side of the vibration system 2 is greater than the air pressure on the lower side. Under the action of this pressure difference, the cover plate 31 and the vibration system 2 move closer together, thus covering the connecting hole 221. Therefore, the gas on the upper side of the vibration system 2 will not flow rapidly into the lower side through the connecting hole 221, achieving unidirectional control of the airflow.

[0032] In this invention, a plurality of connecting holes 221 are provided on the vibration system 2, and the one-way valve 3 includes a plurality of cover plates 31, one end of which is fixed and the other end is free. When the vibration system 2 vibrates, the multiple cover plates 31 can open and close at a central position to control the unidirectional flow of gas. Furthermore, the free ends 312 of the multiple cover plates 31 are arranged opposite each other. When the airflow in one connecting hole 221 flows upward, it diffuses outward under the obstruction of the inclined cover plate 31, which helps to push the free ends 312 of opposite or adjacent cover plates 31 upward, thereby expanding the airflow channel 33 formed between the cover plates 31 and improving heat dissipation efficiency. In other words, the coordinated operation of the multiple cover plates 31 enables the one-way valve 3 to open rapidly when the vibration system 2 vibrates upward, allowing airflow to pass quickly through the connecting holes 221, significantly increasing the gas flow rate. Moreover, the multiple connecting holes 221, compared to the smaller connecting holes 221 in a conventional heat dissipation actuator 100, also increase the gas flow rate, giving the heat dissipation actuator 100 a better heat dissipation effect.

[0033] When this heat sink driver 100 is applied to the electronic device 200, it enables heat dissipation using unidirectional airflow. For example, the heat sink driver 100 is mounted on the electronic device 200, and... Figure 5 The lower surface of the vibration system 2 faces the heat source of the electronic device 200, while the upper surface of the vibration system 2 faces the outside of the electronic device 200. During operation, the unidirectional airflow generated by the heat dissipation driver 100 flows from the heat source of the electronic device 200 to the outside of the electronic device 200, thereby transferring heat to the outside of the electronic device 200 and achieving heat dissipation for the electronic device 200.

[0034] For example, the heat sink driver 100 is mounted on the electronic device 200, and... Figure 5 The upper surface of the vibration system 2 faces the heat source of the electronic device 200, while the lower surface of the vibration system 2 faces the outside of the electronic device 200. During operation, the unidirectional airflow generated by the heat dissipation driver 100 flows from the outside of the electronic device 200 to the heat source inside the electronic device 200. By guiding the external low-temperature gas to the heat source, heat dissipation of the electronic device 200 can also be achieved.

[0035] In this embodiment, four cover plates 31 are provided in the middle of the fixing part 32. The vibration system 2 has four connecting holes 221, and an "X"-shaped support part 222 is formed between the connecting holes 221. When the cover plate 31 covers the connecting hole 221, the free end 312 of the cover plate 31 abuts against the support part 222, preventing the cover plate 31 from moving further downwards. Figure 1 and Figure 3 As shown, four cover plates 31 are evenly distributed inside the fixing part 32, and four connecting holes 221 are also evenly arranged. During operation, the four connecting holes 221 and the cover plates 31 cooperate to achieve high heat dissipation efficiency. In other embodiments, the number of cover plates 31 and connecting holes 221 can be appropriately increased or decreased according to actual needs to adapt to the space inside the electronic device 200 and adjust the heat dissipation efficiency.

[0036] In this embodiment, the connecting hole 221 is an isosceles trapezoidal opening, and the corresponding cover plate 31 is a plate with a size larger than the isosceles trapezoidal opening 221. In other embodiments, the cover plate 31 can also be set as an isosceles triangular or semi-circular plate, and the connecting hole 221 is also set as an isosceles triangular or semi-circular opening accordingly. With these structural forms, the cover plate 31 can guide the airflow from the lower side to flow evenly to both sides, making the upward tilt of the free ends 312 of each cover plate 31 approximately the same, allowing the airflow to flow upward smoothly and quickly, which is beneficial for further improving heat dissipation efficiency.

[0037] Furthermore, in this embodiment, the ratio of the area of ​​the connecting hole 221 to the area of ​​the cover plate 31 is not less than 70%. For example, the area of ​​the connecting hole 221 can be 70%, 80%, 85%, 90%, or 95% of the area of ​​the cover plate 31, as long as it ensures that the cover plate 31 can completely cover the connecting hole 221. In this way, while ensuring intermittent airflow blockage, the gas flow rate can be increased by enlarging the connecting hole 221, ultimately improving the heat dissipation effect.

[0038] Compared to patent CN121335064A, when using cover plates 31 of the same area, the area of ​​the connecting hole 221 in this invention can be significantly increased, improving the total gas flow rate and thus enhancing heat dissipation. Furthermore, with the increased size of the connecting hole 221, the gas velocity flowing through it decreases, reducing the thrust exerted on the cover plate 31 by the airflow. If there is only one cover plate 31, it would be difficult to open the free end 312 of the cover plate 31. Therefore, this application uses multiple cover plates 31. When the airflow under each cover plate 31 flows laterally, it assists the free ends 312 of adjacent and opposite cover plates 31 to open upwards. This ensures that a large airflow channel 33 can be quickly formed between the cover plates 31, guaranteeing rapid airflow.

[0039] In this embodiment, the fixing part 32 is generally annular, and four cover plates 31 are located in the middle of the fixing part 32. The fixing part 32 and the cover plates 31 are an integral structure. The annular structure of the fixing part 32 makes the connection between the one-way valve 3 and the vibration system 2 more stable. The integral structure of the fixing part 32 and the cover plates 31 is low-cost and easy to manufacture. In other embodiments, a fixing part 32 can also be provided between each cover plate 31 and the vibration system 2, which can also achieve the connection of the one-way valve 3 to the vibration system 2.

[0040] This embodiment also provides a specific method for the vibration system 2 to achieve vibration. Please refer to... Figures 1 to 6 The drive system includes a coil 23 and a magnetic circuit assembly 4. The vibration system 2 includes a diaphragm, with the coil 23 connected to the diaphragm. The diaphragm includes a diaphragm body 21 and a reinforcing portion 22 connected to each other. The diaphragm body 21 is typically made of a flexible material and includes an outer edge 211, a folded ring 212, and an inner edge 213 arranged sequentially from the outside to the inside. The outer edge 211 is connected to the frame 1, and the side of the inner edge 213 near the cover plate 31 is connected to the reinforcing portion 22. The reinforcing portion 22 is provided with a connecting hole 221. The folded ring 212 is provided to ensure the up-and-down vibration of the diaphragm, and the frequency response curve can also be adjusted through the folded ring 212. The heat dissipation driver 100 of this embodiment has wideband characteristics, thereby facilitating the editing of asymmetric waveforms. It should be noted that the reinforcing part 22 is located on the upper side of the inner edge part 213, and the fixing part 32 is fixedly connected to the upper surface of the reinforcing part 22, thereby ensuring that the diaphragm can abut against the cover plate 31 when moving upward and can separate from the cover plate 31 when moving downward. By setting the reinforcing part 22, the vibration effect of the diaphragm can be further improved, and the stability of the one-way valve 3 during operation can be enhanced.

[0041] In one embodiment, a coil 23 is connected to the side of the inner edge 213 away from the cover plate 31.

[0042] In one embodiment, a magnetic circuit assembly 4 is provided on the frame 1 to interact with the coil 23, driving the coil 23 to move up and down, thereby causing the diaphragm to vibrate up and down. The magnetic circuit assembly 4, the vibration system 2, and the frame 1 together form a cavity 5. A one-way valve 3 is located outside the cavity 5. An airflow inlet 413 is provided on the magnetic circuit assembly 4 to connect the cavity 5 with the external environment. During operation, the vibration system 2 can pump the air in the cavity 5 out one-way through the connecting hole 221. In other embodiments, the airflow inlet 413 can also be provided on the frame 1, or both the frame 1 and the magnetic circuit assembly 4 can be provided with the airflow inlet 413, both of which allow gas from the external environment to flow into the cavity 5.

[0043] Specifically, the magnetic circuit assembly 4 includes a U-shaped iron 41, a central magnet 42, and a central magnetic guide plate 43. The U-shaped iron 41 is made of a magnetically conductive material and includes a bottom wall 411 and a side wall 412 located at the edge of the bottom wall 411. An airflow inlet 413 is located on the side wall 412.

[0044] One end of the central magnet 42 along the vibration direction of the coil 23 is connected to the bottom wall 411, and the other end of the central magnet 42 along the vibration direction of the coil 23 is connected to the central magnetic plate 43. A side wall 412 surrounds the central magnet 42 and the central magnetic plate 43, forming a magnetic gap 44 between the side wall 412 and the central magnet 42 and the central magnetic plate 43. The first end of the coil 23 along its axial direction is inserted into the magnetic gap 44. The bottom wall 411 secures the central magnet 42, the central magnetic plate 43, and the side wall 412, providing reliable support. By providing the central magnetic plate 43 at the end of the central magnet 42 facing the diaphragm 21, the magnetic lines of force of the central magnet 42 are corrected, thereby increasing the number of magnetic lines of force passing through the coil 23, thus increasing the up-and-down vibration performance of the coil 23 and improving the heat dissipation effect of the heat dissipation driver 100.

[0045] During use, the heat dissipation driver 100 can be configured to either direct the airflow inlet 413 toward the heat source of the electronic device 200 (i.e., the external environment is the heat source area 201 of the electronic device 200), in which case the diaphragm 21 vibrates and pumps the hotter gas from the heat source out unidirectionally through the connecting hole 221, thus dissipating heat from the electronic device 200; or direct the airflow inlet 413 toward the outside of the electronic device 200, with the cover plate 31 facing the heat source of the electronic device 200. In this case, the diaphragm 21 vibrates and pumps the cooler gas from outside the electronic device 200 into the electronic device 200 through the connecting hole 221, blowing the cool gas toward the heat source inside the electronic device 200, thus also dissipating heat from the electronic device 200.

[0046] During use, the heat dissipation driver 100 with this structure can be configured to either direct the airflow inlet 413 towards the heat source of the electronic device 200 (i.e., the external environment is the heat source area 201 of the electronic device 200), in which case, when the elastic conductive sheet vibrates, it can pump the high-temperature gas from the heat source out unidirectionally through the connecting hole 221, thereby dissipating heat from the electronic device 200. Alternatively, the airflow inlet 413 can be directed towards the outside of the electronic device 200, with the cover plate 31 facing the heat source direction of the electronic device 200. In this case, when the elastic conductive sheet vibrates, it can pump the lower-temperature gas from outside the electronic device 200 in unidirectionally through the connecting hole 221, blowing the cool gas towards the heat source inside the electronic device 200, thus also dissipating heat from the electronic device 200.

[0047] Please refer to Figure 7 The present invention also provides an electronic device 200, including a housing 202 and the aforementioned heat dissipation driver 100. A frame 1 is disposed within the housing 202, and a connecting hole 221 communicates with a vent 203. A vent 203 is provided on the side wall 412 of the housing 202, allowing gas to enter and exit the electronic device 200. The specific structure of the heat dissipation driver 100 is as described in the above embodiments. Since the electronic device 200 adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated further here. The electronic device 200 can be a mobile phone, tablet, or other electronic device.

[0048] Specifically, when the frame 1 is fixed inside the housing 202, if the airflow inlet 413 of the heat dissipation driver 100 faces the heat source inside the electronic device 200, the vibration system 2, when vibrating, can pump the high-temperature gas from the heat source out of the electronic device 200 through the connecting hole 221 and the vent 203, thereby dissipating heat from the electronic device 200. If the airflow inlet 413 of the heat dissipation driver 100 faces the outside of the electronic device 200, i.e., opposite to the vent 203, and the cover plate 31 faces the heat source of the electronic device 200, the vibration system 2, when vibrating, can pump the lower-temperature gas from outside the electronic device 200 in one direction through the vent 203 and the connecting hole 221, blowing the cold gas towards the heat source inside the electronic device 200, thus also dissipating heat from the electronic device 200.

[0049] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A heat dissipation driver, characterized in that, include: frame; The vibration system is connected to the frame at its outer edge, and the vibration system has multiple connecting holes. A drive system for driving the vibration system to vibrate axially along the connecting hole; A one-way valve includes a fixed part and a plurality of cover plates opposite to the communicating holes. The fixed part is connected to a first side of the vibration system and disposed on the outer periphery of the plurality of communicating holes. One end of each cover plate is a connecting end connected to the inner edge of the fixed part, and the other end is a free end. The free ends of the plurality of cover plates are arranged opposite to each other and / or adjacent to each other. The area of ​​each cover plate is larger than the area of ​​the corresponding communicating hole. When the vibration system moves toward the first side, the cover plate covers the connecting hole; when the vibration system moves toward the second side opposite to the first side, the cover plate separates from the vibration system, and an airflow channel communicating with the connecting hole is formed among the multiple cover plates.

2. The heat dissipation driver as described in claim 1, characterized in that, The one-way valve is provided with four of the aforementioned cover plates; The vibration system is provided with four connecting holes, and an "X"-shaped support is formed between the connecting holes. When the cover plate covers the connecting holes, the free end of the cover plate is pressed against the support.

3. The heat dissipation driver as described in claim 1, characterized in that, The cover plate is in the shape of an isosceles triangle, an isosceles trapezoid, or a semicircle.

4. The heat dissipation driver as described in claim 3, characterized in that, The ratio of the area of ​​the connecting hole to the area of ​​the cover plate opposite it is not less than 70%.

5. The heat dissipation driver as described in claim 2, characterized in that, The fixing part is ring-shaped, and the four cover plates are located in the middle of the fixing part. The fixing part and the cover plates are an integral structure.

6. The heat dissipation driver as described in any one of claims 1 to 5, characterized in that, The drive system includes coils and magnetic circuit components; The vibration system includes a diaphragm, and the coil is connected to the diaphragm on the side of the diaphragm away from the cover plate; The magnetic circuit assembly is mounted on the frame, and the magnetic circuit assembly, the vibration system, and the frame form a cavity, with the one-way valve located outside the cavity. The frame and / or the magnetic circuit assembly are provided with an airflow inlet that connects the cavity to the external environment.

7. The heat dissipation driver as claimed in claim 6, characterized in that, The diaphragm includes an interconnected diaphragm body and a reinforcing portion located in the middle of the diaphragm body. The connecting hole is opened on the reinforcing portion, and the fixing portion is fixed on the reinforcing portion.

8. The heat dissipation driver as claimed in claim 7, characterized in that, The diaphragm body includes an outer edge, a folded ring, and an inner edge arranged sequentially from the outside to the inside. The outer edge is connected to the frame, and the inner edge is connected to the reinforcing part.

9. The heat dissipation driver as claimed in claim 6, characterized in that, The magnetic circuit assembly includes a U-shaped iron, a central magnet, and a central magnetic guide plate. The sidewall of the U-shaped iron is connected to the frame. One end of the central magnet is connected to the bottom wall of the U-shaped iron, and the other end is connected to the central magnetic guide plate. A magnetic gap is formed between the sidewall of the U-shaped iron, the central magnet, and the central magnetic guide plate. One end of the coil is disposed within the magnetic gap.

10. An electronic device, characterized in that, include: The outer casing has ventilation holes on the side walls; The heat dissipation driver as described in any one of claims 1 to 9, wherein the frame is disposed within the housing, and the connecting hole communicates with the vent hole.

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